A detection device for detecting wafer geometric morphology

Abstract

The present invention relates to the technical field of optical metrology equipment, and discloses a detection device for detecting the geometric morphology of a wafer, comprising a support frame, a circular guide rail is arranged at the top of the support frame; a detection lens, a groove for sliding the detection lens is opened on the inner side of the circular guide rail, and the detection lens slides along the groove as a track to measure different angles of the wafer, thereby reducing optical interference in blind areas; and two light source rings are symmetrically arranged on the inner wall of the circular guide rail with the groove as the center. The invention sets the detection lens inside the circular guide rail, and the detection lens can slide inside the groove, and the circular guide rail can rotate at multiple angles, so that the purpose of detecting blind areas can be reduced by measuring from different angles, and the data of multiple perspectives can be combined to obtain a complete morphology. At the same time, the light source and the detection lens of the present invention are placed on the same straight line, thereby reducing shadows and reflections, providing a light source with uniform light intensity, and reducing the intensity difference between the center and the edge.

Description

Technical Field

[0001] The present invention relates to the technical field of optical metrology equipment, and in particular to a detection equipment for detecting the geometrical morphology of a wafer. Background Art

[0002] Wafers are the basic materials in semiconductor manufacturing, usually made of highly pure single crystal silicon. They are round sheets with diameters ranging from a few inches to more than 12 inches. Wafers undergo a series of complex process steps, such as doping, oxidation, photolithography, etching, and deposition, and eventually form integrated circuits or other semiconductor devices. In order to ensure that the surface and shape of the wafer meet strict manufacturing standards, identify surface defects such as scratches, cracks, and contamination to avoid these defects that may affect the performance of the device, it is necessary to detect the geometric appearance of the wafer. Optical equipment is usually used to non-contactly measure the shape, flatness, roughness and other parameters of the wafer.

[0003] When existing optical equipment performs non-contact inspection on wafers, direct contact with the wafer is avoided, and surface scratches, cracks or other physical damage will not be caused. However, the field of view of the optical system fixed on the bracket is limited and cannot cover the entire wafer surface. Especially in the edge area of ​​the wafer, the reflection and refraction of light may be more complicated, and there may be measurement blind spots or edge effects, which may lead to weak or distorted measurement signals. The reflection and refraction of light may produce multiple reflections and interference, resulting in the inability to correctly measure the edge area. In view of this, the present invention provides a detection device for detecting the geometric morphology of a wafer. Summary of the invention

[0004] Technical issues solved

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a detection device for detecting the geometric morphology of a wafer, which can effectively solve the problem of measurement blind spots caused by the limited optical field of view when the optical equipment in the prior art detects the wafer.

[0006] Technical Solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The present invention provides a detection device for detecting the geometrical morphology of a wafer, a support frame, and a ring guide rail is arranged on the top of the support frame;

[0009] Detection lens, the inner side of the annular guide rail is provided with a groove for sliding the detection lens, the detection lens slides along the groove as a track to measure different angles of the wafer, reducing optical interference in blind areas; the inner wall of the annular guide rail is symmetrically provided with two light source rings with the groove as the center, the light source ring is composed of a plurality of point light sources, and is used to reduce shadows and reflections and provide uniform lighting;

[0010] A fixed shaft is fixedly connected to the middle of the support frame, and a placement platform for carrying wafers is arranged at the other end of the fixed shaft;

[0011] Wherein, the placement platform includes a receiving portion for supporting the falling wafer to prevent the wafer from falling for a short distance and causing damage to its lower surface.

[0012] Furthermore, the placement platform further comprises a limiting portion, and the middle portion of the outer side of the limiting portion is fixedly connected to one end of the fixed shaft;

[0013] The limiting part includes a circular ring, and side plates are fixedly connected at both ends of the circular ring. A linkage piece is arranged on the inner side of the side plate. A sliding groove is opened at the lower position of the inner wall of the circular ring, and an inclined groove is opened at the upper position of the inner wall of the circular ring. The inclined groove and the sliding groove constitute a complete slideway for the sliding of the receiving part.

[0014] Furthermore, the receiving part includes a fixing ring, a sealing ring is fixedly connected to the inner wall of the fixing ring, a sealing strip is fixedly connected to the bottom end of the sealing ring, a positioning ring is fixedly connected to the bottom end of the fixing ring, a rotating block is fixedly connected to the bottom end of the positioning ring, a connecting block is rotatably connected to the bottom end of the rotating block, a wedge block 1 is fixedly connected to the side of the connecting block, and the bottom end of the wedge block 1 is in contact with the linkage part.

[0015] Furthermore, the linkage member includes a connecting rod embedded in the side plate, a wedge block 2 which is fixedly connected to the middle of the connecting rod and fits with the bottom end of the wedge block 1, and two compression springs are symmetrically arranged on the outer side of the connecting rod with the wedge block 2 as the center;

[0016] The other end of the connecting rod passes through the side plate and is fixedly connected with a magnetic block.

[0017] Furthermore, a positioning block is fixedly connected to the bottom end of the inner wall of the slide groove, and the positioning block is slidably connected to the bottom end of the positioning ring.

[0018] Furthermore, a rubber block is fixedly connected to the lower portion of the inner wall of the circular ring, and the structural size of the rubber block is equal to that of the sealing ring.

[0019] Furthermore, the outer wall of the fixing ring is provided with a rubber layer;

[0020] The width of the fixing ring is smaller than the width of the positioning ring.

[0021] Beneficial Effects

[0022] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0023] The present invention sets the detection lens inside the annular guide rail, and the detection lens can slide inside the groove. The annular guide rail can rotate at multiple angles, so that by measuring from different angles, blind spots can be reduced, and data from multiple perspectives can be combined to obtain a complete morphology. At the same time, the light source and the detection lens of the present invention are placed on the same straight line, thereby reducing shadows and reflections, providing a light source with uniform light intensity, reducing the intensity difference between the center and the edge, and when performing multi-angle measurement, the light source illuminates the wafer at different angles, and the camera can capture more images of the wafer surface from a fixed position, thereby improving the accuracy of detection;

[0024] The present invention provides a receiving part which can be adjusted in height and angle. When the robot transports the wafer to the top of the placement platform, the receiving part is raised to stably receive the wafer. There is no need for the wafer to fall from a higher positioning structure to the top of the rotating structure, thus avoiding physical damage to the lower surface of the wafer that may be caused by the wafer falling freely over a short distance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the split structure of the placement platform according to an embodiment of the present invention;

[0028] Figure 3 Schematic diagram of the cross-sectional structure of the limiting part of an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the structure of the receiving part of an embodiment of the present invention;

[0030] Figure 5 It is a schematic diagram of the cross-sectional structure of the placement platform in the crystal detection state according to an embodiment of the present invention;

[0031] Figure 6 Schematic diagram of the cross-sectional structure of the annular guide rail according to an embodiment of the present invention.

[0032] The numbers in the figure represent respectively: 1. support frame; 11. fixed axis; 2. detection lens; 3. annular guide rail; 31. groove; 32. light source ring; 4. placement platform; 41. limiting part; 411. circular ring; 412. inclined groove; 413. slide groove; 415. positioning block; 416. side plate; 42. receiving part; 421. fixing ring; 422. sealing ring; 423. sealing strip; 425. positioning ring; 426. rotating block; 427. connecting block; 428. wedge block one; 43. linkage member; 431. connecting rod; 432. wedge block two; 433. compression spring; 435. magnetic block; 45. rubber block. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] The present invention will be further described below in conjunction with the embodiments.

[0035] Example

[0036] See also Figure 1-Figure 6 The present invention provides a technical solution for detecting the geometric shape of a wafer: Figure 1 As shown, the device includes a support frame 1, the interior of the support frame 1 is provided with a semicircular groove, the middle of the semicircular groove is fixedly connected with a fixed shaft 11, the other end of the fixed shaft 11 is fixedly connected to the outside of the placement platform 4, the top of the interior of the support frame 1 is rotatably connected to the annular guide rail 3 through a circular shaft, the size of the annular guide rail 3 is larger than the size of the placement platform 4, the staff applies an external force to the outer side of the annular guide rail 3, and the annular guide rail 3 can rotate inside the semicircular groove of the support frame 1 with the circular shaft as the center, as shown in FIG. Figure 6 As shown, a groove 31 is opened in the middle of the inner wall of the annular guide rail 3, and a detection lens 2 is slidably connected to the inner side of the groove 31. The detection lens 2 can move along the groove 31. The inner wall of the annular guide rail 3 is symmetrically provided with two light source rings 32 with the groove 31 as the center. The light source ring 32 is a circular ring structure composed of multiple light sources. When the multiple light sources of the light source ring 32 illuminate the wafer, if the light of some light sources is blocked by objects and a shadow is generated, the light of other light sources will illuminate the shadow area from different angles, thereby weakening and eliminating the shadow, and finally forming a shadowless area. At the same time, the detection lens 2 and the light source are located in the same straight line, so as to achieve the purpose of reducing shadows and reflections and providing uniform lighting. The use of a light source that can provide uniform light intensity can reduce the difference in light intensity between the center and the edge.

[0037] The movement of the detection lens 2 inside the groove 31 is controlled by an external remote control device. The detection lens 2 can move in the groove 31. When it is in the upper half of the groove 31, it can measure the upper surface of the wafer at different angles, thereby reducing the detection blind area and combining data from multiple perspectives to obtain a complete morphology, thereby improving the measurement accuracy of the device. There is no need to tilt the wafer to achieve the effect of multi-angle measurement, thereby avoiding mechanical damage caused by wafer tilt.

[0038] At the same time, in order to improve the accuracy of the multi-angle measurement data of the device, the annular guide rail 3 can also be pushed. When the annular guide rail 3 rotates, the light source of the light source ring 32 illuminates the wafer at different positions and angles, and the detection lens 2 can capture different images of the wafer surface from a fixed position, so that by collecting data from multiple angles and lighting conditions, more comprehensive three-dimensional morphological information can be obtained, which helps to more accurately reconstruct the true shape of the wafer surface. Data under multiple angles and lighting conditions can be corrected with each other to improve measurement accuracy, especially in the presence of environmental changes or equipment drift. Adding data points can provide more information redundancy, which helps to identify and eliminate noise and outliers in data processing and analysis, and identify more subtle morphological features. More comprehensive data can be used for more stringent quality control analysis, helping to discover and prevent potential manufacturing defects. By increasing the number of detection data points, the number of re-measurements of the wafer can be reduced, thereby improving.

[0039] In the prior art, the wafer is taken to the inspection platform by a robot, and the inspection platform supports and rotates the wafer through a lifting and positioning structure, and then the inspection platform inspects its surface. However, in this process, the wafer needs to fall from a higher positioning structure to above the rotating structure. The short-distance fall may cause certain physical damage to the lower surface of the wafer. Although the lower surface does not directly participate in the formation of the circuit pattern, it may still be contaminated or damaged. These damages may affect the circuit on the upper surface in subsequent processing steps. After the fall, the existing device only inspects the upper surface. The lower surface of the wafer needs to be taken out by a robot, rotated, and then moved to the next step for inspection, which takes up space and time and is relatively cumbersome.

[0040] The placement platform 4 provided in the present invention has an inner receiving portion 42 which can be adjusted in height as the manipulator drives the wafer to move farther or farther. When the manipulator is closest to the placement platform 4, i.e., when the wafer is transported to the top of the placement platform 4, the receiving portion 42 moves to the highest position, and the wafer can be unloaded from the manipulator without the wafer falling a short distance.

[0041] like Figure 2As shown, the placement platform 4 includes a limiting portion 41, a receiving portion 42 and a linkage member 43. The linkage members 43 are arranged on both sides of the inner wall of the limiting portion 41. The receiving portion 42 is attached to the top of the linkage member 43. The receiving portion 42 is located inside the limiting portion 41, and the receiving portion 42 can slide inside the limiting portion 41. Figure 2 and Figure 3 As shown, the linkage member 43 includes a connecting rod 431, a wedge block 432, a compression spring 433 and a magnetic block 435. One end of the connecting rod 431 is embedded in the limiting portion 41, and the connecting rod 431 is set as a telescopic rod. The outer rod of the telescopic rod is fixed to the inner wall of the limiting portion 41. The middle part of the inner rod of the telescopic rod is fixedly connected with the wedge block 432, and the outer side of the inner rod is sleeved with a compression spring 433. The compression spring 433 is symmetrically arranged with the wedge block 432 as the center. The other end of the connecting rod 431 passes through the limiting portion 41 and the outer end is fixedly connected with a magnetic block 435. The magnetic block 435 is magnetically connected to the magnetic block on one side of the manipulator. The magnetic block 435 and the magnetic block of the manipulator have the same magnetism and repel each other. In the process of the manipulator gradually approaching, the repulsive force between the two gradually increases, and the magnetic block 435 is forced to move toward the inside of the limiting portion 41. The movement of the magnetic block 435 causes the connecting rod 431 and the compression spring 433 to be compressed and deformed, and the movement of the connecting rod 431 drives the wedge block 432 to move.

[0042] like Figure 1 , Figure 4 and Figure 5 As shown, the receiving portion 42 includes a wedge block 1 428 fitted with the top of the wedge block 2 432, the wedge block 1 428 is fixedly connected to a connecting block 427, the top of the connecting block 427 is rotatably connected to a rotating block 426, the top of the rotating block 426 is fixedly connected to the bottom of the positioning ring 425, the top of the positioning ring 425 is fixedly connected to a fixing ring 421, the inner wall of the fixing ring 421 is fixedly connected to a sealing ring 422, the sealing ring 422 is arranged in an arc shape, and the bottom of the sealing ring 422 is fixedly connected to a sealing strip 423. In the initial state, that is, before the manipulator enters the magnetic induction field of the magnetic block 435, the fixing ring 421, the positioning ring 425, the rotating block 426 and the connecting block 427 are arranged in sequence from top to bottom, the sealing ring 422 and the sealing strip 423 on the inner wall of the fixing ring 421 have the same structure as the rubber block 45 and are symmetrically arranged, the sealing ring 422, the sealing strip 423 and the rubber block 45 are tightly fitted to form a flexible concave sealing ring together, as shown in FIG. Figure 5 As shown, the side edge of the wafer can be clamped and fixed without causing damage to the side edge of the wafer.

[0043] As the manipulator approaches, the repulsive force received by the magnetic block 435 from the manipulator magnet increases, and the magnetic block 435 moves toward the inside of the limit portion 41 under the action of the repulsive force, and the magnetic block 435 pushes the connecting rod 431 to extend and retract, and the connecting rod 431 drives the wedge block 2 432 to move synchronously. As the manipulator approaches, the repulsive force gradually increases, and the elastic deformation of the compression spring 433 caused by the movement of the wedge block 2 432 gradually increases, so that the wedge block 2 432 moves stably, and the wedge block 1 428 that fits with the top of the wedge block 2 432 moves upward. Move, the wedge block 428 moves to drive the connecting block 427 to move upward, the connecting block 427 drives the rotating block 426 to move upward, the rotating block 426 drives the positioning ring 425 to move upward, and the positioning ring 425 drives the fixing ring 421 to move upward, thereby moving the top of the receiving portion 42 from a position flush with the upper surface of the limiting portion 41 to a position exceeding the upper surface of the limiting portion 41. When the fixing ring 421 rises to the highest position, the height of the fixing ring 421 is slightly higher than the height of the robot, so that the wafer transmitted by the robot can be smoothly transferred to the fixing ring 421.

[0044] After the wafer is taken out of the robot, the robot retracts and gradually moves away from the magnetic induction field of the magnetic block 435. The repulsive force on the magnetic block 435 gradually weakens, and the repulsive force gradually decreases from being greater than the elastic force of the compression spring 433 to being less than the elastic force of the compression spring 433. The compression spring 433 therefore gradually recovers its elastic deformation. However, since the repulsive force gradually decreases with increasing distance, the elastic deformation of the compression spring 433 and the extension of the connecting rod 431 are both smooth and slow, further reducing the vibration generated by the movement of the device and preventing the vibration from causing mechanical damage to the wafer surface. , the connecting rod 431 extends and drives the wedge block 432 to move to its original position, and the wedge block 428 that is in contact with the top of the wedge block 432 also returns to its original position, the wedge block 428 and the connecting block 427 move downward synchronously, the connecting block 427 drives the rotating block 426 to move downward, the rotating block 426 drives the positioning ring 425 to move downward, the positioning ring 425 drives the fixing ring 421, the sealing ring 422 and the sealing strip 423 to move downward synchronously, and gradually returns to the position where the top of the connecting rod 431 is flush with the top of the limiting portion 41, at this time, the sealing ring 422, the sealing strip 423 and the rubber block 45 together form a flexible concave sealing ring, such as Figure 5 As shown, the side edges of the wafer are clamped and fixed.

[0045] refer to Figure 2 , Figure 3 and Figure 5As shown, the limiting portion 41 is composed of a ring 411 and a side plate 416. Two side plates 416 are symmetrically fixed on both sides of the ring 411. A linkage member 43 is provided inside the side plate 416. A slide groove 413 is provided at the lower position of the inner side of the ring 411. A connecting block 427 is provided at a position where the bottom end of the slide groove 413 coincides with the center line of the linkage member 43. The connecting block 427 can slide inside the slide groove 413. An inclined groove 412 is provided at the upper position of the inner wall of the ring 411. The inclined groove 412 is located above the slide groove 413. In the initial state, the fixing ring 421 is in the In the space of the inclined groove 412, the positioning ring 425, the rotating block 426 and the connecting block 427 are located in the space of the slide groove 413. The bottom end of the slide groove 413 is fixedly connected with a positioning block 415, and the positioning block 415 is slidably connected to the bottom end of the positioning ring 425. When the positioning ring 425 moves from the space of the inclined groove 412 to the space of the slide groove 413, the positioning block 415 can limit the position of the positioning ring 425 to avoid the position displacement of the positioning ring 425. When the wafer is clamped, it can also play a role in limiting the relationship between the various components of the clamping structure to ensure the stability of the wafer during the detection process.

[0046] refer to Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, the ring width of the fixing ring 421 is smaller than the ring width of the positioning ring 425. The outer wall of the fixing ring 421 is fixedly connected with a rubber layer, and the rubber layer fits the side of the inclined groove 412 and the sliding groove 413. When the top of the fixing ring 421 is flush with the top of the circular ring 411, it plays the purpose of stabilizing the position of the fixing ring 421. As the wedge block 428 is forced to move upward, the rotating block 426 and the positioning ring 425 gradually move from the space of the sliding groove 413 to the space of the inclined groove 412. Due to size reasons, the fixing ring 421 can slide on the inside of the inclined groove 412, and only the side rubber strip is deformed during movement. When the positioning ring 425 moves into the space of the inclined groove 412, the side of the positioning ring 425 is squeezed by the side of the inclined groove 412, so that when the positioning ring 425 moves upward, the rotating block 426 at its bottom end rotates around the connecting block 427 as the center, and the positioning ring 425 rotates in a direction away from the center of the circular ring 411. The positioning ring 425 The fixed ring 421, the sealing ring 422 and the sealing strip 423 are driven to rotate. When the moving position reaches the maximum value, the positioning ring 425, the sealing ring 422 and the sealing strip 423 are tilted, and the diameter between the two increases, which is convenient for the placement of the wafer. The highest point of the sealing ring 422 contacts the wafer and restricts it. As the manipulator moves away, the magnetic field weakens, and the fixed ring 421 reverses, the wafer gradually moves from the side of the sealing ring 422 to the side of the sealing strip 423 at the bottom of the sealing ring 422, and when the sealing ring 422 returns to its original position, the two sealing rings 422 restrict the upper and lower sides of the wafer at the same time, and the wafer does not need to fall from a higher positioning structure to the top of the rotating structure. The short-distance fall of the wafer is always carried out under the restriction of the sealing ring 422 and the sealing strip 423, and there is no need to fall freely, so as to avoid certain physical damage to the lower surface of the wafer caused by free fall, thereby improving the safety of detection.

[0047] When the wafer is fixed inside the placement platform 4, Figure 5 After the state shown, the detection lens 2 can be started to rotate along the groove 31. The detection lens 2 completes a circle. In addition to detecting the upper surface of the wafer, the lower surface of the wafer can also be detected. There is no need to turn the wafer over and adjust it through a robot or other structure, which effectively reduces the detection time and the number of wafer displacements during the detection process, reduces the damage caused by the movement of the wafer position, and improves the practicality of the device.

[0048] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A detection device for detecting the geometric morphology of a wafer, characterized in that: include: A support frame (1), wherein a ring guide rail (3) is provided at the top end of the support frame (1); A detection lens (2), wherein a groove (31) for sliding the detection lens (2) is provided on the inner side of the annular guide rail (3), and the detection lens (2) can slide along the groove (31) as a track to measure different angles of the wafer, thereby reducing optical interference in blind areas; the inner wall of the annular guide rail (3) is symmetrically provided with two light source rings (32) with the groove (31) as the center, and the light source ring (32) is composed of a plurality of point light sources, and is used to reduce shadows and reflections and provide uniform lighting; A fixed shaft (11) is fixedly connected to the middle of the support frame (1), and a placement platform (4) for carrying wafers is provided at the other end of the fixed shaft (11); The placement platform (4) includes a receiving portion (42) for supporting the falling wafer, thereby preventing the wafer from falling over a short distance and causing damage to its lower surface; The receiving portion (42) comprises a fixing ring (421), the inner wall of the fixing ring (421) is fixedly connected with a sealing ring (422), the bottom end of the sealing ring (422) is fixedly connected with a sealing strip (423), the bottom end of the fixing ring (421) is fixedly connected with a positioning ring (425), the bottom end of the positioning ring (425) is fixedly connected with a rotating block (426), the bottom end of the rotating block (426) is rotatably connected with a connecting block (427), the side of the connecting block (427) is fixedly connected with a wedge block 1 (428), and the bottom end of the wedge block 1 (428) is in contact with the linkage member (43); The linkage member (43) comprises a connecting rod (431) embedded in the side plate (416), a wedge block 2 (432) fixedly connected to the middle of the connecting rod (431) and fitted with the bottom end of the wedge block 1 (428), and two compression springs (433) are symmetrically arranged on the outer side of the connecting rod (431) with the wedge block 2 (432) as the center; The other end of the connecting rod (431) passes through the side plate (416) and is fixedly connected to a magnetic block (435).

2. The detection device for detecting wafer geometric morphology according to claim 1, characterized in that: The placement platform (4) further comprises a limiting portion (41), and the middle portion of the outer side of the limiting portion (41) is fixedly connected to one end of the fixed shaft (11); The limiting portion (41) comprises a circular ring (411), two ends of the circular ring (411) are fixedly connected with side plates (416), a linkage member (43) is arranged on the inner side of the side plate (416), a sliding groove (413) is provided at the lower position of the inner wall of the circular ring (411), and an inclined groove (412) is provided at the upper position of the inner wall of the circular ring (411), and the inclined groove (412) and the sliding groove (413) constitute a complete slideway for the receiving portion (42) to slide.

3. The detection device for detecting wafer geometric morphology according to claim 2, characterized in that: A positioning block (415) is fixedly connected to the bottom end of the inner wall of the slide groove (413), and the positioning block (415) is slidably connected to the bottom end of the positioning ring (425).

4. The detection device for detecting wafer geometric morphology according to claim 2, characterized in that: A rubber block (45) is fixedly connected to the lower portion of the inner wall of the circular ring (411), and the structural dimensions of the rubber block (45) are equal to those of the sealing ring (422).

5. The detection device for detecting wafer geometric morphology according to claim 3, characterized in that: The outer wall of the fixing ring (421) is provided with a rubber layer; The width of the fixing ring (421) is smaller than the width of the positioning ring (425).

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