A detection method of a detection device and the detection device

Abstract

The application provides a detection method of a detection device and the detection device. The detection method comprises the following steps: performing coarse alignment on a to-be-detected object by using a mechanical alignment module, so that an alignment mark on a surface of the to-be-detected object is located in a field of view of an optical alignment module; and after the coarse alignment, performing fine alignment on the to-be-detected object by using the optical alignment module, so that the to-be-detected object is in a predetermined position. Before a substrate is detected, the direction of the substrate can be adjusted by the mechanical alignment module, the optical alignment module and a bearing table, so that the long side direction of the substrate is consistent with the motion direction of the bearing table, that is, both are the first direction, thereby reducing the missed detection of the full detection module and effectively improving the detection accuracy.

Description

[0001] This application is a divisional application of Chinese patent application entitled "A detection method, an alignment method for a detection device and a detection device", with patent application number 201910944507.5 and filing date of September 30, 2019. Technical Field

[0002] This application belongs to the field of display panel testing technology, and in particular relates to a testing method and testing equipment for a testing device. Background Technology

[0003] Currently, with technological advancements, OLEDs are increasingly used in high-end display devices due to their advantages such as thinner and lighter design, higher brightness, lower power consumption, faster response time, higher resolution, greater flexibility, and higher luminous efficiency. However, the high quality requirements for OLEDs necessitate defect detection of the OLED substrate during the production process to ensure product quality and yield. Given the large size of OLEDs, improving the detection speed and accuracy of OLED substrates is a pressing issue that needs to be addressed. Summary of the Invention

[0004] The purpose of this application is to overcome the shortcomings of the prior art and provide a detection method and detection equipment for a detection device, which aims to solve the problem of low detection accuracy of existing display substrates.

[0005] This invention proposes a detection method for a detection device, the detection device comprising a mechanical alignment module and an optical alignment module, and the detection method comprising the following steps:

[0006] The mechanical alignment module is used to coarsely align the object under test, the surface of which has alignment marks, and the alignment marks are located in the field of view of the optical alignment module.

[0007] After the coarse alignment, the optical alignment module is used to perform fine alignment on the object under test, so that the object under test is in a predetermined position.

[0008] Optionally, the testing equipment includes a support platform with a support area for supporting the object to be tested; the mechanical alignment module includes a plurality of alignment rollers disposed around the support area.

[0009] The step of using the mechanical alignment module to coarsely align the object under test, so that the alignment mark is located in the field of view of the optical alignment module, includes the following sub-steps:

[0010] The alignment roller is moved toward the object to be tested until it reaches a preset position and clamps the outer edge of the object to be tested.

[0011] Optionally, the optical alignment module includes at least one optical alignment probe, and the alignment mark set includes at least two standard points. After the coarse alignment, the optical alignment module is used to perform fine alignment on the object under test to place the object under test in a predetermined position, which includes the following sub-steps:

[0012] The alignment mark is photographed by the optical alignment probe to obtain an alignment image of the alignment mark;

[0013] The position information of the standard point is obtained based on the alignment image;

[0014] The positional deviation of the object under test is obtained based on the positional information of at least two standard points;

[0015] The test object is adjusted according to the positional deviation so that it is in a predetermined position.

[0016] Optionally, the number of optical alignment probes is multiple, including a first optical alignment probe and a second optical alignment probe; the alignment mark group includes a first alignment mark and a second alignment mark;

[0017] Obtaining the position information of the standard point based on the alignment image includes: obtaining the first position information of the center of the first alignment mark based on the alignment image of the first alignment mark; and obtaining the second position information of the center of the second alignment mark based on the alignment image of the second alignment mark.

[0018] The positional deviation includes one or a combination of translational and rotational offsets of the object under test; obtaining the positional deviation of the object under test based on the positional information of at least two standard points includes: root

[0019] The translational offset of the object under test is obtained based on the offset between the first position information and the center of the field of view of the first optical alignment probe; and / or, the rotational offset of the object under test is obtained based on the first position information and the second position information.

[0020] Optionally, the step of adjusting the object to be tested according to the positional deviation to place the object to be tested in a predetermined position includes:

[0021] The required adjustment amount is obtained based on the positional deviation of the object under test;

[0022] The object to be tested is adjusted until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

[0023] The present invention also proposes a detection device, the detection device comprising:

[0024] Mechanical alignment module and optical alignment module;

[0025] The mechanical alignment module is configured to perform coarse alignment of the object under test, the surface of which has alignment marks, such that the alignment marks are located in the field of view of the optical alignment module.

[0026] After the optical alignment module is configured for coarse alignment, it is used to perform fine alignment on the object under test, so that the object under test is in a predetermined position.

[0027] Optionally, the device includes a support platform with a support area for supporting the object to be tested; the mechanical alignment module includes a plurality of alignment rollers disposed around the periphery of the support area; and a driving device for driving the alignment rollers to move toward the support area.

[0028] Optionally, the alignment mark group includes a first alignment mark and a second alignment mark; the number of optical alignment probes is multiple, including a first optical alignment probe and a second optical alignment probe, wherein the first optical alignment probe is used to capture an image of the first alignment mark, and the second optical alignment probe is used to capture an image of the second alignment mark.

[0029] The beneficial effects of the technical solution in this application are as follows: Since the testing equipment of this application is equipped with a mechanical alignment module and an optical alignment module, the orientation of the substrate can be adjusted by the mechanical alignment module, the optical alignment module, and the carrier stage before the substrate is tested, so that the long side direction of the substrate is consistent with the movement direction of the carrier stage, that is, both are the first direction, thereby reducing the missed detections of the full inspection module and effectively improving the testing efficiency.

[0030] The accuracy. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a top view of the overall structure of the detection device provided in the embodiments of this application;

[0033] Figure 2 This is a schematic diagram of the detection coverage area of ​​the re-inspection module of the detection equipment provided in this application embodiment;

[0034] Figure 3 This is a schematic diagram of the mechanical alignment module of the detection equipment provided in the embodiments of this application;

[0035] Figure 4This is a flowchart of the alignment method for the detection device provided in the embodiments of this application;

[0036] Figure 5 This is a flowchart of the coarse alignment method for the detection device provided in the embodiments of this application;

[0037] Figure 6 This is a schematic diagram of the structure of the optical alignment module of the detection device provided in the embodiments of this application;

[0038] Figure 7 This is a schematic diagram illustrating the precision alignment effect of the detection device provided in the embodiments of this application;

[0039] Figure 8 This is a flowchart of the optical alignment method for the detection device provided in the embodiments of this application;

[0040] Figure 9 This is a schematic diagram of the full inspection process of the detection method provided in the embodiments of this application;

[0041] Figure 10 This is a flowchart of the detection method provided in the embodiments of this application;

[0042] Figure 11 This is a flowchart of the re-inspection process of the detection method provided in the embodiments of this application;

[0043] Figure 12 This is a schematic diagram of the detection unit deflection correction process of the detection method provided in the embodiments of this application;

[0044] Figure 13 This is a schematic diagram of the start / end scan signal of the detection unit of the detection method provided in this application embodiment;

[0045] Figure 14 This is a schematic diagram of the combined scanning detection processing and re-inspection processing of the detection method provided in this application embodiment;

[0046] Figure 15 This is a schematic diagram of the screening process of the detection method provided in the embodiments of this application.

[0047] Explanation of icon numbers:

[0048] Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0050] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0051] It should also be noted that the directional terms such as left, right, up, and down in the embodiments of this application are only relative concepts or are based on the normal use state of the product, and should not be considered as restrictive.

[0052] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0053] In the description of this application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or position shown in the accompanying drawings.

[0054] The terms and conditions are used only for the purpose of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0055] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0056] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0057] This application provides a detection method and a detection device for implementing the detection method.

[0058] Please see Figure 9 , Figure 10 as well as Figure 14 In a preferred embodiment, this application proposes a detection method, comprising:

[0059] S1. Scan and detect the object under test to obtain defect information of the surface defects of the object under test;

[0060] S2. Based on the defect information, filter and process the defects to obtain the defects for re-inspection;

[0061] S3. Perform re-inspection processing on the re-inspection defects and obtain the re-inspection information of the re-inspection defects.

[0062] It should be noted that in this embodiment, the object to be tested is specifically the substrate 10 of the OLED display screen, and defects can be as follows: Figure 14 The star-shaped pattern in the image represents the defect information. This detection method involves first scanning and detecting the substrate 10 to obtain defect information, then filtering the defect information to obtain re-inspection defects, and finally re-inspecting these re-inspection defects. Through multiple scanning and re-inspection processes, this method aims to minimize missed detections and focus on re-inspecting the filtered defects, thereby improving the detection speed and accuracy of the substrate 10.

[0063] Furthermore, the process involves repeated scanning and detection of different test areas of the analyte, culminating in a re-inspection process.

[0064] Furthermore, after the initial scanning and detection of the sample, a first screening and re-inspection process is performed.

[0065] Furthermore, the second and subsequent scanning and detection processes are carried out in parallel with the re-inspection process, and scanning and detection processes are performed on the test area of ​​the test object.

[0066] For example, defects not detected in the first full scan can be combined with those detected in the second full scan for a joint defect value evaluation. This allows for the selection of defects to be re-inspected during the third full scan. In this way, all defects on the substrate 10 can be obtained through multiple repeated scans, effectively reducing missed detections and further improving detection accuracy. Moreover, parallel processing of the second and subsequent scans with re-inspection can also effectively improve detection efficiency.

[0067] Furthermore, after the test area of ​​the object under test has been scanned and inspected, the process also includes re-inspecting defects that were not previously re-inspected. For example, after the test area of ​​the object under test has been scanned and inspected, N partial re-inspection defects have been obtained. However, according to the preset re-inspection defect quantity index (the quantity is M, and M≥N), it is still necessary to re-scan the remaining defects for a quantity of MN. Specifically, this process will evaluate the defect value from the set of all unselected full inspection defects, and finally select MN globally optimal solutions. These solutions will then be sorted and re-inspected sequentially according to the fixed-point shooting mode of "movement-stopping-shooting" until all re-inspection defects have been photographed.

[0068] Please see Figures 1 to 3 The present invention also proposes a detection device, which includes:

[0069] A support platform (not shown) is used to support the object to be tested;

[0070] The full inspection module is used to scan the object under test to achieve scanning detection processing, obtain defect information of the surface defects of the object under test, and screen the defects according to the defect information to obtain the defects for re-inspection.

[0071] The re-inspection module is used to re-inspect defects; and,

[0072] A control system (not shown) is used to control the full inspection module and the re-inspection module to implement the detection method as described above.

[0073] The first translation stage (not shown) is used to drive the support stage to translate along the first direction.

[0074] The second translation stage 22 is used to move the full inspection module along a second direction, where the first and second directions are not parallel. Specifically, the first and second directions are perpendicular or have an acute angle between them.

[0075] The third mobile platform 23 is used to move the re-inspection module along a third direction, which is different from the first direction.

[0076] Specifically, in this embodiment, the third direction is the same as the second direction.

[0077] It should be noted that the first direction and the second direction have a first included angle. The object to be tested is a quadrilateral, including an intersecting first side and a second side, which have a second included angle equal to the first included angle. Furthermore, the testing equipment also includes a rotating stage, which drives a support platform to rotate around a rotation axis perpendicular to both the first and second directions. This ensures that the second included angle equals the first included angle, facilitating accurate subsequent testing. Specifically, the object to be tested can be a rectangular substrate 10, where both the first and second included angles are right angles. The first and second included angles can also be acute angles. Specifically, in the above testing method, the scanning detection process includes: translating the object to be tested along the first direction using a first translation stage, and then inspecting the object using a full inspection module.

[0078] After one scan and before the next scan and inspection process, the process also includes: moving the full inspection module a predetermined distance along the second direction.

[0079] Please see Figure 9 and Figure 14 In a preferred embodiment, the full inspection module includes multiple detection units 30. The field of view of each detection unit 30 is rectangular and includes an adjacent third side and a fourth side. The length of the third side is greater than or equal to that of the fourth side.

[0080] Here, multiple detection units 30 are evenly spaced along the second direction. Each detection unit 30 includes a full-scanning probe, which uses a linear array charge-coupled device (CCD) for scanning. Specifically, during a single scan, the stage provides low-delay start and end scan signals based on position information. Upon receiving the start scan signal, the full-scanning probes of each detection unit 30 continuously expose and output images until they receive the end scan signal and stop exposure. After the first full-scan detection process, i.e., the detection scan of the field of view PASS1 of the full-scanning probes of the detection unit 30, is completed, all full-scanning probes will move a predetermined distance along the second direction, i.e., simultaneously step to the position for the second full-scan detection process, change the scanning direction, and continue scanning to complete PASS2, and so on for PASS3 and PASS4, until all rounds of scanning are completed. This is beneficial for the integrity of the full-scanning and can minimize the occurrence of missed detections due to incomplete coverage. However, the specific number of detection units 30 and the field of view...

[0081] The size and number settings are related to the actual testing requirements.

[0082] To achieve better positioning accuracy, it is necessary to consider the impact of the delay in the initial signal acquisition on the image's positional information, the positioning error caused by the inconsistency in scanning directions between adjacent scan detection processes, and the positioning error caused by the positioning accuracy of the substrate 10 and the support stage itself. Therefore, furthermore, the detection areas of adjacent detection units 30 partially overlap; during the process of two adjacent scan detection processes, the field of view of the detection unit 30 partially overlaps in the second direction to correct the positional deviation during multiple scan detection processes. In other words, the field of view of all detection units 30 can be combined to cover the substrate 10 in the second direction, thereby minimizing missed detections and effectively improving detection accuracy. Since there may be angular deflection of the probe during the installation and debugging of the full-inspection scanning probe, the detection method also includes, before the scanning detection process, a second adjustment of the detection unit 30, so that the third side of the field of view of the detection unit 30 is perpendicular to the first direction, thus aligning the detection unit 30. Specifically, as follows... Figure 12 As shown in the figure, the dashed rectangle represents a detection unit 30. Each detection unit 30 has a different deflection angle. With the substrate 10 already aligned, the deflection angle can be calculated using the alignment marks on the substrate 10. Then, the assembly and adjustment mechanism of the detection unit 30 needs to be adjusted to align the detection unit 30.

[0083] like Figure 12 and Figure 13 As shown, different detection units 30 have a certain offset in the first direction, and this offset error will directly lead to the deviation of the starting position of the probe image. Due to the precision limitations of mechanical adjustment, it is further necessary to quantify the offset of the detection unit 30 in the first direction and perform position compensation through software algorithms. Therefore, before the scanning detection process, the detection method also includes:

[0084] Obtain the offset of the field of view of each detection unit 30 along the first direction;

[0085] Based on the offset, the movement range of the full inspection module along the first direction during the scanning and detection process is compensated.

[0086] Here, since there is an offset between each detection unit 30 in the first direction, in order to ensure that all detection units 30 can capture the complete substrate 10 in the first direction, the start and end scan signals of the stage need to comprehensively consider the positional relationship of each detection unit 30. For example, Figure 12 The middle arrow indicates the direction of movement of substrate 10. The left part indicates that the detection unit 30 is about to start scanning substrate 10, and the right part indicates that the detection unit 30 has just finished scanning substrate 10. The dashed line on the left indicates the position of the starting signal.

[0087] The dashed line on the right indicates the end signal position. As can be clearly seen from the diagram, the start signal position is based on the position of the detection unit 30 that first captured the area of ​​substrate 10, and the end signal position is based on the position of the detection unit 30 that last completed capturing the area of ​​substrate 10. For other probes, some invalid areas will be captured; these invalid areas will be selectively discarded based on their location information and will not be subject to defect detection analysis.

[0088] In a preferred embodiment, to ensure imaging quality and positioning accuracy, the following steps are included before the first scanning detection process of the object under test:

[0089] The position of the object to be measured is adjusted so that it rotates around the rotation axis, making the first side parallel to the first direction and the second side parallel to the second direction.

[0090] In the technical solution of this application, the defect information includes the location information of the defect;

[0091] Please see here. Figure 11 The process of re-inspecting defects and obtaining re-inspection information includes the following steps:

[0092] S31. Move the object to be tested along the first direction at a preset speed;

[0093] S32. Based on the location information of the re-inspection defects that have not undergone re-inspection processing, the preset speed, and the location of the re-inspection module, obtain the re-inspection path for each re-inspection defect;

[0094] S33. Determine the next defect to be re-inspected based on the re-inspection path, and designate it as the defect to be re-inspected.

[0095] S34. Based on the location information of the defect to be re-inspected, the re-inspection module is moved along a third direction and the defect to be re-inspected is re-inspected.

[0096] It is understandable that by processing information such as the location of the defect, the preset speed of the second translation stage 22 and the third moving platform 23, and the location of the re-inspection module, a simpler re-inspection path can be obtained, which will help improve the detection efficiency.

[0097] It should be specifically noted that the first direction is perpendicular to the second direction; the third direction is perpendicular to the first direction. Specifically, the substrate 10 is rectangular in shape and has two opposite long sides. The direction of the long sides is the length direction of the substrate 10. The direction in which the substrate 10 moves during detection is the first direction. The directions perpendicular to the first direction on the horizontal plane are the second and third directions. After the substrate 10 is aligned, the first direction...

[0098] The first direction is the length of the substrate 10, and the second direction is its width. Furthermore, the second translation stage 22 and the third moving platform 23 are both mounted on their respective gantry gates. The second translation stage 22, equipped with a full inspection module, is mounted on the middle gantry gate. The second translation stage 22 drives the full inspection module to translate along the second direction. A third moving platform 23 is mounted on each of the other two gantry gates on either side. Each third moving platform 23 is equipped with a re-inspection module, and the third moving platform 23 drives the re-inspection module to translate along the third direction. The first translation stage drives the support platform carrying the substrate 10 to translate relative to the full inspection module along the first direction. Specifically, as shown... Figure 9 and Figure 13 The solid rectangle in the diagram represents a complete area of ​​substrate 10, and the arrow direction indicates the scanning direction of one scan along the first direction. The multiple full-inspection scanning probes included in the full-inspection module have the same scanning direction in the same scan. Of course, the number of full-inspection scanning probes, the number of scans (i.e., the number of scans shown in the figure), and the coverage area of ​​one probe do not represent a true proportional relationship with the size of substrate 10; they are only for illustrative purposes.

[0099] Please see Figure 1 and Figure 2 The re-inspection module includes multiple re-inspection probes, and the movement range of the multiple re-inspection probes along the third direction does not overlap;

[0100] Before obtaining the re-inspection path for each re-inspection defect, the steps of re-inspecting the re-inspection defect and obtaining the re-inspection information of the re-inspection defect also include: assigning a re-inspection area to each re-inspection probe according to the movement range of multiple re-inspection probes, and re-inspecting the re-inspection defects in their respective re-inspection areas.

[0101] Obtaining the re-inspection path for each re-inspection defect includes: planning a re-inspection path for each re-inspection probe based on the location information of the re-inspection defect.

[0102] Specifically, such as Figure 2 As shown, the re-inspection module includes two re-inspection probes, namely a first re-inspection probe 41 and a second re-inspection probe 42. The re-inspection area allocated by the first re-inspection probe 41 covers the right side of the substrate 10, and the re-inspection area allocated by the second re-inspection probe 42 covers the left side of the substrate 10. The two re-inspection areas merge and cover the substrate 10 along the first direction, and their middle parts overlap. In this way, the detection efficiency can be improved and no missed detection will occur.

[0103] In this embodiment, multiple re-inspection probes are located on different gantry cranes, and the different gantry cranes are located along...

[0104] First direction arrangement.

[0105] It is understood that, in the technical solution of this application, since it includes at least two re-inspection modules, its re-inspection imaging efficiency is high. Moreover, through the operation control of the control system, it is also possible to simultaneously image two defects within a certain area. Here, each of the two re-inspection modules covers a portion of the area to be inspected on the substrate 10. Therefore, compared to a design where one re-inspection probe covers the entire area of ​​the substrate 10, the moving distance of the substrate 10 in the first direction of this application is shorter. Consequently, each scan can save a certain amount of scanning time, especially when multiple scans are performed, the time savings will be even more considerable, thereby greatly improving the detection speed of this inspection equipment. In addition, by acquiring the location information of the re-inspection defects, intelligent planning of the re-inspection path can also effectively save time and improve the detection speed.

[0106] Please see Figure 15 In a preferred embodiment, the screening process includes the following steps:

[0107] S21. Select a preliminary defect set consisting of multiple defects based on the screening criteria;

[0108] S22. Calculate the value of each individual defect in the preliminary defect set;

[0109] S23. All defects in the initial defect set are sorted by value to form a defect sequence set in descending order;

[0110] S24. Select a preset number of defects from the defect sequence set to form the largest defect set;

[0111] S25. Perform a re-inspection of the defects in the largest defect set.

[0112] Here, the value D of a single defect is calculated according to a preset formula: D = D1 * D2 + D3 * D4; where D1 is the area of ​​the defect, D2 is the area weight of the defect, D3 is the average gray value of the defect image, and D4 is the average gray value weight of the defect image. Through these conditions and screening processes, defects with greater re-inspection value can be more effectively selected, thereby improving the efficiency and accuracy of defect detection.

[0113] Please see Figures 3 to 8 The present invention also proposes an alignment method for a detection device, wherein the aforementioned detection device includes a mechanical alignment module and an optical alignment module, and the alignment method for the detection device includes the following steps:

[0114] S100. Use a mechanical alignment module to perform coarse alignment of the object under test. The surface of the object under test has alignment marks, and the alignment marks are located in the field of view of the optical alignment module.

[0115] S200. After coarse alignment, the optical alignment module is used to perform fine alignment of the object under test, so that the object under test is positioned...

[0116] At the designated location.

[0117] Specifically, the testing equipment includes the aforementioned support platform, mechanical alignment module, and driving device (not shown); wherein, the support platform is used to support the object to be tested, such as the substrate 10 in this embodiment; the mechanical alignment module includes a plurality of alignment rollers 60 disposed around the support area; and the driving device is used to drive the alignment rollers 60 to move toward the support area.

[0118] It is understood that since the testing equipment of this application is equipped with a mechanical alignment module and an optical alignment module, the orientation of the substrate 10 can be adjusted by the mechanical alignment module, the optical alignment module and the carrier stage before the substrate 10 is tested, so that the long side direction of the substrate 10 is consistent with the movement direction of the carrier stage, that is, both are the first direction, thereby reducing the missed detection of the full inspection module and effectively improving the accuracy of the test.

[0119] Specifically, such as Figure 5 As shown, using a mechanical alignment module to perform coarse alignment of the object under test, ensuring that the alignment mark is within the field of view of the optical alignment module, includes the following sub-steps:

[0120] S210, Move the alignment roller 60 toward the object to be tested until it reaches the preset position and clamps the outer edge of the object to be tested.

[0121] Specifically, refer to Figure 3 Eight alignment rollers 60 are distributed around the substrate 10, that is, two alignment rollers 60 are provided on the outer side of each side. The arrows indicate the moving direction of each alignment roller 60. When the substrate 10 is placed on the motion table, these eight alignment rollers 60 will move inward simultaneously to the preset position and clamp the substrate 10. The positions of the eight alignment rollers 60 can form a rectangle, whose length and width ratio is consistent with the length and width ratio of the substrate 10. During the process of the eight alignment rollers 60 moving inward simultaneously, the length and width ratio of the corresponding rectangle remains unchanged, thereby achieving the technical purpose of aligning the substrate 10.

[0122] In addition to this step, the following steps are also included:

[0123] S220. Turn on the vacuum adsorption device set on the support platform to adsorb and fix the sample to be tested on the support platform.

[0124] It is understandable that this setup, through vacuum adsorption, allows the substrate 10 to be firmly fixed to the stage, which facilitates subsequent optical alignment and scanning inspection.

[0125] S230, all alignment rollers 60 are released simultaneously to detach from the test object.

[0126] It should be noted that the key points for using a mechanical alignment module for coarse alignment are force, precision, and synchronization.

[0127] First, regarding the force, during the clamping process of coarse alignment, since the alignment roller 60 is a cylinder, its side directly contacts the edge of the substrate 10 at a point or line. Therefore, the acceleration and speed of the alignment roller 60 should not be too large and need to be adjusted to a suitable range. If the clamping force is too large, the substrate 10 will be subjected to greater local pressure and will be easily broken. On the other hand, if the acceleration and speed of the alignment roller 60 are set too small, the mechanical alignment process will take a long time, which will affect the overall detection efficiency of this detection equipment.

[0128] Secondly, regarding precision, when all the alignment rollers 60 are in the clamped state, the gap between each alignment roller 60 and the substrate 10 must be within the specified target range (on the order of hundreds of micrometers), neither too large nor too small. If the gap is too large, the substrate 10 will not be aligned properly, and if the gap is too small, the substrate 10 will be easily damaged. Furthermore, there are strict requirements for the repeatability of the clamping position of each alignment roller 60. The position repeatability of the alignment rollers 60 themselves determines the repeatability of the alignment of the substrate 10.

[0129] Thirdly, regarding synchronization, during the coarse alignment process, each alignment roller 60 needs to move synchronously, with higher requirements for clamping synchronization and lower requirements for releasing synchronization. When each alignment roller 60 starts moving and clamping at the same time, the edge of the substrate 10 can be subjected to more uniform force, resulting in higher efficiency in action execution.

[0130] Please see Figures 5 to 8 In a preferred embodiment, the optical alignment module includes at least one optical alignment probe, which can be set with an alignment mark group including at least two standard points. After coarse alignment, the optical alignment module is used to perform fine alignment on the object under test to place the object under test in a predetermined position, including the following sub-steps:

[0131] S310. Take an image of the alignment mark by taking a picture of the alignment mark using an optical alignment probe;

[0132] S320. Obtain the position information of the standard point based on the alignment image;

[0133] S330. Obtain the positional deviation of the object to be measured based on the positional information of at least two standard points;

[0134] S340. Adjust the test object according to the positional deviation to place the test object in the predetermined position.

[0135] Specifically, the alignment mark group includes a first alignment mark 511 and a second alignment mark 512; there are multiple optical alignment probes, including a first optical alignment probe 521 and a second optical alignment probe 522. The first optical alignment probe 521 is used to capture an image of the first alignment mark 511, and the second optical alignment probe 522 is used to capture an image of the second alignment mark 512. The first optical alignment probe 521 and the second optical alignment probe 522 are spaced apart along a second direction, and the first alignment mark 511 and the second alignment mark 512 are also spaced apart along the second direction.

[0136] The process of obtaining the position information of the standard point based on the alignment image includes: obtaining the first position information of the center of the first alignment mark 511 based on the alignment image of the first alignment mark 511; and obtaining the second position information of the center of the second alignment mark 512 based on the alignment image of the second alignment mark 512.

[0137] Positional deviation includes translational offset and / or rotational offset of the object under test; obtaining the positional deviation of the object under test based on the positional information of at least two standard points includes: obtaining the translational offset of the object under test based on the offset between the first positional information and the field of view center of the first optical alignment probe 521; and / or, obtaining the rotational offset of the object under test based on the first positional information and the second positional information.

[0138] Here, the steps for adjusting the object to be tested based on the positional deviation to bring it to a predetermined position include:

[0139] The required adjustment amount is determined based on the positional deviation of the object being measured.

[0140] Adjust the object under test until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

[0141] In other words, the angles of the substrate 10 and the support stage can be adjusted by adjusting the orientation axis of the support stage until the center of the first alignment mark 511 coincides with the field center of the first optical alignment probe 521, and the center of the second alignment mark 512 coincides with the field center of the second optical alignment probe 522. Figure 6 and Figure 7As shown, the solid-line rectangle represents substrate 10. At the top and bottom of the right side of substrate 10 are first alignment marks 511 and second alignment marks 512. The optical alignment module uses a black-and-white area array CCD probe, which can capture the complete first alignment marks 511 and second alignment marks 512 shown in the dashed-line rectangle within its field of view. Furthermore, since the positions of the alignment marks may differ on different substrates 10, the two optical alignment probes have a degree of freedom for displacement adjustment along the short side of substrate 10, i.e., the second direction, as indicated by the dashed arrow in the figure. Substrate 10 and the support stage have an angular degree of freedom for rotation about the center of substrate 10. Specifically, Figure 7 The left side shows the state after coarse alignment but before fine alignment. The first optical alignment probe 521 and the second optical alignment probe 522 respectively capture images of their respective cross-shaped first alignment mark 511 and second alignment mark 512 to obtain alignment images of the alignment marks. Both alignment marks are within the field of view, but not at the center of the field of view. Then, the positional deviation is calculated using the aforementioned method, and the required adjustment amount can be calculated. Then, the angle axis of the moving support stage is adjusted to make the adjustment.

[0142] This results in the state shown on the right side of the figure, where the centers of the two alignment marks are located at the center of their respective optical alignment probes' fields of view. At this point, substrate 10 has completed its precise alignment operation, meaning the long side of substrate 10 is essentially parallel to its moving direction. Since the positions of the alignment marks on the entire substrate 10 are known and determined, after optical alignment, the position information of the stage can correspond to the position information of the alignment marks on substrate 10. This allows for the determination of the transformation relationship between the coordinate system of the stage and the coordinate system of substrate 10, thus achieving precise positioning of substrate 10. It should be noted that the dimensions of the alignment marks in the attached figures are not proportional to the actual dimensions of substrate 10; the sizes are for illustrative purposes only. The actual dimensions of the alignment marks are on the order of micrometers.

[0143] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A detection method for a detection device, characterized in that, The testing equipment includes a mechanical alignment module, an optical alignment module, a full inspection module, a re-inspection module, and a control system. The testing method of the testing equipment includes the following steps: The mechanical alignment module is used to coarsely align the object under test, the surface of which has alignment marks, and the alignment marks are located in the field of view of the optical alignment module. After the coarse alignment, the optical alignment module is used to perform fine alignment of the object under test, so that the object under test is in a predetermined position; the optical alignment module includes at least one optical alignment probe, and sets an alignment mark group including at least two standard points. The full inspection module is used to scan and inspect the object under test, obtain defect information of the surface defects of the object under test, and screen the defects according to the defect information to obtain re-inspection defects. The re-inspection module is used to re-inspect the re-inspection defects and obtain the re-inspection information of the re-inspection defects; The control system is used to repeat the scanning and detection process to the re-inspection process for different test areas of the test object; the second and subsequent scanning and detection processes are carried out in parallel with the re-inspection process, and scanning and detection processes are performed on all test areas of the test object; the defects that were not screened out in the first full scan are combined with the defects obtained in the second full scan to screen out the re-inspection defects in the third full scan process. The process of finely aligning the object under test (DUT) using the optical alignment module after coarse alignment to place it in a predetermined position includes the following steps: capturing an image of the alignment mark using the optical alignment probe; obtaining the position information of the standard points based on the alignment image; obtaining the position deviation of the DUT based on the position information of at least two standard points; the position deviation includes one or a combination of translational and rotational offsets of the DUT; and adjusting the DUT according to the position deviation to place it in the predetermined position. The step of adjusting the test object according to the positional deviation to place the test object in a predetermined position includes: obtaining the adjustment amount according to the positional deviation of the test object; adjusting the test object until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

2. The detection method of the detection equipment as described in claim 1, characterized in that, The testing equipment includes a support platform, which has a support area for supporting the object to be tested; the mechanical alignment module includes multiple alignment rollers disposed around the support area. The step of using the mechanical alignment module to coarsely align the object under test, so that the alignment mark is located in the field of view of the optical alignment module, includes the following sub-steps: The alignment roller is moved toward the object to be tested until it reaches a preset position and clamps the outer edge of the object to be tested.

3. The detection method of the detection equipment as described in claim 1, characterized in that, The number of optical alignment probes is multiple, including a first optical alignment probe and a second optical alignment probe; the alignment mark group includes a first alignment mark and a second alignment mark. Obtaining the position information of the standard point based on the alignment image includes: obtaining the first position information of the center of the first alignment mark based on the alignment image of the first alignment mark; and obtaining the second position information of the center of the second alignment mark based on the alignment image of the second alignment mark. The positional deviation of the object under test is obtained based on the positional information of at least two standard points, including: obtaining the translational offset of the object under test based on the offset between the first positional information and the center of the field of view of the first optical alignment probe; and / or obtaining the rotational offset of the object under test based on the first positional information and the second positional information.

4. A testing device, characterized in that, include: Mechanical alignment module, optical alignment module, re-inspection module, and control system; The mechanical alignment module is configured to perform coarse alignment of the object to be tested, the surface of which has alignment marks, such that the alignment marks are located in the field of view of the optical alignment module. After the optical alignment module is configured for coarse alignment, it is used to perform fine alignment on the object under test, so that the object under test is in a predetermined position. The full inspection module is used to scan the object to be tested to achieve scanning detection processing, obtain defect information of surface defects of the object to be tested, and screen defects according to the defect information to obtain re-inspection defects; The re-inspection module is used to perform re-inspection processing on the re-inspection defects and obtain the re-inspection information of the re-inspection defects; The control system is used to repeat the scanning and detection process to the re-inspection process for different test areas of the test object; the second and subsequent scanning and detection processes are carried out in parallel with the re-inspection process, and scanning and detection processes are performed on all test areas of the test object; the defects that were not screened in the first full scan are combined with the defects obtained in the second full scan to screen out the re-inspection defects in the third full scan process.

5. The detection device as described in claim 4, characterized in that, The optical alignment module includes at least one optical alignment probe, and is equipped with an alignment mark group including at least two standard points; the optical alignment module is specifically configured as follows: After the coarse alignment, the alignment mark is photographed by the optical alignment probe to obtain an alignment image of the alignment mark; the position information of the standard point is obtained based on the alignment image; the position deviation of the object under test is obtained based on the position information of at least two standard points; the position deviation includes one or a combination of the translational offset and rotational offset of the object under test; the object under test is adjusted according to the position deviation to place the object under test in a predetermined position.

6. The detection device as described in claim 5, characterized in that, The step of adjusting the object to be tested according to the positional deviation to place the object to be tested in a predetermined position includes: The required adjustment amount is obtained based on the positional deviation of the object under test; the object under test is adjusted until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

7. The detection device as described in claim 4, characterized in that, The device includes a support platform with a support area for supporting the object to be tested; a mechanical alignment module including multiple alignment rollers disposed around the support area; and a driving device for driving the alignment rollers to move toward the support area.

8. The detection device as described in claim 4, characterized in that, The alignment mark group includes two standard points, which are respectively designated as the first alignment mark and the second alignment mark; the number of optical alignment probes is multiple, including the first optical alignment probe and the second optical alignment probe. The first optical alignment probe is used to capture an image of the first alignment mark, and the second optical alignment probe is used to capture an image of the second alignment mark.

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