Die assembly of sealing ring for semiconductor equipment

Abstract

The invention discloses a die assembly of a sealing ring for semiconductor equipment. The die assembly comprises an upper die assembly and an upper die base with the top face provided with an upper cavity; the lower die assembly comprises a lower die base with a lower cavity formed in the bottom face. The driving assembly is used for driving the upper die holder and the lower die holder to be assembled and disassembled; in the mold closing state, the upper mold base and the lower mold set are combined to form an injection mold, the injection mold is provided with a closed-loop-shaped injection molding cavity, the injection mold is provided with a glue injection runner and an exhaust runner which are distributed in the circumferential direction of the injection molding cavity at intervals, and the injection mold is further provided with a negative pressure runner communicating between the injection molding cavity and the negative pressure runner. According to the mold assembly of the sealing ring for the semiconductor equipment, the multiple glue injection runners and the multiple exhaust runners are distributed in the circumferential direction of the injection molding cavity at intervals, so that in the injection molding process, air in the injection molding cavity can be exhausted from multiple positions, and a rubber material is injected into the injection molding cavity from multiple positions; the filling degree and the filling uniformity of the rubber material in the injection molding cavity are ensured, so that the forming precision and the forming quality of a final product are improved.

Description

Technical Field

[0001] The invention relates to the technical field of rubber injection molding, in particular to a mold assembly of a sealing ring for semiconductor equipment. Background Art

[0002] Rubber sealing rings play a vital role in semiconductor equipment. They isolate external factors such as dust, moisture and corrosive gases, and have sealing and protective functions such as dustproof, waterproof and anti-oxidation, which helps to increase the service life of the equipment.

[0003] Usually, rubber sealing rings are made by injection molding (also known as injection molding, injection molding), the main principle of which is to inject the rubber into the mold cavity by an injection machine, with high output value and easy automated production. For example, in the prior art, Chinese patent documents with announcement numbers CN215750460U, CN219405231U, CN213055819U, CN206416456U, and CN113290765B disclose a variety of rubber injection molding molds, which are provided with injection holes and negative pressure holes connected to the injection cavity on the mold. During production, the negative pressure hole is connected to the negative pressure source for exhaust, and the rubber material is injected into the injection hole at the same time, so that the rubber material is injected into the cavity to obtain the desired product.

[0004] Although the above-mentioned mold can be injection molded to form rubber sealing rings of different shapes, when the cross-sectional size of the rubber sealing ring is much smaller than the total length of the rubber sealing ring, the rubber compound has a certain viscosity during the injection molding process, which makes it difficult for the rubber compound to fill the entire cavity, affecting the molding accuracy of the product, especially at the corner position. Due to the viscosity of the rubber material, it will be affected by resistance when flowing, and it is difficult to fill the corner of the cavity. When the corner position is far away from the suction position and the injection position, the fluidity of the rubber is greatly reduced, which further affects the filling degree and the uniformity of the distribution of the rubber compound, and reduces the accuracy and quality of the final rubber sealing ring product.

[0005] Therefore, it is necessary to improve the rubber seal ring injection production mold of the prior art. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects in the prior art and provide a mold assembly for a sealing ring for semiconductor equipment that increases the filling degree and distribution uniformity of the rubber material in the cavity and ensures the molding accuracy and quality of the product.

[0007] In order to achieve the above technical effects, the technical solution of the present invention is: a mold assembly for a sealing ring for semiconductor equipment, comprising: An upper die assembly, the upper die assembly comprising a horizontal upper die base, the top surface of the upper die base being provided with an upper cavity; A lower die assembly, the lower die assembly comprising a lower die base horizontally arranged above the lower die base, the bottom surface of the lower die base being provided with a lower cavity; A driving assembly, wherein the driving assembly drives the upper mold base and the lower mold base to perform mold closing and mold separation; In the mold separation state, the upper mold base and the lower mold base are spaced apart; In the mold closing state, the upper mold base and the lower mold assembly are combined to form an injection mold, and the injection mold has a closed-loop injection cavity composed of the upper cavity and the lower cavity. The injection mold is provided with at least two injection channels and at least two exhaust channels that are spaced apart in sequence along the circumference of the injection cavity, and the two ends of the injection channels extend to the outer surface of the injection mold and the injection cavity respectively. The injection mold is also provided with a negative pressure channel, one end of the exhaust channel is connected to the injection cavity, and the other end is connected to the negative pressure channel, and the negative pressure channel extends to the outer surface of the injection mold away from the end of the exhaust channel.

[0008] Preferably, in order to increase the filling degree of the rubber compound in the cavity and improve the molding quality of the product, the connecting position between the injection channel and the injection cavity is the injection position, and the connecting position between the exhaust channel and the injection cavity is the exhaust position. Along the circumference of the injection cavity, the exhaust position between adjacent injection positions is adjacent to the center position of the adjacent injection positions, and the injection position between adjacent exhaust positions is adjacent to the center position of the adjacent exhaust position.

[0009] Preferably, in order to further increase the filling degree of the rubber compound and improve product quality, the injection position and / or the exhaust position coincides with or is closely adjacent to a corner position of the injection cavity.

[0010] Preferably, in order to simplify the structure and ensure the sealing performance, the cross-sectional size of the exhaust flow channel is reduced to reduce the rubber compound entering the exhaust flow channel, and the exhaust flow channel is arranged on the upper mold base or the lower mold base.

[0011] Preferably, in order to facilitate smooth exhaust, the exhaust flow channel is arranged on the lower mold base, and the exhaust flow channel includes an exhaust groove, an exhaust concentration depression and an exhaust channel which are sequentially connected and formed on the parting surface of the lower mold base, the exhaust groove and the exhaust channel are respectively connected to the lower mold cavity and the negative pressure flow channel, and the cross-sectional size of the exhaust groove is smaller than the cross-sectional size of the lower mold cavity.

[0012] Preferably, in order to avoid poor exhaust due to blockage, at least two exhaust grooves are provided and are arranged adjacent to each other.

[0013] Preferably, in order to further improve the product molding accuracy, the injection mold also has a plurality of suction units distributed along the circumference of the injection cavity, the suction unit includes a suction channel connected between the injection cavity and the negative pressure channel, the connecting position of the suction channel and the injection cavity is the suction position, the suction position is far away from the glue injection position and is located on both sides of the injection cavity respectively with the exhaust position, the suction position coincides with or is adjacent to the corner position, and the suction channel and the exhaust channel cooperate with each other to increase the glue filling degree at the corner position.

[0014] Preferably, in order to reduce the rubber compound entering the suction channel during the injection molding process and improve the product molding accuracy, the suction channel includes a suction groove connected to the lower cavity and arranged on the parting surface of the lower mold base, the cross-sectional dimension of the suction groove is smaller than the cross-sectional dimension of the exhaust groove, and the extension trajectory of the suction groove is a broken line shape or a corrugated shape.

[0015] Preferably, in order to facilitate the adjustment of the resistance of the rubber compound entering the suction channel during injection molding, a suction blind hole extending along the thickness direction of the lower mold base is provided on the parting surface of the lower mold base, and the top and bottom ends of the suction blind hole are connected to the suction groove and the negative pressure channel, and an adjustment rod coaxial with the suction blind hole is threadedly connected to the injection mold, and the adjustment rod includes an adjustment section, and a spiral convex strip is provided on the circumferential outer edge of the adjustment section, and the suction channel also includes a spiral channel formed by the circumferential inner wall of the suction blind hole, the circumferential outer edge of the adjustment section and the convex strip.

[0016] Preferably, in order to facilitate cleaning of the lower die base, the lower die base includes a lower die base and a lower die top seat detachably disposed on the lower die base, and the negative pressure flow channel is formed by enclosing the lower die base and the lower die top seat.

[0017] In summary, compared with the prior art, the mold assembly of the sealing ring for semiconductor equipment of the present invention has multiple injection channels and multiple exhaust channels distributed at intervals along the circumference of the injection cavity, so that during the injection molding process, the air in the injection molding cavity can be discharged from multiple locations, and the rubber compound can be injected into the injection molding cavity from multiple locations, thereby ensuring the filling degree and filling uniformity of the rubber compound in the injection molding cavity, thereby improving the molding accuracy and quality of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the first embodiment; Figure 2 is a schematic diagram of the connection structure of the frame and the drive assembly of the first embodiment; Figure 3 is a schematic structural diagram of the lower mold assembly of the first embodiment; Figure 4 yes Figure 3 Explosion diagram of Figure 5 is a perspective structural diagram of the lower mold base of the first embodiment; Figure 6 is a schematic structural diagram of an upper mold assembly in accordance with a first embodiment; Figure 7 is a cross-sectional structural diagram of the upper die base and the lower die base in the first embodiment of the mold; Figure 8 yes Figure 7 A magnified view of part A; Fig. 9 is a cross-sectional structural diagram of the first embodiment after the upper mold base and the lower mold base are molded together from another perspective; Fig.10 yes Fig. 9 A magnified view of part B; Fig.11 is a top view of the lower die base of the second embodiment; Fig.12 is a perspective structural diagram of the lower mold base of the second embodiment; Fig.13 is a schematic structural diagram of the lower die base of the third embodiment; Fig.14 yes Fig.13 Explosion diagram of Fig.15 2 is a schematic diagram of the structure of the fourth embodiment after the upper mold base and the lower mold base are molded together; Fig.16 yes Fig.15 The cross-sectional structure diagram of Fig.17 yes Fig.16 Enlarged view of part C; In the figure: 1. upper mold assembly; 11. upper mold base; 111. upper mold cavity; 112. guide hole; 12. glue injection tube; 13. adjusting rod; 131. threaded section; 132. adjusting section; 133. convex strip; 134. convex cap; 135. rotary plate; 136. sealing plate; 14. scale plate; 15. adjusting hole; 151. threaded hole; 152. docking hole; 2. lower mold assembly; 21. lower mold base; 211. lower mold cavity; 212. negative pressure flow channel; 2121. negative pressure through hole; 213. exhaust groove; 214. exhaust concentration depression; 215. exhaust channel; 216. suction groove; 2161. suction concentration depression; 2162. suction connecting groove; 217. suction blind hole; 2171. spiral flow channel; 218. Slide groove; 219. Sealing groove; 22. Guide column; 23. Sealing frame; 24. Sealing plug; 25. Lower mold base; 26. Lower mold top seat; 27. Bolt; 28. Nut; 3. Drive assembly; 31. Fixing frame; 32. Lifting cylinder; 4. Injection mold; 41. Injection cavity; 42. Glue injection channel; 421. Glue injection through hole; 422. Glue injection blind hole; 423. Upper glue injection groove; 424. Lower glue injection groove; 43. Exhaust channel; 44. Suction channel; 5. Frame; 51. Base; 52. Slide rail; 53. Positioning assembly; 531. Positioning protrusion; 532. Rotating seat; 533. Positioning strip; 534. Handle. DETAILED DESCRIPTION

[0019] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0020] First embodiment

[0021] like Figure 1-Figure 10 As shown, the mold assembly of the sealing ring for semiconductor equipment according to the first embodiment of the present invention comprises: An upper die assembly 1, the upper die assembly 1 comprises a horizontal upper die base 11, and an upper die cavity 111 is arranged on the top surface of the upper die base 11; The lower mold assembly 2 includes a lower mold base 21 horizontally arranged above the lower mold base 21, and a lower mold cavity 211 is arranged on the bottom surface of the lower mold base 21; The driving component 3 drives the upper mold base 11 and the lower mold base 21 to close and separate the molds; In the mold separation state, the upper mold base 11 and the lower mold base 21 are spaced apart; In the mold closing state, the upper mold base 11 and the lower mold assembly are combined to form an injection mold 4, which has a closed-loop injection cavity 41 composed of an upper cavity 111 and a lower cavity 211. The injection mold 4 is provided with at least two glue injection channels 42 and at least two exhaust channels 43 that are spaced apart in sequence along the circumference of the injection cavity 41. The two ends of the glue injection channel 42 extend to the outer surface of the injection mold 4 and the injection cavity 41 respectively. The injection mold 4 is also provided with a negative pressure channel 212. One end of the exhaust channel 43 is connected to the injection cavity 41, and the other end is connected to the negative pressure channel 212. The end of the negative pressure channel 212 away from the exhaust channel 43 extends to the outer surface of the injection mold 4.

[0022] In the mold assembly, the upper mold base 11 and the lower mold base 21 are controlled by the driving assembly 3 to close the mold to form an injection mold 4. The injection cavity 41 of the injection mold 4 is a closed loop. The circumference of the injection cavity 41 is much larger than the length and width of the cross section of the injection cavity 41. In order to ensure that the rubber compound can be evenly filled in the injection cavity 41 and improve the rubber filling degree during the injection molding process, the injection mold 4 is also provided with a plurality of injection channels 42 and a plurality of exhaust channels 43 distributed at intervals along the circumference of the injection cavity 41. In this embodiment, four injection channels 42 and four exhaust channels 43 are provided (of course, according to the overall circumference and cross-sectional dimensions of the injection cavity 41, the number of injection channels 42 and exhaust channels 43 can also be designed to be other multiples), and any one of the injection channels 42 is located between two adjacent exhaust channels 43, and correspondingly, any one of the exhaust channels 43 is located between two adjacent exhaust channels 43.

[0023] The glue injection channel 42 extends to the outer surface of the injection mold 4 at one end away from the injection cavity 41, which is convenient for injecting glue into the injection cavity 41 through the glue injection channel 42. Correspondingly, the exhaust channel 43 extends to the negative pressure channel 212 at one end away from the injection cavity 41. The negative pressure channel 212 extends to the outer surface of the injection mold 4 so as to be connected to a negative pressure device such as a negative pressure pump. During the injection molding process, the negative pressure device is started so that during injection molding, the air in the injection cavity 41 can be discharged to the outside through the exhaust channel 43 and the negative pressure channel 212 in turn, so that the rubber glue can be injected into the injection cavity 41.

[0024] Since the injection channel 42 and the exhaust channel 43 are distributed at intervals along the circumference of the injection cavity 41, during injection, the injected rubber compound can flow to both sides from the connecting position between the injection channel 42 and the injection cavity 41, and the coordinated gas is discharged from the exhaust channel 43, which is beneficial to improve the filling degree and distribution uniformity of the rubber compound in the injection cavity 41, thereby improving the product molding accuracy and quality.

[0025] In order to improve the product molding efficiency, the bottom surface of the upper mold base 11, that is, its parting surface, is provided with two lower cavities 111, and the top surface of the upper mold base 11, that is, its parting surface, is provided with two upper cavities 211, so that after the upper mold base 11 and the lower mold base 21 are combined to form the injection mold 4, the injection mold 4 has two injection cavities 41, which is convenient for one-time injection molding of two rubber sealing rings, thereby improving production efficiency.

[0026] The mold assembly of this embodiment also includes a frame 5, and the driving assembly 3 is arranged on the frame 5 to control the upper mold base 11 and the lower mold base 21 to close the mold. The frame 5 includes a horizontal base 51, and the driving assembly 3 includes two fixed frames 31 distributed along the length direction of the base 51. The fixed frame 31 is an inverted U shape, and both ends are fixed on the top of the base 51. Two lifting cylinders 32 distributed along the width direction of the base 51 are arranged on the fixed frame 31. The cylinder barrel of the lifting cylinder 32 is arranged downward in the vertical direction and fixed to the top of the fixed frame 31. The bottom end of the piston rod is fixedly connected to the upper mold base 11, and the bottom surface of the lower mold base 21 is in contact with the top surface of the base 51.

[0027] In order to facilitate the removal of products, the base 51 is also provided with two slide rails 52 distributed side by side along the width direction thereof, and the two slide rails 52 are located directly below the upper mold base 11, and the bottom surface of the lower mold base 21 is provided with two slide grooves 218 distributed side by side, and the two slide grooves 218 correspond one to one with the two slide rails 52 and slide in cooperation; the top surface of the lower mold base 21 is also provided with a closed-loop sealing groove 219, and the two lower cavities 211 are both located on the inner side of the sealing groove 219, and an elastic sealing frame 23 is provided in the sealing groove 219, and the sealing frame 23 is preferably made of rubber or silicone, and the bottom of the sealing frame 23 is in contact with the inner bottom wall of the sealing groove 219, and the top protrudes from the notch of the sealing groove 219.

[0028] After adopting the above structure, the lower mold base 21 is slid through the sliding matching slide groove 218 and the slide rail 52, so that the lower mold base 21 moves to the bottom of the upper mold base 11, and then the lifting cylinder 32 is started to drive the upper mold base 11 to move downward, so that the upper mold base 11 and the lower mold base 21 are combined to form the injection mold 4. At this time, the bottom surface of the upper mold base 11 is in contact with the top surface of the lower mold base 21, and the elastic sealing frame 23 is used to ensure the sealing of the upper mold base 11 and the lower mold base 21, which is convenient for suction and improves the molding accuracy of the injection cavity 41, thereby ensuring the injection accuracy.

[0029] After the rubber is molded in the injection cavity 41, the lifting cylinder 32 drives the upper mold base 11 to move upward and separate from the lower mold base 21, so that after the upper mold base 11 and the lower mold base 21 are separated, the molded rubber sealing ring is located in the lower cavity 211. At this time, after the lower mold base 21 is slid to the side and lower part of the upper mold base 11 through the sliding groove 218 and the slide rail 52, the rubber sealing ring product is located at the side and lower part of the upper mold base 11, and the molded product can be easily taken out.

[0030] The base 51 is also provided with a positioning assembly 53, which is used to position the lower mold base 21 directly below the upper mold base 11, so that the upper mold base 11 and the lower mold base 21 can be accurately molded to improve product accuracy.

[0031] Specifically, the upper mold base 11 and the lower mold base 21 are both flat rectangular parallelepipeds, and their length directions are parallel to the width direction of the base 51, and their width directions are parallel to the length direction of the base 51. The positioning assembly 53 includes two L-shaped positioning protrusions 531 arranged at one end of the top surface of the base 51, and the positioning protrusions 531 coincide with the end of the sliding path of the lower mold base 21.

[0032] After adopting the above structure, the lower mold base 21 is slid along the slide rail 52 until the lower mold base 21 abuts against the positioning protrusion 531. At this time, the lower mold base 21 is located directly below the upper mold base 11, and the lifting cylinder 32 drives the upper mold base 11 to move downward, so that the upper mold base 11 and the lower mold base 21 can be accurately molded.

[0033] Furthermore, the positioning assembly 53 also includes a rotating seat 532 corresponding to the two positioning protrusions 531. The rotating seat 532 is fixed on the top of the base 51. A positioning bar 533 is arranged on the rotating seat 532. The rotation axis of the positioning bar 533 is parallel to the width direction of the base 51. The positioning bar 533 is away from one end of the rotating seat 532, and its side facing away from the positioning protrusion 531 is integrally connected with a handle 534. The distance between the positioning bar 533 and the positioning protrusion 531 along the length direction of the base 51 is consistent with the width dimension of the lower mold base 21, and the length dimension of the lower mold base 21 is within the spacing range of the two positioning bars 533.

[0034] After adopting the above structure, in the initial state, the lower die base 21 is located below the upper die base 11, and the two positioning bars 533 are rotated in the direction away from each other so that the spacing between the two positioning bars 533 is greater than the length of the lower die base 21. After the lower die base 21 is slid by the slide rail 52 until it abuts against the positioning protrusion 531, the two positioning bars 533 are rotated in the direction close to each other so that the spacing between the two positioning bars 533 is less than the length of the lower die base 21, and the positioning bars 533 abut against the lower die base 21 facing away from the positioning protrusion 531. One side of the protrusion 531 positions the lower mold base 21 in the width direction of the lower mold base 21 through the positioning strip 533 and the positioning protrusion 531, and the L-shaped structural design of the slide rail 52, the slide groove 218, and the positioning protrusion 531 can position the lower mold base 21 in the length direction of the lower mold base 21, thereby preventing the lower mold base 21 from shifting in the horizontal direction, further ensuring the precise docking between the upper mold base 11 and the lower mold base 21, improving the molding accuracy of the injection cavity 41, and further facilitating improving the molding quality of the rubber sealing ring.

[0035] In order to further improve the mold docking accuracy of the upper mold base 11 and the lower mold base 21 and improve product quality, the four corners of the lower mold base 21 are provided with upwardly extending guide columns 22, and the four corners of the upper mold base 11 are provided with guide holes 112 extending along the vertical direction. The guide columns 22 are adapted to the guide holes 112, so that after the upper mold base 11 and the lower mold base 21 are molded, the sealing sleeve of the guide hole 112 is arranged on the top outer side of the guide column 22 to achieve precise docking of the upper cavity 111 and the lower cavity 211, thereby ensuring the accuracy of the injection cavity 41 formed by the combination of the two, thereby improving the molding quality of the rubber.

[0036] like Figure 7 and Figure 8 As shown, in this embodiment, the glue injection channel 42 includes a glue injection through hole 421, a glue injection blind hole 422, an upper glue injection groove 423 and a lower glue injection groove 424, wherein the glue injection through hole 421 and the upper glue injection groove 423 are both arranged on the upper mold base 11, and the glue injection blind hole 422 and the lower glue injection groove 424 are both arranged on the lower mold base 21.

[0037] To be more specific, the glue injection blind hole 422 is a stepped hole, extending along the thickness direction of the upper mold base 11, and its top and bottom ends extend to the top and bottom surfaces of the upper mold base 11 respectively, and the top surface size is larger than the bottom surface size, and the upper glue injection groove 424 is arranged on the bottom surface of the upper mold base 11, and its two ends are respectively connected with the bottom end of the glue injection blind hole 422 and the upper cavity 111; the glue injection blind hole 422 and the lower glue injection groove 424 are both arranged on the top surface of the lower mold base 21, the depth of the glue injection blind hole 422 is greater than the groove depth of the lower glue injection groove 424, and the lower glue injection groove 424 is connected between the glue injection blind hole 422 and the lower cavity 211. In the mold closing state, the glue injection through hole 421 and the glue injection blind hole 422 are coaxial and connected, the upper glue injection groove 423 and the lower glue injection groove 424 are arranged opposite each other, and the projections of the two on the horizontal plane coincide with each other. In this way, when injecting glue, the rubber material enters the glue injection through hole 421, then enters the glue injection blind hole 422, passes through the channel formed by the upper glue injection groove 423 and the lower glue injection groove 424, and enters the injection cavity 41 formed by the upper cavity 111 and the lower cavity 211 for molding.

[0038] In order to facilitate the simultaneous injection of glue into multiple glue injection holes 421, five glue injection tubes 12 are fixedly arranged on the top of the upper mold base 11. The five glue injection tubes 12 are a first glue injection tube 12 and four second glue injection tubes 12. The four second glue injection tubes 12 are U-shaped, the first glue injection tube 12 is I-shaped, the bottom of the second glue injection tube 12 is fixedly connected to the glue injection hole 421, and the middle part is connected to the end of the first glue injection tube 12. A vertical tube extending upward and connected to the first glue injection tube 12 is provided in the middle part. In this way, the rubber material is injected through the vertical tube. After passing through the four ends of the first glue injection tube 12, the rubber material enters the four second glue injection tubes 12, and finally enters the eight glue injection channels 42 at the same time. Each injection cavity 41 has four inlets for the rubber material to flow in.

[0039] In order to facilitate exhaust, the negative pressure flow channel 212 in this embodiment is as follows Figure 3-Figure 5 As shown, the negative pressure flow channel 212 includes a plurality of negative pressure through holes 2121 arranged on the lower mold base 21, wherein some of the negative pressure through holes 2121 extend in a length direction parallel to the lower mold base 21, and the remaining negative pressure through holes 2121 extend in a width direction parallel to the lower mold base 21, and the two are vertically connected to each other, one end of the exhaust flow channel 43 is connected to the injection cavity 41, and the other end is connected to the negative pressure through hole 2121, and a plurality of sealing plugs 24 are further arranged on the circumferential side wall of the lower mold base 21, and the number of the sealing plugs 24 is the number of the negative pressure The sealing plug 24 is sealed and connected to the end of the negative pressure through hole 2121, which is twice the number of the through holes 2121 minus one. Among the multiple negative pressure through holes 2121, only one end of one of the negative pressure through holes 2121 is exposed, and the ends of all the remaining negative pressure through holes 2121 are sealed. The exposed end of the negative pressure through hole 2121 is connected to a negative pressure pump, so that exhaust can be carried out from the injection cavity 41 through the multiple interconnected negative pressure through holes 2121 and the exhaust channel 43, so that the rubber material can be injected into the injection cavity 41.

[0040] A further improvement is that the connecting position between the glue injection channel 42 and the injection cavity 41 is the glue injection position, and the connecting position between the exhaust channel 43 and the injection cavity 41 is the exhaust position. Along the circumference of the injection cavity 41, the exhaust position between adjacent glue injection positions is adjacent to the center position of the adjacent glue injection positions, and the glue injection position between adjacent exhaust positions is adjacent to the center position of the adjacent exhaust position.

[0041] That is, in the present embodiment, the injection position is the connecting position of the channel formed by the combination of the upper injection groove 423 and the lower injection groove 423 and the injection cavity 41, and the exhaust position is the connecting position of the exhaust flow channel 43 and the injection cavity 41. Along the circumference of the injection cavity 41, the center position between any two adjacent injection positions is adjacent to the exhaust position between the above-mentioned two injection positions, and the center position between any two adjacent exhaust positions is adjacent to the injection position between the above-mentioned two exhaust positions. In this way, the uniformity of exhaust and injection is ensured, so that during the injection molding production process, after the gas can be discharged from the injection cavity 41, the rubber compound can be evenly injected into the injection cavity 41, thereby improving the molding accuracy of the product.

[0042] A further improvement is that the glue injection position and / or the exhaust position coincides with or is closely adjacent to a corner position of the injection cavity 41 .

[0043] Specifically, the injection position and the exhaust position are both adjacent to the corner position of the injection cavity 41. With the above design, the air at the corner of the injection cavity 41 can be discharged smoothly through the exhaust channel 43, and the injection position is adjacent to the corner position, which is conducive to increasing the filling degree of the rubber at the corner of the injection cavity 41, thereby improving the product quality.

[0044] A further improvement is that the exhaust flow channel 43 is arranged on the upper die base 11 or the lower die base 21 .

[0045] After adopting the above design, the exhaust channel 43 is only set on the upper mold base 11 or the lower mold base 21. Compared with the method of enclosing the exhaust channel 43 by the upper mold base 11 and the lower mold base 21, the overall structure of the mold assembly is simplified, which is beneficial to ensure the sealing of the lower mold base 21 and the upper mold base 11 after the mold is closed, and is beneficial to reducing the rubber compound entering the exhaust channel 43 during injection molding, thereby improving the product molding accuracy and thus improving the product quality.

[0046] Specifically, the exhaust channel 43 is arranged on the lower mold base 21, and the exhaust channel 43 includes an exhaust groove 213, an exhaust concentration recess 214 and an exhaust channel 215 which are connected in sequence and formed on the parting surface of the lower mold base 21. The exhaust groove 213 and the exhaust channel 215 are connected to the lower cavity 211 and the negative pressure channel 212 respectively. The cross-sectional size of the exhaust groove 213 is smaller than the cross-sectional size of the lower cavity 211; at least two exhaust grooves 213 are arranged and are arranged closely together.

[0047] After adopting the above structure, the exhaust flow channel 43 has a plurality of slender exhaust grooves 213 connected to the lower mold cavity 211, and the exhaust groove 213 has exhaust concentration recesses 214 at both ends of the end away from the lower mold cavity 211. One end of the exhaust channel 215 is connected to the exhaust concentration recess 214, and the other end is connected to the negative pressure through hole 2121. By providing a plurality of exhaust grooves 213, and designing the cross-sectional size of the exhaust groove 213 to be smaller than the size of the injection mold cavity 41, it is convenient to exhaust the air in the injection mold cavity 41 during injection molding. After passing through the exhaust groove 213, the exhaust concentration depression 214 and the exhaust channel 215 in sequence, the air enters the negative pressure through hole 2121 and is discharged from the end of the negative pressure through hole 2121 that has not been closed. The exhaust groove 213 is slender, which ensures the molding quality of the rubber compound in the injection cavity 41, and there are multiple exhaust grooves 213 to avoid clogging of the rubber compound and affecting the exhaust. The exhaust concentration depression 214 is conducive to the air discharged from multiple exhaust grooves 213 to be concentrated through the exhaust channel 215 and enter the negative pressure through hole 2121.

[0048] Second embodiment

[0049] like Fig.11 and Fig.12As shown, the mold assembly of the sealing ring for semiconductor equipment of the second embodiment of the present invention is based on the first embodiment, and the difference is that the injection mold 4 also has a plurality of suction units distributed along the circumference of the injection cavity 41, and the suction unit includes a suction channel 44 connected between the injection cavity 41 and the negative pressure channel 212, and the connection position between the suction channel 44 and the injection cavity 41 is the suction position, the suction position is far away from the glue injection position and is located on both sides of the injection cavity 41 respectively with the exhaust position, the suction position coincides with or is adjacent to the corner position, and the suction channel 44 and the exhaust channel 43 cooperate with each other to increase the glue filling degree in the corner position.

[0050] After adopting the above structure, during injection molding, the negative pressure pump is connected to the open end of the negative pressure through hole 2121 to evacuate air, so that a part of the air in the injection cavity 41 enters the negative pressure flow channel 212 through the exhaust flow channel 43 and is discharged from the negative pressure flow channel 212 to the outside, while the other part enters the negative pressure flow channel 212 through the suction flow channel 44 and is discharged from the negative pressure flow channel 212 to the outside. Since the suction position and the exhaust position are respectively located at the corner of the injection cavity 41 or on both sides near the corner position, that is, the suction position and the exhaust position are respectively located at the corner of the injection cavity 41 or on both sides near the corner position, the suction position and the exhaust position are respectively located at the corner of the injection cavity 41 or on both sides near the corner position, and ... The air positions are one of which is located on the inner wall of the injection cavity 41, and the other is located on the outer wall of the injection cavity 41, so that the air is discharged in two ways and then enters the negative pressure flow channel 212, which helps the rubber compound to fill the corner position of the injection cavity 41. Specifically, by pumping air from both sides, the flow resistance of the rubber compound due to its own viscosity is overcome, thereby promoting the fluidity of the rubber and increasing the filling degree of the rubber compound at the corner of the injection cavity 41, thereby improving the molding quality of the product.

[0051] A further improvement is that the suction channel 44 includes a suction groove 216 connected to the lower cavity 211 and arranged on the parting surface of the lower mold base 21, the cross-sectional dimension of the suction groove 216 is smaller than the cross-sectional dimension of the exhaust groove 213, and the extension trajectory of the suction groove 216 is a broken line shape or a corrugated shape.

[0052] Specifically, the suction channel 44 includes a suction groove 216, a suction concentration recess 2161 and a suction connecting groove 2162 which are connected in sequence and are all arranged on the parting surface of the lower mold base 21. The parting surface of the lower mold base 21 is provided with a suction blind hole 217 extending along its own thickness direction. The suction groove 216 is connected to the lower cavity 211 and is a continuous broken line shape. The suction blind hole 217 extends along the thickness direction of the lower mold base 21, the top end is connected to the suction connecting groove 2162, and the bottom end is connected to the negative pressure through hole 2121. The width dimension of the suction concentration recess 2161 is greater than the sum of the width dimensions of the suction grooves 216 in the suction channel 44.

[0053] After adopting the above design, since the cross-sectional dimension of the suction groove 216 is smaller than the cross-sectional dimension of the exhaust groove 213, the resistance of air and rubber material passing through the suction groove 216 is greater than the resistance of air and rubber material passing through the exhaust groove 213, and the suction groove 216 is a continuous broken line shape, which can further increase the resistance of air and rubber material passing through the suction groove 216, so that after the negative pressure device such as an external negative pressure pump is started, the air and rubber material first enter the exhaust flow channel 43 and then enter the suction groove 216, so as to avoid that when the cross-sectional dimension of the suction groove 216 is too large, most of the rubber material enters the suction groove 216 during injection molding, and passes through The cross-sectional size of the suction groove 216 is reduced so that only a small part of the rubber can enter the suction channel 44. On the one hand, the filling degree of the rubber compound in the injection cavity 41 is ensured. On the other hand, after a small part of the rubber compound enters the suction groove 216 and is cured, it is convenient to cut off the excess material formed, thereby ensuring the product accuracy of the final rubber sealing ring. The suction grooves 216 are provided in plurality, thereby ensuring that air and rubber can always pass through some of the suction grooves 216 into the suction concentration depression 2161, thereby ensuring fluidity of the fluid and preventing the rubber compound from being blocked in the overly fine suction grooves 216, thereby affecting the flow performance.

[0054] Third embodiment

[0055] like Fig.13 and Fig.14 As shown, the mold assembly of the sealing ring for semiconductor equipment according to the third embodiment of the present invention is based on the second embodiment, with the difference that the lower mold seat 21 includes a lower mold base 25 and a lower mold top seat 26 detachably arranged on the lower mold base 25, and the negative pressure flow channel 212 is formed by the lower mold base 25 and the lower mold top seat 26.

[0056] Specifically, the top surface of the lower mold base 25 and the bottom surface of the lower mold top seat 26 are respectively provided with depressions with opposite notches and in a mesh shape. The depressions on the top surface of the lower mold base 25 and the depressions on the lower mold top seat 26 are combined to form a plurality of negative pressure through holes 2121 that are interconnected and partially extend along the length direction of the lower mold base 21 and the remaining part extends along the width direction of the lower mold base 21. The plurality of negative pressure through holes 2121 are combined to form a negative pressure flow channel 212; the slide groove 218 is provided on the bottom surface of the lower mold base 25, and the lower mold cavity 211, the negative pressure flow channel 212, the suction groove 216, the suction concentration depression 2161, the suction connecting groove 2162 and the suction blind hole 217 are all provided on the top surface of the lower mold top seat 26. The four corners of the lower mold base 25 and the four corners of the lower mold top seat 26 are detachably fixedly connected by four pairs of threaded bolts 27 and nuts 28, respectively.

[0057] The lower mold base 25 and the lower mold top seat 26 are quickly and detachably connected by threaded bolts 27 and nuts 28, so that after the mold assembly has been used for a period of time, the lower mold base 25 and the lower mold top seat 26 can be separated by disassembly, thereby cleaning the depression on the top surface of the lower mold base 25 and the depression on the lower mold top seat 26 to ensure that the negative pressure through hole 2121 formed after the two are combined again remains unobstructed to avoid blockage.

[0058] Fourth embodiment

[0059] like Figure 15-17 As shown, the mold assembly of the sealing ring for semiconductor equipment of the fourth embodiment of the present invention is based on the third embodiment, and the difference lies in that an adjustment rod 13 coaxial with the suction blind hole 217 is threadedly connected to the injection mold 4, and the adjustment rod 13 includes an adjustment section 132, and the circumferential outer edge of the adjustment section 132 is provided with a spiral convex strip 133, and the suction channel 44 also includes a spiral channel 2171 formed by the circumferential inner wall of the suction blind hole 217, the circumferential outer edge of the adjustment section 132 and the convex strip 133.

[0060] Specifically, the upper die seat 11 is threadedly connected to the adjusting rod 13 corresponding to the suction blind hole 217. The axial direction of the adjusting rod 13 is parallel to the thickness direction of the upper die seat 11, and in the mold closing state, the adjusting rod 13 is coaxial with the suction blind hole 217. The adjusting rod 13 includes a convex cap 134, a threaded section 131, a sealing disk 136 and an adjusting section 132 connected coaxially from top to bottom. The top of the convex cap 134 is integrally connected with a rotating plate 135. The outer diameters of the threaded section 131, the adjusting section 132, the sealing disk 136 and the convex cap 134 increase in sequence. The convex strip 133 spirals around the circumferential outer edge of the adjusting section 132 along a spiral trajectory. The axis of the spiral trajectory coincides with the axis of the threaded section 131. The upper die seat 11 is also provided with an adjusting hole 15 corresponding to the adjusting rod 13 and coaxial. The adjusting hole 15 includes a threaded hole 151 and a docking hole 151 connected coaxially. 2. The top end of the threaded hole 151 extends to the top surface of the upper die base 11, and the bottom end of the docking hole 152 extends to the bottom surface of the upper die base 11. The inner diameter of the threaded hole 151 is smaller than the inner diameter of the docking hole 152. The inner diameter of the docking hole 152 is consistent with the inner diameter of the suction blind hole 217. The threaded section 131 is threadedly connected to the inner side of the threaded hole 151. The circumferential outer edge of the sealing disk 136 is sealed with the circumferential inner wall of the docking hole 152. The outer wall of the convex strip 133 is sealed with the circumferential inner wall of the docking hole 152. The top ends of the adjusting section 132 and the convex strip 133 are both arranged in the docking hole 152, and the bottom ends extend to the bottom of the docking hole 152.

[0061] After adopting the above design, after the upper mold base 11 moves downward to close the mold with the lower mold base 21, the lower part of the convex strip 133 on the outer periphery of the adjusting section 132 and the lower part of the adjusting section 132 can extend into the suction blind hole 217, and the circumferential outer edge of the lower part of the convex strip 133 is sealed with the inner side wall of the suction blind hole 217, so that the circumferential outer edge of the adjusting section 132, the circumferential inner wall of the suction blind hole 217 and the convex strip 133 can enclose and form a spiral flow channel 2171, and the top of the spiral flow channel 2171 is connected to the suction connecting groove 2162, and the bottom end is connected to the bottom of the suction blind hole 217. By rotating the rotary plate 135, the axial position of the adjusting rod 13 is changed by using the threaded segment 131 and the inner wall of the threaded hole 151 connected by thread. Then, the convex strip 133 and the adjusting section 132 are changed. The insertion depth of the segment 132 adjusts the length of the spiral flow channel 2171. Specifically, when the adjusting rod 13 is rotated downward, the insertion depth of the convex strip 133 and the adjusting segment 132 increases, and the length of the spiral flow channel 2171 increases, thereby increasing the resistance of air entering the negative pressure flow channel 212 from the suction groove 216, and extending the time difference between the rubber compound entering the suction groove 216 and the rubber compound entering the exhaust groove 213. Conversely, when the adjusting rod 13 is rotated upward, the insertion depth of the convex strip 133 and the adjusting segment 132 decreases, and the length of the spiral flow channel 2171 decreases, thereby reducing the resistance of air entering the negative pressure flow channel 212 from the suction groove 216, and shortening the time difference between the rubber compound entering the suction groove 216 and the rubber compound entering the exhaust groove 213.

[0062] In this way, through the above structure, it is possible to accurately control the time difference between when the rubber compound flows in the injection cavity 41 and passes through the corner far away from the injection position during injection molding, when the rubber compound enters the suction groove 216 and when the rubber compound enters the exhaust groove 213, so as to ensure that after the vacuuming is completed, the excess part of the rubber compound enters the exhaust groove 213 and the suction groove 216 in turn according to a certain time difference, so that the rubber compound can fill the corner position of the injection cavity 41, ensure the filling degree, and further improve the molding accuracy and quality of the rubber sealing ring.

[0063] A further improvement is that a scale plate 14 corresponding to the adjustment rod 13 is also provided on the upper die seat 11, and scale lines distributed along the vertical direction are provided on the scale plate 14, and the scale lines are adjacent to the convex cap 134. With this design, the scale lines on the scale plate 14 facilitate production workers to determine and accurately control the axial position of the adjustment rod 13, and then accurately control the insertion depth of the adjustment section 132 and the convex strip 133 in the suction blind hole 217 after the upper die seat 11 and the lower die seat 21 are molded, so as to determine and accurately control the length of the spiral flow channel 2171, so as to adjust the time difference between when the rubber compound enters the suction groove 216 and when the rubber compound enters the exhaust groove 213 by changing the resistance of the gas passing through the spiral flow channel 2171.

[0064] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A mold assembly for a sealing ring for semiconductor equipment, characterized in that: include: An upper die assembly (1), the upper die assembly (1) comprising a horizontal upper die base (11), the top surface of the upper die base (11) being provided with an upper cavity (111); A lower die assembly (2), the lower die assembly (2) comprising a lower die base (21) arranged horizontally above the lower die base (21), the bottom surface of the lower die base (21) being provided with a lower cavity (211); A driving component (3), wherein the driving component (3) drives the upper mold base (11) and the lower mold base (21) to perform mold closing and mold separation; In the mold separation state, the upper mold base (11) and the lower mold base (21) are arranged at a distance; In a mold closing state, the upper mold base (11) and the lower mold assembly are combined to form an injection mold (4); the injection mold (4) has a closed-loop injection cavity (41) composed of the upper cavity (111) and the lower cavity (211); the injection mold (4) is provided with at least two injection channels (42) and at least two exhaust channels (43) which are sequentially spaced and distributed along the circumference of the injection cavity (41); the two ends of the injection channels (42) extend to the outer surface of the injection mold (4) and the injection cavity (41) respectively; the injection mold (4) is also provided with a negative pressure channel (212); one end of the exhaust channel (43) is connected to the injection cavity (41), and the other end is connected to the negative pressure channel (212); the end of the negative pressure channel (212) away from the exhaust channel (43) extends to the outer surface of the injection mold (4).

2. The mold assembly for a seal ring for semiconductor equipment according to claim 1, characterized in that: The connection position between the injection flow channel (42) and the injection cavity (41) is the injection position, the connection position between the exhaust flow channel (43) and the injection cavity (41) is the exhaust position, and along the circumference of the injection cavity (41), the exhaust position between adjacent injection positions is adjacent to the center position of the adjacent injection positions, and the injection position between adjacent exhaust positions is adjacent to the center position of the adjacent exhaust position.

3. The mold assembly for a seal ring for semiconductor equipment according to claim 2, characterized in that: The glue injection position and / or the exhaust position coincides with or is closely adjacent to a corner position of the injection cavity (41).

4. The mold assembly for a seal ring for semiconductor equipment according to claim 2, characterized in that: The exhaust flow channel (43) is arranged on the upper die base (11) or the lower die base (21).

5. The mold assembly for a seal ring for semiconductor equipment according to claim 4, characterized in that: The exhaust flow channel (43) is arranged on the lower mold base (21), and the exhaust flow channel (43) comprises an exhaust groove (213), an exhaust concentration depression (214) and an exhaust channel (215) which are sequentially connected and formed on the parting surface of the lower mold base (21), the exhaust groove (213) and the exhaust channel (215) are connected to the lower mold cavity (211) and the negative pressure flow channel (212) respectively, and the cross-sectional dimension of the exhaust groove (213) is smaller than the cross-sectional dimension of the lower mold cavity (211).

6. The mold assembly for a seal ring for semiconductor equipment according to claim 5, characterized in that: At least two exhaust grooves (213) are provided and are arranged adjacent to each other.

7. The mold assembly for a seal ring for semiconductor equipment according to claim 3, characterized in that: The injection mold (4) further comprises a plurality of suction units distributed along the circumference of the injection cavity (41), the suction units comprising a suction channel (44) connected between the injection cavity (41) and the negative pressure channel (212), the connection position between the suction channel (44) and the injection cavity (41) being a suction position, the suction position being away from the injection position and being located on both sides of the injection cavity (41) respectively with the exhaust position, the suction position being coincident with or adjacent to the corner position, the suction channel (44) and the exhaust channel (43) cooperating with each other to increase the filling degree of the rubber material in the corner position.

8. The mold assembly for a seal ring for semiconductor equipment according to claim 7, characterized in that: The suction flow channel (44) comprises a suction groove (216) which is connected to the lower mold cavity (211) and is arranged on the parting surface of the lower mold base (21); the cross-sectional dimension of the suction groove (216) is smaller than the cross-sectional dimension of the exhaust groove (213); and the extension trajectory of the suction groove (216) is in a broken line shape or a corrugated shape.

9. The mold assembly for a seal ring for semiconductor equipment according to claim 8, characterized in that: A suction blind hole (217) extending in the thickness direction of the lower mold base (21) is provided on the parting surface of the lower mold base (21), the top and bottom ends of the suction blind hole (217) are connected to the suction groove (216) and the negative pressure flow channel (212), an adjustment rod (13) coaxial with the suction blind hole (217) is threadedly connected to the injection mold (4), the adjustment rod (13) comprises an adjustment section (132), the circumferential outer edge of the adjustment section (132) is provided with a spiral convex strip (133), and the suction flow channel (44) further comprises a spiral flow channel (2171) formed by the circumferential inner wall of the suction blind hole (217), the circumferential outer edge of the adjustment section (132) and the convex strip (133).

10. The mold assembly for a seal ring for semiconductor equipment according to claim 8, characterized in that: The lower die base (21) comprises a lower die base (25) and a lower die top base (26) detachably arranged on the lower die base (25), and the negative pressure flow channel (212) is formed by enclosing the lower die base (25) and the lower die top base (26).

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