Co-frequency simultaneous full duplex millimeter wave packaging antenna based on glass substrate

Abstract

The invention discloses a co-frequency co-time full duplex millimeter wave packaging antenna based on a glass substrate. The co-frequency co-time full duplex millimeter wave packaging antenna comprises a first polymer layer, a glass substrate, a second polymer layer and a third polymer layer, the antenna assembly is divided into a receiving antenna and a transmitting antenna which are symmetrical by sharing metalized through holes which are arranged diagonally; the transmitting antenna and the receiving antenna are respectively connected with a microstrip line; each microstrip line is electrically connected with the two metalized through holes respectively; the two sides of the shared metalized through hole are respectively provided with a row of symmetrical metal connecting columns which are rotationally symmetrical. And two resonance metal strips which are rotationally and symmetrically arranged at the bottom of the third polymer layer are electrically connected with the metal connecting columns and are combined into a resonance decoupling assembly. According to the antenna, the transmitting antenna and the receiving antenna are divided by taking the shared metallized through holes as boundaries, and the corresponding resonance decoupling assemblies are arranged by adjusting the number and spacing of the shared metallized through holes, so that the antenna structure is more compact while the transceiving isolation is improved, and consistent linear polarization radiation characteristics are kept during transmitting and receiving.

Description

Technical Field

[0001] The present application relates to the technical field of wireless communication equipment, and in particular to a glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna. Background Art

[0002] With the full deployment of 5G networks and the advancement of millimeter wave (mm-Wave) technology, improving spectrum efficiency and system capacity have become key requirements for achieving higher data rates and lower latency. In recent years, simultaneous transmit and receive (STAR) technology, also known as in-band full-duplex (IBFD) technology, has attracted widespread attention from the industry and academia because it can theoretically double the spectrum efficiency and system capacity of a wireless communication system. In practical applications, achieving the expected doubling of system capacity is severely affected by self-interference (SI) between the transmitter and the receiver. The key challenge in achieving STAR operation is to meet the high self-interference cancellation (SIC) requirements, which requires sufficient isolation (110dB) between the transmitter (TX) and the receiver (RX) through a series of SIC techniques across antenna, analog and digital domains. Due to the relative difficulty of improving SIC in the analog and digital domains, it becomes particularly critical to ensure high isolation in the antenna domain. In addition, combining STAR technology with mm-Wave deployment is a promising solution to reduce backhaul costs in dense networks by reducing the reliance on high-density fiber connections while improving spectrum efficiency.

[0003] In the field of STAR antennas, high transmit-receive isolation, similar radiation patterns, and consistent linear polarization between transmission and reception have attracted great interest from a wide range of peers, but are also extremely challenging. In order to achieve co-linear polarization (Co-CP) simultaneous transmit and receive antennas, past studies have proposed different technologies, which can be roughly divided into three categories: 1) using decoupling structures (such as electromagnetic bandgap structures (EBG), defective ground (DFG) and baffles, etc.) and decoupling networks, 2) near-field cancellation technology, and 3) mode superposition method. However, most antennas in existing technologies operate in low-frequency microwave bands, and only antennas in a small number of technologies can operate in the 5G millimeter wave band. Moreover, although some antennas have achieved good isolation, there are problems such as a certain distance between the transmit and receive antennas, insufficient compactness, complex structure, and unstable performance.

[0004] Therefore, the simultaneous transmitting and receiving antenna in the prior art method has the problems of complex structure and poor stability. Summary of the invention

[0005] The embodiment of the present application provides a glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, which aims to solve the problems of complex structure and poor stability of the simultaneous transmitting and receiving antenna in the prior art method.

[0006] The embodiment of the present application provides a glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, which includes a first polymer layer, a glass substrate, a second polymer layer and a third polymer layer stacked in sequence;

[0007] The surface layer of the first polymer layer is provided with an antenna component; the metal layer provided on the bottom layer of the third polymer is composed of a resonant metal strip and a metal connecting sheet for electrical connection; metal layers are provided between the first polymer layer and the glass substrate, between the glass substrate and the second polymer layer, and between the second polymer layer and the third polymer layer; a shared metallized through hole sequentially penetrates the first polymer layer, the glass substrate, the second polymer layer and the third polymer layer, so as to electrically connect the antenna component, the resonant metal strip and each of the metal layers; a metal connecting column penetrating the polymer layer is also provided in the polymer layer; the glass through hole metal connecting column provided in the glass substrate and the metal connecting columns in the polymer layers at both ends are interconnected through each metal layer to form the shared metallized through hole;

[0008] The metal layer disposed between the glass substrate and the second polymer layer is a ground layer; a bottom plate is also disposed on the side opposite to the third polymer layer; a bottom plate connection column disposed in the bottom plate penetrates the bottom plate and electrically connects the metal layers disposed on both sides of the bottom plate; the metal layer on the bottom plate close to the third polymer layer is electrically connected to the metal layer at the bottom of the third polymer layer through a solder ball; the antenna assembly is divided into a symmetrically disposed receiving antenna and a transmitting antenna by a diagonally disposed shared metallized through hole; the transmitting antenna and the receiving antenna are respectively connected to a microstrip line; each of the microstrip lines is electrically connected to two metal connection columns located at both ends for feeding; a row of rotationally symmetrical metal connection columns are respectively disposed on both sides of the shared metallized through hole;

[0009] Two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting column and combined into a resonant decoupling component; a clearance groove is provided on the metal layer on the side of the base plate close to the third polymer layer at a position relative to the resonant metal strip; a transmitting port and a receiving port arranged on the side of the base plate away from the solder ball are respectively connected to the first port and the second port arranged on the metal layer at the bottom of the third polymer layer through a port feeder, the base plate connecting column and the solder ball.

[0010] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the microstrip line is arranged at both ends of the shared metallized through hole, and the connection between the transmitting antenna and the microstrip line and the connection between the receiving antenna and the microstrip line are both provided with notches.

[0011] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the through-glass metal connecting column is composed of metal filled in the through-glass hole set on the glass substrate;

[0012] The hole diameter of the through glass hole at one end close to the first polymer layer is larger than the hole diameter at one end close to the second polymer layer.

[0013] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the aperture of the glass through hole close to one end of the first polymer layer is 33-47 microns;

[0014] The diameter of the through glass hole at one end close to the second polymer layer is 8-22 microns.

[0015] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein a plurality of connecting through holes are provided at the edge of the third polymer layer, and metal connecting columns pass through the connecting through holes.

[0016] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the two resonant metal strips are arranged in a centrally symmetrical manner.

[0017] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the resonant metal strip is a rectangular resonant metal strip, and the clearance slot is a rectangular clearance slot.

[0018] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the first port and the second port are respectively arranged at the top corners of the periphery of the rectangular resonant metal strip.

[0019] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the first port and the second port are each composed of seven port through holes, one of the seven port through holes is located in the center, and six port through holes are arranged around the periphery, and metal connecting columns pass through the port through holes.

[0020] The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna, wherein the spacing between the symmetrical metal connecting columns arranged on both sides of the shared metallized through-hole is greater than the spacing between the shared metallized through-holes.

[0021] The embodiment of the present application provides a glass-based, co-frequency, simultaneous full-duplex millimeter wave packaged antenna, comprising a first polymer layer, a glass substrate, a second polymer layer, and a third polymer layer stacked in sequence; the antenna assembly is divided into a symmetrically arranged receiving antenna and a transmitting antenna by a diagonally arranged shared metallized through hole; the transmitting antenna and the receiving antenna are respectively connected to a microstrip line; each microstrip line is electrically connected to two metallized through holes; a row of rotationally symmetrical metal connecting columns are respectively arranged on both sides of the shared metallized through hole; two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting columns and combined into a resonant decoupling component. The glass through hole metal connecting column arranged in the glass substrate and the metal connecting columns in the polymer layer at both ends are interconnected through each metal layer to form a shared metallized through hole, and the transmitting antenna and the receiving antenna are arranged back to back with the shared metallized through hole as the boundary. By adjusting the number and spacing of the shared metallized through holes, the corresponding resonant decoupling component is arranged using the shared metallized through hole, while improving the transmit-receive isolation, the antenna structure is made more compact, and consistent linear polarization radiation characteristics are maintained in the transmit mode and the receive mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A cross-sectional structural diagram of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0024] Figure 2 An exploded structural diagram of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0025] Figure 3 A partial structural diagram of a glass-based, same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0026] Figure 4 Another partial structural diagram of the glass-based same-frequency simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0027] Figure 5 Another partial structural diagram of the glass-based same-frequency simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0028] Figure 6 Another partial structural diagram of the glass-based same-frequency simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0029] Figure 7 A schematic diagram of the effect of a glass-based same-frequency, simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application;

[0030] Figure 8 Another effect schematic diagram of the glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna provided in an embodiment of the present application;

[0031] Fig. 9 This is another effect schematic diagram of the glass-based same-frequency simultaneous full-duplex millimeter-wave packaged antenna provided in an embodiment of the present application.

[0032] Figure numbers: P1, first polymer layer; G, glass substrate; P2, second polymer layer; P3, third polymer layer; 11, antenna component; 12, resonant metal strip; 131, feed metal connecting column; 132, resonant structure metal connecting column; 133, symmetrical metal connecting column; 14, ground layer; P4, bottom plate; 21, bottom plate connecting column; 22, solder ball; 31, shared metalized through hole; 111, receiving antenna; 112, transmitting antenna; 113, microstrip line; 311, glass through hole metal connecting column; 23, clearance slot; 41, transmitting port; 42, receiving port; 43, port feeder; 122, first port; 123, second port; 114, notch. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0035] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0036] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0037] See also Figure 1 and Figure 2As shown in the figure, a glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna comprises a first polymer layer P1, a glass substrate G, a second polymer layer P2 and a third polymer layer P3 which are stacked in sequence; the surface layer of the first polymer layer P1 is provided with an antenna component 11; the metal layer provided at the bottom layer of the third polymer layer is composed of a resonant metal strip 12 and a metal connecting sheet for electrical connection; metal layers are provided between the first polymer layer P1 and the glass substrate G, between the glass substrate G and the second polymer layer P2, and between the second polymer layer P2 and the third polymer layer P3; a shared metallized through hole 31 passes through the first polymer layer P1 in sequence. The antenna assembly 11, the resonant metal strip 12 and the metal layers are electrically connected to each other through a polymer layer P1, a glass substrate G, a second polymer layer P2 and a third polymer layer P3, and a metal connecting column penetrating the polymer layer is also provided in the polymer layer; a glass through-hole metal connecting column 311 provided in the glass substrate G is interconnected with the metal connecting columns in the polymer layers at both ends through the metal layers to form the shared metalized through-hole 31; the metal layer provided between the glass substrate G and the second polymer layer P2 is a ground layer 14; a bottom plate P4 is also provided on the side opposite to the third polymer layer P3; a bottom plate connecting column 311 provided in the bottom plate P4 is interconnected with the metal connecting columns in the polymer layers at both ends through the metal layers to form the shared metalized through-hole 31; a metal layer provided between the glass substrate G and the second polymer layer P2 is a ground layer 14; a bottom plate P4 is also provided on the side opposite to the third polymer layer P3; a bottom plate connecting column 311 provided in the bottom plate P4 is interconnected with the metal connecting column 311 in the glass substrate G and the metal connecting column 311 in the polymer layers at both ends to form the shared metalized through-hole 31; a metal layer provided between the glass substrate G and the second polymer layer P2 is a ground layer 14; a bottom plate P4 is provided on the side opposite to the third polymer layer P3; a bottom plate connecting column 311 provided in the bottom plate P4 is interconnected with ... The connecting post 21 penetrates the bottom plate P4 and electrically connects the metal layers arranged on both sides of the bottom plate P4; the metal layer on the bottom plate P4 close to the third polymer layer P3 is electrically connected to the metal layer at the bottom of the third polymer layer P3 through the solder ball 22; the antenna component 11 is divided into a symmetrically arranged receiving antenna 111 and a transmitting antenna 112 by a diagonally arranged shared metallized through hole 31; the transmitting antenna 112 and the receiving antenna 111 are respectively connected to a microstrip line 113; each of the microstrip lines 113 is electrically connected to two metal connecting posts at both ends for feeding; a row of rotating Symmetrical metal connecting columns 133; the two relatively arranged resonant metal strips 12 are electrically connected to the metal connecting columns penetrating the second polymer layer P2 and the third polymer layer P3 and are combined into a resonant decoupling component; a clearance groove 23 is provided on the metal layer on the side of the bottom plate P4 close to the third polymer layer P3 at a position relative to the resonant metal strip 12; a transmitting port 41 and a receiving port 42 arranged on the side of the bottom plate P4 away from the solder ball 22 are respectively connected to the first port 122 and the second port 123 arranged on the metal layer at the bottom of the third polymer layer P3 through a port feeder 43, the bottom plate connecting column 21 and the solder ball 22.

[0038] The metal connecting pillars can be divided into four categories, including feed metal connecting pillars 131, resonant structure metal connecting pillars 132 and metallized through holes 13, wherein the metallized through holes 13 include symmetrical metal connecting pillars 133 and shared metallized through holes 31, as shown in FIG. Figure 1 and Figure 2 shown.

[0039] In a more specific embodiment, the microstrip line 113 is disposed at both ends of the shared metallized through hole 31, and a notch 114 is provided at the connection between the transmitting antenna 112 and the microstrip line 113 and at the connection between the receiving antenna 111 and the microstrip line 113, and the notch 114 optimizes the matching of the antenna. The antenna component and the resonant metal strip can both be copper metal layers.

[0040] The glass-based millimeter-wave colinear polarization simultaneous transmission and reception (STAR) packaged antenna (AiP) disclosed in the present application is composed of two quarter-mode dielectric integrated waveguide (QMSIW) antennas and a resonant decoupling component. The two quarter-mode dielectric integrated waveguide (QMSIW) antennas are used as receiving antennas 111 and transmitting antennas 112 respectively. The receiving antenna 111 and the transmitting antenna 112 are combined into an antenna component 11. The technical method of the present application adopts a wafer-level integrated passive device (Wafer Level-Integrated Passive Device) process based on a glass substrate, and combines high-density through-glass via (TGV) technology to prepare a through-glass via metal connecting column 311, which has the characteristics of high performance and easy integration. Compared with the prior art, the millimeter-wave simultaneous transmission and reception (STAR) antenna disclosed in the present application has better and more stable transmission and reception isolation (higher than 25dB in the working frequency band) in a very compact structure.

[0041] Specifically, the layered structure of the glass-based millimeter-wave colinear polarization STAR packaged antenna disclosed in this application is as follows: Figure 1As shown, its core substrate is a glass substrate with a thickness of 285-315um, a dielectric constant (Dk) of 3.74 at 30GHz, and a loss tangent value (Df) of 0.000383; in the preferred embodiment, a glass substrate G with a thickness of 300um can be used. A first polymer layer P1 with a thickness of 10um is arranged on the upper layer of the glass substrate G, and a second polymer layer P2 and a third polymer layer P3 with a thickness of 10um are arranged on the lower layer of the glass substrate. The dielectric constant of the polymer layer at 25GHz is 2.9, and the loss tangent value is 0.02. The function of the polymer layer is bonding and protection, and it plays a key role in compensating for the brittleness of glass. At the same time, the second polymer layer P2 and the third polymer layer P3 also act as thin substrates for the resonant decoupling components in the packaged antenna (AiP) design. The antenna assembly, the resonant metal strip and each metal layer (the metal layer provided between the first polymer layer P1 and the glass substrate G, between the glass substrate G and the second polymer layer P2, and between the second polymer layer P2 and the third polymer layer P3) are all copper metal layers, and the thickness of the copper metal layer is 2-5um. In a preferred embodiment, the thickness of the copper metal layer can be set to 3um. The bottom plate P4 can be set to be a Rogers 4350B substrate with a thickness of 0.508mm (dielectric constant of 3.66, loss tangent of 0.0037).

[0042] The 3D structure of the millimeter wave colinear polarization STAR packaged antenna based on glass substrate disclosed in this application is as follows Figure 2 The STAR packaged antenna consists of two identical QMSIW resonators (quarter-mode dielectric integrated waveguide antennas) and a resonant decoupling component. The QMSIW resonator is equivalent to one quarter of a full-mode rectangular SIW resonator and radiates through two open sides. m0p The resonant frequency of the mode is f mnp It can be calculated according to the following formula:

[0043]

[0044] In the above formula, L eff and W eff are the length and width of the QMSIW resonator equivalent to the full-mode rectangular SIW resonator, m, n, p are the number of standing wave pattern changes in the x, z, y directions, μ = μ0μ r , μ is the magnetic permeability of the medium, μ0 is the magnetic permeability of the vacuum, μ r Relative magnetic permeability; ε=ε0ε r , ε dielectric constant, ε0 vacuum dielectric constant, ε r Relative dielectric constant.

[0045] In a more specific embodiment, the through-glass metal connecting column 311 is composed of metal filled in the through-glass hole set on the glass substrate G; the aperture of the through-glass hole close to the first polymer layer P1 is larger than the aperture close to the second polymer layer P2. The aperture of the through-glass hole close to the first polymer layer P1 is 33-47 microns; the aperture of the through-glass hole close to the second polymer layer P2 is 8-22 microns.

[0046] The through glass via metal connecting column 311 is also called TGV, and the top diameter D1 of the TGV can be set to 33-47 microns, and the bottom diameter D2 can be set to 8-22 microns. In a preferred embodiment, the top diameter D1 of the TGV can be set to 40 microns, and the bottom diameter D2 can be set to 15 microns.

[0047] In a more specific embodiment, a plurality of connection through holes are provided at the edge of the third polymer layer P3, and the metal connection column passes through the connection through holes. Specifically, the two resonant metal strips 12 are arranged in a central symmetrical manner. The resonant metal strips 12 are rectangular resonant metal strips 12, and the clearance slots 23 are rectangular clearance slots 23.

[0048] In a more specific embodiment, the first port 122 and the second port 123 are respectively disposed at the apex corners of the outer periphery of the rectangular resonant metal strip 12, and the first port 122 and the second port 123 are rotationally symmetrically distributed. Specifically, the first port 122 and the second port 123 are each composed of seven port through holes, one of the seven port through holes is located in the center, and six port through holes are arranged around the periphery, and the metal connecting column passes through the port through holes.

[0049] In a more specific embodiment, the spacing between the symmetrical metal connecting pillars 133 disposed on both sides of the shared metallized through-hole 31 is greater than the spacing between the shared metallized through-holes 31 .

[0050] For the above colinearly polarized STAR package antenna, the transmitting antenna and the receiving antenna simultaneously excite TE at 28 GHz. 202 mode, achieving the same 45° linear polarization radiation. Figure 3 As shown, the TX and RX antennas are fed by a microstrip line connected by TGV. The notch at the connection between the microstrip line and the antenna is to obtain better impedance matching. Two identical QMSIW resonators are placed back to back with shared metallized through holes arranged diagonally as the boundary. The shared boundary consists of a row of shared metallized through holes located on the 45° diagonal line, and the shared metallized through holes are evenly arranged along the diagonal line with a spacing of S1.

[0051] In order to reduce the coupling between the transmitting and receiving antennas, firstly, a row of rotationally symmetrical metal connecting posts 133 (the metal connecting posts are formed by metal penetrating through the through holes on the polymer layer) are placed on the left and right sides of the shared metallized through hole, and the metal connecting posts arranged on the first polymer layer are electrically connected to the glass through hole metal connecting posts 311 through the metal layer arranged between the first polymer layer and the glass substrate, so as to ensure that the added resonant decoupling component will not affect the radiation mode of the antenna. The metal connecting posts arranged on the left and right sides of the shared metallized through hole are evenly distributed in a direction parallel to the arrangement direction of the shared metallized through hole, and the spacing is S2, which is greater than the spacing S1. Secondly, the resonant decoupling components are formed by using the resonant metal strips arranged on the metal layer at the bottom of the third polymer layer and part of the shared metallized through hole at the position close to the notch of the transmitting and receiving antenna, so as to further improve the transmitting and receiving isolation. Each resonant decoupling component is composed of three metallized through holes and a resonant metal strip, wherein each metallized through hole is composed of a through-glass metal connecting column and metal connecting columns connected to both ends of the through-glass metal connecting column (metal connecting columns that penetrate the first polymer layer P1, the second polymer layer P2 and the third polymer layer P3 and are connected to the through-glass metal connecting column). The diameter of the metal connecting column (i.e., the metal via) provided in each polymer layer is D1, and the diameter D1 of the metal connecting column is the same as the top diameter of the TGV. The resonant metal strip can be a rectangular copper resonant metal strip, and the clearance slot can be a rectangular clearance slot.

[0052] A Rogers 4350B substrate with a thickness of 0.508 mm is added to the bottom of the antenna as the bottom plate P4, which is used to install two mini-SMP connectors for feeding. The top and bottom of the bottom plate P4 are respectively provided with two metal layers, such as Figure 5 and Figure 6 As shown. The metal layer arranged on the side of the bottom plate P4 facing the third polymer layer P3 is connected to the ground layer 14 through solder balls and metal connecting columns, thereby forming a system ground. The metal layer on the side of the bottom plate P4 facing away from the third polymer layer P3 includes two semi-enclosed structures (mini-SMP PCB layout) and two 50-ohm port feeders 43. The transmitting port 41 and the receiving port 42 are respectively connected to the first port 122 and the second port 123 through the port feeder 43 and the metal connecting columns and solder balls arranged on the bottom plate P4. The two clearance grooves 23 on the metal layer arranged on the side of the bottom plate P4 facing the third polymer layer P3 are located Figure 4 The two resonant metal strips shown below are used to further optimize the transmit and receive isolation.

[0053] In a specific embodiment, the detailed dimensions of the colinearly polarized STAR package antenna of the present application are shown in Table 1. The dimensions shown in Table 1 are similar to those in Table 1. Figures 3 to 6 The structure shown corresponds to .

[0054] Table 1 (Dimensions of packaged antenna, in mm)

[0055] <![CDATA[L1]]> <![CDATA[L2]]> <![CDATA[L3]]> <![CDATA[L4]]> <![CDATA[L5]]> <![CDATA[L6]]> <![CDATA[W1]]> <![CDATA[W2]]> 5.67 1.3 0.55 1.05 13 1.4 5.57 0.3 <![CDATA[W3]]> <![CDATA[W4]]> <![CDATA[W5]]> <![CDATA[W6]]> <![CDATA[D1]]> <![CDATA[D2]]> <![CDATA[D3]]> <![CDATA[D4]]> 0.35 5.4 0.5 1.1 0.04 0.015 2.2 0.48 <![CDATA[D5]]> <![CDATA[D6]]> <![CDATA[S1]]> <![CDATA[S2]]> <![CDATA[S3]]> <![CDATA[S4]]> <![CDATA[S5]]> <![CDATA[S6]]> 0.3 0.12 0.1 0.26 0.3 0.35 0.35 0.5

[0056] To verify the above-mentioned colinearly polarized STAR antenna, the STAR antenna of the above-mentioned size can be simulated and tested in HFSS software. The reflection coefficient and transmit-receive isolation of the STAR antenna system are simulated as follows: Figure 7 As shown. Figure 7 It can be seen that the simulated reflection coefficient has two resonances in the range of 27.8 to 28.2 GHz and both are less than -10 dB. In the operating frequency band where the reflection coefficient is less than -10 dB, the simulated transmit and receive isolation is higher than 29 dB.

[0057] Figure 8 The radiation patterns of the STAR antenna at the center frequency of 28 GHz in the two planes of phi = 45° and phi = -45° are simulated. It can be seen that the RX and TX antennas of the STAR antenna have the same linear polarization radiation characteristics in the normal direction, and their radiation patterns are also very similar.

[0058] The normal gain and efficiency of the STAR antenna simulation are shown in Fig. 9 As shown. In the operating frequency band of 27.8-28.2GHz, the simulated normal gain is higher than 4.5dBi and the radiation efficiency is higher than 70%. Because the structures of the receiving and transmitting antennas are exactly the same and symmetrical, the simulated normal gain and efficiency curves of the two are very consistent. Fig. 9 Only the gain and efficiency when the receiving port is excited are given, so the effect of using the transmitting port is similar.

[0059] Finally, the present application compares the above-mentioned glass-based millimeter-wave Co-LP STAR packaged antenna with the currently disclosed Co-LP STAR antenna. The STAR antenna in the above-mentioned embodiment has better transmit-receive isolation and linear polarization performance than the Co-LP STAR antenna in the prior art. In addition, since the glass through-hole metal connecting column set in the glass substrate and the metal connecting column in the polymer layer at both ends are interconnected through each metal layer to form a shared metallized through-hole in the present application, the transmitting antenna and the receiving antenna are arranged back-to-back with the shared metallized through-hole as the boundary, the glass-based packaging process is used for the STAR antenna design, making the antenna structure more compact.

[0060] The technical method of this application discloses a glass-based millimeter-wave colinear polarized simultaneous transmitting and receiving packaged antenna. The entire STAR antenna consists of two QMSIW antennas with completely identical structures placed back to back and a decoupling structure. Simulation results show that the proposed STAR antenna has a transmit-receive isolation of more than 29dB, a normal gain of more than 4.5dBi, and a radiation efficiency of more than 70% in the frequency range of 27.8-28.2GHz, and has consistent linear polarization and similar radiation patterns in the normal directions of TX and RX. The proposed STAR antenna, combined with advanced packaging technology, has the advantages of system integration while achieving good performance. It has great potential in various applications, including millimeter-wave mobile and satellite communications, point-to-point (P2P) microwave links, and military jamming systems.

[0061] The glass-based, simultaneous, full-duplex millimeter-wave packaged antenna provided in the embodiment of the present application comprises a first polymer layer, a glass substrate, a second polymer layer, and a third polymer layer stacked in sequence; the antenna assembly is divided into a symmetrically arranged receiving antenna and a transmitting antenna by a diagonally arranged shared metallized through hole; the transmitting antenna and the receiving antenna are respectively connected to a microstrip line; each microstrip line is electrically connected to two metallized through holes; a row of rotationally symmetrical metal connecting columns are respectively arranged on both sides of the shared metallized through hole; two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting columns and combined into a resonant decoupling component. The glass through hole metal connecting column arranged in the glass substrate and the metal connecting columns in the polymer layer at both ends are interconnected through each metal layer to form a shared metallized through hole, and the transmitting antenna and the receiving antenna are arranged back to back with the shared metallized through hole as the boundary. By adjusting the number and spacing of the shared metallized through holes, the corresponding resonant decoupling component is arranged using the shared metallized through hole, the transmit-receive isolation is improved while the antenna structure is made more compact, and consistent linear polarization radiation characteristics are maintained in the transmit mode and the receive mode.

[0062] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A glass-based, same-frequency, full-duplex millimeter-wave packaged antenna, characterized in that: It includes a first polymer layer, a glass substrate, a second polymer layer and a third polymer layer which are stacked in sequence; The surface layer of the first polymer layer is provided with an antenna component; the metal layer provided on the bottom layer of the third polymer is composed of a resonant metal strip and a metal connecting sheet for electrical connection; metal layers are provided between the first polymer layer and the glass substrate, between the glass substrate and the second polymer layer, and between the second polymer layer and the third polymer layer; a shared metallized through hole sequentially penetrates the first polymer layer, the glass substrate, the second polymer layer and the third polymer layer, so as to electrically connect the antenna component, the resonant metal strip and each of the metal layers; a metal connecting column penetrating the polymer layer is also provided in the polymer layer; the glass through hole metal connecting column provided in the glass substrate and the metal connecting columns in the polymer layers at both ends are interconnected through each metal layer to form the shared metallized through hole; The metal layer disposed between the glass substrate and the second polymer layer is a ground layer; a bottom plate is also disposed on the side opposite to the third polymer layer; a bottom plate connection column disposed in the bottom plate penetrates the bottom plate and electrically connects the metal layers disposed on both sides of the bottom plate; the metal layer on the bottom plate close to the third polymer layer is electrically connected to the metal layer at the bottom of the third polymer layer through a solder ball; the antenna assembly is divided into a symmetrically disposed receiving antenna and a transmitting antenna by a diagonally disposed shared metallized through hole; the transmitting antenna and the receiving antenna are respectively connected to a microstrip line; each of the microstrip lines is electrically connected to two metal connection columns located at both ends for feeding; a row of rotationally symmetrical metal connection columns are respectively disposed on both sides of the shared metallized through hole; Two resonant metal strips rotationally symmetrically arranged on the metal layer at the bottom of the third polymer layer are electrically connected to the metal connecting column and combined into a resonant decoupling component; a clearance groove is provided on the metal layer on the side of the base plate close to the third polymer layer at a position relative to the resonant metal strip; a transmitting port and a receiving port arranged on the side of the base plate away from the solder ball are respectively connected to the first port and the second port arranged on the metal layer at the bottom of the third polymer layer through a port feeder, the base plate connecting column and the solder ball.

2. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 1, characterized in that: The microstrip line is arranged at two ends of the shared metallized through hole, and notches are provided at the connection between the transmitting antenna and the microstrip line and at the connection between the receiving antenna and the microstrip line.

3. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 2, characterized in that: The through-glass metal connecting column is composed of metal filled in the through-glass hole set on the glass substrate; The hole diameter of the through glass hole at one end close to the first polymer layer is larger than the hole diameter at one end close to the second polymer layer.

4. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 3, characterized in that: The pore size of the through glass hole close to one end of the first polymer layer is 33-47 microns; The diameter of the through glass hole at one end close to the second polymer layer is 8-22 microns.

5. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to any one of claims 1 to 4, characterized in that: A plurality of connection through holes are arranged at the edge of the third polymer layer, and metal connection columns pass through the connection through holes.

6. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 5, characterized in that: The two resonant metal strips are arranged in a centrally symmetrical manner.

7. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 6, characterized in that: The resonant metal strip is a rectangular resonant metal strip, and the clearance slot is a rectangular clearance slot.

8. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 7, characterized in that: The first port and the second port are respectively arranged at the vertex corners of the periphery of the rectangular resonant metal strip.

9. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to claim 8, characterized in that: The first port and the second port are both composed of seven port through holes, one of the seven port through holes is located in the center, and six port through holes are arranged around the periphery, and metal connecting columns pass through the port through holes.

10. The glass-based same-frequency simultaneous full-duplex millimeter wave packaged antenna according to any one of claims 1 to 4, characterized in that: The spacing between the symmetrical metal connecting columns arranged on both sides of the shared metallized through hole is greater than the spacing between the shared metallized through holes.

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