Systems and methods for multi-functional structural elements

Abstract

Systems and methods for a multifunctional structural element of an inverter. An inverter includes: a housing including a first surface and a second surface opposite the first surface; the power module comprises a first surface and a second surface opposite to the first surface, and the first surface of the power module is in contact with the first surface of the shell; a heat sink including a first surface and a second surface opposite to the first surface, where the first surface of the heat sink is coupled to the second surface of the power module; the multifunctional structural element comprises a first surface and a second surface, and the first surface of the multifunctional structural element is in contact with the second surface of the heat sink; and a printed circuit board coupled to the second surface of the multifunctional structural element; wherein the housing and the heat sink define a cooling circuit.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate generally to inverter systems, and more particularly to systems and methods for multi-function inverter components. Background Art

[0002] The inverter system may include a power module, an inverter housing, and a printed circuit board ("printed circuitboard, PCB"). Thermal load management of the inverter system may be necessary to improve the performance and reliability of the system. A cooling loop may be used to transfer heat from the power module in order to cool the power module. Separately, thermal vias or passive cooling through the inverter housing may be used to cool the PCB. Improper cooling of the PCB or the power module may result in improper operation of the inverter system.

[0003] The present disclosure is directed to overcoming one or more of these challenges described above. Summary of the invention

[0004] In some aspects, the technology described herein relates to an inverter, comprising: a housing comprising a first surface and a second surface opposite to the first surface; a power module comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is connected to the second surface of the power module; a multifunctional structural element comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the multifunctional structural element contacts the second surface of the heat sink; and a printed circuit board connected to the second surface of the multifunctional structural element; wherein the housing and the heat sink define a cooling circuit, the cooling circuit comprising a first cooling channel and a second cooling channel, the first cooling channel is defined by a space in the housing, and the second cooling channel is defined by an inner wall of the heat sink.

[0005] In some aspects, the technology described herein relates to an inverter in which a multifunctional structural element is coupled to a heat sink via a thermal interface material.

[0006] In some aspects, the technology described herein relates to an inverter in which a multifunctional structural element is coupled to a heat sink via a hermetic seal.

[0007] In some aspects, the technology described herein relates to an inverter wherein the multifunctional structural element is a metal.

[0008] In some aspects, the technology described herein relates to inverters in which the multifunctional structural elements do not directly contact the cooling circuit.

[0009] In some aspects, the technology described herein relates to an inverter wherein the heat sink is a die-cast heat sink or a sheet metal heat sink.

[0010] In some aspects, the technology described herein relates to an inverter, wherein the multifunctional structural element includes a first plane, the first plane being a recess in a first surface of the multifunctional structural element, the recess being configured to receive a heat sink.

[0011] In some aspects, the technology described herein relates to an inverter wherein an air gap exists between a printed circuit board and an outer cover of the housing.

[0012] In some aspects, the technology described herein relates to an inverter, wherein the multifunctional structural element includes a fixing point capable of receiving a screw configured to fix the printed circuit board and the multifunctional structural element to the housing.

[0013] In some aspects, the technology described herein relates to an inverter wherein the multifunctional structural element has a geometric cross-section that is larger than a power module.

[0014] In some aspects, the technology described herein relates to an inverter in which a multifunctional structural element is configured to completely cover a printed circuit board to shield electromagnetic fields projected from a power module.

[0015] In some aspects, the technology described herein relates to an inverter, wherein the multifunctional structural element includes a second plane protruding from a second surface of the multifunctional structural element and contacting a printed circuit board, wherein the second plane is configured to receive heat from the printed circuit board.

[0016] In some aspects, the technology described herein relates to an inverter, the inverter comprising: a housing, the housing comprising a first surface and a second surface opposite to the first surface; a power module, the power module comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink, the heat sink comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is connected to the second surface of the power module; a multifunctional structural element, the multifunctional structural element comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the multifunctional structural element contacts an outer wall of the heat sink, wherein the multifunctional structural element has a geometric cross-section larger than the power module; and a printed circuit board, the printed circuit board is connected to the second surface of the multifunctional structural element, wherein the multifunctional structural element is configured to completely cover the printed circuit board to shield an electromagnetic field projected from the power module; wherein the housing and the heat sink define a cooling circuit, the cooling circuit comprising a first cooling channel and a second cooling channel, the first cooling channel is defined by a space in the housing, and the second cooling channel is defined by an inner wall of the heat sink.

[0017] In some aspects, the technology described herein relates to an inverter in which a multifunctional structural element is coupled to a heat sink via a thermal interface material.

[0018] In some aspects, the technology described herein relates to an inverter in which a multifunctional structural element is coupled to a heat sink via a hermetic seal.

[0019] In some aspects, the technology described herein relates to an inverter wherein the multifunctional structural element is a metal.

[0020] In some aspects, the technology described herein relates to inverters in which the multifunctional structural elements do not directly contact the cooling circuit.

[0021] In some aspects, the technology described herein relates to an inverter, wherein the multifunctional structural element includes a first plane, the first plane being a recess in a first surface of the multifunctional structural element, the recess being configured to receive a heat sink.

[0022] In some aspects, the technology described herein relates to an inverter, wherein the multifunctional structural element includes a second plane protruding from a second surface of the multifunctional structural element and contacting a printed circuit board, wherein the second plane is configured to receive heat from the printed circuit board.

[0023] In some aspects, the technology described herein relates to a multifunctional structural element for an inverter, the multifunctional structural element comprising: a first plane having a first surface and a second surface opposite to the first surface, the multifunctional structural element also comprising a second plane and a third plane, the second plane being a rectangular recess within the first surface of the first plane, the second plane being configured to receive heat and transfer the heat to a heat sink, the third plane being a protrusion from the second surface of the first plane, the third plane being configured to contact a printed circuit board and configured to transfer heat from the printed circuit board to the first plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various exemplary embodiments and, together with the description, serve to explain the principles of the disclosed embodiments.

[0025] Figure 1 An exemplary system infrastructure for a vehicle including a combination inverter and a converter including an inverter packaging system is shown according to one or more embodiments.

[0026] Figure 2A An exemplary inverter package including a multifunctional inverter structural element according to one or more embodiments is shown.

[0027] Figure 2B Exemplary power modules and multi-function inverter structural elements are shown according to one or more embodiments.

[0028] Figure 3 An exemplary inverter package including a multifunctional inverter structure connected to a heat sink via a thermal interface material is shown in accordance with one or more embodiments.

[0029] Figure 4A An exemplary inverter package including a multifunctional inverter structural element connected to a metal plate heat sink by welding is shown in accordance with one or more embodiments.

[0030] Figure 4B An exemplary inverter package including a multifunctional inverter structural element connected to a die-cast heat sink by seals and screws is shown in accordance with one or more embodiments.

[0031] Figure 4C An exemplary inverter package including a multifunctional inverter structural element connected to a metal plate heat sink via a thermal interface material is shown in accordance with one or more embodiments.

[0032] Figure 5 Exemplary multi-function inverter structural elements in a housing are shown according to one or more embodiments. DETAILED DESCRIPTION

[0033] The foregoing general description and the following detailed description are exemplary and illustrative only and are not limitations on the claimed features. As used herein, the terms "comprises," "having," "including," or other variations thereof are intended to cover non-exclusive inclusions such that a process, method, article, or device including a series of elements includes not only those elements, but may also include other elements that are not explicitly listed or inherent to such processes, methods, articles, or devices. In this disclosure, unless otherwise stated, relative terms such as "about," "substantially," and "approximately" are used to indicate a possible variation of ±10% of the value being described. In this disclosure, unless otherwise stated, any numerical value may include a possible variation of ±10% of the value being described.

[0034] The terms used below may be interpreted in their broadest reasonable manner, even if they are used in conjunction with the detailed description of certain specific examples of the present disclosure. Indeed, certain terms may even be emphasized below; however, any term intended to be interpreted in any restricted manner will be clearly and specifically defined as such in this detailed description section. For example, in the context of the present disclosure, a switching device may be described as a switch or a device, but may refer to any device used to control current in a circuit. For example, a switch may be, for example, a metal-oxide-semiconductor field-effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated-gate bipolar transistor (IGBT), or a relay or any combination thereof, but is not limited thereto.

[0035] Various embodiments of the present disclosure relate generally to inverter systems, and more particularly to systems and methods for multi-function inverter components.

[0036] An inverter, such as one used to drive an electric motor in an electric vehicle, is responsible for converting high voltage direct current (HVDC) into alternating current (AC) to drive the motor. The inverter may include a housing, a power module, a printed circuit board (PCB), and a cooling circuit. The power module may include one or more silicon carbide ("SiC") based power switches that have a relatively high power density and efficiency required for battery capacity range and performance. The power module may include circuits and components configured to convert DC current from an electric vehicle battery into AC current that can be used in an electric motor that drives a propulsion system. The housing of the inverter may structurally connect the components of the inverter together. The PCB may include a control and gate driver board. The control and gate driver board may also include active components, such as a power supply, an active discharge, and a gate driver. The cooling circuit of the inverter may transfer waste heat (eg, heat generated during operation) from the system to a coolant associated with a fluid circuit and transfer the fluid to a radiator, heat exchanger, or other engine component, as described herein.

[0037] The inverter system may have a high ambient temperature during operation. Cooling the inverter system may help improve performance and reliability. Some inverter systems utilize conventional thermal management methods to cool the active components of the PCB. These methods may include cooling the PCB by thermal vias in the copper plane connected to the PCB or by passive cooling of the inverter's housing. Cooling the PCB by thermal vias may not provide significant cooling and may require oversizing of the PCB assembly. Passive cooling of the PCB by the inverter housing may increase the complexity and cost of assembling the inverter housing assembly (e.g., inverter cover). Some inverter cooling systems may include separate cooling elements for various components of the PCB. Some inverter systems may include a power module with double-sided cooling performed by two coolant channel covers. The dual coolant channels may not provide secondary benefits. Some inverter systems may not have active cooling for PCB assemblies.

[0038] Some inverter systems may mount the PCB to the inverter housing using screws. Screw mounts may cause structural inverter integrity issues. Some inverter systems may include PCB fixing points that are directly connected to the inverter housing.

[0039] Some inverter systems may include EMC shields to protect against noise coupling from the AC switch side of the power module and the PCB.

[0040] One or more embodiments of the systems described herein may provide thermal management of power modules with multiple cooling elements, thermal management of active components of control and gate driver boards, and thermal management of internal temperatures of inverters.

[0041] One or more embodiments may provide an inverter system including a flexible mounting location of a PCB. The flexible mounting location of the PCB can meet different mechanical shock and vibration system requirements.

[0042] One or more embodiments may provide inverter structural elements capable of electromagnetically shielding PCB components, such as control and gate driver boards, within an inverter system.

[0043] One or more embodiments may reduce the complexity and cost of assembling an inverter housing assembly (eg, inverter cover).

[0044] One or more embodiments may include a multi-functional structural element ("MFSE") within an inverter system. As will be described in more detail below, the MFSE may be configured to dissipate heat from active components (e.g., power supplies, active discharges, gate drivers) from control and gate driver boards of a PCB. Such active cooling of the PCB may result in improved reliability and allow for a more cost-effective size of the PCB assembly. The MFSE may be configured to enable heat transfer from a first side in contact with the PCB and a second side in contact with a heat sink including a cooling channel. The MFSE may be configured to reduce internal inverter temperature through heat transfer capabilities. The MFSE may be used in conjunction with a double-sided cooled power switch to enable effective cooling of the inverter assembly while simplifying the assembly process. For example, one of the coolant channels used to cool the power switch may be used in conjunction with the MFSE to cool the PCB.

[0045] The MFSE may be used as a structural element within an inverter system and configured to be fixed to a PCB. The fixing may allow the fixing points to be placed in optimal locations to reduce mechanical PCB stress and minimize scrappage. For example, the fixing points may be located at the four corners of the MFSE and additional locations, such as a raised surface adjacent to the MFSE. Some fixing points may allow the MFSE to be fixed to the housing and the PCB. Other fixing points may only fix the MFSE to the PCB. The MFSE may be a separately mountable element that may be mounted to a coolant channel by a thermal interface material (TIM), by a hematic seal, or by a seal and a screw.

[0046] The MFSE can be configured to provide EMC shielding from the power module of the inverter to the control and gate driver boards of the PCB.

[0047] Figure 1 An exemplary system infrastructure for a vehicle including a combined inverter and converter including an inverter packaging system according to one or more embodiments is shown. In the context of the present disclosure, the combined inverter and converter may be referred to as an inverter. Figure 1As shown, the electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include a component that receives power from an external source and outputs power to charge the battery 195 of the electric vehicle 100. The inverter 110 may include an inverter package 200. For example, the inverter 110 may convert DC power from the battery 195 in the electric vehicle 100 into AC power to drive the motor 190 of the electric vehicle 100, but the embodiment is not limited thereto. The inverter 110 may be bidirectional and may convert DC power into AC power, or convert AC power into DC power, such as during regenerative braking. The inverter 110 may be a three-phase inverter, a single-phase inverter, or a multi-phase inverter.

[0048] Figure 2A An exemplary inverter package 200 including a multifunctional inverter structural element ("MFSE") 202 according to one or more embodiments is shown. The inverter package 200 may include an inverter housing 204, an MFSE 202, a printed circuit board ("PCB") 206, and a power module 208 (e.g., one or more power modules, e.g., three power modules, e.g., six power modules). The inverter package 200 may include a first cover 210, a second cover 212, a cooling loop 214, and an open space 216. The inverter housing may be configured to fix the power module 208, the MFSE 202, the cooling loop 214, and the PCB 206. The first cover 210 may be located at a first top end of the inverter package 200, and the second cover 212 may be located at a second bottom end opposite to the first cover 210. An open space 216 (e.g., a gap) may be located between the second cover 212 and the PCB 206 within the inverter housing 204. Open space 216 may include components mounted to PCB 206 .

[0049] The cooling circuit 214 may include an inlet 218, an outlet 220, a first side cooling channel 222 and a second side cooling channel 224. The cooling circuit 214 may transfer waste heat (e.g., heat generated during operation) from the inverter package 200 to the coolant flowing through the cooling circuit 214, and transfer the fluid to a radiator, a heat exchanger or other engine components. The flow of the coolant may be indicated by an arrow in the cooling circuit 214. The inlet 218 may be located at a third end of the inverter package 200 perpendicular to the first end and the second end. The outlet 220 may be located at a fourth end of the inverter package 200, which is also perpendicular to the first end and the second end and is located on the opposite side of the third end. The inlet 218 may be configured to receive the coolant in the cooling circuit 214, and the outlet 220 may discharge the coolant from the cooling circuit 214. The first side cooling channel 222 may be defined by a hollow opening in the inverter housing 204 and a first cover 210 of the inverter housing 204. Thus, a wall defining the hollow opening in the inverter housing 204 and a portion 250 of the surface of the first cover 210 may define a first side cooling channel 222. The connection of the portion 250 and the section of the inverter housing 204 defining the first side cooling channel 222 may be an airtight seal. The airtight seal may be a friction stir welding seal, an ultrasonic welding seal, a brazing seal, or a gasket seal.

[0050] The second side cooling channel 224 can be defined by a heat sink 228 having a hollow interior. The hollow interior of the heat sink 228 can be configured to allow coolant to flow from a first end of the heat sink 228 through the YC axis to a second end of the heat sink 228. The heat sink 228 can have a first surface 252 and a second surface 254 opposite to the first surface 252. The first surface 252 of the heat sink 228 can contact the power module 208. The first surface 252 of the heat sink 228 can be coupled to the power module 208 via a thermal interface material. The heat sink 228 can be a metal plate heat sink 428A (such as Figure 4A and Figure 4C as shown) or die-cast heat sink 428B (as Figure 4B shown).

[0051] Portions of the inverter housing 204 may transfer heat to the coolant within the first side cooling channel 222. The power module 208 along with portions of the inverter housing 204 may transfer heat to the coolant within the second side cooling channel 224 through the heat sink 228.

[0052] A second surface of the heat sink 228 may be connected to the first surface of the power module 208 and to the MFSE 202 via a hermetic seal.

[0053] The MFSE 202 may include a first surface 239 and a second surface 240, the first surface 239 being opposite to the second surface 240. The first plane 544 of the first surface 239 of the MFSE 202 (at Figure 5 ) can contact and receive the heat sink 228. The first plane 544 can be a planar section that is a notch in the first surface 239. The notch can be along the ZC axis. The connection between the heat sink 228 and the first plane 544 can include an airtight seal. The first plane 544 can be generally rectangular and recessed to match and receive the heat sink 228. The first plane 544 (as shown in Figure 5 The first side cooling channel 222 and the second side cooling channel 224 can receive heat from the rest of the MFSE 202 and transfer the heat to the heat sink 228 and then to the second side cooling channel 224. The MFSE 202 combined with the first side cooling channel 222 and the second side cooling channel 224 can enable efficient cooling of the inverter components.

[0054] The first surface 239 of the MFSE 202 may contact a portion of the inverter housing 204 at a fixing point 236 (e.g., one or more fixing points, e.g., two fixing points, e.g., at least three fixing points). The fixing point 236 may extend through the first surface 239 of the MFSE 202 to the second surface 240. The fixing point 236 may include a threaded opening configured to allow a screw to connect the MFSE 202 and the PCB 206 to the inverter housing 204. The fixing point 236 may reduce mechanical PCB 206 stress. For example, the fixing point 236 may increase support for the PCB 206, thereby reducing mechanical stress. The MFSE 202 may be made of a more rigid material than the PCB 206. The fixing point 236 that couples the PCB 206 to the MFSE 202 may reduce bending of the PCB 206 during use of the inverter package 200.

[0055] The second surface 240 of the MFSE 202 may contact and connect to the first surface of the PCB 206 at fixing points 236. The fixing points 236 may be located at optimal locations to reduce mechanical PCB 206 stress and minimize scrap during use of the inverter package 200. For example, there may be a fixing point 236 at each of the four corners of the MFSE 202. The fixing points 236 may allow screws to extend from the PCB 206 through the MFSE 202 and into the housing 204 ( Figure 5 Additional fixing point 546 (as shown) Figure 5The second surface 240 of the MFSE 202 may also contact the PCB 206 at a second plane 238 (e.g., one or more second planes, e.g., two second planes). The second plane 238 may protrude from the second surface of the MFSE 202 in the ZC axis. The second plane 238 may extend further in the ZC axis than the first plane 544. The second plane 238 can receive heat from the PCB 206 and transfer the heat to the heat sink 228 through the MFSE 202. For example, this can be achieved by transferring heat from the PCB 206 through the second plane 238 to the first plane 544 (at the ZC axis). Figure 5 ), transmitted to the radiator 228 through the first plane 544 (in the ZC-axis direction), and transmitted to the second side cooling channel 224.

[0056] The open space 216 may be located between a second surface of the PCB 206 and the second cover 212, the second surface of the PCB 206 being opposite to the first surface of the PCB 206. The open space 216 may not include air.

[0057] MFSE 202 may be made of metal such as copper, aluminum, different types of alloys, sheet metal parts, or die-cast parts. MFSE may be configured to provide shielding of PCB 206 to power module 208. For example, the material of MFSE 202 may not allow electromagnetic fields to pass through MFSE 202. Figure 2B Exemplary power modules and multi-function inverter structural elements are shown according to one or more embodiments. Figure 2B The geometric relationship of the power module 208 and the MFSE 202 may be displayed.

[0058] For example, the cross-section of MFSE 202 in the XC, YC plane can be larger than the cross-section of power module 208. The geometric position of MFSE 202 combined with the larger total cross-sectional area can completely cover the ZC-axis electromagnetic projection from power module 208, such as Figure 2B For example, the gate driver board and the control board of PCB 206 may not be exposed to electromagnetic fields from the components of the power module 208.

[0059] Figure 3An exemplary inverter package 300 is shown including a multi-functional inverter structural element (MFSE) 202 connected to a heat sink 228 via a thermal interface material (TIM) 326 according to one or more embodiments. The TIM 326 can be located between the second surface 254 of the heat sink 228 and the MFSE 202. For example, the TIM 326 can include an epoxy, silicone, or other elastomeric product. For example, the TIM 326 can be provided as a dielectric pad, a heat sink, a thermal compound, a thermal gel (e.g., a dispensable gel), a thermal tape, a phase change material, a gap pad, a thermal grease, or an alternative thermal material. An advantage of the inverter package 300 with the TIM 326 is that the MFSE can be a stronger and / or more durable connection. The above in Figure 3 The elements shown in FIG. 1 may be similar in structure and function to those in FIG. Figure 2A The corresponding components shown in .

[0060] Figure 4A An exemplary inverter package 400A is shown that includes a multi-function inverter structural element ("MFSE") 202 connected to a metal plate heat sink 428A by welding according to one or more embodiments. The metal plate heat sink 428A can define a second side cooling channel 224. The metal plate heat sink 428A can be connected to the power module 208 at a first surface, the first surface being positioned closest to the power module 208. A second surface of the metal plate heat sink 428A, positioned closest to the PCB 206, can be received by the MFSE 202. Figure 4A The elements shown in FIG. 1 may be similar in structure and function to those in FIG. Figure 2A The metal plate heat sink 428A may have a Figure 4B The die cast heat sink 428B depicted in FIG. 4 has better performance (e.g., thermal conductivity and / or durability). Figure 4C By utilizing a solder connection between the MFSE 202 and the metal plate heat sink 428A, the inverter package 400A having the metal plate heat sink 428A may have better thermal conductivity than that utilized in FIG.

[0061] Figure 4B An exemplary inverter package 400B is shown, according to one or more embodiments, comprising a multi-function inverter structural element ("MFSE") 202 connected to a die-cast heat sink 428B by seals and screws. The connection between the MFSE 202 and the die-cast heat sink 428B may be located at a fixing point 542 (e.g., Figure 5) (e.g., one or more fixing points 542, e.g., eight fixing points 542). The die-cast heat sink 428B may define a second side cooling channel 224. The die-cast heat sink 428B may be connected to the power module 208 at a first surface, the first surface being positioned closest to the power module 208. This connection may be performed by one or more types of TIM materials (e.g., a soft TIM such as thermal paste or grease, e.g., a hard TIM such as brazing or sintering). Opposite the first surface may be a second surface including an opening. The second surface of the die-cast heat sink 428B on a side positioned closest to the PCB 206 may be received and connected to the MFSE 202. This connection may occur at an edge of the first plane 544 (not shown). The connection may include a seal 432 received within the second surface of the die-cast heat sink 428B. In the inverter package 400B, a portion of the MFSE 202 (e.g., Figure 5 The first plane 544 shown in FIG. 5 may define a portion (eg, a surface) of the second side cooling channel 224. Figure 4B The elements shown in FIG. 1 may be similar in structure and function to those in FIG. Figure 2A The corresponding components shown in .

[0062] Figure 4C An exemplary inverter package 300 including a multi-function inverter structural element ("MFSE") 202 connected to a metal plate heat sink 428A via a thermal interface material ("thermal interface material, TIM") 326 according to one or more embodiments is shown. The metal plate heat sink 428A can be connected to the power module 208 at a first surface through the TIM 326, and the first surface is located closest to the power module 208. The TIM 326 can be a soft TIM such as thermal paste or grease or a hard TIM such as solder or sintering. The second surface of the metal plate heat sink 428A, which is located closest to the PCB 206, can be received by the MFSE 202. Figure 4C The elements shown in FIG. 1 may be similar in structure and function to those in FIG. Figure 2A The corresponding components shown in .

[0063] Figure 5 An exemplary multi-function inverter structural element ("MFSE") 202 is shown in an inverter housing 204 according to one or more embodiments. The MFSE 202 may include a first surface ( Figure 5The MFSE 202 may include a fixing point 542, a fixing point 236, a fixing point 546, a first plane 544, and a second plane 238 (e.g., two second planes). The second side cooling channel 224 may be positioned to connect to the heat sink 228 (not shown) of the MFSE 202 at the first surface (not shown). The connection may be performed using the fixing point 542. The fixing point 542 may include a thread configured to receive a screw to securely fix the heat sink 228 to the MFSE 202. For example, the MFSE 202 may include eight fixing points 542. Two fixing points 542 may be positioned near each side of the first plane 544. The connection of the MFSE 202 and the heat sink 228 may also be performed by an airtight seal between the MFSE 202 and the heat sink 228. The connection of the MFSE 202 and the heat sink 228 may also be performed by a TIM 326 (not shown).

[0064] As described above, the second surface 240 of the MFSE 202 may be configured to receive the PCB 206. The second surface 240 may be secured to the PCB 206 at the securing points 236 and the securing points 546. For example, the MFSE 202 may include a securing point 236 positioned at each corner of the XC-YX plane along the second surface 240 of the MFSE 202. The securing points 236 may include threads configured to receive screws to securely secure the MFSE 202 to the PCB 206 and the inverter housing 204. The MFSE may include a securing point 546 positioned adjacent to each second surface 238. The securing points 546 may include threads configured to receive screws to securely secure the MFSE 202 to the PCB 206.

[0065] The MFSE 202 may also include a first plane 544. The first plane 544 may transfer heat from the MFSE 202 to the heat sink 228.

[0066] The second surface 240 of the MFSE 202 may also contact the PCB 206 at a second plane 238. The second plane 238 may protrude from the second surface of the MFSE 202. For example, the second plane 238 may include two second planes 238. The second plane 238 is capable of receiving heat from the PCB 206 (not shown) and transferring the heat to the heat sink 228 through the MFSE 202. The second plane 238 may be positioned to contact components from the PCB 206 that require additional cooling. For example, this may be performed by transferring heat from the PCB 206 (not shown) through the second plane 238 to the first plane 544, through the first plane 544 (in the ZC axis direction) to the heat sink 228, and to the second side cooling channel 224. In some examples, the coolant does not directly contact the MFSE 202. In other examples (such as Figure 4B ), the coolant may contact MFSE 202. In some examples, the coolant may only contact an inner surface of inlet 218, an inner surface of inverter housing 204, an inner surface of heat sink 228, a portion 250 of first cover 210, and an inner surface of outlet 220.

[0067] Figure 2A An exemplary inverter package 200 cooling circuit 214 according to one or more embodiments is shown. Arrows located within the cooling circuit 214 may indicate coolant flow through the cooling circuit 214. The coolant may enter the cooling circuit through the inlet 218. The coolant may continue to flow through the first side cooling channel 222 and through the second side cooling channel 224, following the flow path of the arrow. The coolant may flow from the inlet 218 through the first side cooling channel 222 and out through the outlet 220 in the YC axis direction. The coolant may also flow substantially perpendicularly to the first side cooling channel 222 on the ZC axis to enter the second side cooling channel 224 after entering through the inlet 218 and entering the first side cooling channel 222. The coolant may then flow through the second side cooling channel 224 along the YC axis, and then flow substantially perpendicularly to the second side cooling channel 224 along the YC axis, and merge with the first side cooling channel 222. As the coolant flows through the cooling loop, heat can flow into the coolant from the inverter housing 204 , the power module 208 , the PCB 206 , and the heat sink 228 (not shown). The heated coolant can then be exhausted from the cooling loop 214 through the outlet 220 .

[0068] One or more embodiments may include a MFSE configured to dissipate heat from active components (e.g., power supply, active discharge, gate driver) from the control and gate driver boards of the PCB. One or more embodiments may include a MFSE to provide structural support within the inverter system and allow for safe connection of the PCB within the inverter system. One or more embodiments may include a MFSE configured to provide electromagnetic shielding of the PCB assembly to the power module.

[0069] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. An inverter, comprising: a housing, the housing comprising a first surface and a second surface opposite to the first surface; a power module, the power module comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module; a multifunctional structural element, the multifunctional structural element comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the multifunctional structural element contacts the second surface of the heat sink; and a printed circuit board coupled to the second surface of the multifunctional structural element; The housing and the radiator define a cooling circuit, the cooling circuit includes a first cooling channel and a second cooling channel, the first cooling channel is defined by a space in the housing, and the second cooling channel is defined by an inner wall of the radiator.

2. The inverter according to claim 1, wherein: The multifunctional structural element is coupled to the heat sink via a thermal interface material.

3. The inverter according to claim 1, wherein: The multifunctional structural element is coupled to the heat sink via a gas-tight seal.

4. The inverter according to claim 1, wherein: The multifunctional structural element is metal.

5. The inverter according to claim 1, wherein: The multifunctional structural element does not directly contact the cooling circuit.

6. The inverter according to claim 1, wherein: The heat sink is a die-cast heat sink or a metal plate heat sink.

7. The inverter according to claim 1, wherein: The multifunctional structural element includes a first planar surface that is a recess in the first surface of the multifunctional structural element, the recess being configured to receive the heat sink.

8. The inverter according to claim 1, wherein: An air gap exists between the printed circuit board and the outer cover of the housing.

9. The inverter according to claim 1, wherein: The multifunctional structural element comprises a fixing point capable of receiving a screw configured to fix the printed circuit board and the multifunctional structural element to the housing.

10. The inverter according to claim 1, wherein: The multifunctional structural element has a geometric cross-section that is larger than that of the power module.

11. The inverter according to claim 10, wherein: The multifunctional structural element is configured to completely cover the printed circuit board to shield the electromagnetic field projected from the power module.

12. The inverter according to claim 1, wherein: The multifunctional structural element includes a second plane protruding from the second surface of the multifunctional structural element and contacting the printed circuit board, wherein the second plane is configured to receive heat from the printed circuit board.

13. An inverter, comprising: a housing, the housing comprising a first surface and a second surface opposite to the first surface; a power module, the power module comprising a first surface and a second surface opposite to the first surface, the first surface of the power module being in contact with the first surface of the housing; a heat sink comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module; a multifunctional structural element, the multifunctional structural element comprising a first surface and a second surface opposite to the first surface, wherein the first surface of the multifunctional structural element contacts an outer wall of the heat sink, wherein the multifunctional structural element has a geometric cross-section larger than that of the power module; and a printed circuit board coupled to the second surface of the multifunctional structural element, wherein the multifunctional structural element is configured to completely cover the printed circuit board to shield an electromagnetic field projected from the power module; The housing and the radiator define a cooling circuit, the cooling circuit includes a first cooling channel and a second cooling channel, the first cooling channel is defined by a space in the housing, and the second cooling channel is defined by an inner wall of the radiator.

14. The inverter according to claim 13, wherein: The multifunctional structural element is coupled to the heat sink via a thermal interface material.

15. The inverter according to claim 13, wherein: The multifunctional structural element is coupled to the heat sink via a gas-tight seal.

16. The inverter according to claim 13, wherein: The multifunctional structural element is metal.

17. The inverter according to claim 13, wherein: The multifunctional structural element does not directly contact the cooling circuit.

18. The inverter according to claim 13, wherein: The multifunctional structural element includes a first planar surface that is a recess in the first surface of the multifunctional structural element, the recess being configured to receive the heat sink.

19. The inverter according to claim 13, wherein: The multifunctional structural element includes a second plane protruding from the second surface of the multifunctional structural element and contacting the printed circuit board, wherein the second plane is configured to receive heat from the printed circuit board.

20. A multifunctional structural element for an inverter, the multifunctional structural element comprising: A first plane, the first plane having a first surface and a second surface opposite to the first surface, the multifunctional structural element further comprising a second plane and a third plane, the second plane being a rectangular recess in the first surface of the first plane, the second plane being configured to receive heat and transfer the heat to a heat sink, the third plane being a protrusion from the second surface of the first plane, the third plane being configured to contact a printed circuit board and being configured to transfer heat from the printed circuit board to the first plane.

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