Film wire
Through the design of thin-film conductors, the problems of large space occupied by traditional conductors and complex construction are solved, high-density current transmission and low heat generation of conductors are realized, and construction during the house renovation process is simplified.
Patent Information
- Application Number
- CN202411394648.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2024-12-20
AI Technical Summary
The existing wires take up a lot of space during the house renovation process, which affects construction efficiency. The traditional wires are complex in manufacturing and difficult to bend, resulting in waste of materials and difficult construction.
Provide a thin film conductor, including an isolation layer and a conductive layer, the conductive layer can be folded or rolled, and uses materials with good conductivity such as gold, silver, copper and aluminum, and the insulation layer materials include basalt fibers, carbon fibers, etc., and the folding of the conductive layer. The methods include H, W, Z and helical shapes, and the outer layer is provided with functional layers to improve performance.
It achieves the space of the wire, the current density is increased, and the heat generation is reduced. It is suitable for AC power transmission, simplifies the construction process, and reduces material consumption and construction time.
Smart Images
Figure CN119170330A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wires, and in particular to a thin film wire. Background Art
[0002] During the renovation of existing houses, secondary renovation of electrical wires is often involved, which requires changing the pipes and cables in the wall. During construction, it is first necessary to groove the wall and install the wire pipes and wires into the grooves. This construction method will damage the load-bearing capacity and aesthetics of the wall, and cause construction difficulties, affecting construction efficiency.
[0003] As we all know, the skin effect of alternating current is also called the skin effect. It refers to the uneven current distribution on the conductor cross section caused by induction when the alternating current passes through the conductor. The closer to the conductor surface, the greater the current density. The current will be concentrated on the conductor surface, so there is almost no current passing through the center of the wire. The cross-sectional shape of traditional wires is mainly round or flat square, which occupies a large space. In addition, this kind of wire is complex to manufacture and cannot be bent to a large extent, which is not conducive to the construction of branch wiring. In addition, the percentage of the current density in these two types of wires to the volume density is small, which is not conducive to saving materials. Summary of the invention
[0004] The purpose of the present invention is to provide a thin film conductor to solve the problems existing in the above-mentioned prior art, so that the conductor occupies less space, has higher current density, lower heat generation, and is more suitable for the transmission of alternating current.
[0005] To achieve the above object, the present invention provides the following solutions:
[0006] The present invention provides a thin film conductor, comprising an isolation layer and a conductive layer, wherein the isolation layer is evenly distributed or wrapped on the surface of the conductive layer so that adjacent conductive layers do not contact each other, and the conductive layer can be folded or rolled according to a required shape.
[0007] Preferably, the conductive layer is made of a material with good conductivity, including gold, silver, copper and aluminum.
[0008] Preferably, the material of the isolation layer includes insulating material, semiconductor material and conductive material.
[0009] Preferably, the material of the isolation layer includes basalt fiber, carbon fiber, stone powder, ceramic powder, glass fiber and rubber.
[0010] Preferably, the folding modes of the conductive layer include H, W, Z and spiral.
[0011] Preferably, the single-layer thickness of the conductive layer is not greater than 5 mm, and the single-layer thickness of the isolation layer is not greater than 5 mm.
[0012] Preferably, the outer layer of the conductive layer after folding or rolling is provided with at least one functional layer, and the functional layer includes at least one of a waterproof layer, a tensile layer, a self-adhesive layer, a corrosion-resistant layer, an antioxidant layer, a shielding layer, a wire overheating thermosensitive pigment display layer, and a heat dissipation insulation filling layer.
[0013] Preferably, the conductive layer is wound around or wrapped around a tensile metal column, a functional layer is provided between the tensile metal column and the conductive layer, and the tensile metal column comprises steel bars and iron wires.
[0014] Preferably, several molded conductive layers are connected in a row through a functional layer, the functional layer is provided with fixing holes, the two outer conductive layers are provided with connecting surfaces, and self-adhesive glue is provided on at least one side of the conductive layer, the functional layer and the connecting surface.
[0015] Preferably, a connecting portion is provided at the end of the conductive layer, and the connecting portion is directly connected by pressure welding, or the connecting portion includes a slot and a buckle that match each other, and the connecting portion is welded after being clamped by the slot and the buckle.
[0016] Compared with the prior art, the present invention has achieved the following technical effects:
[0017] The thin film conductor of the present invention makes the current evenly distributed in the conductor cross section and has a large current carrying capacity, which effectively improves the conductor conductivity and reduces the total volume of the conductor and the consumption of conductive materials. It can be used in some environments with limited space, such as wall attachment during decoration. The construction is relatively convenient and almost no space in the thickness and width of the wall is occupied. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 A schematic diagram of the structure of a thin film conductor in the second embodiment of the present invention;
[0020] Figure 2 This is a schematic diagram of a first folding structure of a thin film conductor in Embodiment 1 of the present invention;
[0021] Figure 3 This is a schematic diagram of a second folding structure of the thin film conductor in the first embodiment of the present invention;
[0022] Figure 4 Schematic diagram of the structure of the thin film conductor in the fourth embodiment of the present invention;
[0023] Figure 5 Schematic diagram of two construction and installation structures of thin film conductors in the fourth embodiment of the present invention;
[0024] Figure 6 is a schematic diagram of the cross-sectional structure of a thin film conductor in the fourth embodiment of the present invention;
[0025] Figure 7 It is a schematic structural diagram of the conductive layer connection of the thin film wire in the fifth embodiment of the present invention;
[0026] Figure 8 This is a schematic diagram of the structure of the functional layer connection of the thin film conductor in the fifth embodiment of the present invention;
[0027] Fig. 9 Schematic diagram of several connector structures of thin film conductors in Embodiment 5 of the present invention;
[0028] Among them: 1-thin film conductor, 2-conductive layer, 3-isolation layer, 4-functional layer, 5-fixing hole, 6-wall, 7-putty, 8-connecting part, 9-clip, 10-slot, 11-bolt. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0030] The purpose of the present invention is to provide a thin film conductor to solve the problems existing in the prior art, so that the conductor occupies less space, has higher current density, lower heat generation, and is more suitable for the transmission of alternating current.
[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0032] Embodiment 1
[0033] like Figures 1 to 3 As shown: This embodiment provides a thin film conductor 1, including an isolation layer 3 and a conductive layer 2, the isolation layer 3 is evenly distributed or wrapped on the surface of the conductive layer 2, so that adjacent conductive layers 2 do not contact, and the conductive layer 2 can be folded or rolled according to the required shape, thereby increasing the effective conductive area of the conductive layer 2 while reducing the total volume of the conductor.
[0034] As a preferred solution, the material of the conductive layer 2 in this embodiment is a material with good conductivity, preferably including gold, silver, copper and aluminum, but not limited to these conventional materials. In this embodiment, copper is preferably used, which has low cost and good conductivity, and good ductility, and is easy to form a thin film.
[0035] As a preferred solution, the material of the isolation layer 3 in this embodiment includes insulating material, semiconductor material and conductor material. Among them, the material of the isolation layer 3 in this embodiment includes basalt fiber (insulation and good tensile strength), carbon fiber (corrosion resistance and good tensile strength), stone powder, ceramic powder, glass fiber (insulation and good tensile strength) and rubber (elastic and flexible), but not limited to these conventional materials. It is preferred to use materials that are easy to peel off, and coated insulating materials can also be used. Stone powder and ceramic powder are easy to remove to connect the connecting part 8, for example, it can be used in the construction of overhead lines in workshops.
[0036] As a preferred solution, Figure 2 As shown, the folding modes of the conductive layer 2 in this embodiment include H, W, Z and spiral shapes, and after folding, the conductive layer 2 can be in the shape of a cuboid or a cylinder. The shape and large unfolded surface area of the conductive layer 2 can effectively reduce the skin effect, and is more suitable for AC transmission. The metal film is folded, the current density is increased, the overall volume can be reduced, the use of conductive materials is reduced, and the cost is reduced. The film structure is more conducive to embedding it in the wall 6.
[0037] As a preferred solution, the single layer thickness of the conductive layer 2 in this embodiment is not more than 5mm, and the single layer thickness of the isolation layer 3 is not more than 5mm. The optimal thickness is between 0.01-1mm. Compared with the traditional cylindrical wire, it requires less material, has a smaller volume, and has a higher current density, which can save a lot of conductive materials. The current carrying capacity of the thin film wire 1 in this embodiment is higher than that of the same type of cylindrical wire. For example, the test conditions are: the traditional 2m long 4mm 2 The solid copper wire of this embodiment is 2 meters long, 0.1mm thick, 40mm wide, and has a cross-sectional area of 4mm 2 Compared with the thin film copper wire, the solid copper wire and the thin film copper wire are operated continuously for 5 minutes under the current carrying condition of 120A AC. The surface temperature of the thin film copper wire rises from room temperature 33°C to 151°C, while the surface temperature of the solid wire rises from room temperature 33°C to 499°C. The experiment shows that the heat generated by the solid copper wire is more than 330% of that of the thin film copper wire. It can be seen that the thin film copper wire of the present application has excellent conductivity and is more suitable for the transmission of AC power.
[0038] Embodiment 2
[0039] The difference from the first embodiment is that Figure 1As shown, in this embodiment, the outer layer of the conductive layer 2 after folding or rolling is provided with at least one functional layer 4, and the functional layer 4 includes at least one of a waterproof layer, a tensile layer or a self-adhesive layer, a corrosion-resistant layer, an anti-oxidation layer, a shielding layer, a conductor overheating thermosensitive pigment display layer, a heat dissipation insulation filling layer, etc. On the premise of ensuring the conductive performance of the thin film conductor 1, other properties of the conductor are appropriately improved so as to be suitable for different application scenarios, such as external insulation performance, waterproof performance, tensile strength and convenience of pasting and installation. The waterproof layer can be made of rubber, the tensile layer can be made of basalt fiber and carbon fiber, and the self-adhesive layer can be made of a self-adhesive layer, and these performance layers can be used alone or in combination according to the use requirements, or a functional layer 4 with other performance requirements can be used.
[0040] Embodiment 3
[0041] Different from the first embodiment, the conductive layer 2 in this embodiment is wound or wrapped around a tensile metal column (replacing the isolation layer 3), and a functional layer 4 is arranged between the tensile metal column and the conductive layer 2. The tensile metal column includes steel bars and iron wires. After combination, the tensile strength of the thin film conductor 1 of this embodiment can be enhanced, and it can be applied to some scenarios where there are requirements for conductor strength.
[0042] Embodiment 4
[0043] The difference from the first embodiment is that Figures 4 to 6 As shown, in this embodiment, several molded conductive layers 2 are connected in a row through a functional layer 4, and a group of cables including a neutral wire, a live wire and a ground wire can be formed, which is convenient for construction and use. A fixing hole 5 is provided on the functional layer 4, and a connecting surface is provided on the two outer conductive layers 2, so that the wire can be directly crimped onto the wall 6 with putty 7, or directly fixed to the metal connector with bolts 11. Self-adhesive glue is provided on at least one side of the conductive layer 2, the functional layer 4 and the connecting surface. During the construction process of house circuit reconstruction, the film wire 1 can be directly attached to the wall or the surface of a metal body such as equipment and devices. The line row can be first pasted on the wall 6, and then directly fixed with the building material putty 7, which greatly simplifies the construction steps and hardly occupies the thickness and width space of the wall. It is both beautiful and improves the construction efficiency, and ensures that the wall 6 is not structurally damaged or hollowed out, so the bearing capacity of the wall 6 will not be affected, and the surface area of the wall 6 or the metal in contact with the wire is large, which will also improve the heat dissipation effect of the wire.
[0044] Embodiment 5
[0045] The difference from the first embodiment is that Figures 7 to 9 As shown, in this embodiment, the end of the conductive layer 2 is provided with a connecting portion 8, and the connecting portion 8 is directly pressed and welded to ensure current conduction, or the connecting portion 8 includes a card slot 10 and a buckle 9 arranged in a row and matched with each other, and the connecting portion 8 is welded after being clamped by the card slot 10 and the buckle 9. Figure 7 As shown, the two connecting parts 8 can form a straight, L-shaped, Z-shaped, arc-shaped, or T-shaped joint. The connection structure of the slot 10 of the functional layer 4 and the buckle 9 is as shown in FIG. Figure 8 As shown, the continuity of the wire is ensured. Among them, the buckle 9 in this embodiment is provided with a protrusion integrally provided with the conductive layer 2. After the buckle 9 is engaged with the card slot 10, the corresponding conductive layer 2 can be connected to conduct current. The connecting part 8 is used at the wire joint, and can also be used to connect the main wire with the branch wire, which will not affect the normal use, and is convenient for extending or turning the wire. The thin film wire 1 of this embodiment is provided with a multi-layer structure, which can be arbitrarily connected on the thin film conductive layer 2 structure, so that the current is evenly distributed in the cross section, and the current carrying capacity is large, the conductive capacity of the wire is improved, the cost is reduced, the thickness is small and easy to bend, and it is convenient for wiring.
[0046] Each thin film conductor 1 in the above embodiment makes the current evenly distributed in the conductor cross section and has a large current carrying capacity, thereby effectively improving the conductor conductivity and reducing the total volume of the conductor and the consumption of conductive materials.
[0047] The present specification uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core idea of the present invention. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.
Claims
1. A thin film conductor, characterized in that: It comprises an isolation layer and a conductive layer, wherein the isolation layer is evenly distributed or wrapped on the surface of the conductive layer so that adjacent conductive layers do not contact each other, and the conductive layer can be folded or rolled according to a required shape.
2. The thin film conductor according to claim 1, characterized in that: The conductive layer is made of a material with good conductivity, including gold, silver, copper and aluminum.
3. The thin film conductor according to claim 1, characterized in that: The material of the isolation layer includes insulating material, semiconductor material and conductive material.
4. The thin film conductor according to claim 1, characterized in that: The materials of the isolation layer include basalt fiber, carbon fiber, stone powder, ceramic powder, glass fiber and rubber.
5. The thin film conductor according to claim 1, characterized in that: The folding modes of the conductive layer include H, W, Z and spiral.
6. The thin film conductor according to claim 1, characterized in that: The single layer thickness of the conductive layer is not greater than 5 mm, and the single layer thickness of the isolation layer is not greater than 5 mm.
7. The thin film conductor according to claim 1, characterized in that: The outer layer of the conductive layer after folding or rolling is provided with at least one functional layer, and the functional layer includes at least one of a waterproof layer, a tensile layer, a self-adhesive layer, a corrosion-resistant layer, an antioxidant layer, a shielding layer, a wire overheating thermosensitive pigment display layer, and a heat dissipation insulation filling layer.
8. The thin film conductor according to claim 1, characterized in that: The conductive layer is wound or wrapped around a tensile metal column, a functional layer is arranged between the tensile metal column and the conductive layer, and the tensile metal column includes steel bars and iron wires.
9. The thin film conductor according to claim 1, characterized in that: Several molded conductive layers are connected in a row through functional layers, the functional layers are provided with fixing holes, the two outer conductive layers are provided with connecting surfaces, and self-adhesive glue is provided on at least one side of the conductive layer, the functional layer and the connecting surface.
10. The thin film conductor according to claim 1, characterized in that: The end of the conductive layer is provided with a connecting portion, and the connecting portion is directly connected by pressure welding, or the connecting portion includes a slot and a buckle that match each other, and the connecting portion is welded after being clamped by the slot and the buckle.