Image sensing device, manufacturing method thereof and electronic equipment

Abstract

The invention relates to the technical field of display, in particular to an image sensing device, a manufacturing method thereof and electronic equipment. In the embodiment of the invention, the light-transmitting piece is provided with the light-shielding piece, and the sensing piece is provided with the first bonding piece, so that the light-transmitting piece and the sensing piece can be relatively fixed by means of the light-shielding piece and the first bonding piece. The shading piece covers at least part of the first surface and the second surface of the first bonding piece, so that light on the first surface side of the first bonding piece can be prevented from entering the first bonding piece by means of the shading piece; in addition, the situation that light enters the first bonding piece and then is reflected to the sensing area from the first bonding piece due to the fact that the first bonding pad and a part of the wire are packaged in the first bonding piece can be improved, so that the reliability of image acquisition is improved, and the imaging quality is improved. In addition, the connecting assembly is configured to be two parts, namely the shading piece and the first bonding piece, so that the assembling process of the light-transmitting piece can be controlled, and the imaging quality can be further improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an image sensing device and a manufacturing method thereof, and an electronic device. Background Art

[0002] Image sensing devices are widely used in electronic devices such as computer cameras, digital cameras, mobile phones, video phones, surveillance systems, digital video cameras, etc. However, the imaging quality of image sensing devices needs to be improved. Summary of the invention

[0003] Based on this, it is necessary to provide an image sensing device and a manufacturing method thereof, and an electronic device to improve the imaging quality of the image sensing device.

[0004] According to one aspect of the present application, an embodiment of the present application provides an image sensing device, including:

[0005] A substrate having a first surface and a second surface opposite to each other;

[0006] A sensing element is disposed on the first surface; the sensing element has a third surface disposed away from the substrate, the third surface comprising a sensing area and an edge area disposed around the sensing area;

[0007] A first pad disposed on the first surface and a second pad disposed on the edge region, wherein the first pad and the second pad are connected by means of a wire;

[0008] a light-transmitting member, disposed on a side of the sensing member away from the substrate and spaced apart from the sensing member; and

[0009] A connecting component includes a shading member and a first bonding member connected to each other, wherein the shading member is arranged on the light-transmitting member, and the first bonding member is arranged in the edge area and encapsulates the second pad and a part of the wire; the first bonding member has a first surface arranged toward the light-transmitting member, and a second surface arranged toward the sensing area; the shading member covers the first surface and at least a part of the second surface.

[0010] In one embodiment, the orthographic projection of the first bonding member on the first surface is the first projection, and the orthographic projection of the light shielding member on the first surface is the second projection;

[0011] The first projection is located within the range of the second projection, and there is a gap between an outer contour of the first projection and an outer contour of the second projection.

[0012] In one of the embodiments, the light shielding member is formed on the light transmitting member by a casting process.

[0013] In one of the embodiments, the connection assembly further includes a second bonding member;

[0014] The second bonding member is provided in the edge region, the second bonding member is located on the second surface side of the first bonding member and is connected to the second surface; along the direction from the first surface to the second surface, the size of the second bonding member is smaller than the size of the first bonding member;

[0015] The second bonding member has a third surface disposed toward the light-transmitting member, and the light-shielding member also covers the third surface.

[0016] In one embodiment, along the direction from the first surface to the second surface, the size of the second bonding element is less than 0.025 mm.

[0017] In one embodiment, the first bonding member and the second bonding member are integrally formed.

[0018] In one embodiment, the orthographic projection of the sensing element on the first surface is located within the orthographic projection range of the light-transmitting element on the first surface;

[0019] The orthographic projection of the light-shielding member on the first surface is located within the orthographic projection range of the light-transmitting member on the first surface; the orthographic projection of the first bonding member on the first surface is located within the orthographic projection range of the sensing member on the first surface.

[0020] In one embodiment, an outer contour of an orthographic projection of the light-shielding member on the first surface coincides with an outer contour of an orthographic projection of the light-transmitting member on the first surface; and / or

[0021] An outer contour of an orthographic projection of the first bonding member on the first surface coincides with an outer contour of an orthographic projection of the sensing member on the first surface.

[0022] In one embodiment, the image sensing device further includes a packaging component disposed on the first surface;

[0023] The package encapsulates the first pad and another portion of the wire;

[0024] The packaging component has a packaging cavity that is arranged along the first surface and points to the second surface and penetrates through the packaging cavity; the sensing component and the light-transmitting component are both accommodated in the packaging cavity and are in contact with the inner wall of the packaging cavity.

[0025] According to another aspect of the present application, an embodiment of the present application provides a method for manufacturing an image sensing device, the manufacturing method comprising:

[0026] A substrate is provided; the substrate has a first surface and a second surface arranged opposite to each other, a sensing element and a first pad are arranged on the first surface, the sensing element has a third surface arranged away from the substrate, the third surface includes a sensing area and an edge area arranged around the sensing area, a second pad is arranged on the edge area, and the first pad and the second pad are connected by means of a wire;

[0027] An initial first bonding member is formed on an edge region of the sensing member by a dispensing process; the initial first bonding member encapsulates the second pad and a portion of the wire;

[0028] forming a light shielding member on the light-transmitting member through a casting process;

[0029] Connecting the initial first bonding member and the light shielding member, and curing the initial first bonding member into a first bonding member through a curing process, so that the light-transmitting member and the sensing member are relatively fixed and spaced apart;

[0030] The first bonding member has a first surface disposed toward the light-transmitting member, and a second surface disposed toward the sensing area; the light-shielding member covers the first surface and the second surface.

[0031] In one embodiment, forming the light shielding member on the light-transmitting member by a casting process includes:

[0032] Providing an initial light-transmitting member;

[0033] An initial light shielding member is formed on the initial light-transmitting member by a perfusion process; the initial light shielding member comprises a plurality of first portions sequentially arranged at intervals along a first preset direction and a plurality of second portions sequentially arranged at intervals along a second preset direction, and each of the plurality of first portions is connected to any one of the plurality of second portions;

[0034] Cutting the initial light-transmitting member and the initial light-shielding member along the axial direction of each of the first parts and the axial direction of each of the second parts through a cutting process to form a plurality of the light-transmitting members and a plurality of the light-shielding members arranged in a one-to-one correspondence;

[0035] The first preset direction, the second preset direction and the thickness direction of the initial light-transmitting member are perpendicular to each other, the axial direction of the first part and the second preset direction are parallel to each other, and the axial direction of the second part and the first preset direction are parallel to each other.

[0036] According to another aspect of the present application, an embodiment of the present application provides an electronic device, including the image sensing device in any of the above embodiments; or, including an image sensing device manufactured by the manufacturing method of the image sensing device in any of the above embodiments.

[0037] In the above-mentioned image sensing device and its manufacturing method, and electronic device, the image sensing device at least includes a substrate, a sensing element, a first solder pad, a second solder pad, a light-transmitting element, and a connecting component, and the connecting component includes a light-shielding element and a first adhesive element connected to each other, and by configuring the light-shielding element on the light-transmitting element and configuring the first adhesive element on the sensing element, the light-transmitting element and the sensing element can be relatively fixed with the help of the light-shielding element and the first adhesive element. Since the light-shielding element covers at least part of the first surface and the second surface of the first adhesive element, and the first surface of the first adhesive element is a surface arranged toward the light-transmitting element, and the second surface is a surface arranged toward the sensing area, it is possible to not only block the light on the first surface side of the first adhesive element from entering the first adhesive element with the help of the light-shielding element, but also improve the situation where the light enters the first adhesive element and is reflected from the first adhesive element to the sensing area due to the first solder pad and a part of the wire being encapsulated in the first adhesive element, thereby improving the reliability of image acquisition and improving the imaging quality. In addition, since the connecting component is configured as two parts, namely the light-shielding member and the first bonding member, it is also beneficial to control the height and flatness of the light-transmitting member through the light-shielding member, which facilitates the control of the assembly process of the light-transmitting member, and further helps to improve the imaging quality.

[0038] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same items. In the drawings:

[0040] Figure 1 A partial structural schematic diagram of an image sensor provided by some embodiments of the related art;

[0041] Figure 2 A schematic cross-sectional view of an image sensing device provided in some embodiments of the present application;

[0042] Figure 3 for Figure 2 A schematic cross-sectional view of a partial structure of an image sensing device shown in FIG.

[0043] Figure 4 A schematic cross-sectional view of a portion of a connecting component in an image sensing device provided in some embodiments of the present application;

[0044] Figure 5A schematic diagram of the relationship between the first projection and the second projection in some embodiments of the present application;

[0045] Figure 6 A schematic diagram of a process for manufacturing an image sensing device provided in some embodiments of the present application;

[0046] Figure 7 A schematic flow chart of step S130 in the method for manufacturing an image sensing device provided in some embodiments of the present application;

[0047] Figure 8 This is a schematic diagram of the side structure of the initial light-transmitting member in some embodiments of the present application;

[0048] Fig. 9 This is a schematic side view of a structure in which an initial light-shielding member is provided on an initial light-transmitting member in some embodiments of the present application;

[0049] Fig.10 This is a schematic top view of a structure in which an initial light-shielding member is provided on an initial light-transmitting member in some embodiments of the present application;

[0050] Fig.11 A schematic side view of a structure in which a plurality of light-transmitting members and a plurality of light-shielding members are cut to form a plurality of light-transmitting members in some embodiments of the present application;

[0051] Fig.12 This is a schematic top view of the structure of cutting to form a plurality of light-transmitting members and a plurality of light-shielding members in some embodiments of the present application.

[0052] Description of reference numerals:

[0053] Image sensor 10, substrate 11, chip 12, pad 13, gold wire 14, adhesive 15, glass cover 16, black layer 17;

[0054] An image sensing device 100;

[0055] Substrate 110, first surface m1, second surface m2;

[0056] Sensing element 120, third surface m3, sensing area z1, edge area z2;

[0057] Light-transmitting member 130;

[0058] Connecting assembly 140, light shielding member 141, first light shielding portion 141a, second light shielding portion 141b, first bonding member 142, first surface s1, second surface s2, second bonding member 143, third surface s3;

[0059] Encapsulation 150;

[0060] A first pad w1, a second pad w2, and a wire D;

[0061] First projection T1, second projection T2;

[0062] The first size is h1, the second size is h2;

[0063] A first direction F1, a second direction F2, and a third direction F3;

[0064] Steps S110, S120, S130, S131, S132, S133, S140;

[0065] Initial light-transmitting member CT, initial light-shielding member CZ, first portion CZ1, second portion CZ2, first preset direction Y1, second preset direction Y2, thickness direction H, first central axis L1, second central axis L2, molding machine R. DETAILED DESCRIPTION

[0066] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0067] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0068] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0069] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the communication between the internal parts of two components or the interaction relationship between two components, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0070] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0071] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0072] CMOS (Complementary Metal Oxide Semiconductor) refers to a technology used to manufacture large-scale integrated circuit chips or chips manufactured using this technology.

[0073] CCD (Charge Coupled Device) refers to a component that converts light into electric charge and stores and transfers the charge, and can also take out the stored charge to change the voltage.

[0074] Image sensors usually include CCD devices and CMOS devices. COMS image sensors are image sensors made using complementary metal oxide semiconductor (CMOS) technology. Since COMS image sensors have low manufacturing costs, low power consumption, and are easy to integrate with other logic circuits on the same chip, they have gradually replaced traditional CCD devices in many fields. CMOS image sensors are widely used in electronic devices such as computer cameras, digital cameras, mobile phones, video phones, PDAs (Personal Digital Assistants), surveillance systems, digital cameras, etc.

[0075] Figure 1 A partial structural schematic diagram of an image sensor 10 provided by some embodiments of the related art is shown; for ease of explanation, only contents related to the embodiments of the related art are shown.

[0076] Please refer to Figure 1 , an embodiment of the related art provides an image sensor 10, including a substrate 11, a chip 12, a pad 13, a gold wire 14, an adhesive 15 and a black layer 17. The chip 12 is arranged on one side surface of the substrate 11, and the chip 12 and the substrate 11 are respectively provided with pads 13, and the pads 13 on the chip 12 and the pads 13 on the substrate 11 are connected by means of gold wires 14. The adhesive 15 is bonded between the chip 12 and the glass cover 16. A black layer 17 is provided at the connection between the glass cover 16 and the adhesive 15. The black layer 17 is usually formed on the glass cover 16 by means of ink screen printing or sputtering to block scattered light. However, the imaging quality of the above-mentioned image sensor 10 needs to be improved.

[0077] The inventor of the present application has found through research that the light reflected by the pads 13 and the gold wires 14 on the chip 12 will enter the sensing area of ​​the chip 12 and affect the imaging quality. At the same time, since the glass cover plate 16 and the chip 12 are connected by means of the adhesive 15, it is difficult to control the flatness of the glass cover plate 16 relative to the chip 12, and the glass cover plate 16 is prone to tilt, which further affects the imaging quality. In addition, in some usage scenarios, it is necessary to increase the sensing area of ​​the chip 12, which leads to the limitation of the width of the black layer 17. When the width of the black layer 17 is limited, it will not only affect the effect of blocking light, but also cause the black layer 17 to block part of the light from entering the sensing area due to the tolerance generated when the glass cover plate 16 is attached to the first adhesive and when the black layer 17 is coated or sputtered, that is, the difficulty of controlling the process is further increased.

[0078] Based on this, the embodiment of the present application improves the relevant structure connecting the glass cover plate 16 and the chip 12 to improve the light entering the sensing area while facilitating the control of the flatness of the glass cover plate 16 relative to the chip 12, thereby improving the imaging quality.

[0079] Figure 2 A schematic cross-sectional view of an image sensing device 100 provided in some embodiments of the present application is shown; Figure 3 Shows Figure 2 A schematic cross-sectional view of a partial structure of the image sensing device 100 is shown in FIG. Figure 4 A schematic cross-sectional structure diagram of a portion of the structure of the connecting component 140 in the image sensing device 100 provided in some embodiments of the present application is shown; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0080] Please refer to Figures 2 to 4 The embodiment of the present application provides an image sensing device 100 , including a substrate 110 , a sensing element 120 , a first pad w1 , a second pad w2 , a wire D, a light-transmitting element 130 , and a connecting component 140 .

[0081] The substrate 110 is a component for carrying relevant components in the image sensing device 100. The substrate 110 may be a plastic substrate 110, a ceramic substrate 110 or other plate-like components, and the embodiments of the present application do not impose specific restrictions on this. The substrate 110 has a first surface m1 and a second surface m2 that are arranged opposite to each other. Specifically, the first surface m1 and the second surface m2 are arranged opposite to each other along a first direction F1, and the first direction F1 is the thickness direction of the substrate 110. The second direction F2 and the third direction F3 may be the length and width directions of the substrate 110, and the size of the substrate 110 in the second direction F2 and the size of the substrate 110 in the third direction F3 may be equal or unequal. The first direction F1, the second direction F2 and the third direction F3 are perpendicular to each other.

[0082] The sensing element 120 is a component for acquiring an image. The sensing element 120 is disposed on the first surface m1. For example, the sensing element 120 can be bonded to the first surface m1 of the substrate 110 by means of a colloid. The sensing element 120 has a third surface m3 disposed away from the substrate 110, and the third surface m3 includes a sensing area z1 and an edge area z2 disposed around the sensing area z1. The sensing area z1 is an area where pixels are disposed on the sensing element 120, and the edge area z2 is an area where no pixels are disposed on the sensing element 120. The sensing area z1 can be disposed protruding from the edge area z2. The sensing area z1 can be disposed in a substantially rectangular shape (e.g., a square or a rectangle), and the central axis of the sensing area z1 and the central axis of the sensing element 120 can coincide with each other. The edge area z2 can be disposed in a square ring shape, and the width of each part of the edge area z2 is substantially the same. Of course, the shape of the sensing area z1 and the shape of the edge area z2 can be adjusted according to actual use requirements, and no specific restrictions are made here.

[0083] The first pad w1 is disposed on the first surface m1 of the substrate 110, and the second pad w2 is disposed on the edge region z2 of the third surface m3 of the sensor 120. The first pad w1 and the second pad w2 are connected by means of a wire D. In this way, the substrate 110 and the sensor 120 are electrically connected. Specifically, the wire D can be connected to the first pad w1 and the second pad w2 in a reverse bond manner, so that the wire D can form a desired preset angle, which can be less than or equal to 45 degrees, so that the vertex of each wire D can be located at a lower height position.

[0084] The light-transmitting member 130 is disposed on a side of the sensing member 120 away from the substrate 110 and is spaced apart from the sensing member 120. In this way, the sensing area z1 of the sensing member 120 can be protected while facilitating the sensing of the sensing area z1 of the sensing member 120. The light-transmitting member 130 can be a glass plate or other plate-like member capable of transmitting light, and the embodiment of the present application does not impose any specific limitation on this.

[0085] The connecting component 140 is a component for connecting the light-transmitting member 130 and the sensing member 120. The connecting component 140 includes a light-shielding member 141 and a first bonding member 142 connected to each other, the light-shielding member 141 is arranged on the light-transmitting member 130, and the first bonding member 142 is arranged in the edge area z2 and encapsulates a part of the second pad w2 and the wire D. The first bonding member 142 has a first surface s1 arranged toward the light-transmitting member 130, and a second surface s2 arranged toward the sensing area z1. The light-shielding member 141 covers the first surface s1 and at least a part of the second surface s2. That is, the light-transmitting member 130 and the sensing member are relatively fixed by means of the connecting component 140. Due to the existence of the connecting component 140, a desired interval can be formed between the light-transmitting member 130 and the sensing member 120.

[0086] The first bonding member 142 can protect the second pad w2 and the connection between the wire D and the second pad w2. The first bonding member 142 can be set as a square ring-shaped structure, or a circular ring-shaped structure, or other required structures, and the embodiment of the present application does not impose specific restrictions on this. The shape of the light shielding member 141 can be set to match the shape of the first bonding member 142. The light shielding member 141 is located at the edge area of ​​the light-transmitting member 130. The light shielding member 141 can also be set as a square ring-shaped structure or a circular ring-shaped structure, or other required structures. In the embodiment of the present application, the first bonding member 142 and the light shielding member 141 can both be set in a square ring shape. At this time, the first bonding member 142 has two parts arranged oppositely along the second direction F2 and two parts arranged oppositely along the third direction F3, and the light shielding member 141 has two parts arranged oppositely along the second direction F2 and two parts arranged oppositely along the third direction F3. The surfaces of the parts of the first adhesive member 142 facing the light-transmitting member 130 together constitute the first surface s1, and the first surface s1 is generally in a square ring shape. The surfaces of the parts of the first adhesive member 142 facing the sensing area z1 together constitute the second surface s2. The surface constituting the first surface s1 and the surface constituting the second surface s2 on each part of the first adhesive member 142 may be perpendicular to each other. The cross section of each part of the light-shielding member 141 is generally L-shaped.

[0087] Furthermore, since the light shielding member 141 covers the first surface s1 and at least a portion of the second surface s2, the light shielding member 141 is substantially formed by a first light shielding portion 141a arranged in an annular shape and a second light shielding portion 141b arranged outside the first light shielding portion 141a, and the first light shielding portion 141a and the second light shielding portion 141b are both flush with the surface of the side away from the substrate 110 and are both connected to the light-transmitting member 130. The first light shielding member 141 can be extended in the first direction F1, and the second light shielding member 141 can be extended in the radial direction of the first light shielding member 141. As mentioned above, the cross section of each part of the light shielding member 141 is substantially L-shaped.

[0088] Therefore, by configuring the light shielding member 141 on the light-transmitting member 130 and configuring the first bonding member 142 on the sensing member 120, the light-transmitting member 130 and the sensing member 120 can be relatively fixed by means of the light shielding member 141 and the first bonding member 142. Since the light shielding member 141 covers at least part of the first surface s1 and the second surface s2 of the first bonding member 142, and the first surface s1 of the first bonding member 142 is a surface disposed toward the light-transmitting member 130, and the second surface s2 is a surface disposed toward the sensing area z1, the light shielding member 141 can not only block the light on the first surface s1 side of the first bonding member 142 from entering the first bonding member 142, but also improve the situation that the light enters the first bonding member 142 and is reflected from the first bonding member 142 to the sensing area z1 due to the first pad w1 and a part of the wire D encapsulated in the first bonding member 142, thereby improving the reliability of image acquisition and the imaging quality. In addition, since the connecting component 140 is configured as two parts, namely the shading member 141 and the first adhesive member 142, it is also beneficial to control the height and flatness of the light-transmitting member 130 through the shading member 141, which facilitates the control of the assembly process of the light-transmitting member 130, and further helps to improve the imaging quality.

[0089] Figure 5 A schematic diagram showing the relationship between the first projection T1 and the second projection T2 in some embodiments of the present application is shown; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0090] In some embodiments, please refer to Figure 3 , and combined with reference Figure 5 The orthographic projection of the first bonding member 142 on the first surface m1 is the first projection T1, and the orthographic projection of the light shielding member 141 on the first surface m1 is the second projection T2. ​​The first projection T1 is within the range of the second projection T2, and there is a gap between the outer contour of the first projection T1 and the outer contour of the second projection T2.

[0091] Understandable, combined with reference Figure 5 , since the first bonding member 142 and the light shielding member 141 are both substantially annularly arranged, the first projection T1 and the second projection T2 each have an outer contour and an inner contour. The inner contour of the first projection T1 is annularly arranged, and the outer contour of the first projection T1 is arranged around the inner contour of the first projection T1. The inner contour of the second projection T2 is annularly arranged, and the outer contour of the second projection T2 is arranged around the inner contour of the second projection T2. ​​There is a gap between the outer contour of the first projection T1 and the outer contour of the second projection T2, that is, the outer edge of the light shielding member 141 is arranged beyond the outer edge of the first bonding member 142.

[0092] Thus, by setting the outer edge of the shading member 141 beyond the outer edge of the first bonding member 142, the material deterioration of the first bonding member 142 due to overexposure can be improved, thereby improving the reliability of the device and further improving the imaging quality.

[0093] In some embodiments, please refer to Figure 3 The light shielding member 141 is formed on the light transmitting member 130 by a casting process.

[0094] In this way, since the light shielding member 141 is formed by a perfusion process, it is helpful to control the shape of the light shielding member 141, thereby facilitating the control of the height and flatness of the light transmitting member 130.

[0095] In some embodiments, please refer to Figure 3 and Figure 4 , the connecting assembly 140 further includes a second adhesive member 143. The second adhesive member 143 is disposed in the edge region z2, and the second adhesive member 143 is located on the second surface s2 side of the first adhesive member 142, and is connected to the second surface s2. Along the direction from the first surface m1 to the second surface m2, the size of the second adhesive member 143 is smaller than the size of the first adhesive member 142. The second adhesive member 143 has a third surface s3 disposed toward the light-transmitting member 130, and the light-shielding member 141 also covers the third surface s3.

[0096] Specifically, along the first direction F1, the size of the first adhesive member 142 is the first size h1, and the size of the second adhesive member 143 is the second size h2. The first size h1 is greater than the second size h2. The selection range of the first size h1 and the second size h2 can be set according to the use requirements, as long as the corresponding viscosity requirements and the shading requirements of the shading member 141 can be met, and no specific limitation is made here.

[0097] In this way, not only can the bonding strength between the light-transmitting member 130 and the sensing member 120 be further improved by the second bonding member 143 , but the situation in which the light-shielding member 141 presses the sensing member 120 can also be improved by the second bonding member 143 .

[0098] In some embodiments, please refer to Figure 4 , along the direction from the first surface m1 to the second surface m2, the size of the second bonding member 143 is less than 0.025 mm. That is, the second size h2 is less than 0.025 mm. Exemplarily, the second size h2 can be 0.024 mm, 0.023 mm, 0.02 mm, 0.01 mm or 0.005 mm. It can be set according to the specific usage and is not specifically limited here.

[0099] In this way, the sensing element 120 can be protected while having a certain degree of viscosity.

[0100] In some embodiments, please refer to Figure 3 and Figure 4 The first bonding member 142 and the second bonding member 143 are integrally formed.

[0101] It is understood that when the first adhesive member 142 and the second adhesive member 143 are integrally formed, the material of the first adhesive member 142 is the same as the material of the second adhesive member 143. The material of the first adhesive member 142 and the material of the second adhesive member 143 can be silicone or epoxy resin.

[0102] In this way, it is not only easy to process and manufacture the first adhesive member 142 and the second adhesive member 143, but also the integrity of the structure is made stronger, and it can withstand greater external forces and stresses, and is not prone to problems such as loosening, cracking, and deformation.

[0103] In some embodiments, please refer to Figure 3 , the orthographic projection of the sensing member 120 on the first surface m1 is located within the orthographic projection range of the light-transmitting member 130 on the first surface m1. The orthographic projection of the light-shielding member 141 on the first surface m1 is located within the orthographic projection range of the light-transmitting member 130 on the first surface m1. The orthographic projection of the first bonding member 142 on the first surface m1 is located within the orthographic projection range of the sensing member 120 on the first surface m1.

[0104] In this way, it is not only beneficial to manufacture the light shielding member 141 and the first bonding member 142 , but also beneficial to protect the sensing member 120 by means of the light transmitting member 130 , and to obtain a more excellent device appearance.

[0105] In some embodiments, please refer to Figure 3 The outer contour of the orthographic projection of the light shielding member 141 on the first surface m1 coincides with the outer contour of the orthographic projection of the light transmitting member 130 on the first surface m1 .

[0106] In this way, the outer contour of the light shielding member 141 does not exceed the outer contour of the light transmitting member 130 , which is beneficial for obtaining a more excellent device appearance.

[0107] In some embodiments, please refer to Figure 3 The outer contour of the orthographic projection of the first bonding member 142 on the first surface m1 coincides with the outer contour of the orthographic projection of the sensing member 120 on the first surface m1.

[0108] In this way, the outer contour of the first bonding member 142 does not exceed the outer contour of the sensing member 120 , which is beneficial for obtaining a more excellent device appearance.

[0109] In some embodiments, please refer to Figure 2, the image sensing device 100 further includes a package 150 disposed on the first surface m1. The package 150 encapsulates the first pad w1 and another portion of the wire D. The package 150 has a package cavity extending from the first surface m1 to the second surface m2. That is, the package cavity penetrates the package 150 along the first direction F1. The sensing element 120 and the light-transmitting element 130 are both accommodated in the package cavity and are in contact with the inner wall of the package cavity.

[0110] Exemplarily, the package 150 may be made of a thermosetting sealing material, and the thermosetting sealing material may be composed of epoxy resin, phenolic resin, catalyst, and silicon powder, which is not limited here.

[0111] In this way, by providing the packaging member 150 , the reliability of the image sensing device 100 can be further improved.

[0112] In some embodiments, please refer to Figure 2 The light-transmitting member 130 has a surface facing away from the substrate 110 and is flush with a surface facing away from the substrate 110 of the packaging member 150 .

[0113] In this way, it is not only beneficial to further improve the imaging quality by means of the light-transmitting member 130 with better flatness, but also beneficial to make the overall appearance of the device more excellent. It should be noted that in the embodiment of the present application, the light-shielding member 141 and the bonding member are used to cooperate, which is more conducive to controlling the flatness of the light-transmitting member 130.

[0114] Figure 6 A schematic flow chart of a method for manufacturing an image sensing device 100 provided in some embodiments of the present application is shown; for ease of explanation, only contents related to the embodiments of the present application are shown.

[0115] Based on the same invention concept, please refer to Figure 6 The present invention provides a method for manufacturing an image sensing device 100. The method comprises the following steps:

[0116] Step S110, providing a substrate; the substrate has a first surface and a second surface arranged opposite to each other, a sensing element and a first pad are arranged on the first surface, the sensing element has a third surface arranged away from the substrate, the third surface includes a sensing area and an edge area arranged around the sensing area, a second pad is arranged on the edge area, and the first pad and the second pad are connected by means of a wire;

[0117] Step S120, forming an initial first bonding member on the edge area of ​​the sensor element by a dispensing process; the initial first bonding member encapsulates the second pad and a portion of the wire;

[0118] Step S130, forming a light shielding member on the light-transmitting member through a casting process;

[0119] Step S140, connecting the initial first adhesive member and the shading member, and curing the initial first adhesive member into the first adhesive member through a curing process, so that the light-transmitting member and the sensing member are relatively fixed and form a gap; wherein the first adhesive member has a first surface set toward the light-transmitting member, and a second surface set toward the sensing area; the shading member covers the first surface and the second surface.

[0120] The image sensing device manufactured by the above manufacturing method can refer to the structure of the image sensing device illustrated in some of the above embodiments and Figure 2 and Figure 3 The structure shown will not be described in detail here.

[0121] It should be noted that, in step S120, the initial second adhesive member 143 and the initial first adhesive member 142 may be formed by the same glue dispensing process. In step S130, the light shielding member 141 may be formed by pouring black glue material in the pouring process and curing the black glue material. In step S140, during the curing process, the initial second adhesive member 143 is cured into the second adhesive member 143, and at this time, the first adhesive member 142 and the second adhesive member 143 are an integrally formed member. The curing process can be selected according to the initial first adhesive member 142 and the initial second adhesive member 143, for example, the curing process may be UV curing (Ultraviolet Curing).

[0122] The advantages of the above image sensing device 100 are also possessed by the image sensing device 100 manufactured by the manufacturing method of the image sensing device 100, which will not be described in detail here. In addition, forming the light shielding member 141 by a perfusion process is more conducive to controlling the flatness and height of the light-transmitting member 130 relative to the sensing member 120.

[0123] Figure 7 A flow chart of step S130 in a method for manufacturing an image sensing device 100 provided in some embodiments of the present application is shown; for ease of explanation, only contents related to the embodiments of the present application are shown.

[0124] In some embodiments, please refer to Figure 7 , step S130 includes the following steps:

[0125] Step S131, providing an initial light-transmitting member;

[0126] Step S132, forming an initial light shielding member on the initial light-transmitting member by a perfusion process; the initial light shielding member includes a plurality of first portions sequentially spaced apart along a first preset direction and a plurality of second portions sequentially spaced apart along a second preset direction, and each of the plurality of first portions is connected to any one of the plurality of second portions;

[0127] Step S133, cutting the initial light-transmitting member and the initial light-shielding member along the axial direction of each first portion and the axial direction of each second portion through a cutting process to form a plurality of light-transmitting members and a plurality of light-shielding members arranged in a one-to-one correspondence.

[0128] In step S131, illustratively, in combination with reference Figure 8 , Figure 8 A schematic diagram of the side structure of the initial light-transmitting member CT in some embodiments of the present application is shown, and the initial light-transmitting member CT can be placed on the molding machine table R.

[0129] In step S132, illustratively, in combination with reference Fig. 9 and Fig.10 , Fig. 9 1 shows a schematic side view structure diagram of an initial light-shielding member CZ provided on an initial light-transmitting member CT in some embodiments of the present application, Fig.10 The schematic diagram of the top view of the structure in which the initial light-transmitting member CT is provided with the initial light-shielding member CZ in some embodiments of the present application is shown. The first part CZ1 and the second part CZ2 of the initial light-shielding member CZ roughly form a grid-like structure. The first part CZ1 is longitudinally extended along the second preset direction Y2, and the second part CZ2 is longitudinally extended along the first preset direction Y1. The cross section of the first part CZ1 located at the edge and the cross section of the second part CZ2 located at the edge are roughly L-shaped, and the cross section of the first part CZ1 located in the middle and the cross section of the second part CZ2 located in the middle are roughly inverted n-shaped.

[0130] In step S133, illustratively, in combination with reference Fig.11 and Fig.12 , Fig.11 A schematic diagram of a side view of a structure in which a plurality of light-transmitting members 130 and a plurality of light-shielding members 141 are cut to form a plurality of light-transmitting members 130 and a plurality of light-shielding members 141 in some embodiments of the present application is shown. Fig.12 A schematic diagram of a top view of the structure of cutting to form a plurality of light-transmitting members 130 and a plurality of light-shielding members 141 in some embodiments of the present application is shown. The central axis of the first part CZ1 is the first central axis L1, and the central axis of the second part CZ2 is the second central axis L2. The cutting can be performed along the first central axis L1 and the second central axis L2, and can be set according to specific usage requirements, and no specific restrictions are made here. After cutting, the initial light-transmitting member CT becomes a plurality of light-transmitting members 130. A light-shielding member 141 is arranged around the edge of each light-transmitting member 130. Each light-shielding member 141 is roughly defined by a portion of two first portions CZ1 adjacent to each other along the first preset direction Y1, and a portion of two second portions CZ2 adjacent to each other along the second preset direction Y2. After the cutting step, the aforementioned first portion CZ1 located in the middle and the second portion CZ2 located in the middle are both roughly L-shaped in cross-section.

[0131] Among them, combined with reference Figures 9 to 12 The first preset direction Y1, the second preset direction Y2 and the thickness direction H of the initial light-transmitting member CT are perpendicular to each other, the axial direction of the first portion CZ1 and the second preset direction Y2 are parallel to each other, and the axial direction of the second portion CZ2 and the first preset direction Y1 are parallel to each other.

[0132] It should be noted that Fig.12 The above-mentioned shading member 141 is shown as a square ring. Of course, in other embodiments, the shading member 141 can be provided in other shapes, which are not specifically limited here.

[0133] Based on the same inventive concept, an embodiment of the present application further provides an electronic device, comprising the image sensing device 100 in any of the above embodiments; or, the image sensing device 100 manufactured by the manufacturing method of the image sensing device 100 in any of the above embodiments.

[0134] The advantages and related implementations of the image sensing device 100 in the above embodiment are also possessed by the electronic device and can be implemented in the same manner, which will not be described in detail herein.

[0135] It should be understood that the image sensing device 100 provided in the above embodiment can be applied to the fields of mobile phone terminals, bionic electronics, electronic skin, wearable devices, vehicle-mounted devices, Internet of Things devices, and artificial intelligence devices. For example, the above electronic devices can be vehicle-mounted electronic devices, drones, sweeping robots, barcode recognition devices, face / biometric recognition devices, or intelligent education devices.

[0136] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0137] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An image sensing device, characterized in that: include: A substrate having a first surface and a second surface opposite to each other; A sensing element, disposed on the first surface; The sensing element has a third surface disposed away from the substrate, and the third surface includes a sensing area and an edge area disposed around the sensing area; A first pad disposed on the first surface and a second pad disposed on the edge region, wherein the first pad and the second pad are connected by means of a wire; A light-transmitting member, disposed on a side of the sensing member away from the substrate and spaced apart from the sensing member; and A connecting component, comprising a light shielding member and a first bonding member connected to each other, wherein the light shielding member is disposed on the light-transmitting member, and the first bonding member is disposed on the edge region and encapsulates the second pad and a portion of the wire; The first bonding member has a first surface disposed toward the light-transmitting member, and a second surface disposed toward the sensing area; The shading element covers the first surface and at least a portion of the second surface.

2. The image sensing device according to claim 1, wherein: The orthographic projection of the first bonding member on the first surface is a first projection, and the orthographic projection of the light shielding member on the first surface is a second projection; The first projection is located within the range of the second projection, and there is a gap between an outer contour of the first projection and an outer contour of the second projection.

3. The image sensing device according to claim 1, wherein: The light shielding member is formed on the light transmitting member through a casting process.

4. The image sensing device according to claim 1, wherein: The connection assembly further includes a second bonding member; The second bonding member is provided in the edge region, the second bonding member is located on the second surface side of the first bonding member and is connected to the second surface; along the direction from the first surface to the second surface, the size of the second bonding member is smaller than the size of the first bonding member; The second bonding member has a third surface disposed toward the light-transmitting member, and the light-shielding member also covers the third surface.

5. The image sensing device according to claim 4, characterized in that: Along the direction from the first surface to the second surface, the size of the second bonding member is less than 0.025 mm; and / or The first bonding member and the second bonding member are integrally formed.

6. The image sensing device according to any one of claims 1 to 5, characterized in that: The orthographic projection of the sensing element on the first surface is located within the orthographic projection range of the light-transmitting element on the first surface; The orthographic projection of the light-shielding member on the first surface is located within the orthographic projection range of the light-transmitting member on the first surface; the orthographic projection of the first bonding member on the first surface is located within the orthographic projection range of the sensing member on the first surface.

7. The image sensing device according to claim 6, wherein: The outer contour of the orthographic projection of the light shielding member on the first surface coincides with the outer contour of the orthographic projection of the light transmitting member on the first surface; and / or An outer contour of an orthographic projection of the first bonding member on the first surface coincides with an outer contour of an orthographic projection of the sensing member on the first surface.

8. The image sensing device according to any one of claims 1 to 5, characterized in that: The image sensing device further includes a packaging component disposed on the first surface; The package encapsulates the first pad and another portion of the wire; The packaging component has a packaging cavity that is arranged along the first surface and points to the second surface and penetrates through the packaging cavity; the sensing component and the light-transmitting component are both accommodated in the packaging cavity and are in contact with the inner wall of the packaging cavity.

9. A method for manufacturing an image sensing device, characterized in that: The production method comprises: A substrate is provided; the substrate has a first surface and a second surface arranged opposite to each other, a sensing element and a first pad are arranged on the first surface, the sensing element has a third surface arranged away from the substrate, the third surface includes a sensing area and an edge area arranged around the sensing area, a second pad is arranged on the edge area, and the first pad and the second pad are connected by means of a wire; An initial first bonding member is formed on an edge region of the sensing member by a dispensing process; the initial first bonding member encapsulates the second pad and a portion of the wire; forming a light shielding member on the light-transmitting member through a casting process; Connecting the initial first bonding member and the light shielding member, and curing the initial first bonding member into a first bonding member through a curing process, so that the light-transmitting member and the sensing member are relatively fixed and spaced apart; The first bonding member has a first surface disposed toward the light-transmitting member, and a second surface disposed toward the sensing area; the light-shielding member covers the first surface and the second surface.

10. The method for manufacturing an image sensing device according to claim 9, wherein: The method of forming the light shielding member on the light-transmitting member by a casting process comprises: Providing an initial light-transmitting member; An initial light shielding member is formed on the initial light-transmitting member by a perfusion process; the initial light shielding member comprises a plurality of first portions sequentially arranged at intervals along a first preset direction and a plurality of second portions sequentially arranged at intervals along a second preset direction, and each of the plurality of first portions is connected to any one of the plurality of second portions; Cutting the initial light-transmitting member and the initial light-shielding member along the axial direction of each of the first parts and the axial direction of each of the second parts through a cutting process to form a plurality of the light-transmitting members and a plurality of the light-shielding members arranged in a one-to-one correspondence; The first preset direction, the second preset direction and the thickness direction of the initial light-transmitting member are perpendicular to each other, the axial direction of the first part and the second preset direction are parallel to each other, and the axial direction of the second part and the first preset direction are parallel to each other.

11. An electronic device, characterized in that: An image sensing device comprising the image sensing device as claimed in any one of claims 1 to 8; or an image sensing device manufactured by the method for manufacturing an image sensing device as claimed in claim 9 or 10.

Images