Printed circuit board assembly and method for producing printed circuit board assembly

Abstract

Provided are a printed circuit board assembly and a method for manufacturing the printed circuit board assembly, the printed circuit board assembly including: a printed circuit board including a plurality of support holes; a metal frame on which the printed circuit board is supported; and a plurality of coupling portions between the metal frame and the printed circuit board to couple the metal frame and the printed circuit board. The metal frame includes: a board portion opposite to the printed circuit board; and a plurality of support members integral with the plate portion, bent and protruded from the plate portion, and extending to the printed circuit board, each of the plurality of support members being inserted into a corresponding one of the plurality of support holes and supporting the printed circuit board.

Description

Technical Field

[0001] Embodiments relate to printed circuit board assemblies and methods for manufacturing printed circuit board assemblies. Background Art

[0002] Printed circuit boards (PCBs) are used to mount electronic components. Summary of the invention

[0003] An embodiment is directed to a printed circuit board assembly, comprising: a printed circuit board having a plurality of support holes; a metal frame supporting the printed circuit board; and a plurality of coupling parts between the metal frame and the printed circuit board to couple the metal frame and the printed circuit board, wherein the metal frame comprises: a plate portion opposite to the printed circuit board; and a plurality of support members integral with the plate portion, bent from the plate portion and extending to the printed circuit board, inserted into the plurality of support holes, and supporting the printed circuit board.

[0004] According to an embodiment, the metal frame may further include a plurality of through holes adjacent to the plurality of supports and penetrating the plate portion.

[0005] According to an embodiment, a planar shape of the plurality of through holes is the same as a side shape of the plurality of support members.

[0006] According to an embodiment, the number of the plurality of through holes is the same as the number of the plurality of support members.

[0007] According to an embodiment, the plurality of support members are separated from the plurality of through holes and are bent from the plate portion to protrude from the plate portion.

[0008] According to an embodiment, the metal frame further includes a plurality of through hinge portions penetrating between the plurality of supports and the plate portion.

[0009] According to an embodiment, the metal frame further includes a plurality of connecting hinge parts bent and connected between each of the plurality of supports and the plate part with each of the plurality of penetrating hinge parts interposed therebetween.

[0010] According to an embodiment, the plurality of through-hinge portions extend linearly.

[0011] According to an embodiment, each of the plurality of support members includes an insertion portion inserted into a corresponding one of the plurality of support holes, and a support portion extending from the plate portion to the insertion portion and supporting the printed circuit board.

[0012] According to an embodiment, the support portion includes a side portion extending obliquely from the plate portion toward the printed circuit board; and an upper portion located between the side portion and the insertion portion and contacting the printed circuit board.

[0013] According to an embodiment, each of the plurality of coupling parts has a different thickness.

[0014] According to an embodiment, each of the plurality of coupling portions has a different area.

[0015] According to an embodiment, each of the plurality of bonding portions includes solder.

[0016] According to an embodiment, the plurality of supports are located closer to the corners of the plate portion than to the centre of the plate portion.

[0017] According to an embodiment, a method for manufacturing a printed circuit board assembly includes: separating a plurality of support members from a plate portion of a metal frame and bending the plurality of support members from the plate portion to protrude from the plate portion; supporting the printed circuit board on the metal frame by inserting the plurality of support members into a plurality of support holes of the printed circuit board; and combining the metal frame and the printed circuit board using a plurality of coupling portions between the metal frame and the printed circuit board.

[0018] According to an embodiment, separating the plurality of supports from the plate portion of the metal frame and bending the plurality of supports from the plate portion to protrude from the plate portion includes forming a plurality of through holes on the metal frame adjacent to the plurality of supports and penetrating the plate portion.

[0019] According to an embodiment, separating multiple supports from the plate portion of the metal frame and bending the multiple supports from the plate portion to protrude from the plate portion are performed by separating the multiple supports from the multiple through holes along multiple through hinge portions penetrating between the multiple supports and the plate portion and bending the multiple supports from the plate portion.

[0020] According to an embodiment, the plurality of through-hinge portions extend linearly.

[0021] According to an embodiment, coupling the metal frame and the printed circuit board using a plurality of coupling portions therebetween is performed by soldering the plurality of coupling portions therebetween.

[0022] According to an embodiment, each of the plurality of coupling parts has a different thickness.

[0023] According to an embodiment, a printed circuit board assembly and a method for manufacturing the printed circuit board assembly are provided, in which a short circuit between a metal frame and a printed circuit board is suppressed by maintaining a constant distance between the metal frame and the printed circuit board even without adding a separate structure between the metal frame and the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Various features will become apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the accompanying drawings, in which:

[0025] Figure 1 is a cross-sectional view illustrating a printed circuit board assembly according to an embodiment;

[0026] Figure 2 is a top plan view illustrating a metal frame of a printed circuit board assembly according to an embodiment;

[0027] Figure 3 A side view illustrating a metal frame of a printed circuit board assembly according to an embodiment;

[0028] Figure 4 For along Figure 2 A cross-sectional view of line IV-IV;

[0029] Figure 5 A flowchart illustrating a method for manufacturing a printed circuit board assembly according to an embodiment;

[0030] Figure 6 and Figure 7 is a plan view of a metal frame for describing a method for manufacturing a printed circuit board assembly according to an embodiment; and

[0031] Figure 8 and Fig. 9 is a cross-sectional view of a printed circuit board assembly, for describing a method for manufacturing a printed circuit board assembly according to an embodiment. DETAILED DESCRIPTION

[0032] Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey exemplary implementations to those skilled in the art.

[0033] In the drawn figures, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that if a layer or element is referred to as being "on" another layer or element, it can be directly on the other layer or element, or there can be intervening layers or elements. Further, it will be understood that if a layer is referred to as being "below" another layer, it can be directly below the other layer, or there can be one or more intervening layers. In addition, it will be understood that if a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there can be one or more intervening layers. Throughout the text, the same reference numerals refer to the same elements.

[0034] The terms used herein are for describing the embodiments only and are not intended to limit the present disclosure. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0035] In addition, unless explicitly described to the contrary, the words "comprises," "including," or "having" and variations thereof are intended to specify the presence of the embodied features, quantities, steps, elements, or combinations thereof, and will be understood to imply the inclusion of the stated elements but not to exclude the possibility of the presence or addition of one or more features, quantities, steps, elements, or combinations thereof.

[0036] In the following, reference will be made to Figure 1 to Figure 4 A printed circuit board assembly according to an embodiment is described.

[0037] In one implementation, the printed circuit board assembly according to the embodiment may be a printed circuit board assembly included in a protection circuit module of a secondary battery, but is not limited thereto, and may be a printed circuit board assembly including a printed circuit board and a metal frame included in various known electronic devices.

[0038] Figure 1 FIG. 1 is a cross-sectional view illustrating a printed circuit board assembly according to an embodiment.

[0039] refer to Figure 1 , a printed circuit board assembly 1000 according to an embodiment may include a printed circuit board 100 , a metal frame 200 , and a plurality of coupling portions 300 .

[0040] The printed circuit board 100 may include a plurality of support holes 110 located at the outside and a plurality of chips 120 mounted on the printed circuit board 100 .

[0041] In a plan view, the plurality of support holes 110 may be located at the corners of the printed circuit board 100, but is not limited thereto. The plurality of support holes 110 may penetrate the printed circuit board 100. The plurality of support members 220 of the metal frame 200 may be inserted into the plurality of support holes 110. By inserting the plurality of support members 220 into the plurality of support holes 110, the printed circuit board 100 may be supported by the metal frame 200 while maintaining a constant distance from the metal frame 200. The plurality of support holes 110 may have various planar shapes corresponding to the shapes of the plurality of support members 220. In one embodiment, the plurality of support holes 110 may have various planar shapes, such as polygons (including triangles, quadrilaterals, pentagons, and hexagons) as well as circles, ellipses, and irregular shapes.

[0042] The plurality of chips 120 may be mounted on the printed circuit board 100. The plurality of chips 120 may include various known electronic chips included in various known protection circuit modules of secondary batteries, but is not limited thereto, and may include electronic chips included in various known electronic devices.

[0043] The metal frame 200 may be coupled to the printed circuit board 100 using a plurality of coupling portions 300 between the metal frame 200 and the printed circuit board 100. The metal frame 200 supports the printed circuit board 100. The metal frame 200 may have an area corresponding to the area of ​​the printed circuit board 100, but is not limited thereto. The metal frame 200 may have an area and a structure corresponding to an area inside the housing of the secondary battery where a printed circuit board assembly included in a protective circuit module of the secondary battery is installed. In some embodiments, the metal frame 200 may have an area and a structure corresponding to an area of ​​various known electronic devices.

[0044] Figure 2 FIG. 1 is a top plan view illustrating a metal frame of a printed circuit board assembly according to an embodiment. Figure 3 FIG. 1 is a side view illustrating a metal frame of a printed circuit board assembly according to an embodiment. Figure 4 For along Figure 2 Cross-sectional view along line IV-IV.

[0045] refer to Figure 2 to Figure 4 , the metal frame 200 includes a plate portion 210 , a plurality of supports 220 , a plurality of through holes 230 , a plurality of penetrating hinge portions 240 , and a plurality of connecting hinge portions 250 .

[0046] The board portion 210 may be opposite or face-to-face with the printed circuit board 100 .

[0047] The plate portion 210 may include a metal containing nickel (Ni), but is not limited thereto. In one embodiment, the plate portion 210 may include various known metals, such as aluminum (Al) and stainless steel. The plate portion 210 may have a plate shape extending in a first direction X and a second direction Y intersecting the first direction X, but is not limited thereto. The plate portion 210 may be opposite or face to face with the printed circuit board 100 in a third direction Z intersecting the first direction X and the second direction Y. The plate portion 210 may be integrated with a plurality of support members 220.

[0048] The plurality of support members 220 integrated with the plate portion 210 may be bent from the plate portion 210 and extended to the printed circuit board 100, and inserted into the plurality of support holes 110 of the printed circuit board 100 to support the printed circuit board 100. The plurality of support members 220 support the printed circuit board 100 so that the printed circuit board 100 is supported on the metal frame 200 while maintaining a certain distance from the metal frame 200.

[0049] As described, the plurality of support members 220 may be bent and extended from the board portion 210 in the third direction Z, and inserted into the plurality of support holes 110 of the printed circuit board 100. The plurality of support members 220 may extend in the first direction X and the second direction Y inside the plurality of through holes 230 of the board portion 210, be separated from the plurality of through holes 230, be bent from the board portion 210 in the third direction Z, and may protrude and extend from the board portion 210 in the third direction Z. The plurality of support members 220 may be positioned closer to the corners of the board portion 210 in the first direction X and the second direction Y than to the center of the board portion 210 in the first direction X and the second direction Y, and may be positioned at the corners of the board portion 210. Each of the plurality of support members 220 may include an insertion portion 221 and a support portion 222.

[0050] The insertion portion 221 may be inserted into each of the plurality of support holes 110 of the printed circuit board 100. The insertion portion 221 may protrude from the support portion 222 in the third direction Z. The planar shape of the insertion portion 221 may have the same shape as that of the support hole 110, but is not limited thereto.

[0051] The support portion 222 may extend from the plate portion 210 to the insertion portion 221. The support portion 222 may be located between the plate portion 210 and the insertion portion 221, and may contact the rear surface of the printed circuit board 100 in the third direction Z to support the printed circuit board 100.

[0052] The support portion 222 may include a side portion 222 a and an upper portion 222 b .

[0053] The side portion 222a may extend obliquely from the plate portion 210 toward the printed circuit board 100. The side portion 222a may extend obliquely from the front surface of the plate portion 210 based on the third direction Z.

[0054] The upper portion 222 b may be located between the side portion 222 a and the insertion portion 221 , and may contact the rear surface of the printed circuit board 100 in the third direction Z.

[0055] The side portion 222 a of the support portion 222 obliquely extends from the upper portion 222 b contacting the rear surface of the printed circuit board 100 to the front surface of the plate portion 210 , so that the printed circuit board 100 is firmly supported by the support 220 .

[0056] The plurality of through holes 230 may be positioned adjacent to the plurality of support members 220. The plurality of through holes 230 may penetrate the plate portion 210 in the third direction Z. The planar shape of the plurality of through holes 230 may be the same as the side shape of the plurality of support members 220. The number of the plurality of through holes 230 may be the same as the number of the plurality of support members 220. The plurality of support members 220 may be separated from the plurality of through holes 230, and the plurality of support members 220 may be bent and may extend from the plate portion 210 in the third direction Z, so that the planar shape of the plurality of through holes 230 is the same as the side shape of the plurality of support members 220, and the number of the plurality of through holes 230 is the same as the number of the plurality of support members 220.

[0057] A plurality of through hinge portions 240 are provided at Figure 4 and will be described later Figure 6 and Figure 7 The plurality of through-hinge portions 240 may penetrate between the plurality of supports 220 and the plate portion 210 in the third direction Z. The plurality of through-hinge portions 240 may extend linearly in the first direction X. Each of the plurality of through-hinge portions 240 may extend linearly to correspond to a local area of ​​the plurality of supports 220 in the first direction X.

[0058] A plurality of connecting hinge parts 250 are provided at Figure 4 and will be described later Figure 6 and Figure 7 . A plurality of connecting hinge portions 250 may be connected between the plurality of supports 220 and the plate portion 210. Each of the plurality of connecting hinge portions 250 may connect a corresponding one of the plurality of supports 220 and the plate portion 210 in a curved manner with each of the plurality of through hinge portions 240 being between the plurality of connecting hinge portions 250.

[0059] The plurality of supports 220 may be separated from the plurality of through holes 230 by the plurality of connecting hinge portions 250 and the plurality of penetrating hinge portions 240 so as to be easily bent and extended from the plate portion 210 in the third direction Z. The metal frame 200 and the printed circuit board 100 may be coupled by the plurality of coupling portions 300 .

[0060] refer to Figure 1 , a plurality of bonding portions 300 may be located between the metal frame 200 and the printed circuit board 100. A plurality of bonding portions 300 may be bonded between the metal frame 200 and the printed circuit board 100. Each of the plurality of bonding portions 300 may include solder. Due to the inherent characteristics of the solder formed by the welding process, each of the plurality of bonding portions 300 may have a different thickness. Due to the inherent characteristics of the solder formed by the welding process, each of the plurality of bonding portions 300 may have a different area.

[0061] Thus, the printed circuit board assembly 1000 according to the embodiment may include a metal frame 200, the metal frame 200 includes a plurality of support members 220, the plurality of support members 220 may be integrated with the metal frame 200 and may be bent and extended toward the printed circuit board 100, and may be inserted into a plurality of support holes 110 of the printed circuit board 100 to support the printed circuit board 100. Accordingly, even if a deviation occurs in the thickness and area of ​​each of the plurality of coupling portions 300 coupled between the metal frame 200 and the printed circuit board 100, the printed circuit board 100 may be supported on the metal frame 200 while maintaining a constant distance from the metal frame 200.

[0062] In addition, in the printed circuit board assembly 1000 according to the embodiment, even if the thickness and area of ​​each of the plurality of bonding parts 300 are deviated because the plurality of bonding parts 300 include solder, a short circuit between the metal frame 200 and the printed circuit board 100 can be suppressed by maintaining a constant distance between the metal frame 200 and the printed circuit board 100.

[0063] In one embodiment, according to an example, there is provided a printed circuit board assembly 1000 in which a plurality of support members 220 integrated with a metal frame 200 are bent and extended from the metal frame 200 toward the printed circuit board 100 to support the printed circuit board 100, so that even without adding a separate structure between the metal frame 200 and the printed circuit board 100, a short circuit between the metal frame 200 and the printed circuit board 100 is suppressed by maintaining a constant distance between the metal frame 200 and the printed circuit board 100.

[0064] In the following, reference will be made to Figures 5 to 9 A method for manufacturing a printed circuit board assembly according to an embodiment is described. The printed circuit board assembly according to the above-described embodiment may be manufactured using the method for manufacturing a printed circuit board assembly according to another embodiment, but is not limited thereto.

[0065] Figure 5 The present invention is a flow chart illustrating a method for manufacturing a printed circuit board assembly according to an embodiment. Figure 6 and Figure 7 is a plan view of a metal frame for explaining or describing a method for manufacturing a printed circuit board assembly according to an embodiment.

[0066] refer to Figure 5 to Figure 7 , the plurality of supports 220 may be separated from the plate portion 210 of the metal frame 200 and may be bent from the plate portion 210 so as to protrude from the plate portion 210 ( S100 ).

[0067] refer to Figure 6, a plurality of through holes 230 that may be adjacent to the plurality of support members 220 and may penetrate the plate portion 210 may be formed on the metal frame 200. The plurality of through holes 230 may be formed along the edges of the plurality of support members 220, and the plurality of support members 220 may be integrally formed with the metal frame 200 in the same shape as that of the plurality of through holes 230. A plurality of through hinge portions 240 may be formed to linearly penetrate between the plurality of support members 220 and the plate portion 210 in the first direction X. According to the formation of the plurality of through hinge portions 240, a plurality of connecting hinge portions 250 may be formed to be spaced apart in the first direction X by the through hinge portions 240 therebetween to connect the plate portion 210 and the plurality of support members 220.

[0068] refer to Figure 7 , the plurality of support members 220 may be separated from the plurality of through holes 230 based on the bending line CL, and bend CU from the plate portion 210 and at the plate portion 210 in a third direction Z intersecting the first direction X, and the bending line CL may be in an extending direction of the plurality of through hinge portions 240 penetrating between the plurality of support members 220 and the plate portion 210. That is, the plurality of support members 220 may be separated from the plurality of through holes 230 along the plurality of through hinge portions 240.

[0069] The plurality of support members 220 and the plate portion 210 that are bent CU in the third direction Z may be connected via a plurality of bent or curved connection hinge portions 250 .

[0070] Figure 8 and Fig. 9 is a cross-sectional view of a printed circuit board assembly for explaining and describing a method for manufacturing a printed circuit board assembly according to an embodiment.

[0071] refer to Figure 8 , a plurality of support members 220 may be inserted into a plurality of support holes 110 of the printed circuit board 100 to support the printed circuit board 100 on the metal frame 200 ( S200 ).

[0072] In one embodiment, the printed circuit board 100 may be located on the metal frame 200, and the plurality of support members 220 of the metal frame 200 may be inserted into the plurality of support holes 110 of the printed circuit board 100 to support the printed circuit board 100 on the plurality of support members 220 of the metal frame 200. As a result, the printed circuit board 100 may be supported on the metal frame 200 while maintaining a constant distance from the metal frame 200.

[0073] refer to Fig. 9 , a plurality of coupling parts 300 may be positioned between the metal frame 200 and the printed circuit board 100 to be coupled between the metal frame 200 and the printed circuit board 100 (S300).

[0074] In one embodiment, the metal frame 200 and the printed circuit board 100 may be coupled by welding a plurality of coupling parts 300 between the metal frame 200 and the printed circuit board 100 .

[0075] Due to inherent characteristics of solder formed by the welding process, each of the plurality of bonding portions 300 may have different thicknesses and areas, but regardless of the thicknesses and areas of the plurality of bonding portions 300 , a constant distance is maintained between the printed circuit board 100 and the metal frame 200 by the plurality of support members 220 .

[0076] The printed circuit board included in the protection circuit module of the secondary battery may have the form of a printed circuit board bonded to a metal frame supported inside the housing of the secondary battery. A conventional printed circuit board assembly may include a metal frame, a printed circuit board bonded to the metal frame, and multiple adhesives bonded between the metal frame and the printed circuit board. However, the conventional printed circuit board assembly has a problem in that, depending on the thickness difference of each of the multiple adhesives located between the metal frame and the printed circuit board, the distance between the metal frame and the printed circuit board deviates and changes, and the various problems and disadvantages of the conventional printed circuit board assembly are avoided by the present printed circuit board assembly that can be made and manufactured as described above.

[0077] According to an implementation of the embodiment, in a method for manufacturing a printed circuit board assembly, a plurality of support members 220 integrated with a metal frame 200 may be bent to extend from the metal frame 200 toward a printed circuit board 100 to support the printed circuit board 100, so that even without adding a separate structure between the metal frame 200 and the printed circuit board 100, a short circuit between the metal frame 200 and the printed circuit board 100 may be suppressed by maintaining a constant distance therebetween.

[0078] In one embodiment, a method for manufacturing a printed circuit board assembly is provided, in which a short circuit between the metal frame 200 and the printed circuit board 100 can be suppressed by maintaining a constant distance between the metal frame 200 and the printed circuit board 100 even without adding a separate structure between the metal frame 200 and the printed circuit board 100.

[0079] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and interpreted in a general and descriptive sense only and not for purposes of limitation. In some cases, it will be apparent to one of ordinary skill in the art at the time of filing this application that features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise specifically indicated. Accordingly, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the scope of the invention as set forth in the claims.

Claims

1. A printed circuit board assembly, comprising: a printed circuit board having a plurality of support holes; a metal frame supporting the printed circuit board; as well as A plurality of coupling parts are provided between the metal frame and the printed circuit board to couple the metal frame and the printed circuit board together. The metal frame comprises: a board portion, opposite to the printed circuit board; and A plurality of supports, wherein the plurality of supports: Integrally with the plate portion, The plate portion is bent and extends to the printed circuit board, inserted into the plurality of support holes, and The printed circuit board is supported. 2 . The printed circuit board assembly of claim 1 , wherein the metal frame further comprises a plurality of through holes adjacent to the plurality of support members and penetrating the board portion. 3 . The printed circuit board assembly according to claim 2 , wherein a planar shape of the plurality of through holes is the same as a side shape of the plurality of support members. 4 . The printed circuit board assembly according to claim 2 , wherein the number of the plurality of through holes is the same as the number of the plurality of support members. 5 . The printed circuit board assembly according to claim 2 , wherein the plurality of support members are separated from the plurality of through holes and are bent from the plate portion to protrude from the plate portion. 6 . The printed circuit board assembly of claim 2 , wherein the metal frame further comprises a plurality of through hinge portions penetrating between the plurality of support members and the plate portion.

7. A printed circuit board assembly according to claim 6, wherein the metal frame further includes a plurality of connecting hinge portions, which are bent and connected between each of the plurality of support members and the plate portion with each of the plurality of through-hinge portions interposed therebetween.

8. The printed circuit board assembly of claim 6, wherein the plurality of through-hinge portions extend linearly.

9. The printed circuit board assembly of claim 1, wherein each of the plurality of support members comprises: an inserting portion inserted into a corresponding one of the plurality of supporting holes; as well as A support portion extends from the plate portion to the insertion portion and supports the printed circuit board.

10. The printed circuit board assembly according to claim 9, wherein the support portion comprises: a side portion extending obliquely from the plate portion toward the printed circuit board; as well as An upper portion is located between the side portion and the insertion portion and contacts the printed circuit board.

11. The printed circuit board assembly of claim 1, wherein each of the plurality of coupling portions has a different thickness.

12. The printed circuit board assembly of claim 11, wherein each of the plurality of coupling portions has a different area.

13. The printed circuit board assembly of claim 11, wherein each of the plurality of bonding portions comprises solder.

14. The printed circuit board assembly of claim 1, wherein the plurality of support members are closer to corners of the board portion than to a center of the board portion.

15. A method for manufacturing a printed circuit board assembly, comprising: separating a plurality of support members from a plate portion of a metal frame and bending the plurality of support members from the plate portion to protrude from the plate portion; supporting the printed circuit board on the metal frame by inserting the plurality of support members into the plurality of support holes of the printed circuit board; as well as The metal frame and the printed circuit board are coupled using a plurality of coupling portions therebetween.

16. The method for manufacturing a printed circuit board assembly according to claim 15, wherein said separating the plurality of support members from the plate portion of the metal frame and bending the plurality of support members from the plate portion to protrude from the plate portion comprises: A plurality of through holes are formed on the metal frame adjacent to the plurality of support members and penetrating the plate portion.

17. A method for manufacturing a printed circuit board assembly according to claim 16, wherein the separating of the plurality of support members from the plate portion of the metal frame and the bending of the plurality of support members from the plate portion to protrude from the plate portion are performed by separating the plurality of support members from the plurality of through holes along a plurality of through hinge portions penetrating between the plurality of support members and the plate portion and bending the plurality of support members from the plate portion.

18. The method for manufacturing a printed circuit board assembly according to claim 17, wherein the plurality of through-hinge portions extend linearly.

19. The method for manufacturing a printed circuit board assembly according to claim 15, wherein the combining the metal frame and the printed circuit board using the plurality of combining portions therebetween is performed by welding the plurality of combining portions therebetween.

20. The method for manufacturing a printed circuit board assembly according to claim 19, wherein each of the plurality of bonding portions has a different thickness.

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