Driving circuit assembly for piezoelectric micropump

Abstract

The utility model relates to a driving circuit assembly for a piezoelectric micropump, which belongs to the technical field of fluid transmission device driving, solves the problems of large occupied space, low integration level and insufficient reliability in the prior art, and comprises an electrode plate, a driving circuit and a driving circuit, a through conductive through hole is formed in the valve body shell, and the conductive through hole is electrically connected with the electrode plate; the circuit substrate is provided with a power supply element, and the power supply element corresponds to the conductive through hole and is electrically connected with the conductive through hole; wherein the valve body shell and the circuit substrate have the same peripheral shape and size.

Description

Technical Field

[0001] The utility model relates to the technical field of fluid transmission device driving, in particular to a driving circuit component for a piezoelectric micro pump. Background Art

[0002] Piezoelectric micropumps have a wide range of applications in the fields of medical devices and semiconductor thermal management. They are suitable for applications in wearable and portable medical devices and ultra-thin micro-space heat dissipation management.

[0003] The driving circuit of the piezoelectric micropump has an important influence on the performance of the piezoelectric micropump. Its functions include: converting the DC or low-frequency AC provided by the external power supply into a high-frequency AC signal; providing sufficient voltage amplification to ensure that the piezoelectric element can produce the required displacement to drive the fluid flow in the micropump; generating a waveform suitable for the operation of the piezoelectric micropump. In summary, the driving circuit of the piezoelectric micropump is the basis for its function, ensuring the effective conversion and control of energy, so that the piezoelectric micropump can play an important role in precision applications such as micro-liquid manipulation, biomedical chips, and drug delivery.

[0004] At present, conventional piezoelectric micropumps are external separate drive circuit devices, which are usually large in size, resulting in a large space required for the application of piezoelectric micropumps, which is not conducive to integrated application in wearable devices (such as smart watches). In addition, conventional piezoelectric pumps are connected to separate drive circuit devices through cables, and such connecting cables often introduce signal interference or attenuation, affecting the accuracy and efficiency of the drive signal. In addition, external cables are easily damaged or accidentally disconnected, affecting the overall stability and reliability of the system. Utility Model Content

[0005] In order to solve the above-mentioned problems, the utility model provides a driving circuit assembly for a piezoelectric micropump, which integrates the driving circuit on a circuit substrate, and then connects the electrode plate through a driving element through a driving through hole, and connects the piezoelectric element through the electrode plate to drive the piezoelectric element, which not only reduces the overall volume and area of ​​the piezoelectric micropump, but also makes the piezoelectric micropump more stable.

[0006] According to an embodiment of the present utility model, a driving circuit assembly for a piezoelectric micropump is provided, comprising:

[0007] an electrode plate having a cantilever extending inwardly;

[0008] A valve body shell having a conductive through hole formed therein, a conductive portion disposed in the conductive through hole, and the conductive portion is electrically connected to the electrode plate; and

[0009] A circuit substrate having a power supply element thereon, and the power supply element corresponds to the conductive through hole and is electrically connected to the conductive portion;

[0010] Wherein, the valve body shell and the circuit substrate have the same outer peripheral shape and size.

[0011] Optionally, the electrode plate includes two insulating strips, and a first electrode portion and a second electrode portion are separated by the insulating strips, wherein the cantilever extends inwardly from the first electrode portion.

[0012] Optionally, the electrode plate is in a rectangular frame shape, and two insulating strips are arranged on two adjacent sides of the electrode plate.

[0013] Optionally, at least two conductive through holes are formed in the valve body shell; wherein, at least two conductive through holes are arranged to be spaced apart from each other to ensure insulation from each other; wherein, at least two conductive through holes are arranged so that the first electrode portion and the second electrode portion of the electrode plate are respectively electrically connected to at least a conductive portion within one conductive through hole; and wherein the cross-sectional shape of the conductive through hole is circular, rectangular, elliptical or polygonal.

[0014] Optionally, the valve body housing has a side wall, two conductive through holes are formed in the side wall, and the conductive parts in the conductive through holes are electrically connected to the first electrode part and the second electrode part of the electrode plate respectively.

[0015] Optionally, the circuit substrate is a stacked structure, including a circuit layer, an insulating layer and a metal layer.

[0016] Optionally, the circuit substrate is a stacked structure, including a circuit layer, an insulating layer, a metal layer, an insulating layer and a circuit layer stacked and assembled in sequence from top to bottom, wherein the outer peripheral shapes and sizes of the above layers are consistent.

[0017] Optionally, the power supply element of the circuit substrate is composed of forming a substrate through hole at a position corresponding to the conductive through hole of the circuit substrate and the valve body shell, coating an insulating glue on the inner wall of the substrate through hole to form an insulating ring, and arranging a conductive core in the center of the insulating ring.

[0018] Optionally, a power supply control unit and a drive circuit are integrated on the circuit substrate.

[0019] Optionally, the valve body housing and the circuit substrate have a rectangular, circular, elliptical or polygonal outer peripheral shape and consistent size.

[0020] A driving circuit assembly for a piezoelectric micropump provided according to an embodiment of the utility model includes at least the following advantages:

[0021] 1. The valve body shell is used as the path for circuits and control signals. The drive circuit is directly connected to the electrode plate through the conductive through-holes of the valve body shell, which shortens the transmission path of power supply and control signals, reduces signal loss and interference, and improves the response speed and control accuracy of the pump.

[0022] 2. The entire drive circuit conduction structure does not require a separate cable connection, avoiding faults such as loosening and aging of external cables, and the system has higher stability and reliability.

[0023] 3. The driving circuit is integrated on the circuit substrate, connected to the electrode plate through the driving element and the conductive through-hole to drive the piezoelectric element and the entire piezoelectric pump. No independent driving circuit is required for additional connection. The overall area and volume are small, the integration is high, and it is suitable for high-precision micro-application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the implementation mode of the utility model or the technical solution in the prior art, the drawings required for use in the implementation mode will be briefly introduced below. The features and advantages of the utility model can be more clearly understood by referring to the drawings. The drawings are schematic and should not be understood as any limitation to the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 It is an exploded view of a driving circuit assembly for a piezoelectric micropump provided according to the first embodiment of the utility model.

[0026] Figure 2 It is a schematic diagram of applying a driving circuit assembly for a piezoelectric micropump provided in accordance with the first embodiment of the utility model to a piezoelectric micropump.

[0027] Figure 3 It is a partial cross-sectional view of a circuit substrate of a driving circuit assembly for a piezoelectric micropump provided according to a first embodiment of the utility model.

[0028] Figure 4 It is an exploded view of a driving circuit assembly for a piezoelectric micropump provided according to a second embodiment of the utility model.

[0029] Description of reference numerals:

[0030] 1.2 driving circuit components;

[0031] 10, 210 electrode plate;

[0032] 12 Cantilever;

[0033] 14 Insulation tape;

[0034] 16 a first electrode portion;

[0035] 18 a second electrode portion;

[0036] 20, 220 valve body housing;

[0037] 22 conductive through holes;

[0038] 30, 230 circuit substrate;

[0039] 32 power supply element;

[0040] 34 power supply control unit;

[0041] 36 drive unit;

[0042] 40 circuit layer;

[0043] 41 insulation layer;

[0044] 42 metal layer;

[0045] 43 insulation layer;

[0046] 44 circuit layer;

[0047] 50 substrate through hole;

[0048] 52 conduction core;

[0049] 54: insulating ring;

[0050] 100 Piezoelectric micropump. DETAILED DESCRIPTION

[0051] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

[0052] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific implementation methods disclosed below.

[0053] The following reference Figures 1 to 3 , a driving circuit assembly for a piezoelectric micropump provided according to the first embodiment of the utility model is described in detail.

[0054] like Figure 1 and Figure 2As shown, a driving circuit assembly 1 for a piezoelectric micropump provided according to the first embodiment of the utility model includes, assembled from top to bottom: an electrode plate 10, which includes a cantilever 12 for electrically connecting to a piezoelectric element of the piezoelectric micropump; a valve body housing 20, in which a conductive through-hole 22 is formed, in which a conductive portion is arranged, and the conductive portion is electrically connected to the electrode plate 10; and a circuit substrate 30, on which a power supply element 32 is provided, and the power supply element 32 corresponds to the conductive through-hole 22 and is electrically connected to the conductive portion in the conductive through-hole 22. The electrode plate 10, the valve body housing 20 and the circuit substrate 30 may have consistent shapes and sizes, so that the driving circuit assembly 1 for the piezoelectric micropump has a consistent shape after assembly. In this embodiment, the driving circuit assembly 1 has a rectangular peripheral shape. As Figure 2 As shown, when the driving circuit assembly 1 of this embodiment is used for a piezoelectric micropump, its driving circuit loop supplies power to the piezoelectric element of the piezoelectric micropump 100 from the power supply element 32 of the circuit substrate 30 via the conductive through hole 22 of the valve body housing 20 and the electrode plate 10 .

[0055] like Figure 1 As shown, in the first embodiment, the electrode plate 10 is in the shape of a rectangular frame, and may include two insulating strips 14, and two parts separated by the insulating strips 14, namely a first electrode portion 16 and a second electrode portion 18, wherein the cantilever 12 extends inward from the first electrode portion 16. The electrode plate 10 is made of a conductive metal material, and the electrical connection between the first electrode portion 16 and the second electrode portion 18 is cut off by the insulating strip 14, so that they are insulated from each other. When the drive circuit assembly 1 is working, the electrode plate 10 provides two-pole power supply to the piezoelectric element of the piezoelectric micropump 100 via the cantilever 12 of the first electrode portion 16 and the second electrode portion 18, respectively, thereby reducing power loss. Optionally, two insulating strips 14 are arranged on two adjacent sides of the electrode plate 10 to ensure that the separated first electrode portion 16 and the second electrode portion 18 have an appropriate length range for easy installation.

[0056] refer to Figure 1 and Figure 2, the valve body shell 20 below the electrode plate 10 is rectangular in shape, and at least two conductive through holes 22 are formed on its side wall, and the conductive through holes 22 are spaced apart from each other to ensure insulation from each other. In this embodiment, two conductive through holes 22 are symmetrically formed at both ends of one side wall of the valve body shell 20, wherein the conductive portion in one conductive through hole 22 corresponds to and is electrically connected to the first electrode portion 16 of the electrode plate 10, and the conductive portion in the other conductive through hole 22 corresponds to and is electrically connected to the second electrode portion 18 of the electrode plate 10. It should be understood that in other embodiments, more conductive through holes can be formed in the valve body shell 20 as needed, as long as it is ensured that each electrode portion of the electrode plate 10 is electrically connected to the conductive portion of at least one conductive through hole. The conductive through hole 22 in this embodiment is a through hole with a circular cross section, and in other embodiments, it can also be set as a through hole with a rectangular cross section or other polygonal, special-shaped hole or other cross-section as needed. The conductive through hole 22 is filled with a conductive material as a conductive portion, such as copper or silver paste, to achieve a conductive function. Insulating glue can be coated on the inner wall of the conductive through hole 22 so that the filled conductive material is surrounded by the insulating glue layer, thereby achieving insulation between the filled conductive material and the main body of the valve body shell. The valve body shell 20 can be made of materials such as stainless steel and fiber composite materials, and the thickness of the valve body shell 20 can be in the range of 0.6mm to 1.5mm. The valve body shell 20 structure of the utility model can simultaneously realize the functions of serving as a connection and protection shell, as well as a power supply and control signal path. When the drive circuit assembly 1 is applied to a piezoelectric micropump, external connection electrodes, cables and other parts are reduced, the processing technology is simplified, the integration is higher, the overall size is smaller, and the failure of external parts is avoided.

[0057] Continue to refer Figure 1 and Figure 2 , below the valve body housing 20 is a circuit substrate 30, on which a power supply element 32 is provided, and the power supply element 32 is aligned with and electrically connected to the conductive through hole 22. The cross-sectional shape and size of the power supply element 32 may be consistent with the conductive through hole 22. In this embodiment, the cross-sectional shape of the power supply element 32 is circular, and in other embodiments, it may also be set to a rectangular, other polygonal or irregular cross-sectional shape. A power supply control unit 34 may be integrated on the circuit substrate 30, which controls the power supply of the power supply element 32. A drive unit 36 ​​may also be integrated on the circuit substrate 30. The drive unit 36 ​​is composed of an integrated drive chip and a peripheral passive device group. The drive chip is connected to the peripheral passive device group, and the drive chip is packaged on the circuit substrate 30 by patch bonding. The passive device group may include passive devices such as capacitors, resistors, and crystal oscillators, which are used to assist the operation of the system. The passive device group constitutes a boost inverter circuit and a filter circuit. The external power supply is connected to the drive chip through the filter circuit in the passive device group. The power control unit and the boost control unit in the driver chip are connected to the boost inverter circuit to perform control operations.

[0058] See also Figure 3 The structure of the circuit substrate 30 may be composed of a circuit layer, an insulating layer, and a metal layer stacked. Specifically, the circuit substrate 30 may include a circuit layer 40, an insulating layer 41, a metal layer 42, an insulating layer 43, and a circuit layer 44 stacked from top to bottom, wherein the outer peripheral shape and size of each layer structure are consistent, for example, a rectangular shape in this embodiment. In addition, the structure of the power supply element 32 in the circuit substrate 30 is specifically as follows Figure 3 As shown, through holes are formed at corresponding positions of the above-mentioned layers, and after stacking and assembling, a through substrate through hole 50 is formed. An insulating glue is coated on the inner wall of the substrate through hole 50 to form an insulating ring portion 54, and copper or silver paste is used to fill the center of the insulating ring portion 54 to form a conductive core portion 52. Among them, the bottom circuit layer 44 can be a PCB board, on which connecting wires are arranged for connecting various components.

[0059] like Figure 2 As shown, when the driving circuit assembly 1 of this embodiment is applied to the piezoelectric micropump 100, the circuit substrate 30 can be used as the underlying substrate of the piezoelectric micropump 100. The circuit substrate 30 of the above structure has high toughness, high strength, and high rigidity, can withstand greater pressure, and at the same time also has electrical signal processing functions and circuit functions.

[0060] Refer to Figure 2 According to the first embodiment of the utility model, a working process of a driving circuit assembly 1 for a piezoelectric micropump is as follows: the driving unit 36 ​​on the circuit substrate 30 is connected to an external power supply, and drives the power supply control unit 34 to control the conduction of the power supply element 32, and supplies current from the power supply element 32 through the conductive through hole 22 located in one side of the valve body housing 20 and electrically connected to the power supply element 32, and the second electrode portion 18 and the first electrode portion 16 respectively electrically connected to the conductive through hole 22 and the cantilever 12 extending therefrom to the piezoelectric element of the piezoelectric micropump 100, drives the piezoelectric element to work, and thus drives the piezoelectric micropump 100 to work.

[0061] The following references Figure 4 , a driving circuit assembly 2 for a piezoelectric micropump provided according to a second embodiment of the present utility model is described.

[0062] According to the second embodiment of the utility model, a driving circuit assembly 2 for a piezoelectric micropump is provided, which includes: an electrode plate 210, a valve body shell 220 and a circuit substrate 230 assembled from top to bottom. The electrode plate 210, the valve body shell 220 and the circuit substrate 230 included in the driving circuit assembly 2 for the piezoelectric micropump have a consistent circular outer peripheral shape and size, and after assembly, a driving circuit assembly 2 with a circular outer periphery is formed. Among them, although the outer peripheral shape of the above-mentioned multilayer element is circular, its internal structure is the same as the structure of the driving circuit assembly 1 of the first embodiment above, and it will not be repeated here. This embodiment is suitable for applications where a circular piezoelectric micropump is required.

[0063] All the above optional technical solutions can be combined in any way to form optional implementation methods of the present application, and will not be described in detail here.

[0064] It should be understood that the size of the serial numbers of the steps in the above implementation does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation method of the utility model.

[0065] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A driving circuit assembly for a piezoelectric micropump, characterized in that: Includes top-down assembly: an electrode plate having a cantilever extending inwardly; A valve body shell having a conductive through hole formed therein, a conductive portion disposed in the conductive through hole, and the conductive portion is electrically connected to the electrode plate; and A circuit substrate having a power supply element thereon, and the power supply element corresponds to the conductive through hole and is electrically connected to the conductive portion; Wherein, the valve body shell and the circuit substrate have the same outer peripheral shape and size.

2. The driving circuit assembly for a piezoelectric micropump according to claim 1, characterized in that: The electrode plate includes two insulating strips, and a first electrode portion and a second electrode portion separated by the insulating strips, wherein the cantilever extends inwardly from the first electrode portion.

3. The driving circuit assembly for a piezoelectric micropump according to claim 2, characterized in that: The electrode plate is in a rectangular frame shape, and two insulating strips are arranged on two adjacent sides of the electrode plate.

4. The driving circuit assembly for a piezoelectric micropump according to claim 2, characterized in that: At least two conductive through holes are formed in the valve body housing; wherein at least two conductive through holes are arranged to be spaced apart from each other to ensure insulation from each other; wherein at least two conductive through holes are arranged so that the first electrode portion and the second electrode portion of the electrode plate are respectively electrically connected to at least a conductive portion in one conductive through hole; and The cross-sectional shape of the conductive through hole is circular, rectangular, elliptical or polygonal.

5. The driving circuit assembly for a piezoelectric micropump according to claim 4, characterized in that: The valve body housing has a side wall, two conductive through holes are formed in the side wall, and the conductive parts in the conductive through holes are electrically connected to the first electrode part and the second electrode part of the electrode plate respectively.

6. The driving circuit assembly for a piezoelectric micropump according to claim 1, characterized in that: The circuit substrate is a laminated structure, comprising a circuit layer, an insulating layer and a metal layer.

7. The driving circuit assembly for a piezoelectric micropump according to claim 1, characterized in that: The circuit substrate is a stacked structure, including a circuit layer, an insulating layer, a metal layer, an insulating layer and a circuit layer stacked and assembled in sequence from top to bottom, wherein the outer peripheral shapes and sizes of the above layers are consistent.

8. The driving circuit assembly for a piezoelectric micropump according to claim 1, characterized in that: The power supply element of the circuit substrate is composed of forming a substrate through hole at a position corresponding to the conductive through hole of the circuit substrate and the valve body shell, coating the inner wall of the substrate through hole with insulating glue to form an insulating ring part, and arranging a conductive core part in the center of the insulating ring part.

9. The driving circuit assembly for a piezoelectric micropump according to claim 1, characterized in that: The circuit substrate is integrated with a power supply control unit and a drive circuit.

10. The driving circuit assembly for a piezoelectric micropump according to any one of claims 1 to 9, characterized in that: The valve body housing and the circuit substrate have a rectangular, circular, elliptical or polygonal outer peripheral shape and consistent size.

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