Control unit
By opening holes in the physical components of the control unit to guide the radiator, the problem of poor thermal management in the sandwich-style structure is solved, and more effective hot air circulation and heat dissipation is achieved, the thermal load is reduced, and the reliability of the control unit is improved. sex.
Patent Information
- Application Number
- CN202280096006.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-13
- Publication Date
- 2024-12-20
AI Technical Summary
Due to the large current of the control unit of the sandwich-style structure, there are problems with thermal management, and it is difficult for hot air to flow effectively, resulting in poor thermal management in high-heat load areas.
A plurality of holes are provided in the physical member of the control unit, allowing hot air to flow from the high current region through the physical member and away from the high heat load region, through which the hot air is directed to the radiator for cooling and reducing heat accumulation.
It effectively reduces the thermal load of the control unit, reduces the heat accumulation of flexible components and power rails, improves the overall heat dissipation efficiency, avoids thermal failure, and enhances the reliability of the control unit.
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Figure CN119174288A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a control unit for controlling a component of a machine, such as an engine of a vehicle. Background Art
[0002] Control units heat up due to the movement of electrical current, especially in areas with high current flow and densely packed electrical units.
[0003] Modern control units use flexible PCB layers with power tracks that allow high currents to flow between the two rigid PCB components.
[0004] US 2019 / 0150269 A1 describes multiple rigid printed circuit boards (PCBs) connected by flexible PCB layers to form a sandwich structure.
[0005] WO 2021 069061 A1 describes a heat sink that is sandwiched between two rigid PCBs connected by a flexible PCB layer, allowing large currents to flow between the two rigid PCBs.
[0006] In this context, thermal management of control units arranged in a sandwich structure presents problems, since the currents flowing between certain layers of the sandwich structure are very large. Summary of the invention
[0007] In order to solve the above problems, according to a first aspect of the present invention, a control unit for controlling a component of a machine is disclosed herein. The control unit comprises: a first layer, the first layer comprising a printed circuit board (PCB); a second layer, the second layer comprising the PCB; and a solid member, the solid member comprising a heat sink sandwiched in a space between the first layer and the second layer.
[0008] The second layer is arranged above the first layer in the direction of gravity and connected to the first layer through a flexible component carrying a power track, wherein the first layer is a power board, the second layer is a logic board, and wherein the solid component includes a plurality of holes, and the plurality of holes are configured to allow hot air to flow through the solid component.
[0009] The invention disclosed herein is based on the principle of forming a hole in a solid component between two PCBs so that hot air trapped between one of the PCBs and the solid component can pass through the solid component. Thus, the hole allows hot air that cannot flow into the heat sink to flow through the solid component away from high current areas with high heat loads.
[0010] According to one embodiment, said plurality of holes extends at least partially in a region covered by an element extending from said heat sink towards said first layer.
[0011] Elements extending from the solid member towards the first layer (i.e. elements extending downwards in the direction of gravity) form a thermal barrier for hot air rising from the first layer. Thus, holes extending in the area covered by such elements provide an effective channel for thermal management of the control unit disclosed herein.
[0012] According to one embodiment, the plurality of holes extends at least partially in a region which is separated from the heat sink by means of an element arranged on the first layer.
[0013] Since components (eg, electronic parts) arranged on the first layer may block the passage of hot air to the heat sink, holes arranged in those areas where hot air is blocked by such components may provide effective channels for thermal management of the control unit disclosed herein.
[0014] According to one embodiment, the plurality of holes extends at least partially in a region separated from the heat sink by means of an element formed by the solid component.
[0015] Since elements formed by the solid member (such as housings of electronic components) may block the path of hot air to the heat sink, holes arranged in areas where hot air is blocked by these elements may provide an effective thermal management channel for the control unit disclosed herein.
[0016] According to one embodiment, the plurality of holes extend through the solid member and connect the space between the first layer and the solid member with the space between the second layer and the solid member.
[0017] For example, by connecting the space between the first layer and the solid component with the space between the second layer and the solid component, hot air can flow from the space between the first layer and the solid component into the space between the second layer and the solid component and cool there or further flow out of the control unit.
[0018] According to one embodiment, the plurality of holes is arranged in an area at least partially covered by the flexible member.
[0019] Since the flexible member carries power rails, the flexible member is susceptible to electrical and thermal loads. Therefore, by arranging a plurality of holes in the area at least partially covered by the flexible member, hot air generated by the power rails of the flexible member and / or electronic components arranged near the flexible member can flow out of the flexible member through the holes, thereby reducing the thermal load in the flexible member and the control unit as a whole.
[0020] According to one embodiment, a plurality of holes are arranged between the heat sink and the flexible member.
[0021] Since hot air generated by the power supply unit of the first layer accumulates between the heat sink and the flexible member, the holes arranged in this area can allow the hot air to flow away from the flexible member through the holes, thereby reducing the thermal load of the flexible member and the control unit as a whole.
[0022] According to one embodiment, the solid member comprises a plurality of receivers for receiving at least one element, wherein at least one hole of the plurality of holes extends in a region between predetermined receivers of the plurality of receivers.
[0023] Arranging the holes in the area between predetermined receptacles ensures that air flowing in the area covered by the electronic components received by the receptacles can flow out of this area, thereby reducing the thermal load in the flexible member and the control unit as a whole.
[0024] According to one embodiment, the second layer comprises a plurality of holes configured to allow hot air flowing through the plurality of holes of the solid member to flow through the second layer into an environment external to the control unit.
[0025] The additional holes in the second layer provide a thermal path for hot air to flow through the holes in the solid member, thereby reducing heat in the control unit.
[0026] According to a second aspect of the present invention, a machine, such as a vehicle, is disclosed herein. The machine comprises an embodiment of the control unit disclosed herein. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Further advantages and features will become more apparent from the following description in conjunction with the accompanying drawings.
[0028] Figure 1 According to an embodiment of the control unit,
[0029] Figure 2 according to Figure 1 The physical components of the control unit
[0030] Figure 3 A machine according to an embodiment. DETAILED DESCRIPTION
[0031] Figure 1 A control unit 100 is shown. The control unit 100 comprises a first layer 101 comprising a printed circuit board (PCB), a second layer 103 comprising the PCB, and a solid component 105 comprising a heat sink 107 and sandwiched in a space between the first layer 101 and the second layer 103.
[0032] The second layer 103 is disposed above the first layer 101 along the direction of gravity and is connected to the first layer 101 via a flexible member 109 with a power rail.
[0033] The first layer 101 is a power board, and the second layer 103 is a logic board.
[0034] The solid member 105 comprises a plurality of holes 111 which are configured to allow hot air to flow through the solid member 105. Thus, hot air flowing in the area 113 covered by the structural element 115 is not blocked in the area 113 but can flow through the holes 111, thereby reducing the thermal load on the components of the control unit, in particular the components of the power board.
[0035] Figure 2 The solid component 105 is shown in detail. Figure 2 As can be seen in the figure, the predetermined holes 201 extend in the area 203 between the receivers 205 for receiving components such as electronic components. Therefore, the airflow in the area 203 can leave the components through the holes 201, thereby reducing the heat load on the components.
[0036] Figure 3 A machine 300 is shown. The machine 300 includes a Figure 1 control unit 100. Since the control unit 100 is not prone to thermal failure, the machine 300 is very reliable.
[0037] Reference Mark List
[0038] 100 control units
[0039] 101 First Floor
[0040] 103 Second Floor
[0041] 105 physical components
[0042] 107 Radiator
[0043] 109 Flexible components
[0044] 111 holes
[0045] Area 113
[0046] 115 Structural elements
[0047] 201 holes
[0048] Area 203
[0049] 205 Receiver
[0050] 300 machines
Claims
1. A control unit (100) for controlling components of a machine (300), the control unit (100) comprising: - comprising a first layer (101) of a printed circuit board (PCB), - including the second layer (103) of the PCB, - a solid member (105) comprising a heat sink (107) sandwiched in the space between said first layer (101) and said second layer (103), The second layer (103) is arranged above the first layer (101) along the direction of gravity and is connected to the first layer (101) via a flexible member (109) carrying a power rail. wherein the first layer (101) is a power board, the second layer (103) is a logic board, and The solid component (105) comprises a plurality of holes (111, 201), and the plurality of holes are configured to allow hot air to flow through the solid component (105).
2. The control unit (100) according to claim 1, in, The plurality of holes (111, 201) extend at least partially in a region (113) covered by an element (115) extending from the solid component towards the first layer (101).
3. The control unit (100) according to claim 1 or 2, The plurality of holes (111, 201) extend at least partially in a region separated from the heat sink (107) by means of an element arranged on the first layer (101).
4. A control unit (100) according to any one of the preceding claims, The plurality of holes (111, 201) extend at least partially in a region separated from the heat sink (107) by means of an element formed by the solid component (105).
5. A control unit (100) according to any one of the preceding claims, The plurality of holes (111, 201) extend through the solid member (105) and connect the space between the first layer (101) and the solid member (105) with the space between the second layer (103) and the solid member (105).
6. A control unit (100) according to any one of the preceding claims, in, The plurality of holes (111, 201) are arranged in a region at least partially covered by the flexible member (109).
7. A control unit (100) according to any one of the preceding claims, The plurality of holes (111, 201) are arranged between the heat sink (107) and the flexible member (109).
8. A control unit (100) according to any one of the preceding claims, wherein the physical member (105) comprises a plurality of receivers for receiving at least one element, and At least one hole (201) of the plurality of holes (111, 201) extends in a region (203) between predetermined receivers (205) of the plurality of receivers.
9. A control unit (100) according to any one of the preceding claims, The second layer (103) comprises a plurality of holes, wherein the plurality of holes of the second layer are configured to allow hot air flowing through the plurality of holes (111, 201) of the solid component (105) to flow through the second layer (103) and into an environment outside the control unit (100).
10. A machine (300) comprising a control unit (100) according to any one of claims 1 to 9.
Citation Information
Patent Citations
Semi-flexible ridged printed circuit board assembly
US20190150269A1
Assembly comprising a circuit carrier and a heat sink
WO2021069061A1
