A cooling system for underground electronic component compartment

Abstract

The present invention relates to the field of oil and gas drilling technology, and in particular to a downhole electronic component cabin cooling system, which aims to solve the problem that downhole instruments are greatly reduced in stability, work efficiency and service life due to high temperature. The present invention includes an instrument body and a semiconductor refrigeration component; the instrument body includes a cylinder and a cover plate, a storage bin is provided on the cylinder, the semiconductor refrigeration surface of the semiconductor refrigeration component and the storage bin form an electronic component cabin to accommodate electronic components, and the cover plate is in contact with the semiconductor heat dissipation surface of the semiconductor refrigeration component; a heat dissipation channel is provided on the instrument body to allow drilling fluid to pass through and cool the cover plate. The present invention uses Peltier active cooling technology to cool the downhole electronic component cabin through semiconductor refrigeration components to ensure the normal operation and service life of electronic components. At the same time, a heat dissipation channel is provided to use drilling fluid to take away the heat transferred to the cover plate by the semiconductor refrigeration component, assist the semiconductor refrigeration component in heat dissipation, and avoid untimely heat dissipation.

Description

Technical Field

[0001] The invention relates to the technical field of oil and gas drilling, and in particular to a downhole electronic component cabin cooling system. Background Art

[0002] During the oil and gas exploration and development process, high temperatures can easily cause early damage to downhole instruments. The sensors, chips, and measurement and control circuit boards of rotary steerable tools, vertical drilling tools, and measurement while drilling instruments are highly sensitive to high temperatures. The stability, working efficiency, and service life of electronic components will drop significantly in high temperature environments, and the failure rate will increase, which can seriously lead to failure and damage, severely restricting the exploration and development of high-temperature oil and gas resources. Summary of the invention

[0003] The object of the present invention is to provide a downhole electronic component compartment cooling system to solve the problem that downhole instruments are greatly reduced in stability, working efficiency and service life due to high temperature.

[0004] In order to solve the above technical problems, the technical solution provided by the present invention is:

[0005] A downhole electronic component compartment cooling system, comprising an instrument body and a semiconductor refrigeration element;

[0006] The instrument body includes a cylinder and a cover plate. The cylinder is provided with a storage chamber. The semiconductor refrigeration surface of the semiconductor refrigeration element and the storage chamber form an electronic component compartment to accommodate electronic components. The cover plate is in contact with the semiconductor heat dissipation surface of the semiconductor refrigeration element. A heat dissipation channel is provided on the instrument body to allow drilling fluid to pass through and cool the cover plate.

[0007] Furthermore, an inner flow channel is provided on the instrument body, and drilling fluid enters the well through the inner flow channel and returns from the outside of the instrument body. One end of the heat dissipation channel is connected to the inner flow channel, and the other end is connected to the outside of the instrument body.

[0008] Furthermore, the underground electronic component compartment cooling system also includes a temperature control valve, which is used to monitor the temperature of the cover plate and control the opening and closing of the heat dissipation channel.

[0009] Furthermore, the temperature control valve includes a thermal element, which expands and contracts with temperature changes to drive the valve core to move, thereby controlling the on-off of the heat dissipation channel.

[0010] Furthermore, the underground electronic component compartment cooling system also includes a one-way valve, which prevents drilling fluid from flowing from the outside of the instrument body into the inner flow channel.

[0011] Furthermore, the underground electronic component compartment cooling system also includes a heat insulation layer, which is arranged on the inner wall of the electronic component compartment.

[0012] Furthermore, the underground electronic component cabin cooling system also includes a mounting seat, which is mounted on the instrument body and has a mounting groove, the semiconductor refrigeration surface is mounted in the mounting groove, and the cover plate and the mounting seat clamp the semiconductor refrigeration surface.

[0013] Furthermore, the underground electronic component cabin cooling system also includes an insulation board, which is arranged between the mounting seat and the cover plate, and together with the insulation layer and the semiconductor refrigeration element, forms a closed insulation cabin, and the electronic components are arranged in the insulation cabin.

[0014] Furthermore, the underground electronic component compartment cooling system also includes a buffer rubber ring, which is arranged between the mounting seat and the semiconductor refrigeration surface.

[0015] Furthermore, the instrument body also includes a sealing ring, and the cover plate is installed on the cylinder to close the containing chamber; the sealing ring is arranged between the cover plate and the cylinder.

[0016] Based on the above technical solutions, the technical effects that can be achieved by the present invention are:

[0017] The underground electronic component cabin cooling system provided by the present invention comprises an instrument body and a semiconductor refrigeration element; the instrument body comprises a cylinder and a cover plate, a containing chamber is provided on the cylinder, a semiconductor refrigeration surface of the semiconductor refrigeration element and the containing chamber form an electronic component cabin to contain electronic components, and the cover plate contacts the semiconductor heat dissipation surface of the semiconductor refrigeration element; a heat dissipation channel is provided on the instrument body to allow drilling fluid to pass through and cool the cover plate.

[0018] The underground electronic component compartment cooling system provided by the present invention uses a semiconductor refrigeration component to cool the underground electronic component compartment using Peltier active cooling technology to ensure the normal operation and service life of the electronic components. At the same time, a heat dissipation channel is provided to use drilling fluid to take away the heat transferred from the semiconductor refrigeration component to the cover plate, assisting the semiconductor refrigeration component in heat dissipation to avoid untimely heat dissipation.

[0019] Specifically, the semiconductor refrigeration unit absorbs the heat in the electronic component compartment and transfers it to the cover plate, which contacts the returned drilling fluid and takes away the heat. Since the temperature of the returned drilling fluid is relatively high due to the influence of the formation environment and working conditions, the returned drilling fluid may have insufficient heat dissipation capacity and fail to take away the heat of the cover plate in time, resulting in a high temperature in the electronic component compartment. At this time, the heat dissipation channel is opened, so that part of the inflowing drilling fluid does not enter the bottom of the well and then return, but directly passes through the heat dissipation channel and returns to the ground with the returned drilling fluid. Since the temperature of the drilling fluid is relatively low when entering the well, the cover plate can be effectively cooled to ensure the cooling effect. It should be noted that the heat dissipation channel is opened only when the temperature of the cover plate reaches the preset value to prevent the drilling fluid from flowing through the heat dissipation channel for a long time and causing erosion and damage to the parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a downhole electronic component compartment cooling system provided by an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 Another structural schematic diagram of the underground electronic component compartment cooling system provided by an embodiment of the present invention;

[0024] Figure 4 Figure 3 Enlarged view of point B in the middle;

[0025] Figure 5 A top view of the mounting base.

[0026] Icons: 100, instrument body; 200, semiconductor refrigeration component; 300, temperature control valve; 400, one-way valve; 500, thermal insulation layer; 600, mounting seat; 700, thermal insulation board; 800, buffer rubber ring; 900, power cord; 110, cylinder; 120, cover plate; 130, sealing ring; 210, semiconductor refrigeration surface; 220, semiconductor heat dissipation surface; 510, thermal insulation side panel; 520, thermal insulation bottom plate; 101, electronic component compartment; 102, heat dissipation channel; 103, inner channel; 10, electronic components. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0030] During the oil and gas exploration and development process, high temperatures can easily cause premature damage to downhole instruments. In high temperature environments, the stability, working efficiency and service life of electronic components will drop significantly, the failure rate will increase, and in severe cases, they may even fail and be damaged, seriously restricting the exploration and development of high-temperature oil and gas resources.

[0031] In view of this, the present invention provides an underground electronic component cabin cooling system, including an instrument body 100 and a semiconductor refrigeration element 200; the instrument body 100 includes a cylinder 110 and a cover plate 120, the cylinder 110 is provided with a containing chamber, the semiconductor refrigeration surface 210 of the semiconductor refrigeration element 200 and the containing chamber form an electronic component cabin 101 to contain the electronic components 10, and the cover plate 120 is in contact with the semiconductor heat dissipation surface 220 of the semiconductor refrigeration element 200; a heat dissipation channel 102 is provided on the instrument body 100 to allow drilling fluid to pass through and cool the cover plate 120.

[0032] The underground electronic component compartment cooling system provided by the present invention uses the Peltier active cooling technology to cool the underground electronic component compartment 101 through the semiconductor refrigeration element 200 to ensure the normal operation and service life of the electronic component 10. At the same time, a heat dissipation channel 102 is provided to use the drilling fluid to take away the heat transferred from the semiconductor refrigeration element 200 to the cover plate 120, and assist the semiconductor refrigeration element 200 in heat dissipation to avoid untimely heat dissipation.

[0033] Specifically, the semiconductor refrigeration element 200 absorbs the heat in the electronic component compartment 101 and transfers it to the cover plate 120, which contacts the returned drilling fluid and takes away the heat. Since the returned drilling fluid is affected by the formation environment and working conditions and has a high temperature, the returned drilling fluid may have insufficient heat dissipation capacity and cannot take away the heat of the cover plate 120 in time, resulting in a high temperature in the electronic component compartment 101. At this time, the heat dissipation channel 102 is opened, so that part of the drilling fluid that flows in does not enter the bottom of the well and then return, but directly passes through the heat dissipation channel 102 and returns to the ground with the returned drilling fluid. Since the temperature of the drilling fluid when entering the well is low, the cover plate 120 can be effectively cooled to ensure the cooling effect. It should be noted that the heat dissipation channel 102 is opened only when the temperature of the cover plate 120 reaches the preset value to prevent the drilling fluid from flowing through the heat dissipation channel 102 for a long time and causing erosion and damage to the parts.

[0034] The following combination Figure 1-Figure 5 The structure and shape of the underground electronic component cabin cooling system provided in this embodiment are described in detail:

[0035] In this embodiment, the underground electronic component compartment cooling system includes an instrument body 100, a semiconductor refrigeration element 200, a temperature control valve 300, a one-way valve 400, an insulation layer 500, a mounting seat 600, an insulation board 700, a buffer rubber ring 800 and a power line 900. Figure 1 , Figure 3 As shown. Specifically, the instrument body 100 includes a cylinder 110, a cover plate 120 and a sealing ring 130. The inner ring of the cylinder 110 is an inner flow channel 103, which is used for the drilling fluid flowing into the bottom of the well to pass through; the drilling fluid flowing into the bottom of the well flows through the outside of the instrument body 100 when returning to the ground. That is, the drilling fluid enters the well through the inner flow channel 103 and returns to the ground from the outside of the instrument body 100. At the same time, a heat dissipation channel 102 extending radially is provided on the instrument body 100, one end of the heat dissipation channel 102 is connected to the inner flow channel 103, and the other end is connected to the outside of the instrument body 100, so that part of the drilling fluid entering the well can flow along the radial direction of the instrument body 100, so that the drilling fluid does not pass through the bottom of the well, but passes through the heat dissipation channel 102 and merges with the drilling fluid returning to the ground and directly returns to the ground.

[0036] Furthermore, a storage bin is provided on the side wall of the cylinder 110, and the semiconductor cooling surface 210 of the semiconductor cooling element 200 and the storage bin enclose an electronic component compartment 101 to accommodate the electronic components 10. The cover plate 120 contacts the semiconductor heat dissipation surface 220 of the semiconductor cooling element 200, and the heat of the cover plate 120 can be transferred to the heat dissipation channel 102. The cover plate 120 is installed on the cylinder 110 to close the storage bin, and the sealing ring 130 is arranged between the cover plate 120 and the cylinder 110 to ensure the sealing of the storage bin and prevent drilling fluid and the like from entering the storage bin. The cover plate 120 contacts the semiconductor heat dissipation surface 220 and limits the semiconductor heat dissipation surface 220.

[0037] In this embodiment, the mounting seat 600 is installed in the storage chamber of the cylinder 110 and abuts against the cylinder 110. At the same time, the mounting seat 600 is provided with a mounting groove for installing the semiconductor refrigeration surface 210. The cover plate 120 and the mounting seat 600 clamp the semiconductor refrigeration surface 210, thereby fixing the semiconductor refrigeration element 200. The buffer rubber ring 800 is arranged between the semiconductor refrigeration surface 210 and the mounting seat 600 to protect the semiconductor refrigeration surface 210. The semiconductor heat dissipation surface 220 is inserted into the cover plate 120 and contacts the cover plate 120. That is, the mounting seat 600, the semiconductor refrigeration surface 210 and the storage chamber surround the electronic component compartment 101. It should be noted that the mounting seat 600 is provided with a through groove to allow the semiconductor refrigeration surface 210 to pass through the mounting seat 600 and contact the gas in the electronic component compartment 101.

[0038] In this embodiment, since the temperature in the electronic component compartment 101 is lower than the ambient temperature, a heat insulating layer 500 is provided on the inner wall of the electronic component compartment 101 to block heat transfer. Specifically, a heat insulating side plate 510 and a heat insulating bottom plate 520 are provided, a heat insulating plate 700 is provided between the mounting seat 600 and the cover plate 120, and the semiconductor heat dissipation surface 220 passes through the annular heat insulating plate 700; the heat insulating plate 700, the heat insulating layer 500, and the semiconductor refrigeration element 200 form a closed heat insulating cabin, and the electronic component 10 is provided in the heat insulating cabin to reduce the influence of the external ambient temperature.

[0039] In this embodiment, the cover plate 120 is connected to the cylinder 110 by screws, and the mounting seat 600 and the heat insulating plate 700 are clamped and fixed by the cover plate 120 and the cylinder 110, thereby achieving fixation of various parts and fixation of the semiconductor refrigeration element 200.

[0040] In this embodiment, the power line 900 is connected to the semiconductor cooling element 200 and supplies electric energy to the semiconductor cooling element 200 through a downhole turbine engine or a high temperature resistant battery pack.

[0041] In this embodiment, the temperature control valve 300 and the one-way valve 400 are arranged in series in the heat dissipation channel 102, the temperature control valve 300 is used to monitor the temperature of the cover plate 120 and control the on-off of the heat dissipation channel 102, and the one-way valve 400 is used to prevent the drilling fluid from flowing from the outside of the instrument body 100 into the inner channel 103. Among them, the temperature control valve 300 can be installed on the cover plate 120, and the heat dissipation channel 102 needs to be sealed at the contact position between the cover plate 120 and the cylinder 110.

[0042] Specifically, the temperature control valve 300 is driven by a thermistor and is not affected by the high temperature environment underground. It includes a thermistor, a valve body, a valve core and a reset spring. Specifically, the thermistor expands and contracts with temperature changes to drive the valve core to move, thereby pushing the valve core and the valve body to move relative to each other, so that the heat dissipation channel 102 is opened and the size of the flow cross-section can be controlled. The reset spring can apply thrust to the valve core to reset the valve core to cut off the heat dissipation channel 102 and ensure that the heat dissipation channel 102 is reliably closed. In addition, the valve core can also be driven to move only by the thermistor. In this embodiment, the thermistor can be made into a cylinder, one end of which is connected to the valve core, and the other end is inserted into the cover plate 120 to facilitate heat transfer.

[0043] In an optional solution of this embodiment, the thermosensitive element can also be set as a liquid, and the expansion of the liquid due to heat is used to drive the valve core to move.

[0044] In this embodiment, the heat dissipation channel 102 can pass through the cylinder 110 and the cover plate 120. The heat emitted by the semiconductor heat dissipation surface 220 can be transferred to the drilling fluid in the heat dissipation channel 102 through the cover plate 120. At the same time, part of the heat can also be transferred from the cover plate 120 to the cylinder 110 and then from the cylinder 110 to the heat dissipation channel 102. In addition, a continuous S-shaped heat dissipation channel 102 can be set in the cover plate 120 to increase the heat exchange area and improve the cooling effect of the heat dissipation channel 102. At this time, it is necessary to avoid the area of ​​the heat dissipation channel 102 in the cover plate 120 being too large, which affects the heat dissipation capacity and strength of the cover plate 120 itself. In addition, multiple heat dissipation channels 102 can be set outside the electronic component compartment 101 to improve the heat dissipation efficiency.

[0045] Furthermore, the portion of the heat dissipation channel 102 located in the cover plate 120 should be as close to the semiconductor heat dissipation surface 220 as possible and extend along the surface of the semiconductor heat dissipation surface 220, so as to improve the heat dissipation efficiency.

[0046] In this embodiment, the cover plate 120 can be made of metal or alloy such as copper and aluminum, so that it has the high strength and high pressure bearing characteristics of metal while having good thermal conductivity, and the thermal conductivity is greater than 200W / m·K. The insulation board 700, the insulation side plate 510 and the insulation bottom plate 520 are all made of a substrate and an insulating material. The substrate, as a basic structure, has a certain strength and rigidity and plays a role in supporting the insulation material. The insulation material uses a low thermal conductivity material to slow down heat transfer. Specifically, it can be set to coat the insulation material on the substrate, or it can be set to sandwich the insulation material between two substrates. The substrate can be made of metal or non-metal. The thermal conductivity of the insulation board 700, the insulation side plate 510 and the insulation bottom plate 520 is less than 0.05W / m·K.

[0047] It should be noted that the temperatures of the electronic component compartment 101 , the drilling fluid entering the well, the returning drilling fluid, and the semiconductor heat dissipation surface 220 increase in sequence.

[0048] The working process of the underground electronic component compartment cooling system provided in this embodiment is as follows:

[0049] The semiconductor cooling surface 210 absorbs the heat in the electronic component compartment 101, and the semiconductor heat dissipation surface 220 dissipates the heat. When the speed at which the semiconductor cooling surface 210 absorbs heat is greater than the heat generated by the electronic component 10, the ambient temperature of the electronic component 10 will gradually decrease. The heat dissipated by the semiconductor heat dissipation surface 220 is transferred to the cover plate 120, and part of the heat is transferred to the cylinder 110. The drilling fluid returned from the well flows through the cylinder 110 and the cover plate 120 to generate heat exchange to take away the heat, which is beneficial to the operation of the semiconductor cooling element 200.

[0050] When the temperature of the cover plate 120 rises to a preset value due to factors such as the excessively high temperature in the electronic component compartment 101 and the high temperature of the returned drilling fluid, the heat dissipation efficiency decreases due to the reduced temperature difference. At this time, the temperature control valve 300 opens the heat dissipation channel 102, and part of the drilling fluid that enters the well through the inner channel 103 flows through the heat dissipation channel 102 to cool the instrument body 100. Since the temperature of the drilling fluid when entering the well is lower than the temperature when returning, a large temperature difference can be formed between the instrument body 100, thereby effectively reducing the temperature of the cover plate 120, so that a large temperature difference is formed between the semiconductor heat dissipation surface 220 and the cover plate 120, which is conducive to improving the heat dissipation efficiency, ensuring the cooling effect, and avoiding the electronic component compartment 101 from being too high. The combined effects of the semiconductor refrigeration element 200, the heat insulation cabin, and the heat dissipation channel 102 solve the problems of downhole instrument damage and poor stability caused by high temperature, and ensure safe and efficient drilling operations in high-temperature wells.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A downhole electronic component cabin cooling system, characterized in that: It comprises an instrument body (100) and a semiconductor refrigeration element (200); The instrument body (100) comprises a cylinder (110) and a cover plate (120); a storage chamber is provided on the cylinder (110); a semiconductor cooling surface (210) of the semiconductor cooling element (200) and the storage chamber form an electronic component chamber (101) for accommodating electronic components (10); the cover plate (120) is in contact with a semiconductor heat dissipation surface (220) of the semiconductor cooling element (200); a heat dissipation channel (102) is provided on the instrument body (100) to allow drilling fluid to pass through and cool the cover plate (120); The instrument body (100) is provided with an inner flow channel (103), through which drilling fluid enters the well and is returned from the outside of the instrument body (100); one end of the heat dissipation channel (102) is connected to the inner flow channel (103), and the other end is connected to the outside of the instrument body (100); It also includes a temperature control valve (300), the temperature control valve (300) being used to monitor the temperature of the cover plate (120) and control the on / off of the heat dissipation channel (102); The temperature control valve (300) comprises a thermal element, which expands and contracts as the temperature changes to drive the valve core to move, thereby controlling the on and off of the heat dissipation channel (102).

2. The underground electronic component compartment cooling system according to claim 1, characterized in that: It also includes a one-way valve (400), wherein the one-way valve (400) prevents drilling fluid from flowing from the outside of the instrument body (100) into the inner flow channel (103).

3. The underground electronic component compartment cooling system according to claim 1, characterized in that: It also comprises a heat insulation layer (500), wherein the heat insulation layer (500) is arranged on the inner wall of the electronic component compartment (101).

4. The underground electronic component compartment cooling system according to claim 3, characterized in that: It also includes a mounting seat (600), the mounting seat (600) being mounted on the instrument body (100) and having a mounting groove, the semiconductor refrigeration surface (210) being mounted in the mounting groove, and the cover plate (120) and the mounting seat (600) clamping the semiconductor refrigeration surface (210).

5. The underground electronic component cabin cooling system according to claim 4, characterized in that: It also comprises a heat insulation board (700), the heat insulation board (700) being arranged between the mounting seat (600) and the cover plate (120), and forming a closed heat insulation cabin together with the heat insulation layer (500) and the semiconductor refrigeration element (200), and the electronic component (10) being arranged in the heat insulation cabin.

6. The underground electronic component cabin cooling system according to claim 5, characterized in that: It also comprises a buffer rubber ring (800), wherein the buffer rubber ring (800) is arranged between the mounting seat (600) and the semiconductor refrigeration surface (210).

7. The underground electronic component cabin cooling system according to claim 1, characterized in that: The instrument body (100) further comprises a sealing ring (130); the cover plate (120) is mounted on the cylinder (110) to seal the containing chamber; the sealing ring (130) is arranged between the cover plate (120) and the cylinder (110).

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