High-speed camera with efficient heat dissipation
Through the combination of liquid-cooled pipeline and micropump, the vibration error and volume problems caused by fan heat dissipation in high-speed cameras are solved, and the efficient and vibration-free heat dissipation effect is achieved, which improves the camera's accuracy and heat dissipation efficiency.
Patent Information
- Application Number
- CN202411386503.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2024-12-20
AI Technical Summary
The cooling methods of existing high-speed cameras rely on fans, resulting in vibration errors and volume increase, affecting high-precision visual inspection and positioning work.
Liquid-cooled pipes and micropumps are used instead of fans, and heat is transmitted to the radiator through liquid to dissipate heat, and heat dissipation fins and fans are installed on the radiator to improve heat dissipation efficiency.
It realizes efficient heat dissipation without vibration, improves the accuracy and heat dissipation efficiency of high-speed cameras, and reduces energy consumption.
Smart Images
Figure CN119165710A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a high-speed camera with efficient heat dissipation. Background Art
[0002] Visual inspection is a method of object detection using computer vision technology; it detects, identifies and locates objects by analyzing their three-dimensional shape, size, position and other features. The principles of 3D visual inspection mainly include three-dimensional reconstruction, feature extraction and matching, target detection and positioning, etc.
[0003] Visual inspection relies on high-speed cameras and places high demands on their performance. When the performance is improved, the chip of the high-speed camera will generate a lot of heat. The existing high-speed camera heat dissipation method is to use fans, but fan heat dissipation will cause vibration. In high-precision visual inspection and positioning work, slight vibration will cause large errors. At the same time, the fan is large in size, which will increase the size of the high-speed camera. Summary of the invention
[0004] The purpose of the present invention is to provide a high-speed camera with efficient heat dissipation, aiming to solve the technical problem in the above-mentioned prior art that "the heat dissipation means of the high-speed camera is through fans, but the heat dissipation of the fans will produce vibrations. In high-precision visual inspection and positioning work, slight vibrations will produce large errors. At the same time, the fan is large in size, which will increase the size of the high-speed camera."
[0005] To achieve the above-mentioned purpose, an embodiment of the present invention provides a high-speed camera with efficient heat dissipation, comprising a shell; a camera module is provided on the shell, a cavity is provided in the shell, and a chip is provided in the cavity; the chip is electrically connected to the camera module, a heat dissipation component is provided on the chip, and the heat dissipation component is used to dissipate heat from the chip; the heat dissipation component comprises a liquid cooling plate; the liquid cooling plate is in contact with the chip, a radiator is further provided on the shell, and the radiator and the liquid cooling plate are connected through a liquid cooling pipeline; micro temperature sensors are provided in the radiator and the liquid cooling plate, a main control board is further provided inside the shell, a main control module is provided on the main control board, the main control module is connected to the micro temperature sensor signal, and the liquid cooling pipeline comprises a micro pump; the main control module is connected to the micro pump signal.
[0006] Optionally, the liquid cooling circuit also includes a first liquid cooling tube and a second liquid cooling tube; one end of the first liquid cooling tube is connected to the radiator, and the other end is connected to the micro pump, one end of the second liquid cooling tube is connected to the radiator, and the other end is connected to the liquid cooling plate, and the liquid cooling plate is connected to the micro pump through a third liquid cooling tube.
[0007] Optionally, a heat dissipation cavity is provided in the radiator, the first liquid cooling tube and the second liquid cooling tube are connected to the heat dissipation cavity, a liquid cooling cavity is provided in the liquid cooling plate, and the second liquid cooling tube and the third liquid cooling tube are connected to the liquid cooling cavity.
[0008] Optionally, the heat dissipation cavity includes a curved heat dissipation channel; the first liquid cooling tube and the second liquid cooling tube are respectively connected to two ends of the heat dissipation channel, and the heat dissipation channel covers the radiator.
[0009] Optionally, a plurality of heat dissipation fins are arranged on the radiator, each heat dissipation fin array is arranged on the radiator, and each heat dissipation fin is arranged in the same direction.
[0010] Optionally, the heat dissipation assembly further includes a fan, which is disposed on the radiator and is used to dissipate heat and cool the radiator.
[0011] Optionally, the radiator is provided with a plurality of connection blocks, and the fan is fixedly connected to the radiator via the plurality of connection blocks.
[0012] Optionally, a sealing ring is further provided at the connection between the camera module and the housing, and the sealing ring is used to increase the sealing performance.
[0013] Optionally, a heat dissipation mesh is also provided on the shell.
[0014] Compared with the prior art, the above one or more technical solutions in the high-speed camera with efficient heat dissipation provided by the embodiment of the present invention have at least one of the following technical effects:
[0015] By setting up a liquid cooling pipeline to replace the traditional fan, the heat is transferred to the radiator by liquid for heat dissipation, without vibration, which improves the accuracy of the high-speed camera. Compared with the fan, the heat dissipation efficiency is also higher.
[0016] By setting up a micro pump, the heat dissipation material can be circulated, and the flowing heat dissipation material can continuously take away the heat transferred from the electronic products to the heat dissipation body, thereby increasing the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0018] Figure 1 It is a schematic diagram of the structure of the present invention.
[0019] Figure 2It is a structural schematic diagram of another angle of the present invention.
[0020] Figure 3 It is a partial structural schematic diagram of the present invention.
[0021] Figure 4 It is a schematic diagram of a partial structure from another angle of the present invention.
[0022] Figure 5 It is a schematic diagram of the module of the present invention.
[0023] Figure 6 Schematic diagram of the cross-sectional structure of the radiator.
[0024] Among them, the reference numerals in the figure are:
[0025] 100, housing; 110, cavity; 111, heat dissipation mesh; 120, chip; 130, liquid cooling plate; 140, radiator; 141, heat dissipation cavity; 142, heat dissipation channel; 143, heat dissipation fins; 150, liquid cooling pipeline; 151, micro pump; 152, first liquid cooling pipe; 153, second liquid cooling pipe; 154, third liquid cooling pipe; 160, micro temperature sensor; 170, main control board; 171, main control module; 180, fan; 190, connection block;
[0026] 200, camera module;
[0027] 300. Sealing ring. DETAILED DESCRIPTION
[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.
[0029] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0031] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.
[0032] In one embodiment, according to Figure 1-6 As shown, a high-speed camera with efficient heat dissipation includes a housing 100; a camera module 200 is provided on the housing 100, a cavity 110 is provided in the housing 100, and a chip 120 is provided in the cavity 110; the chip 120 is electrically connected to the camera module 200, and a heat dissipation component is provided on the chip 120, and the heat dissipation component is used to dissipate heat from the chip 120; the heat dissipation component includes a liquid cooling plate 130; the liquid cooling plate 130 is in contact with the chip 120, and a radiator 140 is further provided on the housing 100, and the radiator 140 and the liquid cooling plate 130 are connected through a liquid cooling pipeline 150; a micro temperature sensor 160 is provided in both the radiator 140 and the liquid cooling plate 130, and a main control board 170 is further provided inside the housing 100, and a main control module 171 is provided on the main control board 170, and the main control module 171 is connected to the micro temperature sensor 160 by signal, and the liquid cooling pipeline 150 includes a micro pump 151; the main control module 171 is connected to the micro pump 151 by signal.
[0033] Specifically, when the high-speed camera is working under overload, the chip 120 will generate heat. The liquid cooling plate 130 will contact the chip 120 first, so that the heat of the chip 120 is transferred to the liquid cooling plate 130, and then the heat is transferred to the radiator 140 by liquid through the liquid cooling pipeline 150 for heat dissipation. At the same time, a main control module 171 is provided, which is responsible for the control logic of the entire system, realizes the intelligent control of the system, and ensures the stable operation and efficient operation of the system. When the temperature of the chip 120 is low, the micro pump 151 can be turned off, and the liquid cooling plate 130 is used for heat dissipation. When the temperature of the chip 120 is high, the micro pump 151 is controlled to be turned on, and the liquid is circulated for heat dissipation, so as to reasonably coordinate resources and avoid waste of resources.
[0034] Specifically, by providing a liquid cooling circuit 150 to replace the traditional fan 180, the heat is transferred to the radiator 140 by liquid for heat dissipation without vibration, thereby improving the accuracy of the high-speed camera. Compared with the fan 180, the heat dissipation efficiency is also higher. At the same time, the micro pump 151 can be switched on and off according to the temperature of the chip 120 to achieve intelligent temperature control and lower energy consumption.
[0035] Furthermore, the heat dissipating liquid may be a heat dissipating substance such as pure water, an alcohol-water mixture, a fluorinated liquid, and the like.
[0036] Furthermore, after the micro pump 151 is turned on, the heat dissipation liquid is completely flowing, and the flowing heat dissipation liquid can continuously take away the heat transferred from the chip 120 to the liquid cooling plate 130, preventing the temperature of the local area from rising. Static liquid can easily form a temperature gradient, and the overall heat exchange capacity is not as good as that of flowing liquid. It can be seen that after the micro pump 151 is turned on, the heat dissipation effect is better and the efficiency is higher.
[0037] In another embodiment, according to Figure 3 and 4 As shown, the liquid cooling pipeline 150 also includes a first liquid cooling pipe 152 and a second liquid cooling pipe 153; one end of the first liquid cooling pipe 152 is connected to the radiator 140, and the other end is connected to the micro pump 151, one end of the second liquid cooling pipe 153 is connected to the radiator 140, and the other end is connected to the liquid cooling plate 130, and the liquid cooling plate 130 is connected to the micro pump 151 through the third liquid cooling pipe 154. A heat dissipation cavity 141 is provided in the radiator 140, the first liquid cooling pipe 152 and the second liquid cooling pipe 153 are connected to the heat dissipation cavity 141, a liquid cooling cavity is provided in the liquid cooling plate 130, and the second liquid cooling pipe 153 and the third liquid cooling pipe 154 are connected to the liquid cooling cavity.
[0038] Specifically, the micro pump 151 , the radiator 140 and the liquid cooling plate 130 are interconnected through the first liquid cooling tube 152 , the second liquid cooling tube 153 and the third liquid cooling tube 154 , so that liquid can flow therein to dissipate heat, thereby controlling the temperature of the chip 120 .
[0039] In another embodiment, according to Figure 3-6 As shown, the heat dissipation cavity 141 includes a curved heat dissipation channel 142; the first liquid cooling tube 152 and the second liquid cooling tube 153 are respectively connected to the two ends of the heat dissipation channel 142, and the heat dissipation channel 142 covers the radiator 140. A plurality of heat dissipation fins 143 are arranged on the radiator 140 in an array, and each heat dissipation fin 143 is arranged in the same direction. The heat dissipation assembly also includes a fan 180, which is arranged on the radiator 140 and is used to dissipate heat and cool the radiator 140.
[0040] Specifically, the heat dissipation channel 142 can interrupt the straight flow of the liquid, increase the tortuosity and turbulence intensity of the flow, which can effectively improve the convective heat transfer coefficient between the liquid and the heat dissipation surface, and also improve the convective heat transfer coefficient, thereby enhancing the heat dissipation effect and increasing the heat dissipation efficiency. At the same time, the heat dissipation channel 142 covers most of the area of the heat dissipation cavity 141, which can increase the utilization rate and better the heat dissipation efficiency.
[0041] Furthermore, by providing the heat dissipation fins 143 to increase the heat dissipation area, the heat of the heat dissipation channel 142 is transferred to the heat dissipation fins 143 to dissipate heat to the outside. Each heat dissipation fin 143 is provided in the same direction to form a uniform gap, and the fan 180 blows air to it, which will take away the heat from the gap without blocking the wind.
[0042] In another embodiment, according to Figure 1-4 As shown, the radiator 140 is provided with a plurality of connection blocks 190, and the fan 180 is fixedly connected to the radiator 140 through the plurality of connection blocks 190. Specifically, the height of the connection block 190 is substantially consistent with the heat dissipation fin 143, and the fan 180 can be arranged on the heat dissipation fin 143 through the connection block 190 to blow air toward the heat dissipation fin 143 for heat dissipation.
[0043] In another embodiment, according to Figure 3 and 4 As shown, a sealing ring 300 is further provided at the connection between the camera module 200 and the housing 100, and the sealing ring 300 is used to increase the sealing performance.
[0044] In another embodiment, according to Figure 1 and 2 As shown, the housing 100 is further provided with heat dissipation mesh holes 111 . Specifically, the heat dissipation holes are used for the heat generating unit in the housing 100 to dissipate heat to the outside.
[0045] The above content is a further detailed description of the present invention in combination with specific preferred implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, its architecture can be flexible and can derive a series of products. Just making a few simple deductions or substitutions should be regarded as belonging to the scope of patent protection of the present invention determined by the submitted claims.
Claims
1. A high-speed camera with efficient heat dissipation, characterized in that: It comprises a shell; a camera module is arranged on the shell, a cavity is arranged in the shell, a chip is arranged in the cavity; the chip is electrically connected to the camera module, a heat dissipation component is arranged on the chip, the heat dissipation component is used to dissipate heat from the chip; the heat dissipation component comprises a liquid cooling plate; the liquid cooling plate is in contact with the chip, a radiator is also arranged on the shell, the radiator and the liquid cooling plate are connected via a liquid cooling pipeline; micro temperature sensors are arranged in the radiator and the liquid cooling plate, a main control board is also arranged inside the shell, a main control board is arranged on the main control board, the main control board is provided with a main control module, the main control module is connected to the micro temperature sensor signal, the liquid cooling pipeline comprises a micro pump; the main control module is connected to the micro pump signal.
2. The high-speed camera with efficient heat dissipation according to claim 1, characterized in that: The liquid cooling circuit also includes a first liquid cooling tube and a second liquid cooling tube; one end of the first liquid cooling tube is connected to the radiator, and the other end is connected to the micro pump; one end of the second liquid cooling tube is connected to the radiator, and the other end is connected to the liquid cooling plate; the liquid cooling plate is connected to the micro pump via a third liquid cooling tube.
3. The high-speed camera with efficient heat dissipation according to claim 2, characterized in that: The radiator is provided with a heat dissipation cavity, the first liquid cooling tube and the second liquid cooling tube are connected to the heat dissipation cavity, the liquid cooling plate is provided with a liquid cooling cavity, the second liquid cooling tube and the third liquid cooling tube are connected to the liquid cooling cavity.
4. The high-speed camera with efficient heat dissipation according to claim 3, characterized in that: The heat dissipation cavity includes a curved heat dissipation channel; the first liquid cooling tube and the second liquid cooling tube are respectively connected to two ends of the heat dissipation channel, and the heat dissipation channel covers the radiator.
5. The high-speed camera with efficient heat dissipation according to claim 4, characterized in that: A plurality of heat dissipation fins are arranged on the radiator, each heat dissipation fin array is arranged on the radiator, and each heat dissipation fin is arranged in the same direction.
6. The high-speed camera with efficient heat dissipation according to claim 1, characterized in that: The heat dissipation component also includes a fan, which is arranged on the radiator and is used to dissipate heat and cool the radiator.
7. The high-speed camera with efficient heat dissipation according to claim 6, characterized in that: The radiator is provided with a plurality of connection blocks, and the fan is fixedly connected to the radiator through the plurality of connection blocks.
8. The high-speed camera with efficient heat dissipation according to claim 1, characterized in that: A sealing ring is also provided at the connection between the camera module and the shell, and the sealing ring is used to increase the sealing performance.
9. The high-speed camera with efficient heat dissipation according to any one of claims 1 to 8, characterized in that: The shell is also provided with heat dissipation mesh holes.