Thermal performance analysis method and system for harmonic reducer

Abstract

The invention discloses a thermal performance analysis method and system of a harmonic reducer, and relates to the technical field of thermal performance analysis of harmonic reducers, and the method comprises the following steps: data collection and preprocessing: collecting basic data of structural parameters, working conditions and material attributes of the harmonic reducer, and carrying out necessary preprocessing, according to the method, a coupling equation is solved by adopting a finite element analysis (FEA) method, a solving area is divided into a limited number of units, and a global equation set is solved by utilizing a linear algebraic solver, so that the numerical calculation efficiency is greatly improved, and meanwhile, the accuracy and reliability of an analysis result are ensured by verifying and optimizing a solving result; and powerful support is provided for thermal performance evaluation of the harmonic reducer.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal performance analysis of harmonic reducers, and in particular to a thermal performance analysis method and system for harmonic reducers. Background Art

[0002] Traditional thermal performance analysis methods fail to fully consider the coupling effects between multiple physical fields. In the actual operation of the harmonic reducer, multiple physical fields such as temperature field, stress field, and humidity field are interrelated and influence each other. Ignoring this coupling relationship will lead to deviations in the analysis results and even mislead product design and optimization.

[0003] Secondly, the computational efficiency of traditional analysis methods is low and cannot meet the needs of rapid design and optimization. With the continuous development of computer technology, the requirements for product design are becoming higher and higher, and it is necessary to be able to quickly and accurately evaluate product performance. However, traditional thermal performance analysis methods often require a large number of iterative calculations, which are computationally inefficient and cannot meet the needs of modern product design.

[0004] In addition, the verification and optimization methods of traditional analysis methods are also insufficient. Since they cannot fully consider the coupling relationship between multiple physical fields, traditional methods can often only verify and optimize a single physical field, but cannot effectively evaluate the entire system. This leads to omissions or misjudgments in the analysis process, further affecting the effects of product design and optimization.

[0005] Therefore, in view of the deficiencies and shortcomings of the prior art, the present invention proposes a thermal performance analysis method for a harmonic reducer to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to make up for the shortcomings of the prior art and provide a thermal performance analysis method and system for a harmonic reducer, which covers data collection, multi-physical field coupling model establishment, simulation analysis, result output and optimization suggestions and experimental verification. By collecting parameters, establishing models, simulating operations, outputting visual results and experimental verification, the thermal performance of the harmonic reducer is comprehensively evaluated to ensure the accuracy and reliability of the analysis, providing a scientific basis for optimal design.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a thermal performance analysis method for a harmonic reducer, and the specific steps of the charging control method are:

[0008] Data collection and preprocessing: Collect basic data on the structural parameters, working conditions, and material properties of the harmonic reducer, and perform necessary preprocessing;

[0009] Establishment of multi-physics coupling model: Establish a multi-physics coupling model of the harmonic reducer, taking into account the factors of heat conduction, heat convection, heat radiation, and the influence of mechanical stress and vibration on thermal performance;

[0010] Simulation analysis: By simulating the operation of the harmonic reducer under different working conditions, the thermal performance parameters of its temperature distribution and heat flow are obtained. At the same time, the influence of mechanical stress and vibration on thermal performance is analyzed, and the degree of influence on the overall performance of the harmonic reducer is evaluated;

[0011] Result output and optimization suggestions: The simulation analysis results are presented in a visual way, which can intuitively show the thermal performance of the harmonic reducer. Based on the analysis results, optimization suggestions for the thermal performance of the harmonic reducer are given;

[0012] Experimental verification: By building an experimental platform, simulating the actual working environment of the harmonic reducer, measuring its thermal performance parameters in actual operation, and comparing the experimental results with the simulation analysis results, the accuracy and reliability of the present invention are verified.

[0013] Furthermore, the data collection and preprocessing uses sensor equipment to collect vibration signals, temperature, and noise parameters of the real-time operation of the harmonic reducer, obtains experimental record data from laboratory or field tests, retrieves basic data on the structural parameters and material properties of the harmonic reducer from existing databases or data repositories, removes duplicate, erroneous, incomplete or irrelevant data, verifies the cleaned data to ensure the accuracy and consistency of the data, converts the data into a format suitable for subsequent analysis and modeling, and performs standardization processing to merge data from different data sources into a unified data set.

[0014] Furthermore, the multi-physics field coupling model establishes physical fields that need to be coupled clearly. For each physical field, its mathematical model and equations are defined, and relevant boundary conditions are determined. In order to perform numerical calculations, the solution area is divided into discrete grids. For the multi-physics field coupling model, in order to ensure that each physical field is calculated on the same grid, so as to ensure that the coupling relationship between different physical fields can be correctly reflected in the numerical calculation, for each physical field, an initial field is set, that is, the distribution of physical quantities at the beginning of the solution. According to the interaction relationship between different physical fields, a coupling equation is established, and the coupling equation is solved using the finite element analysis (FEA) method. The solution results are verified to ensure that they conform to physical laws and actual conditions. If the results do not meet expectations, the model parameters, grid settings or solution methods are adjusted, and the model is optimized according to the verification results to improve its accuracy and reliability.

[0015] Furthermore, the finite element analysis (FEA) solves the coupled equations, dividing the solution area into a finite number of units, each unit has a unique index e. On each unit, local equations are established according to the laws of physics. For heat conduction problems, the local heat conduction equation is expressed as: K e T e =Q e , where: K e is the unit heat conduction matrix, T e is the element node temperature vector, Q e is the unit heat source vector. The local equations of all units are assembled into a global linear equation group. For coupling problems, it is necessary to ensure that the coupling relationship between different physical fields is correctly reflected in the global equation group. The global heat conduction equation is expressed as KT=Q and the global elastic mechanics equation is expressed as Ku=F, where: K is the heat conduction matrix, T is the global temperature vector, u is the global displacement vector, Q and F are the global heat source and force vectors. The coupling coefficient is introduced to ensure that the coupling term can correctly reflect the interaction between different physical fields. The global equation group is solved using a linear algebra solver, and the solution results are post-processed to extract the required temperature distribution and stress distribution, and visualize or further analyze them.

[0016] Furthermore, the simulation analysis uses 3D modeling software to create a detailed 3D model of the harmonic reducer, defines the density, thermal conductivity, specific heat capacity, elastic modulus, and Poisson's ratio of the material of each component in the model, sets the ambient temperature of the simulation analysis, sets the boundary conditions of the thermal convection coefficient and the thermal radiation coefficient, selects the appropriate mesh size and type, and meshes the model to capture the temperature changes and stress distribution in key areas, performs steady-state thermal analysis to capture the temperature distribution and heat flow changes of the harmonic reducer under different working conditions, adds corresponding input speed, output load, and friction parameters to the model, analyzes the temperature distribution and heat flow, and evaluates whether the thermal performance meets the design requirements. In the simulation software, mechanical models and material parameters are added to the model of the harmonic reducer, boundary conditions and loads are set, and the stress conditions of the harmonic reducer during operation are simulated. By solving the force balance equation, the influence of mechanical stress and vibration on thermal performance is analyzed, and the thermal and mechanical properties of the harmonic reducer are evaluated based on the simulation results, existing problems are identified, and the design is optimized to improve performance or reduce costs.

[0017] Furthermore, the steady-state thermal analysis is based on the boundary conditions set by the three-dimensional modeling software as the constraint conditions for solving the equations, and starts to solve the temperature boundary conditions; T = T0 at the boundary Γ T On the top, the heat flux boundary condition is: At the boundary Γ qWhere: n is the normal direction on the boundary, q0 is the given heat flux density. For a single-layer flat wall, when there is a temperature difference ΔT on both sides of the wall, the heat flux q through the wall is calculated using the following formula: Where: L is the thickness of the wall, q is the heat flow through a certain area A, and the total heat flow Q is expressed as: In finite element analysis, the equations are discretized and the steady-state heat balance equations are solved using finite element analysis software to obtain the temperature distribution and heat flux distribution over the entire model.

[0018] Furthermore, the force balance equation is solved by defining the parameters of the elastic modulus (E), Poisson's ratio (ν), and density (ρ) of the material according to the created model, dividing the model into a finite number of units and nodes, calculating the stiffness matrix of each unit using the elastic modulus and Poisson's ratio of the material, calculating the mass matrix of each unit using the density of the material, defining fixed support and sliding support constraints for the model, applying external loads such as force, moment, and pressure to the model, assembling the stiffness matrix and mass matrix of each unit into a global stiffness matrix and mass matrix, and calculating the global stiffness matrix and mass matrix according to the global stiffness matrix and mass matrix. and the applied load to form the force balance equation K×U=F, where K is the global stiffness matrix, U is the node displacement vector, and F is the load vector. The node displacement vector U and the unit stiffness matrix are used to calculate the stress and strain of each unit. The stress distribution diagram is displayed through a visualization tool to identify the area of ​​stress concentration. Since large stress will cause local temperature to rise, the thermal analysis module can be used to simulate the temperature distribution. Vibration will change the heat conduction path inside the structure, resulting in uneven heat flow distribution. Based on the analysis results, evaluate whether the performance of the harmonic reducer meets the requirements and optimize the design as needed.

[0019] Furthermore, the result output and optimization suggestions derive the temperature distribution, heat flux density, and thermal resistance of the thermal performance of the harmonic reducer from the simulation software, and use data processing and visualization software to visualize the exported data, observe and analyze key information such as trends, peaks, and abnormal points in the charts, deeply understand the thermal performance of the harmonic reducer, compare the analysis results with industry standards, design requirements, or previous product versions, and evaluate whether the thermal performance of the harmonic reducer meets the requirements. By analyzing data charts and comparing results, the key factors or bottlenecks affecting the thermal performance of the harmonic reducer are identified, and specific improvement strategies are proposed for the thermal performance bottlenecks identified. The proposed optimization strategies are input into the simulation software for a new round of simulation analysis.

[0020] Furthermore, the experimental verification selects experimental equipment that is consistent with the model used in the simulation analysis, builds an experimental platform according to the actual working environment and the conditions in the simulation analysis, ensures the stability of the experimental environment, and avoids the influence of external interference factors on the experimental results. According to the predetermined experimental plan, the experimental equipment is started to simulate the actual working environment of the harmonic reducer. During the experiment, the temperature data and other relevant parameters of the key parts of the harmonic reducer are continuously recorded, the maximum temperature, average temperature, and temperature distribution in the collected data are extracted, the trend and law of temperature data over time are analyzed, the temperature data under different experimental conditions are compared, the temperature data and other relevant parameters obtained from the experiment are compared with the results in the simulation analysis, and the accuracy of the simulation analysis is evaluated. If the experimental results are basically consistent with the simulation analysis results, it means that the simulation analysis has high accuracy and reliability. If there are large differences between the experimental results and the simulation analysis results, the reasons are further analyzed, and it is considered to correct or optimize the simulation model to improve the accuracy and reliability of the simulation analysis.

[0021] Furthermore, the system comprises the following steps:

[0022] Data collection module: Sensors are installed at key locations of the harmonic reducer to collect parameter data of temperature, heat flow, stress, and vibration in real time. The sensor data is transmitted to the analysis system through a data collector.

[0023] Multi-physics coupling analysis module: Using finite element analysis (FEA), a multi-physics coupling analysis model of the harmonic reducer is established. This model can simultaneously consider the thermal physical field factors of heat conduction, heat convection, and heat radiation, as well as the factors of mechanical stress and vibration. Through numerical calculation, the influence of these factors on the thermal performance of the harmonic reducer is analyzed;

[0024] Result output module: presents the results of multi-physics field coupling analysis in a visual way, and gives optimization suggestions for the thermal performance of the harmonic reducer based on the analysis results;

[0025] User interaction and feedback: The system provides a user interaction interface for users to view analysis results, adjust analysis parameters, and receive optimization suggestions. Users can also customize the system according to actual needs to meet the requirements of different application scenarios.

[0026] Compared with the prior art, the thermal performance analysis method and system of the harmonic reducer have the following beneficial effects:

[0027] 1. The present invention ensures that calculations are performed on the same grid by clarifying the physical fields that need to be coupled and defining mathematical models and equations for each physical field, thereby accurately reflecting the interaction between different physical fields. This multi-physical field coupling analysis method makes the thermal performance analysis of the harmonic reducer more comprehensive and accurate, providing a reliable basis for product design and optimization.

[0028] 2. The present invention adopts the finite element analysis (FEA) method to solve the coupling equations. By dividing the solution area into a finite number of units and using a linear algebra solver to solve the global equations, the efficiency of numerical calculation is greatly improved. At the same time, by verifying and optimizing the solution results, the accuracy and reliability of the analysis results are ensured, providing strong support for the thermal performance evaluation of the harmonic reducer.

[0029] Other advantages, objectives and features of the present invention will be set forth in part in the following description and, in part, will be apparent to those skilled in the art based on an examination of the following or may be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 The figure is a flow chart of a thermal performance analysis method for a harmonic reducer.

[0032] Figure 2 The figure is a flow chart of a thermal performance analysis system for a harmonic reducer. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1

[0035] A charging control method for an electric vehicle, the method comprising the following steps: data collection and preprocessing, multi-physics field coupling model establishment, simulation analysis, result output and optimization suggestions, and experimental verification.

[0036] First, data collection and preprocessing: install vibration sensors, temperature sensors and noise sensors at key locations of the harmonic reducer to monitor its operating status in real time. Vibration signals, temperature and noise real-time operating data are collected through sensor equipment. Basic data on the structural parameters and material properties of the harmonic reducer are retrieved from existing databases or data repositories. The collected data are deduplicated to ensure that the data set does not contain duplicate data items. Obvious erroneous data is identified and corrected based on the data range and common sense. The data is converted into an appropriate format based on the needs of subsequent analysis and modeling. The cleaned, converted and standardized data are merged into a unified data set.

[0037] Next, the multi-physics coupling model is established. After clarifying the required coupled heat conduction, heat convection, heat radiation, mechanical stress and vibration, the mathematical model and equations of each physical field are defined, and the relevant boundary conditions are determined. The finite element analysis (FEA) method is used to divide the solution area into discrete grids to ensure that the generation and refinement of the grid fully consider the specific structure and details of the harmonic reducer. For each unit e, a local equation is established according to the law of heat conduction. The local equations of all units are assembled into a global linear equation group, and the coupling relationship between units is considered. The global heat conduction equation can be expressed as KT=Q. At the same time, the global elastic mechanics The equation is expressed as Ku=F. The equations together constitute the multi-physics field coupling model of the harmonic reducer. During the processing, special attention should be paid to the abnormal coupling terms that appear to ensure that they can correctly reflect the interaction between different physical fields. By using an appropriate linear algebra solver, this global set of equations can be solved to obtain the physical quantities of temperature distribution and stress distribution. After processing the solution results, the required temperature distribution and stress distribution are extracted and presented in a visual way to intuitively display the thermal performance of the harmonic reducer. Based on these results, the overall performance of the harmonic reducer can be further evaluated, and optimization suggestions can be made for its thermal performance.

[0038] Subsequently, simulation analysis is performed, using 3D modeling software to create a detailed 3D model of the harmonic reducer, defining the material properties of each component in the model, including elastic modulus (E), Poisson's ratio (ν), density (ρ), setting the ambient temperature for the simulation analysis, setting the thermal convection coefficient and thermal radiation coefficient, which depend on the environment in which the model is located and the surface characteristics of the components, and setting temperature boundary conditions and / or heat flux density boundary conditions on the boundaries for steady-state thermal analysis. Where: λ is the thermal conductivity, The model is finely meshed to ensure that the changes in temperature and stress parameters can be accurately captured in the finite element analysis, and the operation of the harmonic reducer under different working conditions is simulated, including steady-state thermal analysis and force analysis. The steady-state thermal analysis is used to capture the changes in temperature, thermal gradient, heat flow rate, and heat flux density. The heat flow through the wall q is calculated using the following formula: q is the heat flow through a certain area A, then the total heat flow Q is expressed as: In finite element analysis, this equation will be discretized and solved on each grid element to obtain the temperature distribution and heat flow distribution on the entire model. Based on the created model, the stiffness matrix and mass matrix of the element are calculated through the defined material properties (elastic modulus, Poisson's ratio, density), the constraints of the fixed support and sliding support of the model are defined, and the load is applied to the model to solve the force equilibrium equation (K×U=F), and the displacement vector U obtained by the solution is used to calculate the stress and strain of the element.

[0039] Then, the results are output and optimization suggestions are made. The simulation software is used to simulate and analyze the thermal performance of the harmonic reducer, and the key thermal performance data of temperature distribution, heat flux density, and thermal resistance are exported. The exported data is imported and exported using data processing and visualization software. The temperature distribution, heat flux density, and thermal resistance data are visualized and charts are generated. The trends, peak values, and abnormal point key information in the charts are observed and analyzed to deeply understand the thermal performance of the harmonic reducer. The analysis results are compared with industry standards, design requirements, or previous product versions to evaluate whether the thermal performance of the harmonic reducer meets the requirements and identify problems or deficiencies. By analyzing data charts and comparing results, the key factors affecting the thermal performance of the harmonic reducer are identified. Specific improvement strategies are proposed for the thermal factors identified. The proposed optimization strategies are input into the simulation software for a new round of simulation analysis to verify the effectiveness of the optimization strategies.

[0040] Finally, for experimental verification, select experimental equipment that is consistent with the model used in the simulation analysis, prepare the experimental equipment according to the actual working environment and the conditions in the simulation analysis, and test the harmonic reducer under the set experimental conditions. During the experiment, continuously record the temperature data and other relevant parameters of the key parts of the harmonic reducer, extract the collected data, including the maximum temperature, average temperature, and temperature distribution, analyze the changing trends and laws of the temperature data over time, and compare the temperature data under different experimental conditions to evaluate the stability and consistency of the experimental results. Compare the temperature data and other relevant parameters obtained from the experiment with the results in the simulation analysis, and analyze the differences and consistency of the comparison results. If the experimental results are basically consistent with the simulation analysis results, it means that the simulation analysis has high accuracy and reliability. If there are large differences, further analyze the reasons, such as considering environmental variables, equipment differences, and measurement errors during the experiment. According to the results of experimental verification, summarize the effectiveness of the simulation analysis model.

[0041] The thermal performance of the harmonic reducer was comprehensively evaluated through the steps of data collection and preprocessing, multi-physics field coupling model establishment, simulation analysis, result output and optimization suggestions, and experimental verification. This method has the characteristics of high accuracy and strong reliability, and provides strong support for the design, manufacture and optimization of the harmonic reducer.

[0042] Example 2

[0043] Application of multi-physics coupling analysis in thermal performance analysis of harmonic reducer

[0044] In the thermal performance analysis of harmonic reducers, the main physical fields involved include heat conduction field and stress field. There are interactions between these physical fields, so coupling analysis is required. For the heat conduction field, Fourier's heat conduction law is used to describe the heat transfer process in the medium. For the stress field, the theory of elastic mechanics is used to describe the deformation and stress distribution of the material under force. According to the actual working environment and constraints of the harmonic reducer, the boundary conditions of the heat conduction field and the stress field are determined. Professional meshing software is used to discretize the solution area of ​​the harmonic reducer to generate high-quality meshes. The generation and refinement of the mesh need to consider the specific structure and details of the harmonic reducer to ensure the accuracy of the calculation results.

[0045] In the thermal performance analysis of harmonic reducers, the main physical fields involved include heat conduction field and stress field. There are interactions between these physical fields, so coupling analysis is performed. For the heat conduction field, Fourier's heat conduction law is used to describe the heat transfer process in the medium. For the stress field, the theory of elastic mechanics is used to describe the deformation and stress distribution of the material under force. According to the actual working environment and constraints of the harmonic reducer, the boundary conditions of the heat conduction field and the stress field are determined. Professional meshing software is used to discretize the solution area of ​​the harmonic reducer to generate high-quality meshes. The generation and refinement of the mesh take into account the specific structure and details of the harmonic reducer to ensure the accuracy of the calculation results.

[0046] The continuous solution area is discretized into a finite number of units, and local equations are established on each unit according to the law of heat conduction. The local equations of all units are assembled into a global linear equation group, and the coupling relationship between units is considered. The global equation group is solved using a linear algebra solver to obtain solutions to temperature distribution and stress distribution.

[0047] Compare and verify the solution results with the actual situation or known experimental data to ensure that they conform to physical laws and actual conditions. If the results do not meet expectations, check whether the model parameters, grid settings or solution methods are correct, and optimize the model according to the verification results, such as modifying boundary conditions and refining the grid, to improve the calculation accuracy and reliability.

[0048] In summary, by establishing a multi-physical field coupling model and adopting finite element analysis technology, an accurate evaluation of the thermal performance of the harmonic reducer is achieved. This method not only takes into account the interaction between different physical fields, but also can handle complex structures and boundary conditions, providing a powerful tool support for the design and optimization of the harmonic reducer.

[0049] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A thermal performance analysis method for a harmonic reducer, characterized in that: The specific steps of this method are: Data collection and preprocessing: Collect basic data on the structural parameters, working conditions, and material properties of the harmonic reducer, and perform necessary preprocessing; Establishment of multi-physics coupling model: Establish a multi-physics coupling model of the harmonic reducer, taking into account the factors of heat conduction, heat convection, heat radiation, and the influence of mechanical stress and vibration on thermal performance; Simulation analysis: By simulating the operation of the harmonic reducer under different working conditions, the thermal performance parameters of its temperature distribution and heat flow are obtained. At the same time, the influence of mechanical stress and vibration on thermal performance is analyzed, and the degree of influence on the overall performance of the harmonic reducer is evaluated; Result output and optimization suggestions: The simulation analysis results are presented in a visual way, which can intuitively show the thermal performance of the harmonic reducer. Based on the analysis results, optimization suggestions for the thermal performance of the harmonic reducer are given; Experimental verification: By building an experimental platform, simulating the actual working environment of the harmonic reducer, measuring its thermal performance parameters in actual operation, and comparing the experimental results with the simulation analysis results, the accuracy and reliability of the present invention are verified.

2. The thermal performance analysis method of a harmonic reducer according to claim 1, characterized in that: The data collection and preprocessing uses sensor equipment to collect the vibration signals, temperature, and noise parameters of the real-time operation of the harmonic reducer, obtains experimental record data from laboratory or field tests, retrieves basic data on the structural parameters and material properties of the harmonic reducer from existing databases or data bases, removes duplicate, erroneous, incomplete or irrelevant data, verifies the cleaned data to ensure the accuracy and consistency of the data, converts the data into a format suitable for subsequent analysis and modeling, and performs standardization processing to merge data from different data sources into a unified data set.

3. The thermal performance analysis method of a harmonic reducer according to claim 1, characterized in that: The multi-physics coupling model establishes physical fields that need to be coupled clearly. For each physical field, its mathematical model and equations are defined, and relevant boundary conditions are determined. In order to perform numerical calculations, the solution area is divided into discrete grids. For the multi-physics coupling model, in order to ensure that each physical field is calculated on the same grid, so as to ensure that the coupling relationship between different physical fields can be correctly reflected in the numerical calculation, for each physical field, an initial field is set, that is, the distribution of physical quantities at the beginning of the solution. According to the interaction relationship between different physical fields, a coupling equation is established, and the coupling equation is solved using the finite element analysis (FEA) method. The solution results are verified to ensure that they comply with physical laws and actual conditions. If the results do not meet expectations, the model parameters, grid settings or solution methods are adjusted, and the model is optimized according to the verification results to improve its accuracy and reliability.

4. The thermal performance analysis method of a harmonic reducer according to claim 3 is characterized in that: The finite element analysis (FEA) solves the coupled equations and divides the solution area into a finite number of units. Each unit has a unique index e. On each unit, local equations are established according to the laws of physics. For heat conduction problems, the local heat conduction equation is expressed as: K e T e =Q e , where: K e is the unit heat conduction matrix, T e is the element node temperature vector, Q e is the unit heat source vector. The local equations of all units are assembled into a global linear equation group. For coupling problems, ensure that the coupling relationship between different physical fields is correctly reflected in the global equation group. The global heat conduction equation is expressed as KT=Q and the global elastic mechanics equation is expressed as Ku=F, where: K is the heat conduction matrix, T is the global temperature vector, u is the global displacement vector, Q and F are the global heat source and force vectors. The coupling coefficient is introduced to ensure that the coupling term can correctly reflect the interaction between different physical fields. The global equation group is solved using a linear algebra solver, and the solution results are post-processed to extract the required temperature distribution and stress distribution, and visualize or further analyze them.

5. The thermal performance analysis method of a harmonic reducer according to claim 1, characterized in that: The simulation analysis uses 3D modeling software to create a detailed 3D model of the harmonic reducer, defines the density, thermal conductivity, specific heat capacity, elastic modulus, and Poisson's ratio of the material of each component in the model, sets the ambient temperature of the simulation analysis, sets the boundary conditions of the thermal convection coefficient and the thermal radiation coefficient, selects the appropriate mesh size and type, and meshes the model to capture the temperature changes and stress distribution in key areas, performs steady-state thermal analysis to capture the temperature distribution and heat flow changes of the harmonic reducer under different working conditions, adds corresponding input speed, output load, and friction parameters to the model, analyzes the temperature distribution and heat flow, and evaluates whether the thermal performance meets the design requirements. In the simulation software, mechanical models and material parameters are added to the model of the harmonic reducer, boundary conditions and loads are set, and the stress conditions of the harmonic reducer during operation are simulated. By solving the force balance equation, the influence of mechanical stress and vibration on thermal performance is analyzed, and the thermal and mechanical properties of the harmonic reducer are evaluated based on the simulation results, existing problems are identified, and the design is optimized to improve performance or reduce costs.

6. The thermal performance analysis method of a harmonic reducer according to claim 5, characterized in that: The steady-state thermal analysis is based on the boundary conditions set by the 3D modeling software as the constraint conditions for solving the equations. The temperature boundary condition, T = T0, is at the boundary Γ T On the top, the heat flux boundary condition is: At the boundary Γ q Where: n is the normal direction on the boundary, q0 is the given heat flux density. For a single-layer flat wall, when there is a temperature difference ΔT on both sides of the wall, the heat flux q through the wall is calculated using the following formula: Where: L is the thickness of the wall, q is the heat flow through a certain area A, and the total heat flow Q is expressed as: In finite element analysis, the equations are discretized and the steady-state heat balance equations are solved using finite element analysis software to obtain the temperature distribution and heat flux distribution over the entire model.

7. The thermal performance analysis method of a harmonic reducer according to claim 5, characterized in that: The force balance equation is solved by defining the parameters of the elastic modulus (E), Poisson's ratio (ν), and density (ρ) of the material according to the created model, dividing the model into a finite number of units and nodes, calculating the stiffness matrix of each unit using the elastic modulus and Poisson's ratio of the material, calculating the mass matrix of each unit using the density of the material, defining fixed support and sliding support constraint conditions for the model, applying external loads such as force, moment, and pressure to the model, assembling the stiffness matrix and mass matrix of each unit into a global stiffness matrix and mass matrix, and calculating the global stiffness matrix, mass matrix, and applied loads according to the global stiffness matrix, mass matrix, and applied loads. The added load forms the force balance equation K×U=F, where K is the global stiffness matrix, U is the node displacement vector, and F is the load vector. The node displacement vector U and the unit stiffness matrix are used to calculate the stress and strain of each unit. The stress distribution diagram is displayed through a visualization tool to identify the area of ​​stress concentration. Since the local temperature will rise due to the large stress, the thermal analysis module can be used to simulate the temperature distribution. Vibration will change the heat conduction path inside the structure, resulting in uneven heat flow distribution. Based on the analysis results, evaluate whether the performance of the harmonic reducer meets the requirements and optimize the design as needed.

8. The thermal performance analysis method of a harmonic reducer according to claim 1, characterized in that: The result output and optimization suggestions derive the temperature distribution, heat flux density, and thermal resistance of the thermal performance of the harmonic reducer from the simulation software, and use data processing and visualization software to visualize the exported data, observe and analyze the key information of trends, peaks, and abnormal points in the charts, and deeply understand the thermal performance of the harmonic reducer. The analysis results are compared with industry standards, design requirements or previous product versions to evaluate whether the thermal performance of the harmonic reducer meets the requirements. By analyzing data charts and comparing results, the key factors or bottlenecks affecting the thermal performance of the harmonic reducer are found, and specific improvement strategies are proposed for the thermal performance bottlenecks found. The proposed optimization strategies are input into the simulation software for a new round of simulation analysis.

9. The thermal performance analysis method of a harmonic reducer according to claim 1, characterized in that: The experimental verification selects experimental equipment that is consistent with the model used in the simulation analysis, builds an experimental platform according to the actual working environment and the conditions in the simulation analysis, ensures the stability of the experimental environment, avoids the influence of external interference factors on the experimental results, starts the experimental equipment according to the predetermined experimental plan, simulates the actual working environment of the harmonic reducer, and continuously records the temperature data and other relevant parameters of the key parts of the harmonic reducer during the experiment, extracts the highest temperature, average temperature, and temperature distribution from the collected data, analyzes the trend and law of temperature data over time, compares the temperature data under different experimental conditions, compares the temperature data and other relevant parameters obtained from the experiment with the results in the simulation analysis, and evaluates the accuracy of the simulation analysis. If the experimental results are basically consistent with the simulation analysis results, it means that the simulation analysis has high accuracy and reliability. If there are large differences between the experimental results and the simulation analysis results, further analyze the reasons and consider correcting or optimizing the simulation model to improve the accuracy and reliability of the simulation analysis.

10. A thermal performance analysis system for a harmonic reducer according to claim 1, characterized in that: The system comprises the following steps: Data collection module: Sensors are installed at key locations of the harmonic reducer to collect parameter data of temperature, heat flow, stress, and vibration in real time. The sensor data is transmitted to the analysis system through a data collector. Multi-physics coupling analysis module: Using finite element analysis (FEA), a multi-physics coupling analysis model of the harmonic reducer is established. This model can simultaneously consider the thermal physical field factors of heat conduction, heat convection, and heat radiation, as well as the factors of mechanical stress and vibration. Through numerical calculation, the influence of these factors on the thermal performance of the harmonic reducer is analyzed; Result output module: presents the results of multi-physics field coupling analysis in a visual way, and gives optimization suggestions for the thermal performance of the harmonic reducer based on the analysis results; User interaction and feedback: The system provides a user interaction interface for users to view analysis results, adjust analysis parameters, and receive optimization suggestions. Users can also customize the system according to actual needs to meet the requirements of different application scenarios.

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