Chip mounting mechanism and use method for camera module production

Abstract

The present invention relates to the technical field of camera module production, specifically to a patch mechanism and a method of use for camera module production, comprising a bottom plate, a supporting circular plate is provided directly above the bottom plate, and four supporting rods are symmetrically fixedly connected between the bottom plate and the supporting circular plate, and a ring conveying plate is provided directly above the supporting circular plate, and a plurality of clamping structures are installed on the top surface of the ring conveying plate, and the plurality of clamping structures are distributed in a circular array with the central axis of the ring conveying plate as the reference axis, and the clamping structure includes four slide grooves and a first rotating rod distributed in a cross shape. This patch mechanism and method for camera module production, through the first straight gear rotating under the action of the first arc-shaped rack, further drives the first rotating rod to rotate, drives the displacement plate to pull the pull rope down through the threaded portion, and further pulls the four clamping plates to move synchronously through the pull rope, finally positions and clamps the circuit board, and can automatically complete chip material collection and mounting.

Description

Technical Field

[0001] The present invention relates to the technical field of camera module production, and in particular to a patch mechanism and a use method for camera module production. Background Art

[0002] Camera module chip mounting is an important part of the camera module manufacturing process, which involves accurately mounting chips and other components onto a substrate or circuit board.

[0003] In the production line, chip placement is mostly done manually, but during the manual chip placement process, the substrate or circuit board is prone to deviation. During operation, the known placement machine uses a suction nozzle to suck components, and after the image recognition system identifies them, the suction nozzle goes down to place the components that meet the requirements on the circuit board. Although a clamping mechanism is set in the placement machine, most of them clamp the circuit board by limiting the two sides of the circuit board, and cannot achieve automatic positioning during the clamping process, resulting in performance problems caused by position deviation during the camera module chip placement process.

[0004] In order to solve the above problems, we have made improvements and proposed a patch mechanism and usage method for camera module production. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The camshaft of the embodiment of the present invention is a kind of frame structure, and the camshaft of the embodiment of the present invention is a kind of frame structure, and the camshaft of the embodiment of the present invention is a kind of frame structure, and the camshaft of the embodiment of the present invention is a kind of frame structure, and the camshaft of the embodiment of the present invention is a kind of frame structure.

[0007] The top surface of the supporting circular plate is coaxially fixedly connected with an inner ring and an outer ring, and the first spur gear is located between the inner ring and the outer ring, a first arc-shaped rack is fixedly connected to the outer wall of the inner ring, and a second arc-shaped rack is fixedly connected to the inner wall of the outer ring, and both the first arc-shaped rack and the second arc-shaped rack can be meshed with the first spur gear;

[0008] A concave plate is integrally connected to the side of the bottom plate, a third rotating rod is rotatably connected between opposite sides of the concave plate, a cylindrical cam is coaxially fixedly connected to the upper outer wall of the third rotating rod, an L-shaped mounting rod is slidably connected to the inside of the slideway of the cylindrical cam, a vacuum generator is fixedly connected to the bottom end of the L-shaped mounting rod, and the suction port of the vacuum generator is connected to the patch head.

[0009] As a preferred technical solution of the present invention, the clamping structure also includes four guide channels connected to the interior of the slide groove, and the guide channels are opened inside the annular conveying plate. The guide channels are composed of a vertical channel and a quarter of a circular channel, and the pull rope passes through the guide channels.

[0010] As a preferred technical solution of the present invention, two first limiting telescopic rods are fixedly connected between the displacement plate and the annular conveying plate, and the top surface of the annular conveying plate is provided with a plurality of chip placement grooves distributed in a circular array with the central axis of the annular conveying plate as the reference axis, and each chip placement groove is located between two adjacent clamping structures.

[0011] As a preferred technical solution of the present invention, a second rotating rod is rotatably connected to the center of the top surface of the supporting circular plate, and a transfer disc is coaxially fixedly connected to the top end of the second rotating rod. A plurality of connecting rods are fixedly connected between the outer wall of the transfer disc and the inner wall of the annular conveying plate, and the plurality of connecting rods are distributed in a circular array with the central axis of the annular conveying plate as the reference axis.

[0012] As a preferred technical solution of the present invention, a reduction motor is fixedly installed on the top surface of the base plate, and the output shaft end of the reduction motor extending above the supporting circular plate is coaxially fixedly connected with a residual gear, and a second spur gear is coaxially fixedly connected to the outer wall of the second rotating rod, and the residual gear can engage with the second spur gear.

[0013] As a preferred technical solution of the present invention, the output shaft of the reduction motor is coaxially fixedly connected with a driving pulley, the lower outer wall of the third rotating rod is coaxially fixedly connected with a driven pulley, and the driving pulley and the driven pulley are transmitted through a transmission belt.

[0014] As a preferred technical solution of the present invention, a second limiting telescopic rod is fixedly connected between the outer wall of the L-shaped mounting rod and the inner top surface of the concave plate.

[0015] The method for using the patch mechanism for camera module production includes the following steps:

[0016] S1: Circuit board and chip loading, workers place the circuit board and chip between four clamping plates and in the chip placement slot respectively;

[0017] S2: Circuit board and chip transportation, the reduction motor is started by an external controller, the reduction motor drives the residual gear to rotate, the residual gear drives the second spur gear to rotate intermittently, and the second rotating rod, the transfer disc and the connecting rod drive the annular conveying plate to rotate synchronously and intermittently, and the chip and circuit board are moved to the bottom of the patch head in turn;

[0018] S3: Self-positioning clamping of the circuit board. While the annular conveying plate rotates synchronously and intermittently, the first spur gear rotates under the action of the first arc-shaped rack, further driving the first rotating rod to rotate, driving the pull rope under the displacement plate through the threaded part, and further pulling the four clamping plates to move synchronously through the pull rope, and finally clamping the circuit board;

[0019] S4: Chip picking and placement, the rotation of the reduction motor can drive the third rotating rod to rotate through the driving pulley, the driven pulley and the transmission belt, and the third rotating rod further drives the cylindrical cam to rotate, thereby driving the L-shaped mounting rod to move back and forth downward to complete the chip picking and placement;

[0020] S5: The circuit board is released from clamping. After the chip is picked up and mounted, the annular conveyor plate rotates, and the first spur gear rotates under the action of the second arc-shaped rack, further driving the first rotating rod to rotate, and the displacement plate is driven to move up through the threaded portion. Under the action of the reset spring, the circuit board is finally released from clamping.

[0021] The beneficial effects of the present invention are:

[0022] 1. This patch mechanism and use method for camera module production: When the circuit board moves to the bottom of the patch head, the first straight gear rotates under the action of the first arc-shaped rack, further driving the first rotating rod to rotate, driving the pull rope under the displacement plate through the threaded portion, and further pulling the four clamping plates to move synchronously through the pull rope, finally positioning and clamping the circuit board.

[0023] 2. This patch mechanism and use method for camera module production, when the chip placement slot rotates to just below the patch head, the residual gear will disengage from the second spur gear, that is, the chip placement slot will stop just below the patch head. At this time, the continued rotation of the reduction motor can drive the third rotating rod to rotate through the active pulley, the driven pulley and the transmission belt, and the third rotating rod further drives the cylindrical cam to rotate, thereby driving the L-shaped mounting rod to move downward, and the chip is picked up through the vacuum generator and the patch head. Then, when the circuit board rotates to just below the patch head, the residual gear will disengage from the second spur gear, that is, the circuit board will stop just below the patch head. At this time, the continued rotation of the reduction motor can drive the third rotating rod to rotate through the active pulley, the driven pulley and the transmission belt, and the third rotating rod further drives the cylindrical cam to rotate, thereby driving the L-shaped mounting rod to move downward, and the chip is mounted on the circuit board through the patch head, so that chip picking and mounting can be automatically completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 It is a three-dimensional schematic diagram of a patch mechanism and a method of use for camera module production of the present invention;

[0026] Figure 2 It is a front view schematic diagram of a patch mechanism and a method of use for camera module production of the present invention;

[0027] Figure 3 It is a top view schematic diagram of a patch mechanism and a method of use for camera module production of the present invention;

[0028] Figure 4 The present invention is a patch mechanism and a method of use for camera module production Figure 3 Schematic diagram of the cross-section at AA in the middle;

[0029] Figure 5 It is a schematic diagram of the clamping structure of the patch mechanism and the use method for the production of camera modules of the present invention;

[0030] Figure 6 It is a schematic diagram of the top surface structure of the supporting circular plate of the patch mechanism and the use method for the production of camera modules of the present invention;

[0031] Figure 7 The present invention is a patch mechanism and a method of use for camera module production Figure 4 The enlarged schematic diagram at A in the middle;

[0032] In the figure: 1, bottom plate; 2, supporting circular plate; 3, annular conveying plate; 4, slide groove; 5, first rotating rod; 6, clamping plate; 7, pull rope; 8, displacement plate; 9, first spur gear; 10, second rotating rod; 11, transfer disc; 12, connecting rod; 13, inner ring; 14, outer ring; 15, first arc-shaped rack; 16, second arc-shaped rack; 17, reduction motor; 18, residual gear; 19, second spur gear; 20, concave plate; 21, third rotating rod; 22, cylindrical cam; 23, L-shaped mounting rod; 24, vacuum generator; 25, driving pulley; 26, driven pulley. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0034] Example: Figure 1 , Figure 2 and Figure 3 As shown, the patch mechanism for camera module production includes a base plate 1, a supporting circular plate 2 is provided directly above the base plate 1, four supporting rods are symmetrically fixedly connected between the base plate 1 and the supporting circular plate 2, and an annular conveying plate 3 is provided directly above the supporting circular plate 2.

[0035] The top surface of the annular conveyor plate 3 is provided with a plurality of chip placement grooves distributed in a circular array with the central axis of the annular conveyor plate 3 as the reference axis, and each chip placement groove is located between two adjacent clamping structures. It should be noted that the curvature between adjacent chip placement grooves and the clamping structures is the same.

[0036] A second rotating rod 10 is rotatably connected to the center of the top surface of the supporting circular plate 2, and a transfer disc 11 is coaxially fixedly connected to the top of the second rotating rod 10. A plurality of connecting rods 12 are fixedly connected between the outer wall of the transfer disc 11 and the inner wall of the annular conveying plate 3, and the plurality of connecting rods 12 are distributed in a circular array with the central axis of the annular conveying plate 3 as the reference axis.

[0037] A reduction motor 17 is fixedly installed on the top surface of the base plate 1. The output shaft end of the reduction motor 17 extending to the top of the supporting circular plate 2 is coaxially fixedly connected with a residual gear 18. A second spur gear 19 is coaxially fixedly connected to the outer wall of the second rotating rod 10, and the residual gear 18 can mesh with the second spur gear 19.

[0038] During the circuit board and chip loading process, workers place the circuit board and chip between the four clamping plates 6 and in the chip placement slots respectively;

[0039] like Figure 6As shown, the circuit board and chip conveying is started by starting the reduction motor 17 through an external controller, the reduction motor 17 drives the residual gear 18 to rotate, the residual gear 18 drives the second spur gear 19 to rotate intermittently, and the annular conveying plate 3 is driven to rotate synchronously and intermittently through the second rotating rod 10, the transfer disc 11 and the connecting rod 12. The second spur gear 19 rotates twice. The first rotation of the second spur gear 19 rotates the chip placement slot to the bottom of the patch head, and the second rotation of the second spur gear 19 rotates the circuit board to the bottom of the patch head.

[0040] like Figure 4 , Figure 5 and Figure 7 As shown, a plurality of clamping structures are installed on the top surface of the annular conveying plate 3, and the plurality of clamping structures are distributed in a circular array with the central axis of the annular conveying plate 3 as the reference axis. The clamping structure includes four slide grooves 4 and a first rotating rod 5 distributed in a cross shape, and the slide groove 4 is opened on the top surface of the annular conveying plate 3, and the inside of the slide groove 4 is slidably connected with a clamping plate 6, and the side of the clamping plate 6 is fixedly connected with a pull rope 7, and the other side of the clamping plate 6 is fixedly connected with the inner wall of the slide groove 4. A return spring is fixedly connected, and the first rotating rod 5 is rotatably connected to the bottom surface of the annular conveying plate 3, and a threaded portion is opened on the upper outer wall of the first rotating rod 5, and the threaded portion of the first rotating rod 5 is threadedly connected with a displacement plate 8, and the lower end of the pull rope 7 is fixedly connected to the top surface of the displacement plate 8, and the lower end of the first rotating rod 5 is coaxially fixedly connected with a first spur gear 9.

[0041] like Figure 6 As shown, the top surface of the supporting circular plate 2 is coaxially fixedly connected with an inner ring 13 and an outer ring 14, and the first spur gear 9 is located between the inner ring 13 and the outer ring 14, a first arc-shaped rack 15 is fixedly connected to the outer wall of the inner ring 13, and a second arc-shaped rack 16 is fixedly connected to the inner wall of the outer ring 14, and the first arc-shaped rack 15 and the second arc-shaped rack 16 can both be engaged with the first spur gear 9, and the first spur gear 9 rotates the same number of circles when passing through the first arc-shaped rack 15 and the second arc-shaped rack 16.

[0042] The clamping structure also includes four guide channels connected to the inside of the slide groove 4, and the guide channels are opened inside the annular conveying plate 3. The guide channels are composed of a vertical channel and a quarter of a circular channel, and the pull rope 7 passes through the guide channels.

[0043] Two first position-limiting telescopic rods are fixedly connected between the displacement plate 8 and the annular conveying plate 3 , and the first position-limiting telescopic rods limit the displacement plate 8 to move only up and down.

[0044] Self-positioning clamping process of the circuit board: When the circuit board moves to the bottom of the patch head, the first spur gear 9 rotates under the action of the first arc-shaped rack 15, further driving the first rotating rod 5 to rotate, driving the displacement plate 8 to pull the pull rope 7 down through the threaded portion, and further pulling the four clamping plates 6 to move synchronously through the pull rope 7, and finally clamping the circuit board;

[0045] like Figure 2 and Figure 3 As shown, a concave plate 20 is integrally connected to the side of the base plate 1, a third rotating rod 21 is rotatably connected between the opposite sides of the concave plate 20, a cylindrical cam 22 is coaxially fixedly connected to the upper outer wall of the third rotating rod 21, an L-shaped mounting rod 23 is slidably connected inside the slideway of the cylindrical cam 22, a vacuum generator 24 is fixedly connected to the bottom end of the L-shaped mounting rod 23, and the suction port of the vacuum generator 24 is connected to the patch head.

[0046] The output shaft of the reduction motor 17 is coaxially fixedly connected with a driving pulley 25 , the lower outer wall of the third rotating rod 21 is coaxially fixedly connected with a driven pulley 26 , and the driving pulley 25 and the driven pulley 26 are driven by a transmission belt.

[0047] A second position-limiting telescopic rod is fixedly connected between the outer wall of the L-shaped mounting rod 23 and the inner top surface of the concave plate 20 , and the second position-limiting telescopic rod limits the L-shaped mounting rod 23 to move only up and down.

[0048] Chip picking process: When the chip placement slot rotates to the bottom of the patch head, the residual gear 18 will be disengaged from the second spur gear 19, that is, the chip placement slot will stop under the patch head. At this time, the reduction motor 17 continues to rotate, and the third rotating rod 21 can be driven to rotate through the driving pulley 25, the driven pulley 26 and the transmission belt. The third rotating rod 21 further drives the cylindrical cam 22 to rotate, thereby driving the L-shaped mounting rod 23 to move downward, and the chip is picked up through the vacuum generator 24 and the patch head, and then moves upward to lift the chip;

[0049] Chip mounting process: When the circuit board rotates to the bottom of the mounting head, the residual gear 18 will disengage from the second spur gear 19, that is, the circuit board will stop under the mounting head. At this time, the reduction motor 17 continues to rotate, and the third rotating rod 21 can be driven to rotate through the driving pulley 25, the driven pulley 26 and the transmission belt. The third rotating rod 21 further drives the cylindrical cam 22 to rotate, thereby driving the L-shaped mounting rod 23 to move downward, and the chip is mounted on the circuit board through the mounting head.

[0050] Circuit board unclamping process: After the chip is taken out and mounted, the annular conveyor plate 3 rotates, and the first spur gear 9 rotates under the action of the second arc-shaped rack 16, further driving the first rotating rod 5 to rotate, and driving the displacement plate 8 to move upward through the threaded portion. Under the action of the reset spring, the four clamping plates 6 return to their original positions, and finally the circuit board is unclamped.

[0051] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A patch mechanism for camera module production, comprising a base plate (1), characterized in that: A supporting circular plate (2) is provided directly above the bottom plate (1), and four supporting rods are symmetrically fixedly connected between the bottom plate (1) and the supporting circular plate (2). An annular conveying plate (3) is provided directly above the supporting circular plate (2). A plurality of clamping structures are installed on the top surface of the annular conveying plate (3), and the plurality of clamping structures are distributed in a circular array with the central axis of the annular conveying plate (3) as a reference axis. The clamping structures include four slide grooves (4) distributed in a cross shape and a first rotating rod (5). The slide grooves (4) are provided on the top surface of the annular conveying plate (3), and the inner slide grooves of the slide grooves (4) are provided with a plurality of clamping structures. The first rotating rod (5) is rotatably connected to the bottom surface of the annular conveying plate (3), a pull rope (7) is fixedly connected to the side surface of the clamping plate (6), a return spring is fixedly connected between the other side surface of the clamping plate (6) and the inner wall of the slide groove (4), the first rotating rod (5) is rotatably connected to the bottom surface of the annular conveying plate (3), a threaded portion is provided on the upper outer wall of the first rotating rod (5), and the threaded portion of the first rotating rod (5) is threadedly connected to the displacement plate (8), the lower end of the pull rope (7) is fixedly connected to the top surface of the displacement plate (8), and the lower end of the first rotating rod (5) is coaxially fixedly connected to the first spur gear (9); An inner ring (13) and an outer ring (14) are coaxially fixedly connected to the top surface of the supporting circular plate (2), and the first spur gear (9) is located between the inner ring (13) and the outer ring (14), a first arc-shaped rack (15) is fixedly connected to the outer wall of the inner ring (13), and a second arc-shaped rack (16) is fixedly connected to the inner wall of the outer ring (14), and both the first arc-shaped rack (15) and the second arc-shaped rack (16) can mesh with the first spur gear (9); A concave plate (20) is integrally connected to the side surface of the bottom plate (1); a third rotating rod (21) is rotatably connected between opposite sides of the concave plate (20); a cylindrical cam (22) is coaxially fixedly connected to the upper outer wall of the third rotating rod (21); an L-shaped mounting rod (23) is slidably connected to the inside of the slideway of the cylindrical cam (22); a vacuum generator (24) is fixedly connected to the bottom end of the L-shaped mounting rod (23); and an air suction port of the vacuum generator (24) is connected to a patch head; Two first limit telescopic rods are fixedly connected between the displacement plate (8) and the annular conveying plate (3); a top surface of the annular conveying plate (3) is provided with a plurality of chip placement grooves distributed in a circular array with the central axis of the annular conveying plate (3) as a reference axis, and each chip placement groove is located between two adjacent clamping structures; A second rotating rod (10) is rotatably connected to the center of the top surface of the supporting circular plate (2); a transfer disc (11) is coaxially fixedly connected to the top end of the second rotating rod (10); a plurality of connecting rods (12) are fixedly connected between the outer wall of the transfer disc (11) and the inner wall of the annular conveying plate (3); and the plurality of connecting rods (12) are distributed in a circular array with the central axis of the annular conveying plate (3) as a reference axis; A reduction motor (17) is fixedly mounted on the top surface of the bottom plate (1); an output shaft end of the reduction motor (17) extending above the supporting circular plate (2) is coaxially fixedly connected to a residual gear (18); a second spur gear (19) is coaxially fixedly connected to the outer wall of the second rotating rod (10); and the residual gear (18) can mesh with the second spur gear (19); The output shaft of the reduction motor (17) is coaxially fixedly connected to a driving pulley (25), the lower outer wall of the third rotating rod (21) is coaxially fixedly connected to a driven pulley (26), and transmission is performed between the driving pulley (25) and the driven pulley (26) via a transmission belt.

2. The patch mechanism for camera module production according to claim 1, characterized in that: The clamping structure also includes four guide channels connected to the interior of the slide groove (4), and the guide channels are opened inside the annular conveying plate (3). The guide channels are composed of a vertical channel and a quarter of a circular channel, and the pull rope (7) passes through the guide channels.

3. The patch mechanism for camera module production according to claim 1, characterized in that: A second limiting telescopic rod is fixedly connected between the outer wall of the L-shaped mounting rod (23) and the inner top surface of the concave plate (20).

4. A method for using a patch mechanism for camera module production, applied to the patch mechanism for camera module production described in any one of claims 1 to 3, characterized in that: The following steps are involved: S1: Loading of circuit boards and chips, where workers place the circuit boards and chips between four clamping plates (6) and in the chip placement slots respectively; S2: The circuit board and chip are transported by starting the reduction motor (17) through an external controller, the reduction motor (17) drives the residual gear (18) to rotate, the residual gear (18) drives the second spur gear (19) to rotate intermittently, and the annular conveying plate (3) is driven to rotate synchronously and intermittently through the second rotating rod (10), the transfer disc (11) and the connecting rod (12), so as to move the chip and the circuit board to the bottom of the patch head in turn; S3: Self-positioning clamping of the circuit board. While the annular conveying plate (3) rotates synchronously and intermittently, the first spur gear (9) rotates under the action of the first arc-shaped rack (15), further driving the first rotating rod (5) to rotate, driving the displacement plate (8) to pull down the pull rope (7) through the threaded portion, and further pulling the four clamping plates (6) to move synchronously through the pull rope (7), and finally clamping the circuit board; S4: Chip picking and placement, the rotation of the reduction motor (17) can drive the third rotating rod (21) to rotate through the driving pulley (25), the driven pulley (26) and the transmission belt, and the third rotating rod (21) further drives the cylindrical cam (22) to rotate, thereby driving the L-shaped mounting rod (23) to move back and forth downward, completing the chip picking and placement; S5: The circuit board is released from clamping. After the chip is removed and mounted, the annular conveyor plate (3) is rotated, and the first spur gear (9) is rotated under the action of the second arc-shaped rack (16), further driving the first rotating rod (5) to rotate, and the displacement plate (8) is driven upward through the threaded portion. Under the action of the reset spring, the circuit board is finally released from clamping.

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