Molding die, resin molding device, and method for manufacturing resin molded article

Abstract

The invention provides a forming die capable of preventing a substrate from falling from an upper die even if the substrate is warped. A molding die for resin molding by compression molding comprises: an upper die in which a plurality of substrate adsorption holes for adsorbing a substrate and a plurality of film adsorption holes for adsorbing a release film are formed so as to open in the lower surface; a lower die disposed on the lower side of the upper die in the vertical direction; and a plurality of pressing members provided on the upper mold so as to be capable of moving up and down such that the lower ends thereof can protrude downward from the lower surface of the upper mold.

Description

Technical Field

[0001] The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product. Background Art

[0002] Patent Document 1 discloses a resin sealing device in which an upper mold release film is arranged on an upper mold and a workpiece is arranged on the upper mold release film. Specifically, a plurality of workpiece suction holes are formed on the upper mold release film, and a suction device such as a pump sucks the workpiece through the workpiece suction holes, thereby holding the workpiece on the upper mold.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-153146 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, in the technology described in Patent Document 1, when the mold is opened after resin sealing, the workpiece may warp due to the difference in thermal shrinkage between the workpiece and the resin. When the workpiece warps and the workpiece is separated from the workpiece adsorption hole of the upper mold release film, the workpiece adsorption hole is opened, and the suction device sucks the surrounding air through the workpiece adsorption hole. As a result, the adsorption force of the workpiece is reduced, and the workpiece may fall from the upper mold.

[0008] Furthermore, the resin sealing device of Patent Document 1 uses an upper mold release film. However, even in a resin sealing device that does not use an upper mold release film, similar to the example described in Patent Document 1, if the work is warped, the work may fall.

[0009] The present invention has been made in view of the above situation, and aims to provide a molding die, a resin molding device, and a method for manufacturing a resin molded product that can prevent a substrate from falling from an upper mold even when the substrate is warped.

[0010] Technical means of solving problems

[0011] The problem to be solved by the present invention is as described above. In order to solve the problem, the forming mold of the present invention is a forming mold for resin forming by compression molding, and includes: an upper mold, which is opened on the lower surface and has a plurality of substrate adsorption holes for adsorbing the substrate and a plurality of film adsorption holes for adsorbing the release film; a lower mold, which is arranged on the lower side of the upper mold in the vertical direction; and a plurality of pressing members, which are arranged on the upper mold in a manner that can be moved up and down, so that the lower end portion can protrude downward from the lower surface of the upper mold.

[0012] Furthermore, the resin molding apparatus of the present invention includes: the molding die; and a clamping mechanism for clamping the molding die.

[0013] In addition, the manufacturing method of the resin molded product of the present invention is a manufacturing method of the resin molded product using the resin molding device, and includes: a film configuration step, configuring the release film on the molding die; a carrying-in step, carrying the resin material into the molding die; a clamping step, clamping the molding die; a resin molding step, hardening the resin material to perform resin molding; and a mold opening step, opening the molding die.

[0014] Effects of the Invention

[0015] According to the present invention, even when the substrate is warped, it is possible to prevent the substrate from falling from the upper mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] [ Figure 1 ] is a front cross-sectional view showing the structure of the resin molding device of the first embodiment.

[0017] [ Figure 2 ](a) is a bottom view of the adsorption member. (b) is a bottom view of the release film provided on the upper mold.

[0018] [ Figure 3 ] is a flow chart showing a method for manufacturing a resin molded product.

[0019] [ Figure 4 ] is a front cross-sectional view of the resin molding device showing the state in which the substrate is adsorbed to the upper mold.

[0020] [ Figure 5 ] is a front cross-sectional view showing a resin molding device in the process of performing a resin molding process.

[0021] [ Figure 6 ] is a front cross-sectional view of a resin molding device showing deformation of a substrate after mold opening.

[0022] [ Figure 7 ] is a front cross-sectional view showing the structure of a resin molding device when a substrate is clamped by an upper mold and a lower mold.

[0023] [ Figure 8 ] is a front sectional view showing the structure of the resin molding device of the second embodiment.

[0024] [ Fig. 9 ] is a front cross-sectional view of a resin molding device showing deformation of a substrate after mold opening.

[0025] [ Fig.10] is a front cross-sectional view showing the structure of a resin molding device when a substrate is clamped by an upper mold and a lower mold. DETAILED DESCRIPTION

[0026] <Resin molding device 100 (first embodiment)>

[0027] First, use Figure 1 A resin molding apparatus 100 according to the first embodiment will be described.

[0028] Figure 1 The resin molding device 100 shown is a device capable of performing resin molding by compression molding. The resin molding device 100 of this embodiment can perform resin sealing on electronic components such as semiconductor chips fixed to a substrate W as a molding object to manufacture a resin molded product. As the substrate W, a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate can be used. In addition, wiring may or may not be implemented for the substrate W. In each of the embodiments described below, a circular or rectangular substrate W is used. In addition, in Figure 2 In FIG. 1 , as an example, an example using a circular substrate W is shown. The resin molding apparatus 100 mainly includes a molding die 110 , a pump 150 , a mold clamping mechanism 160 , and the like.

[0029] The forming mold 110 forms a cavity C into which a thermosetting resin material R is injected. The forming mold 110 mainly includes a lower mold 120 , an upper mold 130 , and a pressing member 140 .

[0030] The lower mold 120 mainly includes: a lower mold base member 121, a bottom surface member 122, a side member 123 and an elastic member 124.

[0031] The lower mold base member 121 supports a bottom surface member 122 and a side surface member 123 which will be described later.

[0032] The bottom member 122 forms the bottom of the cavity C. The bottom member 122 is formed into, for example, a circular shape or a rectangular shape in plan view. The bottom member 122 is formed to have an appropriate vertical width. The bottom member 122 is placed on the upper surface of the lower mold base member 121.

[0033] The side member 123 surrounds the bottom member 122 from the side. The side member 123 is formed to have an appropriate vertical width. A hollow portion that passes through the center of the side member 123 vertically is formed in the side member 123. The hollow portion of the side member 123 is formed in a shape that is substantially consistent with the outer shape of the bottom member 122 in a plan view.

[0034] Thus, the side member 123 is formed into a frame shape that is circular or rectangular in plan view. The bottom member 122 is arranged in the hollow portion of the side member 123. The side member 123 is arranged in a state of being placed on the upper surface of the lower mold base member 121 through the elastic member 124 described later. The upper surface of the side member 123 is located above the upper surface of the bottom member 122. The cavity C for resin molding is defined by the side member 123 and the bottom member 122, and the upper mold 130 described later.

[0035] Elastic member 124 is disposed between side member 123 and lower mold base member 121. Elastic member 124 is formed of, for example, a compression coil spring that can stretch up and down.

[0036] In addition, the upper surface of the lower mold 120 (bottom member 122 and side member 123) is appropriately formed with suction holes (not shown) for sucking and holding the release film F. The release film F can be sucked and held by making the suction holes negatively pressurized by a pump or the like (not shown).

[0037] The upper mold 130 is disposed vertically above the lower mold 120 and mainly includes an upper mold base member 131 and a suction member 132 .

[0038] The upper mold base member 131 supports the suction member 132 described later. The upper mold base member 131 is formed, for example, in a circular shape or a rectangular shape in a plan view. The upper mold base member 131 is formed to have an appropriate vertical width. The upper mold base member 131 is formed with a central recess 131a, a central through hole 131b, an annular recess 131c, and an outer through hole 131d.

[0039] The central recess 131a is a concave portion formed in the central portion of the lower surface of the upper mold base member 131. The central recess 131a is formed, for example, in a circular shape or a rectangular shape when viewed from below. The central recess 131a is formed so as to cover the range where the substrate adsorption hole 132a and the through hole 132c of the adsorption member 132 described later are formed.

[0040] The central through hole 131 b is a hole formed near the center of the central recessed portion 131 a so as to vertically penetrate the upper mold 130 .

[0041] The annular recess 131c is an annular recessed portion formed on the lower surface of the upper mold base member 131 so as to surround the central recess 131a from the outside. The annular recess 131c is formed, for example, in a circular ring shape when viewed from above. The annular recess 131c is formed with an appropriate gap between the lower surface of the upper mold base member 131 and the central recess 131a so as not to be connected to the central recess 131a.

[0042] The outer through hole 131d is a hole formed in the annular recessed portion 131c so as to vertically penetrate the upper mold 130. A plurality of the outer through holes 131d are formed along the annular recessed portion 131c.

[0043] The adsorption member 132 adsorbs and holds the release film F and the substrate W. The adsorption member 132 is formed, for example, in a circular shape or a rectangular shape in a plan view (the same shape as the upper mold base member 131). The adsorption member 132 is formed to have an appropriate upper and lower width. The adsorption member 132 is fixed to the lower surface of the upper mold base member 131. The adsorption member 132 is formed with a substrate adsorption hole 132a, a film adsorption hole 132b, and a through hole 132c.

[0044] Figure 1 and Figure 2 The substrate adsorption hole 132a shown in (a) is used to adsorb the substrate W. The substrate adsorption hole 132a is formed in a manner that penetrates the adsorption member 132 from top to bottom. Figure 2 As shown in (a), a plurality of substrate adsorption holes 132a are formed in a range facing the adsorbed substrate W. Figure 2 In the example shown in (a), since a circular substrate W is used, the substrate suction hole 132 a is also formed over a circular range. The substrate suction hole 132 a is formed to be continuous with the central recess 131 a of the upper mold base member 131 .

[0045] Figure 1 and Figure 2 The film adsorption hole 132b shown in (a) is used to adsorb the release film F. The film adsorption hole 132b is formed to vertically penetrate the adsorption member 132. A plurality of film adsorption holes 132b are formed to be arranged in a ring shape along the annular recess 131c of the upper mold base member 131.

[0046] The through hole 132c is used to dispose the pressing member 140 described later. The through hole 132c is formed in a manner that penetrates the adsorption member 132 from top to bottom. Figure 2 As shown in (a), the through hole 132c is formed to face the outer peripheral portion of the adsorbed substrate W. A plurality of through holes 132c are formed so as to be arranged in a ring shape along the circumferential direction of the substrate W.

[0047] like Figure 2 As shown in (a), the substrate adsorption holes 132a and the through holes 132c are formed inside the area surrounded by the plurality of film adsorption holes 132b. Specifically, the substrate adsorption holes 132a and the through holes 132c are formed inside the area defined by connecting the adjacent film adsorption holes 132b (an area that is roughly circular when viewed from above).

[0048] The substrate adsorption hole 132a is formed inside a region surrounded by the plurality of through holes 132c. Specifically, the substrate adsorption hole 132a is formed inside a region (a substantially circular region in bottom view) defined by connecting adjacent through holes 132c.

[0049] In addition, Figure 2 In (a), in order to easily distinguish the substrate adsorption hole 132a, the membrane adsorption hole 132b and the through hole 132c from each other, the sizes of the substrate adsorption hole 132a, etc. are shown extremely differently, but the size of the substrate adsorption hole 132a, etc. is not limited to the example shown in the figure and can be set arbitrarily.

[0050] Figure 1 The pressing member 140 shown presses the release film F sucked onto the upper mold 130 downward. The pressing member 140 mainly includes a pressing portion 141 and a restricting portion 142 .

[0051] The pressing portion 141 is a portion formed into a columnar (rod-shaped) portion that is long in the vertical direction. The cross section of the pressing portion 141 is formed into a circular shape similar to the through hole 132c of the adsorption member 132. The length of the pressing portion 141 is formed to be longer than the vertical width of the adsorption member 132. The pressing portion 141 is inserted into the through hole 132c. The pressing portion 141 can freely move up and down relative to the through hole 132c.

[0052] A tapered portion 141a is formed at the lower end of the pressing portion 141 so that the diameter gradually decreases downward. By forming the tapered portion 141a, the angle of the lower end of the pressing portion 141 can be made obtuse, thereby preventing the release film F from being damaged. In addition, by forming the corner of the lower end of the pressing portion 141 into a curved surface (R shape), the release film F can also be prevented from being damaged.

[0053] The limiting portion 142 is a portion that limits the downward movement of the pressing portion 141. The limiting portion 142 is formed in the upper and lower mid-portions of the pressing portion 141. The cross-section of the limiting portion 142 is formed in a shape that cannot pass through the through hole 132c of the adsorption member 132. In the present embodiment, the cross-sectional area of ​​the limiting portion 142 is formed to be larger than the cross-sectional area of ​​the pressing portion 141 and the through hole 132c. For example, the cross-sectional shape of the limiting portion 142 is formed in a circular shape that is one circle larger than the cross-sectional shape of the pressing portion 141. The limiting portion 142 can be formed by a component independent of the pressing portion 141, or by a component integral with the pressing portion 141.

[0054] The pressing portion 141 (the portion below the limiting portion 142) of the pressing member 140 is inserted into the through hole 132c from the top of the adsorption member 132. When the pressing portion 141 of the pressing member 140 is inserted into the through hole 132c, the pressing member 140 moves downward due to its own weight. When the lower end of the pressing portion 141 protrudes downward by a predetermined amount from the lower surface of the adsorption member 132, the limiting portion 142 contacts the upper surface of the adsorption member 132, and the downward movement of the pressing member 140 is restricted. The upper portion of the pressing member 140 is accommodated inside the central recess 131a of the upper mold base member 131.

[0055] The pump 150 is used to suck air. The pump 150 is connected to the central through hole 131b and the outer through hole 131d of the upper mold base member 131 via an appropriate hose or the like. When the pump 150 is operated, the film adsorption hole 132b of the adsorption member 132 is evacuated via the outer through hole 131d and the annular recess 131c to form a negative pressure. In this way, the release film F can be adsorbed and held on the lower surface of the adsorption member 132.

[0056] In addition, when the pump 150 is operated, the substrate adsorption hole 132a of the adsorption member 132 is evacuated through the central through hole 131b and the central concave portion 131a, and the substrate adsorption hole 132a is made into a negative pressure. In this way, negative pressure can be applied to the plurality of substrate adsorption holes 132a at the same time through the central concave portion 131a. Figure 2 As shown in (b), a plurality of tiny through holes F1 are formed on the release film F adsorbed on the adsorption member 132 (upper mold 130). The through holes F1 are formed so as to be located inside the area surrounded by the through holes 132c of the adsorption member 132 when the release film F is adsorbed on the adsorption member 132. The through holes F1 can be formed, for example, using a laser or an appropriate tool (a needle, a cutter, etc.). When the substrate adsorption hole 132a of the adsorption member 132 becomes negative pressure, the through holes F1 of the release film F held on the adsorption member 132 also become negative pressure, and the substrate W can be adsorbed and held on the bottom surface of the release film F.

[0057] In addition, in the present embodiment, an example is shown in which the central through hole 131b and the outer through hole 131d are set to negative pressure using one pump 150, but for example, the central through hole 131b and the outer through hole 131d may be set to negative pressure using different pumps 150.

[0058] The mold clamping mechanism 160 raises and lowers the lower mold 120 to perform mold clamping and mold opening, etc. The mold clamping mechanism 160 mainly includes a base 161 and a driving mechanism 162, etc.

[0059] The base 161 supports the forming mold 110 and the like. The base 161 is disposed below the forming mold 110 (lower mold 120).

[0060] The driving mechanism 162 is used to raise and lower the lower mold 120. As the driving mechanism 162, a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. can be used. The driving mechanism 162 is arranged between the base 161 and the lower mold base member 121.

[0061] Note that the operation of each part of the resin molding apparatus 100 is appropriately controlled by a control device (not shown).

[0062] <Manufacturing method of resin molded product>

[0063] Next, an example of a method for manufacturing a resin molded product using the resin molding apparatus 100 will be described.

[0064] like Figure 3 As shown, the method for manufacturing a resin molded product according to the present embodiment mainly includes a film placement step S10, a carrying-in step S20, a mold clamping step S30, a resin molding step S40, a mold opening step S50, and a carrying-out step S60. These steps will be described in order below.

[0065] The film placement step S10 is to place a release film F (see Figure 1 ) is configured in the process of lower mold 120 and upper mold 130.

[0066] Specifically, in the film placement step S10, two release films F are carried into the forming mold 110 by a predetermined conveying device. The two release films F are held by suction on the upper surface of the lower mold 120 and the lower surface of the upper mold 130, respectively.

[0067] At this time, one of the release films F is adsorbed to the lower mold 120 and arranged along the shape of the upper surface of the lower mold 120. The other release film F is adsorbed by the film adsorption hole 132b of the upper mold 130 which is negatively pressurized by the operation of the pump 150. The release film F adsorbed to the upper mold 130 is slightly pressed downward by the pressing member 140 protruding from the adsorption member 132, and is thus held in a state where a portion of the release film F floats from the lower surface of the upper mold 130.

[0068] By providing the mold release film F on the forming mold 110, the resin material R can be prevented from being attached to the surface of the forming mold 110. In addition, when foreign matter is attached to the surface of the upper mold 130, since the mold release film F is arranged between the upper mold 130 and the substrate W, the foreign matter can be prevented from directly contacting the substrate W, thereby suppressing damage to the substrate W. In addition, when foreign matter is attached to the surface of the forming mold 110 (the mold release film F), the foreign matter can be easily removed by replacing the mold release film F.

[0069] In addition, the release film F may be disposed on either the lower mold 120 or the upper mold 130 first, or the release film F may be disposed on both the lower mold 120 and the upper mold 130 at the same time.

[0070] After the release film F is adsorbed onto the lower mold 120 and the upper mold 130 , the process moves from the film placement step S10 to the carrying-in step S20 .

[0071] The loading step S20 is a step of loading the resin material R and the substrate W into the forming mold 110 .

[0072] Specifically, in the carrying-in step S20, the resin material R is carried into the molding die 110 by a predetermined conveying device. The resin material R is contained in the lower die 120 (inside the side member 123). In addition, as the resin material R, various resins in various states such as solid powdery resin (including granular resin) and liquid liquid resin can be used.

[0073] In addition, in the carrying-in step S20, the substrate W is carried into the forming mold 110 by a predetermined conveying device. Figure 4 As shown, the substrate W is sucked by the substrate suction hole 132a of the upper mold 130 which is under negative pressure due to the operation of the pump 150. As a result, the substrate W is held in close contact with the lower surface of the suction member 132 via the release film F. At this time, the pressing member 140 is pushed upward by the substrate W sucked by the suction member 132.

[0074] In addition, the order of carrying in the resin material R and the substrate W is not particularly limited, and either one may be carried into the molding die 110 first, or they may be carried into the molding die 110 simultaneously.

[0075] After the resin material R and the substrate W are carried in, the process shifts from the carrying-in step S20 to the mold clamping step S30 .

[0076] The mold clamping step S30 is a step of closing (locking) the molding die 110 (the lower mold 120 and the upper mold 130 ).

[0077] Specifically, in the mold clamping step S30, first, the resin material R contained in the mold cavity C is melted if it is solid, and is reduced in viscosity if it is liquid, by a heating mechanism (not shown) provided in the lower mold 120. Next, the lower mold 120 is raised toward the upper mold 130 by driving the driving mechanism 162. When the lower mold 120 rises to a predetermined position, the upper surface of the side member 123 contacts the lower surface of the upper mold 130, and the lower mold 120 (the space containing the resin material R) is blocked from above by the upper mold 130.

[0078] like Figure 5As shown, by further driving the driving mechanism 162, the bottom member 122 of the lower mold 120 further rises toward the upper mold 130. At this time, since the side member 123 is in contact with the upper mold 130, it does not rise. That is, the bottom member 122 rises relative to the side member 123. When the bottom member 122 rises, the resin material R accommodated in the lower mold 120 is pressurized. When the bottom member 122 rises to a certain extent, the mold clamping is completed.

[0079] In addition, when clamping the mold, it is preferable to reduce the pressure by sucking the air in the molding die 110. In this way, the air or gas in the resin material R can be discharged.

[0080] After the mold clamping is completed, the process proceeds from the mold clamping step S30 to the resin molding step S40 .

[0081] The resin molding step S40 is a step of hardening the resin material R to perform resin molding.

[0082] Specifically, in the resin forming step S40, Figure 5 As shown, the resin material R is pressed and then waited for a predetermined time. The resin material R is thereby cured to perform resin molding on the substrate W. In addition, in the example shown, a method of performing resin molding to the outside of the substrate W (overmold) is shown.

[0083] After the resin material R is cured, the process moves from the resin molding step S40 to the mold opening step S50 .

[0084] The mold opening step S50 is a step of opening (opening the mold) the molding die 110 (the lower mold 120 and the upper mold 130 ).

[0085] Specifically, if Figure 6 As shown, in the mold opening step S50 , the lower mold 120 is lowered to be separated from the upper mold 130 by driving the driving mechanism 162 . As a result, the lower mold 120 is separated from the lower surface of the upper mold 130 .

[0086] Here, in the resin-molded substrate W (resin-molded product), deformation (warping) may occur due to the difference in thermal shrinkage between the substrate W and the resin material R. For example, Figure 62 shows an example in which the outer peripheral portion of the resin-molded substrate W is bent downward. When such deformation occurs, in the conventional resin molding device, the substrate W sometimes leaves the substrate adsorption hole 132a (through hole F1), and the substrate adsorption hole 132a is in an open state (a state in which the air inside the substrate adsorption hole 132a is connected to the surrounding air (external air) of the resin molding device). When the substrate adsorption hole 132a is open, the surrounding air is sucked into the central recess 131a through the substrate adsorption hole 132a, and the negative pressure generated by the pump 150 is reduced, and the substrate W may fall.

[0087] Therefore, in this embodiment, the pressing member 140 is provided to prevent the substrate W from falling. Figure 6 As shown in FIG. 1 , when the outer peripheral portion of the resin-molded substrate W bends downward, the pressing member 140 moves downward due to its own weight. The release film F is pressed downward to follow the substrate W by the movement of the pressing member 140. As a result, the through hole F1 of the release film F is kept in close contact with the substrate W, so the substrate adsorption hole 132a is not opened, and the negative pressure generated by the pump 150 is maintained. Therefore, the adsorption force of the substrate W is not reduced, and the substrate W can be prevented from falling.

[0088] After the mold opening is completed, the process is transferred from the mold opening step S50 to the unloading step S60.

[0089] The unloading step S60 is a step of unloading the resin molded product from the molding die 110. In the unloading step S60, the resin molded product is unloaded from the molding die 110 by a predetermined conveying device.

[0090] As described above, in the present embodiment, even when the resin-molded substrate W (resin-molded product) is deformed, a decrease in the suction force by the pump 150 can be suppressed, thereby preventing the substrate W from falling.

[0091] In addition, Figure 6 In the examples such as FIG. 1 and FIG. 2 , the resin molding is performed to the outside of the substrate W (overmolding), but the present invention is not limited to this. Figure 7 As shown, during mold clamping, the outer peripheral portion of the substrate W can be clamped by the side members 123 of the lower mold 120 and the suction members 132 of the upper mold 130, thereby only the lower surface of the substrate W can be resin molded.

[0092] <Resin molding device 200 (second embodiment)>

[0093] Below, use Figures 8 to 10 A resin molding apparatus 200 according to the second embodiment will be described.

[0094] The resin molding device 200 of the second embodiment is different from the resin molding device 100 of the first embodiment in that the upper mold 130 includes an elastic member 133, an annular member 134, and a spacer 135. Therefore, the following mainly describes the difference, and the description of the same structure as the first embodiment is omitted.

[0095] Figure 8 The elastic member 133 shown is used to press the pressing member 140 downward. In this embodiment, a compression coil spring is used as the elastic member 133. The elastic member 133 is arranged in the central recess 131a of the upper mold base member 131. The elastic member 133 is arranged between the limiting portion 142 of the pressing member 140 and the upper mold base member 131, and always applies force to the pressing member 140 downward. As a result, the force of the pressing member 140 pressing the release film F downward can be strengthened, and the release film F can be made to follow the substrate W more reliably.

[0096] The annular member 134 is a member configured to surround the substrate W adsorbed by the adsorption member 132 from the outside. The annular member 134 is formed in a circular ring shape or a rectangular ring shape when viewed from above. A recessed portion 132d in a circular ring shape or a rectangular ring shape when viewed from above is formed on the bottom surface of the adsorption member 132, which surrounds the substrate adsorption hole 132a and the through hole 132c from the outside when viewed from above. The annular member 134 is arranged in the recessed portion 132d of the adsorption member 132.

[0097] The spacer 135 is used to adjust the vertical position of the annular member 134. The spacer 135 is formed in the same shape (circular ring or rectangular ring) as the annular member 134 when viewed from above. The spacer 135 is formed to have a smaller vertical width than the annular member 134. The spacer 135 is arranged between the annular member 134 and the adsorption member 132.

[0098] By disposing the spacer 135 between the annular member 134 and the adsorption member 132, the lower surface of the annular member 134 is configured to protrude further downward than the lower surface of the adsorption member 132. The protrusion amount of the annular member 134 can be arbitrarily adjusted by changing the upper and lower widths of the spacer 135 or changing the number of the spacers 135.

[0099] Film adsorption holes 134a are formed in the annular member 134 and the spacer 135 at positions corresponding to the film adsorption holes 132b of the adsorption member 132. The film adsorption holes 134a are formed to vertically penetrate the annular member 134 and the spacer 135 and are connected to the film adsorption holes 132b.

[0100] Thus, the lower surface of the upper mold 130 is formed in a stepped shape by the first surface X1 having the substrate adsorption holes 132a and the through holes 132c formed therein and the second surface X2 formed below the first surface X1 and having the film adsorption holes 134a formed therein.

[0101] By using the resin molding apparatus 200 configured in this way, a resin molded product can be manufactured by the same process as the first embodiment (see Figure 3 ).

[0102] Furthermore, in the film placement step S10 , the release film F placed on the upper mold 130 is adsorbed by the film adsorption holes 134 a of the annular member 134 .

[0103] In addition, in the mold opening step S50, Fig. 9 As shown in the figure, when the outer peripheral portion of the resin-molded substrate W (resin-molded product) is bent downward, the pressing member 140 moves downward as in the first embodiment. At this time, since the pressing member 140 is pressed downward by the elastic member 133, the release film F can easily follow the substrate W.

[0104] In addition, since the release film F is adsorbed by the annular member 134 located below the adsorption member 132, the release film F can be smoothly pressed downward by the pressing member 140. As a result, the release film F can easily follow the substrate W. In particular, in the present embodiment, the position (upper and lower positions) of the second surface X2 in the vertical direction can be adjusted by the spacer 135. Therefore, for example, the deformation amount of the substrate W is known in advance, and the position of the second surface X2 is adjusted to be at a position corresponding to the deformation amount, thereby making it easier for the release film F to follow the substrate W.

[0105] In addition, Figure 8 and Fig. 9 , an example (overmolding) in which resin molding is performed to the outside of the substrate W is shown, but the present invention is not limited to this. Fig.10 As shown, during mold clamping, the outer peripheral portion of the substrate W can be clamped by the side member 123 of the lower mold 120 and the suction member 132 of the upper mold 130, thereby performing resin molding only on the lower surface of the substrate W. In this case, the thickness of the substrate W is set to be thicker than the step difference between the lower surface of the suction member 132 and the lower surface of the annular member 134.

[0106] As mentioned above, although embodiment of this invention was described, this invention is not limited to this embodiment, It can change suitably within the range of the technical idea of ​​the invention described in a claim.

[0107] For example, the number, shape, arrangement, etc. of the substrate adsorption holes 132 a , the film adsorption holes 132 b , the pressing members 140 , etc. can be arbitrarily changed.

[0108] In addition, Figure 2 The use of a circular substrate W (see Figure 2), but the shape of the substrate W is not limited thereto, and for example, a rectangular substrate W may be used. In addition, the arrangement of the substrate adsorption holes 132a, the film adsorption holes 132b, the pressing member 140, etc. may be arbitrarily changed according to the shape of the substrate W. For example, when a rectangular substrate W is used, the pressing member 140 may be arranged in a rectangular shape along the outer peripheral portion of the substrate W. In addition, the shape of each part of the resin molding device 100 (molding mold 110, etc.) may be arbitrarily changed to a circular shape in plan view, a rectangular shape in plan view, etc. according to the shape of the substrate W (circular, rectangular, etc.).

[0109] In addition, in the above-mentioned embodiments, an example is shown in which the outer peripheral portion of the substrate W is bent downward (see Figure 6 The deformation of the substrate W is just one example, and the deformation may vary depending on the shape of the substrate W or the resin material R for resin molding. Therefore, it is desirable that the pressing member 140 is configured to cope with various deformations of the substrate W. For example, it is desirable to evenly configure the pressing members 140 at locations where the substrate W may bend downward. By configuring in this way, no matter which location of the substrate W bends downward, the release film F can be pressed down by the pressing member 140 configured at the location, so that the release film F follows the substrate W.

[0110] In addition, the present invention is not limited to the molding die 110 (resin molding device 100 / resin molding device 200) in which the mold release film F is provided on the upper mold 130 to prevent contamination of the upper mold 130 (adhesion of the resin material R, etc.), and can also be applied to other molding dies (resin molding devices). Figure 7 and Fig.10 In the structure where the upper surface of the cavity C is completely covered by the substrate W, as in the resin molding apparatus 100 / resin molding apparatus 200 shown in the figure, the resin material R does not adhere to the upper mold 130. In the above case, from the viewpoint of preventing contamination of the upper mold 130, it is not necessary to provide the release film F on the upper mold 130. However, even in a molding mold that does not require the release film F for preventing contamination, etc., from the viewpoint of preventing the substrate W from falling, the release film F or the pressing member 140 can be used as in the above embodiments.

[0111] In addition, in the above-described embodiments, an example is shown in which the upper portion of the pressing member 140 is arranged on the central recess 131a of the upper mold base member 131 to which the negative pressure generated by the pump 150 is applied (see Figure 1 ), but the present invention is not limited thereto, and the configuration of the pressing member 140 can be arbitrarily changed. For example, the pressing member 140 can also be configured in a recessed portion provided separately from the central recessed portion 131a, or in a manner that penetrates the upper mold 130 from top to bottom.

[0112] In the second embodiment, an example is shown in which a compression coil spring is used as the elastic member 133 for pressing the pressing member 140 downward (see Figure 8 The present invention is not limited thereto, and various other elastic members (such as leaf springs, tension coil springs, etc.) may also be used. In addition, in the second embodiment, an example of using the elastic member 133 to press the pressing member 140 downward is illustrated, but the structure for pressing the pressing member 140 is not limited thereto. For example, instead of using an elastic member, various actuators such as a motor or a cylinder may be used to press the pressing member 140 downward.

[0113] In addition, the manufacturing method of the resin molded product shown in each embodiment (refer to Figure 3 ) is an example and can be changed appropriately. For example, in the above-mentioned embodiments, an example is shown in which the mold release film F is arranged on the forming mold 110 in the film arrangement step S10 and the resin material R is carried in the carrying-in step S20, but for example, after the resin material R is arranged on the mold release film F arranged on the lower mold 120, the mold release film F and the resin material R can be arranged on the lower mold 120 together.

[0114] Furthermore, in the above-described embodiments, an example in which a thermosetting resin material is used as the resin material R is described. However, the present invention is not limited to this, and a thermoplastic resin material may also be used.

[0115] <Note>

[0116] The forming die 110 of the first aspect of the present disclosure is a forming die 110 for performing resin forming by compression forming, and includes:

[0117] The upper mold 130 is formed with a plurality of substrate adsorption holes 132a for adsorbing the substrate W and a plurality of film adsorption holes 132b for adsorbing the release film F in an open manner on the lower surface;

[0118] A lower mold 120 is disposed at a lower side of the upper mold in a vertical direction; and

[0119] The plurality of pressing members 140 are disposed on the upper mold 130 in a manner that allows them to move up and down, such that lower ends thereof can protrude downward from the lower surface of the upper mold 130 .

[0120] According to the forming mold 110 of the first side of the present disclosure, even when the substrate W is warped, the substrate W can be prevented from falling from the upper mold 130. That is, the release film F can be pressed down by the pressing member 140 in a manner following the deformation of the substrate W, thereby preventing the substrate adsorption hole 132a from opening and maintaining the negative pressure for adsorbing the substrate W.

[0121] In the forming die 110 of the second aspect according to the first aspect,

[0122] When viewed from the vertical direction, the plurality of pressing members 140 are arranged inside the region surrounded by the plurality of film adsorption holes 132b.

[0123] When viewed from the vertical direction, the plurality of substrate adsorption holes 132 a are formed inside a region surrounded by the plurality of pressing members 140 .

[0124] According to the second aspect of the present disclosure, the mold release film F can be easily adapted to the warpage of the outer peripheral portion of the substrate W by pressing down the mold release film F using the pressing member 140 disposed outside the substrate suction hole 132 a .

[0125] The forming die 110 of the third aspect according to the first aspect or the second aspect further includes an elastic member 133,

[0126] The elastic member 133 presses the pressing member 140 downward.

[0127] According to the forming mold 110 of the third aspect of the present disclosure, the force of the pressing member 140 pressing down the release film F can be increased, and the release film F can be made to follow the warpage of the substrate W more easily.

[0128] In the forming die 110 of the fourth aspect according to any one of the first to third aspects,

[0129] The pressing member 140 includes a restricting portion 142 for restricting downward movement.

[0130] According to the forming die 110 of the fourth aspect of the present disclosure, it is possible to prevent the pressing member 140 from falling off.

[0131] In the forming die 110 of the fifth aspect according to any one of the first to fourth aspects,

[0132] The pressing member 140 has a tapered lower end or an R-shaped corner.

[0133] According to the forming die 110 of the fifth aspect of the present disclosure, damage to the release film F can be prevented.

[0134] In the forming die 110 of the sixth aspect according to any one of the first aspect to the fifth aspect,

[0135] The lower surface of the upper mold 130 includes:

[0136] The first surface X1 is provided with the pressing member 140; and

[0137] The second surface X2 is formed with a plurality of the film adsorption holes 134 a and is formed to be located below the first surface X1 .

[0138] According to the forming die 110 of the sixth aspect of the present disclosure, the pressing member 140 can smoothly press the release film F downward.

[0139] In the forming die 110 of the seventh aspect according to the sixth aspect,

[0140] The upper mold 130 is configured to be able to adjust the position of the second surface X2 in the vertical direction.

[0141] According to the molding die 110 of the seventh aspect of the present disclosure, by adjusting the position of the second surface X2 to a position corresponding to the warping of the substrate W, the release film F can easily follow the warping of the substrate W.

[0142] The resin molding device 100 / resin molding device 200 of the eighth aspect includes:

[0143] The forming die 110 according to any one of the first to seventh aspects; and

[0144] The mold clamping mechanism 160 performs mold clamping of the forming mold 110 .

[0145] According to the resin molding apparatus 100 / the resin molding apparatus 200 of the eighth aspect of the present disclosure, even when the substrate W is warped, it is possible to prevent the substrate W from falling from the upper mold 130 .

[0146] A method for manufacturing a resin molded product according to a ninth aspect is a method for manufacturing a resin molded product using the resin molding apparatus 100 / the resin molding apparatus 200 according to the eighth aspect, and includes:

[0147] Film disposing step S10, disposing the release film F on the forming die 110;

[0148] In the loading step S20, the resin material R is loaded into the molding die 110;

[0149] A mold clamping step S30 is to clamp the forming mold 110;

[0150] A resin molding step S40 of hardening the resin material R to perform resin molding; and

[0151] In the mold opening step S50 , the forming mold 110 is opened.

[0152] According to the method for manufacturing a resin molded product according to the ninth aspect of the present disclosure, even when the substrate W is warped, it is possible to prevent the substrate W from falling from the upper mold 130 .

[0153] Explanation of symbols

[0154] 100: Resin molding device

[0155] 110: Forming die

[0156] 120: Lower die

[0157] 130: Upper mold

[0158] 132a: Substrate adsorption hole

[0159] 132b: membrane adsorption pore

[0160] 133: Elastic member

[0161] 140: Pressing member

[0162] 142: Restriction Department

[0163] 160: Clamping mechanism

[0164] 200: Resin molding device

Claims

1. A molding die for performing resin molding by compression molding, the molding die comprising: An upper mold having a plurality of substrate adsorption holes for adsorbing the substrate and a plurality of film adsorption holes for adsorbing the release film formed in an open manner on the lower surface; A lower die is arranged on the lower side of the upper die in the vertical direction; as well as A plurality of pressing members are provided on the upper mold in a manner capable of moving up and down so that lower ends thereof can protrude downward from a lower surface of the upper mold.

2. The forming die according to claim 1, wherein: When viewed from the vertical direction, the plurality of pressing members are arranged inside the region surrounded by the plurality of film adsorption holes. The plurality of substrate adsorption holes are formed inside a region surrounded by the plurality of pressing members when viewed in a vertical direction.

3. The forming die according to claim 1 or 2, further comprising an elastic member, The elastic member presses the pressing member downward.

4. The forming die according to any one of claims 1 to 3, wherein: The pressing member includes a restricting portion that restricts downward movement.

5. The forming die according to any one of claims 1 to 4, wherein: The pressing member may have a tapered lower end or an R-shaped corner.

6. The forming die according to any one of claims 1 to 5, wherein: The lower surface of the upper mold comprises: The first surface is provided with the pressing member; and The second surface is formed with a plurality of the film adsorption holes, and is formed to be located below the first surface.

7. The forming die according to claim 6, wherein: The upper mold is configured to be able to adjust the position of the second surface in the vertical direction.

8. A resin molding device comprising: The forming die according to any one of claims 1 to 7; as well as The clamping mechanism is used to clamp the forming mold.

9. A method for manufacturing a resin molded product, which is a method for manufacturing a resin molded product using the resin molding apparatus according to claim 8, and comprises: a film disposing step of disposing the release film on the forming mold; A loading step of loading the resin material into the forming mold; A clamping step for clamping the forming mold; A resin molding step of hardening the resin material to perform resin molding; as well as The mold opening step is to open the molding die.

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