Photovoltaic module and preparation method thereof

Abstract

The invention relates to the field of photovoltaic technology, in particular to a photovoltaic module and a preparation method thereof. The photovoltaic module comprises a glass cover plate, an anti-PID coating, a first bonding layer, a battery piece, a second bonding layer and a back plate which are stacked in sequence. The preparation raw materials of the anti-PID coating comprise a component A and a component B, the component A is prepared from the following components in parts by mass: 2 to 20 parts of peroxide oxidizing agent, 20 to 55 parts of first monomer, 1 to 15 parts of first cross-linking agent, 12 to 40 parts of first polymer resin and 0.1 to 5 parts of first auxiliary agent; the component B comprises the following components in parts by mass: 0.2-10 parts of an amine reducing agent, 20-55 parts of a second monomer, 1-15 parts of a second cross-linking agent, 12-40 parts of second polymer resin and 0.1-5 parts of a second auxiliary agent. The photovoltaic module is low in PID risk and long in service life.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic technology, and in particular to a photovoltaic module and a preparation method thereof. Background Art

[0002] Photovoltaic modules convert solar energy into electrical energy by absorbing sunlight. During the use of photovoltaic modules, PID effect will occur. PID effect, namely Potential Induced Degradation, refers to the phenomenon that the power of photovoltaic modules decays when they are subjected to a certain external voltage for a long time. The PID effect will cause the open circuit voltage, short circuit current and fill factor of photovoltaic modules to decrease, thereby affecting the power generation efficiency and service life of the modules.

[0003] In view of this, it is necessary to reduce the risk of PID in PV panels. Summary of the invention

[0004] The first aspect of the present application provides a photovoltaic module, and its technical solution is as follows:

[0005] A photovoltaic module comprises a glass cover plate, an anti-PID coating, a first adhesive layer, a battery sheet, a second adhesive layer and a back plate which are stacked in sequence;

[0006] The raw materials for preparing the anti-PID coating include component A and component B;

[0007] In parts by mass, the component A includes 2 to 20 parts of a peroxy oxidant, 20 to 55 parts of a first monomer, 1 to 15 parts of a first cross-linking agent, 12 to 40 parts of a first polymer resin, and 0.1 to 5 parts of a first auxiliary agent;

[0008] In parts by mass, the B component includes 0.2 to 10 parts of an amine reducing agent, 20 to 55 parts of a second monomer, 1 to 15 parts of a second cross-linking agent, 12 to 40 parts of a second polymer resin, and 0.1 to 5 parts of a second auxiliary agent.

[0009] The second aspect of the present application provides a method for preparing a photovoltaic module, and its technical solution is as follows:

[0010] A method for preparing a photovoltaic module comprises the following steps:

[0011] Mixing a peroxide oxidant, a first monomer, a first crosslinking agent, a first polymer resin and a first auxiliary agent according to the above-mentioned mass parts to prepare component A;

[0012] Mix the amine reducing agent, the second monomer, the second cross-linking agent, the second polymer resin and the second auxiliary agent according to the above mass parts to prepare component B;

[0013] Coating the A component and the B component on the inner surface of the glass cover to form an anti-PID coating;

[0014] A photovoltaic module is prepared by using the glass cover plate with the anti-PID coating. The structure of the photovoltaic module comprises a glass cover plate, an anti-PID coating, a first adhesive layer, a battery cell, a second adhesive layer and a back plate which are stacked in sequence.

[0015] Compared with the traditional solution, this application has the following beneficial effects:

[0016] The raw materials for preparing the anti-PID coating of the present application include component A and component B, wherein component A contains a specific oxidant, and component B contains a specific reducing agent. By matching the oxidant and the reducing agent, the anti-PID coating can be formed by mixing component A and component B at room temperature and curing. Compared with the photocuring method, the method for forming the anti-PID coating is convenient, and at the same time, the anti-PID coating can also play a role in blocking the migration of Na+, and can prevent Na+ precipitated from the glass cover from migrating through the first bonding layer to the surface of the battery cell, thereby reducing the risk of PID occurring in the photovoltaic module, which is beneficial to improving the anti-PID performance of the photovoltaic module, ensuring the normal operation of the photovoltaic module, and extending the service life of the photovoltaic module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application and to more completely understand the present application and its beneficial effects, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0018] Figure 1 It is a schematic structural diagram of a photovoltaic module according to one embodiment. DETAILED DESCRIPTION

[0019] The present application will be further described in detail below in conjunction with specific embodiments. The present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly understood.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0021] the term

[0022] Unless otherwise specified or incompatible herewith, the terms and phrases used herein shall have the following meanings:

[0023] In the present application, "plurality", "multiple", "multiple times", "plurality", etc., unless otherwise specified, refer to a number greater than 2 or equal to 2. For example, "one or more" means one or greater than or equal to two.

[0024] In this application, "optionally", "optional" and "optional" refer to optional, that is, to any one of the two parallel schemes of "yes" or "no". If multiple "options" appear in a technical solution, unless otherwise specified and there is no contradiction or mutual restriction, each "optional" is independent.

[0025] In this application, in the "first aspect", "second aspect", "third aspect", "fourth aspect", etc., the terms "first", "second", "third", "fourth", etc. are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first", "second", "third", "fourth", etc. only serve the purpose of non-exhaustive enumeration and description, and it should be understood that they do not constitute a closed limitation on quantity.

[0026] In the present application, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] In the present application, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. It should also be understood that when explaining the connection relationship or positional relationship of elements, although not explicitly described, the connection relationship and positional relationship are interpreted as including an error range, which should be within the acceptable deviation range of a specific value determined by a person skilled in the art.

[0028] In the present application, when it comes to numerical intervals (i.e., numerical ranges), unless otherwise specified, the optional numerical distribution is considered continuous within the above numerical interval, and includes the two numerical endpoints (i.e., the minimum and maximum values) of the numerical range, and each numerical value between the two numerical endpoints. Unless otherwise specified, when the numerical interval only refers to the integers within the numerical interval, it includes the two endpoint integers of the numerical range, and each integer between the two endpoints. In this article, it is equivalent to directly listing each integer, such as t is an integer selected from 1 to 10, indicating that t is any integer selected from the integer group consisting of 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10. In addition, when multiple ranges are provided to describe features or characteristics, these ranges can be combined. In other words, unless otherwise specified, the ranges disclosed herein should be understood to include any and all sub-ranges included therein.

[0029] The temperature parameters in this application, unless otherwise specified, are allowed to be either constant temperature treatment or to vary within a certain temperature range. It should be understood that the constant temperature treatment allows the temperature to fluctuate within the accuracy range controlled by the instrument. Fluctuations within the range of ±5°C, ±4°C, ±3°C, ±2°C, and ±1°C are allowed.

[0030] In the present application, the percentage content, unless otherwise specified, refers to mass percentage for solid-liquid mixing and solid-solid mixing, and volume percentage for liquid-liquid mixing.

[0031] In this application, when it comes to percentage concentration, unless otherwise specified, it refers to the final concentration. The final concentration refers to the proportion of the added component in the system after the addition of the component.

[0032] In this application, room temperature refers to 10°C to 40°C.

[0033] The first aspect of the present application provides a photovoltaic module, see Figure 1 , the photovoltaic module 100 includes a glass cover plate 11, an anti-PID coating 12, a first adhesive layer 13, a cell sheet 14, a second adhesive layer 15 and a back sheet 16 which are stacked in sequence;

[0034] The raw materials for preparing the anti-PID coating include component A and component B;

[0035] In parts by mass, the component A includes 2 to 20 parts of a peroxy oxidant, 20 to 55 parts of a first monomer, 1 to 15 parts of a first cross-linking agent, 12 to 40 parts of a first polymer resin, and 0.1 to 5 parts of a first auxiliary agent;

[0036] In parts by mass, the B component includes 0.2 to 10 parts of an amine reducing agent, 20 to 55 parts of a second monomer, 1 to 15 parts of a second cross-linking agent, 12 to 40 parts of a second polymer resin, and 0.1 to 5 parts of a second auxiliary agent.

[0037] The raw materials for preparing the anti-PID coating of the present application include component A and component B, wherein component A contains a specific oxidant, and component B contains a specific reducing agent. By matching the oxidant and the reducing agent, the anti-PID coating can be formed by mixing component A and component B at room temperature and curing. Compared with the photocuring method, the method for forming the anti-PID coating is convenient, and at the same time, the anti-PID coating can also play a role in blocking the migration of Na+, and can prevent Na+ precipitated from the glass cover from migrating through the first bonding layer to the surface of the battery cell, thereby reducing the risk of PID occurring in the photovoltaic module, which is beneficial to improving the anti-PID performance of the photovoltaic module, ensuring the normal operation of the photovoltaic module, and extending the service life of the photovoltaic module.

[0038] Among them, the mass parts of peroxy oxidants include but are not limited to 2 parts, 5 parts, 10 parts, 15 parts, and 20 parts. The mass parts of the first monomer include but are not limited to 20 parts, 30 parts, 40 parts, 50 parts, and 55 parts. The mass parts of the first cross-linking agent include but are not limited to 1 part, 5 parts, 10 parts, and 15 parts. The mass parts of the first polymer resin include but are not limited to 12 parts, 20 parts, 30 parts, and 40 parts. The mass parts of the first auxiliary agent include but are not limited to 0.1 parts, 1 parts, 3 parts, and 5 parts.

[0039] The mass parts of the amine reducing agent include but are not limited to 0.2 parts, 0.5 parts, 1 parts, 5 parts, and 10 parts. The mass parts of the second monomer include but are not limited to 20 parts, 30 parts, 40 parts, 50 parts, and 55 parts. The mass parts of the second cross-linking agent include but are not limited to 1 part, 5 parts, 10 parts, and 15 parts. The mass parts of the second polymer resin include but are not limited to 12 parts, 20 parts, 30 parts, and 40 parts. The mass parts of the second auxiliary agent include but are not limited to 0.1 parts, 1 parts, 3 parts, and 5 parts.

[0040] Optionally, the peroxy oxidant is selected from one or more of benzoyl peroxide, lauroyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, di-tert-butyl peroxide, diisopropyl peroxide, tert-butyl perbenzoate, tert-butyl pervalerate, methyl ethyl ketone peroxide, cyclohexanone peroxide, diisopropyl peroxydicarbonate and dicyclohexyl peroxydicarbonate.

[0041] Optionally, the amine reducing agent is selected from one or more of N,N-dimethylaniline (DMA), N,N-dimethyl-p-toluidine (DMPT), N-methyl-N-2-hydroxyethyl-p-toluidine (MHPT), N,N-diethylaniline (DEA), N,N-dimethylacetamide (DMMA) and N-ethyl-N-hydroxyethylaniline (QA).

[0042] Optionally, the first monomer is selected from one or more of methyl methacrylate, methyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate, lauryl acrylate, stearyl acrylate, decyl acrylate, dodecyl acrylate, tetradecyl acrylate and hexadecyl acrylate.

[0043] Optionally, the second monomer is selected from one or more of methyl methacrylate, methyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate, lauryl acrylate, stearyl acrylate, decyl acrylate, dodecyl acrylate, tetradecyl acrylate and hexadecyl acrylate.

[0044] In some examples, the first monomer is selected the same as the second monomer.

[0045] Optionally, the first cross-linking agent is selected from one or more of 1,4-butylene glycol dimethacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, dipropylene glycol diacrylate and tetrahydrofuran acrylate.

[0046] Optionally, the second crosslinking agent is selected from one or more of 1,4-butylene glycol dimethacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, dipropylene glycol diacrylate and tetrahydrofuran acrylate.

[0047] In some examples, the first cross-linking agent and the second cross-linking agent are selected to be the same.

[0048] Optionally, the first polymer resin is selected from acrylic resins.

[0049] Optionally, the second polymer resin is selected from acrylic resins.

[0050] Optionally, the weight average molecular weight of the acrylic resin is 10000Da to 20000Da, wherein the weight average molecular weight of the acrylic resin includes but is not limited to 10000Da, 13000Da, 15000Da, 18000Da, and 20000Da.

[0051] In some examples, the first polymer resin and the second polymer resin are selected to be the same.

[0052] Optionally, the first auxiliary agent is selected from one or more of polyethylene glycol dimethacrylate, ethoxy pentaerythritol tetraacrylate, diisopropyl xanthate disulfide and zirconium phosphate.

[0053] Optionally, the second auxiliary agent is selected from one or more of polyethylene glycol dimethacrylate, ethoxy pentaerythritol tetraacrylate, diisopropyl xanthate disulfide and zirconium phosphate.

[0054] In some examples, the first auxiliary agent and the second auxiliary agent are selected the same.

[0055] Optionally, the amounts of component A and component B satisfy that the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0056] Optionally, the thickness of the anti-PID coating is 300 nm to 3000 nm, wherein the thickness of the anti-PID coating includes but is not limited to 300 nm, 500 nm, 800 nm, 1000 nm, 1500 nm, 2000 nm, 2500 nm, and 3000 nm.

[0057] Optionally, the material of the first adhesive layer includes ethylene-vinyl acetate copolymer (EVA).

[0058] Optionally, the second adhesive layer material includes ethylene-vinyl acetate copolymer (EVA).

[0059] The EVA adhesive layer has good packaging performance and can meet the use requirements of photovoltaic modules. The EVA adhesive layer is also UV-resistant and high-temperature-resistant.

[0060] In one example, the material of the first adhesive layer is the same as the material of the second adhesive layer.

[0061] A second aspect of the present application provides a method for preparing a photovoltaic module. In one embodiment, the method for preparing a photovoltaic module comprises the following steps:

[0062] Mixing a peroxide oxidant, a first monomer, a first crosslinking agent, a first polymer resin and a first auxiliary agent according to the above-mentioned mass parts to prepare component A;

[0063] Mix the amine reducing agent, the second monomer, the second cross-linking agent, the second polymer resin and the second auxiliary agent according to the above mass parts to prepare component B;

[0064] Coating the A component and the B component on the inner surface of the glass cover to form an anti-PID coating;

[0065] A photovoltaic module is prepared by using the glass cover plate with the anti-PID coating. The structure of the photovoltaic module comprises a glass cover plate, an anti-PID coating, a first adhesive layer, a battery cell, a second adhesive layer and a back plate which are stacked in sequence.

[0066] Component A of the present application contains a specific oxidant, and component B contains a specific reducing agent. By matching the oxidant and the reducing agent, component A and component B can be mixed and cured at room temperature to form an anti-PID coating. Compared with the photocuring method, the method for forming the anti-PID coating is convenient.

[0067] Optionally, the amounts of component A and component B satisfy that the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B. The amounts of component A and component B affect the overall performance of the coating, such as curing, cost, and light transmittance of the photovoltaic module.

[0068] Photovoltaic modules are prepared using the glass cover plate with the anti-PID coating. The anti-PID coating can block the migration of Na+ and prevent Na+ precipitated from the glass cover plate from passing through the first bonding layer and migrating to the surface of the cell, thereby reducing the risk of PID in the photovoltaic module and improving the anti-PID performance of the photovoltaic module.

[0069] The following is further described in conjunction with specific embodiments and comparative examples. The raw materials involved in the following specific embodiments and comparative examples, unless otherwise specified, can all be commercially available, the instruments used, unless otherwise specified, can all be commercially available, and the processes involved, unless otherwise specified, are all routinely selected by those skilled in the art.

[0070] Example 1

[0071] This embodiment provides a component A, a component B and an anti-PID coating, wherein, by weight, the component A includes 8 parts of methyl methacrylate (first monomer), 6 parts of isooctyl acrylate (first monomer), 8 parts of butyl acrylate (first monomer), 5 parts of tripropylene glycol diacrylate (first cross-linking agent), 6 parts of benzoyl peroxide (peroxide oxidizing agent), 15 parts of acrylic resin (first polymer resin) with a weight average molecular weight of 10,000, and 0.5 parts of polyethylene glycol dimethacrylate (first auxiliary agent); by weight, the component B includes 8 parts of methyl methacrylate (second monomer), 6 parts of isooctyl acrylate (second monomer), 8 parts of butyl acrylate (second monomer), 5 parts of tripropylene glycol diacrylate (second cross-linking agent), 3 parts of N,N-dimethylaniline (DMA, amine reducing agent), 15 parts of acrylic resin (second polymer resin) with a weight average molecular weight of 10,000, and 0.5 parts of polyethylene glycol dimethacrylate (second auxiliary agent).

[0072] The method for forming the anti-PID coating of this embodiment is: at room temperature, use a double tube to spray component A and component B simultaneously, and cure for 1 hour to obtain the anti-PID coating. The amount of component A and component B satisfies that the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0073] Example 2

[0074] This embodiment provides a component A, a component B and an anti-PID coating, wherein, by weight, the component A includes 12 parts of methyl methacrylate (first monomer), 10 parts of n-octyl acrylate (first monomer), 12 parts of butyl acrylate (first monomer), 2 parts of hexanediol diacrylate (first cross-linking agent), 4 parts of benzoyl peroxide (peroxide oxidizing agent), 12 parts of acrylic resin (first polymer resin) with a weight average molecular weight of 15,000, and 0.5 parts of polyethylene glycol dimethacrylate (first auxiliary agent); by weight, the component B includes 12 parts of methyl methacrylate (second monomer), 10 parts of n-octyl acrylate (second monomer), 12 parts of butyl acrylate (second monomer), 2 parts of hexanediol diacrylate (second cross-linking agent), 2 parts of N,N-dimethyl-p-toluidine (DMPT, amine reducing agent), 12 parts of acrylic resin (second polymer resin) with a weight average molecular weight of 15,000, and 1 part of polyethylene glycol dimethacrylate (second auxiliary agent).

[0075] The method for forming the anti-PID coating of this embodiment is: at room temperature, use a double tube to spray component A and component B simultaneously, and cure for 1 hour to obtain the anti-PID coating. The amount of component A and component B satisfies that the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0076] Example 3

[0077] This embodiment provides a component A, a component B and an anti-PID coating, wherein, by mass, the component A includes 20 parts of methyl methacrylate (first monomer), 15 parts of isooctyl acrylate (first monomer), 5 parts of methyl acrylate (first monomer), 10 parts of dipropylene glycol diacrylate (first cross-linking agent), 6 parts of benzoyl peroxide (peroxy oxidant), 20 parts of acrylic resin with a weight average molecular weight of 10,000 (first polymer resin), and 1.5 parts of polyethylene glycol dimethacrylate (first auxiliary agent); by mass, the component B includes. 20 parts of methyl methacrylate (second monomer), 15 parts of isooctyl acrylate (second monomer), 5 parts of methyl acrylate (second monomer), 10 parts of dipropylene glycol diacrylate (second cross-linking agent), 4 parts of reducing agent N,N-dimethylaniline (DMA, amine reducing agent), 1 part of N,N-dimethyl-p-toluidine (DMPT, reducing agent), 20 parts of acrylic resin with a weight average molecular weight of 10,000 (second polymer resin), and 1.5 parts of polyethylene glycol dimethacrylate (second auxiliary agent).

[0078] The method for forming the anti-PID coating of this embodiment is: at room temperature, use a double tube to spray component A and component B simultaneously, and cure for 1 hour to obtain the anti-PID coating. The amount of component A and component B satisfies that the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0079] Performance Testing

[0080] The components A and B of the above-mentioned embodiments are coated on a photovoltaic glass cover plate, and the anti-PID coating of each embodiment is formed on the photovoltaic glass cover plate to obtain the samples to be tested in each embodiment. The specific method is: use a double tube to spray component A and component B on the photovoltaic glass cover plate at the same time, and cure at room temperature for 1 hour. The thickness of the PID coating on the samples to be tested in each embodiment is shown in Table 1. At the same time, a photovoltaic glass cover plate that is not coated is set as a blank control sample.

[0081] The PID test was performed on the samples to be tested and the blank control samples in the above embodiments with reference to the IEC61215 standard, and the transmittance test was performed on the samples to be tested and the blank control samples in the above embodiments with reference to the GB / T 40415-2021 standard. The test results are shown in Table 1.

[0082] Table 1

[0083]

[0084] It can be clearly seen from Table 1 that, compared with the blank photovoltaic glass cover plate not coated with component A and component B, the photovoltaic glass cover plate sprayed with component A and component B to form an anti-PID coating has significantly lower PID96h and PID192h attenuation rates, indicating that the anti-PID coating formed plays a positive role in improving the anti-PID performance. In addition, the light transmittance of the anti-PID coating is also high, which can effectively guarantee the light transmittance of the photovoltaic module.

[0085] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A photovoltaic module, characterized in that: It includes a glass cover plate, an anti-PID coating, a first adhesive layer, a battery cell, a second adhesive layer and a back plate which are stacked in sequence; The raw materials for preparing the anti-PID coating include component A and component B; In parts by mass, the component A includes 2 to 20 parts of a peroxy oxidant, 20 to 55 parts of a first monomer, 1 to 15 parts of a first cross-linking agent, 12 to 40 parts of a first polymer resin, and 0.1 to 5 parts of a first auxiliary agent; In parts by mass, the B component includes 0.2 to 10 parts of an amine reducing agent, 20 to 55 parts of a second monomer, 1 to 15 parts of a second cross-linking agent, 12 to 40 parts of a second polymer resin, and 0.1 to 5 parts of a second auxiliary agent.

2. The photovoltaic module according to claim 1, characterized in that: The peroxy oxidant is selected from one or more of benzoyl peroxide, lauroyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, di-tert-butyl peroxide, diisopropyl peroxide, tert-butyl perbenzoate, tert-butyl pervalerate, methyl ethyl ketone peroxide, cyclohexanone peroxide, diisopropyl peroxydicarbonate and dicyclohexyl peroxydicarbonate.

3. The photovoltaic module according to claim 1, characterized in that: The amine reducing agent is selected from one or more of N,N-dimethylaniline, N,N-dimethyl-p-toluidine, N-methyl-N-2-hydroxyethyl-p-toluidine, N,N-diethylaniline, N,N-dimethylacetamide and N-ethyl-N-hydroxyethylaniline.

4. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The first monomer and the second monomer are each independently selected from one or more of methyl methacrylate, methyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate, lauryl acrylate, stearyl acrylate, decyl acrylate, dodecyl acrylate, myristyl acrylate and hexadecyl acrylate.

5. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The first crosslinking agent and the second crosslinking agent are each independently selected from one or more of 1,4-butylene glycol dimethacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, dipropylene glycol diacrylate and tetrahydrofuran acrylate.

6. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The first polymer resin and the second polymer resin are each independently selected from acrylic resin, and the weight average molecular weight of the acrylic resin is 10000Da to 20000Da.

7. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The first auxiliary agent and the second auxiliary agent are each independently selected from one or more of polyethylene glycol dimethacrylate, ethoxy pentaerythritol tetraacrylate, diisopropyl xanthate disulfide and zirconium phosphate.

8. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The thickness of the anti-PID coating is 300nm~3000nm.

9. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The materials of the first adhesive layer and the second adhesive layer each independently include ethylene-vinyl acetate copolymer.

10. A method for preparing a photovoltaic module, characterized in that: The following steps are involved: Mixing the peroxide oxidant, the first monomer, the first crosslinking agent, the first polymer resin and the first auxiliary agent in parts by weight according to any one of claims 1 to 9 to prepare component A; Mixing the amine reducing agent, the second monomer, the second crosslinking agent, the second polymer resin and the second auxiliary agent in parts by weight according to any one of claims 1 to 9 to prepare component B; Coating the A component and the B component on the inner surface of the glass cover to form an anti-PID coating; A photovoltaic module is prepared by using the glass cover plate with the anti-PID coating. The structure of the photovoltaic module comprises a glass cover plate, an anti-PID coating, a first adhesive layer, a battery cell, a second adhesive layer and a back plate which are stacked in sequence.

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