Full-automatic assembling machine for LED (light-emitting diode) module

Abstract

The invention discloses a full-automatic LED module assembling machine, and relates to the technical field of LED modules. The PCB surface detection device comprises a machine frame, a control panel is designed on the side face of the machine frame, a PCB conveying rail is arranged in the machine frame, an IC surface detection mechanism is arranged in the machine frame, and a flexible material taking mechanism is arranged in the machine frame. According to the LED module assembling machine, through mutual cooperation of a power disc, an adjusting shaft, an intelligent material taking servo clamp and other assemblies of the flexible material taking mechanism, when an LED module needs to be assembled, a worker places LED lamp beads into a material placing groove in a material storage box; according to the LED lamp bead automatic taking device, the LED lamp beads are placed in the feeding groove, then a power signal is output to the power disc through the control panel, so that the intelligent taking servo clamp rotates to the position over the LED lamp beads in the feeding groove, the LED lamp beads are clamped, finally, the LED lamp beads are accurately placed on a PCB through the D laser contourgraph, the effect of automatically taking the LED lamp beads is achieved through the design, and the production efficiency can be greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of LED modules, and in particular relates to a fully automatic assembly machine for LED modules. Background Art

[0002] With the development of various types of Internet and new media, the existing outdoor LED advertising display equipment has more and more black screens due to high energy consumption and other design defects. In addition, the outdoor three-sided flip advertising equipment can only alternately switch 3 spray-painted advertising images due to its single form of expression. Although it is low-carbon and energy-saving, it is gradually being eliminated because it cannot publish multimedia information in the context of the big data era.

[0003] According to a disclosed three-side flip LED display module assembly structure (publication number: CN 207818108 U): it includes a display profile as a main body, the cross-section of the display profile is approximately a triangular prism, and the three planes are respectively called special-shaped surfaces and profile inclined surfaces; the special-shaped surfaces of the display profile are limit steps in the shape of right-angle grooves on both sides along the longitudinal direction, and a row of buckles are arranged inwardly along the longitudinal direction adjacent to the limit steps on each side, and the two rows of buckles are matched and connected with the hooks on both sides of the inner concave surface of the bottom shell; a limit block is respectively arranged on the outside of each side of the hook, and the outer side of the limit block is called the bottom shell inclined surface. After the bottom shell is snap-connected with the display profile, the two limit blocks are respectively stuck in the limit steps on the outside of the buckles.

[0004] In the above application, through the mutual cooperation between the display screen profile and the triangular prism column assembly, it is difficult to solve the function of automatic loading of the PCB board when it is flipped in the triangular prism column, resulting in the need for manual placement of the PCB board. Therefore, we proposed a fully automatic assembly machine for LED modules. Summary of the invention

[0005] The purpose of the present invention is to provide a fully automatic assembly machine for LED modules. Through the mutual cooperation between the power disk, adjustment shaft and intelligent material picking servo clamp of the flexible material picking mechanism, when the LED module needs to be assembled, the staff will place the LED lamp beads inside the discharge trough in the material storage box, and then output a power signal to the power disk through the control panel to make the intelligent material picking servo clamp rotate to just above the LED lamp beads inside the discharge trough to clamp the LED lamp beads. Finally, the LED lamp beads are accurately placed on the PCB board through the D laser profiler. This design achieves the effect of automatic material picking of LDE lamp beads, can greatly improve production efficiency, and solves existing problems.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a fully automatic LED module assembly machine, comprising a frame, a control panel is designed on the side of the frame, a PCB conveying track is arranged inside the frame, an IC surface detection mechanism is arranged inside the frame, and a flexible material taking mechanism is arranged inside the frame; The flexible material picking mechanism includes a power disk, the bottom of which is arranged inside the frame, the top of the power disk is rotatably connected to a movable disk, the side of the movable disk is rotatably connected to an adjusting shaft, the circumferential surface of the adjusting shaft is fixedly connected to a first adjusting arm, the end of the first adjusting arm away from the circumferential surface of the adjusting shaft is rotatably connected to a second adjusting arm, the bottom of the second adjusting arm is rotatably connected to a rotating shaft, and an intelligent material picking servo clamp is arranged at the bottom of the rotating shaft.

[0007] Furthermore, the frame is internally slidably connected to a material storage box, and a material discharge trough is provided inside the material storage box. The frame is internally slidably connected to a material storage box for placing LED lamp beads, and the material discharge trough is provided inside the material storage box for separating the LED lamp beads to facilitate material retrieval.

[0008] Furthermore, a 3D laser profiler is provided on the circumferential surface of the power disk, and the function of the 3D laser profiler is to accurately place the LED lamp beads on the PCB board.

[0009] Furthermore, the number of the material storage boxes is set to two, and a linear array is arranged along the side of the frame. The function of the material storage boxes is to place multiple LED lamp beads through the two material storage boxes, thereby reducing the time for adding materials and improving work efficiency.

[0010] Furthermore, a PCB flipping power mechanism is provided inside the frame, and the PCB flipping power mechanism includes a mounting plate, a side surface of the mounting plate is fixedly connected to the inner wall of the frame, the side surface of the mounting plate is rotatably connected to a power shaft, the circumferential surface of the power shaft is fixedly connected to a driving synchronous gear, a connecting shaft passes through the side surface of the mounting plate and is rotatably connected to the circumferential surface of the connecting shaft, the circumferential surface of the connecting shaft is fixedly connected to a driven synchronous gear, the circumferential surface of the driving synchronous gear is transmission-connected to a synchronous belt, one end of the synchronous belt away from the circumferential surface of the driving synchronous gear is transmission-connected to the circumferential surface of the driven synchronous gear, the circumferential surface of the connecting shaft is fixedly connected to a connecting rod, one end of the connecting rod is fixedly connected to a pushing plate, a support plate is provided on the top of the mounting plate, and the PCB flipping power mechanism provided inside the frame is used to flip the PCB board transported to the support plate.

[0011] Furthermore, a baffle is fixedly connected to the side of the support plate, and a transplanting positioning tray is fixedly connected to the inside of the frame. The baffle is fixedly connected to the side of the support plate to prevent the PCB board from falling during the flipping process, and the transplanting positioning tray is fixedly connected to the inside of the frame to support the flipped PCB board.

[0012] Furthermore, the bottom of the support plate is located on the displacement track of the pushing plate. The bottom of the support plate is located on the displacement track of the pushing plate to ensure that the pushing plate can push the support plate during the rotation process.

[0013] The present invention has the following beneficial effects: The present invention realizes the mutual cooperation among the components such as the power disk, the adjustment shaft and the intelligent material picking servo clamp of the flexible material picking mechanism. When the LED module needs to be assembled, the staff places the LED lamp beads inside the discharge trough in the material storage box, and then outputs a power signal to the power disk through the control panel to make the intelligent material picking servo clamp rotate to just above the LED lamp beads inside the discharge trough to clamp the LED lamp beads. Finally, the LED lamp beads are accurately placed on the PCB board through the D laser profiler. This design achieves the effect of automatic material picking of LDE lamp beads, which can greatly improve production efficiency.

[0014] The present invention realizes the mutual cooperation among the components such as the power shaft, the synchronous belt and the transfer positioning tray of the PCB flipping power mechanism. When the PCB board after mounting is completed, it is transported to the support plate through the PCB conveying track. At this time, the staff transmits a control signal to the power shaft through the control panel to make the push plate rotate clockwise to push the support plate, so that the support plate drives the PCB board to be flipped to the top of the transfer positioning tray. This design achieves the effect of automatically flipping the PCB board, reduces the labor of manual flipping, and improves work efficiency.

[0015] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 It is a structural schematic diagram of the overall three-dimensional appearance of the assembly of the present invention; Figure 2 It is a schematic structural diagram of the overall three-dimensional cross-section of the assembly of the present invention; Figure 3 It is a structural schematic diagram of the three-dimensional appearance of the flexible material taking mechanism of the present invention; Figure 4 It is a structural schematic diagram of the three-dimensional appearance of the PCB flipping power mechanism of the present invention; Figure 5 It is a structural schematic diagram of the three-dimensional appearance of the IC surface detection mechanism of the present invention; Figure 6 For the present invention Figure 3 A is a schematic diagram of the three-dimensional enlarged structure; Figure 7 For the present invention Figure 3 Schematic diagram of the three-dimensional enlarged structure of B; Figure 8 For the present invention Figure 4 Schematic diagram of the three-dimensional enlarged structure of C in the middle Fig. 9 For the present invention Figure 5 Schematic diagram of the three-dimensional magnified structure in D.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Rack; 2. Control panel; 3. PCB conveying track; 4. IC surface detection mechanism; 5. Flexible material picking mechanism; 51. Power disk; 52. Moving disk; 53. Adjustment shaft; 54. First adjustment arm; 55. Second adjustment arm; 56. Rotation shaft; 57. Intelligent material picking servo clamp; 58. Material storage box; 59. Material discharge trough; 510. 3D laser profiler; 6. PCB flip plate power mechanism; 61. Mounting plate; 62. Power shaft; 63. Active synchronous gear; 64. Connecting shaft; 65. Driven synchronous gear; 66. Synchronous belt; 67. Connecting rod; 68. Push plate; 69. Support plate; 610. Baffle; 611. Transplanting positioning tray. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1-9 The present invention is a fully automatic assembly machine for LED modules, comprising a frame 1, a control panel 2 is designed on the side of the frame 1, a PCB conveying track 3 is arranged inside the frame 1, an IC surface detection mechanism 4 is arranged inside the frame 1, and a flexible material taking mechanism 5 is arranged inside the frame 1; The flexible material picking mechanism 5 includes a power disk 51, the bottom of which is arranged inside the frame 1, the top of the power disk 51 is rotatably connected to a movable disk 52, the side of the movable disk 52 is rotatably connected to an adjusting shaft 53, the circumferential surface of the adjusting shaft 53 is fixedly connected to a first adjusting arm 54, the end of the first adjusting arm 54 away from the circumferential surface of the adjusting shaft 53 is rotatably connected to a second adjusting arm 55, the bottom of the second adjusting arm 55 is rotatably connected to a rotating shaft 56, and an intelligent material picking servo clamp 57 is arranged at the bottom of the rotating shaft 56.

[0021] The frame 1 is internally slidably connected to a material storage box 58, and a material discharge trough 59 is provided inside the material storage box 58. The frame 1 is internally slidably connected to a material storage box 58 for placing LED lamp beads, and the material discharge trough 59 is provided inside the material storage box 58 for separating the LED lamp beads for easy material retrieval.

[0022] A 3D laser profiler 510 is provided on the circumferential surface of the power disk 51 . The function of the 3D laser profiler 510 is to accurately place the LED lamp beads on the PCB board.

[0023] The number of storage boxes 58 is set to two, and they are arranged in a linear array along the side of the rack 1. The function of the storage boxes 58 is to place multiple LED lamp beads through the two storage boxes 58, thereby reducing the time for adding materials and improving work efficiency.

[0024] A PCB flipping power mechanism 6 is arranged inside the frame 1. The PCB flipping power mechanism 6 includes a mounting plate 61. The side of the mounting plate 61 is fixedly connected to the inner wall of the frame 1. The side of the mounting plate 61 is rotatably connected to a power shaft 62. The circumferential surface of the power shaft 62 is fixedly connected to a driving synchronous gear 63. A connecting shaft 64 passes through the side of the mounting plate 61 and is rotatably connected to the circumferential surface of the connecting shaft 64. A driven synchronous gear 65 is fixedly connected to the circumferential surface of the connecting shaft 64. The circumferential surface of the driving synchronous gear 63 is transmission-connected to a synchronous belt 66. One end of the synchronous belt 66 away from the circumferential surface of the driving synchronous gear 63 is transmission-connected to the circumferential surface of the driven synchronous gear 65. A connecting rod 67 is fixedly connected to the circumferential surface of the connecting shaft 64. One end of the connecting rod 67 is fixedly connected to a pushing plate 68. A supporting plate 69 is arranged on the top of the mounting plate 61. The PCB flipping power mechanism 6 is arranged inside the frame 1 to flip the PCB board transported to the supporting plate 69.

[0025] A baffle 610 is fixedly connected to the side of the support plate 69, and a transplanting and positioning tray 611 is fixedly connected to the inside of the frame 1. The baffle 610 is fixedly connected to the side of the support plate 69 to prevent the PCB board from falling during the flipping process, and the transplanting and positioning tray 611 is fixedly connected to the inside of the frame 1 to support the PCB board after flipping.

[0026] The bottom of the support plate 69 is located on the displacement track of the push plate 68. The bottom of the support plate 69 is located on the displacement track of the push plate 68 to ensure that the push plate 68 can push the support plate 69 during the rotation process.

[0027] A specific application of this embodiment is: when the LED module needs to be assembled, the staff places the LED lamp beads inside the discharge trough 59 in the storage box 58, and then outputs a power signal to the power disk 51 through the control panel 2, so that the power disk 51 rotates counterclockwise through the movable disk 52, and the movable disk 52 rotates counterclockwise to the top of the storage box 58, and then the adjustment shaft 53 rotates counterclockwise, and the adjustment shaft 53 rotates counterclockwise to drive the first adjustment arm 54 and the second adjustment arm 55 to move downward. When the first adjustment arm 54 and the second adjustment arm 55 move to a suitable angle, the intelligent material picking servo clamp 57 is driven to rotate through the rotating shaft 56, so that the intelligent material picking servo clamp 57 rotates to the top of the LED lamp beads inside the discharge trough 59, and the LED lamp beads are clamped. Finally, the LED lamp beads are accurately placed on the PCB board through the 3D laser profiler 510.

[0028] When the PCB board after mounting is transported to the support plate 69 through the PCB conveying track 3, the staff transmits a control signal to the power shaft 62 through the control panel 2, so that the power shaft 62 rotates clockwise, and the clockwise rotation of the power shaft 62 drives the active synchronous gear 63 to rotate clockwise, and the clockwise rotation of the active synchronous gear 63 drives the synchronous belt 66 to transmit clockwise, and the clockwise transmission of the synchronous belt 66 drives the driven synchronous gear 65 to rotate clockwise, and the clockwise rotation of the driven synchronous gear 65 drives the connecting shaft 64 to rotate clockwise, and the clockwise rotation of the connecting shaft 64 drives the push plate 68 to rotate clockwise through the connecting rod 67, and the push plate 68 pushes the support plate 69 during the clockwise rotation, so that the support plate 69 drives the PCB board to flip to the top of the transplanting positioning tray 611.

[0029] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0030] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. LED module fully automatic assembly machine, characterized by: The machine comprises a frame (1), a control panel (2) is arranged on the side of the frame (1), a PCB conveying track (3) is arranged inside the frame (1), an IC surface detection mechanism (4) is arranged inside the frame (1), and a flexible material taking mechanism (5) is arranged inside the frame (1); The flexible material-retrieving mechanism (5) comprises a power disk (51), the bottom of the power disk (51) is arranged inside the frame (1), the top of the power disk (51) is rotatably connected to a movable disk (52), the side of the movable disk (52) is rotatably connected to an adjustment shaft (53), the circumferential surface of the adjustment shaft (53) is fixedly connected to a first adjustment arm (54), one end of the first adjustment arm (54) away from the circumferential surface of the adjustment shaft (53) is rotatably connected to a second adjustment arm (55), the bottom of the second adjustment arm (55) is rotatably connected to a rotating shaft (56), and an intelligent material-retrieving servo clamp (57) is arranged at the bottom of the rotating shaft (56).

2. The fully automatic LED module assembly machine according to claim 1, characterized in that: A material storage box (58) is slidably connected to the interior of the frame (1), and a material discharge trough (59) is provided inside the material storage box (58).

3. The fully automatic LED module assembly machine according to claim 1, characterized in that: A 3D laser profiler (510) is provided on the circumferential surface of the power disk (51).

4. The fully automatic LED module assembly machine according to claim 1, characterized in that: The number of the material storage boxes (58) is set to two, and they are arranged in a linear array along the side of the frame (1).

5. The fully automatic LED module assembly machine according to claim 1, characterized in that: A PCB flip plate power mechanism (6) is arranged inside the frame (1), and the PCB flip plate power mechanism (6) comprises a mounting plate (61), the side surface of the mounting plate (61) is fixedly connected to the inner wall of the frame (1), the side surface of the mounting plate (61) is rotatably connected to a power shaft (62), the circumferential surface of the power shaft (62) is fixedly connected to an active synchronous gear (63), a connecting shaft (64) passes through the side surface of the mounting plate (61), and is rotatably connected to the circumferential surface of the connecting shaft (64), and the connecting shaft (64) is connected to the circumferential surface of the connecting shaft (64). The circumferential surface of the shaft (64) is fixedly connected to a driven synchronous gear (65), the circumferential surface of the driving synchronous gear (63) is transmission-connected to a synchronous belt (66), one end of the synchronous belt (66) away from the circumferential surface of the driving synchronous gear (63) is transmission-connected to the circumferential surface of the driven synchronous gear (65), the circumferential surface of the connecting shaft (64) is fixedly connected to a connecting rod (67), one end of the connecting rod (67) is fixedly connected to a pushing plate (68), and a support plate (69) is provided on the top of the mounting plate (61).

6. The fully automatic LED module assembly machine according to claim 5, characterized in that: A baffle (610) is fixedly connected to the side of the support plate (69), and a transplanting positioning tray (611) is fixedly connected to the inside of the frame (1).

7. The fully automatic LED module assembly machine according to claim 5, characterized in that: The bottom of the support plate (69) is located on the displacement track of the push plate (68).

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