Selective exposure technical method

Abstract

The invention discloses a selective exposure technical method which comprises the following steps: S1, unit plate marking: detecting a unit plate, and marking a groove mark on a scrapped area of the unit plate; s2, pattern transfer: separating the unit plates with scrap mark grooves, carrying out independent layering on the unit plates by exposure personnel, and then carrying out exposure processing on the unit plates; and S3, exposure processing: selecting an LDI machine or a single PCS negative film for selective exposure. According to the method, in the manufacturing process of the circuit board, the scrapped areas are identified uniformly after passing through the inspection stations, and selective exposure is carried out on the scrapped areas in the pattern transfer process, so that the waste of cost and efficiency on the scrapped units in the subsequent process of manufacturing the scrapped units is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a selective exposure technical method. Background Art

[0002] When pattern transfer is performed during the circuit board manufacturing process, the required circuit (or solder mask) is transferred to the board surface by exposing and developing the photoresist (or ink) to complete the board circuit (or solder mask) production.

[0003] In the prior art, in the actual production process of circuit boards, in order to improve production efficiency, multiple units are usually combined and laid out, and produced at the same time. In each production process, a single unit may be scrapped, and the scrapped unit will be processed and produced in subsequent processes together with the normal unit. In this way, the scrapped unit will waste the production capacity, materials, etc. of the subsequent production, resulting in varying degrees of waste of cost and efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a selective exposure technology method to solve the problem that in the actual production process of the circuit board proposed in the above background technology, in order to improve production efficiency, multiple units are usually combined and laid out, and produced at the same time, and a single unit will be scrapped in each production process, and the scrapped unit will be processed and produced in the subsequent process together with the normal unit. In this way, the scrapped unit will waste the subsequent production capacity, materials, etc., resulting in different degrees of waste of cost and efficiency.

[0005] To achieve the above object, the present invention provides the following technical solution: a selective exposure method, comprising the following steps:

[0006] S1. Unit board marking: Inspect the unit board and mark the scrapped area of ​​the unit board with a groove mark.

[0007] S2. Carry out pattern transfer: separate the unit boards with scrapped marking grooves, and the exposure personnel classify them separately, and then carry out exposure processing on the unit boards.

[0008] S3, Exposure processing: Select LDI machine or single PCS film for selective exposure.

[0009] Preferably, in step S1, when the outer layer circuit of the unit board is completed, the groove marking production method is: directly subject the unit board to the electrical testing process, select the units that need to be scrapped through electrical testing, and make groove markings on the PCS that fails in electrical testing as a basis for subsequent selective exposure using a single PCS film.

[0010] Preferably, in step S1, when the inner layer circuit of the unit board is completed, the groove marking production method is: the inner layer AOI of the unit board is used to check the board surface condition and make groove markings on the scrapped PCS as a basis for selective exposure when the outer layer circuit is produced.

[0011] Preferably, in step S3, the specific method of selecting the LDI machine for selective exposure is: through the editing function of the LDI machine, the NG area corresponding to each plate is modified into a light-transmitting area to complete the selective exposure.

[0012] Preferably, in step S3, the specific method of selecting the single PCS film for selective exposure is: the non-groove area is exposed through the single PCS film, and the groove area is directly exposed without film attached to complete the selective exposure.

[0013] Preferably, the exposure light is a scanning, mixed-wavelength UV-LED surface light source for exposure.

[0014] Preferably, in step S2, during the exposure process of the outer layer circuit of the unit board, after the electrical test is completed, the solder mask process is performed.

[0015] Preferably, the solder mask processing comprises the following steps:

[0016] A1. Pre-treatment: remove impurities on the surface to ensure that the solder mask ink can adhere well to the circuit board;

[0017] A2. Printing: The solder mask ink is evenly applied on the circuit board, covering the areas that do not require soldering;

[0018] A3. Pre-baking: preliminarily dry the solder mask ink to increase its adhesion;

[0019] A4, Alignment / Exposure: The circuit board printed with solder mask ink is aligned with the solder mask film, and then exposed by the exposure machine;

[0020] A5. Post-curing: Completely cure the solder mask ink to improve its chemical corrosion resistance and mechanical strength.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] In the present invention, the scrapped areas after passing through various inspection stations in the circuit board manufacturing process are marked with a unified mark and selectively exposed during the graphic transfer process, thereby avoiding the waste of cost and efficiency caused by the scrapped units in the post-production process of the scrapped units. DETAILED DESCRIPTION

[0023] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] Embodiment 1: A selective exposure method, comprising the following steps:

[0025] Step 1: After the outer layer circuit is completed, the electrical testing process is carried out directly. The units that need to be scrapped are selected through electrical testing, and groove marks are made on the PCS damaged by electrical testing, which serves as the basis for selective exposure using the LDI machine later.

[0026] Step 2: After the electrical test is completed, the solder mask process is performed. When printing the solder mask, the boards with grooves are separated and exposed using an LDI machine alone.

[0027] Step 3. When using the LDI machine for exposure, use the editing function of the LDI machine to find the corresponding scrapped area of ​​the board and edit the data. Edit the area on the data corresponding to the scrapped area of ​​the unit board as blank data, that is, the light-transmitting area. In this way, the scrapped area of ​​the unit board after development will be completely covered with ink, so that it is easy to identify in the subsequent production process, and it will not cause unnecessary material consumption in the subsequent surface treatment.

[0028] Embodiment 2: A selective exposure method, comprising the following steps:

[0029] Step 1: After the outer layer circuit is completed, the electrical testing process is carried out directly. The units that need to be scrapped are selected through electrical testing, and groove marks are made on the PCS damaged by electrical testing, which serves as the basis for selective exposure using single PCS film later.

[0030] Step 2: After the electrical test is completed, the solder mask process is performed. When printing the solder mask, the boards with grooves are separated and selectively exposed using a single PCS film.

[0031] Step 3: When exposing the solder mask, first paste the film on the non-destructive area, and do not paste the film on the scrapped area, and then expose it. After the solder mask is developed, the non-destructive area realizes the normal pattern transfer production, and the corresponding scrapped area is completely covered with solder mask ink, so it is easy to identify in the subsequent production process, and it will not cause unnecessary material consumption in the subsequent surface treatment.

[0032] Embodiment 3: A selective exposure method, comprising the following steps:

[0033] Step 1: After the inner layer circuit is completed, the inner layer AOI checks the board surface and marks the grooves on the scrapped PCS as a basis for selective exposure when making the outer layer circuit.

[0034] Step 2: When the unit board is made through the outer layer circuit, separate the board with grooves and expose it separately using the LDI machine.

[0035] Step 3. When using the LDI machine for exposure, use the editing function of the LDI machine to find the scrapped area corresponding to the unit board and edit the data. Edit the area on the data corresponding to the scrapped area of ​​the unit board as blank data, which is the light-transmitting area. In this way, the scrapped area of ​​the unit board after development will be completely covered with dry film, so that it is easy to identify in the subsequent production process, and it will not cause unnecessary material consumption in the subsequent processes.

[0036] In the present invention, the exposure light of the exposure machine selects scanning, mixed wavelength UV-LED surface light source exposure. In the process of circuit board production, the scrapped areas after passing through various inspection stations are marked with unified identification, and selectively exposed during the graphic transfer process, thereby avoiding the waste of cost and efficiency caused by the scrapped units in the post-production process of the scrapped units.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A selective exposure method, characterized in that: The following steps are involved: S1. Unit board marking: inspect the unit board and mark the scrapped area of ​​the unit board with a groove mark; S2. Pattern transfer: separate the unit boards with scrapped marking grooves, and the exposure personnel classify them separately, and then perform exposure processing on the unit boards; S3, Exposure processing: Select LDI machine or single PCS film for selective exposure.

2. The selective exposure method according to claim 1, characterized in that: In step S1, when the outer circuit of the unit board is completed, the groove marking production method is: directly subject the unit board to the electrical testing process, select the units that need to be scrapped through electrical testing, and make groove markings on the PCS that fails in electrical testing as a basis for subsequent selective exposure using a single PCS film.

3. The selective exposure method according to claim 1, characterized in that: In step S1, when the inner layer circuit of the unit board is completed, the groove marking production method is: the inner layer AOI of the unit board is used to check the board surface condition and make groove markings on the scrapped PCS as a basis for selective exposure when the outer layer circuit is produced.

4. The selective exposure method according to claim 1, characterized in that: In step S3, the specific method of selecting the LDI machine for selective exposure is: through the editing function of the LDI machine, the NG area corresponding to each plate is modified into a light-transmitting area to complete the selective exposure.

5. The selective exposure method according to claim 1, characterized in that: In step S3, the specific method of selecting the single PCS film for selective exposure is: the non-groove area is exposed through the single PCS film, and the groove area is directly exposed without film attached to complete the selective exposure.

6. The selective exposure method according to claim 5, characterized in that: The exposure light selects scanning, mixed wavelength UV-LED surface light source exposure.

7. The selective exposure method according to claim 6, characterized in that: In step S2, during the exposure process of the outer layer circuit of the unit board, after the electrical test is completed, the solder mask process is performed.

8. The selective exposure method according to claim 7, characterized in that: The solder mask process includes the following steps: A1. Pre-treatment: remove impurities on the surface to ensure that the solder mask ink can adhere well to the circuit board; A2. Printing: The solder mask ink is evenly applied on the circuit board, covering the areas that do not require soldering; A3. Pre-baking: preliminarily dry the solder mask ink to increase its adhesion; A4, Alignment / Exposure: The circuit board printed with solder mask ink is aligned with the solder mask film, and then exposed by the exposure machine; A5. Post-curing: Completely cure the solder mask ink to improve its chemical corrosion resistance and mechanical strength.