Multi-layer packaging manufacturing process for improving thermal stability of photovoltaic module

Abstract

The invention relates to the technical field of photovoltaic module multi-layer packaging manufacturing, and discloses a multi-layer packaging manufacturing process for improving the thermal stability of a photovoltaic module, and the process comprises the following steps: S1, providing a substrate layer which is made of a fluorine-containing polymer material; s2, a layer of anti-ultraviolet protective film is deposited on the base material layer, the protective film is formed by combining titanium dioxide and zinc oxide materials, and the thermal stability and durability of the photovoltaic module are remarkably improved by introducing a multi-layer packaging process. Specifically, the fluorine-containing polymer material is adopted as the base material layer, so that the base material layer has excellent weather resistance and chemical stability, and the resistance of the photovoltaic module to the external severe environment is enhanced. The anti-ultraviolet protective film formed by combining titanium dioxide and zinc oxide can effectively shield ultraviolet radiation, reduce long-term damage of ultraviolet rays to the assembly and delay the aging process.

Description

Technical Field

[0001] The invention relates to the technical field of photovoltaic module multilayer packaging manufacturing, and in particular to a multilayer packaging manufacturing process for improving the thermal stability of photovoltaic modules. Background Art

[0002] The multi-layer packaging manufacturing process that improves the thermal stability of photovoltaic modules improves the thermal stability of photovoltaic modules in extreme environments by using a multi-layer structure and optimizing material selection. This process mainly enhances the heat resistance, UV resistance, and moisture resistance of the module through multi-layer design and material combination, thereby extending the service life of the photovoltaic module.

[0003] Traditional packaging methods have deficiencies in UV protection, moisture resistance, temperature resistance and mechanical protection. Single materials or films are prone to aging, traditional EVA materials have limited moisture resistance in high humidity environments, and traditional packaging materials have poor stability at extreme temperatures, insufficient mechanical strength, and uneven thickness control. These drawbacks make components vulnerable to damage during long-term use, affecting their overall performance and service life. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules, which solves the problems of the traditional packaging method in terms of UV protection, moisture resistance, temperature resistance and mechanical protection, the easy aging of single materials or films, and the limited moisture resistance of traditional EVA materials in high humidity environments.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules, comprising the following steps: S1: providing a substrate layer, wherein the substrate layer is made of a fluorine-containing polymer material; S2: depositing a layer of anti-ultraviolet protective film on the substrate layer, wherein the protective film is formed by combining titanium dioxide and zinc oxide materials; S3: applying a high and low temperature resistant layer on the anti-ultraviolet protective film, wherein the high and low temperature resistant layer is composed of a silicone resin and a carbon fiber composite material and has a thickness of 200 to 300 microns; S4: coating a moisture-proof protective layer on the high and low temperature resistant layer, wherein the moisture-proof protective layer is composed of ethylene-vinyl acetate and polyvinyl alcohol materials in a weight ratio of 3:2 and has a thickness of 150 to 250 microns; S5: Covering the moisture-proof protective layer with a wear-resistant protective layer, wherein the wear-resistant protective layer is composed of polyethylene terephthalate and polycarbonate in a weight ratio of 4:1 and has a thickness of 50 to 100 microns;

[0006] Preferably, the anti-ultraviolet protective film is deposited on the substrate layer by a magnetron sputtering process.

[0007] Preferably, the volume ratio of the silicone resin to the carbon fiber composite material of the high and low temperature resistant layer is 6:4.

[0008] Preferably, the moisture-proof protective layer is prepared by a co-extrusion molding process and is directly coated on the high and low temperature resistance layer.

[0009] Preferably, the wear-resistant protective layer is prepared by a hot pressing process and is tightly combined with the moisture-proof protective layer by an adhesive.

[0010] Preferably, the overall thickness of the multi-layer packaging structure is controlled between 500 and 800 microns.

[0011] Preferably, the multi-layer packaging structure is completed by a lamination process, heating each layer of material to 120 to 150 degrees Celsius and applying a pressure of 0.5 to 1.5 MPa.

[0012] Preferably, the multi-layer packaging structure is subjected to vacuum cooling treatment after lamination to ensure the adhesion and structural tightness of each layer. Beneficial Effects

[0013] The present invention provides a multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules. Compared with the prior art, it has the following beneficial effects: In the present invention, by introducing a multi-layer packaging process, the thermal stability and durability of the photovoltaic module are significantly improved. Specifically, the fluorine-containing polymer material is used as the substrate layer, so that it has excellent weather resistance and chemical stability, thereby enhancing the resistance of the photovoltaic module to the harsh external environment. The anti-ultraviolet protective film formed by the combination of titanium dioxide and zinc oxide can effectively shield ultraviolet radiation, reduce the long-term damage of ultraviolet rays to the module, and delay the aging process. The high and low temperature resistant layer made of silicone resin and carbon fiber composite material ensures the structural stability of the module at extreme temperatures and prevents deformation or cracking of the material caused by temperature changes. The moisture-proof protective layer further improves the moisture-proof performance of the module in a high humidity environment through the optimized combination of ethylene-vinyl acetate and polyvinyl alcohol, and reduces the risk of water vapor penetration. Finally, the introduction of the wear-resistant protective layer enables the module to resist mechanical wear during long-term use, thereby improving the overall durability and service life. Through the synergistic effect of the above-mentioned multi-layer structure, the packaging process significantly enhances the performance stability of the photovoltaic module under different environmental conditions, prolongs its service life, and provides a strong guarantee for the long-term operation of the photovoltaic power station. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1The present invention is a schematic flow chart of a multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] Please refer to Figure 1, which specifically includes the following embodiments: Example

[0017] A multi-layer packaging manufacturing process for improving the thermal stability of a photovoltaic module comprises the following steps: S1: Provide a substrate layer, the substrate layer is made of a fluoropolymer material, and the substrate layer is made of a fluoropolymer material, usually polytetrafluoroethylene or polyvinyl fluoride. These materials have excellent chemical corrosion resistance, UV resistance and low surface energy, and can effectively prevent external chemicals and ultraviolet rays from damaging photovoltaic modules. The thickness of the substrate layer should be 100 to 150 microns to ensure good mechanical strength and stability; S2: Depositing an anti-ultraviolet protective film on the substrate layer, the protective film is formed by a combination of titanium dioxide and zinc oxide materials. The anti-ultraviolet protective film is a mixture of titanium dioxide and zinc oxide in an appropriate proportion and deposited on the substrate layer by a magnetron sputtering process. The main function of the film is to shield the ultraviolet radiation from the photovoltaic module and prevent ultraviolet rays from causing long-term damage to the substrate and other packaging layers of the photovoltaic module. The combination of titanium dioxide and zinc oxide not only provides broad-spectrum ultraviolet protection, but also improves the wear resistance and optical transparency of the film. The thickness of the film is usually 50 to 100 microns; S3: Apply a high and low temperature resistant layer on the anti-ultraviolet protective film. The high and low temperature resistant layer is composed of silicone resin and carbon fiber composite material with a thickness of 200 to 300 microns. The high and low temperature resistant layer is composed of silicone resin and carbon fiber composite material, wherein silicone resin provides excellent high and low temperature resistance and elasticity, while carbon fiber enhances the strength and rigidity of the material. The combination of the two enables the packaging layer to maintain its structural stability under extreme temperature changes. The thickness of this layer is 200 to 300 microns, ensuring sufficient thermal insulation and mechanical protection functions; S4: Coat a moisture-proof protective layer on the high and low temperature resistant layer. The moisture-proof protective layer is composed of ethylene-vinyl acetate and polyvinyl alcohol materials in a weight ratio of 3:2, with a thickness of 150 to 250 microns. The moisture-proof protective layer is made of a mixture of ethylene-vinyl acetate and polyvinyl alcohol. EVA has good flexibility and bonding properties, while PVA has excellent waterproof properties. The two are mixed in a weight ratio of 3:2, which can effectively prevent water vapor penetration in high humidity environments and protect the interior of photovoltaic modules from moisture. The thickness of the moisture-proof protective layer should be 150 to 250 microns to provide sufficient moisture-proof effect; S5: Cover the moisture-proof protective layer with a wear-resistant protective layer, which is composed of polyethylene terephthalate and polycarbonate in a weight ratio of 4:1 and a thickness of 50 to 100 microns. The wear-resistant protective layer is made of polyethylene terephthalate and polycarbonate. PET provides excellent transparency and weather resistance, while PC increases impact resistance. The two are mixed in a weight ratio of 4:1, which can effectively resist external mechanical impact and friction and protect the underlying structure from wear. The thickness of this layer should be 50 to 100 microns to ensure good wear resistance.

[0018] The anti-UV protective film is deposited on the substrate layer through the magnetron sputtering process. The magnetron sputtering process is a physical vapor deposition technology that forms a thin film by sputtering target atoms or molecules onto the surface of the substrate in a high vacuum environment. This process can evenly deposit the anti-UV protective film on the substrate layer, control the thickness and composition of the film layer, and improve the adhesion and durability of the film layer.

[0019] The volume ratio of the siloxane resin and carbon fiber composite material of the high and low temperature resistant layer is 6:4, ensuring that the material has good temperature stability and mechanical strength. The siloxane resin provides excellent temperature adaptability, while the carbon fiber increases the rigidity and deformation resistance of the structure. This ratio combination optimizes the performance of the high and low temperature resistant layer.

[0020] The moisture-proof protective layer is prepared by a co-extrusion process and directly coated on the high and low temperature resistant layer. The co-extrusion process extrudes multiple materials simultaneously in the same extrusion equipment and stacks them to form a composite material. This process can obtain uniform thickness and structure on the moisture-proof protective layer, which is directly coated on the high and low temperature resistant layer without the need for additional bonding steps, simplifying the production process and improving the adhesion between layers.

[0021] The wear-resistant protective layer is prepared by a hot pressing process and is tightly bonded to the moisture-proof protective layer by an adhesive. The hot pressing process heats the wear-resistant protective layer material to a molten state at a high temperature and then forms it by pressure. The completed wear-resistant protective layer is bonded to the moisture-proof protective layer using an adhesive to ensure a tight bond between the layers and improve the structural stability and durability of the overall package.

[0022] The overall thickness of the multi-layer encapsulation structure is controlled between 500 and 800 microns to ensure adequate protection while maintaining the flexibility and lightness of the photovoltaic modules. This thickness range ensures effective bonding between the layers and provides the necessary mechanical strength and environmental resistance.

[0023] The multi-layer packaging structure is completed through a lamination process, in which each layer of material is heated to 120 to 150 degrees Celsius and a pressure of 0.5 to 1.5 MPa is applied. The lamination process bonds the layers of material together by heating and applying pressure. Heating to 120 to 150 degrees Celsius can enable the adhesive or molten material to achieve the best bonding state, while applying a pressure of 0.5 to 1.5 MPa ensures a close bond between the layers and avoids the generation of bubbles and gaps.

[0024] The multi-layer packaging structure undergoes vacuum cooling after lamination to ensure the adhesion and structural tightness of each layer. The vacuum cooling process is to gradually cool the multi-layer packaging structure in a vacuum environment to avoid material warping or interlayer peeling caused by uneven cooling. This process can ensure the adhesion and structural tightness between each layer, maintaining the integrity and long-term stability of the packaging structure.

[0025] When working, the multi-layer packaging manufacturing process of the invention achieves the purpose of improving the thermal stability and durability of photovoltaic modules by optimizing different functional materials layer by layer. First, the substrate layer adopts fluorinated polymer material, which has excellent chemical stability and weather resistance, can effectively resist external chemical corrosion and ultraviolet radiation, and maintains low hygroscopicity, which provides a good basic protection for photovoltaic modules. Then, a layer of titanium dioxide (TiO2 ) and zinc oxide (ZnO). This layer is deposited by magnetron sputtering process, so that titanium dioxide and zinc oxide particles are evenly distributed to form an effective UV barrier, reducing the erosion of UV rays on the substrate and subsequent layer structures. On the anti-UV protective film, a high and low temperature resistant layer composed of silicone resin and carbon fiber composite materials is applied. This layer ensures the stability of the component under extreme temperatures through its excellent temperature resistance and mechanical properties. Silicone resin provides excellent elasticity and temperature resistance, while carbon fiber enhances the strength and deformation resistance of the material. The combination of the two ensures the structural integrity of the material in high and low temperature environments. Then, a moisture-proof protective layer is coated on the high and low temperature resistant layer. It is composed of ethylene vinyl acetate (EVA) and polyvinyl alcohol (PVA) materials in a specific proportion and is prepared by co-extrusion molding process. The main function of this layer is to prevent the penetration of water vapor. EVA material provides flexibility and adhesion, while PVA provides excellent waterproofness. The combination of the two forms an effective waterproof barrier. Finally, the wear-resistant protective layer is made of polyethylene terephthalate (PET) and polycarbonate (PC), prepared through a hot pressing process and tightly bonded to the moisture-proof protective layer through an adhesive. The combination of PET and PC materials gives this layer good wear resistance and impact resistance, and can effectively resist mechanical wear and external impacts during long-term use, further improving the durability and service life of photovoltaic modules. Through the layer-by-layer optimized multi-layer packaging structure, this process ensures the stability of photovoltaic modules under various harsh environmental conditions and greatly extends the service life of the modules.

[0026] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the application should be included in the protection scope of the present application.

Claims

1. A multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules, characterized in that: The following steps are involved: S1: providing a substrate layer, wherein the substrate layer is made of a fluorine-containing polymer material; S2: depositing a layer of anti-ultraviolet protective film on the substrate layer, wherein the protective film is formed by combining titanium dioxide and zinc oxide materials; S3: applying a high and low temperature resistant layer on the anti-ultraviolet protective film, wherein the high and low temperature resistant layer is composed of a silicone resin and a carbon fiber composite material and has a thickness of 200 to 300 microns; S4: coating a moisture-proof protective layer on the high and low temperature resistant layer, wherein the moisture-proof protective layer is composed of ethylene-vinyl acetate and polyvinyl alcohol materials in a weight ratio of 3:2 and has a thickness of 150 to 250 microns; S5: Covering the moisture-proof protective layer with a wear-resistant protective layer, wherein the wear-resistant protective layer is composed of polyethylene terephthalate and polycarbonate in a weight ratio of 4:1 and has a thickness of 50 to 100 microns.

2. A multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 1, characterized in that: The anti-ultraviolet protective film is deposited on the substrate layer by a magnetron sputtering process.

3. The multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 1, characterized in that: The volume ratio of the silicone resin to the carbon fiber composite material of the high and low temperature resistant layer is 6:

4.

4. The multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 1, characterized in that: The moisture-proof protective layer is prepared by a co-extrusion molding process and is directly coated on the high and low temperature resistance layer.

5. The multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 1, characterized in that: The wear-resistant protective layer is prepared by a hot pressing process and is tightly combined with the moisture-proof protective layer by an adhesive.

6. The multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 1, characterized in that: The overall thickness of the multi-layer packaging structure is controlled between 500 and 800 microns.

7. A multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 6, characterized in that: The multi-layer packaging structure is completed through a lamination process, where each layer of material is heated to 120 to 150 degrees Celsius and a pressure of 0.5 to 1.5 MPa is applied.

8. The multi-layer packaging manufacturing process for improving the thermal stability of photovoltaic modules according to claim 6, characterized in that: The multi-layer packaging structure is subjected to a vacuum cooling process after lamination to ensure the adhesion and structural tightness of each layer.

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