Display substrate and manufacturing method thereof, display panel

Abstract

The application discloses a display substrate, which comprises a driving substrate and a light-emitting element layer, the driving substrate is arranged on the backlight side of the display substrate and is used for driving each light-emitting element of the light-emitting element layer to emit light, wherein the light-emitting element comprises a light-emitting material body, the light-emitting material bodies of a plurality of light-emitting elements are arranged in the same layer, and the cross-sectional area of the light-emitting material body gradually increases in the direction away from the driving substrate. The application further provides a manufacturing method of the display substrate and a display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of display devices, in particular to a display substrate, a manufacturing method of the display substrate, and a display panel comprising the display substrate. BACKGROUND

[0002] Micro LED technology can be applied in the fields of augmented reality (AR) technology, virtual reality (VR) technology, and wearable device technology to achieve high-resolution, full-color small-size display devices.

[0003] How to manufacture a micro LED display panel has become a technical problem to be solved in the field. SUMMARY

[0004] The present application aims to solve one of the technical problems in the related art to some extent. To this end, the present application provides a display substrate, a manufacturing method of the display substrate, and a display panel, which can be manufactured by a relatively simple manufacturing method.

[0005] To achieve the above-mentioned purpose, as a first aspect of the present application, a display substrate is provided, comprising a driving substrate and a light emitting element layer, the driving substrate is arranged on the backlight side of the display substrate and is used to drive each light emitting element of the light emitting element layer to emit light, wherein the light emitting element comprises a light emitting material body, the light emitting material bodies of a plurality of light emitting elements are arranged in the same layer, and the cross-sectional area of the light emitting material body gradually increases in the direction away from the driving substrate.

[0006] Optionally, the light emitting element layer further comprises a light-transmitting electrode sub-layer arranged on the side of the light emitting material body away from the driving substrate, the light-transmitting electrode sub-layer comprises a light-transmitting dielectric material layer and a light-transmitting electrode material layer, a plurality of interval through holes corresponding to the plurality of light emitting material bodies are formed on the light-transmitting dielectric material layer, a metal light-blocking layer is formed on the side wall of the interval through hole, the light-transmitting electrode material layer covers the light-transmitting dielectric material layer, and the light-transmitting electrode material layer is filled in the interval through hole.

[0007] Optionally, at least one of the interval through holes is provided with a quantum dot material.

[0008] Optionally, the light emitting element layer is divided into a plurality of pixel units, the plurality of light emitting elements in the pixel unit include a red light emitting element, a green light emitting element and a blue light emitting element, wherein the quantum dot material is arranged in the through hole corresponding to the red light emitting element, and the material of the light emitting material body of the red light emitting element is the same as the material of the light emitting material body of the blue light emitting element.

[0009] Optionally, the display substrate further comprises a light filtering material layer arranged on the side of the light-transmitting electrode sub-layer away from the driving substrate, the light filtering material layer comprises a plurality of red light filtering blocks, the positions of the plurality of red light filtering blocks correspond to the red light emitting elements, and the red light filtering blocks are embedded in the light-transmitting electrode material layer.

[0010] Optionally, the light emitting element layer comprises a planarization layer arranged between the layer where the light emitting material body is located and the driving substrate, the planarization layer comprises a planarization material layer and a metal electrode layer, a plurality of electrode holes are formed on the planarization material layer, the plurality of electrode holes correspond to the plurality of light emitting material bodies one by one, and the metal electrode layer comprises a plurality of metal electrodes, the plurality of metal electrodes are arranged in the plurality of electrode holes respectively.

[0011] As a second aspect of the present application, a manufacturing method of a display substrate is provided, wherein the manufacturing method comprises:

[0012] providing an initial substrate, the initial substrate comprising a seed layer;

[0013] forming a combination comprising a light emitting element layer and a driving substrate, the driving substrate being used to drive each light emitting element of each light emitting element layer to emit light, wherein forming a light emitting element layer comprises:

[0014] forming a plurality of light emitting material bodies corresponding to a plurality of light emitting elements on the seed layer by means of selective area growth, the plurality of light emitting material bodies being located in the same layer, wherein the cross section of the light emitting material body gradually increases in the direction away from the driving substrate.

[0015] Optionally, the forming a light emitting element layer further comprises:

[0016] forming a planarization material layer;

[0017] forming a plurality of electrode through holes on the planarization material layer, the plurality of electrode through holes corresponding to the plurality of light emitting material bodies one by one;

[0018] forming a metal electrode in the plurality of electrode through holes to obtain a planarization layer, wherein the plurality of metal electrodes correspond to the plurality of light emitting material bodies one by one respectively;

[0019] The combination of the light emitting element layer and the driving substrate further comprises:

[0020] Bonding the driving substrate with the planarization layer.

[0021] Optionally, the light emitting elements of multiple light emitting colors comprise red light emitting elements, green light emitting elements and blue light emitting elements,

[0022] The light emitting material bodies corresponding to the light emitting elements of multiple light emitting colors formed on the seed layer by selective area growth comprises:

[0023] Forming a mask layer on the seed layer;

[0024] Forming a plurality of first light emitting element through holes penetrating the mask layer in the thickness direction on the mask layer, the plurality of first light emitting element through holes respectively corresponding to red light emitting elements and blue light emitting elements, and in the pixel unit, the first light emitting element through hole corresponding to the red light emitting element and the first light emitting element through hole corresponding to the blue light emitting element are spaced apart;

[0025] Forming a blue light emitting material body in the first light emitting element through hole by selective area growth;

[0026] Forming a blue light device protection layer;

[0027] Forming a second light emitting element through hole penetrating the blue light emitting protection layer and the mask layer, wherein in the pixel unit, the second light emitting element through hole is located between the two first light emitting element through holes;

[0028] Forming a green light emitting material body in the second light emitting element through hole by selective area growth;

[0029] Removing the blue light device protection layer;

[0030] The forming of the light emitting element layer further comprises:

[0031] Peeling off the initial substrate;

[0032] Forming a light-transmitting dielectric material layer on the peeling surface of the layer comprising the light emitting material bodies;

[0033] Forming a plurality of spacing through holes on the light-transmitting dielectric material layer, the plurality of spacing through holes respectively corresponding to the plurality of light emitting material bodies one by one;

[0034] Forming a metal light-blocking layer on the sidewall of each of the plurality of spacing through holes respectively;

[0035] Forming a quantum dot material in the spacing through hole corresponding to the red light emitting element;

[0036] forming a light-transmitting electrode material layer.

[0037] Optionally, the forming a light-emitting element layer further comprises:

[0038] forming a light-filtering hole in the light-transmitting electrode material layer and corresponding to the red light-emitting element;

[0039] forming a red light-filtering block in the light-filtering hole.

[0040] As a third aspect of the present application, a display panel is provided, the display panel comprising a display substrate, wherein the display substrate is the display substrate provided by the first aspect of the present application.

[0041] In manufacturing the display substrate, the light-emitting material body of each light-emitting element can be formed by selective area growth (SAG). The light-emitting material bodies of the light-emitting elements capable of emitting light of different colors are located in the same layer, which can reduce the overall thickness of the display substrate and achieve the thinning of the display panel comprising the display substrate.

[0042] The features and advantages of the present application will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. The preferred embodiments or means of the present application will be described in detail with reference to the accompanying drawings, but the present application is not limited thereto. In addition, the features, elements and components appearing in each of the following text and drawings are multiple, and different symbols or numbers are marked for the convenience of representation, but all represent the same or similar structures or functions of the components. BRIEF DESCRIPTION OF DRAWINGS

[0043] The present application will be further described below with reference to the accompanying drawings:

[0044] Figure 1 Structure diagram of an embodiment of a pixel unit in the display substrate provided by the present application;

[0045] FIG. 2(a) to FIG. 2(n) are schematic diagrams of an embodiment of a manufacturing method of the display substrate provided by the present application.

[0046] EXPLANATION OF REFERENCE NUMERALS

[0047] 100: driving substrate 200: light-emitting element layer

[0048] 210: light-emitting material body of blue light-emitting element

[0049] 220: light-emitting material body of green light-emitting element

[0050] 230: light-emitting material body of red light-emitting element

[0051] 240: light-transmitting dielectric material layer 250: metal light-blocking layer

[0052] 260: light-transmitting electrode material layer 270: quantum dot material

[0053] 280: red filter block DETAILED DESCRIPTION

[0054] Embodiments of the present application are described in detail below with reference to examples illustrated in the accompanying drawings, in which the same or similar components have the same or similar designations throughout the various figures and like reference numerals denote like elements or elements having the same or similar functions. Based on the embodiments, the present application is intended to be explained, but cannot be understood as a limitation of the present application.

[0055] In the present specification, "one embodiment" or "an embodiment" or "example" or "exemplary" means that a specific feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0056] It should be noted that in the present application, "inner side" refers to the side close to the initial substrate, and "outer side" refers to the side away from the initial substrate.

[0057] As a first aspect of the present application, a display substrate is provided, such as Figure 1 As shown, the display substrate includes a driving substrate 100 and a light-emitting element layer 200, the driving substrate 100 is disposed at the backlight side of the display substrate, and the driving substrate 100 is used to drive each light-emitting element of the light-emitting element layer 200 to emit light, wherein the light-emitting element includes a light-emitting material body, the light-emitting material bodies of a plurality of light-emitting elements are disposed in the same layer, and gradually increase in cross-sectional area in the direction away from the driving substrate 100 (the upward direction in the figure). Figure 1 It should be noted that in the manufacture of the display substrate, the light-emitting material body of each light-emitting element can be formed by selective area growth (SAG). The light-emitting material bodies of a plurality of light-emitting elements capable of emitting light of different colors are located in the same layer, which can reduce the overall thickness of the display substrate and achieve thinning of the display panel including the display substrate.

[0058] It should be noted that in addition to including a light-emitting element body, the light-emitting element also includes two electrodes respectively disposed on both sides of the light-emitting element body, and by supplying power to the two electrodes, the light-emitting element can emit light of a corresponding color.

[0059] It should be noted that in addition to including a light-emitting element body, the light-emitting element also includes two electrodes respectively disposed on both sides of the light-emitting element body, and by supplying power to the two electrodes, the light-emitting element can emit light of a corresponding color.

[0060] As described above, the cross-sectional area of the light emitting material body gradually increases in the direction away from the driving substrate 100, and when the light emitting material body is formed in the SAG mode, the growth window is large, which can make the uniformity of the light emitting material body better, and is beneficial to realize the mass production of the display substrate.

[0061] In Figure 1 the embodiment shown in the figure, the light emitting element layer includes a blue light emitting element for emitting blue light, a green light emitting element for emitting green light, and a red light emitting element for emitting red light. Correspondingly, the blue light emitting element includes the light emitting material body 210, the green light emitting element includes the light emitting material body 220, and the red light emitting element includes the light emitting material body 230. As can be seen from Figure 1 the figure, the longitudinal cross sections of the light emitting material body 210, the light emitting material body 220, and the light emitting material body 230 are all inverted triangular shapes.

[0062] In the present application, each light emitting element in the light emitting element layer can be a Micro LED. In order to facilitate manufacturing, multiple light emitting elements can share a transparent electrode.

[0063] In order to obtain good display effect and avoid crosstalk between light emitted by adjacent light emitting elements, optionally, a light blocking piece can be arranged between two adjacent light emitting elements.

[0064] As an optional embodiment, the light emitting element layer further includes a light-transmitting electrode sub-layer, which is arranged on the side of the light emitting material body away from the driving substrate 100. As Figure 1 shown in the figure, the light-transmitting electrode sub-layer includes a light-transmitting dielectric material layer 240 and a light-transmitting electrode material layer 260, multiple spaced apertures corresponding to the multiple light emitting material bodies are formed on the light-transmitting dielectric material layer 240, a metal light blocking layer 250 is formed on the side wall of the spaced apertures, the light-transmitting electrode material layer 260 covers the light-transmitting dielectric material layer 240, and the light-transmitting electrode material layer 260 is filled in the spaced apertures.

[0065] By arranging the metal light blocking layer 250, the light emitted by the light emitting element corresponding to the metal light blocking layer 250 can only be emitted through the spaced apertures, so as to prevent light crosstalk between adjacent light emitting elements and improve the display effect.

[0066] In the present application, the thickness of the metal light blocking layer 250 is not specially limited, as long as it can achieve the light blocking function and will not affect the aperture ratio of the display substrate. In the present application, the material of the metal light blocking layer 250 is also not specially limited. For example, the metal light blocking layer 250 can be formed by using any one of aluminum, copper, and titanium.

[0067] In this invention, the structure of the light-transmitting dielectric material layer 240 is not specifically limited. For example, the light-transmitting dielectric material layer 240 can be made using either silicon oxide or silicon nitride.

[0068] In this invention, the material of the light-transmitting electrode material layer 260 is not particularly limited, as long as it is conductive and light-transmitting. For example, the light-transmitting electrode material layer 260 can be made of ITO material.

[0069] To improve the color gamut of the display panel including the display substrate, optionally, at least one light-emitting element is a quantum dot light-emitting element. That is, quantum dot material 270 may be disposed in at least one of the spaced-through holes. Figure 1 In the embodiment shown, the red light-emitting element is a quantum dot light-emitting diode.

[0070] It's easy to understand that the light-emitting element layer is divided into multiple pixel units. Figure 1 In the illustrated embodiment, the multiple light-emitting elements within the pixel unit are blue, green, and red light-emitting elements, respectively. As described above, quantum dot material 270 is disposed in the spacer aperture corresponding to the red light-emitting element. Correspondingly, the material of the light-emitting material body 230 of the red light-emitting element is the same as the material of the light-emitting material body 210 of the blue light-emitting element. By providing quantum dot material 270, blue light can be converted into red light.

[0071] To enhance the effect of red light, alternatively, such as Figure 1 As shown, the display substrate may further include a color filter (CF) material layer disposed on the side of the light-transmitting electrode sublayer facing away from the driving substrate 100. The color filter material layer includes a plurality of red filter blocks 280, the positions of the plurality of red filter blocks 280 corresponding to the red light-emitting element, and the red filter blocks 280 embedded in the light-transmitting electrode material layer 260.

[0072] As described above, the light-transmitting electrode material layer 260 is disposed on the light-emitting side of the display substrate. Correspondingly, the light-emitting element layer also includes a metal electrode layer, which includes multiple metal electrodes, each of which corresponds to a multiple light-emitting element.

[0073] In the present application, in order to facilitate the bonding of the driving substrate 100 and the light emitting element layer 200, optionally, the light emitting element layer 200 can further comprise a planarization layer arranged between the layer where the light emitting material bodies are located and the driving substrate 100, and the planarization layer comprises a planarization material layer 292 and a metal electrode layer, the planarization material layer 292 is formed with a plurality of electrode holes, and the plurality of electrode holes correspond to the plurality of light emitting material bodies one by one. The metal electrode layer comprises a plurality of metal electrodes 291, and the plurality of metal electrodes 291 are arranged in the plurality of electrode holes respectively.

[0074] In the present application, the material of the metal electrode 291 is not specially limited, and as an optional embodiment, the metal electrode 291 can be formed by using at least one of copper, aluminum and titanium.

[0075] As a second aspect of the present application, a manufacturing method of a display substrate is provided, and the manufacturing method comprises:

[0076] In step S110, an initial substrate is provided, and the initial substrate comprises a seed layer;

[0077] In step S120, a combined structure comprising a light emitting element layer and a driving substrate for driving each light emitting element of the light emitting element layer to emit light is formed.

[0078] As shown in FIG. 2, forming the light emitting element layer comprises:

[0079] In step S121, a plurality of light emitting material bodies corresponding to a plurality of light emitting elements are formed on the seed layer by selective area growth, and the plurality of light emitting material bodies are located in the same layer, and the cross section of the light emitting material body gradually increases in the direction away from the driving substrate.

[0080] The manufacturing method provided by the present application can be used to manufacture the display substrate provided by the first aspect of the present application. As described above, the light emitting material bodies of the light emitting elements are formed by selective area growth, which can make the light emitting material bodies of a plurality of light emitting elements emitting different colors of light located in the same layer, reduce the overall thickness of the display substrate, and realize the thinning of the display panel comprising the display substrate.

[0081] The cross-sectional area of the light emitting material body gradually increases in the direction away from the driving substrate, and when the light emitting material body is formed by using SAG, the growth window is larger, which can make the uniformity of the light emitting material body better, and is beneficial to realize the mass production of the display substrate.

[0082] In the present application, the specific material of the seed layer is also not specially limited. For example, the seed layer can be made of AlGaN material.

[0083] In the present application, the specific structure of the initial substrate is not specially limited. For example, the initial substrate can include a silicon substrate and a seed layer formed on the silicon substrate.

[0084] As an optional embodiment, the forming the light emitting element layer further includes:

[0085] In step S122, a planarization material layer is formed;

[0086] In step S123, a plurality of electrode vias are formed on the planarization material layer, and the plurality of electrode vias correspond one-to-one to the plurality of light emitting material bodies;

[0087] In step S124, metal electrodes are formed in the plurality of electrode vias to obtain a planarization layer, and the plurality of metal electrodes correspond one-to-one to the plurality of light emitting material bodies, respectively.

[0088] In the present disclosure, the plurality of metal electrodes can be collectively referred to as a metal electrode layer, and the combination structure of the planarization material layer and the metal electrode layer is collectively referred to as a planarization layer. The planarization layer of the light emitting element layer is bonded with the driving substrate.

[0089] Correspondingly, step S120 further includes:

[0090] In step S125, the driving substrate is bonded with the planarization layer.

[0091] As described above, the light emitting elements of multiple light emitting colors include red light emitting elements, green light emitting elements, and blue light emitting elements.

[0092] Correspondingly, the forming the light emitting material bodies corresponding to the light emitting elements of multiple light emitting colors on the seed layer by selective area growth includes:

[0093] In step S121a, a mask layer is formed on the seed layer;

[0094] In step S121b, a plurality of first light emitting element vias are formed on the mask layer, the plurality of first light emitting element vias penetrating through the mask layer in the thickness direction, and the plurality of first light emitting element vias correspond to the red light emitting elements and the blue light emitting elements, respectively, and in the pixel unit, the first light emitting element via corresponding to the red light emitting element and the first light emitting element via corresponding to the blue light emitting element are spaced apart;

[0095] In step S121c, blue light emitting material bodies are formed in the first light emitting element vias by selective area growth;

[0096] In step S121d, a blue light device protection layer is formed;

[0097] In step S121e, a second light emitting element through hole is formed through the blue light emitting protection layer and the mask layer, wherein in the pixel unit, the second light emitting element through hole is located between the two first light emitting element through holes;

[0098] In step S121f, a green light emitting material body is formed in the second light emitting element through hole by means of selective area growth;

[0099] In step S121g, the blue light device protection layer is removed.

[0100] The forming of the light emitting element layer further comprises:

[0101] In step S126, the initial substrate is peeled off;

[0102] In step S127, a light-transmitting dielectric material layer is formed on the peeling surface of the layer comprising the light emitting material body;

[0103] In step S128, a plurality of interval through holes are formed on the light-transmitting dielectric material layer, and the plurality of interval through holes correspond to the plurality of light emitting material bodies one by one respectively;

[0104] In step S129, a metal light blocking layer is formed on the sidewall of each interval through hole respectively;

[0105] In step S1210, a quantum dot material is formed in the interval through hole corresponding to the red light emitting element;

[0106] In step S1211, a light-transmitting electrode material layer is formed.

[0107] In the above embodiment, the red light emitting element is a quantum dot light emitting diode, and the blue light can be converted into red light by means of the quantum dot material.

[0108] As described above, the metal light blocking layer arranged on the sidewall of the interval through hole can prevent light emitted by two adjacent light emitting elements from causing crosstalk, thereby improving the display effect of the display panel comprising the display substrate.

[0109] In the present application, the specific material of the mask layer is not specially limited. As an optional embodiment, the mask layer can be formed by means of photoresist, and the first light emitting element through hole can be formed by means of a photoetching patterning process.

[0110] In the present application, the material of the blue light device protection layer is also not specially limited. For example, the blue light device protection layer can be made of silicon oxide and / or silicon nitride. By arranging the blue light device protection layer, the already formed light emitting material body can be prevented from being damaged when the light emitting material body corresponding to the green light emitting element is formed by means of SAG, thereby improving the product yield.

[0111] To improve the light emitting effect of the red light emitting element, optionally, the forming the light emitting element layer can further comprise:

[0112] forming a light filtering hole on the light transmitting electrode material layer corresponding to the red light emitting element;

[0113] forming a red light filtering block in the light filtering hole.

[0114] The following will explain one embodiment of the manufacturing method of the display substrate provided by the present application in combination with FIG. 2(a) to FIG. 2(m), and Figure 1 The following will explain one embodiment of the manufacturing method of the display substrate provided by the present application in combination with FIG. 2(a) to FIG. 2(m), and

[0115] As shown in FIG. 2(a), a substrate is provided, which comprises a seed layer 310 and a silicon substrate 320 (corresponding to step S110);

[0116] As shown in FIG. 2(b), a mask layer 330 is formed on the seed layer 310 (corresponding to step 121a);

[0117] As shown in FIG. 2(c), a plurality of first light emitting element through holes 331 are formed on the mask layer 330, which penetrate the mask layer 330 along the thickness direction, and the plurality of first light emitting element through holes 331 respectively correspond to red light emitting elements and blue light emitting elements, and in a pixel unit, the first light emitting element through hole 331 corresponding to the red light emitting element and the first light emitting element through hole 331 corresponding to the blue light emitting element are spaced apart (corresponding to step S121b);

[0118] As shown in FIG. 2(d), the blue light emitting material body 210 and the red light emitting material body 230 are formed in the first light emitting element through hole by selective area growth using the same material (corresponding to step S121c);

[0119] As shown in FIG. 2(e), a blue light device protection layer 340 is formed (corresponding to step S121d);

[0120] As shown in FIG. 2(f), a second light emitting element through hole 332 is formed, which penetrates the blue light emitting protection layer 340 and the mask layer 330, and in the pixel unit, the second light emitting element through hole 332 is located between the two first light emitting element through holes (corresponding to step S121e);

[0121] As shown in FIG. 2(g), a green light emitting material body 220 is formed in the second light emitting element through hole by selective area growth (corresponding to step S121f);

[0122] As shown in FIG. 2(h), the blue light device protection layer is removed (corresponding to step S121g);

[0123] As shown in Figure 2(i), a planarization material layer 292 is formed, and a plurality of electrode vias are formed on the planarization material layer, with each of the plurality of electrode vias corresponding to a plurality of light-emitting material bodies; metal electrodes 291 are formed in the plurality of electrode vias, with each of the plurality of metal electrodes corresponding to a plurality of light-emitting material bodies (corresponding to steps S122 to S124).

[0124] As shown in Figure 2(j), the initial substrate is bonded to the planarization layer (corresponding to step S125).

[0125] In step S126, the initial substrate is peeled off;

[0126] As shown in Figure 2(k), a light-transmitting dielectric material layer 240 is formed on the peeling surface of the layer including the light-emitting material body; a plurality of spaced through holes 241 are formed on the light-transmitting dielectric material layer, and the plurality of spaced through holes 241 correspond one-to-one with the plurality of light-emitting material bodies (corresponding to steps S127 to S128).

[0127] As shown in Figure 2(l), a metal light-blocking layer 250 is formed on the sidewalls of the plurality of spaced through holes 241 respectively (corresponding to step S129).

[0128] As shown in Figure 2(m), quantum dot material 270 is formed in the spaced through holes corresponding to the red light-emitting element (corresponding to step S1210).

[0129] As shown in Figure 2(n), a light-transmitting electrode material layer 260 is formed (corresponding to step S1211).

[0130] like Figure 1 As shown, a filter hole is formed on the portion of the light-transmitting electrode material layer corresponding to the red light-emitting element; a red filter block 280 is formed in the filter hole.

[0131] As a third aspect of the present invention, a display panel is provided, the display panel including a display substrate, wherein the display substrate is the display substrate provided in the first aspect of the present invention.

[0132] In this invention, in addition to the display substrate, the display panel may also include an encapsulation substrate, through which the display substrate is encapsulated.

[0133] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of the present invention will be included within the scope of the claims.

Claims

1. A display substrate comprising a drive substrate and a light emitting element layer, the drive substrate being provided on a back light side of the display substrate for driving each light emitting element of the light emitting element layer to emit light, characterized in that, The light-emitting element comprises a light-emitting material body, the light-emitting material bodies of a plurality of the light-emitting elements are arranged in the same layer, and the cross-sectional area of the light-emitting material body gradually increases in the direction away from the driving substrate, the light-emitting element layer further comprises a light-transmitting electrode sublayer arranged on the side of the light-emitting material body away from the driving substrate, the light-transmitting electrode sublayer comprises a light-transmitting dielectric material layer and a light-transmitting electrode material layer, a plurality of spaced apertures corresponding to a plurality of the light-emitting material bodies are formed on the light-transmitting dielectric material layer, a metal light-blocking layer is formed on the sidewall of the spaced aperture, and the light-transmitting electrode material layer covers the light-transmitting dielectric material layer and is filled in the spaced aperture.

2. The display substrate of claim 1, wherein, At least one of the spaced apertures is provided with quantum dot material. 3.The display substrate of claim 2, wherein, The light-emitting element layer is divided into a plurality of pixel units, and the plurality of light-emitting elements in the pixel unit comprise red light-emitting elements, green light-emitting elements and blue light-emitting elements, wherein the quantum dot material is arranged in the aperture corresponding to the red light-emitting element, and the material of the light-emitting material body of the red light-emitting element is the same as that of the light-emitting material body of the blue light-emitting element.

4. The display substrate of claim 3, wherein, The display substrate further comprises a light-filtering material layer arranged on the side of the light-transmitting electrode sublayer away from the driving substrate, and the light-filtering material layer comprises a plurality of red light-filtering blocks, the positions of the plurality of red light-filtering blocks correspond to the red light-emitting elements, and the red light-filtering blocks are embedded in the light-transmitting electrode material layer.

5. The display substrate according to any one of claims 1 to 4, characterized in that, The light-emitting element layer comprises a planarization layer arranged between the layer where the light-emitting material body is located and the driving substrate, the planarization layer comprises a planarization material layer and a metal electrode layer, a plurality of electrode holes are formed on the planarization material layer, the plurality of electrode holes correspond to the plurality of light-emitting material bodies one by one, and the metal electrode layer comprises a plurality of metal electrodes arranged in the plurality of electrode holes respectively. 6.A method for manufacturing a display substrate, comprising: The manufacturing method comprises: providing an initial substrate comprising a seed layer; forming a combination comprising a light-emitting element layer and a driving substrate for driving each light-emitting element in the light-emitting element layer to emit light, wherein forming the light-emitting element layer comprises: forming a plurality of light-emitting material bodies corresponding to a plurality of light-emitting elements on the seed layer by selective area growth, and the plurality of light-emitting material bodies are located in the same layer, wherein the cross-sectional area of the light-emitting material body gradually increases in the direction away from the driving substrate.

7. The method of manufacturing according to claim 6, wherein, The method further comprises: forming a planarization material layer; forming a plurality of electrode apertures on the planarization material layer, the plurality of electrode apertures correspond to the plurality of light-emitting material bodies one by one; forming a metal electrode in the plurality of electrode apertures to obtain a planarization layer, wherein the plurality of metal electrodes correspond to the plurality of light-emitting material bodies one by one respectively; forming a combination comprising a light-emitting element layer and a driving substrate further comprises: bonding the driving substrate and the planarization layer.

8. The production method according to claim 6 or 7, characterized by, The light-emitting elements of a plurality of light-emitting colors comprise red light-emitting elements, green light-emitting elements and blue light-emitting elements, The luminescent material body corresponding to the luminescent elements of multiple luminescent colors formed on the seed layer by selective area growth, comprising: forming a mask layer on the seed layer; forming a plurality of first luminescent element through holes penetrating the mask layer in the thickness direction on the mask layer, the plurality of first luminescent element through holes respectively corresponding to red luminescent elements and blue luminescent elements, and in a pixel unit, the first luminescent element through hole corresponding to the red luminescent element and the first luminescent element through hole corresponding to the blue luminescent element are spaced apart; forming a blue luminescent material body in the first luminescent element through hole by selective area growth; forming a blue light device protection layer; forming a second luminescent element through hole penetrating the blue light luminescent protection layer and the mask layer, wherein in the pixel unit, the second luminescent element through hole is located between the two first luminescent element through holes; forming a green luminescent material body in the second luminescent element through hole by selective area growth; removing the blue light device protection layer; The forming of the luminescent element layer further comprises: stripping the initial substrate; forming a light-transmitting dielectric material layer on the stripping surface of the layer comprising the luminescent material body; forming a plurality of spacing through holes on the light-transmitting dielectric material layer, the plurality of spacing through holes respectively corresponding to the plurality of luminescent material bodies one by one; forming a metal light-blocking layer on the sidewall of each of the plurality of spacing through holes; forming a quantum dot material in the spacing through hole corresponding to the red luminescent element; forming a light-transmitting electrode material layer.

9. The method of manufacturing according to claim 8, wherein, The forming of the luminescent element layer further comprises: forming a light filtering hole on the light-transmitting electrode material layer corresponding to the red luminescent element; forming a red light filtering block in the light filtering hole.

10. A display panel comprising a display substrate, characterized by, The display substrate is the display substrate of any one of claims 1 to 5.

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