A drying apparatus for a wafer photolithography machine

Abstract

The present application relates to a kind of drying device of wafer photoetching machine, it is related to wafer photoetching machine accessory field, including wafer photoetching machine host, the upper end of wafer photoetching machine host is fixedly installed with box body assembly, box body assembly includes main frame and vice frame, the inside of main frame is connected with water absorption component, the upper end of wafer photoetching machine host is fixedly installed with gas circulation component, the upper end of main frame is fixedly installed with auxiliary assembly, by box body assembly and gas circulation component, the air in the inside of wafer photoetching machine host is circulated, reduce the intervention of external air, by water absorption component, it is convenient to absorb moisture in circulating air, by auxiliary assembly, improve the water absorption amount of circulating air of water absorption sponge, by drying bag, further absorb moisture in circulating air, by heating bin and heat exchange pipe in auxiliary assembly, it is convenient to heat the air that flows back to the inside of wafer photoetching machine host, it is convenient to dry the inside of wafer photoetching machine host, improve drying effect.

Description

Technical Field

[0001] This invention relates to the field of wafer lithography machine accessories technology, and in particular to a drying device for a wafer lithography machine. Background Technology

[0002] A wafer lithography machine, also known as a photolithography machine, mask alignment exposure machine, exposure system, or photolithography system, is the core equipment for manufacturing semiconductor chips. Using a technique similar to photo printing, the lithography machine transfers the intricate patterns on a photomask onto a silicon wafer through light exposure. Its working principle primarily involves transferring the designed circuit pattern onto the semiconductor material through a series of photolithography processes. During operation, it is necessary to keep the inside of the wafer lithography machine dry; current drying methods often employ heated air.

[0003] For example, Chinese invention patent CN115236948B discloses a drying device for a wafer lithography machine, comprising: a lithography machine, a filter cylinder on the lithography machine, a filter assembly installed inside the filter cylinder to filter air, a circular hole at the bottom of the filter cylinder, a water storage assembly fixedly installed on the lithography machine extending into the circular hole, the water storage assembly storing water produced by the filter assembly, and a circularly distributed set of circular holes at one end of the filter cylinder, and an air extraction cylinder fixedly installed at the other end of the filter cylinder. This invention is novel in design. Air enters the filter cylinder and undergoes a first-stage filtration by an installed absorbent sponge, which absorbs a large amount of moisture from the air. The air then undergoes a second filtration by an installed activated carbon layer. An exhaust pipe blows hot air into a drying tube, where the hot air dries the lithography machine. The filter assembly inside the filter cylinder significantly reduces the humidity in the air, thus improving the drying effect of the drying device.

[0004] However, during use, it is easily affected by the moisture in the outside air, resulting in insufficient dryness of the air supplied to the inside of the lithography machine. This leads to poor drying effect inside the lithography machine, and the effect of removing moisture from the air is not good, making it inconvenient to operate and use. Summary of the Invention

[0005] To overcome the technical deficiencies of existing technologies, this invention provides a drying device for a wafer lithography machine, which circulates the gas inside the wafer lithography machine main unit, improving the drying effect, facilitating operation, and enabling the removal of moisture from the circulating air.

[0006] The technical solution adopted in this invention is: a drying device for a wafer lithography machine, comprising a wafer lithography machine main unit, a housing assembly fixedly mounted on the upper end of the wafer lithography machine main unit, the air inlet of the housing assembly being connected to the upper interior of the wafer lithography machine main unit, the housing assembly including a main frame and a sub-frame, and a water absorption assembly snapped into the interior of the main frame, the sub-frame being fixedly mounted on one side of the main frame, a gas circulation assembly fixedly mounted on the upper end of the wafer lithography machine main unit located on one side of the housing assembly, the air inlet of the gas circulation assembly being fixedly connected to one end of the sub-frame, and the air outlet of the gas circulation assembly being connected to the interior of the wafer lithography machine main unit, an auxiliary assembly fixedly mounted on the upper end of the main frame, the cold end of the auxiliary assembly being located inside the main frame, the auxiliary assembly... The hot end of the component is located inside the gas circulation assembly. During use, by activating the gas circulation assembly, a negative pressure is created inside the housing assembly, drawing the hot and humid airflow from the upper part of the wafer lithography machine into the housing assembly. After entering the housing assembly, the water absorption assembly absorbs the moisture in the hot and humid air, improving the dryness of the air. During absorption, the cold end of the auxiliary component allows the hot and humid air to condense the water vapor in the air into water droplets, which are then absorbed by the water absorption assembly, further improving the dryness of the air. After being heated by the gas circulation assembly, the dried hot air is returned to the interior of the wafer lithography machine to dry the interior of the wafer lithography machine, improving the drying effect.

[0007] Preferably, the main frame and the sub-frame are square frame structures. An air inlet is fixedly installed on one side of the main frame, and an air distribution plate with air holes is fixedly installed on one side inside the air inlet. A U-shaped air inlet pipe is fixedly installed at the other end of the air inlet. The end of the air inlet pipe is connected to the upper interior of the wafer lithography machine host. In use, the gas inside the wafer lithography machine host enters the interior of the main frame through the air inlet pipe and the air inlet. When entering the main frame, the gas is dispersed by the air distribution plate, which improves the contact effect with the water absorption component and facilitates the absorption of water vapor in the air.

[0008] Preferably, frame plates are fixedly installed at both ends of the main frame. The water-absorbing end of the water-absorbing component is located between the frame plates. Compression frames are fixedly installed on both sides of the main frame between the frame plates. The compression frames are connected to the main frame. A sealing strip is fixedly installed on the outer side of the compression frame away from the main frame. A sealing cover with a handle is sleeved on the end of the compression frame. The inner side of the sealing cover is pressed tightly against the sealing strip. The frame plates reduce the airflow from passing through the edge of the water-absorbing component, thus improving the water absorption effect. The compression frames facilitate the compression of the water-absorbing sponge in the water-absorbing component, squeezing out the water. The sealing cover and sealing strip not only improve the sealing effect of the compression frame and facilitate the squeezing of the water-absorbing sponge, but also facilitate the replacement of the water-absorbing sponge after removing the sealing cover. This makes operation convenient. When replacing, the water-absorbing sponge on the compressed side is replaced, achieving the effect of stopping the machine for replacement and maintenance.

[0009] Preferably, a water collection frame is fixedly installed at the lower end of the compression frame, and a drain pipe is fixedly installed between the two water collection frames. A drain valve is fixedly installed at one end of the drain pipe. A square hole is opened at the middle of the lower end of the main frame. One end of the water absorption component passes through the square hole and extends to the outside of the main frame. The water collection frame and the drain pipe facilitate the discharge of water squeezed out by the water-absorbing sponge. When discharging, the drain valve is opened to facilitate the discharge and collection of water filtered from the air. The square hole facilitates the installation of the water absorption component.

[0010] Preferably, the water-absorbing component includes an electric slide rail, which is fixedly installed at the lower end of the main frame. The output end of the electric slide rail passes through the square hole and extends into the interior of the main frame. A movable block is fixedly installed at the output end of the electric slide rail. Compression blocks are fixedly installed on both sides of the movable block, and a water-absorbing sponge is adhered to one side of the compression block. One end of the water-absorbing sponge is located inside the compression frame. The movable block, the compression block, and the water-absorbing sponge are all located between the frame plates. In use, the electric slide rail drives the movable block to move back and forth inside the main frame. During movement, the water-absorbing sponge on one side is pressed into the interior of the compression frame, and the compression block continues to squeeze the water-absorbing sponge, squeezing out the water inside the sponge. When the water-absorbing sponge on one side is in a squeezed state, the water-absorbing sponge on the other side is in a natural state, which facilitates the continued absorption of water from the passing air. This alternating squeezing improves the water absorption effect and makes it easy to use.

[0011] Preferably, Velcro is fixedly installed on one side of the compression block and one side of the absorbent sponge. The absorbent sponge is attached to the compression block via the Velcro. A notch is provided in the middle of the movable block, the compression block, and the absorbent sponge, and the cold end of the auxiliary component is located inside the notch. During use, the Velcro allows for easy replacement of the absorbent sponge, facilitating maintenance. The notch also facilitates the installation of the condenser tube in the auxiliary component, preventing interference with the condenser tube when the movable block moves. Furthermore, as the absorbent sponge moves with the movable block and the compression block, it allows for easy wiping of water droplets condensed on the surface of the condenser tube, improving the absorbency of the sponge and facilitating dehumidification.

[0012] Preferably, the main frame is connected to the sub-frame, and a first mesh plate and a second mesh plate are fixedly installed on the inner sides of the sub-frame, respectively. A placement hole is provided at the upper end of the sub-frame between the first and second mesh plates. A desiccant-containing pack is placed between the first and second mesh plates. A cover plate for sealing the placement hole is snapped onto the upper end of the sub-frame. Slots are provided on both sides of the sub-frame, and the two sides of the cover plate are snapped into these slots. An air outlet is fixedly installed on one side of the sub-frame, and the air inlet of the gas circulation assembly is connected to one end of the air outlet, facilitating... The gas in the housing assembly enters the interior of the gas circulation assembly. During use, the drying pack is placed inside the sub-frame to further dry the air after water absorption, improving the dryness of the air. The drying pack is easily inserted through the placement hole, and the cover plate and the slot facilitate sealing of the placement hole, reducing the intrusion of external air. Furthermore, the first and second mesh plates not only facilitate the placement of the drying pack but also facilitate air distribution inside the sub-frame, improving the contact effect between the air and the drying pack.

[0013] Preferably, the gas circulation assembly includes a main air pump, the inlet of which is connected to the outlet of the housing assembly. A heating chamber is fixedly installed at the outlet of the main air pump. The hot end of the auxiliary assembly is located inside the heating chamber. A return pipe is fixedly installed at the outlet of the heating chamber. A U-shaped return air pipe is fixedly installed at the lower end of the return pipe. The return air pipe is connected to the interior of the wafer lithography machine host. In use, the main air pump circulates the gas, and the heating chamber facilitates heating the returned air, which in turn heats and dries the interior of the wafer lithography machine host. The return pipe and the return air pipe allow the dried hot air to flow back into the interior of the wafer lithography machine host.

[0014] Preferably, the interior of the heating chamber is a square structure, and heating wires are fixedly installed in a circular array inside the heating chamber. The heating wires facilitate the heating of air, allowing the hot air to enter the interior of the wafer lithography machine host for heating and drying.

[0015] Preferably, the auxiliary component includes a secondary air pump, which is fixedly installed at the upper end of the main frame. A vortex tube is fixedly installed at the output end of the secondary air pump, and a condenser tube is fixedly installed at the cold end of the vortex tube. One end of the condenser tube is arranged in a serpentine pattern inside the main frame, and the outlet end of the condenser tube penetrates the main frame and extends to the outside of the main frame. A heat exchange tube is fixedly installed at the hot end of the vortex tube, and one end of the heat exchange tube extends in a spiral manner into the heating chamber of the gas circulation assembly. The spiral heat exchange tube is located between the heating wires. The end of the tube penetrates through the heating chamber and extends to the outside of the heating chamber. The auxiliary air pump supplies air to the vortex tube, which splits the airflow into hot and cold streams. The cold air enters the interior of the condenser tube and condenses the air drawn from the main body of the wafer lithography machine into water vapor, facilitating water absorption by the water absorption component. The hot air assists in heating the air inside the heating chamber through the heat exchange tube. The air flowing out of the condenser tube and the heat exchange tube is discharged to the outside without mixing with the circulating air, thereby avoiding an increase in humidity in the circulating air and facilitating auxiliary drying.

[0016] The beneficial effects of the present invention are: 1. During use, the air inside the wafer lithography machine host is circulated through the housing assembly and the gas circulation assembly, reducing the intervention of external air and improving the stability during drying.

[0017] 2. By using a water-absorbing component, and the reciprocating motion of the movable block in the water-absorbing component, the water-absorbing sponges on both sides are alternately squeezed, which facilitates the absorption and discharge of moisture in the circulating air. In addition, the Velcro and sealing cap make it easy to replace the water-absorbing sponge and facilitate operation.

[0018] 3. By using auxiliary components, when the water absorption component absorbs water, the water vapor condenses when the air comes into contact with the low-temperature condenser tube, which facilitates the increase of water absorption capacity of the water absorption sponge for the circulating air. Furthermore, the drying pack further absorbs the moisture in the circulating air, thereby improving the dryness of the air.

[0019] 4. The heat exchange tubes in the heating chamber and auxiliary components facilitate the heating of the air flowing back into the wafer lithography machine host, which in turn facilitates the drying of the interior of the wafer lithography machine host and improves the drying effect. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention from another angle.

[0022] Figure 3 This is a schematic diagram of the structure of the present invention after removing the wafer lithography machine host and partially cutting it open.

[0023] Figure 4 This is a schematic diagram of the structure of the box assembly after an explosion in this invention.

[0024] Figure 5 This is a structural schematic diagram of the box assembly after it explodes, taken from another angle.

[0025] Figure 6 This is a partial structural schematic diagram of the housing assembly in this invention.

[0026] Figure 7 This is a schematic diagram of the water-absorbing component in this invention.

[0027] Figure 8 This is a schematic diagram of the water-absorbing component in this invention from another angle.

[0028] Figure 9 This is a schematic diagram of the structure of the absorbent sponge in this invention.

[0029] Figure 10 This is a schematic diagram of the gas circulation component in this invention.

[0030] Figure 11 This is a schematic diagram of the structure after a partial cross-section of the heating chamber in this invention.

[0031] Figure 12 This is a schematic diagram of the auxiliary component in this invention.

[0032] Figure 13 This is a schematic diagram of the structure of the drying package in this invention.

[0033] Explanation of reference numerals in the attached figures: 1. Main body of the wafer lithography machine; 2. Housing assembly; 201. Main frame; 202. Sub-frame; 203. Air inlet hopper; 204. Air distribution plate; 205. Air inlet pipe; 206. Frame plate; 207. Compression frame; 208. Sealing strip; 209. Sealing cover; 2010. Water collection frame; 2011. Drain pipe; 2012. Drain valve; 2013. Square hole; 2014. First stencil plate; 2015. Second stencil plate; 2016. Placement hole; 2017. Cover plate 2018, Card slot; 2019, Air outlet; 3, Water absorption assembly; 301, Electric slide rail; 302, Movable block; 303, Compression block; 304, Water-absorbing sponge; 305, Velcro; 306, Notch; 4, Gas circulation assembly; 401, Main air pump; 402, Heating chamber; 403, Return pipe; 404, Air return pipe; 405, Heating wire; 5, Auxiliary assembly; 501, Secondary air pump; 502, Vortex tube; 503, Condenser tube; 504, Heat exchange tube; 6, Drying bag. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings:

[0035] like Figures 1-13 As shown, this embodiment provides a drying device for a wafer lithography machine, including a wafer lithography machine main unit 1. A housing assembly 2 is fixedly installed on the upper end of the wafer lithography machine main unit 1. The air inlet end of the housing assembly 2 is connected to the upper interior of the wafer lithography machine main unit 1. The housing assembly 2 includes a main frame 201 and a sub-frame 202. A water absorption assembly 3 is snapped into the interior of the main frame 201. The sub-frame 202 is fixedly installed on one side of the main frame 201. A gas circulation assembly 4 is fixedly installed on the upper end of the wafer lithography machine main unit 1 on one side of the housing assembly 2. The air inlet end of the gas circulation assembly 4 is fixedly connected to one end of the sub-frame 202, and the air outlet end of the gas circulation assembly 4 is connected to the interior of the wafer lithography machine main unit 1. An auxiliary assembly 5 is fixedly installed on the upper end of the main frame 201. The cold end of the auxiliary assembly 5 is located inside the main frame 201. The hot end of the auxiliary component 5 is located inside the gas circulation component 4. During use, by turning on the gas circulation component 4, a negative pressure is generated inside the housing component 2, which draws the hot and humid airflow from the upper part of the wafer lithography machine host 1 into the housing component 2. After entering the housing component 2, the water absorption component 3 absorbs the moisture in the hot and humid air, improving the dryness of the air. During absorption, the cold end of the auxiliary component 5 allows the hot and humid air to come into contact with a cold object, condensing the water vapor in the air into water droplets, which are then absorbed by the water absorption component 3, further improving the dryness of the air. After being heated by the gas circulation component 4, the dried hot air is returned to the interior of the wafer lithography machine host 1 to dry the interior of the wafer lithography machine host 1, improving the drying effect.

[0036] The main frame 201 and the sub-frame 202 are square frame structures. An air inlet hopper 203 is fixedly installed on one side of the main frame 201, and a perforated air distribution plate 204 is fixedly installed on one side of the interior of the air inlet hopper 203. A U-shaped air inlet pipe 205 is fixedly installed at the other end of the air inlet hopper 203. The end of the air inlet pipe 205 is connected to the upper interior of the wafer lithography machine host 1. During operation, gas inside the wafer lithography machine host 1 enters the interior of the main frame 201 through the air inlet pipe 205 and the air inlet hopper 203. Upon entering the main frame 201, the gas is dispersed by the air distribution plate 204, improving the contact effect with the water absorption component 3 and facilitating the absorption of moisture from the air. Frame plates 206 are fixedly installed at both ends of the interior of the main frame 201. The water-absorbing end of the water-absorbing component 3 is located between the frame plates 206, and compression frames 207 are fixedly installed on both sides of the main frame 201 between the frame plates 206. The compression frames 207 are connected to the main frame 201. A sealing strip 208 is fixedly installed on the outer side of the compression frame 207 away from the main frame 201, and a sealing cap 209 with a handle is sleeved on the end of the compression frame 207. The inner side of the sealing cap 209 is pressed tightly against the sealing strip 208. The frame plates 206 reduce the airflow as it passes through the water-absorbing component 3, allowing it to pass through the edge of the water-absorbing component 3, thus improving the water absorption effect. The compression frames 207 also facilitate the compression of the water-absorbing sponge 304 in the water-absorbing component 3, squeezing out the water from the sponge 304. The water then passes through the sealing cap 209 and the sealing strip 208. Strip 208 not only improves the sealing effect of the compression frame 207 and facilitates the compression of the absorbent sponge 304, but also makes it easier to replace the absorbent sponge 304 after removing the sealing cover 209. This simplifies operation, and the replacement of the absorbent sponge 304 on the compression side allows for maintenance and downtime. A water collection frame 2010 is fixedly installed at the lower end of the compression frame 207, and a drain pipe 2011 is fixedly installed between the two water collection frames 2010. A drain valve 2012 is fixedly installed at one end of the drain pipe 2011. A square hole 2013 is opened in the middle of the lower end of the main frame 201. One end of the water absorption component 3 passes through the square hole 2013 and extends to the outside of the main frame 201. Water flows through the water collection frame 2010 and the drain pipe 2012. 11. To facilitate the drainage of water squeezed from the absorbent sponge 304, the drain valve 2012 is opened to collect and drain water filtered from the air. The square hole 2013 facilitates the installation of the absorbent assembly 3. The main frame 201 is connected to the sub-frame 202. A first mesh plate 2014 and a second mesh plate 2015 are fixedly installed on both sides of the interior of the sub-frame 202. A placement hole 2016 is provided at the upper end of the sub-frame 202 between the first mesh plate 2014 and the second mesh plate 2015. A drying bag 6 made of absorbent resin is placed between the first mesh plate 2014 and the second mesh plate 2015. A cover plate 2017 is snapped onto the upper end of the sub-frame 202 to seal the placement hole 2016.Both sides of the sub-frame 202 are provided with slots 2018. The two sides of the cover plate 2017 are engaged with the slots 2018. An air outlet hopper 2019 is fixedly installed on one side of the sub-frame 202. The air inlet of the gas circulation component 4 is connected to one end of the air outlet hopper 2019, facilitating the entry of gas from the housing component 2 into the gas circulation component 4. During use, a drying pack 6 is placed inside the sub-frame 202 to further dry the air after water absorption, improving its dryness. The drying pack 6 is easily inserted through the placement hole 2016, and the cover plate 2017 and slots 2018 facilitate sealing of the placement hole 2016, reducing the intrusion of external air. Furthermore, the first mesh plate 2014 and the second mesh plate 2015 not only facilitate the placement of the drying pack 6 but also facilitate air distribution inside the sub-frame 202, improving the contact effect between the air and the drying pack 6.

[0037] The water-absorbing component 3 includes an electric slide rail 301, which is fixedly installed at the lower end of the main frame 201. The output end of the electric slide rail 301 passes through the square hole 2013 and extends into the interior of the main frame 201. A movable block 302 is fixedly installed at the output end of the electric slide rail 301. Compression blocks 303 are fixedly installed on both sides of the movable block 302. A water-absorbing sponge 304 is adhered to one side of the compression block 303. One end of the water-absorbing sponge 304 is located inside the compression frame 207. The movable block 302... Both the compression block 303 and the absorbent sponge 304 are located between the frame plates 206. During use, the electric slide rail 301 drives the movable block 302 to reciprocate inside the main frame 201. During this movement, one side of the absorbent sponge 304 is pressed into the compression frame 207, and the compression block 303 continues to squeeze the absorbent sponge 304, squeezing out the water inside. While one side of the absorbent sponge 304 is under compression, the other side... The structure is in a natural state, facilitating continued water absorption from passing air. Alternating compression improves absorption and ease of use. Velcro 305 is fixedly installed on one side of the compression block 303 and one side of the absorbent sponge 304. The absorbent sponge 304 is attached to the compression block 303 via Velcro 305. A notch 306 is provided in the middle of the movable block 302, compression block 303, and absorbent sponge 304, with the cold end of the auxiliary component 5 located inside the notch 306. During use, the Velcro 305... The notch 306 facilitates the replacement of the absorbent sponge 304, making maintenance easier. During use, the notch 306 allows for easy installation of the condenser tube 503 in the auxiliary component 5, preventing any impact on the condenser tube 503 when the movable block 302 moves. Furthermore, as the absorbent sponge 304 moves with the movable block 302 and the compression block 303, it facilitates wiping away water droplets condensed on the surface of the condenser tube 503, improving the absorbent sponge 304's ability to absorb moisture from the air and facilitating air dehumidification.

[0038] The gas circulation assembly 4 includes a main air pump 401. The air inlet of the main air pump 401 is connected to the air outlet of the housing assembly 2. A heating chamber 402 is fixedly installed at the air outlet of the main air pump 401. The hot end of the auxiliary assembly 5 is located inside the heating chamber 402. A return pipe 403 is fixedly installed at the air outlet of the heating chamber 402. A U-shaped return air pipe 404 is fixedly installed at the lower end of the return pipe 403. The return air pipe 404 is connected to the interior of the wafer lithography machine host 1. During use, the main air pump 401 causes the gas to flow. The air is circulated and passes through the heating chamber 402, which facilitates the heating and drying of the interior of the wafer lithography machine host 1. The dried hot air is then returned to the interior of the wafer lithography machine host 1 through the return pipe 403 and the return air pipe 404. The interior of the heating chamber 402 has a square structure, and heating wires 405 are fixedly installed in a circular array inside the heating chamber 402. The heating wires 405 facilitate the heating of the air, allowing the hot air to enter the interior of the wafer lithography machine host 1 for heating and drying.

[0039] Auxiliary component 5 includes a secondary air pump 501, which is fixedly installed at the upper end of the main frame 201. A vortex tube 502 is fixedly installed at the output end of the secondary air pump 501, and a condenser tube 503 is fixedly installed at the cold end of the vortex tube 502. One end of the condenser tube 503 is distributed in a serpentine pattern inside the main frame 201, and the outlet end of the condenser tube 503 penetrates the main frame 201 and extends to the outside of the main frame 201. A heat exchange tube 504 is fixedly installed at the hot end of the vortex tube 502. One end of the heat exchange tube 504 extends in a spiral state into the heating chamber 402 in the gas circulation component 4, and the spiral heat exchange tube 504 is located between the heating wires 405. One end of the heat exchange tube 504 passes through the heating chamber 402 and extends to the outside of the heating chamber 402. The auxiliary air pump 501 supplies air to the vortex tube 502, which splits the airflow into hot and cold streams. The cold air enters the interior of the condenser tube 503 and condenses the air drawn from the wafer lithography machine host 1 to remove water vapor, which is convenient for the water absorption component 3 to absorb water. The hot air passes through the heat exchange tube 504 to provide auxiliary heating to the air inside the heating chamber 402. The air flowing out of the condenser tube 503 and the heat exchange tube 504 is discharged to the outside and does not mix with the circulating air, thereby avoiding the increase of humidity in the circulating air and facilitating auxiliary drying.

[0040] The foregoing has shown and described the basic principles, main features and advantages of this invention. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are only illustrative of the principles of this invention. Various changes and modifications can be made to this invention without departing from the spirit and scope of this invention. All such changes and modifications fall within the scope of this invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A drying apparatus for a wafer lithography machine, characterized in that: The system includes a wafer lithography machine main unit (1), with a housing assembly (2) fixedly mounted on the upper end of the main unit (1). The air inlet of the housing assembly (2) is connected to the upper interior of the wafer lithography machine main unit (1). The housing assembly (2) includes a main frame (201) and a sub-frame (202). A water absorption assembly (3) is snapped into the interior of the main frame (201). The sub-frame (202) is fixedly mounted on one side of the main frame (201). The upper end of the wafer lithography machine main unit (1) is located within the housing assembly. A gas circulation assembly (4) is fixedly installed on one side of the body assembly (2). The gas inlet of the gas circulation assembly (4) is fixedly connected to one end of the sub-frame (202), and the gas outlet of the gas circulation assembly (4) is connected to the interior of the wafer lithography machine host (1). An auxiliary assembly (5) is fixedly installed on the upper end of the main frame (201). The cold end of the auxiliary assembly (5) is located inside the main frame (201), and the hot end of the auxiliary assembly (5) is located inside the gas circulation assembly (4). The gas circulation assembly (4) includes a main air pump (401), the air inlet of the main air pump (401) is connected to the air outlet of the box assembly (2), and a heating chamber (402) is fixedly installed at the air outlet of the main air pump (401). The auxiliary component (5) includes a secondary air pump (501), which is fixedly installed on the upper end of the main frame (201), and a vortex tube (502) is fixedly installed on the output end of the secondary air pump (501).

2. The drying apparatus for a wafer lithography machine according to claim 1, characterized in that: The main frame (201) and the sub-frame (202) are square frame structures. An air inlet (203) is fixedly installed on one side of the main frame (201), and an air distribution plate (204) with air holes is fixedly installed on one side inside the air inlet (203). A U-shaped air inlet pipe (205) is fixedly installed at the other end of the air inlet (203). The end of the air inlet pipe (205) is connected to the upper inside of the wafer lithography machine host (1).

3. The drying apparatus for a wafer lithography machine according to claim 2, characterized in that: Both ends of the main frame (201) are fixedly installed with frame plates (206). The water-absorbing end of the water-absorbing component (3) is located between the frame plates (206). Compression frames (207) are fixedly installed on both sides of the main frame (201) between the frame plates (206). The compression frames (207) are connected to the main frame (201). A sealing strip (208) is fixedly installed on the outer side of the compression frame (207) away from the main frame (201). A sealing cover (209) with a handle is sleeved on the end of the compression frame (207). The inner side of the sealing cover (209) is pressed against the sealing strip (208).

4. The drying apparatus for a wafer lithography machine according to claim 3, characterized in that: A water collection frame (2010) is fixedly installed at the lower end of the compression frame (207), and a drain pipe (2011) is fixedly installed between the two water collection frames (2010). A drain valve (2012) is fixedly installed at one end of the drain pipe (2011). A square hole (2013) is opened at the middle position of the lower end of the main frame (201). One end of the water absorption component (3) passes through the square hole (2013) and extends to the outside of the main frame (201).

5. The drying apparatus for a wafer lithography machine according to claim 4, characterized in that: The water-absorbing component (3) includes an electric slide rail (301), which is fixedly installed at the lower end of the main frame (201). The output end of the electric slide rail (301) passes through the square hole (2013) and extends into the interior of the main frame (201). A movable block (302) is fixedly installed at the output end of the electric slide rail (301). Compression blocks (303) are fixedly installed on both sides of the movable block (302). A water-absorbing sponge (304) is glued to one side of the compression block (303). One end of the water-absorbing sponge (304) is located inside the compression frame (207). The movable block (302), the compression block (303), and the water-absorbing sponge (304) are all located between the frame plate (206).

6. The drying apparatus for a wafer lithography machine according to claim 5, characterized in that: Velcro (305) is fixedly installed on one side of the compression block (303) and one side of the absorbent sponge (304). The absorbent sponge (304) is installed on the compression block (303) by the Velcro (305). A notch (306) is provided in the middle position of the movable block (302), the compression block (303) and the absorbent sponge (304), and the cold end of the auxiliary component (5) is located inside the notch (306).

7. The drying apparatus for a wafer lithography machine according to claim 6, characterized in that: The main frame (201) is connected to the sub-frame (202), and a first mesh plate (2014) and a second mesh plate (2015) are fixedly installed on the inner sides of the sub-frame (202) respectively. A placement hole (2016) is opened at the upper end of the sub-frame (202) between the first mesh plate (2014) and the second mesh plate (2015). A drying agent made of water-absorbing resin is placed between the first mesh plate (2014) and the second mesh plate (2015). The package (6) has a cover plate (2017) for sealing the placement hole (2016) at the upper end of the sub-frame (202). The sub-frame (202) has slots (2018) on both sides. The cover plate (2017) is engaged with the slots (2018) on both sides. An air outlet (2019) is fixedly installed on one side of the sub-frame (202). The air inlet of the gas circulation component (4) is connected to one end of the air outlet (2019).

8. The drying apparatus for a wafer lithography machine according to claim 7, characterized in that: The hot end of the auxiliary component (5) is located inside the heating chamber (402). A return pipe (403) is fixedly installed at the outlet end of the heating chamber (402). A U-shaped return pipe (404) is fixedly installed at the lower end of the return pipe (403). The return pipe (404) is connected to the interior of the wafer lithography machine host (1).

9. The drying apparatus for a wafer lithography machine according to claim 8, characterized in that: The interior of the heating chamber (402) is a square structure, and heating wires (405) are fixedly installed in a circular array inside the heating chamber (402).

10. The drying apparatus for a wafer lithography machine according to claim 9, characterized in that: A condenser tube (503) is fixedly installed at the cold end of the vortex tube (502). One end of the condenser tube (503) is distributed in a serpentine shape inside the main frame (201), and the outlet end of the condenser tube (503) passes through the main frame (201) and extends to the outside of the main frame (201). A heat exchange tube (504) is fixedly installed at the hot end of the vortex tube (502). One end of the heat exchange tube (504) extends in a spiral state into the heating chamber (402) in the gas circulation assembly (4), and the spiral heat exchange tube (504) is located between the heating wires (405). One end of the heat exchange tube (504) passes through the heating chamber (402) and extends to the outside of the heating chamber (402).

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