Liquid-cooled servers

Abstract

The present application discloses a liquid-cooled server, comprising a cabinet having a plurality of mounting brackets disposed therein, the mounting brackets being used to secure a server motherboard, the outer walls of the mounting brackets being provided with liquid pipes; a liquid cooling channel comprising a first liquid cooling channel and a second liquid cooling channel, the first liquid cooling channel and the second liquid cooling channel being connected by a plurality of vertical connecting pipes, a vertical track being disposed on a side of the liquid cooling channel away from the mounting brackets so that the first liquid cooling channel and the second liquid cooling channel can slide up and down along the vertical track; and a conducting pipe, the conducting pipe connecting opposite sides of the first liquid cooling channel, a receiving groove being disposed on the side of the first liquid cooling channel for accommodating the conducting pipe, the conducting pipe being able to slide via a horizontal track disposed on the first liquid cooling channel and into the receiving groove, the conducting pipe being provided with a connection port corresponding to the liquid pipe. The present application can effectively solve the heat dissipation problem of high-power density servers while improving the technical problems of space utilization, maintenance convenience, and scalability.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a liquid-cooled server. Background Art

[0002] With the rapid advancement of computing technology, the computing density of data centers and servers continues to increase, leading to increasingly serious heat dissipation issues. Traditional air cooling technology has become ineffective in addressing overheating in high-power density servers, making liquid cooling a more effective heat dissipation solution. Liquid cooling technology effectively dissipates heat by directly delivering coolant to heat-generating components, significantly improving server stability and efficiency. However, existing liquid cooling systems often suffer from numerous issues, limiting their widespread adoption in large-scale data centers.

[0003] To optimize the performance of liquid cooling systems, recent research and development efforts have focused on improving the structural design of liquid cooling devices to make them more adaptable to high-power density computing environments. Existing liquid cooling systems typically surround the server to effectively dissipate heat. While this design improves cooling efficiency to a certain extent, it also introduces a number of problems. First, when the liquid cooling system completely surrounds the server, space utilization decreases. For example, when multiple servers are deployed, heat dissipation between servers becomes impossible. Adding a liquid cooling system increases costs, restricts the layout of components within the server, and compromises compact design. This situation hinders the scalability and upgradeability of servers in high-density environments, making them unsuitable for rapidly evolving technological demands and market changes. Second, the maintenance and management of surround-type liquid cooling systems is complex. Because the liquid cooling system tightly surrounds the server, hardware repair and replacement operations are difficult. For example, to inspect a component, technicians often need to disassemble the entire liquid cooling system, increasing repair time and cost, and potentially damaging the cooling system in the process. Summary of the Invention

[0004] The purpose of this application is to provide a liquid-cooled server to solve the technical problem that the existing technology cannot effectively solve the heat dissipation problem of high-power density servers while improving space utilization, maintenance convenience and scalability.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] A liquid cooling server, comprising:

[0007] A cabinet body, wherein a plurality of mounting racks are provided inside the cabinet body, wherein the mounting racks are used to fix the server motherboard, and wherein the outer walls of the mounting racks are provided with liquid pipes, and the liquid pipes are arranged around the circumference of the outer walls of the mounting racks;

[0008] The liquid cooling channel includes a first liquid cooling channel and a second liquid cooling channel, the first liquid cooling channel and the second liquid cooling channel are respectively arranged at the top and bottom of the cabinet and surround the mounting rack, the first liquid cooling channel and the second liquid cooling channel are connected by a plurality of vertical connecting pipes, and a vertical track is provided on a side of the liquid cooling channel away from the mounting rack, the vertical track is fixedly connected to the cabinet so that the first liquid cooling channel and the second liquid cooling channel can slide up and down along the vertical track;

[0009] A conducting tube, the conducting tube connecting the opposite sides of the first liquid-cooling channel, the side of the first liquid-cooling channel is provided with a receiving groove for accommodating the conducting tube, the conducting tube can slide through a horizontal track provided on the first liquid-cooling channel and can slide to the receiving groove, and the conducting tube is provided with a connecting port corresponding to the liquid pipeline, so that the liquid pipeline is connected when docking with the connecting port of the conducting tube.

[0010] Furthermore, it also includes a sliding connection component, the first liquid cooling channel and the second liquid cooling channel slide along the vertical track, the sliding parts of the first liquid cooling channel and the second liquid cooling channel are provided with sliders, the sliders are slidingly connected to the vertical track through guide grooves, and positioning pins are provided in the guide grooves, and the relative positions of the liquid cooling channels on the vertical track are fixed by the positioning pins cooperating with the holes in the guide grooves.

[0011] Furthermore, it also includes a telescopic assembly, which is used to adjust the length of the vertical connecting pipe to adapt to the relative height difference between the first liquid cooling channel and the second liquid cooling channel when the liquid cooling channel slides up and down along the vertical track;

[0012] The telescopic assembly includes a telescopic rod and a telescopic sleeve. One end of the telescopic rod is fixedly connected to the first liquid cooling channel, and the other end is slidably connected to the telescopic sleeve. The telescopic sleeve is fixedly connected to the second liquid cooling channel. A spring is provided between the telescopic rod and the telescopic sleeve. The spring provides elastic force between the telescopic rod and the telescopic sleeve to maintain the stability of the vertical connecting pipe during the telescopic process.

[0013] Furthermore, it also includes a diverter, which is arranged inside the liquid cooling channel and fixedly connected to the inner wall of the liquid cooling channel. The flow channel of the diverter is connected to the inlet of the liquid cooling channel through a threaded joint. The flow channel of the diverter is provided with a regulating valve so that the regulating valve changes the flow path of the coolant.

[0014] Furthermore, it also includes a bubble separator, a grid structure is provided inside the bubble separator, and the bubble separator is arranged at the entrance of the liquid cooling channel for separating bubbles in the cooling liquid.

[0015] Furthermore, there is a gap between the liquid pipe and the outer wall, and a sealing assembly is arranged in the gap. The sealing assembly includes a sealing strip and a sealant. The sealing strip is arranged at the edge where the liquid pipe contacts the outer wall, and the sealant is filled in the gap between the liquid pipe and the outer wall to prevent leakage of the coolant when flowing in the liquid pipe.

[0016] Furthermore, the inner wall of the cabinet is also provided with a liquid inlet component, which includes a plunger pump and a filter. The first liquid channel is provided with a liquid inlet corresponding to the plunger pump. The plunger pump and the filter are movably connected, and the liquid outlet of the plunger pump is connected to the liquid inlet.

[0017] Furthermore, a liquid collecting channel is provided at the bottom of the cabinet, and the liquid collecting channel is used to collect the cooling liquid flowing out of the liquid cooling channel. The liquid collecting channel includes a vertical reflux pipe, and the reflux pipe is connected to the filter of the liquid inlet component through a reflux pump.

[0018] Furthermore, the cabinet includes a top plate, and the inner wall of the top plate is provided with heat sinks, and the heat sinks are used to transfer heat absorbed by the liquid cooling device to the air to achieve a cooling effect.

[0019] Furthermore, it also includes a heat dissipation component, which includes a fan and a heat dissipation fan bracket. The fan bracket is fixed to the inner wall of the cabinet, and the fan is arranged on the fan bracket. The fan is used to discharge the heat inside the cabinet.

[0020] Compared with the prior art, this application has the following beneficial effects:

[0021] This application adopts a liquid cooling channel design that slides up and down, and the outer wall of the server is provided with a liquid pipe, so that multiple servers can be compactly arranged together without interfering with each other's heat dissipation. This design not only improves the utilization of space, but also reduces the demand for overall space. The up and down sliding design of the liquid cooling channel allows technicians to easily move the liquid cooling channel when performing hardware maintenance or upgrades, without having to disassemble the entire liquid cooling system. This greatly reduces maintenance time and maintenance costs, and reduces the risk of damage to the cooling system. Since the liquid cooling channel can slide up and down independently of the server, it can be flexibly expanded when the number of servers needs to be increased without being restricted by the existing liquid cooling system, which significantly improves the scalability and upgrade capabilities of the server in a high-density environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0023] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the efficacy and objectives that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0024] Figure 1 This is a schematic diagram of the overall structure of the liquid-cooled server.

[0025] Figure 2 This is a structural diagram of an embodiment of a liquid cooling server;

[0026] Figure 3 This is a schematic diagram of a top view of the structure of an embodiment of a liquid cooling server;

[0027] Figure 4 A side structural diagram of an embodiment of a liquid cooling server;

[0028] Figure 5 This is a schematic cross-sectional view of the vertical connecting pipes of an embodiment of a liquid cooling server;

[0029] Figure 6 A schematic structural diagram of a mounting frame for a liquid-cooled server according to an embodiment of the present invention.

[0030] Illustration:

[0031] 1. Cabinet; 11. Top plate; 12. Mounting frame; 21. Liquid pipeline; 22. First liquid cooling channel; 23. Second liquid cooling channel; 31. Vertical connecting pipeline; 32. Vertical track; 33. Conducting pipe; 34. Connecting port; 35. Receiving groove; 41. Locating pin; 42. Slider; 43. Telescopic rod; 44. Telescopic sleeve; 45. Spring; 51. Sealing strip; 52. Sealant; 53. Plunger pump; 54. Filter; 55. Liquid inlet; 61. Liquid collecting channel; 62. Return pipe; 71. Heat sink; 72. Fan; 73. Fan bracket. DETAILED DESCRIPTION

[0032] In order to make the purpose, features, and advantages of the invention of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described below are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting this application. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0034] The technical solution of the present application will be further explained below with reference to the accompanying drawings and through specific implementation methods.

[0035] refer to Figures 1 to 6 The present application provides a liquid cooling server, comprising: a cabinet 1, wherein a plurality of mounting racks 12 are provided inside the cabinet 1, wherein the mounting racks 12 are used to fix the server motherboard, and a liquid pipe 21 is provided on the outer wall of the mounting rack 12, wherein the liquid pipe 21 is provided around the circumference of the outer wall of the mounting rack 12; a liquid cooling channel, comprising a first liquid cooling channel 22 and a second liquid cooling channel 23, wherein the first liquid cooling channel 22 and the second liquid cooling channel 23 are respectively provided at the top and the bottom of the cabinet 1 and surround the mounting rack 12, the first liquid cooling channel 22 and the second liquid cooling channel 23 are connected by a plurality of vertical connecting pipes 31, and the liquid cooling channel is provided with a liquid cooling channel on the side away from the mounting rack 12. A vertical track 32, the vertical track 32 is fixedly connected to the cabinet 1 so that the first liquid cooling channel 22 and the second liquid cooling channel 23 can slide up and down along the vertical track 32; a conducting tube 33, the conducting tube 33 connects the opposite sides of the first liquid cooling channel 22, and the side of the first liquid cooling channel 22 is provided with a receiving groove 35 for accommodating the conducting tube 33. The conducting tube 33 can slide through a horizontal track provided on the first liquid cooling channel 22 and can slide to the receiving groove 35. The conducting tube 33 is provided with a connecting port 34 corresponding to the liquid pipe 21, so that the liquid pipe 21 is connected when docking with the connecting port 34 of the conducting tube 33.

[0036] In this embodiment, a liquid-cooled server includes a cabinet 1 with multiple mounting racks 12 disposed within it for securely securing server motherboards. Liquid conduits 21 are mounted on the outer walls of the mounting racks 12, extending along the perimeter of the outer walls. The conduits 21 can be arranged in a rectangular shape around the outer walls of the mounting racks 12. This arrangement ensures that every part of the server motherboard is effectively surrounded by coolant, achieving uniform heat dissipation. The conduits 21 evenly distribute coolant across the server motherboard, ensuring system stability and performance even under high-load conditions. First and second liquid cooling channels 22 and 23 are located at the top and bottom of the cabinet 1, respectively, and surround the mounting racks 12. These channels allow coolant to flow throughout the cooling system and effectively cool the server motherboards surrounding the mounting racks 12. The first and second liquid cooling channels 22 and 23 are connected by multiple vertical connecting pipes 31, forming a complete coolant circulation system. Coolant flows between these connecting pipes, ensuring full utilization of the coolant and effectively reducing server temperature. A vertical track 32 is provided on the side away from the mounting frame 12. The vertical track 32 is fixedly connected to the cabinet 1, allowing the first liquid cooling channel 22 and the second liquid cooling channel 23 to slide in the vertical direction. This sliding design allows the liquid cooling channels to be adjusted up and down as needed. A guide tube 33 is provided. The guide tube 33 connects the opposite sides of the first liquid cooling channel 22. The side of the first liquid cooling channel 22 is provided with a receiving groove 35 for accommodating the guide tube 33. The guide tube 33 can slide through the horizontal track provided on the first liquid cooling channel 22 and can slide into the receiving groove 35. The guide tube 33 is also provided with a connection port 34 corresponding to the liquid pipeline 21. These connection ports 34 are designed to ensure that the guide tube 33 can achieve a stable connection when docking with the chain structure of the liquid pipeline 21. This connection design not only ensures the effective circulation of the coolant, but also avoids possible leakage problems. Through this connection method, the stability and reliability of the liquid cooling system can be ensured during long-term use. This embodiment can be adjusted and maintained according to actual needs, increasing the flexibility and adaptability of the system. The sliding mechanism makes liquid cooling channel maintenance more convenient, allowing operators to quickly complete maintenance tasks and reducing system downtime. The relative positions of the first liquid cooling channel 22 and the second liquid cooling channel 23 can also be flexibly adjusted according to the heat level of the server. Specifically, by adjusting the height of the liquid cooling channel, the cooling effect can be optimized to meet the heat dissipation requirements under different workloads. The effective connection between the guide tube 33 and the liquid pipeline 21 ensures the stable flow of coolant and improves the overall cooling efficiency of the system. In addition, by optimizing the structure of the liquid cooling channel and the guide tube 33, the system not only improves cooling performance but also effectively extends the service life of the equipment.

[0037] In one specific embodiment, the first and second liquid cooling channels 22 and 23 can slide up and down along the vertical track 32, automatically detecting the temperature based on temperature sensors and automatically adjusting their relative positions via a control system. Specifically, multiple cavities can be designed on the outer wall of the mounting plate to accommodate temperature sensors, with the size of each cavity corresponding to the size of the liquid cooling channel. The control system then automatically adjusts the relative heights of the first and second liquid cooling channels 22 and 23 based on the temperature indices to achieve optimal cooling. The control system can be a central processing unit (CPU), which receives signals from the temperature sensors and calculates the optimal positions of the liquid cooling channels based on a preset algorithm. When the temperature of the server motherboard increases, the control system instructs the liquid cooling channels to move downward to increase the contact area between the coolant and the motherboard, thereby improving cooling efficiency. Conversely, if the temperature is lower, the control system instructs the liquid cooling channels to move upward to reduce coolant flow and save energy.

[0038] The specific formula of the above preset algorithm is: .in: is the temperature index corresponding to the optimal position of the liquid cooling channel. The target temperature is the desired operating temperature of the server. It is the actual temperature detected by the current temperature sensor. It is an adjustment coefficient used to adjust the impact of the deviation between the actual temperature and the target temperature on the position of the liquid cooling channel. It is a dynamic adjustment coefficient used to adjust the impact of temperature change rate on the position of liquid cooling channel. It is the temperature change rate, that is, the speed at which the temperature changes over time. Through this intelligent adjustment mechanism, the liquid-cooled server can adjust the cooling effect in real time according to the actual operating conditions, ensuring that the server can maintain optimal performance under different load conditions. In addition, this adaptive cooling system can also reduce unnecessary energy consumption and improve the energy efficiency of the system. The inner wall of the liquid cooling channel can be designed to have a microstructured surface. This microstructure can increase the contact area between the coolant and the inner wall of the channel, thereby improving the heat exchange efficiency. Specifically, the microstructure is a series of tiny protrusions or grooves. These microstructures can be regularly arranged or randomly distributed. The purpose is to break the boundary layer formed when the coolant flows, thereby increasing the degree of turbulence and improving the heat exchange efficiency. For example, it can be an L-shaped microstructure, which can cause the coolant to generate more turbulence when flowing through the liquid cooling channel, thereby improving the cooling efficiency.

[0039] In another embodiment, the shape of the vertical connecting pipe 31 can be changed according to actual conditions. For example, when more mounting racks 12 need to be placed in the middle, the vertical connecting pipe 31 can be designed into a curved shape to achieve more flexible connection within a limited space. The curved vertical connecting pipe 31 can effectively bypass the middle mounting rack 12, thereby adding more liquid cooling channels without increasing the size of the cabinet 1. This design not only increases the capacity of the cooling system but also maintains the system's compactness, making the liquid-cooled server more suitable for space-constrained data center environments.

[0040] In one embodiment, a sliding connection assembly is further included, wherein the first liquid cooling channel 22 and the second liquid cooling channel 23 slide along the vertical track 32, and the sliding parts of the first liquid cooling channel 22 and the second liquid cooling channel 23 are provided with a slider 42, and the slider 42 is slidingly connected to the vertical track 32 through a guide groove, and a positioning pin 41 is provided in the guide groove, and the relative position of the liquid cooling channel on the vertical track 32 is fixed by the cooperation between the positioning pin 41 and the hole in the guide groove.

[0041] In this embodiment, a sliding connection assembly enhances the flexibility and ease of maintenance of the liquid-cooled server. The first and second liquid cooling channels 22 and 23 slide along a vertical track 32. The sliding portion is provided with a slider 42, which is slidably connected to the vertical track 32 via a guide groove. A positioning pin 41 is provided within the guide groove. The positioning pin 41 engages with the hole in the guide groove to secure the relative position of the liquid cooling channel on the vertical track 32. This sliding connection assembly design allows for highly flexible vertical movement of the liquid cooling channel while ensuring stable fixation in a specific position. The height of the liquid cooling channel can be adjusted to optimize cooling efficiency based on actual heat dissipation requirements. For example, when the server is heavily loaded, the liquid cooling channel can be moved downward to increase the contact area between the coolant and the server motherboard, improving cooling efficiency. When the load is light, the liquid cooling channel can be moved upward to reduce coolant usage and achieve energy savings. This can be controlled using the aforementioned control system.

[0042] In one embodiment, it also includes a telescopic component, which is used to adjust the length of the vertical connecting pipe 31 to adapt to the relative height difference between the first liquid cooling channel 22 and the second liquid cooling channel 23 when the liquid cooling channel slides up and down along the vertical track 32; the telescopic component includes a telescopic rod 43 and a telescopic sleeve 44, one end of the telescopic rod 43 is fixedly connected to the first liquid cooling channel 22, and the other end is slidably connected to the telescopic sleeve 44, the telescopic sleeve 44 is fixedly connected to the second liquid cooling channel 23, and a spring 45 is provided between the telescopic rod 43 and the telescopic sleeve 44, and the spring 45 provides elastic force between the telescopic rod 43 and the telescopic sleeve 44 to maintain the stability of the vertical connecting pipe 31 during the telescopic process.

[0043] In this embodiment, a telescopic assembly is disposed within the vertical connecting pipe 31 and is used to adjust the length of the vertical connecting pipe 31 to accommodate the relative height difference between the first liquid cooling channel 22 and the second liquid cooling channel 23 when the liquid cooling channel slides up and down along the vertical track 32. The telescopic assembly includes a telescopic rod 43 and a telescopic sleeve 44. One end of the telescopic rod 43 is fixedly connected to the first liquid cooling channel 22, and the other end is slidably connected to the telescopic sleeve 44. The telescopic sleeve 44 is fixedly connected to the second liquid cooling channel 23. A spring 45 is disposed between the telescopic rod 43 and the telescopic sleeve 44. The spring 45 provides elastic force between the telescopic rod 43 and the telescopic sleeve 44 to maintain the stability of the vertical connecting pipe 31 during the telescopic process. This allows the vertical connecting pipe 31 to automatically adjust its length according to the up and down sliding of the liquid cooling channel, ensuring smooth flow of coolant while avoiding stress concentration caused by length mismatch. The design of the spring 45 in the telescopic assembly not only ensures the stability of the connecting pipe during telescopic expansion and contraction, but also absorbs some vibration, reducing noise generated during system operation. In actual applications, the telescopic assembly can effectively cope with the space limitations of different server rooms, allowing the liquid cooling system to be flexibly installed in a variety of different environments. It is worth noting that the edge of the telescopic sleeve in this embodiment is provided with a waterproof sealing ring to ensure that the coolant will not leak from the telescopic assembly during the operation of the liquid cooling system, thereby ensuring safety and reliability. The waterproof sealing ring can be made of high-temperature resistant and corrosion-resistant materials to adapt to the characteristics of the coolant in the liquid cooling system. In another embodiment, a bellows can be used directly instead, and the inner wall of the liquid cooling channel can also be coated with a layer of material with high thermal conductivity, such as copper or aluminum. This material can effectively and quickly conduct the heat generated by the server to the coolant, thereby improving the heat exchange efficiency. The thickness and material of the coating layer can be selected according to the actual application requirements to achieve the best cooling effect.

[0044] In one embodiment, a diverter is further included, which is arranged inside the liquid cooling channel and fixedly connected to the inner wall of the liquid cooling channel. The flow channel of the diverter is connected to the inlet of the liquid cooling channel through a threaded joint. The flow channel of the diverter is provided with a regulating valve so that the regulating valve changes the flow path of the coolant.

[0045] In this embodiment, a flow diverter optimizes the flow of coolant within the liquid cooling channel, thereby improving cooling efficiency. The flow diverter is positioned within the liquid cooling channel and fixedly connected to the inner wall of the channel. The flow channel of the flow diverter is connected to the inlet of the liquid cooling channel via a threaded joint, ensuring a tight and reliable connection. The flow channel of the flow diverter is equipped with a regulating valve, which can be adjusted to change the flow path of the coolant, thereby achieving precise control of the coolant flow rate. In actual application, the flow diverter can be adjusted according to the heat generation and cooling requirements of the server. For example, when the server is heavily loaded, more regulating valves can be opened to allow coolant to flow through more channels, increasing the coolant flow rate and improving cooling efficiency. When the load is light, some regulating valves can be closed to reduce the coolant flow rate and achieve energy conservation. The design of the flow diverter enables the liquid cooling system to more flexibly cope with different workloads, ensuring that the server achieves optimal cooling performance in all situations. In another embodiment, if certain flow channels fail or become blocked, the flow path of the coolant can be redistributed by adjusting the valves of other flow channels, ensuring that the coolant can bypass the faulty area and continue to provide effective cooling to the server. This design not only improves the stability and reliability of the system, but also extends the service life of the equipment.

[0046] In one embodiment, a bubble separator is further included. A grid structure is provided inside the bubble separator. The bubble separator is provided at the inlet of the liquid cooling channel and is used to separate bubbles in the cooling liquid.

[0047] In this embodiment, a grid structure is provided inside the bubble separator, which can effectively capture and separate bubbles in the coolant. The presence of bubbles will not only reduce the heat conduction efficiency of the coolant, but may also cause malfunctions of components such as pumps and valves in the cooling system. The bubble separator is provided at the entrance of the liquid cooling channel to ensure that the bubble content in the coolant entering the liquid cooling channel is minimized. In actual applications, when bubbles are generated during the circulation of the coolant, these bubbles will be intercepted and separated by the grid structure inside the bubble separator. The separated bubbles will be discharged from the system through the exhaust port at the top of the bubble separator, thereby avoiding the accumulation of bubbles in the cooling system. In addition, the bubble separator also has a self-cleaning function. By regularly backflushing, impurities and sediments on the grid structure can be removed to ensure its long-term stable operation.

[0048] In one embodiment, there is a gap between the liquid pipe 21 and the outer wall, and a sealing assembly is provided in the gap. The sealing assembly includes a sealing strip 51 and a sealant 52. The sealing strip 51 is provided at the edge where the liquid pipe 21 contacts the outer wall, and the sealant 52 is filled in the gap between the liquid pipe 21 and the outer wall to prevent leakage of the coolant when flowing in the liquid pipe 21.

[0049] In this embodiment, a sealing assembly is provided between the liquid pipe 21 and the outer wall to ensure tightness when the coolant flows within the liquid pipe 21 and prevent leakage. The sealing assembly includes a sealing strip 51 and a sealant 52. The sealing strip 51 is provided at the edge where the liquid pipe 21 contacts the outer wall, and the sealant 52 fills the gap between the liquid pipe 21 and the outer wall. The sealing strip 51 provides an initial seal to prevent large particles of impurities from entering the gap, while the sealant 52 fills the tiny gaps that the sealing strip 51 cannot cover, ensuring a complete seal between the liquid pipe 21 and the outer wall. This double sealing design improves system reliability and extends the service life of the equipment. In actual application, the maintenance and replacement of the sealing assembly is also relatively simple. If the sealing strip 51 or sealant 52 is found to be aged or damaged, they can be easily replaced without disassembling the entire liquid pipe 21 system. In addition, the material selection of the sealing assembly is also very important. Corrosion-resistant, high-temperature-resistant, and high-pressure-resistant materials are generally selected to adapt to the operating conditions of the liquid cooling system in different environments. In another embodiment, a pre-tightening device, such as a spring 45 or a bolt, is provided between the sealing strip 51 and the sealant 52 to ensure that the sealing assembly can still maintain a good sealing effect when the pressure in the liquid pipeline 21 changes. The pre-tightening device can effectively compensate for the relaxation of the sealing assembly caused by temperature changes or long-term use, thereby ensuring the long-term stable operation of the system.

[0050] In one embodiment, the inner wall of the cabinet 1 is also provided with a liquid inlet component, which includes a plunger pump 53 and a filter 54. The first liquid channel is provided with a liquid inlet 55 corresponding to the plunger pump 53. The plunger pump 53 and the filter 54 are movably connected, and the liquid outlet of the plunger pump 53 is connected to the liquid inlet 55.

[0051] In this embodiment, the inner wall of the cabinet 1 is provided with a liquid inlet assembly comprising a plunger pump 53 and a filter 54. The first liquid channel is provided with a liquid inlet 55 corresponding to the plunger pump 53. The plunger pump 53 and the filter 54 are movably connected, with the liquid outlet of the plunger pump 53 communicating with the liquid inlet 55. The liquid inlet assembly is designed to ensure a continuous supply and purification of coolant to maintain efficient operation of the liquid cooling system. The plunger pump 53 draws coolant from the reservoir and delivers it to the liquid cooling channel. The reciprocating motion of the piston generates suction and pressure, thereby achieving coolant delivery. The plunger pump 53 is highly efficient and reliable, adapting to the flow and pressure requirements of various operating conditions. The filter 54 is used to remove impurities and particles from the coolant, preventing them from entering the liquid cooling channel and potentially affecting cooling efficiency or damaging components within the system. The filter 54 typically utilizes multiple layers of filter media, effectively intercepting particles of varying sizes to ensure coolant purity. In practice, the filter 54 requires regular cleaning or replacement to maintain its filtering effectiveness. In practical applications, the liquid inlet assembly can effectively cope with the space limitations of different server rooms, allowing the liquid cooling system to be flexibly installed in a variety of different environments.

[0052] In one embodiment, a liquid collecting channel 61 is provided at the bottom of the cabinet 1, and the liquid collecting channel 61 is used to collect the cooling liquid flowing out of the liquid cooling channel. The liquid collecting channel 61 includes a vertical return pipe 62, and the return pipe 62 is connected to the filter 54 of the liquid inlet component through a return pump.

[0053] In this embodiment, a liquid collecting channel 61 is provided at the bottom of the cabinet 1. The liquid collecting channel 61 is used to collect the coolant flowing out of the liquid cooling channel. The liquid collecting channel 61 includes a vertical return pipe 62. The return pipe 62 is connected to the filter 54 of the liquid inlet component through a return pump. The liquid collecting channel 61 enables the coolant to be effectively recovered and reused after completing the cooling task, thereby improving the efficiency and economy of the cooling system. The return pipe 62 transports the coolant from the liquid collecting channel 61 to the return pump, and the return pump then sends the coolant back to the filter 54 of the liquid inlet component to complete the coolant circulation process. In actual applications, the design of the liquid collecting channel 61 also takes into account anti-leakage and anti-overflow measures. For example, an overflow port can be provided at the bottom of the liquid collecting channel 61. When there is too much coolant, the excess coolant can be discharged through the overflow port, avoiding the risk of coolant overflowing the cabinet. In addition, the inner wall of the liquid collecting channel 61 is usually coated with rust-proof material to prevent the coolant from corroding metal parts. Reflux pumps can be made of corrosion-resistant materials and have certain overload protection functions to cope with possible abnormal situations. In actual applications, reflux pumps are also relatively simple to maintain and replace. If the pump body is found to be worn or the seals are aged, they can be quickly replaced to ensure stable operation of the system.

[0054] In one embodiment, the cabinet 1 includes a top plate 11 , and the inner wall of the top plate 11 is provided with heat sinks 71 . The heat sinks 71 are used to transfer heat absorbed by the liquid cooling device to the air to achieve a cooling effect.

[0055] In this embodiment, the cabinet 1 includes a top plate 11, the inner wall of which is provided with heat sinks 71. The heat sinks 71 are used to transfer heat absorbed by the liquid cooling device to the air to achieve a cooling effect. The heat sinks 71 on the top plate 11 are designed to improve the heat dissipation efficiency of the liquid cooling system, allowing heat to be quickly absorbed from the liquid cooling channel and transferred to the air. The heat sinks 71 can be made of a highly thermally conductive material, such as aluminum or copper, and have a large surface area to increase the contact area with the air, avoid heat stagnation, and thus improve the overall heat dissipation effect. In another embodiment, the top plate 11 of the cabinet 1 can also integrate heat pipes to improve heat dissipation efficiency. Heat pipe technology uses the phase change of the working fluid during evaporation and condensation to transfer heat, thereby achieving cooling.

[0056] In one embodiment, the heat dissipation assembly includes a fan 72 and a heat dissipation fan 72 bracket. The fan 72 bracket is fixed to the inner wall of the cabinet 1. The fan 72 is arranged on the fan 72 bracket. The fan 72 is used to discharge heat inside the cabinet 1.

[0057] In this embodiment, the heat dissipation assembly includes a fan 72 and a heat dissipation fan 72 bracket. The fan 72 bracket is fixed to the inner wall of the cabinet 1, and the fan 72 is mounted on the fan 72 bracket. The fan 72 is used to dissipate heat from the interior of the cabinet 1. The fan 72 enhances air circulation within the cabinet 1, thereby improving heat dissipation efficiency. The fan 72 bracket ensures that the fan 72 is stably installed within the cabinet 1, while allowing the fan 72 to be adjusted in different positions to accommodate different spaces and heat dissipation requirements. The fan 72 can use a high-efficiency, low-noise motor to ensure that while providing sufficient air volume, it does not cause excessive noise interference to the computer room environment. In actual application, the operation of the fan 72 can be controlled by a temperature sensor. When it is detected that the temperature inside the cabinet 1 exceeds a set threshold, the fan 72 automatically starts to ensure that the system operates within a safe temperature range. In addition, the maintenance and replacement of the fan 72 are relatively simple. When the fan 72 is found to be damaged or its performance has degraded, it can be easily replaced without disassembling the entire cabinet 1.

[0058] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cooling server, characterized in that: include: A cabinet body, wherein a plurality of mounting racks are provided inside the cabinet body, wherein the mounting racks are used to fix the server motherboard, and wherein the outer walls of the mounting racks are provided with liquid pipes, and the liquid pipes are arranged around the circumference of the outer walls of the mounting racks; The liquid cooling channel includes a first liquid cooling channel and a second liquid cooling channel, the first liquid cooling channel and the second liquid cooling channel are respectively arranged at the top and bottom of the cabinet and surround the mounting rack, the first liquid cooling channel and the second liquid cooling channel are connected by a plurality of vertical connecting pipes, and a vertical track is provided on a side of the liquid cooling channel away from the mounting rack, the vertical track is fixedly connected to the cabinet so that the first liquid cooling channel and the second liquid cooling channel can slide up and down along the vertical track; a conducting pipe, the conducting pipe connecting opposite sides of the first liquid-cooling channel, a receiving groove for receiving the conducting pipe provided on a side of the first liquid-cooling channel, the conducting pipe being slidable via a horizontal track provided on the first liquid-cooling channel and being slidable to the receiving groove, the conducting pipe being provided with a connecting port corresponding to the liquid pipeline, so that the liquid pipeline is connected to the connecting port of the conducting pipe when docked; a telescopic assembly, the telescopic assembly being used to adjust the length of the vertical connecting pipe to accommodate a relative height difference between the first liquid cooling channel and the second liquid cooling channel when the liquid cooling channel slides up and down along the vertical track; The telescopic assembly includes a telescopic rod and a telescopic sleeve. One end of the telescopic rod is fixedly connected to the first liquid cooling channel, and the other end is slidably connected to the telescopic sleeve. The telescopic sleeve is fixedly connected to the second liquid cooling channel. A spring is provided between the telescopic rod and the telescopic sleeve. The spring provides elastic force between the telescopic rod and the telescopic sleeve to maintain the stability of the vertical connecting pipe during the telescopic process.

2. The liquid cooling server according to claim 1, characterized in that: It also includes a sliding connection component, the first liquid cooling channel and the second liquid cooling channel slide along the vertical track, the sliding parts of the first liquid cooling channel and the second liquid cooling channel are provided with sliders, the sliders are slidably connected to the vertical track through guide grooves, and positioning pins are provided in the guide grooves, and the relative positions of the liquid cooling channels on the vertical track are fixed by the positioning pins cooperating with the holes in the guide grooves.

3. The liquid cooling server according to claim 1, characterized in that: It also includes a diverter, which is arranged inside the liquid cooling channel and fixedly connected to the inner wall of the liquid cooling channel. The flow channel of the diverter is connected to the inlet of the liquid cooling channel through a threaded joint. The flow channel of the diverter is provided with a regulating valve so that the regulating valve changes the flow path of the coolant.

4. The liquid cooling server according to claim 1, characterized in that: It also includes a bubble separator, which has a grid structure inside. The bubble separator is arranged at the entrance of the liquid cooling channel and is used to separate bubbles in the cooling liquid.

5. The liquid cooling server according to claim 1, characterized in that: There is a gap between the liquid pipeline and the outer wall, and a sealing component is arranged in the gap. The sealing component includes a sealing strip and a sealant. The sealing strip is arranged at the edge where the liquid pipeline contacts the outer wall, and the sealant is filled in the gap between the liquid pipeline and the outer wall to prevent leakage of the coolant when flowing in the liquid pipeline.

6. The liquid cooling server according to claim 1, characterized in that: The inner wall of the cabinet is also provided with a liquid inlet component, which includes a plunger pump and a filter. The first liquid cooling channel is provided with a liquid inlet corresponding to the plunger pump. The plunger pump and the filter are movably connected, and the liquid outlet of the plunger pump is connected to the liquid inlet.

7. The liquid cooling server according to claim 6, characterized in that: A liquid collecting channel is provided at the bottom of the cabinet, and the liquid collecting channel is used to collect the cooling liquid flowing out of the liquid cooling channel. The liquid collecting channel includes a vertical return pipe, and the return pipe is connected to the filter of the liquid inlet component through a return pump.

8. The liquid cooling server according to claim 1, characterized in that: The cabinet includes a top plate, and the inner wall of the top plate is provided with heat sinks, and the heat sinks are used to transfer heat absorbed by the liquid cooling device to the air to achieve a cooling effect.

9. The liquid cooling server according to claim 1, characterized in that: It also includes a heat dissipation component, which includes a fan and a heat dissipation fan bracket. The fan bracket is fixed to the inner wall of the cabinet, and the fan is arranged on the fan bracket. The fan is used to discharge the heat inside the cabinet.

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