A copper-plated step gradient circuit board quality inspection method and system

Abstract

The present invention belongs to the technical field of circuit board quality inspection. A method and system for quality inspection of copper-plated step gradient circuit boards are provided. The method comprises: obtaining the electrical design data of the copper-plated step gradient circuit board, and determining the first thickness data of the target copper layer segment on the copper-plated step gradient circuit board according to the electrical design data; controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle, and extracting the second thickness data of the target copper layer segment on the copper-plated step gradient circuit board according to the high-definition image; calculating the deviation thickness between the second thickness data and the first thickness data, and generating the quality inspection result of the target copper layer segment according to the deviation thickness; repeating the above steps to generate the quality inspection results of each target copper layer segment of the copper-plated step gradient circuit board, that is, completing the quality inspection of the copper-plated step gradient circuit board. The present invention realizes automatic quality inspection of whether the actual thickness of the copper layer on the copper-plated step gradient circuit board meets the designed thickness.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board quality inspection, and in particular to a method and system for quality inspection of copper-plated step gradient circuit boards. Background Art

[0002] Copper-plated step gradient circuit board is a material used to make high-density, high-performance printed circuit boards. It has copper layers of different thicknesses, which can achieve the connection between different circuits. The copper layer on the copper-plated step gradient circuit board needs to be maintained at a designed thickness, which is mainly formulated based on electrical performance requirements, such as impedance matching, signal transmission quality, etc. However, the existing quality inspection method lacks quality inspection of the thickness of the copper layer of the copper-plated step gradient circuit board, resulting in the production of copper-plated step gradient circuit boards may have greater quality risks. The technical solution of the present invention is intended to solve this technical problem. Summary of the invention

[0003] In this regard, the present invention provides a copper-plated step gradient circuit board quality inspection method, system, electronic equipment, computer storage medium and computer program product to solve the above-mentioned technical problems.

[0004] The present invention discloses a quality inspection method for a copper-plated step gradient circuit board, the method comprising the following steps:

[0005] Acquire electrical design data of the copper-plated step-gradient circuit board, and determine first thickness data of a target copper layer segment on the copper-plated step-gradient circuit board according to the electrical design data;

[0006] Controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle, and extracting second thickness data of the target copper layer segment on the copper-plated step gradient circuit board according to the high-definition image;

[0007] Calculating the deviation thickness between the second thickness data and the first thickness data, and generating the quality inspection result of the target copper layer segment according to the deviation thickness;

[0008] Repeat the above steps to generate quality inspection results for each target copper layer segment of the copper-plated step gradient circuit board, that is, complete the quality inspection of the copper-plated step gradient circuit board.

[0009] Optionally, the controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle includes:

[0010] Determine a plurality of the set angles according to the first thickness data, wherein a first number of the set angles and a maximum angle span of each of the set angles are both negatively correlated with the first thickness data;

[0011] The camera is controlled to capture the high-definition image of the copper-plated step gradient circuit board at each of the set angles to obtain the high-definition images corresponding to the first quantity.

[0012] Optionally, the determining of the plurality of set angles according to the first thickness data is specifically:

[0013]

[0014] In the formula, is the first number of the set angle, is the preset number of the set angle, is the first thickness data, is a constant, A preset angle span for the maximum angle span; The mathematical symbol for rounding up.

[0015] Optionally, the acquiring electrical design data of the copper-plated step gradient circuit board and determining first thickness data of the target copper layer segment according to the electrical design data comprises:

[0016] Acquire electrical design data of the copper-plated step gradient circuit board, and determine whether thickness data corresponding to the target copper layer segment can be parsed from the electrical design data;

[0017] If yes, the thickness data obtained through analysis is determined as the first thickness data of the target copper layer segment;

[0018] If not, the electrical design data of the copper-plated step gradient circuit board is input into a copper layer thickness prediction model based on a large model, and the copper layer thickness prediction model predicts the first thickness data of the target copper layer segment.

[0019] Optionally, the step of inputting the electrical design data of the copper-plated step gradient circuit board into a copper layer thickness prediction model based on a large model, wherein the copper layer thickness prediction model predicts first thickness data of the target copper layer segment, comprises:

[0020] Determine the analysis scope according to the set rules, and determine the attribute information of each component within the analysis scope; wherein each component within the analysis scope is in direct or indirect electrical connection with the target copper layer segment;

[0021] Input each of the attribute information into the copper layer thickness prediction model based on the large model, and the copper layer thickness prediction model predicts and obtains the first thickness data of the target copper layer segment;

[0022] The analysis range is determined as follows:

[0023] Determine a second quantity of thickness data corresponding to the copper layer segment analyzed in the electrical design data, determine the number of span layers based on the second quantity, and determine the analysis range based on the number of span layers; wherein the number of span layers refers to the number of components passed when tracing back in upstream and downstream directions respectively with the target copper layer segment as the starting point.

[0024] Optionally, generating the quality inspection result of the target copper layer segment according to the deviation thickness includes:

[0025] If the deviation thickness is higher than the thickness threshold, the quality inspection result of the target copper layer segment is determined to be unqualified; otherwise, the quality inspection result of the target copper layer segment is determined to be qualified.

[0026] The present invention also discloses a copper-plated step gradient circuit board quality inspection system, the system comprising a shooting module, a processing module, and a storage module, the processing module executes the computer code in the storage module to implement the following method steps:

[0027] Acquire electrical design data of the copper-plated step-gradient circuit board, and determine first thickness data of a target copper layer segment on the copper-plated step-gradient circuit board according to the electrical design data;

[0028] Controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle, and extracting second thickness data of the target copper layer segment on the copper-plated step gradient circuit board according to the high-definition image;

[0029] Calculating the deviation thickness between the second thickness data and the first thickness data, and generating the quality inspection result of the target copper layer segment according to the deviation thickness;

[0030] Repeat the above steps to generate quality inspection results for each target copper layer segment of the copper-plated step gradient circuit board, that is, complete the quality inspection of the copper-plated step gradient circuit board.

[0031] The present invention also discloses an electronic device, comprising: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor, wherein the processor executes the computer program to implement any of the above methods.

[0032] The present invention also discloses a computer storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement any of the above methods.

[0033] The present invention also discloses a computer program product, which can implement any of the above methods when the computer program product is executed by a processor.

[0034] The beneficial effect of the present invention is that the above scheme of the present invention realizes the automatic extraction or acquisition of the actual thickness and the designed thickness of the copper layer on the copper-plated step gradient circuit board, and automatically performs the analysis and calculation of the thickness deviation, thereby quickly generating the quality inspection results of each target copper layer segment of the copper-plated step gradient circuit board to be inspected, which can help ensure that the electrical performance of the produced copper-plated step gradient circuit board meets the design requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a schematic flow chart of a method for quality inspection of a copper-plated step gradient circuit board disclosed in an embodiment of the present invention;

[0037] Figure 2 is a schematic diagram of a camera disclosed in an embodiment of the present invention shooting at a set angle;

[0038] Figure 3 The present invention is a schematic diagram of the structure of a copper-plated step gradient circuit board quality inspection system disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The following is a description of the implementation of the present application by specific specific embodiments. People familiar with the technology can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0040] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0041] like Figure 1 As shown, an embodiment of the present invention discloses a method for quality inspection of copper-plated step gradient circuit boards, the method comprising the following steps:

[0042] Acquire electrical design data of the copper-plated step-gradient circuit board, and determine first thickness data of a target copper layer segment on the copper-plated step-gradient circuit board according to the electrical design data;

[0043] Controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle, and extracting second thickness data of the target copper layer segment on the copper-plated step gradient circuit board according to the high-definition image;

[0044] Calculating the deviation thickness between the second thickness data and the first thickness data, and generating the quality inspection result of the target copper layer segment according to the deviation thickness;

[0045] Repeat the above steps to generate quality inspection results for each target copper layer segment of the copper-plated step gradient circuit board, that is, complete the quality inspection of the copper-plated step gradient circuit board.

[0046] In order to solve the technical problem mentioned in the background technology part that the existing quality inspection method lacks the quality inspection process for the thickness of the copper layer on the copper-plated step gradient circuit board, the present invention designs the above-mentioned quality inspection scheme based on image recognition technology to analyze whether the copper layer thickness is qualified. Specifically, the electrical design data of the copper-plated step gradient circuit board is obtained, and the electrical design data contains the circuit design data on the copper-plated step gradient circuit board, the electrical components that should be arranged at each position, and the like. According to the electrical design data, it can be determined that the first thickness data that the corresponding target copper layer segment should have can be obtained, and the first thickness data is the design thickness. Then, the quality inspection section is equipped with a camera, which can take high-definition photos of the copper-plated step gradient circuit board at a set angle. According to the high-definition image obtained by the shooting, the high-definition image is analyzed to extract the second thickness data of the target copper layer segment on the copper-plated step gradient circuit board. The target copper layer segment is each copper layer segment on the copper-plated step gradient circuit board that needs to be inspected for thickness, and the second thickness data is the actual thickness. Finally, by analyzing the deviation thickness between the actual thickness, i.e., the second thickness data, and the designed thickness, i.e., the first thickness data, the quality inspection result of the target copper layer segment can be generated. In this way, the quality inspection results of each target copper layer segment of the copper-plated step gradient circuit board can be generated.

[0047] The above scheme of the present invention realizes the automatic extraction or acquisition of the actual thickness and the designed thickness of the copper layer on the copper-plated step gradient circuit board, and automatically performs analysis and calculation of the thickness deviation, thereby quickly generating the quality inspection results of each target copper layer segment of the copper-plated step gradient circuit board to be inspected, which can help ensure that the electrical performance of the produced copper-plated step gradient circuit board meets the design requirements.

[0048] Among them, the above-mentioned camera can be fixed or mobile. A fixed camera is fixedly installed on the side of the quality inspection assembly line. When each copper-plated step gradient circuit board to be inspected is transmitted to the installation position of the camera, the copper-plated step gradient circuit board is identified, and then a suitable capture speed is determined according to the transmission speed of the copper-plated step gradient circuit board, and then a number of high-definition images of the copper-plated step gradient circuit board are captured. A mobile camera can be movably installed on the side of the quality inspection assembly line. When the copper-plated step gradient circuit board being transmitted is identified, the speed is maintained at the same speed as the copper-plated step gradient circuit board, and a number of high-definition images of the copper-plated step gradient circuit board are captured. In fact, the present invention does not limit the fixed or mobile layout of the camera.

[0049] Optionally, the controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle includes:

[0050] Determine a plurality of the set angles according to the first thickness data, wherein a first number of the set angles and a maximum angle span of each of the set angles are both negatively correlated with the first thickness data;

[0051] The camera is controlled to capture the high-definition image of the copper-plated step gradient circuit board at each of the set angles to obtain the high-definition images corresponding to the first quantity.

[0052] In some embodiments, the first thickness data of each copper layer segment on the copper-plated step gradient circuit board can be determined by analyzing the electrical design data of the copper-plated step gradient circuit board, and the appropriate setting angle strategy to be adopted can be determined based on the first thickness data of the copper layer segment. Specifically, based on the design thickness of the copper layer segment, i.e., the first thickness data, the first number of setting angles to be adopted and the maximum angle span of these setting angles are determined according to a preset negative correlation. Figure 2 As shown, three setting angles are designed for the camera according to the first thickness data, and the maximum angle span between the three setting angles is 60°. Of course, the first number of setting angles and the maximum angle span can also be more, and both are negatively correlated with the first thickness data. The reason for this arrangement is that when the first thickness data is smaller (that is, the thinner the copper layer), the height of the copper layer is insufficient, and the high-definition data of the copper layer segment should be shot at more inclined angles, which is conducive to extracting a more accurate actual thickness, that is, the second thickness data; on the contrary, when the height of the copper layer is sufficient, that is, the larger the first thickness data, there is no need to shoot the high-definition data of the copper layer segment at more inclined angles, which can significantly reduce the first number of high-definition images that need to be processed and reduce the processing load. However, the present invention does not limit the expression form of the specific formula of the above negative correlation.

[0053] Optionally, the determining of the plurality of set angles according to the first thickness data is specifically:

[0054] In the formula, is the first number of the set angle, is the preset number of the set angle, is the first thickness data, is a constant, A preset angle span for the maximum angle span; The mathematical symbol for rounding up.

[0055] In the present embodiments, the first number of setting angles for controlling the camera shooting is negatively correlated with the first thickness data. The larger the first thickness data of the copper layer segment is, the thicker the copper layer segment is, and the setting angles of the preset number n1 are adjusted to be smaller. On the contrary, when the first thickness data of the copper layer segment is smaller, that is, the copper layer segment is thinner, the setting angle of the preset number n1 is adjusted to more .

[0056] The maximum angle span of each set angle is negatively correlated with the first thickness data of the copper layer segment on the one hand, and positively correlated with the first number of set angles on the other hand. Specifically, when the first number n of set angles determined above is larger, the maximum angle span needs to be increased accordingly (the angle difference between each set angle is the same, that is, the maximum angle span is evenly divided). This can avoid the adjacent set angles being too close, and the side wall features of the copper layer segment photographed at too close shooting angles are too similar, which is not conducive to accurately extracting the second thickness data of the copper layer segment; conversely, when the first number n of set angles determined above is smaller, the maximum angle span needs to be correspondingly reduced. Therefore, under the premise that n set angles can meet the accurate extraction of the second thickness data, appropriately reducing the angle adjustment range of the camera can effectively improve the shooting speed of high-definition data, thereby improving the overall quality inspection efficiency of copper-plated step gradient circuit boards.

[0057] Optionally, the acquiring electrical design data of the copper-plated step gradient circuit board and determining first thickness data of the target copper layer segment according to the electrical design data comprises:

[0058] Acquire electrical design data of the copper-plated step gradient circuit board, and determine whether thickness data corresponding to the target copper layer segment can be parsed from the electrical design data;

[0059] If yes, the thickness data obtained through analysis is determined as the first thickness data of the target copper layer segment;

[0060] If not, the electrical design data of the copper-plated step gradient circuit board is input into a copper layer thickness prediction model based on a large model, and the copper layer thickness prediction model predicts the first thickness data of the target copper layer segment.

[0061] In the present embodiments, the electrical design data of the obtained copper-plated step gradient circuit board is parsed to obtain the thickness data corresponding to the target copper layer segment. However, the electrical design data may mark the thickness data of all copper layer segments, or may only mark the thickness data of some copper layer segments (such as key copper layer segments), or may not mark the thickness data of any copper layer segment but mark the types and models of components to be welded at various positions of the copper-plated step gradient circuit board.

[0062] In view of the above-mentioned reality, the present invention first determines whether the thickness data corresponding to the target copper layer segment is obtained by parsing the electrical design data of the copper-plated step gradient circuit board. If it is indeed marked, the thickness data can be directly determined as the thickness data of the target copper layer segment. If it is not marked, it is necessary to predict the design data of the target copper layer segment, i.e., the first thickness data, by indirect analysis, as follows:

[0063] A copper layer thickness prediction model based on a large model is pre-built. The large model here refers to a machine learning model with billions or even hundreds of billions of parameters that can handle data for complex tasks. These machine learning models are usually built on the basis of various neural networks. During the training and optimization process, these models use large-scale data to self-adjust and optimize to achieve intelligent data analysis and processing. The above-mentioned copper layer thickness prediction model of the present invention is constructed based on existing large models, such as OpenAI's GPT series large model, Zhipu Qingyan AI large model, etc. By using targeted small sample data to train these large models for specific capabilities, the copper layer thickness prediction model of the present invention can be obtained, which can predict the thickness (i.e., design thickness) that a specific copper layer segment should maintain based on the electrical design data of the copper-plated step gradient circuit board. The specific small sample data collection, labeling and training process will not be repeated here.

[0064] Optionally, the step of inputting the electrical design data of the copper-plated step gradient circuit board into a copper layer thickness prediction model based on a large model, wherein the copper layer thickness prediction model predicts first thickness data of the target copper layer segment, comprises:

[0065] Determine the analysis scope according to the set rules, and determine the attribute information of each component within the analysis scope; wherein each component within the analysis scope is in direct or indirect electrical connection with the target copper layer segment;

[0066] Input each of the attribute information into the copper layer thickness prediction model based on the large model, and the copper layer thickness prediction model predicts and obtains the first thickness data of the target copper layer segment;

[0067] The analysis range is determined as follows:

[0068] Determine a second quantity of thickness data corresponding to the copper layer segment analyzed in the electrical design data, determine the number of span layers based on the second quantity, and determine the analysis range based on the number of span layers; wherein the number of span layers refers to the number of components passed when tracing back in upstream and downstream directions respectively with the target copper layer segment as the starting point.

[0069] In some embodiments, the electrical design data includes the attribute information (component type, model, etc.) of the components that will be subsequently welded at various positions on the copper-plated step gradient circuit board. Different components have different electrical performance requirements for the copper layer used for electrical conduction. For example, high-current components require better conductivity, so a thicker copper layer is required; certain components need to transmit high-speed signals, so a thinner copper layer is required to reduce the influence of the skin effect, etc. Therefore, the attribute information of the components within the analysis range based on the target copper layer segment on the copper-plated step gradient circuit board is input into the copper layer thickness prediction model together, and the first thickness data of the predicted target copper layer segment can be obtained.

[0070] The analysis scope is not a circular or rectangular area as traditionally understood, but is determined based on the wire connectivity structure of components, specifically the number of span layers. For example, abc-target copper layer segment-defg, the target copper layer segment is connected to three components a, b, and c in the upstream direction, and to four components d, e, f, and g in the downstream direction. Assuming the number of span layers is 2, the components included in the analysis scope are b, c, d, and e.

[0071] In addition, the number of span layers is determined according to the second number of thickness data corresponding to the copper layer segment obtained by parsing in the electrical design data. The electrical design data may only contain the thickness data of some other copper layer segments other than the target copper layer segment, and the second number of copper layer segments with thickness data marked can be statistically obtained. The larger the second number of the marking, the more precise the copper-plated step gradient circuit board is, and the designer has marked the copper layer thickness at more locations. Conversely, the less precise the copper-plated step gradient circuit board is. In this regard, the present invention is further arranged that when the second number is larger, the number of span layers is set to be larger, so that the design thickness that should be maintained for the target copper layer segment can be analyzed based on more components; and when the second number is smaller, the number of span layers is set to be smaller, so that the analysis rate of the copper layer thickness prediction model can be appropriately reduced, and the interference of irrelevant components can be reduced. When the thickness data corresponding to the copper layer segment is not parsed in the electrical design data, the number of span layers can be set to a preset value, such as 3.

[0072] It should be noted that the first thickness data of the target copper layer segment predicted by the copper layer thickness prediction model may also be inaccurate, but the degree of inaccuracy can be reduced through deeper training of the copper layer thickness prediction model, and the degree of inaccuracy within a reasonable range is also acceptable, because there will be manual quality inspection links in the follow-up, and the manual quality inspection link can complete the quality inspection by conducting electrical performance tests on the copper-plated step gradient circuit board. Through the mutual cooperation of the two quality inspection methods, a balance between quality inspection efficiency and false detection rate can be achieved at the same time.

[0073] Optionally, generating the quality inspection result of the target copper layer segment according to the deviation thickness includes:

[0074] If the deviation thickness is higher than the thickness threshold, the quality inspection result of the target copper layer segment is determined to be unqualified; otherwise, the quality inspection result of the target copper layer segment is determined to be qualified.

[0075] In some embodiments, by comparing the deviation thickness between the actual thickness, i.e., the second thickness data, and the designed thickness, i.e., the first thickness data, and the thickness threshold, the quality inspection result of the target copper layer segment can be quickly determined. The corresponding quality inspection result is output to the quality inspector, who uses more sophisticated means to perform quality inspection and analysis according to the situation, such as a scanning electron microscope test method. This method uses a scanning electron microscope to test the surface morphology of the sample, which can be accurate to the micron level and clearly detect the copper plating thickness of the copper layer segment.

[0076] like Figure 3 As shown, the embodiment of the present invention also discloses a copper-plated step gradient circuit board quality inspection system, the system includes a shooting module, a processing module, and a storage module, the processing module executes the computer code in the storage module to implement the following method steps:

[0077] Acquire electrical design data of the copper-plated step-gradient circuit board, and determine first thickness data of a target copper layer segment on the copper-plated step-gradient circuit board according to the electrical design data;

[0078] Controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle, and extracting second thickness data of the target copper layer segment on the copper-plated step gradient circuit board according to the high-definition image;

[0079] Calculating the deviation thickness between the second thickness data and the first thickness data, and generating the quality inspection result of the target copper layer segment according to the deviation thickness;

[0080] Repeat the above steps to generate quality inspection results for each target copper layer segment of the copper-plated step gradient circuit board, that is, complete the quality inspection of the copper-plated step gradient circuit board.

[0081] An embodiment of the present invention further discloses an electronic device, comprising: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor, wherein the processor executes the computer program to implement the method described in the above embodiment.

[0082] An embodiment of the present invention further discloses a computer storage medium, wherein the computer storage medium stores a computer program, and the computer program is executed by a processor to implement the method described in the above embodiment.

[0083] The embodiment of the present invention further discloses a computer program product, which can implement the method described in the above embodiment when the computer program product is executed by a processor.

[0084] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0085] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0086] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, or can be electrical, mechanical or other forms of connection.

[0087] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments of the present invention.

[0088] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0089] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0090] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for quality inspection of copper-plated step gradient circuit boards, characterized in that: The method comprises the following steps: Obtaining electrical design data of a copper-plated step gradient circuit board, and determining first thickness data of a target copper layer segment on the copper-plated step gradient circuit board according to the electrical design data, including: Determining whether the electrical design data can be parsed to obtain thickness data corresponding to the target copper layer segment; if not, inputting the electrical design data into a copper layer thickness prediction model based on a large model to predict the first thickness data of the target copper layer segment, including: Determine the analysis scope according to the set rules, and determine the attribute information of each component within the analysis scope; each component within the analysis scope is in direct or indirect electrical connection with the target copper layer segment; Input each of the attribute information into the copper layer thickness prediction model based on the large model to predict the first thickness data of the target copper layer segment; The analysis scope is determined as follows: Determine a second quantity of thickness data corresponding to the copper layer segment obtained by parsing the electrical design data, determine the number of span layers according to the second quantity, and determine the analysis range according to the number of span layers; the number of span layers refers to the number of components passed when tracing from the target copper layer segment as the starting point to the upstream and downstream directions respectively; Controlling the camera to capture a high-definition image of the copper-plated step gradient circuit board at a set angle, and extracting the second thickness data of the target copper layer segment according to the high-definition image; Calculating the deviation thickness between the second thickness data and the first thickness data, and generating the quality inspection result of the target copper layer segment according to the deviation thickness; Repeat the above steps to generate quality inspection results for each target copper layer segment of the copper-plated step gradient circuit board, that is, complete the quality inspection of the copper-plated step gradient circuit board.

2. A method for quality inspection of copper-plated step gradient circuit boards according to claim 1, characterized in that: Control the camera to capture high-definition images of copper-plated gradient circuit boards at a set angle, including: Determine a plurality of the set angles according to the first thickness data, wherein a first number of the set angles and a maximum angle span of each of the set angles are both negatively correlated with the first thickness data; The camera is controlled to capture the high-definition image of the copper-plated step gradient circuit board at each of the set angles to obtain the high-definition images corresponding to the first quantity.

3. A copper-plated step gradient circuit board quality inspection method according to claim 2, characterized in that: Determine the set angles according to the first thickness data, specifically: In the formula, is the first number of the set angle, is the preset number of the set angle, is the first thickness data, is a constant, A preset angle span for the maximum angle span; The mathematical symbol for rounding up.

4. A method for quality inspection of copper-plated step gradient circuit boards according to claim 3, characterized in that: The electrical design data of the copper-plated step gradient circuit board is obtained, and the first thickness data of the target copper layer segment is determined according to the electrical design data, and further includes: If so, the thickness data obtained through analysis is determined as the first thickness data of the target copper layer segment.

5. A method for quality inspection of copper-plated step gradient circuit boards according to claim 4, characterized in that: Generating a quality inspection result of the target copper layer segment according to the deviation thickness includes: If the deviation thickness is higher than the thickness threshold, the quality inspection result of the target copper layer segment is determined to be unqualified; otherwise, the quality inspection result of the target copper layer segment is determined to be qualified.

6. A copper-plated step gradient circuit board quality inspection system, the system comprising a shooting module, a processing module, and a storage module, characterized in that: The processing module implements the method according to any one of claims 1 to 5 by executing the computer code in the storage module.

7. An electronic device comprising: At least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor, wherein the processor executes the computer program to implement the method according to any one of claims 1 to 5.

8. A computer storage medium storing a computer program, characterized in that: The computer program is executed by a processor to implement the method according to any one of claims 1 to 5.

9. A computer program product, characterized in that: When the computer program product is executed by a processor, the method according to any one of claims 1 to 5 is implemented.

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