Intelligent chip interface module detection and debugging device

Abstract

An intelligent chip interface module detection and debugging device disclosed by the present invention comprises a first shell, a detection assembly, a base and a test seat, the upper surface of the base is fixedly connected with a detection unit, the upper surface of the base is provided with a first sliding groove, the inner wall of the first sliding groove is provided with a contact piece, and the test seat is slidably connected in the first sliding groove. The upper surface of the test seat is fixedly connected with a test module; a chip interface module positioning clamp assembly is designed and can be adjusted and fixed according to different test modules, the interface modules are prevented from loosening and affecting connection stability in the test process, a drawer type detection assembly is designed, a to-be-tested interface module is installed on a base, a contact piece is pressed in a sliding mode through the base, and the test efficiency is improved. The interface module and the detection unit are connected more stably and reliably, meanwhile, the surface of the interface module is shot through a camera, surface defect analysis is carried out through an image comparison technology, and the quality and reliability of products are further ensured.

Description

Technical Field

[0001] The invention relates to the technical field of chip detection, in particular to an intelligent chip interface module detection and debugging device. Background Art

[0002] Intelligent chip interface module detection and debugging is a comprehensive process, which aims to ensure that the functions, performance and compatibility of the chip interface module meet the design requirements. The main purposes of intelligent chip interface module detection include: verifying interface functions: ensuring that the interface can exchange data and control operations as expected; evaluating performance indicators: testing the interface's transmission rate, response time and other performance indicators; checking compatibility: verifying the compatibility of the interface on different systems or platforms; discovering potential problems: discovering errors, defects or deficiencies in the interface implementation through testing.

[0003] The existing intelligent chip interface module detection and debugging devices have the following defects: First, during the connection process, the current detection device lacks a precise positioning fixture designed specifically for the chip interface module; this lack results in the module's position being unable to be accurately fixed during the test connection, which in turn affects the accuracy and reliability of the test results; second, when performing the connection operation between the chip interface module and the detection unit, the process is quite cumbersome; the tester needs to manually install the product on the equipment, which is not only time-consuming and labor-intensive, but also increases the risk of operational errors and reduces the overall detection efficiency; third, there is a lack of effective detection capabilities for surface defects of the chip interface module. Surface defects such as scratches, oxide layer defects, cracks, mechanical damage, etc. may indicate problems in the manufacturing process and pose a potential threat to the overall quality and life of the product. Summary of the invention

[0004] The purpose of the present invention is to provide a smart chip interface module detection and debugging device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a smart chip interface module detection and debugging device, comprising a first shell, a detection component is arranged in the first shell, the detection component comprises a base, and the base is fixedly connected to the inner wall of the first shell, the upper surface of the base is fixedly connected to the detection unit, the upper surface of the base is provided with a first slide groove, the inner wall of the first slide groove is provided with a contact piece, a test socket is slidably connected in the first slide groove, the upper surface of the test socket is fixedly connected to the test module, a connecting block is fixedly connected to the outer wall of one side of the test socket, the upper surface of the connecting block is provided with a first guide block and a second guide block, a first spring is fixedly connected to the base, and the other end of the first spring is fixedly connected to the connecting block, a pull rod is rotatably connected to the upper surface of the base, and the other end of the pull rod is clamped on the first guide block, and clamp assemblies are arranged on both sides of the test module.

[0006] As a further technical solution of the present invention, the clamp assembly includes a third shell, a bracket is arranged in the third shell, first guide rails are fixedly connected to the inner walls on both sides of the third shell, and the bracket is slidably connected to the first guide rails, a second spring is fixedly connected to the lower surface of the bracket, and the other end of the second spring is fixedly connected to the inner wall of the third shell.

[0007] As a further technical solution of the present invention, a fourth shell is fixedly connected to the bracket, a third spring is fixedly connected to an inner wall on one side of the fourth shell, a slider is fixedly connected to the other end of the third spring, second guide rails are provided on the inner walls on both sides of the fourth shell, and the slider is slidably connected to the second guide rails.

[0008] As a further technical solution of the present invention, a fifth shell is fixedly connected to the slider, a fourth spring is fixedly connected to the inner wall of the fifth shell, the other end of the fourth spring is fixedly connected to a fixing clamp, and the fixing clamp is slidably connected in the fifth shell.

[0009] As a further technical solution of the present invention, a mounting plate is fixedly connected to the outer walls on both sides of the third shell, and a positioning bolt is threadedly connected to the mounting plate. A limiting groove is set at the bottom end of the positioning bolt, and the limiting groove is opened on the upper surface of the test seat, and the positioning bolt is sleeved in the limiting groove.

[0010] As a further technical solution of the present invention, a camera is fixedly connected to an inner wall of one side of the first shell.

[0011] As a further technical solution of the present invention, a through hole is provided on one side outer wall of the first shell, and the test socket is sleeved in the through hole, and a heat dissipation hole is provided on the other side outer wall of the first shell.

[0012] As a further technical solution of the present invention, a second shell is fixedly connected to one side outer wall of the first shell, and a display screen and a start button are arranged on one side outer wall of the second shell.

[0013] As a further technical solution of the present invention, the lower surfaces of the first shell and the second shell are both fixedly connected with ground feet.

[0014] As a further technical solution of the present invention, a third guide rail is arranged on one side outer wall of the first shell, a protective cover is slidably connected to the third guide rail, and a socket is arranged on the other side outer wall of the first shell.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention is designed with a chip interface module positioning fixture assembly, which can be adjusted and fixed according to different test modules to avoid loosening of the interface module during the test and affect the connection stability; a drawer-type detection assembly is designed, and the interface module to be tested is installed on the base, and the contact piece is pressed by sliding the base to achieve the connection between the interface module and the detection unit, which is more stable and reliable; at the same time, the surface of the interface module is photographed by a camera, and surface defect analysis is performed by image comparison technology to further ensure the quality and reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 2 It is a front view structural schematic diagram of the present invention;

[0018] Figure 3 It is a schematic diagram of the top view of the structure of the present invention;

[0019] Figure 4 It is a rear view structural schematic diagram of the present invention;

[0020] Figure 5 It is a structural explosion diagram of the present invention;

[0021] Figure 6 for Figure 5 Schematic diagram of the enlarged structure of the A area in the middle;

[0022] Figure 7 It is a structural explosion diagram of the detection component of the present invention;

[0023] Figure 8 It is a front view structural schematic diagram of the clamp assembly of the present invention;

[0024] Fig. 9 It is a schematic diagram of the side cutaway structure of the clamp assembly of the present invention.

[0025] In the figure: 1. first shell; 2. second shell; 3. display screen; 4. start button; 5. through hole; 6. detection component; 61. base; 62. first slide groove; 63. contact piece; 64. test socket; 65. test module; 66. limit groove; 67. connecting block; 68. first guide block; 69. second guide block; 610. pull rod; 611. first spring; 612. detection unit; 7. fixture assembly; 71. third shell; 72. mounting plate; 73. positioning bolt; 74. second spring; 75. first guide rail; 76. bracket; 77. fourth shell; 78. third spring; 79. second guide rail; 710. slider; 711. fifth shell; 712. fourth spring; 713. fixing fixture; 8. protective cover; 9. camera; 10. heat dissipation hole; 11. ground pin; 12. jack; 13. third guide rail. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Please see attached Figure 1 -Attached Fig. 9An embodiment of the present invention is as follows: a smart chip interface module detection and debugging device comprises a first shell 1, a detection assembly 6 is arranged in the first shell 1, the detection assembly 6 comprises a base 61, and the base 61 is fixedly connected to the inner wall of the first shell 1, a detection unit 612 is fixedly connected to the upper surface of the base 61, a first slide groove 62 is provided on the upper surface of the base 61, a contact piece 63 is arranged on the inner wall of the first slide groove 62, a test seat 64 is slidably connected in the first slide groove 62, a test module 65 is fixedly connected to the upper surface of the test seat 64, a connection block 67 is fixedly connected to the outer wall of one side of the test seat 64, a first guide block 68 and a second guide block 69 are arranged on the upper surface of the connection block 67, and a first spring 611 is fixedly connected to the base 61 , and the other end of the first spring 611 is fixedly connected to the connecting block 67, the upper surface of the base 61 is rotatably connected with a pull rod 610, and the other end of the pull rod 610 is clamped on the first guide block 68, and the clamp assemblies 7 are arranged on both sides of the test module 65; the clamp assembly 7 includes a third shell 71, and a bracket 76 is arranged in the third shell 71. The inner walls of both sides of the third shell 71 are fixedly connected with first guide rails 75, and the bracket 76 is slidably connected to the first guide rails 75, and the lower surface of the bracket 76 is fixedly connected with a second spring 74, and the other end of the second spring 74 is fixedly connected to the inner wall of the third shell 71, and the first guide rail 75 is used for the sliding guide of the bracket 76; the bracket 76 is fixedly connected with a fourth shell 77, and the inner wall of one side of the fourth shell 77 is fixedly connected with a fourth shell 77. A third spring 78 is fixedly connected, and the other end of the third spring 78 is fixedly connected to a slider 710. Second guide rails 79 are provided on the inner walls on both sides of the fourth housing 77, and the slider 710 is slidably connected to the second guide rails 79, and the second guide rails 79 are used for sliding guides of the slider 710; a fifth housing 711 is fixedly connected to the slider 710, and a fourth spring 712 is fixedly connected to the inner wall of the fifth housing 711, and the other end of the fourth spring 712 is fixedly connected to a fixing fixture 713, and the fixing fixture 713 is slidably connected in the fifth housing 711, and the fixing fixture 713 is used to fix the test module 65; mounting plates 72 are fixedly connected to the outer walls on both sides of the third housing 71, and positioning bolts 73 are threadedly connected to the mounting plates 72, and the bottom of the positioning bolts 73 A limiting groove 66 is provided at the end, and the limiting groove 66 is opened on the upper surface of the test seat 64, and the positioning bolt 73 is sleeved in the limiting groove 66. The mounting plate 72, the positioning bolt 73 and the limiting groove 66 are used to fix the third shell 71; a camera 9 is fixedly connected to the inner wall of one side of the first shell 1, and the camera 9 is used to shoot the surface of the test module 65 for defect analysis; a through hole 5 is opened on the outer wall of one side of the first shell 1, and the test seat 64 is sleeved in the through hole 5, and a heat dissipation hole 10 is opened on the outer wall of the other side of the first shell 1, and the heat dissipation hole 10 is used for heat dissipation; a second shell 2 is fixedly connected to the outer wall of one side of the first shell 1, and a display screen 3 and a start button 4 are provided on the outer wall of one side of the second shell 2, and the display screen 3 is used to set detection parameters and display detection and debugging reports;The lower surfaces of the first shell 1 and the second shell 2 are fixedly connected with a foot 11, which is used to support the first shell 1 and the second shell 2; a third guide rail 13 is provided on one side of the outer wall of the first shell 1, and a protective cover 8 is slidably connected to the third guide rail 13, and a socket 12 is provided on the other side of the outer wall of the first shell 1, and the protective cover 8 is used to protect the internal components. ;

[0028] Working principle: When using the present invention to detect and debug the intelligent chip interface module, first, the test module 65 needs to be installed on the detection component 6, first, the test seat 64 in the through hole 5 is pressed, and the test seat 64 slides inward along the first slide groove 62 on the base 61, and the test seat 64 drives the connecting block 67 to slide inward, and the pull rod 610 moves upward relative to the connecting block 67, and deflects to one side through the second guide block 69, and the test seat 64 is released. Under the pulling force of the first spring 611, the test seat 64 moves outward, and the pull rod 610 enters the track on one side and the first guide block 68 Separate, the test seat 64 pops up, the test module 65 is installed on the test seat 64, and fixed by the clamp assembly 7. First, the position of the clamp assembly 7 is adjusted by the limit groove 66, and the position is locked by tightening the positioning bolt 73 on the mounting plate 72, and then the slider 710 is pulled up, the bracket 76 together with the fourth shell 77 moves up along the first guide rail 75, and at the same time, the slider 710 is pulled outward to slide outward along the second guide rail 79. When the slider 710 slides to the position of the test module 65, the fourth spring 712 in the fifth shell 711 presses down to fix the clamp 71 3, so that the fixing fixture 713 is pressed against the surface of the test module 65 for fixing, and at the same time, the reset tension of the second spring 74 and the third spring 78 makes the fixing fixture 713 more tightened. After the positioning is completed, the test seat 64 is pushed in, and the pull rod 610 returns to one side of the first guide block 68 from the other side under the guidance of the first guide block 68 and the provided guide groove with a slope, and the test seat 64 is released. One end of the pull rod 610 falls into the groove on the first guide block 68, so that the pull rod 610 hooks the test seat 64, and at the same time, the contact at the bottom of the test seat 64 moves into place to squeeze The contact piece 63 completes the connection with the detection unit 612, slides and closes the protective cover 8 through the third guide rail 13 on the first shell 1, connects the power supply through the jack 12, presses the start button 4 to start the detection, and the camera 9 photographs the surface of the test module 65. The detection unit 612 performs defect analysis on the surface of the test module 65 through image comparison technology, and displays the defect report through the display screen 3 on the second shell 2. The detection unit 612 performs subsequent detection and debugging on the test module 65; wherein the heat dissipation hole 10 is used for heat dissipation, and the ground pin 11 is used to support the first shell 1 and the second shell 2.

[0029] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A smart chip interface module detection and debugging device, comprising a first housing (1), characterized in that: The first shell (1) is provided with a detection assembly (6), the detection assembly (6) comprising a base (61), and the base (61) is fixedly connected to the inner wall of the first shell (1), the upper surface of the base (61) is fixedly connected to a detection unit (612), the upper surface of the base (61) is provided with a first slide groove (62), the inner wall of the first slide groove (62) is provided with a contact piece (63), a test seat (64) is slidably connected in the first slide groove (62), the upper surface of the test seat (64) is fixedly connected to a test module (65), and the test A connecting block (67) is fixedly connected to an outer wall of one side of the seat (64); a first guide block (68) and a second guide block (69) are arranged on the upper surface of the connecting block (67); a first spring (611) is fixedly connected to the base (61), and the other end of the first spring (611) is fixedly connected to the connecting block (67); a pull rod (610) is rotatably connected to the upper surface of the base (61), and the other end of the pull rod (610) is clamped on the first guide block (68); and fixture assemblies (7) are arranged on both sides of the test module (65).

2. The intelligent chip interface module detection and debugging device according to claim 1, characterized in that: The clamp assembly (7) comprises a third shell (71), a bracket (76) is arranged inside the third shell (71), first guide rails (75) are fixedly connected to the inner walls on both sides of the third shell (71), and the bracket (76) is slidably connected to the first guide rails (75), a second spring (74) is fixedly connected to the lower surface of the bracket (76), and the other end of the second spring (74) is fixedly connected to the inner wall of the third shell (71).

3. The intelligent chip interface module detection and debugging device according to claim 2, characterized in that: The bracket (76) is fixedly connected to a fourth housing (77), a third spring (78) is fixedly connected to an inner wall on one side of the fourth housing (77), a slider (710) is fixedly connected to the other end of the third spring (78), second guide rails (79) are provided on inner walls on both sides of the fourth housing (77), and the slider (710) is slidably connected to the second guide rails (79).

4. The intelligent chip interface module detection and debugging device according to claim 3, characterized in that: The slider (710) is fixedly connected to a fifth housing (711), the inner wall of the fifth housing (711) is fixedly connected to a fourth spring (712), the other end of the fourth spring (712) is fixedly connected to a fixing clamp (713), and the fixing clamp (713) is slidably connected inside the fifth housing (711).

5. The intelligent chip interface module detection and debugging device according to claim 2, characterized in that: The third housing (71) is fixedly connected to the outer walls on both sides thereof with mounting plates (72), the mounting plates (72) are threadedly connected to positioning bolts (73), the bottom end of the positioning bolts (73) is provided with limiting grooves (66), and the limiting grooves (66) are opened on the upper surface of the test seat (64), and the positioning bolts (73) are sleeved in the limiting grooves (66).

6. The intelligent chip interface module detection and debugging device according to claim 1, characterized in that: A camera (9) is fixedly connected to an inner wall of one side of the first shell (1).

7. The intelligent chip interface module detection and debugging device according to claim 1, characterized in that: A through hole (5) is provided on one side outer wall of the first shell (1), and the test socket (64) is sleeved in the through hole (5); a heat dissipation hole (10) is provided on the other side outer wall of the first shell (1).

8. The intelligent chip interface module detection and debugging device according to claim 6, characterized in that: A second shell (2) is fixedly connected to one side outer wall of the first shell (1), and a display screen (3) and a start button (4) are provided on one side outer wall of the second shell (2).

9. The intelligent chip interface module detection and debugging device according to claim 8, characterized in that: The lower surfaces of the first shell (1) and the second shell (2) are both fixedly connected with ground feet (11).

10. The intelligent chip interface module detection and debugging device according to claim 8, characterized in that: A third guide rail (13) is provided on one side outer wall of the first shell (1), a protective cover (8) is slidably connected to the third guide rail (13), and a plug hole (12) is provided on the other side outer wall of the first shell (1).

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