IC substrate vacuum hot pressing device and method

Abstract

The invention discloses an IC carrier vacuum hot pressing device and method thereof, and relates to the technical field of vacuum hot pressing, comprising a sealed hot pressing chamber, two hot pressing tables with adjustable angles installed in the sealed hot pressing chamber, a lower heating unit is arranged below the hot pressing table, a liftable upper heating unit is arranged above the hot pressing table, a vertical bracket is respectively arranged on both sides of the hot pressing table, two movable grooves corresponding to the positions of the adjacent side edges of the hot pressing table are arranged on the vertical bracket, a movable wheel which can slide horizontally is arranged in the movable groove, a second pulley is arranged between the movable wheel and the adjacent side edges of the hot pressing table, a first pulley is arranged on the vertical bracket above the hot pressing table, the upper heating unit comprises a winder arranged on the first pulley away from the vertical bracket and an upper electric heater connected to the winder through a traction rope, and the invention can automatically adjust the distance between the heating unit and the hot pressing table to ensure the stability of the temperature of the IC carrier material to be hot pressed during the hot pressing process.

Description

Technical Field

[0001] The present invention relates to the field of vacuum hot pressing technology, and in particular to an IC carrier vacuum hot pressing device and a method thereof. Background Art

[0002] IC substrate vacuum hot pressing is a key technology used in integrated circuit packaging. It is mainly used to combine multi-layer circuit boards or other related materials together through high temperature and high pressure to form an integrated circuit packaging substrate with high reliability and good electrical performance.

[0003] In the traditional hot pressing process of IC substrates, fixed hot pressing equipment is usually used to heat and press the materials through upper and lower heating units. However, this equipment has certain limitations in adjusting the distance between the hot pressing tables and adapting to materials of different sizes to be pressed. In addition, it is difficult to maintain the stability between the hot pressing tables during the pressing process, which easily leads to unsatisfactory pressing effects.

[0004] In addition, during the operation of traditional equipment, the distance between the hot press platforms and the position of the heating unit are manually adjusted, which results in low work efficiency. Failure to adjust the hot press platforms and the heating unit will easily result in a higher temperature in the part close to the heating unit and a higher temperature in the part far from the heating unit, which is not conducive to uniform temperature control during the IC substrate pressing process. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides an IC carrier vacuum hot pressing device and method thereof, which can automatically adjust the distance between the heating unit and the hot pressing table to ensure the temperature stability of the IC carrier material to be hot pressed during the hot pressing process.

[0006] To achieve the above object, the present invention provides the following technical solution: an IC substrate vacuum hot pressing device, comprising a sealed hot pressing chamber, two hot pressing tables with adjustable angles installed in the sealed hot pressing chamber, a lower heating unit is provided below the hot pressing table, and a liftable upper heating unit is provided above the hot pressing table;

[0007] A vertical bracket is provided on both sides of the hot press platform, and two movable grooves corresponding to the positions of the adjacent side edges of the hot press platform are provided on the vertical bracket. A movable wheel that can slide horizontally is provided in the movable groove. A second belt pulley is provided between the movable wheel and the adjacent side edge of the hot press platform. The second belt pulley is rotatably connected to the side edge of the hot press platform, and when the second belt pulley rotates, the hot press platform can be driven to rotate;

[0008] The two hot pressing tables are located in the same plane with a certain gap in between, so that the materials to be hot pressed are placed on the hot pressing tables, so that the bottoms of the materials located on the two hot pressing tables can contact each other during the hot pressing process, thereby achieving a complete hot pressing effect;

[0009] Two first pulleys distributed along the transverse axis of the hot press platform are provided on the vertical support located above the hot press platform, and the two second pulleys are respectively connected to the first pulleys at corresponding positions through transmission belts, and a first pulley located close to the vertical support is driven to rotate by a motor installed on the vertical support, so that when the first pulley rotates, the two second transmission wheels are driven to rotate due to the action of the connected transmission belt, so that the two hot press platforms connected thereto are gradually folded, and the materials placed on the two hot press platforms are gradually pressed together;

[0010] The upper heating unit includes a winder arranged on a first pulley away from the vertical bracket and an upper electric heater connected to the winder by a traction rope. When the first pulley rotates, the winder can be driven to achieve a lifting effect on the position of the upper electric heater. When the two hot pressing tables are in a folded state, the upper electric heater gradually rises, so that the pressing position can always maintain a close distance with the upper electric heater, so as to avoid the upper electric heater being far away from the pressing position and causing the vacuum hot pressing effect to be unsatisfactory. One of the winders is connected to the winder installed on the other vertical bracket by a connecting shaft, so that when one of the winders rotates under the drive of the motor, the other winder can be driven to rotate synchronously, thereby keeping the two winders in a synchronized state at all times and reducing the manufacturing cost of the device.

[0011] Preferably, an adjustment seat is provided on the side of the two first pulleys facing the vertical bracket, and the adjustment seat, which is located closest to the vertical bracket, is connected to the rotating shaft of the motor installed on the vertical bracket. An adjustment unit is provided on the side of the two adjustment seats facing the first pulley, and the adjustment unit includes a plurality of transversely arranged grooves opened on the side of the adjustment seat, a slidable connecting seat is provided in the groove body, a reset spring for restoring the connecting seat to an initial position is provided on one side of the connecting seat, the connecting seat is connected to the adjacent first pulley, and the connecting seat can drive the first pulley to move laterally under the action of tension to cooperate with the lateral displacement of the moving wheel located in the moving groove, and the first pulley away from the vertical bracket is connected to the winder through a connecting block.

[0012] Preferably, a telescopic cylinder is provided below the moving wheel, and an articulated seat which can move up and down along the vertical bracket is provided on the output end of the cylinder, and articulated rods are extended from the articulated seat to the two moving wheels respectively. When the telescopic cylinder is pushed upward, the articulated seat uses the articulated rod to drive the moving wheel to move laterally in the moving groove to adjust the spacing between the two hot pressing tables, so as to adapt to materials to be pressed of different sizes, so that the two materials to be pressed can always be fully matched and pressed, thereby improving the accuracy of pressing. At the same time, the first pulley also adopts a movable design, which makes it unnecessary to replace the transmission belts on the first pulley and the second pulley when adjusting the spacing between the hot pressing tables, thereby improving the working efficiency of the device.

[0013] Preferably, a circular track is provided on the vertical bracket, and an electric telescopic rod is provided on the side of the two hot pressing platforms corresponding to the circular track. The electric telescopic rod can be slidably arranged on the side of the hot pressing platform, and the output end of the electric telescopic rod can be extended into the circular track and slide along the circular track, so that the two hot pressing platforms have a certain degree of stability during the folding process. However, when the distance between the two hot pressing platforms needs to be adjusted, the electric telescopic rod is retracted, and at the same time, according to the adjusted position of the hot pressing platform and the circular track, the position of the electric telescopic rod is slidably adjusted so that it always corresponds to the position of the circular track. After the adjustment is completed, the output end of the electric telescopic rod is extended into the circular track through electric control for matching sliding.

[0014] Preferably, the lower heating unit includes a support plate located below the hot pressing table, the vertical bracket is installed on the support plate, the support plate is open at the center, an electric slide rail is vertically arranged at the opening, the electric slide rail is provided with a slider that can slide up and down, an insulation frame is installed on the top of the slider, and the insulation frame is provided with a lower electric heater for heating the pressing.

[0015] Preferably, the hot press platform is provided with a slide groove near the side, and each of the slide grooves is provided with a movable clamping plate, and the clamping plate is used to clamp the clamping plate placed on the hot press platform under the push of an external force.

[0016] Preferably, the height of the clamp plate is set to 2-4 mm to ensure that the upper horizontal surface of the clamp plate is lower than the upper horizontal surface of the material to be pressed on the hot pressing table, thereby avoiding incomplete pressing of the material to be pressed due to the influence of the clamp plate during the pressing state.

[0017] Preferably, a plurality of evenly distributed adsorption holes are provided on the upper surface of the hot press table, and an adsorption bin is provided below the heating table. When the material to be pressed is placed on the upper surface of the hot press table, the adsorption bin uses suction to completely adsorb the material to be pressed on the hot press table to improve stability during pressing.

[0018] Preferably, the sealed hot pressing chamber has an exhaust pipe extending from the inside to the outside, and the exhaust pipe is located outside the sealed hot pressing chamber and connected to a vacuum pump installed on one side of the sealed hot pressing chamber, for exhausting the gas in the sealed hot pressing chamber, so that the sealed hot pressing chamber can perform vacuum hot pressing on the IC carrier material to be pressed. A solenoid valve is provided on the exhaust pipe for electrically controlling the opening and closing state of the exhaust pipe to enhance a certain degree of automation effect. The part of the exhaust pipe located in the sealed hot pressing chamber extends a hose toward the adsorption chamber and is connected to the adsorption chamber, so that the adsorption chamber adsorbs the material to be pressed.

[0019] A method for using an IC substrate vacuum hot pressing device comprises the following steps:

[0020] S1. Place two IC substrate materials to be hot-pressed on two hot-pressing tables respectively, fix the materials to be hot-pressed with the clamping plates on the sides of the hot-pressing tables to ensure that they will not move during the hot-pressing process, and adjust the position of the moving wheel by the telescopic cylinder according to the size of the materials to be hot-pressed, thereby changing the distance between the two hot-pressing tables to ensure that the bottoms of the materials can contact each other;

[0021] S2, start the vacuum system, and extract the air in the sealed hot pressing chamber through the exhaust pipe and the vacuum pump to form a vacuum environment. At the same time, the part of the exhaust pipe located in the sealed hot pressing chamber extends a hose to the adsorption chamber and is connected to the adsorption chamber, so that the adsorption chamber adsorbs the material to be pressed;

[0022] S3, start the motor to drive the first pulley to rotate, and rotate the second pulley through the transmission belt, so that the hot press table starts to fold and gradually press the materials, and the lower heating unit remains in a fixed position when it is moved to the bottom of the hot press table. When the first pulley in the upper heating unit rotates, it can drive the winder to achieve a lifting effect on the position of the upper electric heater, so that when the two hot press tables are in a mutually folded state, the upper electric heater gradually rises, so that the pressing position can always be kept at a relatively close distance to the upper electric heater to achieve an ideal heating effect;

[0023] S4. After the two hot pressing tables are folded from the horizontal position until the IC substrate materials are completely attached, they are left to stand for 3-5 minutes and are continuously heated to ensure the stability of the pressing of the two IC substrate materials;

[0024] S5. After the static state is completed, the motor and the heating unit are stopped, the vacuum system is turned off, the hot pressing table is restored to the initial position, and the hot pressed IC substrate material is taken out.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The device realizes efficient and uniform heating of IC substrate materials through the coordinated work of two hot pressing tables with adjustable angles and upper and lower heating units, effectively solving the problems of low heating efficiency and uneven heating in the prior art. This design makes the heating process more uniform, greatly improving product quality and yield rate. Secondly, a moving wheel and a second pulley are provided between the hot pressing tables of the device. Through the transmission of the first pulley, the hot pressing table can be gradually folded and the material can be pressed, which not only improves the accuracy of pressing, but also avoids material damage caused by uneven pressing, further improving the product yield rate.

[0027] 2. The device is also equipped with a retractable cylinder and an electric retractable rod, which can adjust the distance between the hot pressing tables according to the size of the material to be pressed to meet the pressing requirements of different sizes. This not only improves the applicability of the equipment, but also makes the operation more flexible and convenient.

[0028] 3. The lower heating unit and the upper heating unit of the device both use electric heaters, which not only improve the heating efficiency and the accuracy of temperature control, but also realize the automatic lifting and lowering of the heater through the coordinated work of the winder and the motor, ensuring that the pressing position always maintains a close distance with the heater, thereby avoiding unsatisfactory hot pressing effect caused by the heater being too far away.

[0029] 4. The design height of the fixture plate of this device is 2-4mm, which ensures that the horizontal surface of the fixture plate is lower than the upper horizontal surface of the material to be pressed on the hot pressing table, avoiding incomplete pressing and ensuring the stability of the pressing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the structural installation of the hot pressing table and the vertical support in the present invention;

[0033] Figure 3 It is a schematic diagram of the structural installation of the upper electric heater, the winder and the heating table in the present invention;

[0034] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0035] Figure 5 It is a schematic diagram of the separation state of the hot pressing table in the present invention;

[0036] Figure 6 for Figure 5 A partial enlarged view of point B in the middle;

[0037] Figure 7 It is a schematic diagram of the structural installation of the hinge seat, the second belt and the first belt in the present invention;

[0038] Figure 8 It is a schematic diagram of the structural installation of the first pulley and the adjustment seat in the present invention;

[0039] Fig. 9 It is a schematic diagram of the structural installation of the adjustment seat in the present invention.

[0040] In the figure: 1. Sealed hot pressing chamber; 2. Hot pressing table; 3. Lower heating unit; 301. Support plate; 302. Electric slide rail; 303. Slider; 304. Heat insulation frame; 305. Lower electric heater; 4. Upper heating unit; 401. Winder; 402. Traction rope; 403. Upper electric heater; 5. Vertical bracket; 6. Moving groove; 7. Moving wheel; 8. Second pulley; 9. First pulley; 901. Transmission belt; 902. Connecting block; 10. Adjusting seat; 11. Rotating shaft; 12. Groove body; 13. Connecting seat; 14. Reset spring; 15. Telescopic cylinder; 16. Articulated seat; 17. Articulated rod; 18. Annular track; 19. Electric telescopic rod; 20. Slide; 21. Fixture plate; 22. Adsorption hole; 23. Connecting shaft; 24. Exhaust pipe; 25. Vacuum pump; 26. Solenoid valve. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] See also Figure 1-9 The IC substrate vacuum hot pressing device of the present invention comprises a sealed hot pressing chamber 1, two hot pressing tables 2 with adjustable angles installed in the sealed hot pressing chamber 1, a lower heating unit 3 is provided below the hot pressing table 2, and a liftable upper heating unit 4 is provided above the hot pressing table 2;

[0043] A vertical bracket 5 is provided on both sides of the hot pressing platform 2, and two movable grooves 6 corresponding to the side positions of the adjacent hot pressing platforms 2 are provided on the vertical bracket 5. A movable wheel 7 that can slide horizontally is provided in the movable groove 6. A second pulley 8 is provided between the movable wheel 7 and the side of the adjacent hot pressing platform 2. The second pulley 8 is rotatably connected to the side of the hot pressing platform 2, and when the second pulley 8 rotates, it can drive the hot pressing platform 2 to rotate;

[0044] The two hot pressing tables 2 are located in the same plane with a certain gap in between, so that the material to be hot pressed can be placed on the hot pressing table 2, so that the bottoms of the materials located on the two hot pressing tables 2 can contact each other during the hot pressing process, thereby achieving a complete hot pressing effect;

[0045] The vertical support 5 located above the hot press table 2 is provided with two first pulleys 9 distributed along the transverse axis of the hot press table 2, and the two second pulleys 8 are respectively connected to the first pulleys 9 at corresponding positions through transmission belts 901. The first pulley 9 located near the vertical support 5 is driven to rotate by the motor installed on the vertical support 5. Therefore, when the first pulley 9 rotates, the two second transmission wheels are driven to rotate due to the action of the connected transmission belt 901, so that the two hot press tables 2 connected thereto are gradually folded, and the materials placed on the two hot press tables 2 are gradually pressed together;

[0046] The upper heating unit 4 includes a winder 401 arranged on a first pulley 9 away from the vertical bracket 5 and an upper electric heater 403 connected to the winder 401 through a traction rope 402. When the first pulley 9 rotates, it can drive the winder 401 to achieve a lifting effect on the position of the upper electric heater 403, so that when the two hot pressing tables 2 are in a folded state, the upper electric heater 403 gradually rises, so that the pressing position can always maintain a close distance with the upper electric heater 403, so as to avoid the upper electric heater 403 being far away from the pressing position, resulting in an unsatisfactory vacuum hot pressing effect.

[0047] Preferably, an adjustment seat 10 is provided on the side of the two first pulleys 9 facing the vertical bracket 5, and the adjustment seat 10, which is located closest to the vertical bracket 5, is connected to the rotating shaft 11 of the motor installed on the vertical bracket 5. An adjustment unit is provided on the side of the two adjustment seats 10 facing the first pulley 9, and the adjustment unit includes a plurality of transversely arranged grooves 12 opened on the side of the adjustment seat 10, and a slidable connecting seat 13 is provided in the groove 12. A reset spring 14 for restoring the connecting seat 13 to an initial position is provided on one side of the connecting seat 13, and the connecting seat 13 is connected to the adjacent first pulley 9. Under the action of tension, the connecting seat 13 can drive the first pulley 9 to move laterally to cooperate with the lateral displacement of the moving wheel 7 located in the moving groove 6, and the first pulley 9 away from the vertical bracket 5 is connected to the winder 401 through a connecting block 902.

[0048] Preferably, a telescopic cylinder 15 is provided below the moving wheel 7, and an articulated seat 16 which can move up and down along the vertical bracket 5 is provided on the output end of the cylinder, and articulated rods 17 are respectively extended from the articulated seat 16 to the two moving wheels 7. When the telescopic cylinder 15 is pushed upward, the articulated seat 16 uses the articulated rod 17 to drive the moving wheel 7 to move laterally in the moving groove 6 to adjust the distance between the two hot pressing tables 2, so as to adapt to materials to be pressed of different sizes, so that the two materials to be pressed can always be completely matched and pressed, thereby improving the accuracy of pressing. At the same time, the first pulley 9 also adopts a movable design, so that when adjusting the distance between the hot pressing tables 2, there is no need to replace the transmission belt 901 on the first pulley 9 and the second pulley 8, thereby improving the working efficiency of the device.

[0049] Preferably, a circular track 18 is provided on the vertical bracket 5, and an electric telescopic rod 19 is provided on the side of the two hot pressing platforms 2 corresponding to the circular track 18. The electric telescopic rod 19 can be slidably arranged on the side of the hot pressing platform 2, and the output end of the electric telescopic rod 19 can be extended into the circular track 18 and slide along the circular track 18, so that the two hot pressing platforms 2 have a certain degree of stability during the folding process. However, when it is necessary to adjust the distance between the two hot pressing platforms 2, the electric telescopic rod 19 is retracted, and at the same time, according to the adjusted position of the hot pressing platform 2 and the circular track 18, the position of the electric telescopic rod 19 is slidably adjusted so that it always corresponds to the position of the circular track 18. After the adjustment is completed, the output end of the electric telescopic rod 19 is extended into the circular track 18 through electric control for matching sliding.

[0050] Preferably, the lower heating unit 3 includes a support plate 301 located below the hot pressing table 2, the vertical bracket 5 is installed on the support plate 301, the support plate 301 is open at the center, and an electric slide rail 302 is vertically arranged at the opening position, and a slider 303 that can slide up and down is provided on the electric slide rail 302, and a heat insulation frame 304 is installed on the top of the slider 303, and a lower electric heater 305 for heating the pressing is provided on the heat insulation frame 304.

[0051] Preferably, the hot press platform 2 is provided with a slide groove 20 near the side, and each of the slide grooves 20 is provided with a movable clamping plate 21, and the clamping plate 21 is clamped on the hot press platform 2 under the push of an external force.

[0052] Preferably, the height of the clamp plate 21 is set to 2-4 mm so that the upper horizontal surface of the clamp plate 21 is lower than the upper horizontal surface of the material to be pressed on the hot pressing table 2, thereby avoiding incomplete pressing of the material to be pressed due to the influence of the clamp plate 21 during the pressing state.

[0053] Preferably, a plurality of evenly distributed adsorption holes 22 are provided on the upper surface of the hot pressing platform 2, and an adsorption bin is provided below the heating platform. When the material to be pressed is placed on the upper surface of the hot pressing platform 2, the adsorption bin uses suction to completely adsorb the material to be pressed onto the hot pressing platform 2 to improve stability during pressing.

[0054] Preferably, one of the winders 401 is connected to a winder 401 installed on another vertical bracket 5 via a connecting shaft 23, so that when one of the winders 401 rotates driven by a motor, the other winder 401 can be driven to rotate synchronously, thereby keeping the two winders 401 in a synchronized state at all times and reducing the manufacturing cost of the device.

[0055] Preferably, the sealed hot pressing chamber 1 has an exhaust pipe 24 extending from the inside to the outside. The exhaust pipe 24 is located outside the sealed hot pressing chamber 1 and is connected to a vacuum pump 25 installed on one side of the sealed hot pressing chamber 1. It is used to discharge the gas in the sealed hot pressing chamber 1 so that the sealed hot pressing chamber 1 can perform vacuum hot pressing on the IC carrier material to be pressed. A solenoid valve 26 is provided on the exhaust pipe 24 for electrically controlling the opening and closing state of the exhaust pipe 24 to enhance a certain degree of automation effect. The part of the exhaust pipe 24 located in the sealed hot pressing chamber 1 extends a hose toward the adsorption chamber and is connected to the adsorption chamber, so that the adsorption chamber adsorbs the material to be pressed.

[0056] A method for using an IC substrate vacuum hot pressing device comprises the following steps:

[0057] S1. Place two IC substrate materials to be hot-pressed on two hot-pressing platforms 2 respectively, fix the materials to be hot-pressed with the clamping plate 21 on the side of the hot-pressing platform 2 to ensure that they will not move during the hot-pressing process, and adjust the position of the moving wheel 7 by the telescopic cylinder 15 according to the size of the materials to be hot-pressed, thereby changing the distance between the two hot-pressing platforms 2 to ensure that the bottoms of the materials can contact each other;

[0058] S2, start the vacuum system, and extract the air in the sealed hot pressing chamber 1 through the exhaust pipe 24 and the vacuum pump 25 to form a vacuum environment. At the same time, the part of the exhaust pipe 24 located in the sealed hot pressing chamber 1 extends a hose to the adsorption chamber to be connected with the adsorption chamber, so that the adsorption chamber adsorbs the material to be pressed;

[0059] S3, start the motor to drive the first pulley 9 to rotate, and the second pulley 8 is rotated through the transmission belt 901, so that the hot press table 2 starts to fold and gradually press the materials, and the lower heating unit 3 remains in a fixed position when it moves to the bottom of the hot press table 2. When the first pulley 9 in the upper heating unit 4 rotates, it can drive the winder 401 to achieve a lifting effect on the position of the upper electric heater 403, so that when the two hot press tables 2 are in a mutually folded state, the upper electric heater 403 gradually rises, so that the pressing position can always maintain a close distance with the upper electric heater 403 to achieve an ideal heating effect;

[0060] S4, after the two hot pressing tables 2 are folded from the horizontal position until the IC substrate materials are completely attached, they are left to stand for 3-5 minutes and are continuously heated to ensure the stability of the pressing of the two IC substrate materials;

[0061] S5. After the static state is completed, the motor and the heating unit are stopped, the vacuum system is turned off, the hot pressing table 2 is restored to the initial position, and the IC substrate material that has been hot pressed is taken out.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to be a further limitation of the present invention. All equivalent changes made using the contents of the present specification and drawings are within the protection scope of the present invention.

Claims

1. An IC carrier vacuum hot pressing device, characterized in that: It comprises a sealed hot pressing chamber (1), two hot pressing tables (2) with adjustable angles installed in the sealed hot pressing chamber (1), a lower heating unit (3) being provided below the hot pressing tables (2), and a liftable upper heating unit (4) being provided above the hot pressing tables (2); A vertical bracket (5) is provided on each side of the hot pressing platform (2), and two movable grooves (6) corresponding to the positions of the adjacent side edges of the hot pressing platform (2) are provided on the vertical bracket (5). A movable wheel (7) capable of horizontal sliding is provided in the movable groove (6), and a second belt pulley (8) is provided between the movable wheel (7) and the adjacent side edge of the hot pressing platform (2). The second belt pulley (8) is rotatably connected to the side edge of the hot pressing platform (2); The two hot pressing tables (2) are located on the same plane with a certain gap between them; Two first belt pulleys (9) distributed along the transverse axis of the hot pressing platform (2) are provided on the vertical support (5) located above the hot pressing platform (2), and the two second belt pulleys (8) are respectively connected to the first belt pulleys (9) at corresponding positions via transmission belts (901); The upper heating unit (4) comprises a winder (401) arranged on a first belt pulley (9) far from the vertical support (5) and an upper electric heater (403) connected to the winder (401) via a traction rope (402), wherein one winder (401) is connected to a winder (401) installed on another vertical support (5) via a connecting shaft (23); an adjustment seat (10) is provided on the side of the two first belt pulleys (9) facing the vertical support (5), and the adjustment seat (10) is located between the adjustment seat (10) closest to the vertical support (5) and the adjustment seat (10) installed on the vertical support (5). The two adjustment seats (10) are connected to the rotating shaft (11) of the motor, and the sides of the two adjustment seats (10) facing the first pulley (9) are provided with adjustment units, and the adjustment units include a plurality of transversely arranged grooves (12) opened on the sides of the adjustment seats (10), and a slidable connecting seat (13) is provided in the grooves (12), and a return spring (14) for restoring the connecting seat (13) to an initial position is provided on one side of the connecting seat (13), and the connecting seat (13) is connected to the adjacent first pulley (9), and the first pulley (9) away from the vertical support (5) is connected to the winder (401) through a connecting block (902).

2. The IC carrier vacuum hot pressing device according to claim 1, characterized in that: A telescopic cylinder (15) is provided below the moving wheel (7), and an articulated seat (16) that can move up and down along the vertical bracket (5) is provided on the output end of the cylinder, and articulated rods (17) extend from the articulated seat (16) toward the two moving wheels (7).

3. The IC carrier vacuum hot pressing device according to claim 2, characterized in that: The vertical support (5) is provided with a circular track (18), and the two hot pressing tables (2) are each provided with an electric telescopic rod (19) on the side corresponding to the circular track (18). The electric telescopic rod (19) can be slidably arranged on the side of the hot pressing table (2), and the output end of the electric telescopic rod (19) can be extended into the circular track (18).

4. The IC carrier vacuum hot pressing device according to claim 3, characterized in that: The lower heating unit (3) comprises a support plate (301) located below the hot pressing platform (2), the vertical bracket (5) being mounted on the support plate (301), the support plate (301) being open at the center, the opening being provided with an electric slide rail (302) arranged in a vertical state, the electric slide rail (302) being provided with a slider (303) that can slide up and down, a heat insulation frame (304) being mounted on the top of the slider (303), and the heat insulation frame (304) being provided with a lower electric heater (305) for heating the pressing.

5. The IC carrier vacuum hot pressing device according to claim 4, characterized in that: The hot pressing platform (2) is provided with a slide groove (20) near the side edge, and each of the slide grooves (20) is provided with a movable clamping plate (21), and the clamping plate (21) clamps the clamping plate (21) placed on the hot pressing platform (2) under the push of an external force.

6. The IC carrier vacuum hot pressing device according to claim 5, characterized in that: The height of the fixture plate (21) is set to 2-4 mm.

7. The IC carrier vacuum hot pressing device according to claim 6, characterized in that: The upper surface of the hot pressing platform (2) is provided with a plurality of evenly distributed adsorption holes (22), and an adsorption bin is provided below the hot pressing platform (2).

8. The IC carrier vacuum hot pressing device according to claim 7, characterized in that: The sealed hot pressing chamber (1) has an exhaust pipe (24) extending from the inside to the outside. The exhaust pipe (24) is located outside the sealed hot pressing chamber (1) and is connected to a vacuum pump (25) installed on one side of the sealed hot pressing chamber (1). A solenoid valve (26) is provided on the exhaust pipe (24). A hose is extended from the part of the exhaust pipe (24) located inside the sealed hot pressing chamber (1) to the adsorption chamber and is connected to the adsorption chamber.

9. The method for using the IC substrate vacuum hot pressing device according to claim 8, characterized in that: The following steps are included: S1. Place two IC substrate materials to be hot-pressed on two hot-pressing platforms (2) respectively, fix the materials to be hot-pressed using a clamping plate (21) on the side of the hot-pressing platform (2) to ensure that they do not move during the hot-pressing process, and adjust the position of the moving wheel (7) by a telescopic cylinder (15) according to the size of the materials to be hot-pressed, thereby changing the distance between the two hot-pressing platforms (2) to ensure that the bottoms of the materials can contact each other; S2, turning on the vacuum system, and extracting the air in the sealed hot pressing chamber (1) through the exhaust pipe (24) and the vacuum pump (25) to form a vacuum environment. At the same time, a hose is extended from the exhaust pipe (24) located in the sealed hot pressing chamber (1) to the adsorption chamber and is connected to the adsorption chamber, so that the adsorption chamber adsorbs the material to be pressed; S3, start the motor to drive the first pulley (9) to rotate, and rotate the second pulley (8) through the transmission belt (901), so that the hot pressing platform (2) starts to fold and gradually press the material, and the lower heating unit (3) remains in a fixed position when it moves to the bottom of the hot pressing platform (2), and the first pulley (9) in the upper heating unit (4) can drive the winder (401) to achieve a lifting effect on the position of the upper electric heater (403) when the first pulley (9) in the upper heating unit (4) rotates, so that when the two hot pressing platforms (2) are in a mutually folded state, the upper electric heater (403) gradually rises, so that the pressing position can always be kept at a relatively close distance to the upper electric heater (403), so as to achieve an ideal heating effect; S4, after the two hot pressing tables (2) are folded from a horizontal position until the IC substrate materials are completely attached, they are left to stand for 3-5 minutes and are continuously heated to ensure the stability of the pressing of the two IC substrate materials; S5. When the static state is completed, the motor and the heating unit are stopped, the vacuum system is turned off, the hot pressing table (2) is restored to the initial position, and the hot pressed IC substrate material is taken out.

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