Automatic carrier plate for integrated circuit chip test and use method thereof

Abstract

The invention relates to the field of automatic carrier plates, in particular to an automatic carrier plate for integrated circuit chip testing and a using method thereof, and the automatic carrier plate comprises a limiting mechanism which is used for limiting and fixing the automatic carrier plate; the mounting mechanism is used for carrying out mounting treatment on the chip and the automatic carrier plate; a symmetrical plate and a fixed sliding rail are fixedly mounted at the bottom of the limiting mechanism, supporting frames are fixedly mounted at the bottoms of the symmetrical plate and the fixed sliding rail, the mounting mechanism is arranged above the limiting mechanism, and an adjusting mechanism is arranged at the bottom of the limiting mechanism; according to the automatic carrier plate for testing the integrated circuit chip and the use method of the automatic carrier plate, through downward extrusion of the top pressing plate and end face extrusion of the elastic pressing head, all-directional limiting and fixing effects on the automatic carrier plate are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of automated carrier boards, and in particular to an automated carrier board for integrated circuit chip testing and a method for using the same. Background Art

[0002] Automation carriers are the boards that transform embedded computer modules into fully functional computer systems, providing power, I / O connections, mechanical support, and additional components. In the semiconductor and panel manufacturing industries, carriers are an important part of automated material handling systems used to store, retrieve, and transfer wafer cassettes or panel carriers.

[0003] When the existing chip is placed inside the automated carrier for testing, the chip connection part and the carrier slot feeler are offset and cannot be fully aligned, thus affecting the test accuracy. Summary of the invention

[0004] The present invention provides an automated carrier for integrated circuit chip testing and a method of using the same to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: an automated carrier for integrated circuit chip testing, comprising a limiting mechanism, the limiting mechanism being used for limiting and fixing the automated carrier; An installation mechanism, which is used for installation processing between the chip and the automated carrier; A symmetrical plate and a fixed slide rail are fixedly mounted on the bottom of the limiting mechanism, and a support frame is fixedly mounted on the bottom of the symmetrical plate and the fixed slide rail. The mounting mechanism is arranged above the limiting mechanism, and an adjustment mechanism is arranged at the bottom of the limiting mechanism. The limiting mechanism includes a placing table, the bottom of which is fixedly connected to the symmetrical plate and the fixed slide rail respectively, a carrier plate is arranged at the center of the top of the placing table, a slide groove is provided on the inner side of the placing table, a slide bar is provided for sliding inside the slide groove, an electric push rod is fixedly installed on the top of the slide bar, and the top end of the electric push rod is fixedly connected to the top of the slide groove; One end of the slide bar away from the slide slot is fixedly connected to a top pressure plate, the bottom of the top pressure plate is extruded and adapted to the top of the carrier plate, and the inner end of the top pressure plate is fixedly connected to a connecting rod.

[0006] Preferably, the end of the slide bar close to the slide slot is fixedly connected to a bottom diagonal rod, the bottom diagonal rod is slidably adapted inside the slide slot, the bottom of the bottom diagonal rod is extruded and adapted with an inclined block, both ends of the inclined block are symmetrically connected to side panels, the inner side of the side panel is fixedly connected to a return spring, and the end of the return spring away from the side panel is fixedly connected to the outer side of the placement table.

[0007] Preferably, one end of the inclined block away from the bottom inclined rod is fixedly connected to an insertion rod, the insertion rod is inserted into the outer side of the placement table and extends to the inner side thereof, and one end of the insertion rod away from the inclined block is fixedly connected to an elastic pressure head, and one end of the elastic pressure head away from the insertion rod is extruded and adapted to the carrier plate.

[0008] Preferably, the mounting mechanism includes an external connecting frame, which is fixedly connected to the outside of the supporting frame, an end of the external connecting frame away from the supporting frame is fixedly connected to an extension rod, an end of the extension rod away from the external connecting frame is fixedly connected to a hydraulic rod, and the bottom of the hydraulic rod is fixedly connected to a chip frame, wherein the chip frame is used to place the chip.

[0009] Preferably, the installation assembly includes a No. 1 movable frame, which is slidably adapted inside the fixed slide rail, a flat plate is fixedly connected to the top of the No. 1 movable frame, and a U-shaped plate is fixedly connected to one end of the flat plate away from the No. 1 movable frame.

[0010] Preferably, the top sliding adapter of the flat plate is equipped with a top block, the top of the top block is fixedly connected to a rod sleeve, the inner side of the rod sleeve is fixedly connected to an inner connecting rod, the inner connecting rod is inserted through the outer side of the U-shaped plate and extends to the inner side thereof, the end of the inner connecting rod away from the rod sleeve is fixedly connected to a No. 1 posting plate, the bottom of the No. 1 posting plate is fixedly connected to a vertical plate, and the inner side of the vertical plate is fixedly connected to a horizontal plate.

[0011] Preferably, the outer side of the No. 1 movable frame is fixedly connected with a bending inclined plate, the end of the bending inclined plate away from the No. 1 movable frame is extruded and adapted with a triangular block, the end of the triangular block away from the bending inclined plate is fixedly connected with a No. 2 movable frame by a fixed tube, the top of the No. 2 movable frame is fixedly connected with a square plate, the top of the square plate is fixedly connected with a No. 2 sticking plate, the bottom of the No. 2 movable frame is slidingly adapted with a sticking rail, the sticking rail is fixedly connected to the outer side of the fixed slide rail, the inside of the sticking rail is fixedly connected with a No. 2 magnet, the end of the No. 2 magnet away from the sticking rail is provided with a No. 1 magnet, and the No. 1 magnet is fixedly connected to the outer side of the No. 2 movable frame.

[0012] Preferably, the adjustment mechanism includes a curved rod, which is fixedly connected to the bottom of the No. 1 moving frame, and the end of the curved rod away from the No. 1 moving frame is fixedly connected to a compensation rod, and the end of the compensation rod away from the curved rod is extruded and adapted with a seesaw, and the internal rotation of the seesaw is connected to the No. 1 rotating shaft, and the two ends of the No. 1 rotating shaft are symmetrically connected to the No. 1 support, and the No. 1 support is fixedly connected to the bottom of the fixed slide rail.

[0013] Preferably, an elastic strip is fixedly connected to the top of the seesaw, and the elastic strip is fixedly connected to the bottom of the fixed slide rail. A No. 2 support is provided beside the elastic strip, and the No. 2 support is fixedly connected to the seesaw, and a No. 2 rotating shaft is fixedly connected inside the No. 2 support, and a sleeve rod is rotatably connected to the outer side of the No. 2 rotating shaft, and an external plate is fixedly connected to the end of the sleeve rod away from the No. 2 rotating shaft, and the external plate is slidably adapted inside the fixed slide rail.

[0014] A method for using an automated carrier board for integrated circuit chip testing comprises the following steps: Step 1: The carrier plate is limited by moving the bottom inclined rod downward and squeezing the inclined surface block, and the interlaced rod connected to the other end of the inclined surface block will move toward the center with the elastic pressure head. At this time, the other end of the elastic pressure head will limit the periphery of the carrier plate. Therefore, the downward squeezing of the top pressure plate and the end squeezing of the elastic pressure head will limit the automatic carrier plate in all directions. Step 2: Preliminary positioning: the No. 1 mounting plate fixedly connected to the other end of the inner connecting rod will be moved to the edge of the slot where the chip is to be installed, and the horizontal plate connected to the No. 1 mounting plate through the vertical plate will be attached to the edge of the slot, thereby positioning one edge of the chip where it is to be installed; Step 3: After being fully positioned, the impacted triangle block will carry the No. 2 moving frame and move inward along the track. Then the square plate connected to the other side of the No. 2 moving frame will carry the No. 2 sticking plate to the edge of the slot where the chip is installed, thereby positioning the second edge of the chip where it needs to be installed, preparing for the subsequent chip installation.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The through rod connected to the other end of the inclined block will move the elastic pressure head toward the center. At this time, the other end of the elastic pressure head will limit and squeeze the periphery of the carrier. Therefore, the downward extrusion of the top pressure plate and the end extrusion of the elastic pressure head will play a role in all-round limiting and fixing of the automated carrier.

[0016] 2. The rod sleeve fixedly connected to the top of the top block will move toward the center with the inner rod, and the No. 1 plate fixedly connected to the other end of the inner rod will move to the edge of the slot where the chip needs to be installed. At the same time, the horizontal plate connected to the No. 1 plate through the vertical plate will be attached to the edge of the slot, thereby positioning one edge of the chip where it needs to be installed, preparing for the subsequent installation of the chip.

[0017] 3. The square plate connected to the other side of the No. 2 mobile frame will move the No. 2 mounting plate to the edge of the slot where the chip is installed, thereby positioning the second edge of the chip where it needs to be installed, preparing for the subsequent chip installation.

[0018] 4. The top of the external board is connected to another set of mounting components, and there are two mounting components. Therefore, the operation of the internal components of the two mounting components will position the third edge of the chip where it needs to be installed, preparing for the subsequent installation of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The figure is a schematic diagram of the external structure of an automated carrier board for integrated circuit chip testing according to the present invention.

[0020] Figure 2 It is a schematic cross-sectional structural diagram of the present invention as a whole.

[0021] Figure 3 It is a structural schematic diagram of the limiting mechanism of the present invention.

[0022] Figure 4 It is a schematic diagram of the overall cross-sectional structure of the limiting mechanism of the present invention.

[0023] Figure 5 It is a schematic side view of the limiting mechanism of the present invention.

[0024] Figure 6 It is a front view structural schematic diagram of the mounting mechanism of the present invention.

[0025] Figure 7 It is a bottom view structural schematic diagram of the mounting mechanism of the present invention.

[0026] Figure 8 It is a structural schematic diagram of the installation assembly of the present invention.

[0027] Fig. 9 It is a schematic diagram of the full cross-section structure of the installation component of the present invention.

[0028] Fig.10 It is a schematic diagram of the side structure of the installation assembly of the present invention.

[0029] Fig.11 It is a schematic cross-sectional view of some components of the installation assembly of the present invention.

[0030] Fig.12 It is a structural schematic diagram of the adjustment mechanism of the present invention.

[0031] Fig.13 It is a schematic diagram of the full cross-section structure of the adjustment mechanism of the present invention.

[0032] Fig.14 For the present invention Fig.13 Schematic diagram of the enlarged structure at point A in the middle.

[0033] In the figure: 1, support frame; 2, symmetrical plate; 3, fixed slide rail; 4, limit mechanism; 5, installation mechanism; 6, adjustment mechanism; 41, placement table; 42, carrier plate; 43, slide groove; 44, electric push rod; 45, slide bar; 46, top pressure plate; 47, bottom inclined rod; 48, inclined surface block; 49, interlaced rod; 40, elastic pressure head; 401, connecting rod; 402, side plate; 403, return spring; 51, external connecting frame; 52, extension rod; 53, hydraulic rod; 54, chip frame; 55, installation assembly; 551, No. 1 mobile frame; 552, flat plate; 553, U shaped plate; 554, top block; 555, rod sleeve; 556, inner connecting rod; 557, No. 1 sticking plate; 558, vertical plate; 559, horizontal plate; 550, bent inclined plate; 5501, triangular block; 5502, No. 2 moving frame; 5503, sticking track; 5504, No. 1 magnet; 5505, No. 2 magnet; 5506, square plate; 5507, No. 2 sticking plate; 61, curved rod; 62, compensation rod; 63, seesaw; 64, No. 1 rotating shaft; 65, No. 1 support; 66, elastic strip; 67, No. 2 support; 68, No. 2 rotating shaft; 69, sleeve rod; 60, external connecting plate. DETAILED DESCRIPTION

[0034] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment. It should be noted that the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] See also Figures 1 to 14 The present invention provides a technical solution: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, it includes a limiting mechanism 4, which is used for limiting and fixing the automated carrier; A mounting mechanism 5, which is used for mounting the chip and the automated carrier; The bottom of the limiting mechanism 4 is fixedly mounted with a symmetrical plate 2 and a fixed slide rail 3, and the bottom of the symmetrical plate 2 and the fixed slide rail 3 is fixedly mounted with a support frame 1. The mounting mechanism 5 is arranged above the limiting mechanism 4, and the bottom of the limiting mechanism 4 is provided with an adjustment mechanism 6.

[0036] The limiting mechanism 4 includes a placing table 41, the bottom of the placing table 41 is fixedly connected to the symmetrical plate 2 and the fixed slide rail 3 respectively, a carrier plate 42 is arranged at the center position of the top of the placing table 41, a slide groove 43 is opened on the inner side of the placing table 41, the inner sliding adaptor of the slide groove 43 is equipped with a slide bar 45, an electric push rod 44 is fixedly installed on the top of the slide bar 45, the top of the electric push rod 44 is fixedly connected to the top of the slide groove 43, the end of the slide bar 45 away from the slide groove 43 is fixedly connected to a top pressure plate 46, the bottom of the top pressure plate 46 is extruded and adapted to the top of the carrier plate 42, the inner end of the top pressure plate 46 is fixedly connected to a connecting rod 401, the end of the slide bar 45 close to the slide groove 43 is fixedly connected to a bottom oblique rod 47, the bottom oblique rod 47 is slidably adapted in the interior of the slide groove 43, and the bottom of the bottom oblique rod 47 is extruded and adapted to the inclined surface block 4 8. Both ends of the inclined plane block 48 are symmetrically connected with the side plates 402, and the inner side of the side plates 402 is fixedly connected with a return spring 403, wherein both ends of the inclined plane block 48 are symmetrically connected with the side plates 402, and the side plates 402 are connected to the placing table 41 through the return spring 403. At this time, the return spring 403 plays a role in restoring the inclined plane block 48 when it is not squeezed by the bottom inclined rod 47. One end of the return spring 403 away from the side plate 402 is fixedly connected to the outer side of the placing table 41, and one end of the inclined plane block 48 away from the bottom inclined rod 47 is fixedly connected with an insertion rod 49. The insertion rod 49 is inserted into the outer side of the placing table 41 and extends to the inner side thereof. One end of the insertion rod 49 away from the inclined plane block 48 is fixedly connected with an elastic pressure head 40, and one end of the elastic pressure head 40 away from the insertion rod 49 is squeezed and adapted to the carrier plate 42. By placing the carrier 42 at the center of the top of the placement table 41, where the carrier 42 is the automated carrier, and then starting the electric push rod 44, the slide bar 45 connected to its telescopic end will move downward along the slide groove 43, and the top pressure plate 46 connected to the outer end of the slide bar 45 will squeeze and limit the top of the edge of the carrier 42. In addition, along with the downward movement of the slide bar 45, the bottom oblique rod 47 connected to the inner end will move downward and squeeze the inclined surface block 48, wherein the contact surfaces between the bottom oblique rod 47 and the inclined surface block 48 are both inclined surfaces, and the interlaced rod 49 connected to the other end of the inclined surface block 48 will move toward the center with the elastic pressure head 40. At this time, the other end of the elastic pressure head 40 will limit and squeeze the periphery of the carrier 42. Therefore, the downward squeezing of the top pressure plate 46 and the end surface squeezing of the elastic pressure head 40 play a role in all-round limiting and fixing of the automated carrier.

[0037] like Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.11As shown, the mounting mechanism 5 includes an external connecting frame 51, which is fixedly connected to the outside of the support frame 1, and an extension rod 52 is fixedly connected to one end of the external connecting frame 51 away from the support frame 1, and a hydraulic rod 53 is fixedly connected to one end of the extension rod 52 away from the external connecting frame 51, and a chip frame 54 is fixedly connected to the bottom of the hydraulic rod 53, wherein the chip frame 54 is used to place the chip, and finally the chip is placed in the chip frame 54 and clamped, and then the hydraulic rod 53 is started, so that the chip frame 54 connected to the bottom end thereof will move downward along the No. 1 paste board 557 and the No. 2 paste board 5507 respectively, and be inserted into the slot of the automation carrier.

[0038] The mounting assembly 55 comprises a No. 1 movable frame 551, which is slidably adapted inside the fixed slide rail 3; a flat plate 552 is fixedly connected to the top of the No. 1 movable frame 551; a U-shaped plate 553 is fixedly connected to the end of the flat plate 552 away from the No. 1 movable frame 551; a top block 554 is slidably adapted to the top of the flat plate 552; a rod sleeve 555 is fixedly connected to the top of the top block 554; an inner connecting rod 556 is fixedly connected to the inner side of the rod sleeve 555; the inner connecting rod 556 is inserted through the outer side of the U-shaped plate 553 and extends to the inner side thereof; an end of the inner connecting rod 556 away from the rod sleeve 555 is fixedly connected to a No. 1 pasting plate 557; a vertical plate 558 is fixedly connected to the bottom of the No. 1 pasting plate 557; a horizontal plate 559 is fixedly connected to the inner side of the vertical plate 558. By moving the No. 1 moving frame 551 inward along the fixed slide rail 3, the flat plate 552 fixedly connected to the top of the No. 1 moving frame 551 will move toward the center with the U-shaped plate 553, and then the top block 554 will be manually pushed inward, so that the rod sleeve 555 fixedly connected to the top of the top block 554 will move toward the center with the inner rod 556, wherein the inner rod 556 is inserted into the U-shaped plate 553, and the No. 1 sticking plate 557 fixedly connected to the other end of the inner rod 556 will move to the edge of the slot where the chip needs to be installed, and at the same time, the horizontal plate 559 connected to the No. 1 sticking plate 557 through the vertical plate 558 will be attached to the edge of the slot, thereby locating an edge of the chip where it needs to be installed, and preparing for the subsequent chip installation.

[0039] The outer side of the No. 1 moving frame 551 is fixedly connected with a bending inclined plate 550, and the end of the bending inclined plate 550 away from the No. 1 moving frame 551 is squeezed and adapted with a triangular block 5501, and the end of the triangular block 5501 away from the bending inclined plate 550 is fixedly connected with a No. 2 moving frame 5502, and the top of the No. 2 moving frame 5502 is fixedly connected with a square plate 5506, and the top of the square plate 5506 is fixedly connected with a No. 2 sticking plate 5507, and the bottom of the No. 2 moving frame 5502 is slidably adapted with a sticking rail 5503, and the sticking rail 5503 is fixedly connected to the outer side of the fixed slide rail 3, and the inside of the sticking rail 5503 is fixedly connected with a No. 2 magnet 5505, and the end of the No. 2 magnet 5505 away from the sticking rail 5503 is provided with a No. 1 magnet 5504, and the No. 1 magnet 5504 is fixedly connected to the outer side of the No. 2 moving frame 5502. In addition, as the first moving frame 551 moves toward the center, the bending inclined plate 550 fixedly connected to the outside thereof will move toward the center and impact the triangular block 5501, wherein the contact surfaces between the bending inclined plate 550 and the triangular block 5501 are both inclined surfaces, and the impacted triangular block 5501 will carry the second moving frame 5502 and move inward along the track 5503, wherein the track 5503 is fixedly connected with the second magnet 5505, and the second moving frame 55 02 is fixedly connected with No. 1 magnet 5504, and there is magnetic attraction between No. 1 magnet 5504 and No. 2 magnet 5505, so the two magnets play a role in resetting No. 2 mobile frame 5502 and triangular block 5501, and then the square plate 5506 connected to the other side of No. 2 mobile frame 5502 will move with No. 2 paste plate 5507 to the edge of the slot for installing the chip, thereby locating the second edge of the chip where it needs to be installed, preparing for the subsequent installation of the chip.

[0040] like Fig.12 , Fig.13 and Fig.14As shown, the adjustment mechanism 6 includes a curved rod 61, which is fixedly connected to the bottom of the No. 1 moving frame 551, and the end of the curved rod 61 away from the No. 1 moving frame 551 is fixedly connected to a compensation rod 62, and the end of the compensation rod 62 away from the curved rod 61 is pressed and adapted with a seesaw 63, and the inner rotation of the seesaw 63 is connected to a No. 1 rotating shaft 64, and the two ends of the No. 1 rotating shaft 64 are symmetrically connected to a No. 1 support 65, and the No. 1 support 65 is fixedly connected to the bottom of the fixed slide rail 3, and the top of the seesaw 63 is fixedly connected There is an elastic strip 66, which is fixedly connected to the bottom of the fixed slide rail 3. A second support 67 is arranged beside the elastic strip 66, and the second support 67 is fixedly connected to the seesaw 63. The second support 67 is fixedly connected to the second rotating shaft 68 inside, and the outer side of the second rotating shaft 68 is rotatably connected to a sleeve rod 69. The end of the sleeve rod 69 away from the second rotating shaft 68 is fixedly connected to an external plate 60. The external plate 60 is slidably adapted inside the fixed slide rail 3. As the first mobile frame 551 moves toward the center, The movement causes the curved rod 61 fixedly connected to its bottom to move inward with the compensation rod 62 connected to its other end, and hit the seesaw 63, and then the hit seesaw 63 will deflect clockwise through the first shaft 64, wherein the top of the seesaw 63 is connected to the elastic strip 66, and the function of the elastic strip 66 is to reset the seesaw 63, and the top of the seesaw 63 is also connected to the second support 67, and the center part of the second support 67 is rotatably connected to the sleeve rod 69 through the second shaft 68, so the sleeve rod 69 will move toward the center and drive the external plate 60 connected to its other end to move along the fixed slide rail 3 toward the center, wherein the top of the external plate 60 is connected to another group of mounting components 55, and the number of mounting components 55 is two, so the operation of the internal components of the two mounting components 55 will play a role in positioning the third edge of the chip where the chip needs to be installed, and prepare for the subsequent installation of the chip.

[0041] When the present invention is in use: first, place the carrier plate 42 on the center of the top of the placement table 41, and then start the electric push rod 44, so that the slide bar 45 connected to the telescopic end thereof will move downward along the slide groove 43, and the top pressure plate 46 connected to the other end of the slide bar 45 will squeeze and limit the top of the edge of the carrier plate 42. In addition, along with the downward movement of the slide bar 45, the bottom inclined rod 47 connected to the inner end will move downward and squeeze the inclined surface block 48, and the interlaced rod 49 connected to the other end of the inclined surface block 48 will move toward the center with the elastic pressure head 40, and at this time, the other end of the elastic pressure head 40 will limit and squeeze the periphery of the carrier plate 42.

[0042] By moving the No. 1 moving frame 551 inward along the fixed slide rail 3, the flat plate 552 fixedly connected to the top of the No. 1 moving frame 551 will move toward the center with the U-shaped plate 553, and then the top block 554 will be manually pushed inward, so that the rod sleeve 555 fixedly connected to the top of the top block 554 will move toward the center with the inner rod 556, and the No. 1 sticking plate 557 fixedly connected to the other end of the inner rod 556 will move to the edge of the slot where the chip needs to be installed, and at the same time, the horizontal plate 559 connected to the No. 1 sticking plate 557 through the vertical plate 558 will be attached to the edge of the slot. In addition, as the No. 1 moving frame 551 moves toward the center, the bent inclined plate 550 fixedly connected to its outer side will move toward the center and impact the triangular block 5501. The impacted triangular block 5501 will carry the No. 2 moving frame 5502 and move inward along the track 5503. Then, the square plate 5506 connected to the other side of the No. 2 moving frame 5502 will carry the No. 2 sticking plate 5507 to the edge of the slot for installing the chip.

[0043] As the No. 1 moving frame 551 moves toward the center, the curved rod 61 fixedly connected to its bottom will move inward with the compensation rod 62 connected to its other end, and hit the seesaw 63, and then the hit seesaw 63 will deflect clockwise through the No. 1 rotating shaft 64, and the top of the seesaw 63 is connected to the No. 2 support 67, and the center part of the No. 2 support 67 is rotatably connected to the sleeve rod 69 through the No. 2 rotating shaft 68, so the external plate 60 connected to the other end of the sleeve rod 69 will move toward the center along the fixed slide rail 3.

[0044] The above-mentioned embodiments are only preferred embodiments of the present invention, and cannot be used to limit the scope of protection of the present invention. Various changes made by ordinary technicians in this field based on the above-mentioned concepts without creative work all fall within the scope of protection of the present invention.

Claims

1. An automated carrier for integrated circuit chip testing, characterized in that: include: A limiting mechanism (4), the limiting mechanism (4) is used for limiting and fixing the automated carrier plate; A mounting mechanism (5), the mounting mechanism (5) being used for mounting the chip on an automated carrier board; A symmetrical plate (2) and a fixed slide rail (3) are fixedly mounted on the bottom of the limiting mechanism (4), respectively; a support frame (1) is fixedly mounted on the bottom of the symmetrical plate (2) and the fixed slide rail (3); the mounting mechanism (5) is arranged above the limiting mechanism (4); and an adjustment mechanism (6) is arranged at the bottom of the limiting mechanism (4); The limiting mechanism (4) comprises a placement platform (41), the bottom of the placement platform (41) is fixedly connected to the symmetrical plate (2) and the fixed slide rail (3) respectively, a carrier plate (42) is arranged at the center position of the top of the placement platform (41), a slide groove (43) is opened on the inner side of the placement platform (41), a slide bar (45) is provided inside the slide groove (43), an electric push rod (44) is fixedly installed on the top of the slide bar (45), and the top end of the electric push rod (44) is fixedly connected to the top of the slide groove (43); One end of the slide bar (45) away from the slide groove (43) is fixedly connected to a top pressure plate (46), the bottom of the top pressure plate (46) is squeezed and adapted to the top of the carrier plate (42), and the inner end of the top pressure plate (46) is fixedly connected to a connecting rod (401).

2. The automated carrier for integrated circuit chip testing according to claim 1, characterized in that: One end of the slide bar (45) close to the slide groove (43) is fixedly connected to a bottom oblique rod (47), and the bottom oblique rod (47) is slidably adapted inside the slide groove (43). The bottom of the bottom oblique rod (47) is extruded and adapted with an inclined block (48), and both ends of the inclined block (48) are symmetrically connected to side plates (402). The inner side of the side plate (402) is fixedly connected to a return spring (403), and one end of the return spring (403) away from the side plate (402) is fixedly connected to the outer side of the placement table (41).

3. The automated carrier for integrated circuit chip testing according to claim 2, characterized in that: One end of the inclined surface block (48) away from the bottom inclined rod (47) is fixedly connected to an insertion rod (49), the insertion rod (49) is inserted into the outer side of the placement table (41) and extends to the inner side thereof, and one end of the insertion rod (49) away from the inclined surface block (48) is fixedly connected to an elastic pressing head (40), and one end of the elastic pressing head (40) away from the insertion rod (49) is pressed and adapted to the carrier plate (42).

4. The automated carrier for integrated circuit chip testing according to claim 1, characterized in that: The mounting mechanism (5) comprises an external connecting frame (51), wherein the external connecting frame (51) is fixedly connected to the outside of the support frame (1), an end of the external connecting frame (51) away from the support frame (1) is fixedly connected to an extension rod (52), an end of the extension rod (52) away from the external connecting frame (51) is fixedly connected to a hydraulic rod (53), and the bottom of the hydraulic rod (53) is fixedly connected to a chip frame (54), wherein the chip frame (54) is used to place chips.

5. The automated carrier for integrated circuit chip testing according to claim 4, characterized in that: The mounting assembly (55) comprises a first movable frame (551), the first movable frame (551) being slidably adapted inside the fixed slide rail (3), the top of the first movable frame (551) being fixedly connected to a flat plate (552), and an end of the flat plate (552) away from the first movable frame (551) being fixedly connected to a U-shaped plate (553).

6. The automated carrier for integrated circuit chip testing according to claim 5, characterized in that: The top of the flat plate (552) is slidably adapted to be equipped with a top block (554); the top of the top block (554) is fixedly connected to a rod sleeve (555); the inner side of the rod sleeve (555) is fixedly connected to an inner connecting rod (556); the inner connecting rod (556) is inserted through the outer side of the U-shaped plate (553) and extends to the inner side thereof; one end of the inner connecting rod (556) away from the rod sleeve (555) is fixedly connected to a first sticking plate (557); the bottom of the first sticking plate (557) is fixedly connected to a vertical plate (558); the inner side of the vertical plate (558) is fixedly connected to a horizontal plate (559).

7. The automated carrier for integrated circuit chip testing according to claim 5, characterized in that: The outer side of the first moving frame (551) is fixedly connected to a bending inclined plate (550); one end of the bending inclined plate (550) away from the first moving frame (551) is extruded and adapted with a triangular block (5501); one end of the triangular block (5501) away from the bending inclined plate (550) is fixedly connected to a second moving frame (5502); the top of the second moving frame (5502) is fixedly connected to a square plate (5506); the top of the square plate (5506) is fixedly connected to the second moving frame (5502); The sticking plate (5507) is slidingly adapted to be provided with a sticking rail (5503) at the bottom of the second movable frame (5502); the sticking rail (5503) is fixedly connected to the outside of the fixed slide rail (3); the inside of the sticking rail (5503) is fixedly connected to a second magnet (5505); a first magnet (5504) is provided at one end of the second magnet (5505) away from the sticking rail (5503); the first magnet (5504) is fixedly connected to the outside of the second movable frame (5502).

8. The automated carrier for integrated circuit chip testing according to claim 1, characterized in that: The adjustment mechanism (6) comprises a curved rod (61), the curved rod (61) being fixedly connected to the bottom of a No. 1 moving frame (551), one end of the curved rod (61) away from the No. 1 moving frame (551) being fixedly connected to a compensation rod (62), one end of the compensation rod (62) away from the curved rod (61) being pressed and adapted to be provided with a seesaw (63), the inside of the seesaw (63) being rotatably connected to a No. 1 rotating shaft (64), two ends of the No. 1 rotating shaft (64) being symmetrically connected to a No. 1 support (65), and the No. 1 support (65) being fixedly connected to the bottom of the fixed slide rail (3).

9. The automated carrier for integrated circuit chip testing according to claim 8, characterized in that: The top of the seesaw (63) is fixedly connected to an elastic strip (66), and the elastic strip (66) is fixedly connected to the bottom of the fixed slide rail (3). A second support (67) is arranged on the side of the elastic strip (66), and the second support (67) is fixedly connected to the seesaw (63). The interior of the second support (67) is fixedly connected to a second rotating shaft (68), and the outer side of the second rotating shaft (68) is rotatably connected to a sleeve rod (69), and the end of the sleeve rod (69) away from the second rotating shaft (68) is fixedly connected to an external plate (60), and the external plate (60) is slidably adapted inside the fixed slide rail (3).

10. A method for using an automated carrier for integrated circuit chip testing, used for the automated carrier for integrated circuit chip testing according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: The carrier plate is limited by moving the bottom inclined rod (47) downward and squeezing the inclined surface block (48), and the interlaced rod (49) connected to the other end of the inclined surface block (48) will move toward the center with the elastic pressing head (40), and then the other end of the elastic pressing head (40) will perform a limiting squeezing process on the periphery of the carrier plate (42), so that the downward squeezing of the top pressing plate (46) and the end squeezing of the elastic pressing head (40) will limit the automatic carrier plate in all directions; Step 2: Preliminary positioning, the No. 1 pasting plate (557) fixedly connected to the other end of the inner connecting rod (556) will be moved to the edge of the slot where the chip is to be installed, and at the same time, the horizontal plate (559) connected to the No. 1 pasting plate (557) through the vertical plate (558) will be attached to the edge of the slot, thereby positioning one edge of the chip where it is to be installed; Step 3: After being completely positioned, the impacted triangular block (5501) will carry the No. 2 mobile frame (5502) and move inward along the track (5503), and then the square plate (5506) connected to the other side of the No. 2 mobile frame (5502) will carry the No. 2 sticking plate (5507) to the edge of the slot where the chip is installed, thereby positioning the second edge of the chip where it needs to be installed, preparing for the subsequent installation of the chip.

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