Processing system and control method thereof

Abstract

The invention provides a processing system and a control method thereof. This processing system is provided with: a processing device that has a supply unit that supplies a material from a storage unit in which the material is stored, and that performs a processing process for forming a molded article using the material supplied from the supply unit on the basis of molding data; and an output device that outputs information relating to the amount of the material obtained on the basis of the modeling data and the storage amount of the material stored in the storage unit.

Description

[0001] This application is a divisional application of the Chinese invention patent application with an application date of March 25, 2019, an invention name of “Processing System” and an application number of 201980096608.X (PCT / JP2019 / 012511). Technical Field

[0002] The present invention relates to the technical field of a processing system for forming a molded object and a control method thereof. Background Art

[0003] Patent Document 1 describes a processing system that melts a powdered material using an energy beam and then solidifies the molten material to form a molded object. In such a processing system, suppressing the occurrence of abnormalities caused by material shortage is a technical issue.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: U.S. Patent No. 5,038,014 Summary of the invention

[0007] According to a first aspect of the present invention, there is provided a processing system for shaping a shaped object, wherein the processing system comprises: a processing device having a supply portion, the supply portion supplying the material from a storage portion for storing the material, the processing device performing processing to form the shaped object using the material supplied from the supply portion according to shaping data; and an output device, which outputs information related to the amount of the material obtained based on the shaping data and the storage amount of the material stored in the storage portion.

[0008] According to a second aspect of the present invention, there is provided a processing system for shaping an object based on shaping data, wherein the processing system comprises: a processing device having a supply portion that supplies the material from a storage portion that stores the material, the processing device performing processing to form the object using the material supplied from the supply portion; and an output device that outputs information indicating the relationship between the amount of the material required to shape the object obtained using the shaping data and the storage amount of the material.

[0009] According to a third aspect of the present invention, there is provided a processing system for shaping an object based on shaping data, wherein the processing system comprises: a processing device having a supply portion that supplies the material from a storage portion that stores the material, the processing device performing a processing to form the object using the material supplied from the supply portion; and an estimating device that estimates the amount of the material required for the processing using the shaping data.

[0010] The effects and other advantages of the present invention will become apparent from the embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a cross-sectional view showing the structure of the processing system according to the first embodiment.

[0012] Figure 2 It is a system configuration diagram showing the system configuration of the processing system according to the first embodiment.

[0013] Figure 3 It is a cross-sectional view showing the structure of the material supply device according to the first embodiment.

[0014] Figure 4 It is a side view showing the structure of a holding member included in the material supply device.

[0015] Figure 5 (a) is a perspective view showing the structure of a first example of a conveying member included in the material supply device. Figure 5 (b) is a front view showing the structure of the first example of the conveying member.

[0016] Figure 6 (a) is a perspective view showing the structure of a second example of a conveying member included in the material supply device. Figure 6 (b) to Figure 6 (c) are cross-sectional views showing the structure of the second example of the conveying member.

[0017] Figure 7 It is a cross-sectional view showing the supply operation of the material supply device supplying the modeling material.

[0018] Figure 8 (a) to Figure 8 (e) are cross-sectional views showing the state when a certain area on the work is irradiated with light and a modeling material is supplied.

[0019] Fig. 9 (a) to Fig. 9 (c) are cross-sectional views showing the process of forming a three-dimensional structure.

[0020] Fig.10 This is a flowchart showing the flow of the second machining operation performed by the machining system.

[0021] Fig.11 It is a top view showing a display example on the display.

[0022] Fig.12 (a) to Fig.12 (b) are plan views showing display examples on the display.

[0023] Fig.13 It is a top view showing a display example on the display.

[0024] Fig.14 It is a top view showing a display example on the display.

[0025] Fig.15 It is a top view showing a display example on the display.

[0026] Fig.16 It is a plan view showing a display example of information indicating the status of processing.

[0027] Fig.17 It is a top view showing a display example of warning information.

[0028] Fig.18 It is a top view showing a display example of warning information.

[0029] Fig.19 It is a top view showing a display example of warning information.

[0030] Fig. 20 It is a top view showing a display example of warning information.

[0031] Fig.21 It is a top view showing a display example of warning information.

[0032] Fig. 22 It is a top view showing a display example of warning information.

[0033] Fig.23 It is a top view showing a display example of warning information.

[0034] Fig.24 It is a top view showing a display example of warning information.

[0035] Fig.25 It is a top view showing a display example of warning information.

[0036] Fig.26 It is a side view which shows the structure of the hopper of 2nd Embodiment.

[0037] Fig. 27 It is a system configuration diagram showing the system configuration of the processing system according to the third embodiment.

[0038] Fig.28 It is a system configuration diagram showing the system configuration of the processing system according to the fourth embodiment.

[0039] Fig.29 It is a cross-sectional view showing the structure of the processing system according to the fifth embodiment.

[0040] Fig.30 It is a cross-sectional view showing the structure of the processing system according to the sixth embodiment.

[0041] Fig.31 (a) is a top view showing a plurality of beam spots of guide light on a modeling surface when the focus position of the processing light is set to the modeling surface, Fig.31 (b) is a plan view showing a plurality of beam spots of guide light on the modeling surface when the focus position of the processing light is not set to a position different from the modeling surface. DETAILED DESCRIPTION

[0042] Hereinafter, an embodiment of a processing system will be described with reference to the accompanying drawings. Hereinafter, an embodiment of the processing system will be described using a processing system SYS that performs additional processing on a workpiece W as an example of an object. In particular, hereafter, an embodiment of the processing system will be described using a processing system SYS that performs additional processing based on a laser deposition welding method (LMD: Laser Metal Deposition). The additional processing based on the laser deposition welding method is an additional processing in which a molding material M supplied to the workpiece W is melted by using a processing light EL, thereby forming (i.e., molding) a three-dimensional structure ST (i.e., a molded object) that is integrated with the workpiece W or can be separated from the workpiece W. It should be noted that the laser deposition welding method (LMD) may also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser engineering net forming, direct light synthesis, laser synthesis, forming deposition machinery, wire laser deposition, gas passing through a wire, laser powder erosion, laser metal forming, selective laser powder melting, laser direct casting, laser powder deposition, laser additional machinery, and laser rapid prototyping.

[0043] In addition, in the following description, the positional relationship of various structural elements constituting the processing system SYS is described using an XYZ vertical coordinate system defined by mutually perpendicular X-axis, Y-axis and Z-axis. In addition, in the following description, for the convenience of description, the X-axis direction and the Y-axis direction are respectively horizontal directions (i.e., prescribed directions in the horizontal plane), and the Z-axis direction is the vertical direction (i.e., the direction perpendicular to the horizontal plane, substantially the up and down direction). In addition, the rotation directions (in other words, the tilting directions) around the X-axis, Y-axis and Z-axis are respectively referred to as the θX direction, the θY direction and the θZ direction. Here, the Z-axis direction may also be set as the gravity direction. In addition, the XY plane may also be set as the horizontal direction.

[0044] (1) Processing System SYSa of First Embodiment

[0045] First, a machining system SYS according to a first embodiment (hereinafter, the machining system SYS according to the first embodiment will be referred to as a “machining system SYSa”) will be described.

[0046] (1-1) Overall Configuration of Processing System SYSa According to First Embodiment

[0047] First, refer to Figure 1 and Figure 2 The configuration of the machining system SYSa according to the first embodiment will be described. Figure 1 It is a cross-sectional view showing an example of the structure of the processing system SYSa according to the first embodiment. Figure 2 1 is a system configuration diagram showing an example of a system configuration of the machining system SYSa according to the first embodiment.

[0048] The processing system SYSa can form a three-dimensional structure ST (that is, a three-dimensional object having a size in any direction of the three-dimensional direction, which is a three-dimensional object). The processing system SYSa can form a three-dimensional structure ST on a workpiece W that serves as a basis for forming the three-dimensional structure ST. The workpiece W can also be referred to as a substrate or a base. The processing system SYSa can form a three-dimensional structure ST by performing additional processing on the workpiece W. In the case where the workpiece W is a workbench 31 described later, the processing system SYSa can form a three-dimensional structure ST on the workbench 31. In the case where the workpiece W is an existing structure held by the workbench 31 (or supported or placed by the workbench 31), the processing system SYSa can form a three-dimensional structure ST on the existing structure. In this case, the processing system SYSa can also form a three-dimensional structure ST integrated with the existing structure. The action of forming a three-dimensional structure ST integrated with the existing structure can be regarded as equivalent to the action of adding a new structure to the existing structure. In addition, the existing structure may also be, for example, a product to be repaired with a defective portion. The processing system SYSa may also form a three-dimensional structure on the repaired product in a manner that fills the defective portion of the repaired product. Alternatively, the processing system SYSa may form a three-dimensional structure ST that can be separated from the existing structure. Figure 1 The example in which the workpiece W is a conventional structure held by the table 31 is shown. In addition, the example in which the workpiece W is a conventional structure held by the table 31 is also used for the following description.

[0049] As described above, the processing system SYSa can form a three-dimensional structure ST by laser cladding. That is, the processing system SYSa can also be said to be a 3D printer that uses the stacking modeling technology to form an object. In addition, the stacking modeling technology is also called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0050] In order to form a 3D structure ST, Figure 1 and Figure 2As shown, the processing system SYSa includes a material supply device 1, a processing device 2, a workbench device 3, a light source 4, a gas supply device 5, a housing 6, a control device 7, and a display 8. At least a portion of each of the processing device 2 and the workbench device 3 is accommodated in a chamber space 63IN inside the housing 6.

[0051] The material supply device 1 supplies the molding material M to the processing device 2. The material supply device 1 supplies the molding material M at a supply rate corresponding to the required amount in such a manner that the molding material M required per unit time by the processing device 2 for forming the three-dimensional structure ST is supplied to the processing device 2. That is, the material supply device 1 supplies the molding material M in such a manner that the supply amount of the molding material M per unit time becomes a desired supply amount corresponding to the required amount. It should be noted that, regarding the structure of the material supply device 1, refer to Figure 3 The details will be described later, so the detailed description here is omitted.

[0052] The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or above. As such a modeling material M, for example, at least one of a metal material and a resin material can be used. However, as the modeling material M, other materials different from the metal material and the resin material can also be used. The modeling material M is a powdery material. That is, the modeling material M is a powder. In addition to the powdery material, the powder can also include a granular material. The modeling material M can also include, for example, a powder with a particle size in the range of 90 microns ± 40 microns. The average particle size of the powder constituting the modeling material M can be, for example, 75 microns, or other sizes. However, the modeling material M may not be a powder, and for example, a linear modeling material or a gaseous modeling material can also be used. In addition, the processing system SYSa can also process the modeling material M using an energy beam such as a charged particle beam to form a modeling object.

[0053] The processing device 2 uses the modeling material M supplied from the material supply device 1 to form a three-dimensional structure ST. In order to form the three-dimensional structure ST using the modeling material M, the processing device 2 has a processing head 21 and a head drive system 22. In addition, the processing head 21 has an irradiation optical system 211 and a material nozzle (i.e., a supply system for supplying the modeling material M) 212. The processing head 21 and the head drive system 22 are accommodated in the chamber space 63IN. However, at least a portion of the processing head 21 and / or the head drive system 22 may also be arranged in a space outside the housing 6, i.e., an external space 64OUT. In addition, the external space 64OUT may also be a space that an operator of the processing system SYSa can enter.

[0054] The irradiation optical system 211 is an optical system (for example, a focusing optical system) for emitting the processing light EL from the emission section 213. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits the processing light EL via an optical transmission component 41 such as an optical fiber or a light guide. The irradiation optical system 211 emits the processing light EL transmitted from the light source 4 via the optical transmission component 41. The irradiation optical system 211 emits the processing light EL in such a manner that the processing light EL advances in the chamber space 63IN. The irradiation optical system 211 irradiates the processing light EL from the irradiation optical system 211 downward (that is, the -Z side). A workbench 31 is arranged below the irradiation optical system 211. When the workpiece W is placed on the workbench 31, the irradiation optical system 211 irradiates the processing light EL toward the workpiece W. Specifically, the irradiation optical system 211 can irradiate the processing light EL to the irradiation area EA set on the workpiece W as an area to be irradiated with the processing light EL (typically, focused). Furthermore, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated to the irradiation area EA and a state in which the processing light EL is not irradiated to the irradiation area EA under the control of the control device 7. In addition, the direction of the processing light EL emitted from the irradiation optical system 211 is not limited to being directly downward (i.e., consistent with the -Z axis direction), and for example, it may be a direction inclined at a predetermined angle relative to the Z axis.

[0055] The material nozzle 212 has a supply outlet 214 for supplying the modeling material M. The material nozzle 212 supplies the modeling material M from the supply outlet 214 (for example, sprays, ejects, or blows). Figure 1 , the material nozzle 212 is depicted as a tube, but the shape of the material nozzle 212 is not limited to this shape. The material nozzle 212 supplies the modeling material M to the chamber space 63IN. The material nozzle 212 supplies the modeling material M from the material nozzle 212 toward the bottom (i.e., the -Z side). A workbench 31 is arranged below the material nozzle 212. When the workbench 31 is loaded with a workpiece W, the material nozzle 212 supplies the modeling material M toward the workpiece W. In addition, the traveling direction of the modeling material M supplied from the material nozzle 212 is a direction inclined at a predetermined angle (an acute angle as an example) relative to the Z-axis direction, but it may also be the -Z side (i.e., directly below).

[0056] In the first embodiment, the material nozzle 212 is aligned with respect to the irradiation optical system 211 so as to supply the modeling material M toward the irradiation area EA irradiated with the processing light EL by the irradiation optical system 211. That is, the material nozzle 212 and the irradiation optical system 211 are aligned so that the supply area MA set on the workpiece W as the area where the material nozzle 212 supplies the modeling material M coincides with (or at least partially overlaps with) the irradiation area EA. Alternatively, the material nozzle 212 may be aligned so as to supply the modeling material M to the molten pool MP formed by the processing light EL emitted from the irradiation optical system 211.

[0057] The material nozzle 212 is physically connected to the material supply device 1 as a supply source of the modeling material M via a material supply pipe 191 such as a tube. The material nozzle 212 supplies the modeling material M supplied from the material supply device 1 via the material supply pipe 191. The material nozzle 212 may also pressure-feed the modeling material M supplied from the material supply device 1 via the material supply pipe 191. That is, the modeling material M from the material supply device 1 may be mixed with a transport gas (for example, an inert gas such as nitrogen or argon) and pressure-feeded to the material nozzle 212 via the material supply pipe 191.

[0058] A valve 192 may be provided on the material supply pipe 191. The state of the valve 192 may be switched between a closed state in which the material supply pipe 191 is closed and an open state in which the material supply pipe 191 is opened under the control of the control device 7. When the valve 192 is in the closed state, the modeling material M is not supplied from the material supply device 1 to the processing device 2 via the material supply pipe 191. On the other hand, when the valve 192 is in the open state, the modeling material M can be supplied from the material supply device 1 to the processing device 2 via the material supply pipe 191. Furthermore, when the valve 192 is in the open state, the valve 192 may be adjusted to adjust the supply amount of the modeling material M supplied to the processing device 2 via the material supply pipe 191 by adjusting the opening of the valve 192. In addition, the valve 192 may be switched between a closed state in which the material supply pipe 191 is closed and an open state in which the material supply pipe 191 is opened, regardless of the control of the control device 7. For example, the state of the valve 192 may be switched between the closed state and the open state manually.

[0059] The head drive system 22 moves the processing head 21. The head drive system 22, for example, moves the processing head 21 in the chamber space 63IN. The head drive system 22 moves the processing head 21 along at least one of the X-axis, the Y-axis, and the Z-axis. When the processing head 21 moves along at least one of the X-axis and the Y-axis, the irradiation area EA and the supply area MA move along at least one of the X-axis and the Y-axis on the workpiece W, respectively. In addition, the head drive system 22 can also move the processing head 21 along at least one rotation direction of the θX direction, the θY direction, and the θZ direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis. In other words, the head drive system 22 can also rotate the processing head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. The head drive system 22 can also change the posture of the processing head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. The head drive system 22 includes, for example, an actuator such as a motor.

[0060] In addition, the head driving system 22 may also move the irradiation optical system 211 and the material nozzle 212 separately. Specifically, for example, the head driving system 22 may also be able to adjust at least one of the position of the injection portion 213, the direction of the injection portion 213, the position of the supply outlet 214, and the direction of the supply outlet 214. In this case, the irradiation area EA where the irradiation optical system 211 irradiates the processing light EL and the supply area MA where the material nozzle 212 supplies the modeling material M can be controlled separately.

[0061] The workbench device 3 has a workbench 31. The workbench 31 is accommodated in the chamber space 63IN. The workbench 31 can support the workpiece W. In addition, the state of "the workbench 31 supports the workpiece W" mentioned here may also refer to a state in which the workpiece W is directly or indirectly supported by the workbench 31. The workbench 31 may also be able to hold the workpiece W. That is, the workbench 31 may also support the workpiece W by holding the workpiece W. Alternatively, the workbench 31 may not be able to hold the workpiece W. In this case, the workpiece W may also be placed on the workbench 31. That is, the workbench 31 may also support the workpiece W placed on the workbench 31. At this time, the workpiece W may also be placed on the workbench 31 by a clamping press. Therefore, the state of "the workbench 31 supports the workpiece W" in this embodiment may also include a state in which the workbench 31 holds the workpiece W and a state in which the workpiece W is placed on the workbench 31. Since the workbench 31 is accommodated in the chamber space 63IN, the workpiece W supported by the workbench 31 is also accommodated in the chamber space 63IN. Furthermore, the workbench 31 can release the workpiece W while holding the workpiece W. The irradiation optical system 211 irradiates the processing light beam PL at least part of the time when the workbench 31 supports the workpiece W. Furthermore, the material nozzle 212 supplies the modeling material M at least part of the time when the workbench 31 supports the workpiece W. In addition, a part of the modeling material M supplied by the material nozzle 212 may be scattered or spilled from the surface of the workpiece W to the outside of the workpiece W (for example, to the surroundings of the workbench 31). Therefore, the processing system SYSa may also have a recovery device around the workbench 31 for recovering the scattered or spilled modeling material M. In addition, in order to hold the workpiece W, the workbench 31 may also have a mechanical chuck, a vacuum adsorption chuck, etc.

[0062] The workbench device 3 may also have a workbench drive system 32. The workbench 31 may also be movable by the workbench drive system 32. In this case, the workbench drive system 32 may, for example, move the workbench 31 within the chamber space 63IN. The workbench drive system 32 may also move the workbench 31 along at least one of the X-axis, the Y-axis, and the Z-axis. When the workbench 31 moves along at least one of the X-axis and the Y-axis, the irradiation area EA and the supply area MA move along at least one of the X-axis and the Y-axis on the workpiece W, respectively. In addition, in addition to at least one of the X-axis, the Y-axis, and the Z-axis, the workbench drive system 32 may also move the workbench 31 in a rotation direction of at least one of the θX direction, the θY direction, and the θZ direction. The workbench drive system 32 may include an actuator such as a motor. In the case where the workbench device 3 has the workbench drive system 32, the processing device 2 may not have the head drive system 22. Similarly, in the case where the processing device 2 has the head drive system 22, the workbench device 3 may not have the workbench drive system 32.

[0063] The light source 4 emits, for example, at least one of infrared light and ultraviolet light as the processing light EL. However, as the processing light EL, light of other wavelengths, for example, light of a wavelength in the visible region, may also be used. The processing light EL is a laser. In this case, the light source 4 may also include a laser light source such as a semiconductor laser. As an example of a laser light source, at least one of a laser diode (LD: Laser Diode), a fiber laser, a CO2 laser, a YAG laser, and an excimer laser may be cited. However, the processing light EL may not be a laser, and the light source 4 may also include any light source (for example, at least one of an LED (Light Emitting Diode: light emitting diode) and a discharge lamp).

[0064] The gas supply device 5 is a supply source of a purge gas for purging the chamber space 631IN. The purge gas includes an inert gas. As an example of an inert gas, nitrogen or argon can be cited. The gas supply device 5 supplies the purge gas to the chamber space 63IN. Specifically, the gas supply device 5 supplies the purge gas to the chamber space 63IN via a gas supply pipe 51 that connects the gas supply device 5 to the housing 6 (particularly the chamber space 63IN inside the housing 6). As a result, the chamber space 63IN becomes a space purged by the purge gas.

[0065] The gas supply device 5 also supplies an inert gas to the material supply device 1. Specifically, the gas supply device 5 supplies a purge gas to the material supply device 1 via a gas supply pipe 52 connecting the gas supply device 5 and the material supply device 1. As described later, the purge gas supplied to the material supply device 1 is mainly used to pressurize the molding material M from the material supply device 1 to the material nozzle 212. Therefore, the gas supply device 5 supplies pressurized purge gas to the material supply device 1. In addition, the gas supply device 5 may also be a gas cylinder containing a purge gas such as nitrogen or argon. In the case where the purge gas is nitrogen, the gas supply device 5 may also be a nitrogen generator that uses the atmosphere as a raw material to generate nitrogen.

[0066] A valve 53 may also be provided on the gas supply pipe 52. The state of the valve 53 may also be switched between a closed state in which the gas supply pipe 52 is closed and an open state in which the gas supply pipe 52 is opened under the control of the control device 7. When the valve 53 is in a closed state, the purge gas is not supplied from the gas supply device 5 to the chamber space 63IN via the gas supply pipe 52. On the other hand, when the valve 53 is in an open state, the purge gas can be supplied from the gas supply device 5 to the chamber space 63IN via the gas supply pipe 52. Moreover, when the valve 53 is in an open state, the valve 53 may also adjust the supply amount of the purge gas supplied to the chamber space 63IN via the gas supply pipe 52 by adjusting the opening of the valve 53. In addition, the valve 53 may also be switched between a closed state and an open state regardless of the control of the control device 7. For example, the state of the valve 53 may also be switched manually between a closed state and an open state.

[0067] The gas supply device 5 may also control the gas supply mode to the chamber space 63IN and the gas supply mode to the material supply device 1 separately. For example, the gas supply device 5 may control the gas supply mode to each of the chamber space 63IN and the material supply device 1 so that the supply amount per unit time of the purge gas to the chamber space 63IN is different from the supply amount per unit time of the purge gas to the material supply device 1. For example, the gas supply device 5 may control the gas supply mode to each of the chamber space 63IN and the material supply device 1 in a state where the purge gas supply to either the chamber space 63IN or the material supply device 1 is stopped and the purge gas is supplied to the other of the chamber space 63IN and the material supply device 1. In addition, the characteristics (for example, temperature, etc.) of the purge gas supplied to the chamber space 63IN and the purge gas supplied to the material supply device 1 may be different. The composition of the purge gas supplied to the chamber space 63IN and the purge gas supplied to the material supply device 1 may be different. In addition, the processing system SYSa may include a gas supply device that supplies the purge gas to the chamber space 63IN and a gas supply device that supplies the purge gas to the material supply device 1 .

[0068] The housing 6 is a storage device that stores at least a portion of each of the processing device 2 and the workbench device 3 in the chamber space 63IN which is the internal space of the housing 6. The housing 6 includes a partition member 61 that defines the chamber space 63IN. The partition member 61 is a member that separates the chamber space 63IN from the external space 64OUT of the housing 6. The partition member 61 faces the chamber space 63IN across its inner wall 611, and faces the external space 64OUT across its outer wall 612. In this case, the space surrounded by the partition member 61 (more specifically, the space surrounded by the inner wall 611 of the partition member 61) becomes the chamber space 63IN. In addition, a door that can be opened and closed can also be provided on the partition member 61. The door can also be opened when the workpiece W is placed on the workbench 31 and when the workpiece W and / or the molded object is taken out from the workbench 31, and closed during molding.

[0069] The control device 7 controls the operation of the machining system SYSa. The control device 7 may include, for example, a CPU (Central Processing Unit) (or a GPU (Graphics Processing Unit) in addition to or instead of the CPU) and a memory. The control device 7 functions as a device that controls the operation of the machining system SYSa by executing a computer program by the CPU. The computer program is a computer program for causing the control device 7 (for example, the CPU) to perform (i.e., execute) the operation to be described later that the control device 7 should perform. That is, the computer program is a computer program for causing the control device 7 to perform the function of causing the machining system SYSa to perform the operation to be described later. The computer program executed by the CPU may be recorded in a memory (i.e., a recording medium) possessed by the control device 7, or in any storage medium (for example, a hard disk, a semiconductor memory) that is built into the control device 7 or can be externally mounted on the control device 7. Alternatively, the CPU may download the computer program to be executed from a device external to the control device 7 via a network interface.

[0070] For example, the control device 7 may also control the emission mode of the processing light EL of the irradiation optical system 211. The emission mode may also include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. In the case where the processing light EL is a pulse light, the emission mode may also include, for example, the ratio of the length of the emission time of the pulse light to the emission period of the pulse light (the so-called duty cycle). In addition, the emission mode may also include, for example, the length of the emission time of the pulse light itself and the emission period itself. In addition, the control device 7 may also control the movement mode of the processing head 21 based on the head driving system 22. The movement mode may also include, for example, at least one of the movement amount, the movement speed, the movement direction and the movement timing. Furthermore, the control device 7 may also control the supply mode of the molding material M based on the material supply device 1. The supply mode of the molding material M based on the material nozzle 212 is mainly determined by the supply mode of the molding material M based on the material supply device 1. Therefore, controlling the supply mode of the molding material M based on the material supply device 1 can be regarded as equivalent to controlling the supply mode of the molding material M based on the material nozzle 212. The supply method may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing.

[0071] The control device 7 may not be arranged inside the processing system SYSa, for example, it may be arranged outside the processing system SYSa as a server or the like. In this case, the control device 7 and the processing system SYSa may be connected via a wired or wireless network (or a data bus and / or a communication line). As a wired network, for example, a network using a serial bus interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be applied. As a wired network, a network using a parallel bus interface may also be applied. As a wired network, a network using an interface based on Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX and 1000BASE-T may also be applied. As a wireless network, a network using radio waves may also be applied. As an example of a network using radio waves, a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) is cited. As a wireless network, a network using infrared rays may also be used. As a wireless network, a network using optical communication may also be used. In this case, the control device 7 and the processing system SYSa may also be configured to be able to send and receive various information via a network. In addition, the control device 7 may also be able to send information such as instructions and control parameters to the processing system SYSa via the network. The processing system SYSa may also have a receiving device that receives information such as instructions and control parameters from the control device 7 via the above-mentioned network.

[0072] In addition, a part of the control device 7 may be provided inside the processing system SYSa, and another part may be provided outside the processing system SYSa.

[0073] In addition, as a recording medium for recording a computer program executed by the CPU, at least one of CD-ROM, CD-R, CD-RW, floppy disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW and Blu-ray (registered trademark) and other optical disks, magnetic media such as magnetic tapes, optical magnets, semiconductor memories such as USB memories, and other arbitrary media capable of storing programs may be used. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device installed in a state capable of executing a computer program in at least one of software and firmware). Furthermore, each process and function included in the computer program may be realized by a logic processing block realized in the control device 7 (i.e., a computer) by executing the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) possessed by the control device 7, or may be realized in the form of a mixture of a logic processing block and a partial hardware module that realizes a part of the elements of the hardware.

[0074] (1-2) Material supply device 1

[0075] Next, the material supply device 1 included in the machining system SYSa will be further described.

[0076] (1-2-1) Structure of Material Supply Device 3

[0077] First, refer to Figure 3 The structure of the material supply device 1 will be described. Figure 3 2 is a cross-sectional view showing the structure of the material supply device 1. Figure 3 This is merely an example of the structure of the material supply device 1, and the processing system SYSa may also include Figure 3 The material supply device 1 has a structure different from the structure shown in the figure. The processing system SYSa may include any material supply device 1 having any structure capable of supplying the modeling material M stored inside to the processing device 2. In addition, the material supply device 1 may also be a structure capable of supplying the modeling material M stored outside to the processing device 2. For example, the modeling material M may also be stored in a storage unit outside the processing system SYSa. It is also possible to supply the material to multiple processing systems SYSa from the external storage unit.

[0078] like Figure 3As shown, the material supply device 1 includes a hopper 11, a holding member 12, a conveying member 13, a driving device 14, a material delivery member 15, a housing (in other words, a container) 16, a connecting pipe 17, a supporting member 18, and a weight measuring device 19. The holding member 12, the conveying member 13, and the material delivery member 15 are accommodated in a space surrounded by a partition member 161 of a housing 16 having a box shape (or other shapes) (i.e., an internal space 16IN of the housing 16). The hopper 11 and the driving device 14 are arranged in an external space 16OUT separated from the internal space 16IN by the partition member 161. However, at least one of the hopper 11 and the driving device 14 may be arranged in the internal space 16IN.

[0079] The hopper 11 is a device for storing the modeling material M. The hopper 11 serves as a supply source for the modeling material M. The hopper 11 has a funnel-shaped shape (i.e., an inverted cone-shaped shape). The space surrounded by the partition member 111 having a funnel-shaped shape corresponds to a storage space 112 for storing the modeling material M. However, the hopper 11 may also have other shapes. For example, the shape of the hopper 11 may also be an inverted pyramid (for example, an inverted quadrangular pyramid).

[0080] A supply port 113 is formed at the lower end of the hopper 11 (i.e., below the storage space 112). The supply port 113 is an opening (i.e., a through hole) that penetrates the partition member 111 in the Z-axis direction at the bottom of the hopper 11. Alternatively, in the case where the partition member 111 is not formed at the lower end of the hopper 11, the open end of the lower part of the hopper 11 where the partition member 111 is not formed can also be used as the supply port 113. The shape of the cross section of the supply port 113 (specifically, the cross section along the XY plane) is circular, but it can also be other shapes (for example, at least one of an oblong, an elliptical, a rectangular, and a polygonal shape). The supply port 113 is an opening for supplying the modeling material M from the hopper 11 to the lower side of the hopper 11 (i.e., the -Z side). That is, the modeling material M stored in the storage space 112 of the hopper 11 is supplied to the outside of the hopper 11 (in other words, discharged or dropped) via the supply port 113.

[0081] The hopper 11 is arranged on the partition member 161 of the outer shell 16. Specifically, the hopper 11 is arranged on the top surface member 1611 located above the internal space 16IN in the partition member 161. A supply port 162 is formed on the top surface member 1611. The supply port 162 is an opening (i.e., a through hole) that passes through the top surface member 1611 from the external space 16OUT toward the internal space 16IN. The supply port 162 of the outer shell 16 is connected to the supply port 113 of the hopper 11. Therefore, the supply port 162 is essentially an opening (i.e., a through hole) that passes through the top surface member 1611 from the supply port 113 toward the internal space 16IN. Therefore, the modeling material M stored in the storage space 112 of the hopper 11 is supplied (in other words, discharged or dropped) to the internal space 16IN of the outer shell 16 via the supply port 113 and the supply port 162.

[0082] A material replenishment port 114 is formed at the upper end of the hopper 11. The material replenishment port 114 is an opening that penetrates the partition member 111 in the Z-axis direction at the upper end of the hopper 11. Alternatively, when the partition member 111 is not formed at the upper end of the hopper 11, the open end of the upper part of the hopper 11 where the partition member 111 is not formed may be used as the material replenishment port 114. The material replenishment port 114 is an opening for replenishing the modeling material M to the hopper 11 (particularly the storage space 112). The material replenishment port 114 is usually (specifically, during the period when the modeling material M is not replenished to the hopper 11) sealed by the cover 115. In this case, the cover 115 may also function as a partition member that defines the storage space 112 together with the partition member 111. The cover 115 may also function as a partition member that maintains the airtightness of the storage space 112 together with the partition member 111. The cover 115 is opened during the period when the modeling material M is replenished to the hopper 11. In addition, the material replenishment port 114 can also be used for purposes other than replenishing the modeling material M (for example, maintenance of the hopper 11, etc.). In addition, the partition member 111 and the cover 115 of the hopper 11 can also be connected by a hinge. In addition, a metal mesh can also be provided on the upper part of the hopper 11 to prevent foreign matter from mixing in.

[0083] An opening 116 is formed in the partition member 111 of the hopper 11 (for example, a portion located relatively above and below the material replenishment port 114). The opening 116 is a through hole that passes through the partition member 111 from the storage space 111 toward the space outside the hopper 11 (specifically, the external space 16OUT of the housing 16). Therefore, the storage space 112 is connected to the external space 16OUT via the opening 116. However, as described in detail later, a connecting pipe 17 is installed in the opening 116. Therefore, when the connecting pipe 17 is installed in the opening 116, the storage space 112 is separated from the external space 16OUT. In addition, a through hole formed in the cover 115 may be used as the opening 116 on the basis of or in place of the through hole formed in the partition member 111.

[0084] The holding member 12 holds the modeling material M supplied from the supply port 113 of the hopper 11 to the internal space 16IN via the supply port 162. In order to hold the modeling material M supplied from the hopper 11, the holding member 12 is arranged below each of the supply port 113 and the supply port 162. The holding member 12 is arranged in a manner that a portion of the holding member 12 is located directly below each of the supply port 113 and the supply port 162. The holding member 12 is arranged in a manner that a portion of the holding member 12 is located in a falling path of the modeling material M from the supply port 113 and the supply port 162. The holding member 12 is arranged in a manner that a portion of the holding member 12 is opposite to each of the supply ports 162 along the Z-axis direction.

[0085] The holding component 12 is supported by the partition component 161 (particularly the top surface component 1611) of the housing 6. However, the holding component 12 may also be supported by any other component. For example, the holding component 12 may also be supported by the side wall component 1612 located on the side of the internal space 16IN in the partition component 161. For example, the holding component 12 may also be supported by the bottom component 1613 located below the internal space 16IN in the partition component 161. For example, the holding component 12 may also be supported by a supporting component not shown in the figure.

[0086] like Figure 3 And a side view showing the structure of the holding member 12, namely Figure 4 As shown, the holding member 12 is a cylindrical member (i.e., a hollow member). Specifically, the holding member 12 is a member having a cylindrical space 121 extending in a direction intersecting the Z-axis direction. That is, the holding member 12 is a member whose length direction is the direction intersecting the Z-axis direction. In addition, Figure 3 as well as Figure 4An example is shown in which the space 121 is a space extending in the Y-axis direction, but the space 121 may be a space extending in the X-axis direction or a space extending in a direction inclined relative to the Z-axis. The space 121 is a space surrounded by the inner wall surface 122 of the holding component 12. The shape of the cross section of the inner wall surface 122 including the Z-axis is circular. In this case, the shape of the cross section of the cylindrical space 121 including the Z-axis is circular. That is, the holding component 12 becomes a cylindrical component. In addition, the "cylindrical component" mentioned here refers to a component in which the shape of the cross section of the inner wall surface 122 is circular. Therefore, the shape of the cross section of the outer wall surface of the holding component 12 is not limited to a circle, but may be any shape (for example, at least one of an oblong, an ellipse, a rectangle, and a polygon). However, the shape of the cross section of the inner wall surface 122 including the Z-axis may also be other shapes (for example, at least one of an oblong, an ellipse, a rectangle, and a polygon). Since the holding component 12 is arranged in the internal space 16IN, the space 121 constitutes at least a part of the internal space 16IN.

[0087] A supply port 123 is formed on the holding member 12. The supply port 123 is an opening (i.e., a through hole) that penetrates the holding member 12 in the Z-axis direction. The supply port 123 is a through hole that penetrates the holding member 12 from the space 121 toward one direction. The supply port 123 is a through hole that penetrates the holding member 12 toward a direction (e.g., the Z-axis direction (upward)) that intersects the direction in which the space 121 extends (e.g., the Y-axis direction). The supply port 123 is connected to the supply port 162 located above the holding member 12. That is, the holding member 12 is configured in such a manner that the supply port 123 is connected to the supply port 162. In this case, since the holding member 12 is configured below the supply port 162, the supply port 123 is a through hole that penetrates the holding member 12 from the space 121 toward the upward direction. Since the supply port 123 is connected to the supply port 162, the storage space 112 is connected to the space 121 via the supply ports 113, 162, and 123. Therefore, the modeling material M supplied from the storage space 112 to the internal space 16IN via the supply port 113 and the supply port 162 is supplied to the space 121 via the supply port 123. That is, the modeling material M is supplied from the storage space 112 to the space 121 via the supply port 113, the supply port 162, and the supply port 123. The modeling material M is supplied from the hopper 11 to the holding member 12 in a manner of falling from the storage space 112 via the supply port 113, the supply port 162, and the supply port 123 toward the space 121.

[0088] The modeling material M supplied to the space 121 is accumulated on the inner wall surface 122. Specifically, the modeling material M supplied to the space 121 falls and accumulates on the surface portion of the inner wall surface 122 located below the supply port 113, the supply port 162, and the supply port 123. The inner wall surface 122 holds the modeling material M accumulated on at least a portion of the inner wall surface 122. Therefore, the inner wall surface 122 has a holding surface 1221 for holding the modeling material M supplied from the hopper 11. At least a portion of the inner wall surface 122 functions as the holding surface 1221. For example, since the holding surface 1221 holds the modeling material M falling downward due to gravity, at least a portion of the surface portion of the inner wall surface 122 facing upward (i.e., +Z side) functions as the holding surface 1221. For example, since the holding surface 1221 holds the modeling material M dropped from the supply ports 113, 162, and 123, at least a portion of the surface portion of the inner wall surface 122 located downwardly away from the supply ports 113, 162, and 123 functions as the holding surface 1221. In addition, since the holding surface 1221, which is at least a portion of the inner wall surface 122, holds the modeling material M, the space 121 defined by the inner wall surface 122 functions as a space for holding the modeling material M supplied from the hopper 11. Therefore, in the following description, the space 121 is referred to as "holding space 121".

[0089] At least a portion of the conveying member 13 is disposed in the holding space 121. Figure 3 as well as Figure 4 As shown, at least a portion of the transport member 13 is surrounded by the inner wall surface 122 defining the holding space 121. A gap SP is formed between the transport member 13 and the inner wall surface 122. Therefore, the modeling material M supplied to the holding space 121 is held between the inner wall surface 122 and the transport member 13. In other words, the modeling material M supplied to the holding space 121 is held between the holding member 12 and the transport member 13. Therefore, at least a portion of the surface portion of the inner wall surface 122 that faces the transport member 13 can also function as the above-mentioned holding surface 1221.

[0090] The transport member 13 is a member for transporting the modeling material M held by the holding member 12 from the holding member 12 to the outside of the holding member 12. The transport member 13 is a member for transporting the modeling material M held by the holding space 121 from the holding space 121 to the outside of the holding space 121. The transport member 13 is a member for transporting the modeling material M held by the inner wall surface 122 (particularly the holding surface 1221) from the inner wall surface 122 to the outside of the inner wall surface 122.

[0091] The transport member 13 transports the modeling material M along the direction in which the holding space 121 extends. As a result, the transport member 13 transports the modeling material M held by the holding space 121 from the holding space 121 to the outside of the holding space 121 via the opening (i.e., open end) 124 of the holding member 12 defining the end of the holding space 121. That is, the opening 124 is used as a transport port for transporting the modeling material M from the holding member 12 to the outside of the holding member 12. Therefore, hereinafter, the opening 124 is referred to as a "transport port 124".

[0092] Since the transport member 13 transports the molding material M dropped from the supply ports 113, 162, and 123 to the holding space 121, at least a portion of the transport member 13 is located below the supply ports 113, 162, and 123. Since the transport member 13 transports the molding material M dropped onto the inner wall surface 122 (particularly the holding surface 1221), at least a portion of the transport member 13 is located above at least a portion of the inner wall surface 122 (particularly the holding surface 1221). That is, at least a portion of the transport member 13 is located between the supply ports 113, 162, and 123 and the inner wall surface 122 (particularly the holding surface 1221). As a result, the molding material M is supplied from the hopper 11 to the transport member 13 along the gravity direction.

[0093] The conveying member 13 may have any structure as long as it can convey the modeling material M. Figure 3 and Figure 5 (a) to Figure 5 (b) and Figure 6 (a) to Figure 6 (c) An example of the structure of the conveying member 13 is described. Figure 5 (a) is a perspective view showing a first example of the structure of the conveying member 13 included in the material supply device 1. Figure 5 (b) is a front view showing the structure of a first example of the conveying member 13 included in the material supply device 1. Figure 6 (a) is a perspective view showing the structure of a second example of the conveying member 13 included in the material supply device 1. Figure 6 (b) to Figure 6 (c) are cross-sectional views showing the structure of a second example of the conveying member 13 included in the material supply device 1.

[0094] like Figure 3 as well as Figure 5 (a) to Figure 6As shown in (c), the conveying member 13 is a member extending in a desired direction. Specifically, the conveying member 13 is a member extending in a direction in which the holding space 121 extends. That is, the conveying member 13 is a member extending in a length direction of the holding member 12. Since the holding space 121 extends in a direction intersecting the Z axis, the conveying member 13 is a member extending in a direction intersecting the Z axis. Figure 5 Although the example in which the conveying member 13 is a member extending in the Y-axis direction is shown, the conveying member 13 may be a member extending in the X-axis direction or a member extending in a direction inclined with respect to the Z-axis. The conveying member 13 is arranged in the holding space 121 so as to extend in the direction in which the holding space 121 extends.

[0095] In the case where the transport member 13 is a member extending in a direction intersecting the Z axis, the transport member 13 may also include an axis member 131 extending in a direction intersecting the Z axis. The axis member 131 is a member whose cross-section including the Z axis is circular. However, the axis member 131 may also be a member whose cross-section including the Z axis is in another shape (for example, at least one of an oblong, an elliptical, and a rectangular shape). The transport member 13 is arranged in the holding space 121 so that the axis member 131 extends in the direction in which the holding space 121 extends.

[0096] The conveying member 13 is a member having a spiral groove 132 formed on its side. Specifically, the conveying member 13 is a member having a groove 132 formed on its side that extends (i.e., advances) in the direction in which the conveying member 13 extends while rotating around an axis along the direction in which the conveying member 13 extends. The conveying member 13 is a member having a groove 132 formed on its side that extends (i.e., advances) in the direction in which the conveying member 13 extends while surrounding the side of the conveying member 13. The pitch of the spiral groove 132 (i.e., period, for example, the distance the groove 132 extends (i.e., advances) during one rotation of the groove 132) is constant, but may also be variable. An example of a conveying member 13 having such a groove 132 formed on its side is as follows. Figure 5 (a) to Figure 5 (b) and Figure 6 (a) to Figure 6 As shown in (c).

[0097] Figure 5 (a) to Figure 5 (b) shows a first example of a conveying member 13 having a groove 132 formed on the side surface. Figure 5 (a) to Figure 5As shown in (b), a protrusion 133 protruding from the side of the shaft part 131 may be formed on the side of the shaft part 131 to define (i.e., form) a spiral groove 132. In this case, the groove 132 is formed between two adjacent protrusions 133. That is, the space sandwiched by the two adjacent protrusions 133 becomes the groove 132. Therefore, the groove 132 is formed in parallel with the protrusion 133. In addition, the "state in which the groove 132 is parallel to the protrusion 133" mentioned here not only includes the state in which the direction in which the groove 132 extends is completely parallel to the direction in which the protrusion 133 extends as the word indicates, but also includes the state in which the direction in which the groove 132 extends is not strictly parallel to the direction in which the protrusion 133 extends but can be regarded as substantially parallel (i.e., the direction in which the groove 132 extends is roughly parallel to the direction in which the protrusion 133 extends). In this case, the protrusion 133 may also function as a partition wall that defines the groove 132. In addition, Figure 5 (a) to Figure 5 The dimensions of the shaft member 131 and the protrusion 133 shown in (b) are only an example and may be different from the above. Figure 5 (a) to Figure 5 For example, the radial dimension of the protrusion 133 relative to the diameter of the shaft member 131 may be greater than Figure 5 (a) to Figure 5 The example shown in (b) is smaller than Figure 5 (a) to Figure 5 The example shown in (b) is larger.

[0098] Since the protrusion 133 forms the spiral groove 132, the protrusion 133 also becomes a spiral component. Specifically, the protrusion 133 is formed in a manner that describes a spiral on the side of the shaft member 131. The protrusion 133 is formed so as to describe a spiral while surrounding the side of the shaft member 131. The position where the protrusion 133 is formed on the side of the shaft member 131 describes a spiral on the side of the shaft member 131. The protrusion 133 extends along the direction in which the shaft member 131 extends while rotating around an axis along the direction in which the shaft member 131 extends on the side of the shaft member 131.

[0099] Figure 6 (a) to Figure 6 (c) shows a second example of the conveying member 13 having a groove 132 formed on the side. Figure 6 (a) to Figure 6As shown in (c), a depression (i.e., a concave portion) defining the spiral groove 132 may be formed on the side of the shaft member 131. That is, a conveying member 13 having a groove 132 formed on the side may be formed by processing the side of the shaft member 131 to form a depression in the side of the shaft member 131 so as to form the groove 132. A conveying member 13 having a groove 132 formed on the side may be formed by engraving the side of the shaft member 131 to form the groove 132. In this case, a portion of the shaft member 131 where the groove 132 is not formed (e.g., a portion where the engraving process is not performed or a convex portion protruding relative to the groove 132) may substantially function as a protrusion 133 defining the groove 132. Therefore, in the following description, for the sake of convenience, the second example of the conveying member 13 is also described as a member having a protrusion 133 formed on the side of the shaft member 131, similar to the first example of the conveying member 13.

[0100] In addition, the shape of the cross section of the groove 132 formed on the side surface of the shaft member 131 along the XZ plane may be any shape. Figure 6 (b) shows an example in which the cross-sectional shape of the groove 132 formed on the side surface of the shaft member 131 along the XZ plane is a rectangular shape (for example, a trapezoidal shape). Figure 6 (c) shows an example in which the cross-sectional shape of the groove 132 formed on the side surface of the shaft member 131 along the XZ plane is an arc shape. Figure 6 (a) to Figure 6 The dimensions of the shaft member 131 and the groove 132 shown in (c) are only an example and may be different from the above. Figure 6 (a) to Figure 6 For example, the radial dimension of the groove 132 relative to the diameter of the shaft member 131 may be greater than Figure 6 (a) to Figure 6 The example shown in (c) is smaller than Figure 6 (a) to Figure 6 The example shown in (c) is larger.

[0101] In either the first example or the second example of the conveying member 13, the conveying member 13 can function as a screw. Figure 5 (a) to Figure 5 (b) and Figure 6 (a) to Figure 6 The conveying member 13 of the structure shown in (c) may also be a member that can function as a screw as the conveying member 13. In addition, the first example of the conveying member 13 can also function as an alkyd screw. Figure 5 (a) to Figure 5 (b) and Figure 6 (a) to Figure 6 The conveying member 13 of the structure shown in (c) may also be a member that can function as an alkyd screw as the conveying member 13. In addition, the second example of the conveying member 13 can function as a screw. Figure 5 (a) to Figure 5 (b) and Figure 6 (a) to Figure 6 In the conveying member 13 of the structure shown in (c), a member that can function as a screw may be used as the conveying member 13.

[0102] The transport member 13 transports the modeling material M via the groove 132. The transport member 13 transports the modeling material M in such a manner that the modeling material M moves via the groove 132 in the holding space 121. The transport member 13 transports the modeling material M in such a manner that the modeling material M moves along the groove 132 in the holding space 121. The transport member 13 transports the modeling material M from the holding space 121 to the outside of the holding member 12 via the transport port 124 of the holding member 12 using the groove 132. Therefore, the transport member 13 is arranged so as to penetrate the transport port 124.

[0103] In order to convey the modeling material M via the groove 132, the groove 132 is formed to extend from the holding space 121 toward the conveying port 124. More specifically, the groove 132 is formed to extend from at least a portion of the holding space 121 located directly below the supply port 123 toward the conveying port 124. The groove 132 is formed to extend from at least a portion of the conveying member 13 located directly below the supply port 123 toward a portion of the conveying member 13 located at the conveying port 124.

[0104] Furthermore, in order to transport the modeling material M via the groove 132, the driving device 14 drives the transporting member 13 formed with the groove 132. Therefore, the driving device 14 has a power source such as an electric motor in order to drive the transporting member 13. Specifically, the driving device 14 rotationally drives the transporting member 13 so that the shaft member 131 rotates with the axis along the direction in which the shaft member 131 extends (typically the central axis of the shaft member 131) as the rotation axis. As a result, the modeling material M held in the holding space 121 moves along the spiral groove 132 formed on the side of the rotating transporting member 13 in the direction in which the shaft member 131 extends (i.e., the direction in which the holding space 121 extends, i.e., the length direction of the holding member 12). That is, the modeling material M moves in a direction intersecting the Z axis. The modeling material M moves sideways. In this case, the driving device 14 rotationally drives the transporting member 13 so that the shaft member 132 is able to move the modeling material M toward the transport port 124 via the groove 132 (in Figure 3In the example shown, the transport member 13 rotates in the direction of rotation (moving toward the -Y side). As a result, the modeling material M held in the holding space 121 drops to the outside of the holding space 121 through the transport port 124. The modeling material M held on the inner wall surface 122 drops to the outside of the inner wall surface 122 through the transport port 124. That is, the transport member 13 transports the modeling material M to the outside of the holding member 12 by transporting the modeling material M and passing it through the transport port 124.

[0105] In order to drive the conveying member 13, the conveying member 13 is connected to the driving device 14. Specifically, the conveying member 13 (particularly the shaft member 131) extends from the internal space 16IN (particularly the holding space 121) to the external space 16OUT via the opening (i.e., the open end) 125 of the holding member 12 defining the end on the opposite side to the conveying port 124 and the opening 163 formed in the housing 16. The opening 163 is a through hole that penetrates the side wall member 1612 of the housing 16 from the internal space 16IN to the external space 16OUT. The conveying member 13 (particularly the shaft member 131) is connected to the driving device 14 disposed in the external space 16OUT via the openings 126 and 163.

[0106] A sealing member 164 for filling the gap between the conveying member 13 (especially the shaft member 131) and the partition member 161 may be formed in the opening 163 formed in the partition member 161. If the sealing member 164 is formed, it is possible to suppress the modeling material M in the internal space 16IN (especially the holding space 121) from accidentally being released to the external space 16OUT through the opening 163. Moreover, when the sealing member 164 is formed, it is possible to suppress the purge gas in the internal space 16IN (especially the holding space 121) from accidentally being released to the external space 16OUT through the opening 163. In addition, in the case where the sealing member 164 is a sealing member using grease, in order to prevent the grease of the sealing member from running out, a storage chamber for storing grease for replenishing the sealing member 164 may be formed around the sealing member 164. The grease stored in the storage chamber may also be replenished to the sealing member 164 by, for example, a capillary phenomenon.

[0107] As described above, a gap SP is formed between the conveying member 13 and the inner wall surface 122 defining the holding space 121. As a result, the conveying member 13 rotates smoothly compared to a case where the gap SP is not formed between the conveying member 13 and the inner wall surface 122. That is, the conveying member 13 rotates smoothly compared to a case where the conveying member 13 is in contact with the inner wall surface 122.

[0108] On the other hand, if a relatively large gap SP is formed between the conveying member 13 and the inner wall surface 122, a relatively large amount of modeling material M will intrude into the gap SP. As a result, regardless of the situation in which the modeling material M should be conveyed through the groove 132 of the rotating conveying member 13, there is a possibility that the modeling material M is conveyed through the gap SP instead of the groove 132 of the conveying member 13. Such conveyance of the modeling material M without passing through the groove 132 may cause a change in the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2. Therefore, the size of the gap SP (i.e., the interval between the conveying member 13 and the inner wall surface 122) d may also be set to a desired interval or less that can achieve a state in which the conveyance of the modeling material M through the gap SP is suppressed (typically, prevented).

[0109] In addition, the "size d of the gap SP" in the first embodiment may also refer to the gap between the portion of the conveying member 13 closest to the inner wall surface 122 and the inner wall surface 122. That is, the "size d of the gap SP" may also refer to the minimum value of the gap between the conveying member 13 and the inner wall surface 122. Figure 3 , Figure 5 (a) to Figure 5 (b) and Figure 5 (a) to Figure 5 As can be seen from (c), the portion of the conveying member 13 closest to the inner wall surface 122 is the protrusion 133 (particularly the portion of the protrusion 133 located on the outermost peripheral side). Therefore, the "size d of the gap SP" in the first embodiment may also refer to the interval between the protrusion 133 (particularly the portion of the protrusion 133 located on the outermost peripheral side) and the inner wall surface 122.

[0110] The size d of the gap SP may also be set according to the characteristics of the modeling material M. For example, since the modeling material M is a powder, the smaller the size (e.g., particle size) of the modeling material M is, the more modeling material M invades the gap SP. Therefore, the size d of the gap SP may also be set according to the size (e.g., particle size) of the modeling material M. For example, the size d of the gap SP may also be set according to the maximum particle size of the modeling material M (i.e., the maximum size assumed as the particle size of the modeling material M). For example, the size d of the gap SP may also be set to be less than 2 times the maximum particle size of the modeling material M. In the case where the size d of the gap SP is set to be less than 2 times the maximum particle size of the modeling material M, the transportation of the modeling material M through the gap SP is suppressed compared to the case where the size d of the gap SP is set to be larger than 2 times the maximum particle size of the modeling material M. Alternatively, for example, the size d of the gap SP may also be set to be less than 1 times the maximum particle size of the modeling material M. When the size d of the gap SP is set to be less than 1 times the maximum particle size of the modeling material M, the conveyance of the modeling material M through the gap SP is suppressed compared to when the size d of the gap SP is set to be larger than 1 times the maximum particle size of the modeling material M.

[0111] Again in Figure 4 In the embodiment, the material delivery component 15 receives the modeling material M delivered by the conveying component 13 from the holding component 12. The conveying component 13 delivers the modeling material M in such a manner that the modeling material M falls from the holding component 12. Therefore, the material delivery component 15 receives the modeling material M falling from the holding component 12. In this case, the material delivery component 15 is arranged at a position capable of receiving the modeling material M delivered from the holding component 12. For example, the material delivery component 15 may also be arranged at least one of below and obliquely below the holding component 12. For example, the material delivery component 15 may also be arranged on the falling path of the modeling material M from the holding component 12. Typically, the material delivery component 15 is arranged below the conveying port 124. In order to receive the modeling material M, the material delivery component 15 may also have a funnel-shaped shape (for example, an inverted cone-shaped shape). The material delivery component 15 receives the modeling material M delivered from the holding component 12 in a collecting manner through a partition component having a funnel-shaped shape. However, the material feeding member 15 may have other shapes (for example, an inverted pyramid shape, for example, an inverted quadrangular pyramid shape).

[0112] The material delivery component 15 also delivers the modeling material M received from the holding component 12 to the outside of the material supply device 1 (i.e., to the processing device 2). In order to deliver the modeling material M to the processing device 2, a delivery port 151 is formed at the lower end of the material delivery component 15. The delivery port 151 is an opening of a partition wall that passes through the bottom of the material delivery component 15 in the Z-axis direction (i.e., a through hole). Alternatively, in the case where a partition wall component is not formed at the lower end of the material delivery component 15, the open end of the lower part of the material delivery component 15 where the partition wall component is not formed can also be used as the delivery port 151. The shape of the cross section of the delivery port 151 (specifically, the cross section along the XY plane) is circular, but it can also be other shapes. Other shapes include at least one of an oblong, an elliptical, a rectangular, and a polygonal shape.

[0113] The housing 16 has a delivery port 165 formed therein. The delivery port 165 extends from the internal space 16IN toward the external space 16OUT through the partition wall member 161 (at Figure 3 In the example shown, the bottom member 1613 has an opening (i.e., a through hole). The delivery port 165 is connected to the delivery port 151 of the material delivery member 15. The above-mentioned material supply pipe 91 (in the case of the material delivery pipe 165) connected to the processing device 2 is connected to the delivery port 165. Figure 3 Therefore, the molding material M delivered by the material delivery member 15 is delivered to the processing device 2 via the delivery ports 151 and 164 and the material supply pipe 91.

[0114] The housing 16 is also provided with an inlet 166. The inlet 166 is a portion of the housing 16 which extends from the inner space 16IN toward the outer space 16OUT and passes through the partition wall member 161 (at Figure 3 In the example shown, the side wall member 1612 is used, but it may also be an opening (i.e., a through hole) of the top surface member 1611 or the bottom member 1613. The inlet 166 is connected to the above-mentioned gas supply device 5. Therefore, the pressurized purge gas is supplied from the above-mentioned gas supply device 6 to the internal space 16IN of the housing 16 through the inlet 166.

[0115] A rectifying member (such as a rectifying plate, etc.) for controlling the flow of the purge gas supplied from the inlet 166 to the internal space 16IN may also be formed in the internal space 16IN. The rectifying member may also be formed to reduce the effect of the purge gas supplied from the inlet 166 on the modeling material M falling from the holding member 12 to the material delivery member 15. For example, the rectifying member may also be formed to reduce the effect of the purge gas supplied from the inlet 166 on blowing or rolling up the modeling material M falling from the holding member 12 to the material delivery member 15. If the modeling material M falling from the holding member 12 to the material delivery member 15 is blown or rolled up, the amount of the modeling material M actually falling from the holding member 12 to the material delivery member 15 changes, and as a result, the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 may change. Therefore, the rectifying member formed so as to reduce the influence of the purge gas blowing away or rolling up the modeling material M can also function as a member for suppressing the fluctuation of the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2.

[0116] The housing 16 also has an opening 167. The opening 167 passes through the partition wall member 161 (at the bottom) from the internal space 16IN toward the external space 16OUT. Figure 3 In the example shown, the top surface member 1611 is used, but it may be a through hole of the side wall member 1612 or the bottom member 1613. The connecting pipe 17 connected to the opening 116 of the hopper 11 is connected to the opening 167. Specifically, one end of the connecting pipe 17 is connected to the opening 116, and the other end of the connecting pipe 17 is connected to the opening 167. As a result, the storage space 112 of the hopper 11 is connected to the internal space 16IN of the housing 16 via the connecting pipe 17, the opening 116, and the opening 167. That is, in the processing system SYSa, as a path connecting the storage space 112 and the internal space 16IN, not only a path via the supply ports 113, 162, and 123 is formed, but also a path via the connecting pipe 17, the opening 116, and the opening 167 is formed. In other words, the connecting pipe 17 connects the storage space 112 and the internal space 16IN at a position different from the supply ports 113, 162, and 123.

[0117] Therefore, even when the modeling material M is stored in the storage space 112 (as a result, the paths through the supply ports 113, 162, and 123, which are the paths connecting the storage space 112 and the internal space 16IN, are blocked by the modeling material M), the storage space 112 becomes a space purged by the purge gas in the same manner as the internal space 16IN. Furthermore, even when the modeling material M is stored in the storage space 112 (as a result, the paths through the supply ports 113, 162, and 123, which are the paths connecting the storage space 112 and the internal space 16IN, are blocked by the modeling material M), the purge gas of the storage space 112 flows into (i.e., moves) the internal space 16IN through the connecting pipe 17 and / or the purge gas of the internal space 16IN flows into the storage space 112. As a result, the difference between the pressure of the storage space 112 and the pressure of the internal space 16IN is reduced. Therefore, there is almost no imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN. Therefore, there is almost no problem that the modeling material M is suddenly supplied from the hopper 11 to the holding member 12 due to the imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN. In addition, there is almost no problem that the modeling material M cannot be smoothly supplied from the hopper 11 due to the imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN. In addition, due to the imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN, the modeling material M supplied from the hopper 11 to the internal space 16IN (especially the holding space 121) hardly flows back to the storage space 112 of the hopper 11 through the supply ports 113, 162 and 123.

[0118] In addition, the hopper 11 may be arranged in the internal space 16IN in addition to or in place of the connection pipe 17 provided in the processing system SYSa. In this case, even if the connection pipe 17 is not connected to the opening 116, the storage space 112 and the internal space 16IN are connected via the opening 116. Therefore, there is almost no imbalance between the pressure of the storage space 112 and the pressure of the internal space 16IN. In addition, when the processing system SYSa does not have the connection pipe 17, the opening 167 may not be formed in the housing 16.

[0119] The support member 18 extends from a support surface F such as the ground to the housing 16 (at Figure 3 In the example shown, the bottom part 16 is an extended part 13. The material supply device 1 including the housing 16 is supported by the support surface F via the support part 18.

[0120] The weight measuring device 19 is capable of measuring the weight of the modeling material M stored in the hopper 11. The weight measuring device 19 may also be capable of directly measuring the weight of the modeling material M stored in the hopper 11. Alternatively, the weight measuring device 19 may also be capable of indirectly measuring the weight of the modeling material M stored in the hopper 11. For example, the weight measuring device 19 may also be capable of measuring the weight of a portion (or the entirety) of the material supply device 1 including the hopper 11. In this case, the control device 7 may also estimate the weight of the modeling material M stored in the hopper 11 by subtracting the weight of components other than the hopper 11 from the measurement result of the gravity measuring device 19. In addition, the weight measuring device 19 may have any structure and may be arranged at any position as long as it is capable of measuring the weight of the modeling material M stored in the hopper 11.

[0121] (1-3-2) Supplying operation of the material supply device 1 to supply the molding material M

[0122] Next, refer to Figure 7 , the supplying action of the material supply device 1 to supply the modeling material M will be described. Figure 7 1 is a cross-sectional view showing a supply operation of the modeling material M by the material supply device 1 .

[0123] like Figure 7 As shown, the modeling material M stored in the storage space 112 of the hopper 11 falls to the holding space 121 of the holding member 12 through the supply ports 113, 162 and 123. The modeling material M stored in the storage space 112 of the hopper 11 falls to the holding surface 1221 of the holding member 12 through the supply ports 113, 162 and 123. That is, the modeling material M is supplied from the hopper 11 to the holding member 12 (particularly to the holding space 121, and further to the conveying member 13 arranged in the holding space 121) in the direction of gravity. In order to realize such supply of the modeling material M, the supply port 123 is formed in the conveying member 13 in the inner wall surface 122 (particularly formed in the surface portion that does not intersect the shaft member 131). As a result, the holding space 121 holds the modeling material M in an amount corresponding to the size of the holding space 121. The modeling material M in an amount corresponding to the size of the holding space 121 is accumulated on the holding surface 1221.

[0124] The modeling material M accumulated on the holding surface 1221 contacts the supply ports 123, 162, and 113. In this case, when the conveying member 113 is stationary (i.e., not rotating), the accumulated modeling material M blocks the supply ports 123, 162, and 113, thereby inhibiting further modeling material M from being supplied to the holding member 12. In this state, the conveying member 13 is rotationally driven by the driving device 14. When the conveying member 13 starts to rotate, as described above, the modeling material M held in the holding space 121 starts to move through the groove 132 formed in the conveying member 13. The modeling material M is pressed by the protrusion 133 that defines the groove 132 and gradually moves toward the conveying port 124. That is, the conveying member 13 conveys the modeling material M toward the conveying port 124. That is, the conveying member 13 conveys the modeling material M in a direction (e.g., Y-axis direction) that intersects the direction (e.g., gravity direction, Z-axis direction) in which the modeling material M is supplied from the hopper 11 to the conveying member 13.

[0125] As a result, the modeling material M transported by the transport member 13 falls (i.e., spills) from the opening 124 of the holding member 12 to the outside of the holding member 12 (i.e., the material delivery member 15). Specifically, the modeling material M falls to the material delivery member 15 from the gap G corresponding to the groove 132 exposed at the end of the groove 132 or the internal space 16IN. That is, the modeling material M falls to the material delivery member 15 from the gap G formed by the groove 132 at the position where the opening 124 is formed. The gap G is a gap forming the groove 132 between the holding member 12 and the transport member 13 at the position where the opening 124 is formed. The gap G is a gap forming the groove 132 between the edge portion 125 of the holding member 12 defining the transport port 124 and the transport member 13 at the position where the opening 124 is formed. The gap G is a gap forming the groove 132 between the edge portion 125 and the protrusion 133 of the transport member 13 at the position where the opening 124 is formed. The gap G is a gap where the groove 132 is formed between the edge portion 125 and a portion of the protrusion 133 located in the external space 16IN at the position where the opening 124 is formed.

[0126] Since the pitch (i.e., the period, for example, the distance the groove 132 extends (i.e., the distance it advances) during one rotation of the groove 132) of the spiral groove 132 is constant, when the conveying member 13 continues to rotate in the same manner, the modeling material M held in the holding space 121 is conveyed at a constant conveying rate. As a result, a certain amount of the modeling material M per unit time is spilled from the conveying port 124 of the holding member 12 to the outside of the holding member 12 (i.e., the material delivery member 15). As a result, a certain amount of the modeling material M per unit time is conveyed (i.e., delivered) from the holding member 12 to the material delivery member 15. Therefore, the conveying member 13 conveys the modeling material M through the groove 132, and in essence, functions as a member that cuts out a certain amount of the modeling material M to the outside of the holding member 12 per unit time.

[0127] On the other hand, if the rotation of the conveying member 13 realized by the driving device 14 stops, the modeling material M held in the holding space 121 stops moving, and the modeling material M does not fall from the holding member 12. That is, the conveyance of the modeling material M from the holding member 12 to the material delivery member 15 is stopped. As a result, the supply of the modeling material M from the material supply device 1 to the processing device 2 is also stopped. Therefore, the driving device 14 stops the rotation of the conveying member 13 under the control of the control device 7 at the timing when the modeling material M can be stopped from being supplied to the processing device 2 (for example, the timing when the material nozzle 212 can stop supplying the modeling material M).

[0128] The amount of the modeling material M transported from the holding member 12 to the outside of the holding member 12 per unit time (i.e., the transport amount of the modeling material M per unit time) can be controlled by the rotation state of the transport member 13. Therefore, the control device 7 can also set the rotation state of the transport member 13 in such a way that the amount of the modeling material M transported from the holding member 12 to the material delivery member 15 per unit time becomes a desired transport amount corresponding to the supply rate of the modeling material M required to form the three-dimensional structure ST. Moreover, the drive device 33 can also rotate the transport member 13 under the control of the control device 7 during the period when the processing device 2 forms the three-dimensional structure ST (more specifically, during the period when the material nozzle 212 continues to supply the modeling material M) so that the transport member 13 continues to rotate in the set rotation state. As a result, a certain amount of modeling material M required per unit time for the processing device 2 to form the three-dimensional structure ST is transported from the holding member 12 to the material delivery member 15.

[0129] The state of rotation may include, for example, a rotation speed (i.e., a rotation speed per unit time). For example, the faster the rotation speed (i.e., the greater the rotation speed per unit time), the faster the movement speed of the modeling material M moving through the groove 132. Therefore, the faster the rotation speed, the greater the amount of modeling material M transported from the holding member 12 to the outside of the holding member 12 per unit time. The greater the amount of modeling material M transported from the holding member 12 to the outside of the holding member 12 per unit time, the greater the amount of modeling material M supplied from the material supply device 1 to the processing device 2 per unit time (i.e., the supply amount). Therefore, the faster the rotation speed, the greater the supply amount of modeling material M supplied from the material supply device 1 to the processing device 2 per unit time. The control device 7 may also set the rotation speed of the transport member 13 in such a manner that the amount of modeling material M transported from the holding member 12 to the material delivery member 15 per unit time becomes a desired transport amount corresponding to the supply rate of modeling material M required to form the three-dimensional structure ST, based on the relationship between the rotation speed of the transport member 13 and the supply amount of modeling material M. That is, the control device 7 may also set the rotation speed of the conveying member 13 according to the supply rate of the modeling material M required to form the three-dimensional structure ST (that is, the amount of the modeling material M that the material supply device 1 should supply per unit time). Furthermore, the driving device 14 may also rotationally drive the conveying member 13 so that the conveying member 13 rotates at the rotation speed set by the control device 7.

[0130] However, when the conveying member 13 is in contact with other members, if the conveying member 13 rotates, at least one of the conveying member 13 and the other member may be worn due to the contact between the conveying member 13 and the other member. In addition, as an example of a member that may be in contact with the conveying member 13, the sealing member 164 can be cited. In this case, if the rotation speed of the conveying member 13 becomes too fast, at least one of the conveying member 13 and the sealing member 164 may be worn too fast. Therefore, an upper limit speed that can be allowed may be set for the rotation speed of the conveying member 13. In this case, the rotation speed of the conveying member 13 is set to be less than the upper limit speed.

[0131] Even if the state of rotation of the transport member 13 is the same, there is a possibility that the amount of the modeling material M in the first state transported from the holding member 12 per unit time is different from the amount of the modeling material M in the second state (where the second state is different from the first state) transported from the holding member 12 per unit time. That is, there is a possibility that the amount of the modeling material M in the first state transported from the holding member 12 per unit time by the transport member 13 rotating in a certain state is different from the amount of the modeling material M in the second state that is different from the first state transported from the holding member 12 per unit time by the transport member 13 rotating in the same state. Specifically, for example, there is a possibility that the amount of the first type of modeling material M transported from the holding member 12 per unit time by the transport member 13 rotating in a certain state is different from the amount of the modeling material M in the second type (where the second type is different from the first type) transported from the holding member 12 per unit time by the transport member 13 rotating in the same state. For example, there is a possibility that the amount of the modeling material M of the first particle size delivered from the holding member 12 per unit time by the conveying member 13 rotating in a certain state is different from the amount of the modeling material M of the second particle size (wherein the second particle size is different from the first particle size) delivered from the holding member 12 per unit time by the conveying member 13 rotating in the same state. For example, there is a possibility that the amount of the modeling material M of the first shape (particularly the outer shape) delivered from the holding member 12 per unit time by the conveying member 13 rotating in a certain state is different from the amount of the modeling material M of the second shape (wherein the second shape is different from the first shape) delivered from the holding member 12 per unit time by the conveying member 13 rotating in the same state. For example, there is a possibility that the amount of the modeling material M having a first value of the surface friction coefficient delivered from the holding member 12 per unit time by the transport member 13 rotating in a certain state is different from the amount of the modeling material M having a second value of the surface friction coefficient (wherein the second value is different from the first value) delivered from the holding member 12 per unit time by the transport member 13 rotating in the same state. Therefore, the control device 7 may set the rotation state of the transport member 13 in addition to or instead of the relationship between the rotation state of the transport member 13 and the supply amount of the modeling material M, based on the relationship between the state of the modeling material M and the supply amount of the modeling material M, so that the amount of the modeling material M delivered from the holding member 12 to the material delivery member 15 per unit time becomes the desired delivery amount corresponding to the supply rate of the modeling material M required to form the three-dimensional structure ST. That is, the control device 7 may set the rotation state of the transport member 13 according to the state of the modeling material M and the supply rate of the modeling material M required to form the three-dimensional structure ST. Here, the state of the modeling material M may include at least one of the type of the modeling material M, the size of the modeling material M (for example, the particle size), the shape of the modeling material M, and the friction coefficient of the surface of the modeling material M.

[0132] The amount of the modeling material M conveyed from the holding member 12 to the outside of the holding member 12 per unit time (i.e., the conveying amount of the modeling material M per unit time) can also be controlled by the characteristics of the conveying member 13 itself. Therefore, the characteristics of the conveying member 13 can also be set to a desired characteristic that can achieve a state in which the amount of the modeling material M conveyed from the holding member 12 to the material feeding member 15 per unit time becomes a desired conveying amount corresponding to the supply rate of the modeling material M required to form the three-dimensional structure ST. That is, the characteristics of the conveying member 13 can also be set based on the supply rate of the modeling material M required to form the three-dimensional structure ST. The characteristics of the conveying member 13 can also be set to a desired characteristic that can achieve a state in which the amount of the modeling material M conveyed from the holding member 12 to the material feeding member 15 per unit time becomes a desired conveying amount when the conveying member 13 rotates at a desired rotational speed. That is, the characteristics of the conveying member 13 can also be set based on the supply rate of the modeling material M required to form the three-dimensional structure ST and the rotational speed of the conveying member 13.

[0133] For example, the smaller the volume of the groove 132 per spiral turn formed by the groove 132 (i.e., the volume of the groove 132 per one pitch (one cycle)), the smaller the supply rate of the molding material M supplied from the material supply device 1 to the processing device 2. Therefore, if the volume of the groove 132 per spiral turn becomes too small, even if the conveying member 13 rotates at the upper limit speed, there is a possibility that the material supply device 1 cannot supply the molding material M at the supply rate of the molding material M required to form the three-dimensional structure ST. Therefore, the characteristics of the conveying member 13 may be set so that the volume of the groove 132 per spiral turn becomes greater than the first predetermined amount set from the viewpoint of not causing the above-mentioned first technical problem. As a result, when the volume of the groove 132 per spiral turn becomes greater than the first predetermined amount, the material supply device 1 can supply the molding material M at the supply rate of the molding material M required to form the three-dimensional structure ST when the conveying member 13 rotates at the upper limit speed (i.e., when the conveying member 13 rotates at a rotation speed less than the upper limit speed).

[0134] On the other hand, if the volume of the groove 132 for one spiral turn is too large, the amount of the modeling material M that the conveying member 13 conveys to the material delivery member 15 per unit time is likely to vary. This is because, as the volume of the groove 132 for one spiral turn increases, the amount of the modeling material M that collapses in the groove 132 due to its own weight increases, and the amount of the modeling material M that may fall from the gap G at an undesirable time increases. As a result, the second technical problem that the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 varies may occur. Therefore, the characteristics of the conveying member 13 may be set so that the volume of the groove 132 for one spiral turn becomes less than a second predetermined amount (wherein the second predetermined amount is less than the first predetermined amount) set from the viewpoint of not causing the above-mentioned second technical problem. As a result, the volume of the groove 132 for one spiral turn becomes less than the second predetermined amount, and the fluctuation of the supply rate of the modeling material M supplied from the material supply device 1 to the processing device 2 is suppressed.

[0135] In other words, the control device 7 may set the rotation speed of the transport member 13 in consideration of the characteristics of the transport member 13 so that the amount of the modeling material M transported from the holding member 12 to the material feeding member 15 per unit time by using the transport member 13 having certain characteristics becomes a desired transport amount corresponding to the supply rate of the modeling material M required to form the three-dimensional structure ST. That is, the rotation speed of the transport member 13 (or the state of rotation of the transport member 13) may also be set according to the supply rate of the modeling material M required to form the three-dimensional structure ST and the characteristics of the transport member 132.

[0136] The characteristics of the conveying member 13 may include the characteristics of the groove 132 formed in the conveying member 13. This is because when the characteristics of the groove 132 change, the amount of the modeling material M stored in the groove 132 may change, and as a result, the amount of the modeling material M transported per unit time through the groove 132 may change. The amount of the modeling material M stored in the groove 132 depends on the volume of the groove 132. Therefore, the characteristics of the groove 132 may include the volume of the groove 132 (for example, the volume of the groove 132 for one spiral turn). The characteristics of the groove 132 may include the characteristics that affect the volume of the groove 132 for one spiral turn. As an example of the characteristics that affect the volume of the groove 132 for one spiral turn, at least one of the shape of the groove 132, the depth of the groove 132, the width of the groove 132, and the pitch of the groove 132 may be included. The shape of the groove 132 may include the cross-sectional shape of the groove 132 (specifically, the shape of the cross section along the surface intersecting the direction in which the shaft member 131 extends).

[0137] If the modeling material M is conveyed from the holding member 12 to the material delivery member 15, the amount of the modeling material M held by the holding member 12 decreases. On the other hand, since the holding member 12 is located below the supply port 113 of the hopper 11, if the amount of the modeling material M held by the holding member 12 decreases, new modeling material M is supplied from the hopper 11 to the holding member 12 via the supply port 113 due to the weight of the modeling material M itself. That is, the modeling material M of an amount corresponding to the amount of the modeling material M conveyed from the holding member 12 to the material delivery member 15 is newly supplied from the hopper 11 to the holding member 12. For example, the modeling material M of an amount substantially equal to the amount of the modeling material M conveyed from the holding member 12 to the material delivery member 15 is newly supplied from the hopper 11 to the holding member 12. Therefore, the modeling material M does not disappear from the holding member 12 due to the conveyance of the modeling material M from the holding member 12. Typically, the holding member 12 holds substantially the same amount of the modeling material M.

[0138] The modeling material M conveyed from the holding member 12 falls from the holding member 12 to the material delivery member 15. As a result, the material delivery member 15 receives the modeling material M conveyed from the holding member 12. The modeling material M received by the material delivery member 15 is delivered to the outside of the material supply device 1 (i.e., to the processing device 2). Here, as described above, the pressurized purge gas is supplied from the gas supply device 5 via the inlet 166 to the internal space 16IN of the housing 16 in which the material delivery member 15 is arranged. The material delivery member 15 delivers the modeling material M to the processing device 1 by the pressurized purge gas. That is, the modeling material M received by the material delivery member 15 is delivered in a manner of being pressed out in the material supply pipe 91 via the delivery ports 151 and 164 by the pressure of the purge gas supplied to the internal space 16IN. The modeling material M delivered via the material supply pipe 91 is supplied from the material nozzle 212.

[0139] Since the material delivery member 15 delivers the modeling material M by pressure feeding, the amount of the modeling material M delivered by the material delivery member 15 per unit time depends on the amount of the modeling material M conveyed from the holding member 12 to the material delivery member 15 per unit time. Therefore, the material delivery member 15 can deliver a certain amount of the modeling material M to the processing device 2 per unit time. As a result, the material supply device 1 can supply a certain amount of the modeling material M to the processing device 2 per unit time. That is, the material supply device 1 can supply the modeling material M to the processing device 2 in such a manner that the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time becomes a constant supply amount corresponding to the supply rate of the modeling material M required to form the three-dimensional structure ST.

[0140] In the above description, the amount of the modeling material M delivered from the holding member 12 to the material delivery member 15 per unit time is constant during the period when the processing device 2 forms the three-dimensional structure ST. That is, the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time is constant during the period when the processing device 2 forms the three-dimensional structure ST. However, the material supply device 1 may change the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time under the control of the control device 7 during the period when the processing device 2 forms the three-dimensional structure ST. Specifically, as described above, the amount of the modeling material M delivered from the holding member 12 to the material delivery member 15 per unit time depends on the rotation state of the delivery member. Therefore, the control device 7 may control the driving device 14 so as to change the rotation state of the delivery member 13 during at least a part of the period when the processing device 2 forms the three-dimensional structure ST. As a result, the amount of the modeling material M delivered from the holding member 12 to the material delivery member 15 per unit time is changed along with the change in the rotation state of the delivery member 13. That is, as the rotation state of the conveying member 13 is changed, the amount of the modeling material M conveyed from the material supply device 1 to the processing device 2 per unit time is changed.

[0141] As an example of changing the amount of the modeling material M supplied from the material supply device 1 per unit time, there can be cited a case where the moving speed of the processing head 21 based on the head driving system 22 changes. In this case, the control device 7 can also change the amount of the modeling material M delivered from the material supply device 1 to the processing device 2 per unit time based on the moving speed of the processing head 21 (that is, information related to the moving speed of the processing head 21). Specifically, the faster the moving speed of the processing head 21, the shorter the time for the material nozzle 212 to supply the modeling material M to a certain unit area on the workpiece W (or a certain unit area on the structural layer SL formed on the workpiece W, the same below). Therefore, the faster the moving speed of the processing head 21, the less the amount of the modeling material M supplied to the unit area. As a result, if the moving speed of the processing head 21 changes, the amount of the modeling material M supplied to a certain unit area on the workpiece W may be different from the amount of the modeling material M supplied to other unit areas on the workpiece W. In this case, the accuracy of the formed three-dimensional structure ST may be affected. Therefore, the control device 7 may also change the amount of the modeling material M supplied from the material supply device 1 per unit time based on the moving speed of the processing head 21 so that the amounts of the modeling material M supplied to the plurality of unit areas on the workpiece W are the same. Specifically, the control device 7 may also change the amount of the modeling material M supplied per unit time in such a manner that the faster the moving speed of the processing head 21, the greater the amount of the modeling material M supplied from the material supply device 1 per unit time (i.e., the supply amount of the modeling material M per unit time).

[0142] When an allowable upper limit speed is set for the rotation speed of the conveying part 13, the control device 7 can also perform inverse calculation on the supply amount of molding material M per unit time that the material supply device 1 can supply to the processing device 2 based on the upper limit speed, and determine the upper limit of the moving speed of the processing head 21 in the processing device 2 based on the supply amount.

[0143] In addition, without being limited to the above-mentioned case, the control device 7 may also change the amount of the modeling material M transported from the material supply device 1 to the processing device 2 per unit time based on at least one of the information related to the moving speed of the processing head 21 and the information related to the irradiation of the processing light EL. In addition, as an example of the information related to the irradiation of the processing light EL, at least one of the intensity of the processing light EL, the irradiation position of the processing light EL, and the irradiation timing of the processing light EL can be listed. For example, the control device 7 may also change the amount of the modeling material M transported from the material supply device 1 to the processing device 2 per unit time in accordance with the change in the intensity of the processing light EL. For example, the control device 7 may also change the amount of the modeling material M transported from the material supply device 1 to the processing device 2 per unit time in accordance with the change in the irradiation timing of the processing light EL.

[0144] (1-3) Operation of machining system SYSa

[0145] Next, the operation performed by the machining system SYSa will be described.

[0146] (1-3-1) 3 The first processing operation for forming the three-dimensional structure ST

[0147] As described above, the processing system SYSa performs the first processing operation for forming the three-dimensional structure ST. Specifically, as described above, the processing system SYSa forms the three-dimensional structure ST by the laser build-up welding method. Therefore, the processing system SYSa can also form the three-dimensional structure ST by performing an existing processing operation (in this case, a shaping operation) based on the laser build-up welding method. Hereinafter, an example of the first processing operation for forming the three-dimensional structure ST using the laser build-up welding method is briefly described.

[0148] The processing system SYSa forms a 3D structure ST on the workpiece W based on 3D model data (e.g., CAD (Computer Aided Design) data) of the 3D structure ST to be formed. As the 3D model data, at least one of the measurement data of a solid object measured by a measuring device (not shown) provided in the processing system SYSa and the measurement data of a 3D shape measuring instrument provided separately from the processing system SYSa may be used. As an example of a 3D shape measuring instrument, a contact-type 3D coordinate measuring instrument having a probe that can move relative to the workpiece W and can contact the workpiece W can be cited. As an example of a 3D shape measuring instrument, a non-contact 3D measuring instrument can be cited. As an example of a non-contact type 3D measuring instrument, at least one of a pattern projection type 3D measuring instrument, a light section type 3D measuring instrument, a time-of-flight type 3D measuring instrument, a moire image inspection type 3D measuring instrument, a holographic interferometry type 3D measuring instrument, a CT (Computed Tomography) type 3D measuring instrument, and an MRI (Magnetic Resonance Imaging) type 3D measuring instrument can be cited. In addition, as 3D model data, for example, STL (Stereo Lithography) format, VRML (Virtual Reality Modeling Language) format, AMF (Additive Manufacturing File Format), IGES (Initial Graphics Exchange Specification) format, VDA-FS (Association of German Automotive Manufactures-Surfaces Interface) format, HP / GL (Hewlett-Packard Graphics Language) format, bitmap format, etc. can be used.

[0149] The processing system SYSa forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged in the Z-axis direction in order to form a three-dimensional structure ST. For example, the processing system SYSa forms a plurality of structural layers SL obtained by cutting the three-dimensional structure ST into wafers in the Z-axis direction one layer at a time. As a result, a stacked structure having a plurality of structural layers SL stacked thereon, i.e., a three-dimensional structure ST, is formed. The following is a description of the flow of the operation of forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one layer at a time.

[0150] First, refer to Figure 8 (a) to Figure 8 (e) The action of forming each structural layer SL is described. Under the control of the control device 7, the processing system SYSa sets an irradiation area EA on the surface of the workpiece W or a desired area on the modeling surface MS corresponding to the surface of the formed structural layer SL, and irradiates the irradiation area EA with processing light EL from the irradiation optical system 211. In addition, the area occupied by the processing light EL irradiated from the irradiation optical system 211 on the modeling surface MS can also be called the irradiation area EA. In the first embodiment, the focusing position (i.e., the focusing position) of the processing light EL is consistent with the modeling surface MS. As a result, Figure 8 As shown in (a), a molten pool (i.e., a pool of metal melted by the processing light EL) MP is formed in a desired area on the modeling surface MS by the processing light EL emitted from the irradiation optical system 211. Furthermore, under the control of the control device 7, the processing system SYSa sets a supply area MA in a desired area on the modeling surface MS, and supplies the modeling material M to the supply area MA from the material nozzle 212. Here, as described above, since the irradiation area EA coincides with the supply area MA, the supply area MA is set as the area where the molten pool MP is formed. Therefore, as shown in FIG. Figure 8 As shown in (b), the processing system SYSa supplies the modeling material M to the molten pool MP from the material nozzle 212. As a result, the modeling material M supplied to the molten pool MP melts. When the processing head 21 moves without irradiating the molten pool MP with the processing light EL, the modeling material M melted in the molten pool MP is cooled and solidified (i.e., solidified). As a result, Figure 8 As shown in (c) of FIG. 1 , the solidified modeling material M is deposited on the modeling surface MS. That is, the deposited material of the solidified modeling material M forms a modeled object.

[0151] like Figure 8As shown in (d), while the processing head 21 is relatively moved along the XY plane relative to the modeling surface MS, a series of modeling processes including the formation of the molten pool MP based on the irradiation of the processing light EL, the supply of the modeling material M to the molten pool MP, the melting of the supplied modeling material M, and the solidification of the molten modeling material M are repeatedly performed. That is, if the processing head 21 is relatively moved relative to the modeling surface MS, the irradiation area EA and the supply area MA are also relatively moved relative to the modeling surface MS. Therefore, a series of modeling processes are repeatedly performed while the irradiation area EA and the supply area MA are relatively moved along the XY plane (that is, in a two-dimensional plane) relative to the modeling surface MS. At this time, the processing light EL selectively irradiates the irradiation area EA set on the modeling surface MS in the area where the modeling object is desired to be formed, and on the other hand, the irradiation area EA set on the modeling surface MS in the area where the modeling object is not desired to be formed is not selectively irradiated (it can also be said that the irradiation area EA is not set in the area where the modeling object is not desired to be formed). That is, the processing system SYSa irradiates the molding surface MS with processing light EL at a timing corresponding to the distribution form of the area where the molding object is to be formed, while moving the irradiation area EA on the molding surface MS along a prescribed moving trajectory. It should be noted that the distribution form of the area where the molding object is to be formed can also be referred to as a distribution pattern and a pattern of a structural layer SL. As a result, the molten pool MP also moves on the molding surface MS along a moving trajectory corresponding to the moving trajectory of the irradiation area EA. Specifically, the molten pool MP is sequentially formed on the molding surface MS in the portion irradiated with the processing light EL in the area along the moving trajectory of the irradiation area EA. And, as described above, since the irradiation area EA coincides with the supply area MA, the supply area MA also moves on the molding surface MS along the moving trajectory corresponding to the moving trajectory of the irradiation area EA. That is, the material nozzle 212 supplies the molding material M in a manner such that the molding material M becomes a layer along the molding surface MS. As a result, as shown in FIG. Figure 8 As shown in (e), a structural layer SL corresponding to the aggregate of the modeling object formed by the solidified modeling material M is formed on the modeling surface MS. That is, a structural layer SL corresponding to the aggregate of the modeling object formed on the modeling surface MS is formed in a pattern corresponding to the moving trajectory of the molten pool MP (that is, a structural layer SL having a shape corresponding to the moving trajectory of the molten pool MP when viewed from above). In addition, in a case where the irradiation area EA is set in a region where it is not desired to form a modeling object, the processing light EL may be irradiated to the irradiation area EA, and the supply of the modeling material M may be stopped. In addition, in a case where the irradiation area EA is set in a region where it is not desired to form a modeling object, the modeling material M may be supplied to the irradiation area EL, and the processing light EL of an intensity that cannot form the molten pool MP may be irradiated to the irradiation area EL. In addition, in the above description, the irradiation area EA is moved relative to the modeling surface MS, but the modeling surface MS may also be moved relative to the irradiation area EA.

[0152] The processing system SYSa, under the control of the control device 7, repeatedly performs processing for forming such a structural layer SL based on the 3D model data. Specifically, first, the control device 7 creates slice data by slicing the 3D model data at a stacking pitch. The slice data includes data that determines the content of the processing (i.e., the processing including the above-mentioned series of modeling processing) for forming a plurality of structural layers SL. That is, the slice data includes data that determines the content of the processing for modeling the 3D structure ST. Therefore, the slice data can also be referred to as processing data or modeling data. The control device 7 can also perform slicing processing on the 3D model data by executing a computer program called a slicing program.

[0153] The slice data may include model data (particularly 3D model data) of each of the plurality of structural layers SL constituting the three-dimensional structure ST as data for determining the content of the processing. In this case, the 3D model data may include solid data or surface data.

[0154] The slice data may also include command data for controlling the processing system SYSa in a manner of forming a plurality of structural layers SL constituting the three-dimensional structure ST, as data for determining the content of the processing. The command data may also include data related to the movement of the processing head 21. The command data may also include data related to the movement of the table 31. In addition, since the workpiece W is placed on the table 31, the command data may also include data related to the movement of the workpiece W placed on the table 31. When at least one of the processing head 21 and the table 31 moves, as described above, the irradiation area EA and the supply area MA move on the workpiece W, respectively. Therefore, the command data may also include data related to the movement of at least one of the irradiation area EA and the supply area MA. In this case, the command data may also include processing path data that specifies the movement trajectory (in other words, the movement path) of at least one of the processing head 21, the table 31, the workpiece W, the irradiation area EA, and the supply area MA. The processing path data may also specify the movement trajectory for forming the three-dimensional structure ST under the condition that the influence of heat caused by the irradiation of the processing light EL (especially the influence of heat on the molding surface MS) is taken into account. Alternatively, the processing path data may specify a movement trajectory for forming a three-dimensional structure ST without considering the influence of heat caused by the irradiation of the processing light EL (especially the influence of heat on the modeling surface MS). The instruction data may also include processing speed data that specifies the movement speed of at least one of the processing head 21, the worktable 31, the workpiece W, the irradiation area EA, and the supply area MA. The instruction data may also include emission data that specifies the timing of the irradiation optical system 211 emitting the processing light EL in synchronization with the movement of at least one of the processing head 21, the worktable 31, the workpiece W, the irradiation area EA, and the supply area MA. The instruction data may also include emission data that specifies the timing of the material nozzle 212 supplying the modeling material M in synchronization with the movement of at least one of the processing head 21, the worktable 31, the workpiece W, the irradiation area EA, and the supply area MA. In addition, as an example of such instruction data, the so-called G code can be cited.

[0155] In addition, in addition to or instead of the control device 7 generating the slice data based on the 3D model data of the 3D structure ST, the control device 7 may also obtain the slice data from a device (such as a computer, etc.) outside the processing system SYSa. For example, when the device outside the processing system SYSa generates the slice data based on the 3D model data of the 3D structure ST, the control device 7 may also obtain the slice data from the device outside the processing system SYSa. For example, when the device outside the processing system SYSa retains (in other words, stores) the slice data, the control device 7 may also obtain the slice data from the device outside the processing system SYSa.

[0156] After that, the processing system SYSa starts processing for forming a plurality of structural layers SL. Specifically, the processing system SYSa performs processing for forming the first structural layer SL#1 on the molding surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structural layer SL#1. Fig. 9 As shown in (a), a structural layer SL#1 is formed on the modeling surface MS. Afterwards, the processing system SYSa performs processing for forming a second structural layer SL#2 on the new modeling surface MS on the basis of setting the surface (i.e., the upper surface) of the structural layer SL#1 as the new modeling surface MS. In order to form the structural layer SL#2, the control device 7 first controls at least one of the head drive system 22 and the worktable drive system 32 based on the slicing data (especially the processing path data) so that the processing head 21 moves along the Z axis relative to the modeling surface MS. Specifically, the control device 7 controls at least one of the head drive system 22 and the worktable drive system 32 so as to set the irradiation area EA and the supply area MA on the surface of the structural layer SL#1 (i.e., the new modeling surface MS) so as to move the processing head 21 relatively from the modeling surface MS toward the +Z side. As a result, the focusing position of the processing light EL is consistent with the new modeling surface MS. Then, the processing system SYSa, under the control of the control device 7, performs a process for forming the structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2 in the same manner as the process for forming the structural layer SL#1. Fig. 9 As shown in (b), a structural layer SL#2 is formed. Thereafter, the same process is repeated until all structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, Fig. 9 As shown in (c), a stacked structure formed by stacking a plurality of structural layers SL forms a three-dimensional structure ST.

[0157] (1-3-2) Second processing operation for forming a three-dimensional structure ST

[0158] The processing system SYSa performs processing for forming a plurality of structural layers SL constituting a three-dimensional structure ST using the modeling material M stored in the hopper 11 of the material supply device 1. When the amount of the modeling material M stored in the hopper 11 (i.e., the storage amount of the modeling material M in the hopper 11) is greater than the amount of the modeling material M required to form the three-dimensional structure ST, the modeling material M will not be insufficient during the process of forming the three-dimensional structure ST. Therefore, the processing system SYSa can complete the processing for forming the plurality of structural layers SL. On the other hand, when the storage amount of the modeling material M in the hopper 11 is less than the amount of the modeling material M required to form the three-dimensional structure ST, the modeling material M will be insufficient during the process of forming the three-dimensional structure ST. Therefore, before the processing system SYSa completes the processing for forming the plurality of structural layers SL, the modeling material M stored in the hopper 11 is exhausted. That is, before the processing system SYSa forms all of the plurality of structural layers SL, the modeling material M stored in the hopper 11 is exhausted. When the molding material M is exhausted, there is a possibility that the processing light EL is irradiated to the molding surface MS from the irradiation optical system 211 even though the molding material M is not supplied to the molding surface MS by the material nozzle 212. As a result, there is a possibility that the molding surface MS is melted unnecessarily. In addition, the molding object may not be formed at the position where the molding object should be formed by the accumulation of the molding material M that is solidified after melting. Therefore, the processing system SYSa may not be able to form the three-dimensional structure ST that was originally intended to be formed.

[0159] Therefore, in order to solve the above-mentioned technical problem caused by the shortage of modeling material M, the processing system SYSa may also perform a second processing action that takes into account the storage amount of modeling material M in the hopper 11 when forming the three-dimensional structure ST. That is, the processing system SYSa may also perform a second processing action that forms the three-dimensional structure ST based on the storage amount of modeling material M in the hopper 11. In this case, the second processing action may be different from the above-mentioned first processing action in that a process corresponding to the storage amount of modeling material M in the hopper 11 is added. Fig.10 The second processing operation will be described. Fig.10 It is a flowchart showing the flow of the second processing operation.

[0160] In addition, the second processing operation is performed when the chamber space 63IN is purged with the purge gas. The second processing operation starts when the chamber space 63IN is purged with the purge gas. However, the second processing operation may also start when the chamber space 63IN is not purged with the purge gas. In this case, the chamber space 63IN is purged with the purge gas before the actual processing is started.

[0161] like Fig.10As shown, the control device 7 obtains slice data that determines the content of the processing (step S101). For example, the control device 7 may also obtain slice data from an external device (e.g., a computer, etc.) of the processing system SYSa. In this case, the control device 7 and the external device may also be connected via a wired or wireless network. For example, the control device 7 may also obtain slice data from a recording medium that can be externally mounted on the control device 7. Alternatively, the control device 7 may also obtain 3D model data of the 3D structure ST instead of obtaining slice data. In this case, the control device 7 may also generate slice data based on the obtained 3D model data.

[0162] Then, the control device 7 estimates (i.e., estimates) the amount of the modeling material M required to form the three-dimensional structure ST based on the slice data obtained in step S101 (step S102). Specifically, the control device 7 estimates the amount of the modeling material M required to complete the process of forming the three-dimensional structure ST based on the slice data. That is, the control device 7 estimates the amount of the modeling material M required to form the entire three-dimensional structure ST based on the slice data.

[0163] As described above, the slice data includes the command data. Therefore, the control device 7 can determine the action content of the processing system SYSa in the process of forming the three-dimensional structure ST based on the command data. Specifically, the control device 7 can determine the supply time of the modeling material M supplied from the material nozzle 212 in the process of forming the three-dimensional structure ST based on the command data (for example, information related to the movement of the processing head 21, etc.). In addition, the amount of the modeling material M supplied from the material nozzle 212 per unit time depends on the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time. As a result, the control device 7 can estimate how much amount of the modeling material M is supplied from the material nozzle 212 in the process of forming the three-dimensional structure ST based on the supply time of the modeling material M supplied from the material nozzle 212 in the process of forming the three-dimensional structure ST and the amount of the modeling material M supplied from the material supply device 1 to the processing device 2 per unit time. As a result, the control device 7 can estimate the amount of the modeling material M required to form the three-dimensional structure ST (hereinafter referred to as "the necessary amount of the modeling material M"). That is, the control device 7 can estimate the amount of the modeling material M required to complete the processing without causing a shortage of the modeling material M (i.e., the necessary amount of the modeling material M). In addition, the control device 7 can also estimate the weight of the modeling material M required to form the three-dimensional structure ST as the necessary amount of the modeling material M. The control device 7 can also estimate the volume (i.e., capacity) of the modeling material M required to form the three-dimensional structure ST as the necessary amount of the modeling material M.

[0164] As described above, when forming each structural layer SL, the material nozzle 212 supplies the molding material M in a manner that the molding material M forms a layer along the molding surface MS. Therefore, in order to form a plurality of structural layers SL, the material nozzle 212 substantially supplies the molding material M in a manner that forms a plurality of layers of the molding material M. Therefore, the necessary amount of the molding material M depends on the number of layers of the molding material M. Therefore, the control device 7 may also estimate the number of layers of the molding material M as at least a part of the information related to the necessary amount of the molding material M. In this case, the value obtained by multiplying the amount of one layer of the molding material M (that is, the amount of the molding material M required to form one structural layer SL) by the number of layers of the molding material M may also be used as the necessary amount of the molding material M. It should be noted that such information related to the number of layers of the molding material M can also be used as useful information when performing additional processing based on the laser cladding method, or in place of this, when performing additional processing based on the powder bed fusion method (Powder Bed Fusion) described later. In addition, in the additional processing operation based on the powder bed fusion bonding method, the necessary amount of the modeling material M is mostly determined by the area of ​​the powder bed and the height of the modeling object. Therefore, the control device 7 can also estimate the necessary amount of the modeling material M using the area of ​​the powder bed and the height of the modeling object.

[0165] When estimating the necessary amount of the molding material M, the control device 7 may also be as shown in the top view of the display example on the display 8. Fig.11 As shown, the display 8 is controlled in such a manner as to display the necessary amount of the modeling material M. In this case, the user of the processing system SYSa can recognize the necessary amount of the modeling material M. In the first embodiment, the information displayed on the display 8 may include text, graphics, images, icons, or any display object that can be visually recognized by the user.

[0166] The control device 7 may also be a top view showing an example of display on the display 8. Fig.12 (a) and Fig.12 As shown in (b), in addition to or instead of the necessary amount of the modeling material M, the display 8 is controlled in such a manner as to display the storage amount of the modeling material M in the hopper 11 (that is, the remaining amount of the modeling material M in the hopper 11, information related to the measurement result of the weight measuring device 19). In this case, the user of the processing system SYSa can recognize the storage amount of the modeling material M. In addition, Fig.12 (a) shows an example in which the storage amount of the modeling material M in the hopper 11 is displayed in addition to the necessary amount of the modeling material M. Fig.12 As shown in (b), the necessary amount of modeling material and the storage amount of modeling material M in the hopper 11 can also be represented by a graphic.

[0167] When the storage amount of the modeling material M in the hopper 11 is displayed in addition to the required amount of the modeling material M, the control device 7 may control the display 8 in a manner that displays the relationship between the required amount of the modeling material M and the storage amount of the modeling material M in the hopper 11. That is, the control device 7 may control the display 8 in a manner that displays the required amount of the modeling material M in association with the storage amount of the modeling material M in the hopper 11. For example, the control device 7 may also control the display 8 as shown in the top view of the display example of the display 8. Fig.13 As shown, the display 8 is controlled in a manner to display the relationship between the necessary amount of the modeling material M and the storage amount of the modeling material M in the hopper 11. In this case, the user of the processing system SYSa can recognize whether the storage amount of the modeling material M is sufficient. It should be noted that the necessary amount of the modeling material M is information obtained from the slicing data. Therefore, the action of displaying the relationship between the necessary amount of the modeling material M and the storage amount of the modeling material M in the hopper 11 is a specific example of the action of displaying information related to the amount of the modeling material M obtained based on the slicing data and the storage amount of the modeling material M in the hopper 11. Therefore, the control device 7 can also control the display 8 to display information related to the amount of the modeling material M obtained based on the slicing data and the storage amount of the modeling material M in the hopper 11. In addition, the above-mentioned Fig.12 The display example on the display 8 shown in (b) can also be said to display the relationship between the required amount of the modeling material M and the storage amount of the modeling material M in the hopper 11.

[0168] The control device 7 may also control the display 8 to display the allowable upper limit value of the storage amount of the modeling material M in the hopper 11 on the basis of or instead of at least one of the necessary amount of the modeling material M and the storage amount of the modeling material M in the hopper 11. In this case, the control device 7 may also control the display 8 to display the relationship between at least one of the necessary amount of the modeling material M and the storage amount of the modeling material M in the hopper 11 and the allowable upper limit value of the storage amount of the modeling material M in the hopper 11. That is, the control device 7 may also control the display 8 in a manner that displays at least one of the necessary amount of the modeling material M and the storage amount of the modeling material M in the hopper 11 in association with the allowable upper limit value of the storage amount of the modeling material M in the hopper 11. For example, as shown in the top view of the display example in the display 8 Fig.14 As shown, the control device 7 may also control the display 8 to display at least one of the required amount of the modeling material M and the storage amount of the modeling material M in the hopper 11 and the size relationship of the storage amount of the modeling material M in the hopper 11. In this case, the user of the processing system SYSa can recognize whether the three-dimensional structure ST can be formed by the modeling material M of the amount corresponding to the allowable upper limit value.

[0169] The control device 7 may control the display 8 so as to display information related to the three-dimensional structure ST in addition to or instead of the information related to the amount of the modeling material M. For example, as shown in FIG. Fig.15 As shown, the control device 7 may control the display 8 to display information on at least one of the shape and size of the three-dimensional structure ST. In this case, the user of the machining system SYSa can recognize what kind of object the three-dimensional structure ST formed by the machining operation is.

[0170] After that, the control device 7 determines whether the hopper 11 stores a sufficient amount of the modeling material M (step S103). That is, the control device 7 determines whether the hopper 11 stores a sufficient amount of the modeling material M before the processing system SYSa starts processing. Specifically, the control device 7 determines the storage amount of the modeling material M in the hopper 11 based on the measurement result of the weight measuring device 19. After that, the control device 7 determines whether the storage amount of the modeling material M in the hopper 11 is more than the first prescribed amount. As the first prescribed amount, the necessary amount of the modeling material M estimated in step S102 is used. However, other values ​​may be used as the first prescribed amount. When the storage amount of the modeling material M in the hopper 11 is more than the necessary amount of the modeling material M, the control device 7 determines that the hopper 11 stores a sufficient amount of the modeling material M. When the storage amount of the modeling material M in the hopper 11 is less than the necessary amount of the modeling material M, the control device 7 determines that the hopper 11 does not store a sufficient amount of the modeling material M. In addition, when the storage amount of the modeling material M in the hopper 11 is the same as the required amount of the modeling material M, the control device 7 may determine that the hopper 11 stores a sufficient amount of the modeling material M, or may determine that the hopper 11 does not store a sufficient amount of the modeling material M. In addition, step S103 may also be executed before the display 8 displays information related to the amount of the modeling material M and / or information related to the three-dimensional structure ST.

[0171] If the result of the determination in step S103 is that the hopper 11 stores a sufficient amount of the molding material M (step S103: Yes), the processing system SYSa can complete the processing without causing a situation where the molding material M is insufficient. Therefore, in this case, the processing system SYSa starts the processing (step S111). That is, the processing system SYSa is as described above. Figure 8 (a) to Figure 8 (e) and Fig. 9 (a) to Fig. 9 As shown in (c), a plurality of structural layers SL are formed in sequence.

[0172] During the processing, the control device 7 may control the display 8 so as to display information indicating the status of the processing. The display of the information indicating the status of the processing may be, for example, Fig.16 As shown. Fig.16 As shown, the control device 7 can also control the display 8 to display an image representing the portion that has been formed in the three-dimensional structure ST. Fig.16 As shown, the control device 7 may also control the display 8 to display an image representing a portion of the 3D structure ST that has not yet been formed (ie, a portion to be formed from now on). Fig.16 The figure shows an example of an image in which the already formed portion of the 3D structure ST is represented by a solid line and the unformed portion of the 3D structure ST is represented by a dotted line when a 3D structure ST is processed to form a quadrangular pyramid. At this time, the control device 7 may also control the display 8 to display information related to the size of at least one of the already formed portion of the 3D structure ST and the unformed portion of the 3D structure ST. Fig.16 As shown, the control device 7 may also control the display 8 in a manner to display the degree of completion of the processing. The degree of completion may also represent the ratio of the formed portion of the 3D structure ST to the 3D structure ST. Fig.16 As shown, the control device 7 may also control the display 8 in a manner to display the concentration of oxygen in the chamber space 63IN. Fig.16 As shown, the control device 7 can also control the display 8 to display the storage amount of the modeling material M in the hopper 11 (that is, the remaining amount of the modeling material M in the hopper 11).

[0173] On the other hand, if the result of the determination in step S103 is that the hopper 11 does not store a sufficient amount of modeling material M (step S103: "No"), the modeling material M may be insufficient during the process of forming the three-dimensional structure ST. That is, the modeling material M may be exhausted before the processing system SYSa completes the processing. In this case, the processing system SYSa does not start the processing. That is, the control device 7 controls the processing device 2 and the like in a manner not to start the processing. Furthermore, the control device 7 controls the display 8 to display a warning message for warning the user of the processing system SYSa that the hopper 11 does not store a sufficient amount of modeling material M (step S104). That is, the control device 7 controls the display 8 so that the warning message is displayed before the processing system SYSa starts the processing.

[0174] The warning information may also include a text message. The warning information may also include a graphic. The warning information may also include an image. The warning information may also include an icon. The warning information may also include any display object that the user can visually confirm.

[0175] It is also possible to display a warning message related to the shortage of the molding material M stored in the hopper 11. Specifically, as shown in the top view as an example of a display of the warning message Fig.17 As shown, for example, a warning message may be displayed to warn the user that the hopper 11 does not store a sufficient amount of the modeling material M. For example, a warning message may be displayed to warn the user that the modeling material M is insufficient. Fig.17 An example of displaying a warning display including a text message such as “Insufficient materials!” is shown.

[0176] Also available in Fig.17 In addition to or in place of the warning information shown, warning information related to the processing status is displayed. Specifically, as shown in the top view of the display example of the warning information Fig.18 As shown, for example, a warning message may be displayed to warn the user that the processing cannot be started because the hopper 11 does not store enough modeling material M. A warning message may also be displayed to warn the user that the reason for not being able to start the processing is that the hopper 11 does not store enough modeling material M. Fig.18 An example of displaying a warning display including a text message such as “Processing cannot be started due to insufficient material!” is shown.

[0177] Also available in Figure 17 to Figure 18 In addition to or in place of the warning information shown in at least one of the above, warning information related to at least one of the storage amount of the modeling material M in the hopper 11 and the required amount of the modeling material M is displayed. Specifically, as shown in the top view of the display example of the warning information Fig.19 As shown, for example, warning information indicating the storage amount of the modeling material M in the hopper 11 may be displayed. For example, warning information indicating the necessary amount of the modeling material M may also be displayed. Fig.19 The following example is shown: both the warning information indicating that the storage amount of the modeling material M in the hopper 11 is 2.1 kg and the warning information indicating that the required amount of the modeling material M is 3.5 kg are displayed. For example, the warning information indicating the difference between the storage amount of the modeling material M in the hopper 11 and the required amount of the modeling material M (that is, the insufficient amount of the modeling material M) may be displayed. In addition, when the warning information related to at least one of the storage amount of the modeling material M and the required amount of the modeling material M is displayed, the control device 7 may control the display 8 so as to display information related to the allowable upper limit value of the storage amount of the modeling material M in the hopper 11.

[0178] Also available in Figures 17 to 19In addition to or in place of at least one of the warning messages shown in the above, a warning message related to the necessity of replenishing the molding material M to the hopper 11 is displayed. Specifically, as shown in the top view of the display example of the warning message Fig. 20 As shown, for example, a warning message may be displayed to warn the user that the hopper 11 needs to be refilled with the modeling material M. Fig. 20 An example of a warning display including a text message such as “Please provide additional materials” is shown.

[0179] Also available in Figures 17 to 20 In addition to or in place of at least one of the warning messages shown in the above, warning information related to the amount of molding material M to be replenished to the hopper 11 (hereinafter referred to as "necessary replenishment amount") is displayed. Specifically, as shown in the top view of the display example of the warning information Fig.21 As shown, a warning message indicating the necessary replenishment amount may also be displayed. Fig.21 An example of displaying a warning display including a text message indicating that the required replenishment amount is 1.4 kg is shown. It should be noted that the control device 7 may also set the required replenishment amount based on the difference between the storage amount of the modeling material M in the hopper 11 and the required amount of the modeling material M (i.e., the insufficient amount of the modeling material M). For example, the control device 7 may also set the difference between the storage amount of the modeling material M in the hopper 11 and the required amount of the modeling material M as the required replenishment amount. For example, the control device 7 may also set the difference between the storage amount of the modeling material M in the hopper 11 and the required amount of the modeling material M plus a predetermined margin as the required replenishment amount.

[0180] Also available in Figures 17 to 21 In addition to or instead of at least one of the warning messages shown in the display, the display object selected when the user takes an action to replenish the hopper 11 with the molding material M is displayed as a warning message. Figures 17 to 21 In addition to or in place of at least one of the warning messages shown in the above, the selected display object is displayed as a warning message when the user does not take action to replenish the molding material M in the hopper 11. Specifically, a top view showing an example of a display of a warning message is shown. Fig.21 As shown, for example, a button selected when the user takes an action to replenish the hopper 11 with the modeling material M (specifically, a button labeled "Yes") and a button selected when the user does not take an action to replenish the hopper 11 with the modeling material M (specifically, a button labeled "No") may be displayed as warning information. In this case, the control device 7 can determine whether the modeling material M is replenished in the hopper 11 based on the button selection result.

[0181] When the display object that the user can select is displayed on the display 8, the display 8 may also be a touch panel. In this case, the user can select the desired display object by operating the touch panel. In this case, the display 8 functions as an input device that receives input from the user who wishes to select the desired display object. Alternatively, the user may also use any other input device (for example, at least one of a keyboard, a touch pad, a mouse, and a pointing device) to select the desired display object.

[0182] Also available in Figures 17 to 22 In addition to or in place of at least one of the warning information shown, warning information related to the three-dimensional structure ST that can be formed is displayed. Specifically, a top view showing an example of a display of warning information is shown. Fig.23 As shown, a warning message may be displayed to warn the user that only a part of the three-dimensional structure ST can be formed in the modeling material M stored in the material supply device 1. A warning message may be displayed to warn the user that the entire three-dimensional structure ST cannot be formed in the modeling material M stored in the material supply device 1. A warning message may be displayed to warn the user that the processing for forming the three-dimensional structure ST cannot be completed in the modeling material M stored in the material supply device 1. Fig.23 An example of a warning display including a text message such as “Due to insufficient material, only a part of the three-dimensional structure ST can be formed!” is shown.

[0183] Also available in Figures 17 to 23 In addition to or instead of at least one of the warning information shown, a warning information related to a portion of the three-dimensional structure ST that can be formed by the modeling material M stored in the hopper 11 is displayed. Figures 17 to 23 In addition to or in place of at least one of the warning information shown in the above, warning information related to a portion that the modeling material M stored in the hopper 11 in the three-dimensional structure ST cannot be formed is displayed. Specifically, as shown in the top view as an example of display of the warning information Fig.24 As shown, warning information indicating a portion of the three-dimensional structure ST that can be formed with the modeling material M stored in the hopper 11 may be displayed. Warning information indicating a portion of the three-dimensional structure ST that cannot be formed with the modeling material M stored in the hopper 11 may be displayed. Fig.24 An example of an image is shown in which a portion of the 3-dimensional structure ST that can be formed by the modeling material M stored in the hopper 11 is represented by a solid line, and a portion of the 3-dimensional structure ST that cannot be formed by the modeling material M stored in the hopper 11 is represented by a dotted line when a processing is performed to form a 3-dimensional structure ST in a quadrangular pyramid shape.

[0184] Also available in Figures 17 to 24In addition to or instead of at least one of the warning messages shown, a display item is displayed as a warning message for the user to select whether to start a certain processing when the hopper 11 does not store a sufficient amount of molding material M. Specifically, a top view showing an example of a display of a warning message is Fig.25 As shown, for example, a button selected by the user when the processing is desired to be started (specifically, a button labeled "Yes") and a button selected when the processing is not desired to be started (specifically, a button labeled "No") may be displayed as warning information. In this case, based on the button selection result, the control device 7 can determine whether the user wants to start a certain processing when the hopper 11 does not store a sufficient amount of the molding material M.

[0185] Again in Fig.10 In the embodiment, after displaying the warning message, the control device 7 determines whether the modeling material M is added to the hopper 11 (step S105). More specifically, the control device 7 determines whether the modeling material M is added to the hopper 11 until the hopper 11 stores a sufficient amount of the modeling material M. The control device 7 determines whether the hopper 11 stores a sufficient amount of the modeling material M because the modeling material M is added to the hopper 11. In addition, the processing of step S105 may be the same as the processing of step S103 described above, so its detailed description is omitted.

[0186] The replenishment of the molding material M may also be performed in a state where the chamber space 63IN is purged with the purge gas. The replenishment of the molding material M may also be performed in a state where the chamber space 63IN is kept purged with the purge gas. Specifically, when the molding material M is replenished in a state where the chamber space 63IN is kept purged with the purge gas, the state of the valve 53 disposed in the gas supply pipe 52 connecting the gas supply device 5 and the material supply device 1 is set to a state of closing the gas supply pipe 52. Furthermore, the state of the valve 192 disposed in the material supply pipe 191 connecting the material supply device 1 and the processing device 2 is set to a state of closing the material supply pipe 191. As a result, the internal space 16IN and the storage space 112 of the material supply device 1 are spatially separated from the processing device 2 and the gas supply device 5. In this state, the cover 115 blocking the material replenishment port 114 of the hopper 11 is opened, and the molding material M is replenished from the material replenishment port 114 to the storage space 112. However, the modeling material M may be replenished when the chamber space 63IN is not purged with the purge gas. The modeling material M may be replenished after the purge gas is exhausted from the chamber space 63IN purged with the purge gas.

[0187] If the result of the determination in step S105 is that the modeling material M is replenished in the hopper 11 (the hopper 11 stores a sufficient amount of the modeling material M because the modeling material M is replenished in the hopper 11) (step S105: Yes), the processing system SYSa can complete the processing without causing a situation such as insufficient modeling material M. Therefore, in this case, the processing system SYSa starts the processing (step S111).

[0188] On the other hand, as a result of the determination in step S105, if it is determined that the hopper 11 has not been replenished with the modeling material M or that the hopper 11 has not stored a sufficient amount of the modeling material M even if the modeling material M has been replenished (step S105: "No"), there is still a possibility that the modeling material M is insufficient during the process of forming the three-dimensional structure ST. That is, there is still a possibility that the modeling material M is exhausted before the processing system SYSa completes the processing. In this case, the control device 7 determines whether to perform processing to form only a portion of the three-dimensional structure ST (step S106). For example, the control device 7 may also determine based on the user's Fig.25 The control device 7 may determine whether to perform processing to form only a portion of the three-dimensional structure ST in response to the warning information shown (for example, the selection status of the button). In this case, when the hopper 11 does not store a sufficient amount of modeling material M, if the user wishes to start a certain processing, the control device 7 may also determine to perform processing to form only a portion of the three-dimensional structure ST. On the other hand, when the user does not want to start processing when the hopper 11 does not store a sufficient amount of modeling material M, the control device 7 may also determine not to perform processing to form only a portion of the three-dimensional structure ST.

[0189] If the result of determination in step S106 is that machining processing for forming only a portion of the three-dimensional structure ST is not performed (step S106: No), the machining system SYSa ends the second machining operation. That is, the machining system SYSa does not form the three-dimensional structure ST.

[0190] On the other hand, if the result of determination in step S106 is that processing is performed to form only a portion of the three-dimensional structure ST (step S106: "Yes"), the processing system SYSa starts processing (step S111). However, in this case, the processing system SYSa performs processing in a manner of interrupting the processing at the stage where a portion of the three-dimensional structure ST is formed. In addition, the action of interrupting the processing includes the action of stopping the irradiation of the processing light EL from the irradiation optical system 211. The action of interrupting the processing may also include the action of stopping the supply of the modeling material M from the material nozzle 212. The action of interrupting the processing may also include the action of stopping the processing head 21 and / or the workbench 31.

[0191] For example, the processing system SYSa may interrupt the processing at the stage where the portion of the three-dimensional structure ST that can be formed by the modeling material M stored in the hopper 11 is formed. That is, the processing system SYSa may interrupt the processing before the modeling material M stored in the hopper 11 is exhausted.

[0192] For example, the processing system SYSa may perform processing in the following manner: if the processing is interrupted at the stage where the part in the three-dimensional structure ST is formed, the processing is interrupted at the stage where the part is formed and it is easier to restart the processing than when the processing is interrupted at the stage where the other parts are formed. Specifically, the processing system SYSa may perform processing in a manner in which the processing is interrupted at the stage where the formation of one structural layer SL is completed. That is, the processing system SYSa may perform processing in a manner in which the processing is not interrupted in the middle of forming one structural layer SL. This is because, when the processing is interrupted at the stage where the formation of one structural layer SL is completed, the modeling surface MS is easier to become a plane, and it is easier to restart the processing. That is, this is because, when the processing is interrupted at the stage where the formation of one structural layer SL is completed, it is easier to restart the processing because the unevenness caused by the step difference between the part where the structural layer SL has been formed and the part where the structural layer SL that should have been formed has not been formed is less likely to occur on the modeling surface MS than when the processing is interrupted in the middle of forming one structural layer SL.

[0193] For example, the processing system SYSa may perform processing by interrupting processing at a stage where a shaped object is formed on a portion of the molding surface MS where the characteristics of the heat transferred from the processing light EL meet the desired conditions. Specifically, the processing system SYSa may perform processing by interrupting processing at a stage where a shaped object is formed on a portion of the molding surface MS where the heat transferred from the processing light EL is easy to diffuse compared to other portions. This is because, when processing is interrupted at a stage where the formation of a shaped object is completed in a portion where heat is relatively easy to diffuse, the influence of the heat transferred from the processing light EL irradiated to the molding surface MS by interrupted processing is relatively unlikely to remain when processing is restarted in the future, and thus it is easy to restart processing.

[0194] After the processing starts, the control device 7 determines whether the processing is completed (step S121). That is, the control device 7 determines whether the formation of the entire 3-dimensional structure ST is completed. In the case where it is determined that the formation of the entire 3-dimensional structure ST is completed, the control device 7 determines that the processing is completed. However, in the case where it is determined in step S106 that the processing is performed to form only a part of the 3-dimensional structure ST, the control device 7 determines whether the formation of a part of the 3-dimensional structure ST (that is, a part of the 3-dimensional structure ST that is scheduled to be formed by the processing) is completed. In the case where it is determined that the formation of a part of the 3-dimensional structure ST is completed, the control device 7 determines that the processing is completed.

[0195] If the result of determination in step S121 is that the processing is completed (step S121: Yes), the processing system SYSa ends the second processing operation. In addition, if it is determined that the processing is completed because the formation of a part of the three-dimensional structure ST is completed, the three-dimensional structure ST is not completed. If the three-dimensional structure ST is not completed, the processing system SYSa may treat the workpiece W including the formed part of the three-dimensional structure ST as a new workpiece W, and perform the second processing operation for forming the remaining part of the three-dimensional structure ST that has not yet been formed into the new workpiece W, on the condition that the modeling material M is replenished to the hopper 11 after the second processing operation is completed. More specifically, the processing system SYSa may perform processing based on a part of the slice data obtained in step S101, that is, the first data part, so as to end the second processing operation after forming a part of the three-dimensional structure ST. Thereafter, the processing system SYSa may restart the processing based on the second data part of the slice data obtained that is different from the first data, so as to perform processing based on the second data part different from the first data. That is, the processing system SYSa may also end the second processing action at the stage where the processing based on the first data part in the slice data obtained in step S101 is completed, and then restart the processing based on the second data part in the slice data obtained, on the condition that the modeling material M is replenished in the hopper 11. However, in the case where the three-dimensional structure ST is formed by two (or more) processings, the temperature of the modeling surface MS at the stage of restarting the second processing may be different from that in the case where the three-dimensional structure ST is formed by one processing. The reason is that there is a possibility that the modeling surface MS becomes cold due to the interruption of the processing. Therefore, when the control device 7 restarts the processing based on the second data part in the slice data obtained, it may also perform an update process on the second data part to reflect the influence of the temperature of the modeling surface MS. In this case, the control device 7 may also restart the processing based on the updated second data part.

[0196] On the other hand, if the result of determination in step S121 is that the processing is not yet completed (step S121: No), the processing is continued. Furthermore, in the case where the processing is continued, the control device 7 determines whether the hopper 11 stores a sufficient amount of the modeling material M (step S122). That is, the control device 7 determines whether the hopper 11 stores a sufficient amount of the modeling material M during at least a portion of the period during which the processing system SYSa performs the processing.

[0197] Specifically, the control device 7 determines the storage amount of the modeling material M in the hopper 11 based on the measurement result of the weight measuring device 19. Thereafter, the control device 7 determines whether the storage amount of the modeling material M in the hopper 11 is greater than the second predetermined amount. As the second predetermined amount, the amount of the modeling material M required to form the unformed portion of the three-dimensional structure ST (i.e., the necessary amount of the modeling material M) may be used. Alternatively, as the second predetermined amount, the minimum storage amount of the modeling material M required to maintain the state in which the material supply device 1 supplies the modeling material M to the processing device 2, i.e., the required storage amount may be used. The necessary storage amount may also refer to the allowable lower limit value of the storage amount of the modeling material M. Alternatively, the necessary storage amount may also refer to the value obtained by adding a prescribed margin to the allowable lower limit value of the storage amount of the modeling material M. The allowable lower limit value of the storage amount of the modeling material M may also refer to the minimum storage amount of the modeling material M required to maintain the state in which the material supply device 1 supplies the modeling material M to the processing device 2. When the amount of the modeling material M stored in the hopper 11 is lower than the required storage amount (or the allowable lower limit), the material supply device 1 may not be able to properly (for example, at a constant supply rate) supply the modeling material M to the processing device 2 even if the modeling material M remains in the hopper 11. In addition, generally, the allowable lower limit of the amount of the modeling material M stored is less than the required amount of the modeling material M. However, other values ​​may be used as the second prescribed amount. When the amount of the modeling material M stored in the hopper 11 is greater than the second prescribed amount, the control device 7 determines that the hopper 11 stores a sufficient amount of the modeling material M. When the amount of the modeling material M stored in the hopper 11 is less than the second prescribed amount, the control device 7 determines that the hopper 11 does not store a sufficient amount of the modeling material M. It should be noted that when the amount of the modeling material M stored in the hopper 11 is the same as the second prescribed amount, the control device 7 may determine that the hopper 11 stores a sufficient amount of the modeling material M, or may determine that the hopper 11 does not store a sufficient amount of the modeling material M.

[0198] In addition, the case where the processing is performed is limited to the case where it is determined that the hopper 11 stores a sufficient amount of modeling material M before the processing is started, the case where the hopper 11 is replenished with modeling material M although it is determined that the hopper 11 does not store a sufficient amount of modeling material M before the processing is started, or the case where it is determined that a part of the three-dimensional structure ST that can be formed by the modeling material M stored in the hopper 11 is formed although it is determined that the hopper 11 does not store a sufficient amount of modeling material M before the processing is started. Therefore, originally, the possibility of determining that the hopper 11 does not store a sufficient amount of modeling material M after the processing is started is low. However, the determination of whether the hopper 11 stores a sufficient amount of modeling material M before the processing is started is based on the necessary amount of modeling material M estimated from the slice data, so depending on the estimation accuracy of the necessary amount of modeling material M, it may be determined that the hopper 11 does not store a sufficient amount of modeling material M after the processing is started. In addition, since the material nozzle 212 may not supply the expected amount of modeling material M (for example, the material nozzle 212 may supply a larger amount of modeling material M than expected), it is possible that the hopper 11 is determined to have not stored a sufficient amount of modeling material M after the processing starts.

[0199] If the result of determination in step S122 is that the hopper 11 stores a sufficient amount of modeling material M (step S122: Yes), the processing is continued. Furthermore, in the case of continuing the processing, the control device 7 determines whether the processing is completed and whether the hopper 11 stores a sufficient amount of modeling material M (step S121 and / or step S122).

[0200] On the other hand, if the result of the determination in step S122 is that the hopper 11 does not store a sufficient amount of the modeling material M (step S122: No), there is a possibility that the modeling material M is insufficient during the process of forming the three-dimensional structure ST. In this case, the processing system SYSa controls the display 8 to display a warning message for warning the user of the processing system SYSa that the hopper 11 does not store a sufficient amount of the modeling material M (step S123). The display of the warning message in step S123 can be the same as the display of the warning message in the above-mentioned step S104, so its detailed description is omitted.

[0201] In parallel with or before the display of the warning information, the processing system SYSa interrupts the processing (step S124). In addition, the processing system SYSa may interrupt the processing immediately after determining that the hopper 11 does not store a sufficient amount of the modeling material M. Alternatively, the processing system SYSa may interrupt the processing after a certain time has passed since it was determined that the hopper 11 does not store a sufficient amount of the modeling material M.

[0202] After that, the control device 7 determines whether the modeling material M is added to the hopper 11 (step S125). More specifically, the control device 7 determines whether the modeling material M is added to the hopper 11 until the hopper 11 stores a sufficient amount of the modeling material M. The control device 7 determines whether the hopper 11 stores a sufficient amount of the modeling material M because the modeling material M is added to the hopper 11. It should be noted that the state in which the hopper 11 stores a sufficient amount of the modeling material M in step S125 refers to the state in which the storage amount of the modeling material M in the hopper 11 is greater than the second predetermined amount. In addition, the processing of step S125 can also be the same as the processing of step S105 described above, so its detailed description is omitted.

[0203] Furthermore, in step S125, the control device 7 may determine whether the modeling material M is replenished in the hopper 11 after a certain time has passed since it was determined that the hopper 11 does not store a sufficient amount of the modeling material M. In this case, time is ensured for replenishing the modeling material M in the hopper 11. Conversely, the control device 7 may determine whether the modeling material M is replenished in the hopper 11 after a time required for replenishing the modeling material M in the hopper 11 has passed after displaying a warning message after it was determined that the hopper 11 does not store a sufficient amount of the modeling material M.

[0204] As a result of the determination in step S125, when it is determined that the hopper 11 stores a sufficient amount of the modeling material M because the modeling material M is replenished into the hopper 11 (step S125: Yes), the processing system SYSa can complete the processing without causing a situation such as insufficient modeling material M. Therefore, in this case, the processing system SYSa restarts the interrupted processing (step S111).

[0205] On the other hand, as a result of the determination in step S125, when it is determined that the hopper 11 has not been replenished with the modeling material M or that the hopper 11 has not stored a sufficient amount of the modeling material M even if the modeling material M has been replenished with the modeling material M (step S125: "No"), there is still a possibility that the modeling material M is insufficient during the process of forming the three-dimensional structure ST. In this case, the processing system SYSa does not restart the interrupted processing and ends the second processing operation. That is, the processing system SYSa ends the second processing operation without completing the three-dimensional structure ST. In this case, since the three-dimensional structure ST is not completed, the processing system SYSa may also treat the workpiece W including the formed portion of the three-dimensional structure ST as a new workpiece W on the condition that the modeling material M is replenished in the hopper 11 after the second processing operation is completed, and perform the second processing operation for forming the remaining portion of the three-dimensional structure ST that has not yet been formed into the new workpiece W.

[0206] (1-4) Technical Effects of the Processing System SYSa of the First Embodiment

[0207] As described above, according to the machining system SYSa of the first embodiment, the workpiece W can be additionally machined appropriately.

[0208] The processing system SYSa can perform the second processing operation taking into account the storage amount of the modeling material M in the hopper 11. Therefore, compared with the case where the processing operation is performed without taking into account the storage amount of the modeling material M in the hopper 11, the occurrence of abnormality due to shortage (particularly depletion) of the modeling material M is suppressed.

[0209] Specifically, the processing system SYSa can display information related to the amount of the modeling material M (for example, information related to at least one of the necessary amount of the modeling material M, the storage amount of the modeling material M in the hopper 11, and the allowable upper limit of the storage amount of the modeling material M in the hopper 11). As a result, the processing system SYSa can prompt the user who has confirmed the displayed information to take appropriate measures. In other words, the user can take appropriate measures based on the displayed information.

[0210] Specifically, the processing system SYSa can display a warning message when the hopper 11 does not store a sufficient amount of the molding material M. As a result, the processing system SYSa can prompt the user who has confirmed the warning message to take appropriate measures. That is, the user can take appropriate measures based on the displayed warning message.

[0211] In addition, the processing system SYSa determines whether the hopper 11 stores a sufficient amount of modeling material M before starting the processing, and does not start the processing in the first place if the hopper 11 does not store a sufficient amount of modeling material M. Therefore, even if the hopper 11 does not store a sufficient amount of modeling material M, the possibility of insufficient modeling material M during the formation of the three-dimensional structure ST is reduced compared to the case of starting the processing. That is, the possibility of the modeling material M stored in the hopper 11 being exhausted during the processing is reduced.

[0212] In addition, the processing system SYSa determines whether a sufficient amount of modeling material M is stored in the hopper 11 after starting the processing (i.e., during the processing), and interrupts the processing if a sufficient amount of modeling material M is not stored in the hopper 11. Therefore, it is possible to suppress the occurrence of the above-mentioned technical problems caused by continuing the processing (for example, continuing the irradiation of the processing light EL) in a situation where the modeling material M may be insufficient (or the modeling material M is exhausted).

[0213] Furthermore, even when the hopper 11 does not store a sufficient amount of modeling material M, the processing system SYSa can perform processing on the condition that the modeling material M is replenished. Therefore, when the hopper 11 does not store a sufficient amount of modeling material M, there are relatively more opportunities to ensure that processing can be performed compared to a case where processing is not performed unconditionally.

[0214] Furthermore, the processing system SYSa can perform processing of the portion of the three-dimensional structure ST that can be formed by the modeling material M stored in the hopper 11, even when the hopper 11 does not store a sufficient amount of modeling material M. Therefore, when the hopper 11 does not store a sufficient amount of modeling material M, there are relatively more opportunities to ensure that the processing can be performed, compared to a case where the processing is not performed unconditionally.

[0215] (1-5) Modification Example of Machining System SYSa of First Embodiment

[0216] The control device 7 can also be Fig.10 In step S105, it is not determined whether the modeling material M is replenished in the hopper 11. In this case, Fig.10 When it is determined in step S103 that the hopper 11 does not store a sufficient amount of the modeling material M, the control device 7 may also determine whether to perform processing to form only a portion of the three-dimensional structure ST ( Fig.10 Step S106).

[0217] Likewise, the control device 7 may not be Fig.10 In step S125, it is determined whether the molding material M is replenished in the hopper 11. In this case, Fig.10 If it is determined in step S122 that the hopper 11 does not store a sufficient amount of the modeling material M, the processing system SYSa may terminate the second processing operation. In this case, the processing system SYSa may treat the workpiece W including the formed portion of the three-dimensional structure ST as a new workpiece W, and perform the second processing operation for forming the remaining portion of the three-dimensional structure ST that has not yet been formed into the new workpiece W, on the condition that the modeling material M is replenished in the hopper 11 after the second processing operation is completed.

[0218] The control device 7 may also not be Fig.10 In step S106, it is determined whether processing is performed to form only a portion of the three-dimensional structure ST. In this case, Fig.10 In the case where it is determined in step S103 that the hopper 11 does not store a sufficient amount of the molding material M, or in the case where Fig.10 When it is determined in step S105 that the modeling material M has not been replenished in the hopper 11, the processing system SYSa may end the second processing operation.

[0219] The control device 7 can also be Fig.10 In step S104, no warning message is displayed. Fig.10 In the case where it is determined in step S103 that the hopper 11 does not store a sufficient amount of the modeling material M, the control device 7 may also determine whether the modeling material M is replenished in the hopper 11 ( Fig.10 Step S105). Or, Fig.10 When it is determined in step S103 that the hopper 11 does not store a sufficient amount of the modeling material M, the control device 7 may also determine whether to perform processing to form only a portion of the three-dimensional structure ST ( Fig.10 Step S106). Or, Fig.10 When it is determined in step S103 that the hopper 11 does not store a sufficient amount of the modeling material M, the processing system SYSa may end the second processing operation.

[0220] Likewise, the control device 7 can also be Fig.10 In step S123, no warning message is displayed. Fig.10 When it is determined in step S122 that the hopper 11 does not store a sufficient amount of the modeling material M, the processing system SYSa may interrupt the processing.

[0221] In the above description, the warning information is displayed on the display 8. That is, the warning information is output in a manner that the user can visually confirm. However, the warning information may also be output in other output forms. For example, the warning information may also be output as sound. In this case, the processing system SYSa may also have a speaker that can output the warning information as sound in addition to the display 8 or instead of the display 8.

[0222] In the above description, the number of the hopper 11 is one, but the processing system SYSa may include a plurality of hoppers 11 .

[0223] (2) Machining System SYSb of Second Embodiment

[0224] Next, a processing system SYS of a second embodiment (hereinafter, the processing system SYS of the second embodiment will be referred to as "processing system SYSb") will be described. The processing system SYSb of the second embodiment is different from the processing system SYSa of the first embodiment described above in that a material supply device 1b is provided instead of the material supply device 1. Other features of the processing system SYSb may be the same as other features of the processing system SYSa. The material supply device 1b is different from the material supply device 1 described above in that a hopper 11b is provided instead of the hopper 11. Other features of the material supply device 1b may be the same as other features of the material supply device 1. Therefore, hereinafter, reference will be made to Fig.26 The hopper 11b according to the second embodiment will be described. Fig.26 It is a side view which shows the structure of the hopper 11b of 2nd Embodiment.

[0225] like Fig.26 As shown, the hopper 11b of the second embodiment is different from the above-mentioned hopper 11 in that an observation window 115 is formed in the partition member 111. The other features of the hopper 11b may be the same as those of the hopper 11.

[0226] The observation window 117b is used as a window for the user to observe the state of the storage space 112 from the outside of the hopper 11b (for example, the external space 16OUT). Therefore, the observation window 117b may also include a light-passing member that is arranged in the through hole that penetrates the partition member 111 and allows light to pass through. As a result, the user can grasp the storage amount of the modeling material M in the hopper 11b through the observation window 117b.

[0227] The observation window 117b may also display information related to the necessary amount of the molding material M. For example, Fig.26 As shown, an indicator 118b indicating the position of the upper end of the stored material M in the hopper 11 assuming that the hopper 11 stores a necessary amount of the modeling material M may be displayed in the observation window 117b. In this case, the indicator 118b can move up and down according to the necessary amount of the modeling material M. In addition, the indicator 118b may also be an indicator as a physical object. Alternatively, when the observation window 117b also serves as a display, the indicator 118b may also be a display object displayed on the display.

[0228] As described above, the machining system SYSb of the second embodiment can enjoy the same effects as those enjoyed by the machining system SYSa of the above-described first embodiment.

[0229] (3) Processing System SYSc of the Third Embodiment

[0230] Next, refer to Fig. 27 A machining system SYS according to a third embodiment (hereinafter, the machining system SYS according to the third embodiment will be referred to as a “machining system SYSc”) will be described. Fig. 27 1 is a system configuration diagram showing a system configuration of a machining system SYSc according to a third embodiment.

[0231] like Fig. 27As shown, the processing system SYSc of the third embodiment is different from at least one of the processing system SYSa of the first embodiment and the processing system SYSb of the second embodiment in that it has a material supply device 1c instead of the material supply device 1. Other features of the processing system SYSc may be the same as other features of at least one of the processing system SYSa and the processing system SYSb of the second embodiment. The material supply device 1c is different from at least one of the material supply device 1 and the material supply device 1b in that it has a pressure measuring device 19c. Other features of the material supply device 1c may be the same as other features of at least one of the material supply device 1 and the material supply device 1b.

[0232] The pressure measuring device 19c can measure the pressure inside the material supply device 1c. Specifically, the pressure measuring device 19c can measure the internal space 16IN (see Figure 3 ) pressure.

[0233] The control device 7 may determine the state of the material supply device 1c based on the measurement result of at least one of the gravity measurement device 19 and the pressure measurement device 19c. The control device 7 may control the display 8 to display information related to the state of the material supply device 1c.

[0234] Specifically, for example, the control device 7 determines whether an abnormality has occurred in the material supply device 1c based on the measurement results of at least one of the gravity measuring device 19 and the pressure measuring device 19c. The "abnormality of the material supply device 1c" in the third embodiment is not limited to the abnormality of "insufficient (especially depleted) modeling material M" in the first embodiment described above, but may also include any abnormality that may occur in the material supply device 1c. Therefore, the processing system SYSc of the third embodiment is different from the processing system SYSa of the first embodiment in that it can also determine whether an abnormality of a different type from the abnormality of insufficient modeling material M has occurred.

[0235] The control device 7 may also control the display 8 to display a warning message to warn the user of the abnormality when it is determined that the material supply device 1c has an abnormality. In this case, the control device 7 may control the display 8 to display a warning message including the type of abnormality. The control device 7 may also control the display 8 to display a warning message including the portion where the abnormality has occurred. The control device 7 may also control the display 8 to display a warning message including a solution to the abnormality.

[0236] The control device 7 may also perform an action to deal with the abnormality when it is determined that the material supply device 1c has an abnormality. For example, the control device 7 may also control the processing device 2, etc., so that the processing is not started before the abnormality is eliminated when it is determined that the material supply device 1c has an abnormality before starting the above-mentioned processing. For example, the control device 7 may also control the processing device 2, etc. in the following manner: when it is determined that the material supply device 1c has an abnormality during the above-mentioned processing, the processing is interrupted before the abnormality is eliminated. Or, for example, the control device 7 may also terminate the processing action (i.e., the first or second processing action mentioned above) itself when it is determined that the material supply device 1c has an abnormality during the above-mentioned processing. When interrupting the processing or terminating the processing action, in order to prevent the contact between the processing head 21 and the molding surface MS, the control device 7 may also control at least one of the head drive system 22 and the worktable drive system 32 to make the processing head 21 leave the molding surface MS. Alternatively, for example, when the control device 7 determines that an abnormality has occurred in the material supply device 1b before starting the above-mentioned processing, the control device 7 may control the processing device 2 etc. so as not to start the processing until the abnormality is resolved.

[0237] An example of an abnormality of the material supply device 1c is a material supply abnormality such as "the material supply device 1c cannot supply the molding material M to the processing device 2". Therefore, the control device 7 may also determine whether a material supply abnormality has occurred based on the measurement results of at least one of the gravity measuring device 19 and the pressure measuring device 19c.

[0238] In the case of a material supply abnormality, the molding material M is not supplied from the material nozzle 212 to the molding surface MS, so the processing system SYSc may have a technical problem that the molding object cannot be formed. Moreover, even in the case of an abnormality such as the shortage (especially depletion) of the molding material M described in the first embodiment, the molding material M cannot be supplied from the material nozzle 212 to the molding surface MS, so even in the case of a material supply abnormality, a technical problem caused by the shortage (especially depletion) of the molding material M described in the first embodiment may occur. In the third embodiment, it is expected to suppress the occurrence of technical problems caused by the material supply abnormality.

[0239] As a first example of the cause of the material supply abnormality, there is an abnormality that the modeling material M cannot be conveyed from the holding member 12 to the material feeding member 15. This is because, since the modeling material M is supplied from the material supply device 1c to the processing device 2 via the material feeding member 15, if the modeling material M is not conveyed to the material feeding member 15, the material supply device 1c cannot supply the modeling material M to the processing device 2. Such an abnormality may be caused by at least one of an abnormality (e.g., breakage) of the conveying member 13 that conveys the modeling material M from the holding member 12 to the material feeding member 15 and an abnormality of the driving device 14 that drives the conveying member 13.

[0240] When the modeling material M cannot be conveyed from the holding member 12 to the material delivery member 15, the modeling material M is retained in the material supply device 1c. Therefore, the amount of the modeling material M in the material supply device 1c does not decrease. That is, the storage amount of the modeling material M in the hopper 11 does not decrease. Therefore, it is highly likely that the measurement result of the weight measuring device 19 that measures the weight of the modeling material M stored in the hopper 11 does not change. Therefore, in order to determine whether an abnormality such as the inability to convey the modeling material M from the holding member 12 to the material delivery member 15 has occurred, the control device 7 may also determine whether the measurement result of the weight measuring device 19 changes for more than a first predetermined time (for example, several seconds). In addition, the state of "the measurement result of the weight measuring device 19 does not change" mentioned here includes not only a state in which the measurement result of the weight measuring device 19 does not change at all as shown in the text, but also a state in which the measurement result of the weight measuring device 19 changes slightly but does not change as when the material supply device 1c supplies the modeling material M to the processing device 2. Furthermore, when it is determined that the measurement result of the weight measuring device 19 has not changed for more than the first specified time, the control device 7 may determine that an abnormality has occurred in which the molding material M cannot be conveyed from the holding component 12 to the material feeding component 15 (i.e., a material supply abnormality has occurred).

[0241] As a second example of the cause of abnormal material supply, there is an abnormality such as clogging of the material supply pipe 191 connecting the material supply device 1c and the processing device 2 (for example, clogging by the modeling material M or other substances). This is because the modeling material M is supplied from the material supply device 1b to the processing device 2 via the material supply pipe 191, so if the material supply pipe 191 is clogged, the material supply device 1c cannot supply the modeling material M to the processing device 2 via the material supply pipe 191.

[0242] When the material supply pipe 191 is blocked, there is a possibility that the pressure of the internal space 16IN of the material supply device 1c becomes higher than when the material supply pipe 191 is not blocked. This is because, when the material supply pipe 191 is not blocked, the purge gas supplied from the gas supply device 5 to the internal space 16IN is discharged to the material supply pipe 191, while on the other hand, when the material supply pipe 191 is blocked, the purge gas supplied from the gas supply device 5 to the internal space 16IN cannot be discharged from the material supply pipe 191 and remains in the internal space 16IN. Therefore, in order to determine whether an abnormality such as blockage of the material supply pipe 191 has occurred, the control device 7 may also determine whether the measurement result of the pressure measuring device 19c is above the first threshold value. The first threshold value is set to an appropriate value that can distinguish between the pressure of the internal space 16IN when the material supply pipe 191 is not blocked and the pressure of the internal space 16IN when the material supply pipe 191 is blocked. Furthermore, when determining that the measurement result of the pressure measuring device 19c is equal to or greater than the first threshold value, the control device 7 may determine that an abnormality such as clogging of the material supply pipe 191 has occurred (that is, a material supply abnormality has occurred).

[0243] As a third example of the cause of the material supply abnormality, the pressure of the internal space 16IN is too low, and the molding material M cannot be pressure-fed from the material supply device 1c to the processing device 2. This is because the molding material M is pressure-fed from the material supply device 1b to the processing device 2 by the pressure of the internal space 16IN, so if the pressure of the internal space 16IN is too low, the molding material M cannot be pressure-fed. Such an abnormality may be caused by at least one of an abnormality such as deterioration of a sealing member arranged at an opening (specifically, at least one of the supply port 162, the opening 163, the delivery port 165, the inflow port 166, and the opening 167) formed in the housing 16, an abnormality such as forgetting to close the cover 115 of the hopper 11, deterioration of a member for the inflow and outflow of the purge gas (for example, at least one of the joint member and the resin member), and an abnormality such as poor assembly of the members constituting the material supply device 1c.

[0244] When the pressure of the internal space 16IN is too low to pressurize the modeling material M from the material supply device 1c to the processing device 2, the pressure of the internal space 16IN of the material supply device 1c becomes lower than that of the internal space 16IN being appropriate to pressurize the modeling material M from the material supply device 1c to the processing device 2. Therefore, in order to determine whether the abnormality of the internal space 16IN being too low to pressurize the modeling material M from the material supply device 1c to the processing device 2 has occurred, the control device 7 may determine whether the state in which the measurement result of the pressure measuring device 19c is less than the second threshold value continues for more than a second predetermined time (for example, several seconds). The second threshold value is set to an appropriate value that can distinguish the pressure of the internal space 16IN when the pressure of the internal space 16IN is too low to pressurize the modeling material M from the material supply device 1c to the processing device 2 and the pressure of the internal space 16IN when the pressure of the internal space 16IN is appropriate to pressurize the modeling material M from the material supply device 1c to the processing device 2. Moreover, when the control device 7 determines that the measurement result of the pressure measuring device 19c is below the second threshold value for more than the second specified time, it can also determine that an abnormality has occurred such that the pressure in the internal space 16IN is too low and the molding material M cannot be pressurized from the material supply device 1c to the processing device 2 (that is, a material supply abnormality has occurred).

[0245] As an example of an abnormality of the material supply device 1c, there can be cited an abnormality of excess material such as "the hopper 11 stores a quantity of modeling material M exceeding the allowable amount". Therefore, the control device 7 can also determine whether an abnormality of excess material has occurred based on the measurement results of at least one of the gravity measuring device 19 and the pressure measuring device 19c. Specifically, the control device 7 can also calculate the storage amount of the modeling material M in the hopper 11 based on the measurement results of the weight measuring device 19, and determine whether the calculated storage amount is greater than the third prescribed amount. The third prescribed amount can also be set to the allowable upper limit value of the storage amount of the modeling material M in the material supply device 1c (or a value that is less than the allowable upper limit value by a prescribed margin). Moreover, the control device 7 can also determine that an abnormality of excess material has occurred when it is determined that the calculated storage amount has not changed for more than the first prescribed time.

[0246] The material excess abnormality may cause an abnormality in the supply amount of the modeling material M supplied from the hopper 11 to the holding member 12. The abnormality in the supply amount of the modeling material M supplied from the hopper 11 to the holding member 12 may cause an abnormality in the supply amount of the modeling material M supplied from the material supply device 1c to the processing device 2. The abnormality in the supply amount of the modeling material M supplied from the material supply device 1c to the processing device 2 may cause a technical problem such as deterioration in the accuracy of the three-dimensional structure ST. In the third embodiment, it is expected to suppress the occurrence of technical problems caused by the material supply abnormality.

[0247] As an example of an abnormality of the material supply device 1c, there can be cited a measurement abnormality such as "the measurement result of the weight measuring device 19 is not updated in the control device 7". When such a measurement abnormality occurs, the control device 7 may not be able to grasp the measurement result of the weight measuring device 19. Alternatively, there is a possibility that the measurement result of the weight measuring device 19 grasped by the control device 7 remains the same for a long time. Therefore, in order to determine whether a measurement abnormality has occurred, the control device 7 may also determine whether the measurement result of the weight measuring device 19 can be grasped and / or whether the measurement result of the weight measuring device 19b grasped by the control device 7 remains the same for a long time. Furthermore, the control device 7 may also determine that a measurement abnormality has occurred when it is determined that the measurement result of the weight measuring device 19 cannot be grasped and / or the measurement result of the weight measuring device 19b grasped by the control device 7 remains the same for a long time.

[0248] When a measurement abnormality occurs, the control device 7 cannot accurately grasp the storage amount of the modeling material M in the hopper 11, which may cause an abnormality in the supply amount of the modeling material M supplied from the material supply device 1c to the processing device 2. Therefore, it may cause an abnormality such as the "second processing operation considering the storage amount of the modeling material M in the hopper 11" described in the first embodiment cannot be properly performed. As a result, there may be a technical problem that the accuracy of the three-dimensional structure ST may be affected. In the third embodiment, it is expected to suppress the occurrence of technical problems caused by measurement abnormalities.

[0249] As described above, the machining system SYSc of the third embodiment can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above, and can perform appropriate operations when an abnormality different from the abnormality of shortage of the molding material M occurs.

[0250] In addition, the control device 7 may determine (i.e., predict) whether an abnormality will occur in the material supply device 1c in the future based on the measurement results of at least one of the gravity measuring device 19 and the pressure measuring device 19c, on the basis of or instead of determining whether an abnormality has occurred in the material supply device 1c (i.e., whether an abnormality has actually occurred). That is, the control device 7 may also predict whether an abnormality will occur in the material supply device 1c before the abnormality actually occurs in the material supply device 1c.

[0251] For example, in the case where a material supply abnormality occurs due to an abnormality such as the blockage of the material supply pipe 191 described above, there is a possibility that the material supply pipe 191 is gradually blocked. In this case, the pressure in the internal space 16IN of the material supply device 1c may gradually increase. Therefore, in order to predict whether an abnormality such as the blockage of the material supply pipe 191 will occur in the future, the control device 7 may also determine whether the measurement result of the pressure measuring device 19c is gradually increasing and is above the third threshold. The third threshold is smaller than the above-mentioned first threshold for determining whether an abnormality such as the blockage of the material supply pipe 191 actually occurs. Moreover, the control device 7 may also determine that although an abnormality such as the blockage of the material supply pipe 191 has not yet occurred, an abnormality such as the blockage of the material supply pipe 191 will occur in the future when it is determined that the measurement result of the pressure measuring device 19c is gradually increasing and is above the third threshold.

[0252] For example, when a material supply abnormality occurs due to the above-mentioned abnormality that the pressure of the internal space 16IN is too low and the molding material M cannot be pressure-fed from the material supply device 1c to the processing device 2, the pressure of the internal space 16IN may gradually decrease. Therefore, in order to predict whether the abnormality that the pressure of the internal space 16IN is too low and the molding material M cannot be pressure-fed from the material supply device 1c to the processing device 2 will occur in the future, the control device 7 may determine whether the measurement result of the pressure measuring device 19c is gradually decreasing and is below the fourth threshold value. The fourth threshold value is larger than the above-mentioned third threshold value for determining whether the abnormality that the pressure of the internal space 16IN is too low and the molding material M cannot be pressure-fed from the material supply device 1c to the processing device 2 actually occurs. In addition, when it is determined that the measurement result of the pressure measuring device 19c is gradually decreasing and is below the fourth threshold value, the control device 7 may determine that although the abnormality that the pressure of the internal space 16IN is too low and the molding material M cannot be pressure-fed from the material supply device 1c to the processing device 2 does not occur at present, the abnormality that the pressure of the internal space 16IN is too low and the molding material M cannot be pressure-fed from the material supply device 1c to the processing device 2 will occur in the future.

[0253] (4) Processing System SYSd of Fourth Embodiment

[0254] Next, refer to Fig.28 A processing system SYS according to a fourth embodiment (hereinafter, the processing system SYS according to the fourth embodiment will be referred to as a “processing system SYSd”) will be described. Fig.28 It is a system configuration diagram showing the system configuration of a machining system SYSd according to the fourth embodiment.

[0255] like Fig.28As shown, the processing system SYSd of the fourth embodiment is different from at least one of the processing systems SYSa of the first embodiment to the processing systems SYSc of the third embodiment described above in that it further includes an abnormality monitoring device 9d. Other features of the processing system SYSd may be the same as other features of at least one of the processing systems SYSa to SYSc.

[0256] The abnormality monitoring device 9d is a device for monitoring any abnormality that may occur in the processing system SYSd. Specifically, the abnormality monitoring device 9d includes a sensor corresponding to the type of abnormality to be monitored. The control device 7 can also control the display 8 to display information related to the monitoring result (for example, the detection result of the sensor) of the abnormality monitoring device 9d (that is, information related to the state of the processing system SYSd).

[0257] The control device 7 determines whether an abnormality has occurred in the processing system SYSd based on the monitoring result of the abnormality monitoring device 9d (for example, the detection result of the sensor). Therefore, the processing system SYSd of the fourth embodiment is different from the processing system SYSc of the third embodiment in that it is not limited to determining whether an abnormality has occurred in the material supply device 1, but can also determine whether any abnormality has occurred in the processing system SYSd.

[0258] The control device 7 may also control the display 8 to display a warning message to warn the user of the abnormality when it is determined that the material supply device 1d has an abnormality. At this time, the control device 7 may control the display 8 to display a warning message including the type of abnormality. The control device 7 may also control the display 8 to display a warning message including the portion where the abnormality has occurred. The control device 7 may also control the display 8 to display a warning message including a solution to the abnormality.

[0259] The control device 7 may also perform an action to deal with the abnormality when it is determined that the processing system SYSd has an abnormality. For example, the control device 7 may also control the processing device 2, etc., so that the processing is not started before the abnormality is eliminated when it is determined that the processing system SYSd has an abnormality before starting the above-mentioned processing. For example, the control device 7 may also control the processing device 2, etc., so that the processing is interrupted before the abnormality is eliminated when it is determined that the processing system SYSd has an abnormality during the above-mentioned processing. Or, for example, the control device 7 may also terminate the processing action (that is, the first or second processing action mentioned above) itself when it is determined that the processing system SYSd has an abnormality during the above-mentioned processing. When interrupting the processing or terminating the processing action, in order to prevent the processing head 21 from contacting the molding surface MS, the control device 7 may also control at least one of the head drive system 22 and the table drive system 32 so that the processing head 21 is separated from the molding surface MS. Or, for example, the control device 7 may also control the processing device 2, etc., so that the processing is not started before the abnormality is eliminated when it is determined that the processing system SYSd has an abnormality before starting the above-mentioned processing.

[0260] As an example of an abnormality of the machining system SYSd, there can be cited an abnormality in which the machining head 21 moves beyond the movable range (i.e., the machining head 21 is located at a position beyond the movable range). In this case, the abnormality monitoring device 9d may also include a head position sensor capable of measuring the position of the machining head 21. The head position sensor may also include, for example, at least one of an encoder and an interferometer. The control device 7 may also determine, based on the detection result of the head position sensor, whether an abnormality in which the machining head 21 moves beyond the movable range has occurred. Specifically, the control device 7 may also determine that an abnormality in which the machining head 21 moves beyond the movable range has occurred when the position of the machining head 21 determined based on the detection result of the head position sensor is a position beyond the movable range (e.g., a position outside the movable range).

[0261] As an example of an abnormality of the machining system SYSd, there is an abnormality in which the worktable 31 moves beyond the movable range (that is, the worktable 31 is located at a position beyond the movable range). In this case, the abnormality monitoring device 9d may also include a worktable position sensor capable of measuring the position of the worktable 31. The worktable position sensor may also include, for example, at least one of an encoder and an interferometer. The control device 7 may also determine whether an abnormality in which the worktable 31 moves beyond the movable range has occurred based on the detection result of the worktable position sensor. Specifically, the control device 7 may also determine that an abnormality in which the worktable 31 moves beyond the movable range has occurred when the position of the worktable 31 determined based on the detection result of the worktable position sensor is a position beyond the movable range (for example, a position outside the movable range).

[0262] As an example of an abnormality of the processing system SYSd, there can be cited an abnormality that the amount of processing light EL emitted from the irradiation optical system 211 toward the modeling surface MS exceeds the upper limit or falls below the lower limit. In this case, the abnormality monitoring device 9d may also include a light amount sensor capable of detecting the amount of processing light EL emitted from the irradiation optical system 211 toward the modeling surface MS. In addition, in order not to hinder the processing based on the processing light EL, the light amount sensor may also be capable of detecting the amount of return light from the modeling surface MS of the processing light EL. In this case, the control device 7 can estimate the amount of processing light EL emitted from the irradiation optical system 211 toward the modeling surface MS based on the amount of return light from the modeling surface MS of the processing light EL. The control device 7 may also determine whether an abnormality has occurred that the amount of processing light EL emitted from the irradiation optical system 211 toward the modeling surface MS exceeds the upper limit or falls below the lower limit based on the detection result of the light amount sensor.

[0263] As an example of an abnormality of the processing system SYSd, there can be cited an abnormality such as a disconnection of the optical transmission component 41 (e.g., an optical fiber or a light guide) connecting the light source 4 and the processing device 2 (particularly the irradiation optical system 211). In this case, the abnormality monitoring device 9d may also include: an electric wire extending along the optical transmission component 41 and being cut off when the optical transmission component 41 is disconnected; and a disconnection sensor capable of detecting the disconnection of the electric wire. The control device 7 may also determine whether an abnormality such as a disconnection of the optical transmission component 41 has occurred based on the detection result of the disconnection sensor. Specifically, the control device 7 may also determine whether the electric wire is disconnected based on the detection result of the disconnection sensor. In addition, the control device 7 may also determine that an abnormality such as a disconnection of the optical transmission component 41 has occurred when it is determined that the electric wire is disconnected.

[0264] As an example of an abnormality of the processing system SYSd, there is an abnormality that the processing light EL is emitted from the irradiation optical system 211 even though the processing head 21 does not move relative to the modeling surface MS (i.e., stops). In this case, the abnormality monitoring device 9d may also include the head position sensor and / or the table position sensor mentioned above, and a light source sensor capable of detecting the emission state of the processing light EL in the light source 4. The control device 7 may also determine whether an abnormality has occurred that the processing light EL is emitted from the irradiation optical system 211 even though the processing head 21 does not move relative to the modeling surface MS based on the detection results of the head position sensor and / or the table position sensor and the light source sensor. Specifically, the control device 7 may also determine whether the processing head 21 and / or the table 31 are moving based on the detection results of the head position sensor and / or the table position sensor, and determine whether the light source 4 emits the processing light EL based on the detection results of the light source sensor. Furthermore, when the control device 7 determines that the light source 4 emits the processing light EL even though the processing head 21 and the table 31 do not move, it can also determine that an abnormality has occurred in which the processing light EL is emitted from the irradiation optical system 211 even though the processing head 21 does not move relative to the modeling surface MS.

[0265] As an example of an abnormality of the processing system SYSd, an abnormality that the head drive system 22 cannot properly move the processing head 21 can be cited. In this case, the abnormality monitoring device 9d may also include the above-mentioned head position sensor. The control device 7 may also determine whether an abnormality that the head drive system 22 cannot properly move the processing head 21 has occurred based on the detection result of the head position sensor. Specifically, the control device 7 controls the head drive system 22 in a manner that moves the processing head 21 based on the above-mentioned slice data. Therefore, the control device 7 can determine the original movement mode (or position) of the processing head 21 based on the slice data. In addition, the control device 7 can determine the actual movement mode (or position) of the processing head 21 based on the detection result of the head position sensor. The control device 7 may also determine that an abnormality that the head drive system 22 cannot properly move the processing head 21 has occurred when the difference between the original movement mode (or position) of the processing head 21 and the actual movement mode (or position) of the processing head 21 is greater than the allowable amount.

[0266] As an example of an abnormality of the processing system SYSd, an abnormality that the table drive system 32 cannot move the table 31 properly is cited. In this case, the abnormality monitoring device 9d may also include the above-mentioned table position sensor. The control device 7 may also determine whether an abnormality that the table drive system 32 cannot move the table 31 properly occurs based on the detection result of the table position sensor. Specifically, the control device 7 controls the table drive system 32 so that the table 31 moves based on the above-mentioned slice data. Therefore, the control device 7 can determine the original movement mode (or position) of the table 31 based on the slice data. Furthermore, the control device 7 can determine the actual movement form (or position) of the table 31 based on the detection result of the table position sensor. The control device 7 may also determine that an abnormality that the table drive system 32 cannot move the table 31 properly occurs when the difference between the original movement mode (or position) of the table 31 and the actual movement mode (or position) of the table 31 is greater than the allowable amount.

[0267] As an example of an abnormality of the machining system SYSc, an abnormality that the pressure of the chamber space 63IN exceeds the upper limit pressure or falls below the lower limit pressure is listed. In this case, the abnormality monitoring device 9d may also include a pressure sensor capable of detecting the pressure of the chamber space 63IN. The control device 7 may also determine whether an abnormality that the pressure of the chamber space 63IN exceeds the upper limit pressure or falls below the lower limit pressure occurs based on the detection result of the pressure sensor.

[0268] As an example of an abnormality of the processing system SYSd, an abnormality that the temperature of the chamber space 63IN exceeds the upper limit temperature or falls below the lower limit temperature is listed. In this case, the abnormality monitoring device 9c may also include a temperature sensor capable of detecting the temperature of the chamber space 63IN. The control device 7 may also determine whether an abnormality that the temperature of the chamber space 63IN exceeds the upper limit temperature or falls below the lower limit temperature occurs based on the detection result of the temperature sensor.

[0269] As an example of an abnormality of the machining system SYSd, an abnormality such as the machining head 21 contacts certain objects can be cited. As an example of an object that the machining head 21 may collide with, for example, at least one of the workpiece W, the workbench 31, and the shaped object formed on the workpiece W can be cited. In this case, the abnormality monitoring device 9d may also include a contact sensor capable of detecting the contact between the machining head 21 and the object. Alternatively, the abnormality monitoring device 9d may also include the above-mentioned head position sensor. The control device 7 may also determine whether an abnormality such as the machining head 21 contacts certain objects has occurred based on the detection results of the contact sensor and / or the head position sensor.

[0270] As an example of an abnormality of the machining system SYSd, an abnormality that the distance between the machining head 21 and a certain object is lower than the allowable lower limit distance can be cited. As an example of an object that may approach the machining head 21, for example, at least one of the workpiece W, the workbench 31, and the shaped object formed on the workpiece W can be cited. In this case, the abnormality monitoring device 9d may also include a distance sensor capable of detecting the distance between the machining head 21 and the object. Alternatively, the abnormality monitoring device 9d may also include the above-mentioned head position sensor. The control device 7 may also determine whether an abnormality that the distance between the machining head 21 and a certain object is lower than the allowable lower limit distance has occurred based on the detection results of the distance sensor and / or the head position sensor.

[0271] As an example of an abnormality of the processing system SYSd, an abnormality that the concentration of oxygen in the chamber space 63IN exceeds the allowable upper limit concentration is listed. In this case, the abnormality monitoring device 9d may also include a concentration sensor capable of detecting the concentration of oxygen in the chamber space 63IN. The control device 7 may also determine whether an abnormality that the concentration of oxygen in the chamber space 63IN exceeds the allowable upper limit concentration has occurred based on the detection result of the concentration sensor.

[0272] As described above, the machining system SYSd of the fourth embodiment can enjoy the same effects as those enjoyed by at least one of the machining systems SYSa of the first embodiment to the machining system SYSc of the third embodiment, and can perform appropriate actions when some abnormality occurs in the machining system SYSd.

[0273] In the fourth embodiment, in addition to or instead of determining whether an abnormality has occurred in the machining system SYSd (i.e., whether an abnormality has actually occurred), the control device 7 may determine (i.e., predict) whether an abnormality will occur in the machining system SYSd in the future based on the monitoring result of the abnormality monitoring device 9d, similarly to the third embodiment. That is, the control device 7 may predict whether an abnormality will occur in the machining system SYSd before the abnormality actually occurs in the machining system SYSd.

[0274] (5) Processing System SYSe of Fifth Embodiment

[0275] Next, refer to Fig.29 A processing system SYS according to a fifth embodiment (hereinafter, the processing system SYS according to the fifth embodiment will be referred to as a “processing system SYSe”) will be described. Fig.29 It is a system configuration diagram showing the system configuration of a processing system SYSe according to the fifth embodiment.

[0276] like Fig.29As shown, the processing system SYSe of the fifth embodiment is different from at least one of the processing systems SYSa of the first embodiment to the processing systems SYSd of the fourth embodiment described above in that it further includes an observation device 9e. Other features of the processing system SYSe may be the same as at least one other feature of the processing systems SYSa to SYSd.

[0277] The observation device 9e can also observe the state of at least a part of the chamber space 63IN under the control of the control device 7. As described above, the chamber space 63IN contains the processing device 2, the workbench device 3, and the workpiece W. Therefore, the observation device 9e can also observe the state of at least a part of the processing device 2, the workbench device 3, and the workpiece W. As described above, the above-mentioned processing is performed in the chamber space 63IN. Therefore, the observation device 9e can also observe the state of the processing. The state of the processing can also include at least one of the state of the molding surface MS to be processed, the irradiation state of the processing light EL, the supply state of the molding material M, and the state of the molten pool MP.

[0278] The observation result of the observation device 9e may be output to the control device 7. The control device 7 may control the processing device 2 and the like so as to perform processing according to the observation result of the observation result 9e. The control device 7 may control the display 8 so as to display information indicating the observation result of the observation result 9e.

[0279] The observation device 9e may also include a camera, for example. In this case, the observation device 9e may also be able to capture the state of at least a portion of the chamber space 63IN. The observation device 9e may also be able to output an image representing the state of at least a portion of the chamber space 63IN to the control device 7. The observation device 9e may also be able to capture the state of at least a portion of the processing device 2, the workbench device 3, and the workpiece W. The observation device 9e may also be able to output an image representing the state of at least a portion of the processing device 2, the workbench device 3, and the workpiece W to the control device 7. The observation device 9d may also be able to capture the state of the processing. The observation device 9e may also be able to output an image representing the state of the processing to the control device 7.

[0280] The observation device 9e may also be isolated from the chamber space 63IN by the partition member 93e. The observation device 9e may also be arranged in a space isolated from the chamber space 63IN by the partition member 93e. In this case, the adhesion of the substance existing in the chamber space 63IN to the observation device 9e is suppressed. In addition, as an example of the substance existing in the chamber space 63IN, there may be the molding material M supplied from the material nozzle 212 to the chamber space 63IN, and the substance generated from the molding surface MS due to the irradiation of the processing light EL. As an example of the substance generated from the molding surface MS due to the irradiation of the processing light EL, smoke containing at least one of the particles of the molten molding material M and the particles of the material constituting the molten workpiece W can be listed.

[0281] The partition member 93e includes a light-transmitting member 94e that allows light to pass therethrough and blocks the above-mentioned substances. As a result, even if the observation device 9e is isolated from the chamber space 63IN by the partition member 93e, the observation device 9e can observe the state of the observation object through the light-transmitting member 94e.

[0282] As described above, the processing system SYSe of the fifth embodiment can achieve the same effects as those achieved by at least one of the processing systems SYSa of the first embodiment to the processing system SYSd of the fourth embodiment described above. Furthermore, the processing system SYSe can appropriately observe the observation object using the observation device 9e.

[0283] (6) Processing System SYSf of Sixth Embodiment

[0284] Next, refer to Fig.30 A processing system SYS according to a fifth embodiment (hereinafter, the processing system SYS according to a sixth embodiment will be referred to as a “processing system SYSf”) will be described. Fig.30 1 is a system configuration diagram showing a system configuration of a processing system SYSf according to a sixth embodiment.

[0285] like Fig.30 As shown, the processing system SYSf of the sixth embodiment is different from the processing system SYSe of the fifth embodiment described above in that a processing device 2f is provided instead of the processing device 2. Other features of the processing system SYSf may be the same as those of the processing system SYSe. The processing device 2f is different from the processing device 2 in that it has a plurality of guide light emitting devices 23f. Other features of the processing device 2f may be the same as those of the processing device 2.

[0286] The guide light emitting device 23f is disposed on the processing head 21. The guide light emitting device 23f emits the guide light GL. The guide light emitting device 23f emits the guide light GL in such a manner that the guide light GL advances in the chamber space 63IN. The plurality of guide light emitting devices 23f are aligned with each other in such a manner that the plurality of guide lights GL emitted from the plurality of guide light emitting devices 23f intersect each other at a certain position below the processing head 21.

[0287] In the sixth embodiment, in particular, the plurality of guide light emitting devices 23f may be mutually aligned in such a manner that the plurality of guide lights GL intersect each other at the focal position of the processing light EL. In this case, the processing system SYSf may also use the plurality of guide lights GL to set the focal position of the processing light EL to a desired position. Specifically, the control device 7 may use the plurality of guide lights GL to move the processing head 21 along the Z-axis direction in such a manner that the focal position of the processing light EL is set to a desired position. The following describes the operation of setting the focal position of the processing light EL to a desired position using the plurality of guide lights GL.

[0288] As described above, the focus position of the processing light EL is usually set on the modeling surface MS. If a plurality of guide lights GL are emitted from the plurality of guide light emitting devices 23f respectively when the focus position of the processing light EL is set on the modeling surface MS, the beam points of the plurality of guide lights GL on the modeling surface MS when the focus position of the processing light EL is set on the modeling surface MS are shown as follows. Fig.31 As shown in (a), the beam spots of the plurality of guide lights GL overlap on the modeling surface MS. On the other hand, if the focus position of the processing light EL is set at a position different from the modeling surface MS, the beam spots of the plurality of guide lights GL on the modeling surface MS overlap as shown in (a). Fig.31 As shown in (b), the beam spots of the plurality of guide lights GL do not overlap on the modeling surface MS. Therefore, if the control device 7 moves the processing head 21 in the Z-axis direction in such a manner that the beam spots of the plurality of guide lights GL overlap on the modeling surface MS, the focusing position of the processing light EL can be set on the modeling surface MS.

[0289] The states of the beam spots of the multiple guide lights GL on the modeling surface MS can be determined based on the observation results of the observation device 9e. Therefore, the control device 7 can determine whether the beam spots of the multiple guide lights GL on the modeling surface MS overlap based on the observation results of the observation device 9e. That is, the control device 7 can determine whether the focus position of the processing light EL is set to the modeling surface MS based on the observation results of the observation device 9e. If the beam spots of the multiple guide lights GL on the modeling surface MS do not overlap, the control device 7 moves the processing head 21 along the Z-axis direction in such a way that the beam spots of the multiple guide lights GL on the modeling surface MS overlap. As a result, the focus position of the processing light EL is set to the modeling surface MS.

[0290] As described above, the processing system SYSf of the sixth embodiment can enjoy the same effects as those of the processing system SYSe of the fifth embodiment described above, and can set the focus position of the processing light EL to a desired position (for example, the modeling surface MS).

[0291] (7) Other Modifications

[0292] The processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) may also monitor its operating time. As an example, the operating time of the material supply device 1 may also be monitored. The life of the material supply pipe 191 may also be estimated based on the monitoring result of the operating time of the material supply device 1.

[0293] In the above description, the control device 7 causes the display 8 to display the information on the amount of the material. However, the information on the amount of the material may be output in the form of a sound output.

[0294] In the above description, the processing device 2 and the processing device 2f melt the modeling material M by irradiating the processing light EL to the modeling material M. However, the processing device 2 and the processing device 2f may also melt the modeling material M by irradiating an arbitrary energy beam to the modeling material M. In this case, the processing device 2 may also have a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or instead of the irradiation optical system 211. The arbitrary energy beam is not limited and includes a charged particle beam such as an electron beam and an ion beam or an electromagnetic wave.

[0295] In the above description, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) can form a three-dimensional structure ST by laser deposition welding. However, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) can also form a three-dimensional structure ST from the modeling material M by using other methods that can form a three-dimensional structure ST by irradiating the modeling material M with processing light EL (or any energy beam). As other methods, for example, powder bed fusion methods such as powder sintering stacking modeling method (SLS: Selective Laser Sintering), binder jetting method (Binder Jetting) or laser metal fusion method (LMF: Laser Metal Fusion) can be cited. Alternatively, the processing system SYS can also form a three-dimensional structure ST by using any method for additional processing that is different from the method that can form a three-dimensional structure ST by irradiating the modeling material M with processing light EL (or any energy beam).

[0296] In the above description, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) supplies the modeling material M from the material nozzle 212 toward the irradiation area EA of the irradiation optical system 211, thereby forming the three-dimensional structure ST. However, the processing system SYS may also form the three-dimensional structure ST by supplying the modeling material M from the material nozzle 212 without irradiating the processing light EL from the irradiation optical system 211. For example, the processing system SYS may also form the three-dimensional structure ST by blowing the modeling material M from the material nozzle 212 to the modeling surface MS, melting the modeling material M on the modeling surface MS, and solidifying the molten modeling material M. For example, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) may also form the three-dimensional structure ST by blowing a gas containing the modeling material M from the material nozzle 212 to the modeling surface MS at an ultra-high speed, melting the modeling material M on the modeling surface MS, and solidifying the molten modeling material M. For example, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) may also form a three-dimensional structure ST by blowing the heated modeling material M from the material nozzle 212 to the modeling surface MS, thereby melting the modeling material M on the modeling surface MS and solidifying the melted modeling material M. In this case, when the three-dimensional structure ST is formed without irradiating the processing light EL from the irradiation optical system 211, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) (particularly the processing head 21) may not have the irradiation optical system 211.

[0297] Alternatively, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) may perform removal processing that can remove at least a portion of an object by irradiating the processing light EL (or any energy beam) to the object such as the workpiece W, in addition to or in place of the additional processing. Alternatively, the processing system SYS (i.e., at least one of the processing systems SYSa to SYSf) may perform marking processing that can form a mark (e.g., text, numbers, or graphics) on at least a portion of the object by irradiating the processing light EL (or any energy beam) to the object such as the workpiece W, in addition to or in place of at least one of the additional processing and the removal processing. Even in this case, the above-mentioned effect can be enjoyed.

[0298] (8) Notes

[0299] The following additional remarks are further disclosed with respect to the embodiment described above.

[0300] [Note 1]

[0301] A processing system comprising:

[0302] a supply device which stores a material and supplies the stored material;

[0303] a processing device that performs a processing process of forming a molded object using the material supplied from the supply device; and

[0304] An output device outputs a warning message when the storage amount of the material in the supply device is less than a prescribed amount.

[0305] [Note 2]

[0306] The processing system according to Supplement 1, wherein:

[0307] The output device outputs the warning information before the processing device starts the processing.

[0308] [Note 3]

[0309] The processing system according to Supplement 1 or 2, wherein:

[0310] The output device outputs the warning information after the processing device starts the processing.

[0311] [Note 4]

[0312] A processing system according to any one of Supplements 1 to 3, wherein:

[0313] The processing system further includes a control device that controls the output device to determine whether the storage amount is less than the prescribed amount and output the warning information if it is determined that the storage amount is less than the prescribed amount.

[0314] [Note 5]

[0315] A processing system according to Supplement 4, wherein:

[0316] The control device determines whether the storage amount is less than the predetermined amount before the processing device starts the processing.

[0317] [Note 6]

[0318] The processing system according to Supplement 5, wherein:

[0319] The control device controls the processing device so as not to start the processing when it is determined that the storage amount is less than the predetermined amount before the processing device starts the processing.

[0320] [Note 7]

[0321] A processing system according to any one of Supplements 2 to 7, wherein:

[0322] When the control device determines that the storage amount is less than the predetermined amount before the processing device starts the processing, the control device controls the processing device so as to start the processing on the condition that the material is replenished to the supply device.

[0323] [Note 8]

[0324] A processing system according to any one of Supplements 4 to 7, wherein:

[0325] The control device determines whether the storage amount is less than the predetermined amount after the processing device starts the processing.

[0326] [Note 9]

[0327] The processing system according to Supplementary Note 8, wherein:

[0328] The control device controls the processing device to interrupt the processing when it is determined that the storage amount is less than the predetermined amount after the processing device starts the processing.

[0329] [Note 10]

[0330] The processing system according to Supplementary Note 9, wherein:

[0331] The control device controls the processing device so as to restart the interrupted processing on the condition that the material is replenished to the supply device.

[0332] [Note 11]

[0333] A processing system according to Supplement 9 or 10, wherein:

[0334] The control device controls the processing device so as to interrupt the processing after a certain time has passed since it was determined that the storage amount is less than the predetermined amount.

[0335] [Note 12]

[0336] The processing system according to any one of claims 9 to 11, wherein:

[0337] The control device controls the processing device so that the processing is not interrupted if the material is replenished to the supply device within a certain time from the time when it is determined that the storage amount is less than the specified amount, and the processing is interrupted if the material is not replenished to the supply device within a certain time from the time when it is determined that the storage amount is less than the specified amount.

[0338] [Note 13]

[0339] A processing system according to any one of Notes 4 to 12, wherein:

[0340] The processing system also has a detection device, which detects the storage amount.

[0341] The control device determines whether the storage amount is less than the prescribed amount based on the detection result of the detection device.

[0342] [Note 14]

[0343] A processing system according to any one of Supplements 4 to 13, wherein:

[0344] The control device sets the predetermined amount based on the shaping data that determines the content of the processing.

[0345] [Note 15]

[0346] A processing system according to Supplement 14, wherein:

[0347] The control device estimates the amount of the material required for the processing based on the molding data, and sets the estimated amount as the predetermined amount.

[0348] [Note 16]

[0349] A processing system according to any one of Notes 1 to 15, wherein:

[0350] The warning information includes information related to the shortage of the material stored in the supply device.

[0351] [Note 17]

[0352] A processing system according to any one of Notes 1 to 16, wherein:

[0353] The warning information includes information related to the storage amount.

[0354] [Note 18]

[0355] A processing system according to any one of Supplementary Notes 1 to 17, wherein:

[0356] The warning information includes information on the amount of the material required for the processing device to perform the processing.

[0357] [Note 19]

[0358] A processing system according to any one of Supplementary Notes 1 to 18, wherein:

[0359] The warning information includes information on the necessity of replenishing the material to the supply device.

[0360] [Note 20]

[0361] A processing system according to any one of Supplementary Notes 1 to 19, wherein:

[0362] The warning information includes information on the amount of the material that is desired to be replenished to the supply device.

[0363] [Note 21]

[0364] A processing system according to any one of Notes 1 to 20, wherein:

[0365] The warning information includes information for notifying the supply device that the material stored in the supply device can only form a part of the object.

[0366] [Note 22]

[0367] A processing system according to any one of Supplementary Notes 1 to 21, wherein:

[0368] The warning information includes information on a portion of the object that can be formed using the material stored in the supply device.

[0369] [Note 23]

[0370] A processing system according to any one of Notes 1 to 22, wherein:

[0371] The warning information includes information related to a portion of the object that cannot be formed by the material stored in the supply device.

[0372] [Note 24]

[0373] A processing system according to any one of Notes 1 to 23, wherein:

[0374] The warning information includes information for notifying that the processing cannot be started.

[0375] [Note 25]

[0376] A processing system according to any one of Notes 1 to 24, wherein:

[0377] The warning information includes information for allowing a user of the processing system to select whether to use the material stored in the supply device to perform the processing.

[0378] [Note 26]

[0379] A processing system according to any one of Notes 1 to 25, wherein:

[0380] When the storage amount is less than the predetermined amount, the processing device interrupts the processing at a stage where a part of the shaped object is formed.

[0381] [Note 27]

[0382] A processing system, wherein the processing system has:

[0383] a supply device which stores a material and supplies the stored material; and

[0384] a processing device for performing a processing process of forming a molded object using the material supplied from the supply device,

[0385] The processing device interrupts the processing at a stage where a part of the shaped object is formed when the storage amount of the material in the supply device is less than a predetermined amount.

[0386] [Note 28]

[0387] A processing system according to Appendix 26 or 27, wherein:

[0388] The processing device interrupts the processing at a stage where a portion of the shaped object that can be formed by the material stored in the supply device is formed.

[0389] [Note 29]

[0390] A processing system according to any one of Notes 26 to 28, wherein:

[0391] The shaped object is a structure composed of a plurality of layered structures stacked on top of each other.

[0392] The processing device interrupts the processing at a stage where formation of one of the plurality of layered structures is completed.

[0393] [Note 30]

[0394] A processing system according to any one of Notes 26 to 29, wherein:

[0395] The processing device forms the object by irradiating the surface of the object with an energy beam.

[0396] The processing device interrupts the processing at a stage where irradiation of the energy beam to a portion of the surface where characteristics with respect to heat transferred from the energy beam satisfy desired conditions is completed.

[0397] [Note 31]

[0398] A processing system according to Appendix 30, wherein:

[0399] The portion of the surface that satisfies the desired condition includes a portion where heat transferred from the energy beam is easily diffused, compared with the portion of the surface that does not satisfy the desired condition.

[0400] [Note 32]

[0401] A processing system according to any one of Notes 26 to 31, wherein:

[0402] The processing device restarts the processing on the condition that the material is replenished to the supply device after the processing is interrupted.

[0403] [Note 33]

[0404] A processing system according to any one of Notes 26 to 32, wherein:

[0405] The processing system also has a control device, which determines whether the storage amount of the material in the supply device is less than a specified amount and, if it is determined that the storage amount of the material in the supply device is less than the specified amount, controls the processing device so that the processing is interrupted at the stage where a part of the sculpted object is formed.

[0406] [Note 34]

[0407] A processing system according to Supplement 33, wherein:

[0408] The control device determines whether the storage amount of the material in the supply device is less than a predetermined amount before the processing device starts the processing.

[0409] [Note 35]

[0410] A processing system according to Appendix 33 or 34, wherein:

[0411] The control device determines whether the storage amount of the material in the supply device is less than a predetermined amount after the processing device starts the processing.

[0412] [Note 36]

[0413] A processing system according to any one of Notes 33 to 35, wherein:

[0414] The processing system further comprises a detection device, which detects the storage amount of the material based on the supply device.

[0415] The control device determines whether the storage amount of the material in the supply device is less than a predetermined amount based on the detection result of the detection device.

[0416] [Note 37]

[0417] A processing system according to any one of Notes 33 to 36, wherein:

[0418] The control device sets the predetermined amount based on the shaping data that determines the content of the processing.

[0419] [Note 38]

[0420] A processing system according to Supplement 37, wherein:

[0421] The control device estimates the amount of the material required for the processing based on the molding data, and sets the estimated amount as the predetermined amount.

[0422] [Note 39]

[0423] A processing system according to any one of Notes 33 to 38, wherein:

[0424] When it is determined that the storage amount is less than the specified amount, the control device controls the processing device so that (i) the processing is interrupted at the stage where the first part of the shaped object is formed according to the first data part of the modeling data, and (ii) the processing is restarted on the condition that the material is replenished to the supply device after the processing is interrupted to form the second part of the shaped object according to the second data part of the modeling data.

[0425] [Note 40]

[0426] A processing system according to any one of Notes 1 to 39, wherein:

[0427] The processing system also has a control device, which controls the processing device when the storage amount is less than the specified amount, so that (i) the processing is interrupted at the stage where the first part of the sculpted object is formed according to the first data part in the sculpting data that determines the content of the processing, and (ii) the processing is restarted on the condition that the material is replenished to the supply device after the processing is interrupted, so as to form the second part of the sculpted object according to the second data part in the sculpting data.

[0428] [Note 41]

[0429] A processing system according to any one of Notes 1 to 40, wherein:

[0430] The predetermined amount is the amount of the material required for the processing.

[0431] [Note 42]

[0432] A processing system according to any one of Notes 1 to 40, wherein:

[0433] The specified amount is the amount of the material required to complete the processing.

[0434] [Note 43]

[0435] A processing system according to any one of Notes 1 to 40, wherein:

[0436] The predetermined amount is a storage amount of the material that can maintain a state in which the supply device supplies the material to the processing device.

[0437] [Note 44]

[0438] A processing system according to any one of Notes 1 to 40, wherein:

[0439] The predetermined amount is a minimum storage amount of the material required to maintain a state in which the supply device supplies the material to the processing device.

[0440] [Note 45]

[0441] A processing system according to any one of Notes 1 to 44, wherein:

[0442] The storage space of the supply device storing the material is purged by a purge gas,

[0443] The material can be replenished to the storage space in a state in which the storage space is purged by the purge gas.

[0444] [Note 46]

[0445] A processing system, wherein the processing system has:

[0446] a supply device which stores a material and supplies the stored material;

[0447] a processing device for performing a processing process of forming a molded object using the material supplied from the supply device;

[0448] an output device capable of outputting information; and

[0449] A receiving device receives a control signal that controls the output device so as to output a warning message when the storage amount of the material in the supply device is less than a prescribed amount.

[0450] [Note 47]

[0451] A processing system, wherein the processing system has:

[0452] a supply device which stores a material and supplies the stored material;

[0453] a processing device for performing a processing process of forming a molded object using the material supplied from the supply device;

[0454] A receiving device receives a control signal for controlling the processing device when the storage amount of the material in the supply device is less than a predetermined amount, so that the processing is interrupted at the stage where a part of the shaped object is formed.

[0455] [Note 48]

[0456] A computer program is executed by a computer and controls a processing system, the processing system comprising: a supply device that stores a material and supplies the stored material; a processing device that performs a processing process of forming a molded object using the material supplied from the supply device; and an output device that can output information, wherein the computer program causes the computer to perform the following processing:

[0457] When the storage amount of the material in the supply device is less than a prescribed amount, the output device is controlled to output warning information.

[0458] [Note 49]

[0459] A computer program is executed by a computer and controls a processing system, the processing system comprising: a supply device that stores a material and supplies the stored material; and a processing device that performs a processing process of forming a molded object using the material supplied from the supply device, wherein the computer program causes the computer to perform the following processing:

[0460] When the storage amount of the material in the supply device is less than a predetermined amount, the processing device is controlled so as to interrupt the processing at a stage where a part of the shaped object is formed.

[0461] [Note 50]

[0462] A recording medium having the computer program according to Supplement 48 or 49 recorded thereon.

[0463] [Note 51]

[0464] A control device controls a processing system, the processing system comprising: a supply device that stores a material and supplies the stored material; a processing device that performs a processing to form a molded object using the material supplied from the supply device; and an output device that can output information, wherein:

[0465] When the storage amount of the material in the supply device is less than a predetermined amount, a process is performed to control the output device to output warning information.

[0466] [Note 52]

[0467] A control device controls a processing system, the processing system comprising: a supply device that stores a material and supplies the stored material; and a processing device that performs a processing to form a molded object using the material supplied from the supply device, wherein:

[0468] The control device has:

[0469] When the storage amount of the material in the supply device is less than a predetermined amount, a process is performed to control the processing device so as to interrupt the processing at a stage where a part of the shaped object is formed.

[0470] [Note 53]

[0471] A processing method, wherein the processing method comprises the following contents:

[0472] supplying the material stored in the supply device from the supply device;

[0473] performing a process of forming a molded object using the material supplied from the supply device; and

[0474] When the storage amount of the material in the supply device is less than a predetermined amount, a warning message is output.

[0475] [Note 54]

[0476] A processing method, wherein the processing method comprises the following contents:

[0477] supplying the material stored in the supply device from the supply device;

[0478] performing a process of forming a molded object using the material supplied from the supply device; and

[0479] When the storage amount of the material in the supply device is less than a predetermined amount, the processing is interrupted at a stage where a part of the shaped object is formed.

[0480] [Note 55]

[0481] A processing method, the processing method shapes a modeling object according to modeling data, wherein the processing method includes the following contents:

[0482] Storing materials in the storage department;

[0483] supplying said stored material;

[0484] Performing a processing to form a molded object using the supplied material; and

[0485] Information on the amount of the material obtained based on the molding data and the storage amount of the material stored in the storage unit is output.

[0486] [Note 56]

[0487] A processing method, the processing method shapes a modeling object according to modeling data, wherein the processing method includes the following contents:

[0488] Storing materials in the storage department;

[0489] supplying said stored material;

[0490] Performing a processing to form a molded object using the supplied material; and

[0491] Information indicating a relationship between an amount of the material required to form the object obtained using the formation data and a storage amount of the material is output.

[0492] [Note 57]

[0493] A processing method, the processing method shapes a modeling object according to modeling data, wherein the processing method includes the following contents:

[0494] Storing materials in the storage department;

[0495] supplying said stored material;

[0496] Performing a processing to form a molded object using the supplied material; and

[0497] An amount of the material required to perform the machining process using the modeling data is estimated.

[0498] [Note 58]

[0499] A computer program that causes a computer to execute the processing method described in any one of Supplement 53 to Supplement 57.

[0500] [Note 59]

[0501] A recording medium having the computer program according to Supplementary Note 58 recorded thereon.

[0502] [Note 60]

[0503] An output device is connected to a processing system, the processing system having a processing device and molding a molding according to molding data, the processing device having a storage unit for storing materials and a supply unit for supplying the stored materials and performing a processing to form a molding using the materials supplied from the supply unit, wherein:

[0504] The output device outputs information on the amount of the material based on the molding data and the storage amount of the material stored in the storage unit.

[0505] [Note 61]

[0506] An output device is connected to a processing system, the processing system having a processing device and molding a molding according to molding data, the processing device having a storage unit for storing materials and a supply unit for supplying the stored materials and performing a processing to form a molding using the materials supplied from the supply unit, wherein:

[0507] The output device outputs information indicating the relationship between the amount of the material required to shape the object and the storage amount of the material using the shaping data.

[0508] [Note 62]

[0509] A control device controls a processing system, the processing system having a processing device and an output device and molding a molding according to molding data, the processing device having a storage unit for storing materials and a supply unit for supplying the stored materials and performing processing to form a molding using the materials supplied from the supply unit, the output device outputting information related to the amount of the materials, wherein:

[0510] The control device performs control to output information on the amount of the material from the output device based on the molding data and the storage amount of the material stored in the storage unit.

[0511] [Note 63]

[0512] A control device controls a processing system, the processing system having a processing device and an output device and molding a molding according to molding data, the processing device having a storage unit for storing materials and a supply unit for supplying the stored materials and performing processing to form a molding using the materials supplied from the supply unit, the output device outputting information related to the amount of the materials, wherein:

[0513] The control device uses the molding data to control the output device to output information indicating the relationship between the amount of the material required to mold the molded object and the storage amount of the material.

[0514] [Note 64]

[0515] A computing device connected to a processing system, the processing system having a processing device and an output device and molding a molding according to molding data, the processing device having a storage unit for storing materials and a supply unit for supplying the stored materials and performing a processing to form a molding using the materials supplied from the supply unit, the output device outputting information related to the amount of the materials, wherein:

[0516] A calculation is performed using the modeling data, the calculation estimating the amount of the material required to perform the machining process.

[0517] At least a portion of the structural elements of each of the above-mentioned embodiments can be appropriately combined with at least another portion of the structural elements of each of the above-mentioned embodiments. It is also possible not to use a portion of the structural elements of each of the above-mentioned embodiments. In addition, within the scope permitted by law, all public gazettes and U.S. patents cited in the above-mentioned embodiments are cited as part of the description of this article.

[0518] The present invention is not limited to the above-mentioned embodiments, and can be appropriately modified without violating the main purpose or idea of ​​the invention read from the claims and the entire specification. The processing system, processing method, computer program, recording medium, receiving device, control device, output device and computing device accompanying such changes are also included in the technical scope of the present invention.

[0519] Description of symbols

[0520] SYS: processing system; 1: material supply device; 11: hopper; 12: holding component; 13: transport component;

[0521] 14: driving device; 15: material delivery component; 16: housing; 19: weight measuring device; 2: processing device;

[0522] 21: processing head; 211: irradiation optical system; 212: material nozzle; 22: head drive system; 31: workbench;

[0523] 7: control device; 8: display; W: workpiece; M: modeling material; SL: structural layer; MS: modeling surface;

[0524] EA: irradiation area; MA: supply area; MP: melt pool; EL: processing light.

Claims

1. A processing system for shaping a shaped object, wherein: The processing system has: a material supply device including a storage portion for storing a material and a supply portion for supplying the material from the storage portion; a processing device that performs a processing operation to form a modeled object using the material; and a control device that controls the supply unit and the processing device, The processing system further includes a measuring device, which performs measurement on the material supply device to obtain information related to the supply of the material. The control device stops the processing operation based on the information related to the supply of the material.

2. The processing system according to claim 1, wherein: The measuring device measures the weight of the storage portion as information related to the storage amount of the material, The control device stops the processing operation according to the information related to the supply of the material determined based on the information related to the storage amount.

3. The processing system according to claim 2, wherein: The control device estimates the amount of the material required to form the object based on the molding data, and stops the processing operation according to the information related to the supply of the material based on the information related to the estimated amount and the information related to the storage amount.

4. The processing system according to any one of claims 1 to 3, wherein: The processing system further includes a moving device for moving the supply position of the material. The control device controls the moving device based on the information related to the supply of the material.

5. The processing system according to any one of claims 1 to 3, wherein: The measuring device measures the pressure inside the material supply device that supplies the material by pressurizing the material with gas as information related to the storage amount of the material. The control device stops the processing operation according to the information related to the supply of the material determined based on the information related to the storage amount of the material.

6. The processing system according to claim 5, wherein: The control device determines that the material is clogged and that a supply abnormality of the material has occurred, when it is determined based on information related to the storage amount of the material that the pressure is equal to or higher than a first threshold value.

7. The processing system according to claim 5, wherein: When the control device determines that the pressure is equal to or lower than a second threshold value based on information related to the storage amount of the material, the control device determines that the material cannot be pressure-fed by the gas and that a supply abnormality of the material has occurred.

8. The processing system according to any one of claims 5 to 7, wherein: The processing system further includes a moving device for moving the supply position of the material. The control device controls the moving device based on information related to the storage amount of the material.

9. The processing system according to any one of claims 1 to 8, wherein: The control device controls at least one of a display and a speaker to report the state of the supply unit to a user.

10. A control method for a processing system, wherein the processing system forms a shaped object, the processing system comprising: a material supply device having a storage portion for storing a material and a supply portion for supplying the material from the storage portion; and a processing device, which performs a processing operation to form a shaped object using the material, wherein: In the control method of the machining system, a result of measurement performed in the material supply device, that is, information related to material supply obtained is obtained, and the machining device is controlled to stop the machining operation based on the information related to material supply.

11. The control method of a processing system according to claim 10, wherein: The information on the storage amount of the material is a result of measuring the weight of the storage portion.

12. The control method of a processing system according to claim 11, wherein: The amount of the material required to form the object is estimated based on the input molding data, and the machining device is controlled to stop the machining operation based on the information related to the estimated amount and the information related to the storage amount.

13. The control method of a processing system according to any one of claims 10 to 12, wherein: Based on the information related to the supply of the material, the moving device is controlled so as to move the supply position of the material.

14. The control method of a processing system according to any one of claims 10 to 13, wherein: The information on the storage amount of the material is a result of measuring the pressure inside the material supply device that supplies the material by pressurizing the material with gas.

15. The control method of a processing system according to claim 14, wherein: When it is determined that the pressure is equal to or higher than the first threshold value based on the information on the storage amount of the material, it is determined that the material is clogged and that a supply abnormality of the material has occurred.

16. The control method of a processing system according to claim 14, wherein: When it is determined based on the information on the storage amount of the material that the pressure is equal to or lower than the second threshold value, it is determined that the material cannot be pressure-fed by the gas and that a supply abnormality of the material has occurred.

17. The control method of a processing system according to any one of claims 14 to 16, wherein: The moving device that moves the supply position of the material is controlled based on information related to the storage amount of the material.

18. The control method of a processing system according to any one of claims 10 to 17, wherein: At least one of a display and a speaker is controlled to report the state of the supply unit to a user.

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