Jumper resistor, light-emitting substrate and light-emitting device

Abstract

The embodiment of the invention provides a jumper resistor, a light-emitting substrate and a light-emitting device. The jumper resistor comprises a conductive body, the conductive body comprises a bridging part and two connecting parts, the bridging part is connected between the two connecting parts, each connecting part comprises a welding surface, the maximum distance between the surface of the side, facing the welding surface, of the bridging part and the welding surface is a first preset distance, and the first preset distance is larger than 0; and the first insulating layer wraps the surface of the conductive body, the first insulating layer is provided with an open hole corresponding to the connecting part, at least one part of the welding surface is exposed through the open hole, and the part, exposed through the open hole, of the welding surface forms a first bonding pad used for being electrically connected with the metal wire. According to the technical scheme, after the jumper resistor is connected with the metal wires on the wiring substrate in a welded mode, even if conductive foreign matter exists on the wiring substrate, the conductive foreign matter cannot cause short circuit of the jumper resistor and other metal wires, and the short circuit risk of the jumper resistor and the metal wires is avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a jumper resistor, a light-emitting substrate and a light-emitting device. Background Art

[0002] Miniaturization of the size of light-emitting diodes (LEDs) can produce sub-millimeter light-emitting diodes (Mini Light Emitting Diodes, referred to as Mini LEDs) or micro light-emitting diodes (Micro Light Emitting Diodes, referred to as Micro LEDs). The light-emitting diodes are arranged on a wiring substrate, and the wiring substrate controls the light-emitting diodes to emit light. The wiring substrate is provided with a plurality of metal traces, and two metal traces that are spaced apart but electrically connected can be connected by using a jumper resistor. Summary of the invention

[0003] The embodiments of the present disclosure provide a jumper resistor, a light-emitting substrate, and a light-emitting device to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a jumper resistor, including:

[0005] The conductive body comprises a bridge portion and two connecting portions, the bridge portion is connected between the two connecting portions, the connecting portion comprises a welding surface, and the maximum distance between a surface of the bridge portion facing the welding surface and the welding surface is a first preset distance, and the first preset distance is greater than 0;

[0006] The first insulating layer is coated on the surface of the conductive body. The first insulating layer is provided with an opening corresponding to the connecting portion. At least a portion of the welding surface is exposed through the opening. The portion of the welding surface exposed through the opening forms a first pad for electrical connection with the metal trace.

[0007] In some embodiments, the thickness of the first insulating layer is less than the first predetermined distance.

[0008] In some embodiments,

[0009] The thickness of the first insulating layer is 0.05 mm to 0.15 mm; and / or,

[0010] The first preset distance is 0.15 mm to 0.25 mm.

[0011] In some embodiments, the color of the surface of the first insulating layer is white.

[0012] In some embodiments,

[0013] The maximum dimension of the jumper resistor in the direction perpendicular to the welding surface is 0.5 mm to 0.6 mm; and / or,

[0014] The dimension of the jumper resistor in the extending direction of the bridge portion is 9 mm to 10.5 mm.

[0015] In some embodiments, the conductive body includes a metal substrate and a metal layer located on the surface of the metal substrate. The material of the metal substrate includes copper, and the material of the metal layer includes nickel.

[0016] As a second aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a light-emitting substrate, including:

[0017] A wiring substrate, comprising a base and a metal layer located on one side of the base, wherein the metal layer comprises two first metal traces insulated from each other;

[0018] In any one of the embodiments of the present disclosure, the two first pads of the jumper resistor are electrically connected to the two first metal traces respectively.

[0019] In some embodiments, the metal layer further includes a second metal trace passing between the two first metal traces.

[0020] In some embodiments, a packaging layer is also included, which is arranged along the outer edge of the connecting part of the jumper resistor, and the surface of the packaging layer away from the wiring substrate is close to the wiring substrate relative to the surface of the bridge part of the jumper resistor away from the wiring substrate.

[0021] In some embodiments, the maximum dimension of the encapsulation layer in a direction perpendicular to the substrate is 0.45 mm to 0.55 mm.

[0022] In some embodiments, the encapsulation layer includes a first encapsulation portion arranged along the outer edge of the connecting portion, the size of the first encapsulation portion in the extension direction of the jumper resistor is 3.5mm-4mm, and the size of the first encapsulation portion in the extension direction perpendicular to the jumper resistor is 3mm-3.5mm.

[0023] In some embodiments, the wiring substrate further comprises a second insulating layer with a white surface, the second insulating layer is located on a side of the metal layer away from the substrate, the second insulating layer is provided with a first window corresponding to the first metal trace, the first window at least partially overlaps with the orthographic projection of the corresponding first metal trace on the substrate, the first metal trace forms a second pad through a portion exposed by the first window, and the first pad of the jumper resistor is electrically connected to the second pad;

[0024] The light-emitting substrate also includes a packaging layer, which includes a first packaging part arranged along the outer edge of the connecting part. In the area outside the jumper resistor, the orthographic projection of the first window on the substrate is located within the orthographic projection of the corresponding first packaging part on the substrate.

[0025] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a light-emitting device, including the jumper resistor or the light-emitting substrate in the embodiments of the present disclosure.

[0026] In the jumper resistor of the embodiment of the present disclosure, the surface of the conductive body is coated with a first insulating layer, and the first insulating layer is provided with openings corresponding to the connecting parts. For example, the number of the connecting parts is two, and the number of the openings is also two, and the two openings correspond to the two connecting parts. A first pad is formed by the welding surface exposed by the opening, and the first pad is used to be electrically connected to the metal wiring. In such a jumper resistor, the jumper resistor is covered by the first insulating layer in the area outside the first pad. Therefore, when the first pad of the jumper resistor is welded and connected to the metal wiring on the wiring substrate, since the jumper resistor is covered by the first insulating layer in the area outside the first pad, even if there is a conductive foreign object on the wiring substrate, the conductive foreign object will not cause the jumper resistor to short-circuit with the irrelevant metal wiring, thereby avoiding the risk of short-circuiting between the jumper resistor and the irrelevant metal wiring, and improving the performance of the light-emitting substrate.

[0027] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0029] Figure 1A is a plan view schematic diagram of a light-emitting substrate;

[0030] Figure 1B is a plan view schematically showing another light-emitting substrate;

[0031] Figure 2 It is a plan view of a jumper resistor in the related art;

[0032] Figure 3 for Figure 2 AA cross-sectional diagram of the jumper resistor shown;

[0033] Figure 4 for Figure 1B An enlarged schematic diagram of part C in the related art;

[0034] Figure 5 for Figure 4BB cross-sectional diagram in the related art;

[0035] Figure 6 is a schematic plan view of a light-emitting substrate in another embodiment;

[0036] Figure 7 for Figure 6 Schematic diagram of EE cross section in;

[0037] Figure 8 Schematic diagram of the structure of a jumper resistor in one embodiment of the present disclosure;

[0038] Fig. 9 is a plan view of a jumper resistor in one embodiment of the present disclosure;

[0039] Fig.10 for Fig. 9 A schematic diagram of the AA section in one embodiment;

[0040] Fig.11 for Fig. 9 A schematic diagram of an AA cross section in another embodiment;

[0041] Fig. 12A for Figure 1B An enlarged schematic diagram of part C in one embodiment of the present disclosure;

[0042] Fig. 12B for Fig. 12A BB cross-section diagram;

[0043] Fig.13 for Figure 6 EE cross-sectional schematic diagram in one embodiment of the present disclosure;

[0044] Fig.14 for Figure 6 EE cross-sectional schematic diagram in another embodiment of the present disclosure;

[0045] Fig.15 for Figure 6 DD cross-sectional schematic diagram of the light-emitting substrate shown.

[0046] Description of reference numerals:

[0047] 10, substrate; 121, light emitting element; 122, micro driver chip; 140, first metal wiring; 150, partition opening; 160, second metal wiring;

[0048] 20, jumper resistor; 21, conductive body; 211, bridge portion; 212, connection portion; 213, metal substrate; 214, metal layer; 22, first insulating layer; 221, opening; 215, welding surface; 215a, first pad;

[0049] 30. second insulating layer; 31. first opening window;

[0050] 40. packaging layer; 41. first packaging part; 42. second packaging part; 43. third packaging part;

[0051] 50. Reflective layer / reflective sheet. DETAILED DESCRIPTION

[0052] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined arbitrarily without conflict. Therefore, the drawings and descriptions are considered to be illustrative in nature and not restrictive.

[0053] Figure 1A is a schematic plan view of a light-emitting substrate, Figure 1B is a plan view schematically showing another light-emitting substrate; Figure 2 is a plan view of a jumper resistor in the related art. Figure 3 for Figure 2 The AA cross-sectional diagram of the jumper resistor is shown. Figure 4 for Figure 1B An enlarged schematic diagram of part C in the related art, Figure 5 for Figure 4 BB cross-sectional diagram in the related art. Figure 1A-Figure 5 As shown, the light-emitting substrate includes a wiring substrate and an electronic component arranged on the wiring substrate, and the electronic component may include a light-emitting element 121, a jumper resistor 20 and a micro-drive chip. The light-emitting element 121 may be a light-emitting diode. The wiring substrate may include a base 10 and a metal layer arranged on one side of the base 10, and the metal layer includes two first metal traces 140, and the two first metal traces 140 are separated by a partition 150, and the two first metal traces 140 are insulated from each other. The metal layer also includes a second metal trace, and the second metal trace passes between the two first metal traces 140. Figure 1A and Figure 1B As shown, two first metal traces 140 are electrically connected through a jumper resistor 20. The first metal trace 140 may include a first power line VLED or a second power line GND. The signal transmitted by the first metal trace 140 is not limited here, and the signal transmitted by the first metal trace 140 can be set according to actual needs.

[0054] like Figure 2 and Figure 3As shown, the jumper resistor 20 includes a conductive body 21, and the conductive body 21 includes a bridge portion 211 and two connecting portions 212, and the bridge portion 211 is connected between the two connecting portions 212. The conductive body 21 includes a metal substrate 213 and an anti-oxidation layer 214 located on the surface of the metal substrate 213, and the material of the metal substrate 213 includes copper, and the material of the anti-oxidation layer 214 includes nickel. Exemplarily, the length L1 of the jumper resistor 20 can be 9.6mm, and the height H1 is 0.45mm. The thickness of the anti-oxidation layer 214 can be 2μm, the length L2 of the connecting portion 212 can be 1.5mm, and the width w1 of the connecting portion 212 can be 1.0mm. The bridge portion 211 is arched upward relative to the connecting portion 212, and the height H2 of the bridge portion 211 arched relative to the connecting portion 212 can be 0.2mm.

[0055] The connecting portion 212 includes a welding surface 215, at least a portion of which forms a first pad 215a, and the first pad 215a is used to electrically connect to the metal trace. The bridge portion 211 protrudes upward relative to the connecting portion 212, so that when the first pad 215a is welded to the first metal trace 140 on the wiring substrate, a trace gap is formed between the bridge portion 211 and the partition opening 150. Figure 5 As shown, the second metal trace 160 passes through the partition 150 between the two first metal traces 140a and 140b. In the related art, the outer layer of the jumper resistor 20 is an anti-oxidation layer 214, and the anti-oxidation layer 214 is a conductive material. Although the second insulating layer 30 is provided above the metal layer in the wiring substrate, the first opening 31 of the second insulating layer 30 exposes a portion of the second metal trace 160. When there is a conductive foreign object on the display substrate, it is easy to cause a short circuit between the jumper resistor 20 and the second metal trace 160, increasing the risk of a short circuit between the jumper resistor 20 and the metal trace. Figure 5 Circles are used to indicate locations where short circuits are likely to occur.

[0056] Figure 6 is a schematic plan view of a light-emitting substrate in another embodiment; Figure 7 for Figure 6 The surface of the jumper resistor 20 is silver, which affects the optical effect. Therefore, a first packaging part 41 is provided above the jumper resistor 20. The first packaging part 41 packages the jumper resistor 20 as a whole. The packaging effect is as follows: Figure 4 and 5 The material of the first packaging part 41 is usually white silica gel. In the related art, the packaging length L2 of the first packaging part 41 is 12.6 mm, the packaging width W2 is 3.6 mm, and the packaging height H0 is 1.0 mm.

[0057] like Figure 6 and Figure 7As shown, the light-emitting substrate also includes a reflective layer 50 disposed above the first packaging portion 41, and the reflective layer 50 is attached to the upper surface of the light-emitting substrate. Due to the large size of the first packaging portion 41, the reflective layer 50 forms a bulge at the position of the first packaging portion 41. The bulging of the reflective layer 50 affects the light efficiency of the surrounding light-emitting diodes, and causes the reflective layer 50 around the surrounding light-emitting diodes to be unable to achieve good adhesion with the light-emitting substrate, thereby affecting the light output efficiency of the corresponding light-emitting diode position. The more densely populated the jumper resistors 20 are, the more serious the darkening defect is.

[0058] It should be noted that in order to more clearly show the positional relationship between the reflective layer 50, the first packaging portion 41 and the jumper resistor 20 in the direction perpendicular to the wiring substrate, Figure 7 use Figure 6 The EE cross section in Figure 7 The vertical positional relationship among the jumper resistor 20 , the first encapsulation portion 41 and the reflective layer 50 is shown.

[0059] In order to solve the problems in the related art, an embodiment of the present disclosure provides a jumper resistor 20 .

[0060] Figure 8 is a schematic diagram of the structure of a jumper resistor in one embodiment of the present disclosure, Fig. 9 is a plan view of a jumper resistor in one embodiment of the present disclosure, Fig.10 for Fig. 9 AA cross-sectional schematic diagram of an embodiment, Fig.11 for Fig. 9 AA cross-sectional schematic diagram in another embodiment. Figure 8-Figure 11 As shown, the jumper resistor 20 includes a conductive body 21 and a first insulating layer 22. The conductive body 21 includes a bridge portion 211 and two connecting portions 212, and the bridge portion 211 is connected between the two connecting portions 212. The connecting portion 212 includes a welding surface 215, and the maximum distance between the surface of the bridge portion 211 facing the welding surface 215 and the welding surface 215 is a first preset distance H2, and the first preset distance H2 is greater than 0. Therefore, the surface of the bridge portion 211 facing the welding surface 215 is arched upward relative to the welding surface 215, as shown in FIG. Fig.10 and Fig.11 shown.

[0061] The first insulating layer 22 is coated on the surface of the conductive body 21. The first insulating layer 22 is provided with an opening 221 corresponding to the connecting portion 212. At least a portion of the welding surface 215 is exposed through the opening 221. The portion of the welding surface 215 exposed through the opening 221 forms a first pad 215a for electrical connection with a metal trace. Exemplarily, a portion of the welding surface 215 may be exposed through the opening 221, or the entire welding surface 215 may be exposed through the opening 221.

[0062] In the jumper resistor 20 of the embodiment of the present disclosure, the surface of the conductive body 21 is covered with a first insulating layer 22, and the first insulating layer 22 is provided with openings 221 corresponding to the connecting parts 212. For example, the number of the connecting parts 212 is two, and the number of the openings 221 is also two, and the two openings 221 correspond to the two connecting parts 212. The welding surface 215 exposed by the opening 221 forms a first pad 215a, and the first pad 215a is used to be electrically connected to the metal trace. In such a jumper resistor 20, the jumper resistor 20 is covered by the first insulating layer 22 in the area outside the first pad 215a. Thus, when the first pad 215a of the jumper resistor 20 is welded and connected to the metal trace on the wiring substrate, since the area outside the first pad 215a of the jumper resistor 20 is covered by the first insulating layer 22, even if there is conductive foreign matter on the wiring substrate, the conductive foreign matter will not cause the jumper resistor 20 to be short-circuited with irrelevant metal traces, thereby avoiding the risk of short circuit between the jumper resistor 20 and irrelevant metal traces and improving the performance of the light-emitting substrate.

[0063] In one embodiment, the surface color of the first insulating layer 22 is white. When the jumper resistor 20 is disposed on the light-emitting substrate, the white color can reflect light, prevent the jumper resistor 20 from being dark, and improve the light effect.

[0064] Exemplarily, the material of the first insulating layer 22 may include white insulating materials such as white ink. Alternatively, the first insulating layer 22 may include an insulating material layer and a white film coated on the surface of the insulating material layer. The insulating material layer may include at least one of silicon oxide, silicon nitride, and silicon oxynitride, and the material of the white film may include white ink.

[0065] In one embodiment, the thickness of the first insulating layer 22 is less than the first preset distance. It can be understood that the first preset distance H2 is greater than 0, so that the surface of the bridge portion 211 facing the welding surface 215 is arched upward relative to the welding surface 215. The thickness of the first insulating layer 22 is set to be less than the first preset distance, so that after the first insulating layer 22 is formed on the surface of the conductive body 21, the surface of the bridge portion 211 facing the welding surface 215 is still arched upward relative to the welding surface 215. Fig.10 When the jumper resistor 20 is welded to the light-emitting substrate, a routing gap may be formed between the bridge portion 211 and the partition opening 150 of the light-emitting substrate. When the second metal wiring passes through the routing gap, an insulating gap is retained between the first insulating layer 22 on the lower surface of the bridge portion 211 and the second metal wiring.

[0066] like Fig.10As shown, the thickness w1 of the first insulating layer 22 may be 0.05 mm to 0.15 mm. For example, the thickness of the first insulating layer 22 may be one of 0.05 mm, 0.08 mm, 0.10 mm, 0.12 mm, and 0.15 mm. The first preset distance H2 may be 0.15 mm to 0.25 mm. For example, the first preset distance H2 may be one of 0.15 mm, 0.18 mm, 0.20 mm, 0.22 mm, and 0.25 mm.

[0067] Exemplarily, the first insulating layer 22 may be formed on the surface of the conductive body 21 by sputtering or printing. After the first insulating layer 22 is formed, the first insulating layer 22 may be patterned to form an opening 221, and the opening 221 exposes at least a portion of the welding surface 215. Exemplarily, before the first insulating layer 22 is formed, the position of the opening 221 may be protected, so that when the first insulating layer 22 is formed, the material of the first insulating layer 22 will not form the first insulating layer 22 at the position of the opening 221, and the formed first insulating layer 22 is located on the surface outside the opening 221.

[0068] like Fig.10 As shown, the maximum dimension H3 of the jumper resistor 20 in the direction perpendicular to the welding surface 215 is 0.5 mm to 0.6 mm. For example, the maximum dimension H3 of the jumper resistor 20 in the direction perpendicular to the welding surface 215 can be one of 0.5 mm, 0.55 mm, and 0.6 mm. The dimension L3 of the jumper resistor 20 in the extending direction of the bridge portion 211 can be 9 mm to 10.5 mm. For example, L3 can be one of 9 mm, 9.5 mm, 9.8 mm, 10 mm, and 10.5 mm.

[0069] like Fig. 9 As shown, the width W3 of the jumper resistor 20 may be 1.0 mm to 1.5 mm. For example, the width W3 of the jumper resistor 20 may be 1.0 mm, 1.2 mm, or 1.5 mm.

[0070] In one embodiment, Fig.10 As shown, the bridge portion 211 protrudes relative to the connection portion 212 in a direction away from the welding surface 215. The bridge portion 211 may include a first sub-bridge portion 2111 and a second sub-bridge portion 2112. The number of the second sub-bridge portions 2112 is two, and the two second sub-bridge portions 2112 are respectively connected to the two ends of the first sub-bridge portion 2111, and the second sub-bridge portion 2112 connects the first sub-bridge portion 2111 with the connection portion 212.

[0071] In one embodiment, Fig.11As shown, the surface of the bridge portion 211 away from the welding surface 215 and the surface of the connecting portion 212 away from the welding surface 215 can be located on the same plane. The surface of the bridge portion 211 close to the welding surface 215 is recessed toward the side away from the welding surface 215, that is, the lower surface of the bridge portion 211 is recessed toward the upper side, thereby forming the bridge portion 211.

[0072] like Fig.10 As shown, the conductive body 21 includes a metal substrate 213 and an anti-oxidation layer 214 located on the surface of the metal substrate 213. The material of the metal substrate 213 may include copper. The material of the anti-oxidation layer 214 may include nickel.

[0073] Fig. 12A for Figure 1B In the enlarged schematic diagram of part C in one embodiment of the present disclosure, Fig. 12B for Fig. 12A BB cross-sectional schematic diagram. The embodiment of the present disclosure also provides a light-emitting substrate, which includes a wiring substrate and a jumper resistor 20 in any embodiment of the present disclosure. Figure 1B , Fig. 12A and Fig. 12B As shown, the wiring substrate includes a base 10 and a metal layer located on one side of the base 10, and the metal layer includes two mutually insulated first metal traces 140. The two first pads 215a of the jumper resistor 20 are electrically connected to the two first metal traces 140 respectively, so as to realize the electrical connection of the two first metal traces 140.

[0074] In the light-emitting substrate of the embodiment of the present disclosure, when there is a conductive foreign object on the light-emitting substrate, since the outer surface of the jumper resistor 20 is provided with a first insulating layer 22, the short circuit between the jumper resistor 20 and the metal wiring other than the first metal wiring 140 is avoided, and the risk of short circuit between the jumper resistor 20 and other metal wirings is avoided, thereby improving the performance of the light-emitting substrate.

[0075] like Figure 1B and Fig. 12A , Fig. 12B As shown, the metal layer may further include a second metal trace, and the second metal trace passes through the partition opening 150 between the two first metal traces 140 . Figure 5 In the related art shown in FIG. 1 , the jumper resistor 20 is easily short-circuited with the second metal wiring, causing a short-circuit risk. In the embodiment of the present disclosure, since the outer surface of the jumper resistor 20 is provided with a first insulating layer 22, the short-circuit between the jumper resistor 20 and the second metal wiring is avoided, and the short-circuit risk between the jumper resistor 20 and other metal wiring is avoided. Fig. 12B As shown, after the first insulating layer 22 is provided on the surface of the jumper resistor 20, under the protection of the first insulating layer 22, the risk of short circuit at the position indicated by the circle is greatly reduced.

[0076] like Fig. 12A and Fig. 12B As shown, the light-emitting substrate may further include an encapsulation layer 40, which is arranged along the outer edge of the connection portion 212 of the cross-connecting resistor 20, and the surface of the encapsulation layer 40 away from the wiring substrate is closer to the wiring substrate than the surface of the first insulating layer 22 on the side of the bridge portion 211 away from the wiring substrate. Fig. 12B As shown, the surface of the packaging layer 40 away from the wiring substrate is surface E1, and the surface of the first insulating layer 22 of the bridge portion 211 away from the wiring substrate is surface E2. Surface E1 is closer to the wiring substrate than surface E2, that is, surface E1 is lower than surface E2.

[0077] In related technologies, such as Figure 5 and Figure 7 As shown, the first packaging portion 41 (also called packaging layer 40 ) needs to package the jumper resistor 20 as a whole, so the upper surface of the first packaging portion 41 is higher than the upper surface of the bridge portion 211 of the jumper resistor 20 .

[0078] In the present disclosure, Fig. 12B As shown, due to the use of the jumper resistor 20 in the present disclosure, the outer surface of the jumper resistor 20 is provided with a first insulating layer 22, so that the encapsulation layer 40 only needs to be provided along the outer edge of the connection portion 212 to encapsulate the first pad 215a, and the encapsulation layer 40 no longer needs to encapsulate the entire jumper resistor 20, so that the surface of the encapsulation layer 40 away from the wiring substrate can be closer to the wiring substrate than the surface of the bridge portion 211 of the jumper resistor 20 away from the wiring substrate. This makes it possible that the provision of the first encapsulation portion 41 will not increase the height of the jumper resistor 20 position. The height of the jumper resistor 20 position in the light-emitting substrate of the present disclosure is the height of the upper surface of the bridge portion 211 of the jumper resistor 20. The height of the jumper resistor 20 position is compared to Figure 5 The related art shown is greatly reduced.

[0079] Exemplarily, the material of the first packaging part 41 may include white silica gel. Thus, the first packaging part 41 can reflect light and improve the light effect of the light-emitting substrate.

[0080] like Fig. 12A In the embodiment, the first encapsulation part 41 is arranged along the outer edge of the corresponding connection part 212. In another embodiment, the first encapsulation part 41 is arranged along the outer edge of the corresponding connection part 212, and the first encapsulation part 41 can cover the corresponding connection part 212, that is, the orthographic projection of the connection part 212 on the light-emitting substrate is located within the orthographic projection of the corresponding first encapsulation part 41 on the light-emitting substrate.

[0081] Fig.13 for Figure 6The BB cross-sectional schematic diagram in one embodiment of the present disclosure, Fig.14 for Figure 6 BB cross-sectional view in another embodiment of the present disclosure. It should be noted that in order to more clearly show the positional relationship between the reflective layer 50, the first packaging parts 41a and 41b, and the jumper resistor 20 in the direction perpendicular to the wiring substrate, Fig.13 and Fig.14 use Figure 6 The EE cross section in Fig.13 and Fig.14 The vertical positional relationship of the jumper resistor 20, the first packaging parts 41a and 41b, and the reflective layer 50 is illustrated. It should be noted that one jumper resistor 20 corresponds to two first packaging parts 41. In order to distinguish the two first packaging parts, in the drawings of the specification, the first packaging part located on the left side of the jumper resistor 20 is marked as 41a, and the first packaging part located on the right side of the jumper resistor 20 is marked as 41b.

[0082] like Fig.13 and Fig.14 As shown, the light-emitting substrate further includes a reflective layer 50. Exemplarily, the reflective layer 50 may be a reflective sheet 50. Figure 6 As shown, the reflective layer 50 has a plurality of first functional regions Q1 , and at least a portion of the orthographic projection of the jumper resistor 20 and the corresponding first encapsulation portion 41 on the substrate 10 is located in the first functional region Q1 .

[0083] In order to improve the reflectivity, Figure 6 As shown, the reflector 50 adopts a straight-line gap design in the first functional area Q1. The reflector 50 adopts an opening design at the position of the light emitting element 121, such as Figure 6 As shown, the reflective sheet 50 is provided with a first through hole M1 , and the orthographic projection of the light emitting element 120 on the substrate 10 is located within the orthographic projection of the first through hole M1 on the substrate 10 , so that the light emitting element 121 can be exposed through the first through hole M1 .

[0084] The reflective sheet 50 is attached to the surface of the light emitting substrate facing the encapsulation layer 40. Figure 5 and Figure 7 As shown in the related art, in the light-emitting substrate of the embodiment of the present disclosure, the height of the jumper resistor 20 is greatly reduced. Therefore, after the reflector 50 is attached, since the surface E1 is lower than the surface E2, the reflector 50 can be attached to the surface of the first insulating layer 22 on the side of the bridge portion 211 of the jumper resistor 20 away from the wiring substrate, as shown in FIG. Fig.13 and Fig.14As shown, the bulging height of the reflective sheet 50 at the position of the jumper resistor 20 can be greatly reduced, reducing the influence of the bulging of the reflective sheet 50 on the light efficiency of the surrounding LEDs, improving the fitting effect of the reflective sheet 50 around the surrounding LEDs, avoiding dark light at the position of the LEDs, and improving the performance of the light-emitting substrate.

[0085] For example, Fig. 12B As shown, the maximum dimension H4 of the encapsulation layer 40 in a direction perpendicular to the substrate 10 may be 0.45 mm to 0.55 mm. For example, H4 may be 0.45 mm, 0.5 mm or 0.55 mm.

[0086] like Fig. 12A and Fig. 12B As shown, the encapsulation layer 40 may include a first encapsulation portion 41 disposed along the outer edge of the connection portion 212. Since the first encapsulation portion 41 is disposed along the outer edge of the connection portion 212, the first encapsulation portion 41 may be in a "U"-shaped structure. Fig. 12A The shape of the first packaging part is illustrated by using thicker lines.

[0087] For example, the first packaging portion 41 extends in the direction of the cross-connect resistor 20. Fig. 12A The dimension L5 in the X direction in the figure can be 3.5 mm to 4 mm, for example, L5 can be 3.5 mm, 3.8 mm or 4 mm. Fig. 12A The dimension W4 in the Y direction may be 3 mm to 3.5 mm. For example, W4 may be 3 mm, 3.3 mm or 3.5 mm.

[0088] In one embodiment, Fig. 12B As shown, the wiring substrate may further include a second insulating layer 30, and the surface of the second insulating layer 30 may be white. The second insulating layer 30 is located on the side of the metal layer away from the substrate 10. The reflective sheet 50 may be attached to the surface of the second insulating layer 30. The second insulating layer 30 is provided with a first window 31 corresponding to the first metal trace 140, and the first window 31 at least partially overlaps with the orthographic projection of the corresponding first metal trace 140 on the substrate 10. The exposed portion of the first metal trace 140 through the first window 31 may form a second pad, and the first pad 215a of the jumper resistor 20 is electrically connected to the second pad. Fig. 12A As shown, in order to allow the packaging layer 40 to cover the metal exposed through the first window 31, in the area outside the jumper resistor 20, the orthographic projection of the first window 31 on the substrate 10 is located within the orthographic projection of the corresponding first packaging part 41 on the substrate 10, so that the first packaging part 41 can completely cover the metal exposed through the first window 31 to avoid the risk of short circuit.

[0089] Exemplarily, the material of the second insulating layer 30 may be white ink.

[0090] Fig.15 for Figure 6 DD cross-sectional schematic diagram of the light-emitting substrate shown.

[0091] In one embodiment, Figure 6 and Fig.15 As shown, the electronic component may include a light emitting element 121 such as a light emitting diode. The light emitting substrate may further include a second encapsulation portion 42, and the orthographic projection of the light emitting element 121 on the substrate 10 is located within the orthographic projection range of the second encapsulation portion 42 on the substrate 10. The reflective layer 50 is provided with a first through hole M1, and the orthographic projection of the second encapsulation portion 42 on the substrate 10 is located within the orthographic projection of the first through hole M1 on the substrate 10, so that the second encapsulation portion 42 can be exposed through the first through hole M1.

[0092] For example, Fig.15 As shown, the second packaging part 42 covers the light emitting element 121, which can protect the light emitting element 121 and extend the service life of the light emitting element 121. The material of the second packaging part 42 is a light-transmitting material, which reduces the shielding of the second packaging part 42 to light and increases the intensity of light that can pass through the second packaging part 42.

[0093] In some examples, the material of the second packaging portion 42 includes transparent glue. In some embodiments, the second packaging portion 42 may be mushroom-shaped or approximately mushroom-shaped.

[0094] Based on the inventive concept of the aforementioned embodiment, the embodiment of the present disclosure further provides a light-emitting device, the light-emitting device includes the jumper resistor 20 in the embodiment of the present disclosure, or the light-emitting device includes the light-emitting substrate in the embodiment of the present disclosure. The light-emitting device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a laptop computer, a digital photo frame, a navigator, etc.

[0095] The light-emitting substrate in the embodiment of the present disclosure can be assembled in a light-emitting device as a display panel, or can be assembled in a light-emitting device as a light source. The light-emitting device can be: electronic paper, mobile phones, tablet computers, televisions, monitors, laptops, digital photo frames, navigators, wearable display devices, and any other products or components with display functions.

[0096] The light-emitting substrate in the embodiment of the present disclosure can also be used as a light source in lighting products.

[0097] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0098] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0099] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0100] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0101] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0102] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A jumper resistor, characterized in that: include: A conductive body, comprising a bridge portion and two connecting portions, wherein the bridge portion is connected between the two connecting portions, the connecting portion comprises a welding surface, and a maximum distance between a surface of the bridge portion facing the welding surface and the welding surface is a first preset distance, and the first preset distance is greater than 0; A first insulating layer is coated on the surface of the conductive body, wherein the first insulating layer is provided with an opening corresponding to the connecting portion, at least a portion of the welding surface is exposed through the opening, and the portion of the welding surface exposed through the opening forms a first pad for electrical connection with a metal trace.

2. The jumper resistor according to claim 1, characterized in that: The thickness of the first insulating layer is smaller than the first preset distance.

3. The jumper resistor according to claim 1, characterized in that: The thickness of the first insulating layer is 0.05 mm to 0.15 mm; and / or, The first preset distance is 0.15 mm to 0.25 mm.

4. The jumper resistor according to claim 1, characterized in that: The surface color of the first insulating layer is white.

5. The jumper resistor according to claim 1, characterized in that: The maximum dimension of the jumper resistor in a direction perpendicular to the welding surface is 0.5 mm to 0.6 mm; and / or, The dimension of the jumper resistor in the extending direction of the bridge portion is 9 mm to 10.5 mm.

6. The jumper resistor according to claim 1, characterized in that: The conductive body includes a metal substrate and a metal layer located on the surface of the metal substrate. The material of the metal substrate includes copper, and the material of the metal layer includes nickel.

7. A light-emitting substrate, characterized in that: include: A wiring substrate, comprising a base and a metal layer located on one side of the base, wherein the metal layer comprises two first metal traces insulated from each other; The jumper resistor according to any one of claims 1 to 6, wherein the two first pads of the jumper resistor are electrically connected to the two first metal traces respectively.

8. The light-emitting substrate according to claim 7, characterized in that: The metal layer further includes a second metal trace, and the second metal trace passes between two of the first metal traces.

9. The light-emitting substrate according to claim 7, characterized in that: It also includes a packaging layer, which is arranged along the outer edge of the connecting part of the jumper resistor, and the surface of the packaging layer away from the wiring substrate is closer to the wiring substrate than the surface of the bridge part of the jumper resistor away from the wiring substrate.

10. The light emitting substrate according to claim 9, characterized in that: The maximum dimension of the encapsulation layer in a direction perpendicular to the substrate is 0.45 mm to 0.55 mm.

11. The light emitting substrate according to claim 9, characterized in that: The encapsulation layer includes a first encapsulation portion arranged along the outer edge of the connecting portion, the size of the first encapsulation portion in the extension direction of the jumper resistor is 3.5 mm to 4 mm, and the size of the first encapsulation portion in the extension direction perpendicular to the jumper resistor is 3 mm to 3.5 mm.

12. The light emitting substrate according to claim 7, characterized in that: The wiring substrate further comprises a second insulating layer with a white surface, the second insulating layer is located on a side of the metal layer away from the substrate, the second insulating layer is provided with a first window corresponding to the first metal trace, the first window at least partially overlaps with the corresponding orthographic projection of the first metal trace on the substrate, the first metal trace forms a second pad through a portion exposed by the first window, and the first pad of the jumper resistor is electrically connected to the second pad; The light-emitting substrate also includes a packaging layer, which includes a first packaging portion arranged along the outer edge of the connecting portion. In the area outside the jumper resistor, the orthographic projection of the first window on the substrate is located within the orthographic projection of the corresponding first packaging portion on the substrate.

13. A light emitting device, characterized in that: The invention comprises the jumper resistor according to any one of claims 1 to 6, or comprises the light-emitting substrate according to any one of claims 7 to 12.

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