An integrated circuit package, a package substrate, and a manufacturing step thereof
By combining structures such as limit rods, lifting rods, and springs, the problem of low efficiency in fixing and releasing integrated circuit packages during soldering is solved, enabling rapid and stable clamping and release of the packages.
Patent Information
- Application Number
- CN202411262376.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2044-09-10
AI Technical Summary
The current integrated circuit package requires stable clamping and releasing operations during soldering, resulting in low work efficiency.
It employs a structure including a limit rod, a lifting rod, a spring, and a fixing block. The packaging substrate is moved by a lead screw, and the packaging components are quickly fixed and released using deformation blocks and plug-in blocks.
It enables quick fixing and loosening of the packaged components, improving work efficiency.
Smart Images

Figure CN119132981B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of integrated circuit packaging technology, in particular to an integrated circuit package, a packaging substrate and a manufacturing method thereof. BACKGROUND
[0002] Integrated circuit packaging is both the tip of the pyramid and the base of the pyramid in the electronic pyramid. There is a very sufficient basis for saying that it is in both of these two positions. From the perspective of the density of electronic components (such as transistors), IC represents the tip of electronics. But IC is a starting point, a basic building block, the basis of most electronic systems in our lives. Similarly, IC is not just a single chip or a basic electronic structure, and the types of ICs are different (analog circuits, digital circuits, radio frequency circuits, sensors, etc.), and thus the needs and requirements for packaging are also different;
[0003] The existing packaging for integrated circuits needs stable movement clamping when welding electronic components, and needs to be stably placed on the surface of the packaging substrate, so that the packaging moves with the packaging substrate. However, the fixing and loosening of the packaging substrate packaging need to be operated through the steps of clamping and releasing, which requires time for operation, affecting the work efficiency. SUMMARY
[0004] The purpose of the present application is to provide an integrated circuit package, a packaging substrate and a manufacturing method thereof to solve the problems raised in the background.
[0005] To achieve the above purpose, the present application provides the following technical scheme: an integrated circuit package, a packaging substrate, comprising:
[0006] The surface of the limiting rod is provided with a packaging substrate;
[0007] The surface of the lifting rod is provided with a first spring, the surface of the lifting rod is fixed with an extension plate, the surface of the extension plate is provided with a first through hole, the first through hole is inserted with a fixed block, the surface of the extension plate is fixed with an elastic plate, and the surface of the packaging substrate is fixed with a supporting rod; and
[0008] The second through hole is arranged on the surface of the elastic plate.
[0009] Preferably, the inside of the packaging substrate is inserted with two groups of limiting rods, the inside of the packaging substrate is provided with a lead screw, the two ends of the lead screw are provided with a driving assembly, the driving assembly drives the lead screw to rotate, the packaging substrate can move on the surface of the limiting rod, and the surface of the packaging substrate is placed with a packaging.
[0010] Preferably, the surface of the limiting rod is provided with a through slot, the bottom of the limiting rod is provided with a clamping groove, the clamping groove is provided with a plurality of groups, a deformation block is fixed in the clamping groove, the deformation block has flexibility, the deformation block can be deformed under extrusion, and the deformation block can restore to the original state when not stressed.
[0011] Preferably, the bottom of the limiting rod is provided with a lifting plate, the bottom of the lifting plate is fixed with a U-shaped rod, the end of the U-shaped rod is inserted into the inside of the packaging substrate, the end of the U-shaped rod is connected with the end of the lifting rod, the U-shaped rod moves with the lifting rod, and the surface of the lifting plate is provided with a sliding groove.
[0012] Preferably, the sliding groove is provided with a plug-in block, the sliding block can move in the sliding groove, the surface of the sliding block is fixed with a plug-in block, the plug-in block moves with the sliding block, the plug-in block can be inserted into the clamping groove, and the surface of the plug-in block abuts against the surface of the deformation block when the plug-in block is inserted into the clamping groove.
[0013] Preferably, the surface of the lifting rod is provided with a first spring, one end of the first spring is connected with the surface of the packaging substrate, the other end of the first spring is connected with the surface of the lifting rod, the surface of the lifting rod is fixed with two groups of extension plates, and the extension plates move up and down with the lifting rod.
[0014] Preferably, the surface of the extension plate is provided with a first through hole, the surface of the elastic plate is provided with a second through hole, a fixed block is inserted into the first through hole and the second through hole, the fixed block can move in the first through hole and the second through hole, the bottom of the fixed block is fixed with a protrusion, the protrusion moves with the fixed block, and the protrusion can move into the first through hole and the second through hole.
[0015] Preferably, the end of the fixed block is provided with a supporting rod, the end of the supporting rod is fixed with the surface of the packaging substrate, the end of the supporting rod is inserted into the inside of the fixed block, the fixed block can move outside the supporting rod, the surface of the supporting rod is provided with a second spring, one end of the second spring is connected with the surface of the fixed block, and the other end is connected with the surface of the supporting rod.
[0016] Preferably, the elastic plate is clamped on the surface of the packaging piece, and the fixed block is located at the top of the packaging piece after moving.
[0017] A manufacturing step for the cooperation process of an integrated circuit packaging piece and a packaging substrate comprises the following steps:
[0018] Step one: the inside of the packaging substrate is provided with a screw rod, the screw rod rotates to drive the packaging substrate to move on the surface of the limiting rod, when the packaging substrate stops on the surface of the limiting rod, the sliding block moves in the sliding groove, so that the plug-in block moves into the clamping groove, and the clamping groove is provided with a deformation block, the plug-in block is supported on the surface of the deformation block, so that the deformation block deforms, the plug-in block is plugged into the clamping groove, so that the lifting plate moves up, the lifting plate drives the extension plate to move up through the U-shaped rod and the lifting rod, the extension plate moves up and is supported on the surface of the protrusion, the fixing block moves in the first through hole and the second through hole, the fixing block is received in the second through hole and the first through hole, the packaging piece can be directly placed on the surface of the packaging substrate, and the packaging piece is stably supported on the surface of the elastic plate.
[0019] Step two: fixing, when the packaging substrate moves, the plug-in block moves on the surface of the limiting rod, so that the U-shaped rod moves down, drives the extension plate to move down, and drives the fixing block to move to the top of the packaging piece under the pushing of the second spring, so as to fix the packaging piece.
[0020] Compared with the prior art, the beneficial effects of the present application are:
[0021] The inside of the packaging substrate is provided with a screw rod, the screw rod rotates to drive the packaging substrate to move on the surface of the limiting rod, when the packaging substrate stops on the surface of the limiting rod, the sliding block moves in the sliding groove, so that the plug-in block moves into the clamping groove, and the clamping groove is provided with a deformation block, the plug-in block is supported on the surface of the deformation block, so that the deformation block deforms, the plug-in block is plugged into the clamping groove, so that the lifting plate moves up, the lifting plate drives the extension plate to move up through the U-shaped rod and the lifting rod, the extension plate moves up and is supported on the surface of the protrusion, the fixing block moves in the first through hole and the second through hole, the fixing block is received in the second through hole and the first through hole, the packaging piece can be directly placed on the surface of the packaging substrate, and the packaging piece is stably supported on the surface of the elastic plate, when the packaging substrate moves, the plug-in block moves on the surface of the limiting rod, so that the U-shaped rod moves down, drives the extension plate to move down, and drives the fixing block to move to the top of the packaging piece under the pushing of the second spring, so as to fix the packaging piece, which can realize quick fixing and loosening of the packaging. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a three-dimensional structure schematic diagram of the present application.
[0023] Figure 2 It is another perspective structure schematic diagram of the present application.
[0024] Figure 3 It is a lifting plate structure schematic diagram of the present application.
[0025] Figure 4 It is Figure 2 It is an enlarged schematic diagram of structure in A.
[0026] Figure 5 Structure diagram of the lifting rod of the present application.
[0027] Figure 6 Structure diagram of the lifting rod of the present application.
[0028] In the figure: limiting rod 1, screw rod 2, packaging substrate 3, U-shaped rod 4, sliding block 5, plug-in block 6, sliding groove 7, lifting plate 8, clamping groove 9, through groove 10, deformation block 11, extension plate 12, lifting rod 13, first spring 14, first through hole 15, fixed block 16, protrusion 17, second spring 18, support rod 19, second through hole 20, elastic plate 21. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical solutions of the present application clear, complete description, and the advantages are more clear and obvious, the following will be combined with the drawings to further describe the embodiments of the present application. It should be understood that the specific embodiments described here are part of the embodiments of the present application, not all the embodiments, only to explain the embodiments of the present application, and not for the purpose of limiting the embodiments of the present application, all other embodiments obtained by the person skilled in the art without doing creative work, belong to the scope of protection of the present application.
[0030] Please refer to Figures 1 to 6 The present application provides a technical solution: an integrated circuit package, packaging substrate, comprising:
[0031] The surface of the limiting rod 1 is provided with the packaging substrate 3, the inside of the packaging substrate 3 is inserted with two groups of limiting rods 1, the inside of the packaging substrate 3 is provided with the lead screw 2, the both ends of the lead screw 2 are provided with the driving assembly, the driving assembly drives the lead screw 2 to rotate, the packaging substrate 3 can move on the surface of the limiting rod 1, the surface of the packaging substrate 3 is placed with the packaging piece, the surface of the limiting rod 1 is opened with the through slot 10, the bottom of the limiting rod 1 is opened with the clamping groove 9, the clamping groove 9 is provided with multiple groups, the clamping groove 9 is fixed with the deformation block 11, the deformation block 11 has flexibility, the deformation block 11 can be deformed when being extruded, and the deformation block 11 can restore to the original state when not being stressed, the bottom of the limiting rod 1 is provided with the lifting plate 8, the bottom of the lifting plate 8 is fixed with the U-shaped rod 4, the end of the U-shaped rod 4 is inserted into the inside of the packaging substrate 3, the end of the U-shaped rod 4 is connected with the end of the lifting rod 13, the U-shaped rod 4 moves along with the lifting rod 13, the surface of the lifting plate 8 is opened with the sliding groove 7, the sliding groove 7 is provided with the insertion block 6, the sliding block 5 can move in the sliding groove 7, and the surface of the sliding block 5 is fixed with the insertion block 6, the insertion block 6 moves along with the sliding block 5, the insertion block 6 can be inserted into the clamping groove 9, and when the insertion block 6 is inserted into the clamping groove 9, the surface of the insertion block 6 is supported on the surface of the deformation block 11, the clamping groove 9 is provided with the deformation block 11, the insertion block 6 is supported on the surface of the deformation block 11, so that the deformation block 11 is deformed, the insertion block 6 is inserted into the clamping groove 9, so that the lifting plate 8 moves upwards, the lifting plate 8 drives the extension plate 12 to move upwards through the U-shaped rod 4 and the lifting rod 13;
[0032] The surface of the lifting rod 13 is provided with the first spring 14, the surface of the lifting rod 13 is fixed with the extension plate 12, the surface of the extension plate 12 is provided with the first through hole 15, the first through hole 15 is inserted with the fixed block 16, the surface of the extension plate 12 is fixed with the elastic plate 21, the surface of the packaging substrate 3 is fixed with the support rod 19, the surface of the lifting rod 13 is provided with the first spring 14, one end of the first spring 14 is connected with the surface of the packaging substrate 3, the other end of the first spring 14 is connected with the surface of the lifting rod 13, the surface of the lifting rod 13 is fixed with two groups of extension plates 12, the extension plate 12 rises and falls along with the lifting rod 13, the surface of the extension plate 12 is provided with the first through hole 15, the surface of the elastic plate 21 is provided with the second through hole 20, the first through hole 15 and the second through hole 20 are inserted with the fixed block 16, the fixed block 16 can move in the first through hole 15 and the second through hole 20, the bottom of the fixed block 16 is fixed with the protrusion 17, the protrusion 17 moves along with the fixed block 16, and the protrusion 17 can move into the first through hole 15 and the second through hole 20, the end of the fixed block 16 is provided with the support rod 19, the end of the support rod 19 is fixed with the surface of the packaging substrate 3, the end of the support rod 19 is inserted into the inside of the fixed block 16, the fixed block 16 can move outside the support rod 19, the surface of the support rod 19 is provided with the second spring 18, one end of the second spring 18 is connected with the surface of the fixed block 16, and the other end is connected with the surface of the support rod 19; The second through hole 20 is arranged on the surface of the elastic plate 21, the elastic plate 21 is clamped on the surface of the packaging piece, after the fixed block 16 moves, the fixed block 16 is located at the top of the packaging piece, when the packaging substrate 3 moves, the insertion block 6 moves on the surface of the limiting rod 1, so that the U-shaped rod 4 moves downward, drives the extension plate 12 to move downward, and the fixed block 16 moves to the top of the packaging piece under the thrust of the second spring 18.
[0033] The inside of the packaging substrate 3 is provided with a screw rod 2, the screw rod 2 rotates to drive the packaging substrate 3 to move on the surface of the limiting rod 1, when the packaging substrate 3 stops on the surface of the limiting rod 1, the sliding block 5 moves in the sliding groove 7, so that the plug-in block 6 moves into the clamping groove 9, and the clamping groove 9 is provided with a deformation block 11, the plug-in block 6 is supported on the surface of the deformation block 11, so that the deformation block 11 is deformed, the plug-in block 6 is plugged into the clamping groove 9, so that the lifting plate 8 moves up, the lifting plate 8 drives the extension plate 12 to move up through the U-shaped rod 4 and the lifting rod 13, the extension plate 12 moves up and is supported on the surface of the protrusion 17, the fixing block 16 moves in the first through hole 15 and the second through hole 20, the fixing block 16 is received in the second through hole 20 and the first through hole 15, the packaging piece can be directly placed on the surface of the packaging substrate 3, the packaging piece is stabilized by the elastic plate 21 supported on the surface of the packaging piece, when the packaging substrate 3 moves, the plug-in block 6 moves on the surface of the limiting rod 1, so that the U-shaped rod 4 moves down, drives the extension plate 12 to move down, so that the fixing block 16 moves to the top of the packaging piece under the pushing of the second spring 18, the packaging piece is fixed, the packaging can be quickly fixed and loosened.
[0034] Although the above describes the specific embodiments of the present application in order to enable those skilled in the art to understand the present application, the present application is not limited to the scope of the specific embodiments, for those skilled in the art, as long as various changes are within the spirit and scope of the present application defined and determined by the appended claims, all the application creations utilizing the concept of the present application are protected.
Claims
1. An integrated circuit packaging component, characterized in that: include: A limiting rod (1) is provided with an encapsulation substrate (3) on its surface; a lifting rod (13) is provided with a first spring (14) on its surface; an extension plate (12) is fixed on its surface; a first through hole (15) is opened on the surface of the extension plate (12); a fixing block (16) is inserted into the first through hole (15); an elastic plate (21) is fixed on the surface of the extension plate (12); a support rod (19) is fixed on the surface of the encapsulation substrate (3); and a second through hole (20) is provided on the surface of the elastic plate (21). Two sets of limiting rods (1) are inserted inside the encapsulation substrate (3). A lead screw (2) is provided inside the encapsulation substrate (3). A driving component is provided at both ends of the lead screw (2). The driving component drives the lead screw (2) to rotate. The encapsulation substrate (3) can move on the surface of the limiting rod (1). An encapsulation component is placed on the surface of the encapsulation substrate (3). The surface of the limiting rod (1) is provided with a through groove (10), and the bottom of the limiting rod (1) is provided with a slot (9). Multiple sets of slots (9) are provided, and a deformable block (11) is fixed in the slot (9). The deformable block (11) is flexible, and can deform when squeezed, and can return to its original shape when not under force. The bottom of the limiting rod (1) is provided with a lifting plate (8), and a U-shaped rod (4) is fixed at the bottom of the lifting plate (8). The end of the U-shaped rod (4) is inserted into the inside of the encapsulation substrate (3). The end of the U-shaped rod (4) is connected to the end of the lifting rod (13). The U-shaped rod (4) moves with the lifting rod (13). The surface of the lifting plate (8) is provided with a sliding groove (7). The slide groove (7) is provided with a plug-in block (6), the slider (5) can move in the slide groove (7), and the surface of the slider (5) is fixed with the plug-in block (6). The plug-in block (6) moves with the slider (5), and the plug-in block (6) can be inserted into the slot (9). When the plug-in block (6) is inserted into the slot (9), the surface of the plug-in block (6) presses against the surface of the deformable block (11).
2. The integrated circuit packaging component according to claim 1, characterized in that: The surface of the lifting rod (13) is provided with a first spring (14). One end of the first spring (14) is connected to the surface of the encapsulation substrate (3), and the other end of the first spring (14) is connected to the surface of the lifting rod (13). Two sets of extension plates (12) are fixed on the surface of the lifting rod (13), and the extension plates (12) move up and down with the lifting rod (13).
3. An integrated circuit packaging component according to claim 2, characterized in that: The surface of the extension plate (12) is provided with a first through hole (15), and the surface of the elastic plate (21) is provided with a second through hole (20). A fixing block (16) is inserted into the first through hole (15) and the second through hole (20). The fixing block (16) can move in the first through hole (15) and the second through hole (20). A protrusion (17) is fixed at the bottom of the fixing block (16). The protrusion (17) moves with the fixing block (16) and can move into the first through hole (15) and the second through hole (20).
4. An integrated circuit packaging component according to claim 3, characterized in that: The fixed block (16) has a support rod (19) at its end. The end of the support rod (19) is fixed to the surface of the encapsulation substrate (3). The end of the support rod (19) is inserted into the interior of the fixed block (16). The fixed block (16) can move outside the support rod (19). The surface of the support rod (19) is provided with a second spring (18). One end of the second spring (18) is connected to the surface of the fixed block (16), and the other end is connected to the surface of the support rod (19).
5. An integrated circuit packaging component according to claim 4, characterized in that: The elastic plate (21) is clamped on the surface of the package, and after the fixing block (16) moves, the fixing block (16) is located on the top of the package.
6. A manufacturing step for an integrated circuit packaging assembly as described in any one of claims 1-5, characterized in that: The steps include: Step 1: Stabilization. A lead screw (2) is provided inside the encapsulation substrate (3). The lead screw (2) rotates and drives the encapsulation substrate (3) to move on the surface of the limiting rod (1). When the encapsulation substrate (3) stops on the surface of the limiting rod (1), the slider (5) will move in the groove (7), so that the insertion block (6) moves into the slot (9). A deformation block (11) is provided in the slot (9). The insertion block (6) presses against the surface of the deformation block (11), so that the deformation block (11) deforms. The insertion block (6) is inserted into the slot (9), so that the lifting plate (8) moves upward. The lifting plate (8) drives the extension plate (12) to move upward through the U-shaped rod (4) and the lifting rod (13). 12) After moving upward, the extension plate (12) is held against the surface of the protrusion (17), and the fixing block (16) moves in the first through hole (15) and the second through hole (20). The fixing block (16) is received in the second through hole (20) and the first through hole (15), and the package can be placed directly on the surface of the package substrate (3). The package is held against the surface of the package by the elastic plate (21) to stabilize the package. Step 2: Fixing. When the package substrate (3) moves, the plug block (6) moves on the surface of the limiting rod (1), so that the U-shaped rod (4) moves down, driving the extension plate (12) to move down, so that the fixing block (16) moves to the top of the package under the push of the second spring (18) to fix the package.
Citation Information
Patent Citations
Package substrate and integrated circuit package
CN210245467U
Reciprocating torsion durability detection device for material or structural component
CN219590077U