A RGB light source structure

Abstract

The present invention discloses an RGB light source structure, belonging to the field of semiconductor lighting technology, the RGB light source structure comprises a packaging bracket, a light-emitting module is arranged inside the packaging bracket, and the front and rear ends of the packaging bracket are provided with a pin structure electrically connected to the light-emitting module; a packaging structure for sealing the light-emitting module is arranged at the center of the top of the packaging bracket; a heat dissipation structure is also arranged inside the packaging bracket, which is used to guide and diffuse heat outward during the operation of the light-emitting module; a negative electrode notch is also arranged on one side of the top rear end of the packaging bracket. The present invention can achieve active heat dissipation effect even without the auxiliary heat dissipation of external auxiliary heat dissipation equipment by designing different heat dissipation structures, and then can autonomously dissipate heat outward during the continuous operation of the RGB light source, reduce the working temperature of its core working area, and effectively prevent the occurrence of overheating.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor lighting, and in particular relates to an RGB light source structure. Background Art

[0002] RGB light source is a technology that realizes multiple color display by combining three basic color light sources: red, green and blue. Millions of colors can be generated by adjusting the brightness of red, green and blue LEDs and using the principle of additive color mixing. In addition, different light colors and brightness can be set through the controller to achieve static color, dynamic gradient or flashing effects, making RGB light sources widely used in display equipment, stage lighting, illumination and other fields.

[0003] RGB light sources will generate a lot of heat when they continue to emit light. Therefore, in most cases, external heat sinks or fans and other cooling devices are required for auxiliary heat dissipation to prevent overheating from affecting the life of the RGB light source. There are many different types of RGB light sources on the market, but most of the current RGB light sources have relatively simple structures and generally do not have a good heat dissipation structure. In actual use, they generally rely on external cooling fans and other devices for auxiliary heat dissipation. However, the use of external cooling devices such as cooling fans is usually only suitable for medium and large LED light-emitting devices. For some small and medium-sized LED light-emitting devices, or when it is inconvenient to install active heat dissipation devices, it is usually impossible to achieve rapid heat dissipation of the light-emitting devices. When a large number of densely installed RGB light sources continue to work for a long time, in the absence of auxiliary heat dissipation devices for active heat dissipation, it is easy to cause overheating inside the RGB light source, which in turn causes the failure of the RGB light source and affects its actual service life. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the above-mentioned prior art and provide an RGB light source structure.

[0005] The technical solution adopted to solve the above technical problems is: an RGB light source structure, including a packaging bracket, a light-emitting module is arranged inside the packaging bracket, and a pin structure electrically connected to the light-emitting module is arranged at the front and rear ends of the packaging bracket;

[0006] A packaging structure for sealing the light-emitting module is provided at the top center of the packaging bracket;

[0007] The packaging bracket is also provided with a heat dissipation structure for guiding and diffusing heat during the operation of the light-emitting module;

[0008] A negative electrode notch is also provided on one side of the rear end of the top of the packaging bracket. By providing the negative electrode notch, the negative electrode pin at the corresponding position can be determined more conveniently and quickly to facilitate accurate welding and prevent wrong welding or erroneous welding.

[0009] Furthermore, the light-emitting module includes a positive and negative functional area located at the bottom center of the packaging bracket, and an isolation dam for isolating the pin structure is provided in the positive and negative functional area. The R light-emitting chip, G light-emitting chip and B light-emitting chip are respectively installed in the positive and negative functional area, and the positive and negative pins of the R light-emitting chip, G light-emitting chip and B light-emitting chip are electrically connected to the corresponding pin structure through gold wires.

[0010] Through the above technical solution, the light-emitting module serves as the main working unit. After the positive and negative power supplies of the pin structure are connected, the R light-emitting chip, the G light-emitting chip and the B light-emitting chip can emit corresponding red light, green light and blue light according to the control program of the external IC chip. According to actual needs, the R light-emitting chip, the G light-emitting chip and the B light-emitting chip can be controlled to work separately, or to emit light in pairs at the same time, thereby forming different colors. When the R light-emitting chip, the G light-emitting chip and the B light-emitting chip emit light at the same time, white light will be formed.

[0011] Furthermore, the pin structure includes a first positive pin, a second positive pin and a third positive pin located at the front end of the packaging bracket and a first negative pin, a second negative pin and a third negative pin located at the rear end of the packaging bracket.

[0012] Through the above technical solution, the positive and negative pins of the pin structure are used to connect the positive and negative poles of the power supply respectively. In actual use, the corresponding positive and negative pins will be welded on the corresponding circuit board and correspond one by one to the positive and negative pins set on the circuit board. After the power is turned on, and under the integrated control of the external IC chip, the corresponding R light-emitting chip, G light-emitting chip and B light-emitting chip can be controlled to emit light independently or in combination, thereby realizing the control and adjustment of the light color.

[0013] Furthermore, the packaging structure includes a lens installed in the middle of the packaging bracket, and the outer side of the lens is filled with packaging colloid.

[0014] Through the above technical solution, the packaging structure is mainly used to seal the light-emitting module. The lens inside can adopt a dome structure or a flat structure according to needs. The packaging colloid filled on the outside can be epoxy resin glue, UV curing glue and organic silicone, etc. Through packaging, the effects of sealing, waterproofing and dustproofing can be achieved.

[0015] Furthermore, a through hole is provided at the bottom of the center of the packaging bracket and runs through the bottom of the packaging bracket in a transverse direction, and side grooves are provided at both sides of the packaging bracket.

[0016] Through the above technical solution, by providing through holes and continuous side grooves, the installation and fixation of the heat dissipation structure can be facilitated, and at the same time, the heat dissipation structure can be closely matched with the packaging bracket to ensure the overall sealing.

[0017] Furthermore, the heat dissipation structure is structure one, which includes a bottom heat conducting plate installed in the through hole, the bottom heat conducting plate is an overall U-shaped structure, and its two ends are respectively located in corresponding side grooves, and an insulating layer is attached to the top center of the bottom heat conducting plate.

[0018] Through the above technical solution, by providing a bottom heat conduction plate and providing an insulating layer between the bottom heat conduction plate and the light-emitting module, on the one hand, the heat generated by the light-emitting module during operation can be directly conducted to the bottom heat conduction plate, and dissipated outwards through the outward-turned structures on both sides, thereby achieving rapid heat conduction and heat dissipation. Even without the auxiliary heat dissipation of external auxiliary heat dissipation equipment, an active heat dissipation effect is achieved, and then the heat can be dissipated outwards autonomously during the continuous operation of the RGB light source, thereby reducing the operating temperature of its core working area, thereby effectively preventing the occurrence of overheating; on the other hand, by providing an insulating layer, the bottom heat conduction plate can be prevented from interfering with the circuit connection of the light-emitting module, thereby ensuring the normal operation of the light-emitting module.

[0019] Furthermore, stepped slots are provided on the peripheral sides of the packaging bracket, positioning protrusions are provided at the top corners of the packaging bracket, a packaging cover plate is buckled on the top of the packaging bracket, a support platform is provided on the inner side of the packaging cover plate, a limiting ring is provided in the middle of the support platform, and a plurality of evenly distributed glue injection grooves are also provided on the support platform.

[0020] Through the above technical scheme, by setting up a mounting structure matching the structure two, it is convenient for the quick installation and fixation of the structure two, and it is also more convenient for production and assembly. After the structure two is installed and fixed on the packaging bracket, the packaging bracket and the packaging cover plate can be tightly connected by snapping, and then the lens can be installed on the support table and located on the inner side of the limit ring, and finally the packaging colloid can be used for overall packaging. By setting the limit ring, the assembly and positioning of the lens can be quickly completed to prevent it from displacement. At the same time, by opening a plurality of evenly distributed glue injection grooves on the support table, when the packaging colloid is filled and hardened, it can form an integral structure with the lens, and at the same time, the connection strength and sealing between the lens and the packaging cover plate are also enhanced.

[0021] Furthermore, the heat dissipation structure is structure two, and structure two includes a central heat conducting plate installed between the packaging bracket and the packaging cover plate, and positioning holes for positioning protrusions to pass through are opened at the corners of the central heat conducting plate, an inner heat conducting ring is fixedly connected to the inner side of the central heat conducting plate, and an outer heat conducting skirt is provided on the peripheral side of the central heat conducting plate, and the outer heat conducting skirt is engaged in the step slot.

[0022] Through the above technical solution, by setting up structure 2 that cooperates with the packaging bracket, in actual use, the heat generated when the light-emitting module is working can be conducted to the middle heat-conducting plate through the inner heat-conducting ring, and then conducted to the outer heat-conducting skirt through the middle heat-conducting plate, and finally dissipated to the outer peripheral side through the outer heat-conducting skirt, thereby achieving an active heat dissipation effect; in addition, the middle heat-conducting plate, the inner heat-conducting ring and the outer heat-conducting skirt are an integrated structure, which not only makes the overall structure simpler, but also facilitates production and assembly.

[0023] Furthermore, a stepped positioning groove is provided on the inner side of the packaging bracket, and a plurality of evenly distributed shallow glue injection grooves are provided around the stepped positioning groove.

[0024] Through the above technical solution, by providing a stepped positioning groove, the heat dissipation structure can be quickly installed and fixed on the inner side of the packaging bracket, the lens can be installed on the inner side of the heat dissipation structure, and finally the packaging colloid is used for the overall packaging process.

[0025] Furthermore, the heat dissipation structure is structure three, which includes a stepped heat-conducting ring installed in the stepped positioning groove, the top of the stepped heat-conducting ring is fixedly connected to a top heat dissipation ring, and the circumferential side of the top heat dissipation ring is provided with a plurality of glue injection holes corresponding to the shallow glue injection grooves.

[0026] Through the above technical scheme, by setting a stepped thermal conductive ring, the whole can be quickly installed on the inner side of the packaging bracket. During operation, the heat generated by the light-emitting module can be directly conducted to the top heat dissipation ring through the stepped thermal conductive ring, and then the heat is diffused outward through the top heat dissipation ring, thereby achieving an active heat dissipation effect; during the packaging process, the lens can be placed in the middle of the inner side of the stepped thermal conductive ring, and then filled and sealed with the packaging colloid; in addition, a plurality of injection holes corresponding to the shallow injection grooves are provided on the circumference of the top heat dissipation ring. When the packaging colloid is used for filling and sealing, the packaging colloid, the lens and the packaging bracket can form an integrated sealing structure, which is not only more solid and stable, but also ensures the sealing effect.

[0027] The beneficial effects of the present invention are as follows: (1) The present invention designs a heat dissipation structure so that the heat generated by the light-emitting module during operation can be directly conducted to the heat dissipation structure and dissipated to the outside by heat conduction, thereby realizing active and rapid heat conduction and heat dissipation; (2) The present invention designs different heat dissipation structures so that even without the auxiliary heat dissipation of external auxiliary heat dissipation equipment, it can also achieve active heat dissipation effect, and then can autonomously dissipate heat to the outside during the continuous operation of the RGB light source, thereby reducing the operating temperature of its core working area, thereby effectively preventing the occurrence of overheating; (3) The present invention uses a simple assembled heat dissipation structure, and its simple structural design is convenient for production and processing, and also convenient for rapid assembly. In actual use, it can actively dissipate heat by heat conduction, thereby ensuring the continuous and stable operation of the light-emitting module. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a three-dimensional structural diagram of the first embodiment of the present invention;

[0029] Figure 2 is a front view of the first embodiment of the present invention;

[0030] Figure 3 yes Figure 2 Middle AA section view;

[0031] Figure 4 is an exploded view of the first embodiment of the present invention;

[0032] Figure 5 is a schematic diagram of the internal structure of the first embodiment of the present invention;

[0033] Figure 6 is a three-dimensional structural diagram of the second embodiment of the present invention;

[0034] Figure 7 is a top view of the second embodiment of the present invention;

[0035] Figure 8 is a bottom view of the second embodiment of the present invention;

[0036] Fig. 9 is a front view of the second embodiment of the present invention;

[0037] Fig.10 yes Fig. 9 Middle BB section view;

[0038] Fig.11 is an exploded view of the second embodiment of the present invention;

[0039] Fig.12 yes Fig.11 A partial enlarged view of the middle A;

[0040] Fig.13is a three-dimensional structural diagram of embodiment 3 of the present invention;

[0041] Fig.14 is a top view of the third embodiment of the present invention;

[0042] Fig.15 is a front view of Embodiment 3 of the present invention;

[0043] Fig.16 yes Fig.15 Middle CC section view;

[0044] Fig.17 It is an exploded view of the third embodiment of the present invention.

[0045] Figure numerals: 1. Package bracket; 111. Through hole; 112. Side groove; 121. Step slot; 122. Positioning protrusion; 123. Package cover; 124. Support platform; 125. Limiting ring; 126. Glue injection groove; 131. Step positioning groove; 132. Shallow glue injection groove; 2. Light-emitting module; 21. Positive and negative functional areas; 22. Isolation dam; 23. R light-emitting chip; 24. G light-emitting chip; 25. B light-emitting chip; 26. Gold wire; 3. Pin structure; 31. First positive electrode pin; 32. Second positive electrode pin pin; 33, third positive pin; 34, first negative pin; 35, second negative pin; 36, third negative pin; 4, packaging structure; 41, lens; 42, packaging colloid; 5, heat dissipation structure; 51, structure one; 511, bottom heat conduction plate; 512, insulation layer; 52, structure two; 521, middle heat conduction plate; 522, positioning hole; 523, inner heat conduction ring; 524, outer heat conduction skirt; 53, structure three; 531, stepped heat conduction ring; 532, top heat dissipation ring; 533, glue injection hole; 6, negative electrode gap. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Embodiment 1

[0047] like Figure 1-Figure 5 As shown, an RGB light source structure of the present embodiment includes a packaging bracket 1, a through hole 111 extending transversely therethrough is provided at the bottom of the center of the packaging bracket 1, and side grooves 112 are provided on both sides of the packaging bracket 1. By providing the through hole 111 and the continuous side grooves 112, the installation and fixation of the heat dissipation structure 5 can be facilitated, and the heat dissipation structure 5 can also be closely matched with the packaging bracket 1 to ensure the overall sealing.

[0048] Regarding the light emitting module 2, refer to Figure 4-Figure 5The light-emitting module 2 includes a positive and negative functional area 21 located at the center bottom of the packaging bracket 1, and an isolation dam 22 for isolating the pin structure 3 is provided in the positive and negative functional area 21. An R light-emitting chip 23, a G light-emitting chip 24 and a B light-emitting chip 25 are respectively installed in the positive and negative functional area 21. The positive and negative pins of the R light-emitting chip 23, the G light-emitting chip 24 and the B light-emitting chip 25 are electrically connected to the corresponding pin structure 3 through a gold wire 26. The light-emitting module 2 serves as a main working unit. After the positive and negative power supplies of the pin structure 3 are turned on, the R light-emitting chip 23, the G light-emitting chip 24 and the B light-emitting chip 25 can emit corresponding red light, green light and blue light according to the control program of the external IC chip. According to actual needs, the R light-emitting chip 23, the G light-emitting chip 24 and the B light-emitting chip 25 can be controlled to work alone, or to emit light in pairs at the same time, thereby forming different colors (based on the principle of additive mixing of three primary colors, the formation of specific colors will not be described in detail here). When the R light-emitting chip 23, the G light-emitting chip 24 and the B light-emitting chip 25 emit light at the same time, a white light will be formed.

[0049] For pin structure 3, refer to Figure 1-Figure 5 The positive and negative pins of the pin structure 3 are respectively used to connect the positive and negative poles of the power supply. The front and rear ends of the packaging bracket 1 are provided with a pin structure 3 electrically connected to the light-emitting module 2. The pin structure 3 includes a first positive pin 31, a second positive pin 32 and a third positive pin 33 located at the front end of the packaging bracket 1, and a first negative pin 34, a second negative pin 35 and a third negative pin 36 located at the rear end of the packaging bracket 1. In actual use, the corresponding positive and negative pins will be welded on the corresponding circuit board and correspond one by one to the positive and negative pins set on the circuit board. After the power is turned on, and under the integrated control of the external IC chip, the corresponding R light-emitting chip 23, G light-emitting chip 24 and B light-emitting chip 25 can be controlled to emit light independently or in combination, thereby realizing the control and adjustment of the light color.

[0050] For package structure 4, refer to Figure 1-Figure 4 The packaging structure 4 includes a lens 41 installed in the middle of the packaging bracket 1, and the outer side of the lens 41 is filled with a packaging colloid 42. The packaging structure 4 is mainly used to seal the light-emitting module 2. The lens 41 inside it can adopt a dome structure or a plane structure according to needs, and the packaging colloid 42 filled on the outer side can be epoxy resin glue, UV curing glue, and organic silicone, etc. Through packaging, the effects of sealing, waterproofing, and dustproofing can be achieved.

[0051] In this embodiment, a heat dissipation structure 5 is further provided in the packaging bracket 1 to guide and diffuse heat outward during the operation of the light emitting module 2 .

[0052] The present embodiment provides a configuration of the heat dissipation structure 5, specifically structure 1 51, which includes a bottom heat conducting plate 511 installed in the through hole 111, and the bottom heat conducting plate 511 is a U-shaped structure as a whole, and its two ends are respectively located in the corresponding side grooves 112, and an insulating layer 512 is attached to the top center of the bottom heat conducting plate 511. Specifically, the bottom heat conducting plate 511 can be made of metal copper or aluminum. By setting the bottom heat conducting plate 511 and setting the insulating layer 512 between the bottom heat conducting plate 511 and the light emitting module 2, on the one hand, the heat generated by the light emitting module 2 when working can be It can be directly conducted to the bottom heat conduction plate 511 and dissipated outwards through the outward-turned structures on both sides, thereby realizing rapid heat conduction and heat dissipation. Even without the auxiliary heat dissipation of external auxiliary heat dissipation equipment, an active heat dissipation effect is achieved, and then the heat can be dissipated outwards autonomously during the continuous operation of the RGB light source, thereby reducing the operating temperature of its core working area, thereby effectively preventing the occurrence of overheating. On the other hand, by providing an insulating layer 512, it can also prevent the bottom heat conduction plate 511 from interfering with the circuit connection of the light-emitting module 2, thereby ensuring the normal operation of the light-emitting module 2.

[0053] Furthermore, in this embodiment, a negative electrode notch 6 is provided on one side of the top rear end of the packaging bracket 1. By providing the negative electrode notch 6, the negative electrode pin at the corresponding position can be determined more conveniently and quickly to facilitate accurate welding and prevent wrong welding or erroneous welding. Embodiment 2

[0054] like Figure 6-Figure 12As shown, the difference between this embodiment and the first embodiment is that a stepped groove 121 is provided on the peripheral side of the packaging bracket 1, and positioning protrusions 122 are provided at the top corners of the packaging bracket 1. A packaging cover plate 123 is buckled on the top of the packaging bracket 1, and a groove corresponding to the positioning protrusion 122 is provided at the bottom corner of the packaging cover plate 123 (not shown in the figure), which can be tightly buckled with the packaging bracket 1 during assembly to ensure sealing; a support platform 124 is provided on the inner side of the packaging cover plate 123, and a limiting ring 125 is provided in the middle of the support platform 124. A plurality of evenly distributed glue injection grooves 126 are also provided on the support platform 124. By providing an installation structure matching the structure 52, it is convenient for the structure 52 to be quickly installed and fixed, and at the same time It is also more convenient for production and assembly. After the structure 2 52 is installed and fixed on the packaging bracket 1, the packaging bracket 1 can be tightly connected with the packaging cover plate 123 by snapping, and then the lens 41 can be installed on the support platform 124 and located on the inner side of the limiting ring 125. Finally, the packaging colloid 42 is used for overall packaging. By setting the limiting ring 125, the assembly and positioning of the lens 41 can be quickly completed to prevent it from being displaced. At the same time, by opening a plurality of evenly distributed glue injection grooves 126 on the support platform 124, when the packaging colloid 42 is filled and hardened, it can form an integral structure with the lens 41, and at the same time, the connection strength and sealing between the lens 41 and the packaging cover plate 123 are also enhanced.

[0055] The present embodiment further provides another configuration of the heat dissipation structure 5, specifically, structure 2 52, which includes a middle heat conducting plate 521 installed between the packaging bracket 1 and the packaging cover plate 123, and the corners of the middle heat conducting plate 521 are provided with positioning holes 522 for the positioning protrusions 122 to pass through, and the inner side of the middle heat conducting plate 521 is fixedly connected with an inner heat conducting ring 523, and the peripheral side of the middle heat conducting plate 521 is provided with an outer heat conducting skirt 524. Specifically, the inner heat conducting ring 523 and the middle heat conducting plate 52 1 and the outer heat-conducting skirt 524 can be integrally formed by metal copper or aluminum, the outer heat-conducting skirt 524 is engaged in the stepped slot 121, and by setting the structure 52 that matches the packaging bracket 1, in actual use, the heat generated by the light-emitting module 2 when working can be conducted to the middle heat-conducting plate 521 through the inner heat-conducting ring 523, and then conducted to the outer heat-conducting skirt 524 through the middle heat-conducting plate 521, and finally the heat is dissipated to the outer peripheral side through the outer heat-conducting skirt 524, thereby achieving an active heat dissipation effect.

[0056] Furthermore, in this embodiment, the middle heat conducting plate 521, the inner heat conducting ring 523 and the outer heat conducting skirt 524 are an integrated structure, which not only makes the overall structure simpler, but also facilitates production and assembly. Embodiment 3

[0057] like Figure 13-Figure 17As shown, the difference between this embodiment and the first embodiment is that a stepped positioning groove 131 is provided on the inner side of the packaging bracket 1, and a plurality of evenly distributed shallow glue injection grooves 132 are provided on the surrounding side of the stepped positioning groove 131. By providing the stepped positioning groove 131, the heat dissipation structure 5 can be quickly installed and fixed on the inner side of the packaging bracket 1, and the lens 41 can be installed on the inner side of the heat dissipation structure 5, and finally the packaging colloid 42 can be used for overall packaging.

[0058] The present embodiment further provides another configuration of the heat dissipation structure 5, specifically structure three 53, which includes a stepped heat conductive ring 531 installed in the stepped positioning groove 131, and a top heat dissipation ring 532 is fixedly connected to the top of the stepped heat conductive ring 531, and a plurality of glue injection holes 533 corresponding to the shallow glue injection groove 132 are provided on the circumference of the top heat dissipation ring 532. Specifically, the stepped heat conductive ring 531 and the top heat dissipation ring 532 can be integrally formed by metal copper or aluminum. By providing the stepped heat conductive ring 531, the stepped heat conductive ring 531 can be quickly installed on the inner side of the packaging bracket 1 as a whole. During operation, the heat generated by the light-emitting module 2 during operation can be directly conducted to the top heat dissipation ring 532 through the stepped heat conductive ring 531, and then the heat is diffused outward through the top heat dissipation ring 532, thereby achieving an active heat dissipation effect.

[0059] Furthermore, in the present embodiment, during the packaging process, the lens 41 can be placed in the middle of the inner side of the stepped heat conductive ring 531, and then filled and sealed with the packaging colloid 42; in addition, a plurality of injection holes 533 corresponding to the shallow injection grooves 132 are provided on the circumference of the top heat dissipation ring 532. When the packaging colloid 42 is used for filling and sealing, the packaging colloid 42, the lens 41 and the packaging bracket 1 can form an integrated sealing structure, which is not only more solid and stable, but also ensures the sealing effect.

[0060] The working principle of this embodiment is as follows. When in use, the positive and negative pins corresponding to the pin structure 3 can be welded to the corresponding circuit board by welding. During the welding process, it is necessary to make them correspond one-to-one with the positive and negative pins set on the circuit board. After the power is turned on, under the integrated control of the external IC chip, the corresponding R light-emitting chip 23, G light-emitting chip 24 and B light-emitting chip 25 can be controlled to emit light independently or in combination, thereby realizing the control and adjustment of the light color;

[0061] A heat dissipation structure 5 is also provided in the packaging bracket 1. During the continuous operation of the RGB light source, the heat dissipation structure 5 can use its own structure to guide and diffuse heat outwards. Even without the auxiliary heat dissipation of external auxiliary heat dissipation equipment, an active heat dissipation effect can be achieved. Therefore, the heat can be dissipated outwards autonomously during the continuous operation of the RGB light source, thereby reducing the operating temperature of its core working area, thereby avoiding overheating and ensuring the continuous and stable operation of the light-emitting module 2.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. An RGB light source structure, comprising a packaging bracket (1), characterized in that: A light-emitting module (2) is arranged inside the packaging bracket (1), and a pin structure (3) electrically connected to the light-emitting module (2) is arranged at the front and rear ends of the packaging bracket (1); A packaging structure (4) for sealing the light-emitting module (2) is provided at the top centre of the packaging support (1); The packaging bracket (1) is also provided with a heat dissipation structure (5) for guiding and diffusing heat during the operation of the light-emitting module (2); The packaging bracket (1) is provided with a stepped slot (121) on the circumference thereof, the top corners of the packaging bracket (1) are provided with positioning protrusions (122), a packaging cover plate (123) is buckled on the top of the packaging bracket (1), a support platform (124) is provided on the inner side of the packaging cover plate (123), a limiting ring (125) is provided in the middle of the support platform (124), and a plurality of evenly distributed glue injection grooves (126) are also provided on the support platform (124); The heat dissipation structure (5) is structure 2 (52), and the structure 2 (52) comprises a middle heat conduction plate (521) installed between the packaging bracket (1) and the packaging cover plate (123), positioning holes (522) for the positioning protrusions (122) to pass through are provided at the corners of the middle heat conduction plate (521), an inner heat conduction ring (523) is fixedly connected to the inner side of the middle heat conduction plate (521), and an outer heat conduction skirt (524) is provided on the peripheral side of the middle heat conduction plate (521), and the outer heat conduction skirt (524) is engaged in the stepped slot (121); A negative electrode notch (6) is also provided on one side of the top rear end of the packaging bracket (1).

2. The RGB light source structure according to claim 1, characterized in that: The light-emitting module (2) comprises a positive and negative functional area (21) located at the center bottom of the packaging bracket (1), an isolation dam (22) for isolating the pin structure (3) is provided in the positive and negative functional area (21), an R light-emitting chip (23), a G light-emitting chip (24) and a B light-emitting chip (25) are respectively installed in the positive and negative functional area (21), and the positive and negative pins of the R light-emitting chip (23), the G light-emitting chip (24) and the B light-emitting chip (25) are electrically connected to the corresponding pin structure (3) through a gold wire (26).

3. The RGB light source structure according to claim 1, characterized in that: The pin structure (3) comprises a first positive pin (31), a second positive pin (32) and a third positive pin (33) located at the front end of the packaging support (1), and a first negative pin (34), a second negative pin (35) and a third negative pin (36) located at the rear end of the packaging support (1).

4. The RGB light source structure according to claim 1, characterized in that: The packaging structure (4) comprises a lens (41) mounted in the middle of the packaging bracket (1), and the outer side of the lens (41) is filled with packaging colloid (42).

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