A power adjustable wafer cooling device with local temperature control feedback

Abstract

The present invention relates to the field of semiconductor technology, and specifically to a power-adjustable wafer cooling device with local temperature control feedback. The wafer cooling device includes a mounting frame, a carrying mechanism, and a cooling component. The cooling component is arranged at the rear end of the mounting frame, and the cooling component is connected to an external air-cooling system through an air pipe. Compared with the current wafer cooling device, the present invention reduces the through-hole spacing at the lower part of the cooling pipeline by the same ratio as that at the upper part, thereby achieving the purpose of accelerating cooling, reducing the cooling time of the wafer, and reducing the risk of wafer oxidation. At the same time, the present invention is also provided with several groups of carrying mechanisms. When several groups of carrying mechanisms rotate in the mounting frame, on the one hand, the temperature measuring component on the fixing frame can detect the temperature of each area of the wafer, so as to facilitate the staff to adjust the flow rate and temperature of the high-purity nitrogen gas transported into the cooling component by the external air-cooling system in real time. On the other hand, it can also ensure the cooling uniformity of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and specifically to a power-adjustable wafer cooling device with local temperature control feedback. Background Art

[0002] In the semiconductor industry, since the furnace tube equipment is a high-temperature equipment and has the characteristic of a large number of wafers in a single process, wafers often need to wait for 40 - 60 minutes in the equipment loading area. At this time, there is a high risk of oxidation on the wafer surface. To ensure the quality of the wafers, some factories will set up wafer cooling devices to cool the wafers.

[0003] For example, the patents "Publication No. CN115440613A Wafer Cooling Device" and "Publication No. CN114383426A Cooling Device, Cooling System and Diffusion Furnace Tube Device" disclose a technical solution for wafer cooling. However, the existing wafer cooling devices still have disadvantages such as slow cooling speed and limited usage scenarios. At the same time, during the cooling process, the staff cannot obtain the temperature changes of each area of each wafer in real time, and cannot adjust the flow rate and temperature of the cooling gas in time, resulting in low cooling efficiency and a large amount of resource waste. Finally, the current wafer cooling devices are difficult to ensure that the cooling speeds of each area of the wafer are consistent, which may affect the wafer quality. Summary of the Invention

[0004] The purpose of the present invention is to provide a power-adjustable wafer cooling device with local temperature control feedback to solve the problems raised in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A power-adjustable wafer cooling device with local temperature control feedback, the wafer cooling device includes a mounting frame, a carrying mechanism and a cooling component. The cooling component is arranged at the rear end of the mounting frame. The cooling component is connected to an external air-cooling system through an air pipe, and high-purity nitrogen is transported into the cooling component through the external air-cooling system. A number of carrying grooves are arranged on the inner wall of the mounting frame, and a set of carrying mechanisms are arranged in each set of carrying grooves. The wafers are carried by the carrying mechanisms. When a number of wafers are placed on a number of carrying mechanisms, high-purity nitrogen will flow out of the cooling component, and then cool the wafers on the carrying mechanisms. Finally, the present invention is provided with a set of fixing frames below each set of carrying grooves, and a number of temperature measuring components are arranged above each set of fixing frames. The different areas of different wafers are measured at fixed points through the number of temperature measuring components, so as to facilitate the staff to adjust the flow rate and temperature of the high-purity nitrogen transported into the cooling component by the external air-cooling system in real time.

[0006] Further, the cooling assembly includes cooling pipelines, elbow compression fittings, and T-shaped compression fittings. There are four cooling pipelines, three elbow compression fittings, and five T-shaped compression fittings. The four cooling pipelines form a closed pipeline through the three elbow compression fittings and five T-shaped compression fittings. One of the T-shaped compression fittings is connected to an external air-cooling system through a ventilation pipe.

[0007] Further, several groups of through holes are provided on each cooling pipeline. The distance between several groups of through holes gradually decreases from bottom to top. Compared with the current wafer cooling device, the present invention reduces the distance between the through holes at the lower part of the cooling pipeline compared with the upper part of the through holes, thereby achieving the purpose of accelerating cooling, reducing the cooling time of the wafer in the equipment, reducing the risk of wafer oxidation, and improving the working efficiency of the equipment.

[0008] Further, a transmission box and a power box are provided on the outer side of the mounting frame. A transmission mechanism is provided in the transmission box, and a power mechanism is provided in the power box. The power mechanism is connected to several groups of bearing mechanisms through the transmission mechanism. In the present invention, several groups of fixing frames are fixedly connected to the inner wall of the mounting frame. The several groups of bearing mechanisms are controlled to rotate in the mounting frame through the power mechanism and the transmission mechanism. When the bearing mechanism rotates in the mounting frame, on the one hand, the temperature measuring component on the fixing frame can detect the temperature of each area of the wafer, thereby increasing the detection range and facilitating the staff to know the temperature changes of each local area of the wafer. On the other hand, when the bearing mechanism rotates with the wafer, it can avoid inconsistent cooling of each area of the wafer and ensure the cooling uniformity of the wafer. Finally, the present invention can enhance the fluidity of high-purity nitrogen by controlling the rotation speed of the bearing mechanism, thereby improving the cooling effect.

[0009] Further, the bearing mechanism includes a bearing ring, a reversing gear, and a slider. The reversing gear and the slider are sequentially arranged below the bearing ring. A guide groove is provided below the bearing groove, and a sliding groove is provided in the guide groove. The slider is matched with the sliding groove.

[0010] Further, a groove is provided at the side end of the bearing ring. A movable block is provided at the upper end of the groove, and a first electromagnet is provided at the lower end of the groove. The movable block is movably installed in the groove through a first compression spring. One end of the movable block close to the first electromagnet has magnetism.

[0011] Furthermore, the transmission mechanism includes transmission gears, fixed seats, and transmission rods. The power mechanism includes a motor, a second power gear, and a first power gear. There are several groups of the transmission gears, and each group of the transmission gears is connected to a group of reversing gears. There are several groups of fixed seats arranged on the transmission rod, and the transmission rod is connected to several groups of transmission gears through several groups of fixed seats. The first power gear is arranged at the bottom end of the transmission rod, and the motor is connected to the first power gear through the second power gear. In the present invention, the upper surface of the bearing ring is flush with the bottom surface of the bearing groove, so that when the staff puts the wafer into the bearing groove, the wafer can be directly pushed onto the bearing ring. When the wafer moves onto the bearing ring, there will be a gap between the wafer and the movable block. At this time, the staff turns on the first electromagnet, and a magnetic field that attracts the movable block is generated by the first electromagnet. As the movable block moves downward, the gap between the wafer and the movable block will increase, and the pressure inside the wafer and the movable block will decrease accordingly. Under the action of the external atmospheric pressure, the wafer will be adsorbed onto the bearing ring, preventing the wafer from shifting in position due to centrifugal force when the bearing mechanism rotates with the wafer. Finally, when the wafer is cooled, the motor drives the transmission rod and several groups of transmission gears to rotate through the second power gear and the first power gear, and several groups of bearing mechanisms are driven to rotate through several groups of transmission gears. On the one hand, it is convenient for the wafer to be cooled evenly in each area, and on the other hand, it is convenient for the staff to monitor the temperature of each area of the wafer. Finally, the fluidity of the high-purity nitrogen is enhanced, thereby improving the cooling effect.

[0012] Furthermore, a telescopic groove is arranged inside the fixed seat. A positioning groove is arranged at one end of the transmission gear close to the telescopic groove. A second electromagnet, a positioning frame, and a positioning block are arranged inside the telescopic groove. The positioning frame is movably installed in the telescopic groove through a second compression spring. The positioning block is arranged at one end of the positioning frame close to the positioning groove, and the positioning block is matched with the positioning groove. One end of the positioning frame close to the second electromagnet has magnetism. When the present invention is working normally, the second electromagnet will generate a magnetic field that attracts the positioning frame. Under the action of the magnetic field, the positioning frame is fastened to the second electromagnet, and the positioning block is inserted into the positioning groove, thereby ensuring that the transmission gear is fixed to the fixed seat, and the power generated by the motor can be transmitted to the bearing mechanism. If a certain group of transmission gears is stuck due to debris or other reasons and cannot rotate during the working process, the staff can disconnect the second electromagnet that cooperates with this group of transmission gears. At this time, under the action of the second compression spring, the positioning frame and the positioning block that cooperate with this group of transmission gears will move away from this group of transmission gears, thereby ensuring that the transmission rod can rotate normally without being hindered by this group of transmission gears. Through the above technical solution, when a certain group of bearing mechanisms and transmission gears in the present invention fail, other bearing mechanisms and transmission gears can still work normally, thereby ensuring the durability of the present invention.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] 1. Compared with the currently used wafer cooling device, the present invention reduces the through-hole spacing at the lower part of the cooling pipeline compared with the upper through-hole spacing, thereby achieving the purpose of accelerating cooling, reducing the cooling time of the wafer in the device, reducing the risk of wafer oxidation, and improving the working efficiency of the device;

[0015] 2. The present invention is provided with several groups of bearing mechanisms to cool different wafers synchronously, improve the cooling efficiency. At the same time, a set of fixing frames are arranged below each group of bearing mechanisms, and several groups of temperature measuring components are arranged above each group of fixing frames. The power mechanism and the transmission mechanism are used to control the rotation of several groups of bearing mechanisms in the mounting frame. When several groups of bearing mechanisms rotate in the mounting frame, on the one hand, the temperature measuring components on the fixing frames can detect the temperature of each area of the wafer, which is convenient for the staff to know the temperature changes of each local area of the wafer, and then adjust the flow rate and temperature of the high-purity nitrogen gas conveyed by the external air-cooling system into the cooling component in real time. On the other hand, when the bearing mechanism rotates with the wafer, it can avoid inconsistent cooling of each area of the wafer, ensuring the cooling uniformity of the wafer. Finally, by controlling the rotation speed of the bearing mechanism, the present invention can enhance the fluidity of the high-purity nitrogen gas, thereby improving the cooling effect;

[0016] 3. The present invention is also provided with a second electromagnet, a positioning frame and a positioning block. During normal operation, the second electromagnet can ensure that the transmission gear is fixed to the fixed seat, ensuring that the power generated by the motor can be transmitted to the bearing mechanism. If a certain group of transmission gears is stuck due to debris or other reasons and cannot rotate during the working process, the staff can disconnect the second electromagnet cooperating with this group of transmission gears. At this time, the positioning frame and the positioning block cooperating with this group of transmission gears will move away from this group of transmission gears, so that the transmission rod can rotate normally without being hindered by this group of transmission gears. Compared with the current wafer cooling device, when a certain group of bearing mechanisms and transmission gears in the present invention fail, other bearing mechanisms and transmission gears can still work normally, thus ensuring the durability of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 is a schematic diagram of the structure of the cooling component of the present invention;

[0019] Figure 3 is a schematic diagram of several groups of bearing mechanisms of the present invention;

[0020] Figure 4 is a cross-sectional view of the bearing mechanism of the present invention;

[0021] Figure 5 For the present invention Figure 4 Schematic diagram of the structure of part A in

[0022] Figure 6 Schematic diagram of the connection structure between the bearing mechanism and the transmission mechanism of the present invention;

[0023] Figure 7 Schematic diagram of the power mechanism and the transmission mechanism of the present invention;

[0024] Figure 8 Schematic diagram of the internal structure of the fixed seat of the present invention.

[0025] In the figure: 1. Mounting frame; 11. Bearing groove; 12. Guide groove; 2. Bearing mechanism; 21. Bearing ring; 211. Movable block; 212. First electromagnet; 22. Reversing gear; 23. Slide block; 3. Wafer; 4. Cooling assembly; 41. Cooling pipeline; 42. Right-angle ferrule joint; 43. T-shaped ferrule joint; 5. Vent pipe; 6. Transmission box; 61. Transmission gear; 62. Fixed seat; 621. Telescopic groove; 622. Second electromagnet; 623. Positioning frame; 624. Positioning block; 63. Transmission rod; 64. First power gear; 7. Power box; 71. Motor; 72. Second power gear; 8. Fixed frame; 81. Temperature measuring assembly. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Embodiment: As Figures 1 - 3As shown in the figure, the present invention provides a technical solution for a power-adjustable wafer cooling device with local temperature control feedback. The wafer cooling device includes a mounting frame 1, a carrying mechanism 2, and a cooling component 4. The cooling component 4 is arranged at the rear end of the mounting frame 1. The cooling component 4 is connected to an external air-cooling system through an air pipe 5. High-purity nitrogen is conveyed into the cooling component 4 by the external air-cooling system. A number of carrying grooves 11 are arranged on the inner wall of the mounting frame 1. A set of carrying mechanisms 2 is arranged in each set of carrying grooves 11. The wafers 3 are carried by the carrying mechanisms 2. After a number of wafers 3 are placed on a number of carrying mechanisms 2, high-purity nitrogen will flow out of the cooling component 4, and then cool the wafers 3 on the carrying mechanisms 2. By setting multiple sets of carrying mechanisms 2, the present invention can cool different wafers synchronously, thereby improving the cooling efficiency. Finally, a set of fixing frames 8 is arranged below each set of carrying grooves 11, and a number of temperature measuring components 81 are arranged above each set of fixing frames 8. The different areas of different wafers 3 are measured at fixed points by the number of temperature measuring components 81, so as to facilitate the staff to adjust the flow rate and temperature of the high-purity nitrogen conveyed into the cooling component 4 by the external air-cooling system in real time.

[0028] As Figures 1 - 2 shown, the cooling component 4 includes a cooling pipeline 41, a right-angle ferrule joint 42, and a T-shaped ferrule joint 43. There are four cooling pipelines 41, three right-angle ferrule joints 42, and five T-shaped ferrule joints 43. The four cooling pipelines 41 form a closed pipeline through three right-angle ferrule joints 42 and five T-shaped ferrule joints 43. One of the T-shaped ferrule joints 43 is connected to the external air-cooling system through an air pipe 5.

[0029] As Figures 1 - 2 shown, a number of through holes are arranged on each cooling pipeline 41, and the spacing between the number of through holes gradually decreases from bottom to top.

[0030] Considering the phenomenon of hot air rising, compared with the currently used wafer cooling device, the present invention reduces the through-hole spacing at the lower part of the cooling pipeline 41 compared with the upper through-hole spacing, so as to achieve the purpose of accelerating cooling, thereby reducing the cooling time of the wafer 3 in the equipment, reducing the risk of oxidation of the wafer 3, and improving the working efficiency of the equipment.

[0031] As Figure 1 、 Figure 3 and Figure 7As shown in the figure, a transmission box 6 and a power box 7 are arranged on the outer side of the mounting bracket 1. A transmission mechanism is arranged in the transmission box 6, and a power mechanism is arranged in the power box 7. The power mechanism is connected to a plurality of groups of bearing mechanisms 2 through the transmission mechanism. In the present invention, a plurality of groups of fixing brackets 8 are fixedly connected to the inner wall of the mounting bracket 1. The plurality of groups of bearing mechanisms 2 are controlled to rotate in the mounting bracket 1 through the power mechanism and the transmission mechanism. When the bearing mechanism 2 rotates in the mounting bracket 1, on the one hand, the temperature measuring component 81 on the fixing bracket 8 can detect the temperature of each area of the wafer 3, thereby increasing the detection range and facilitating the staff to know the temperature change of each local area of the wafer 3. On the other hand, when the bearing mechanism 2 rotates with the wafer 3, it can avoid inconsistent cooling of each area of the wafer 3 and ensure the cooling uniformity of the wafer 3. Finally, in the present invention, by controlling the rotation speed of the bearing mechanism 2, the fluidity of high-purity nitrogen can be enhanced, thereby improving the cooling effect.

[0032] As Figure 1 , Figures 3 - 6 shown, the bearing mechanism 2 includes a bearing ring 21, a reversing gear 22 and a slider 23. The reversing gear 22 and the slider 23 are arranged below the bearing ring 21 in sequence. A guide groove 12 is arranged below the bearing groove 11, and a sliding groove is arranged in the guide groove 12. The slider 23 is matched with the sliding groove.

[0033] As Figure 1 , Figures 3 - 6 shown, a groove is arranged at the side end of the bearing ring 21. An active block 211 is arranged at the upper end of the groove, and a first electromagnet 212 is arranged at the lower end of the groove. The active block 211 is movably installed in the groove through a first compression spring. One end of the active block 211 close to the first electromagnet 212 has magnetism.

[0034] As Figure 1 , Figure 6 , Figure 7 shown, the transmission mechanism includes a transmission gear 61, a fixed seat 62 and a transmission rod 63. The power mechanism includes a motor 71, a second power gear 72 and a first power gear 64. A plurality of groups of transmission gears 61 are arranged. Each group of transmission gears 61 is connected to a group of reversing gears 22. A plurality of groups of fixed seats 62 are arranged on the transmission rod 63. The transmission rod 63 is connected to the plurality of groups of transmission gears 61 through the plurality of groups of fixed seats 62. The first power gear 64 is arranged at the bottom end of the transmission rod 63. The motor 71 is connected to the first power gear 64 through the second power gear 72.

[0035] In the present invention, the upper surface of the bearing ring 21 is flush with the bottom surface of the bearing groove 11, so that when the staff puts the wafer 3 into the bearing groove 11, the wafer 3 can be directly pushed onto the bearing ring 21. When the wafer 3 moves onto the bearing ring 21, there will be a gap between the wafer 3 and the movable block 211. At this time, the staff turns on the first electromagnet 212, and a magnetic field that attracts the movable block 211 is generated by the first electromagnet 212. As the movable block 211 moves downward, the gap between the wafer 3 and the movable block 211 will increase, and the pressure inside the wafer 3 and the movable block 211 will decrease accordingly. Under the action of the external atmospheric pressure, the wafer 3 will be adsorbed onto the bearing ring 21, preventing the wafer 3 from shifting in position due to centrifugal force when the bearing mechanism 2 rotates with the wafer 3. Finally, when the wafer 3 is cooled, the motor 71 drives the transmission rod 63 and several groups of transmission gears 61 to rotate through the second driving gear 72 and the first driving gear 64. The several groups of transmission gears 61 drive the several groups of bearing mechanisms 2 to rotate. On the one hand, it is convenient for the wafer 3 to be cooled evenly in each area, and on the other hand, it is convenient for the staff to monitor the temperature of each area of the wafer 3. Finally, the fluidity of the high-purity nitrogen is enhanced, thereby improving the cooling effect.

[0036] As Figure 8 shown, a telescopic groove 621 is provided inside the fixed seat 62. One end of the transmission gear 61 close to the telescopic groove 621 is provided with a positioning groove. A second electromagnet 622, a positioning frame 623 and a positioning block 624 are provided inside the telescopic groove 621. The positioning frame 623 is movably installed in the telescopic groove 621 through a second compression spring ( Figure 8 the second compression spring in it is in an extended state), the positioning block 624 is arranged at one end of the positioning frame 623 close to the positioning groove, the positioning block 624 cooperates with the positioning groove, and one end of the positioning frame 623 close to the second electromagnet 622 has magnetism.

[0037] When the present invention is working normally, the second electromagnet 622 generates a magnetic field that attracts the positioning frame 623. Under the action of the magnetic field, the positioning frame 623 is fastened to the second electromagnet 622, and the positioning block 624 is inserted into the positioning groove, thereby ensuring that the transmission gear 61 is fixed to the fixed seat 62, and the power generated by the motor 71 can be transmitted to the bearing mechanism 2. If a certain group of transmission gears 61 is stuck due to debris or other reasons and cannot rotate during the working process, the staff can disconnect the second electromagnet 622 that cooperates with this group of transmission gears 61. At this time, under the action of the second compression spring, the positioning frame 623 and the positioning block 624 that cooperate with this group of transmission gears 61 will move away from this group of transmission gears 61, thereby ensuring that the transmission rod 63 can rotate normally without being blocked by this group of transmission gears 61. Through the above technical solutions, when a certain group of bearing mechanisms 2 and transmission gears 61 in the present invention fail, other bearing mechanisms 2 and transmission gears 61 can still work normally, thereby ensuring the durability of the present invention.

[0038] Working principle of the present invention: Before working, first place the wafer 3 into the carrier slot 11, and then push the wafer 3 onto the carrier ring 21. When the wafer 3 moves onto the carrier ring 21, turn on the first electromagnet 212, and drive the movable block 211 to move downward through the first electromagnet 212, so that the wafer 3 is adsorbed onto the carrier ring 21. Then turn on the motor 71 and the external air-cooling system, and deliver high-purity nitrogen gas to the cooling component 4 through the external air-cooling system, thereby cooling the wafer 3 on the carrier mechanism 2. The motor 71 drives the transmission rod 63 and several groups of transmission gears 61 to rotate through the second driving gear 72 and the first driving gear 64, and drives several groups of carrier mechanisms 2 to rotate through several groups of transmission gears 61. On the one hand, it is convenient for the cooling of each area of the wafer 3 to be uniform, and on the other hand, it is convenient for the staff to monitor the temperature of each area of the wafer 3, and then adjust the flow rate and temperature of the high-purity nitrogen gas delivered to the cooling component 4 by the external air-cooling system in real time. Finally, the fluidity of the high-purity nitrogen gas is enhanced, thereby improving the cooling effect.

[0039] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A power adjustable wafer cooling device with local temperature control feedback, characterized in that: The wafer cooling device comprises a mounting frame (1), a bearing mechanism (2) and a cooling assembly (4); the cooling assembly (4) is arranged at the rear end of the mounting frame (1); the cooling assembly (4) is connected to an external air cooling system via a ventilation pipe (5); a plurality of groups of bearing grooves (11) are arranged on the inner wall of the mounting frame (1); a group of bearing mechanisms (2) are arranged in each group of the bearing grooves (11); a group of fixing frames (8) are arranged below each group of the bearing grooves (11); and a plurality of groups of temperature measuring assemblies (81) are arranged above each group of the fixing frames (8); A transmission box (6) and a power box (7) are arranged outside the mounting frame (1); a transmission mechanism is arranged inside the transmission box (6); a power mechanism is arranged inside the power box (7); and the power mechanism is connected to a plurality of groups of bearing mechanisms (2) via the transmission mechanism; The transmission mechanism comprises a transmission gear (61) and a transmission rod (63); the power mechanism comprises a motor (71); the transmission gear (61) is provided with a plurality of groups, each group of the transmission gear (61) is connected to a group of reversing gears (22); a plurality of groups of fixing seats (62) are provided on the transmission rod (63); the transmission rod (63) is connected to a plurality of groups of transmission gears (61) via the plurality of fixing seats (62); a first power gear (64) is provided at the bottom end of the transmission rod (63); and the motor (71) is connected to the first power gear (64) via the second power gear (72); A telescopic slot (621) is provided inside the fixing seat (62); a positioning slot is provided at one end of the transmission gear (61) close to the telescopic slot (621); a second electromagnet (622), a positioning frame (623) and a positioning block (624) are provided inside the telescopic slot (621); the positioning frame (623) is movably mounted in the telescopic slot (621) via a second compression spring; the positioning block (624) is provided at one end of the positioning frame (623) close to the positioning slot; and the positioning block (624) cooperates with the positioning slot.

2. The power adjustable wafer cooling device with local temperature control feedback according to claim 1, characterized in that: The cooling assembly (4) comprises a cooling pipeline (41), a right-angled ferrule joint (42) and a T-shaped ferrule joint (43); four cooling pipelines (41) are provided, three right-angled ferrule joints (42) are provided, and five T-shaped ferrule joints (43) are provided; the four cooling pipelines (41) form a closed pipeline through the three right-angled ferrule joints (42) and the five T-shaped ferrule joints (43).

3. The power adjustable wafer cooling device with local temperature control feedback according to claim 2, characterized in that: Each cooling pipeline (41) is provided with a plurality of groups of through holes, and the spacing between the plurality of groups of through holes gradually decreases from bottom to top.

4. The power adjustable wafer cooling device with local temperature control feedback according to claim 1, characterized in that: The bearing mechanism (2) comprises a bearing ring (21), a reversing gear (22) and a sliding block (23); the reversing gear (22) and the sliding block (23) are arranged below the bearing ring (21) in sequence; the upper surface of the bearing ring (21) is flush with the bottom surface of the bearing groove (11); a guide groove (12) is arranged below the bearing groove (11); a slide groove is arranged in the guide groove (12); and the sliding block (23) cooperates with the slide groove.

5. The power adjustable wafer cooling device with local temperature control feedback according to claim 4, characterized in that: A groove is provided at the side end of the bearing ring (21), a movable block (211) is provided at the upper end of the groove, a first electromagnet (212) is provided at the lower end of the groove, and the movable block (211) is movably mounted in the groove via a first compression spring.

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