Method for processing workpiece

Abstract

The invention provides a processing method of a processed object, which can inhibit damage of a device. The processing method of the processed object comprises the following steps: a first processing step of irradiating a laser beam along a plurality of first division preset lines to divide the processed object into a plurality of long strips; and a second processing step in which, after the first processing step is performed, the workpiece is divided into a plurality of chips by irradiating a laser beam along a plurality of second division predetermined lines. In the first processing step, each of the first division lines is irradiated with a laser beam from one end side of the first division line toward the other end side of the first division line. The operation of irradiating the laser beam from one end side to the other end side of one second division predetermined line and then irradiating the laser beam from the other end side to the one end side of the adjacent second division predetermined line is repeated.

Description

Technical Field

[0001] The present invention relates to a method for processing a workpiece in which a first planned dividing line extending in a first direction and a second planned dividing line extending in a second direction are set. Background Art

[0002] As a laser processing device for dividing a workpiece by irradiating it with a laser beam, there is known a device that reciprocates the workpiece relative to the laser beam in a direction parallel to a planned dividing line in order to shorten processing time (for example, see Patent Document 1).

[0003] When using a laser processing device such as that described in Patent Document 1 to singulate an object to be processed into chips, the object to be processed is first divided along a first predetermined dividing line extending in a first direction to form a plurality of long strips, and then the object to be processed is divided into chips along a second predetermined dividing line extending in a second direction.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2016-132017

[0005] When the workpiece is divided along the first planned dividing line, the position of the formed strips may be shifted in the first direction. This phenomenon occurs particularly significantly when the width (index dimension) of the strips is as small as 0.5 mm or less.

[0006] For example, in the case of a workpiece in which devices are formed in areas divided by a plurality of intersecting predetermined dividing lines, when the position of the long strip is offset, the second predetermined dividing line is not on a straight line, so when the laser beam is irradiated along the second direction, the laser beam may irradiate the device and damage the device. Summary of the invention

[0007] Therefore, an object of the present invention is to provide a method for processing a workpiece that can suppress damage to a device.

[0008] According to one aspect of the present invention, a method for processing a workpiece is provided, wherein the workpiece having predetermined splitting lines is split along the predetermined splitting lines to form a plurality of chips, the predetermined splitting lines comprising a plurality of first predetermined splitting lines extending in a first direction and a plurality of second predetermined splitting lines extending in a second direction intersecting the first direction, wherein the method for processing the workpiece comprises the following steps: a first processing step, wherein the workpiece is split into a plurality of strips by irradiating a laser beam along the plurality of first predetermined splitting lines; and a second processing step, wherein after the first processing step is performed, the workpiece is split into a plurality of chips by irradiating a laser beam along the plurality of second predetermined splitting lines, wherein in the first processing step, each of the first predetermined splitting lines is irradiated with the laser beam from one end side toward the other end side of the first predetermined splitting line, and in the second processing step, the action of irradiating the laser beam from one end side toward the other end side of one of the second predetermined splitting lines and then irradiating the laser beam from the other end side toward the one end side of an adjacent second predetermined splitting line is repeated.

[0009] Preferably, the processing method of the workpiece also has the following laser processing groove forming step: before implementing the first processing step, after irradiating the laser beam along each of the first predetermined dividing lines to form a first laser processing groove, irradiating the laser beam along each of the second predetermined dividing lines to form a second laser processing groove. In the laser processing groove forming step, after irradiating the laser beam from one end side of the first predetermined dividing line or the second predetermined dividing line toward the other end side, the action of irradiating the laser beam from the other end side toward the one end side of the adjacent first predetermined dividing line or the second predetermined dividing line is repeated.

[0010] According to another aspect of the present invention, a method for processing a workpiece is provided, wherein the workpiece with a predetermined splitting line is split along the predetermined splitting line to form a plurality of chips, the predetermined splitting lines comprising a plurality of first predetermined splitting lines extending in a first direction and a plurality of second predetermined splitting lines extending in a second direction intersecting the first direction, wherein the method for processing the workpiece comprises the following steps: a first processing step, in which a laser beam is irradiated along the plurality of first predetermined splitting lines to split the workpiece into a plurality of long strips; and a second processing step, in which, after the first processing step is implemented, a laser beam is irradiated along the plurality of second predetermined splitting lines to split the workpiece into a plurality of chips, wherein in the first processing step, the action of irradiating each first predetermined splitting line with the laser beam from one end side toward the other end side of the first predetermined splitting line, then irradiating the first predetermined splitting line with the laser beam from the other end side toward the one end side after the laser beam has been irradiated from the one end side toward the other end side, and then irradiating the adjacent first predetermined splitting line with the laser beam.

[0011] Preferably, the method for processing a workpiece further comprises a tape sticking step of sticking the workpiece on a vinyl chloride tape before performing the first processing step.

[0012] The present invention has the effect of being able to suppress damage to a device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view schematically showing a workpiece to be processed by the workpiece processing method according to the first embodiment.

[0014] Figure 2 This is a flowchart showing the flow of the method for processing a workpiece according to the first embodiment.

[0015] Figure 3 It is schematically shown Figure 2 A perspective view of a wafer after a tape sticking step in the method for processing a workpiece shown.

[0016] Figure 4 is a schematic diagram showing the implementation Figure 2 A perspective view of a configuration example of a laser processing device in an alignment step, a first processing step, and a second processing step of a method for processing a workpiece shown.

[0017] Figure 5 It is schematically shown Figure 2 A schematic side view in partial cross section of an alignment step of a method for machining a workpiece is shown.

[0018] Figure 6 The partial cross section is shown schematically. Figure 2 A side view of a first processing step and a second processing step of a method for processing a workpiece is shown.

[0019] Figure 7 It is schematically shown Figure 2 A plan view showing the relative movement direction of the laser beam with respect to the workpiece in the first processing step of the method for processing the workpiece shown.

[0020] Figure 8 It is schematically shown Figure 2 A plan view of a workpiece after the first processing step of the workpiece processing method shown.

[0021] Fig. 9 It is schematically shown in Figure 2 FIG. 1 is a plan view of a workpiece before irradiation with a laser beam in a second processing step of a method for processing a workpiece shown in FIG.

[0022] Fig.10 It is schematically shown Figure 2FIG. 1 is a plan view showing the relative movement direction of the laser beam with respect to the workpiece in the second processing step of the method for processing the workpiece.

[0023] Fig.11 It is a flowchart showing the flow of the method for processing a workpiece according to the second embodiment.

[0024] Fig.12 It is schematically shown Fig.11 A plan view showing a relative moving direction of a laser beam with respect to a first planned dividing line of a workpiece in a laser machining groove forming step of a method for machining a workpiece shown in FIG.

[0025] Fig.13 It is schematically shown Fig.11 A plan view showing a relative moving direction of a laser beam with respect to a second planned dividing line of a workpiece in a laser machining groove forming step of a workpiece machining method shown in FIG.

[0026] Fig.14 It is schematically shown Fig.11 A plan view showing the relative movement direction of the laser beam with respect to the workpiece in the first processing step of the method for processing the workpiece shown.

[0027] Fig.15 It is schematically shown Fig.11 FIG. 1 is a plan view showing the relative movement direction of the laser beam with respect to the workpiece in the second processing step of the method for processing the workpiece.

[0028] Fig.16 It is a plan view schematically showing the relative movement direction of the laser beam with respect to the first planned dividing line of the workpiece in the first processing step of the workpiece processing method according to the third embodiment.

[0029] Fig.17 It is a plan view schematically showing the relative movement direction of the laser beam with respect to the second planned dividing line of the workpiece in the second processing step of the workpiece processing method according to the third embodiment.

[0030] Description of symbols

[0031] 1: workpiece; 3: front side (one side); 4: first predetermined dividing line; 5: second predetermined dividing line; 6: predetermined dividing line; 10: chip; 11: vinyl chloride tape; 13: long strip; 41: laser beam; 101: tape pasting step; 103: first processing step; 104: second processing step; 110: laser processing groove forming step; 201: first direction; 202: second direction; 401: one end; 402: the other end; 403: first laser processing groove; 501: one end; 502: the other end; 503: second laser processing groove. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include elements that can be easily thought of by a person skilled in the art, and substantially the same elements. Furthermore, the structures described below can be appropriately combined. In addition, various omissions, substitutions or changes in the structure can be made within the scope of the gist of the present invention.

[0033] [First embodiment]

[0034] A method for processing a workpiece according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 It is a perspective view schematically showing a workpiece to be processed by the workpiece processing method according to the first embodiment. Figure 2 This is a flowchart showing the flow of the method for processing a workpiece according to the first embodiment.

[0035] The processing method of the workpiece of the embodiment is to Figure 1 The workpiece 1 to be processed by the workpiece processing method of the embodiment is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer having a substrate 2 made of silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), or sapphire.

[0036] The object 1 is provided with a predetermined dividing line 6 on the front surface 3, and the predetermined dividing line 6 includes a plurality of first predetermined dividing lines 4 extending along a linear first direction 201 and a plurality of second predetermined dividing lines 5 extending along a second direction 202 intersecting (perpendicular to) the first direction 201. The object 1 is provided with devices 7 in the regions divided by the predetermined dividing lines 4 and 5. The device 7 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), an optical element such as an LED (Light-Emitting Diode), a MEMS (Micro Electro Mechanical Systems) or a semiconductor memory (semiconductor storage device).

[0037] In the first embodiment, the workpiece 1 is an optical device wafer in which the device 7 is an LED. In the first embodiment, the workpiece 1 has a notch 8 formed at the outer edge thereof as a irregular shape portion indicating the crystal orientation of the substrate 2 .

[0038] The workpiece 1 is divided into individual chips 10 along the predetermined dividing line 4. The chip 10 includes a portion of the substrate 2 and the device 7. In the first embodiment, the chip 10 is formed into a square (rectangle) with a planar shape of 0.5 mm × 0.5 mm. In the present invention, the workpiece 1 is not limited to a circular plate-shaped wafer. For example, the workpiece 1 may also be a rectangular package substrate having a plurality of resin-sealed devices, a ceramic plate, a glass plate, or other rectangular workpieces.

[0039] The first embodiment of the workpiece processing method is a method of dividing a workpiece 1 having predetermined dividing lines 4 and 5 set thereon along the predetermined dividing lines 4 and 5 to form a plurality of chips 10. Figure 2 As shown, the processing method of the workpiece according to the first embodiment includes a tape attaching step 101 , an alignment step 102 , a first processing step 103 , and a second processing step 104 .

[0040] Figure 3 It is schematically shown Figure 2 The tape sticking step 101 is a step of sticking the workpiece 1 on the vinyl chloride tape 11 in order to implement the first processing step 103.

[0041] In the first embodiment, in the tape pasting step 101, as Figure 3 As shown, the central portion of a vinyl chloride tape 11 having a disk shape larger than the outer diameter of the workpiece 1 and having an annular frame 12 attached to the outer edge is attached to the back surface 9 of the workpiece 1, and the workpiece 1 is supported in the opening of the annular frame 12. The vinyl chloride tape 11 is an adhesive tape having a base material and a paste layer, and the paste layer is attached to the annular frame 12 and the workpiece 1. The base material is composed of non-adhesive and flexible polyvinyl chloride, and the paste layer is laminated on the base material and is composed of an adhesive and flexible resin.

[0042] Regarding the vinyl chloride tape 11, the base material is made of polyvinyl chloride, and thus the base material usually attached to the workpiece 1 has a lower melting point than the adhesive tape made of polyolefin, polyethylene terephthalate, etc., and is irradiated with the laser beam 41 ( Figure 6 As shown) the workpiece 1 is cut into long strips 13 ( Figure 8 In the case of (as shown in the figure), the strip 13 cut at the rear side of the relative moving direction of the laser beam 41 with respect to the workpiece 1 is prone to positional displacement.

[0043] Next, implementation is described according to the accompanying drawings Figure 2 A laser processing device for an alignment step, a first processing step, and a second processing step of a processing method for a workpiece shown. Figure 4 is a schematic diagram showing the implementation Figure 2 A perspective view of a configuration example of a laser processing device in an alignment step, a first processing step, and a second processing step of a method for processing a workpiece shown.

[0044] Figure 4 The laser processing device 20 shown is a processing device that emits a pulsed laser beam 41 ( Figure 6 The focal point 411 (as shown) is set on the front surface 3 of the substrate 2, and the laser beam 41 is irradiated from the front surface 3 of the workpiece 1 along the predetermined dividing lines 4 and 5 to perform laser processing (also called ablation processing) on ​​the workpiece 1. Figure 4 As shown, the laser processing device 20 includes a holding table 30 for holding the workpiece 1 , a laser beam irradiation unit 40 , a moving unit 50 , an imaging unit 43 , and a controller 45 .

[0045] The holding table 30 holds the workpiece 1 by a holding surface 31 parallel to the horizontal direction. The holding surface 31 is a disk-shaped material formed of porous ceramics or the like, and is connected to a suction source 35 via a suction path 33 and an on-off valve 34. The holding table 30 is sucked by the vacuum suction source to hold the workpiece 1 placed on the holding surface 31. A plurality of clamping parts 32 are arranged around the holding table 30, and the clamping parts 32 clamp the annular frame 12 supporting the workpiece 1 in the opening.

[0046] In addition, the holding table 30 is rotated around an axis parallel to the Z-axis direction, which is perpendicular to the holding surface 31 and parallel to the vertical direction, by the rotation moving unit 53 of the moving unit 50. The holding table 30 is moved in the X-axis direction (corresponding to the processing direction) parallel to the horizontal direction by the X-axis moving unit 51 of the moving unit 50 together with the rotation moving unit 53, and is moved in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction by the Y-axis moving unit 52. The holding table 30 is moved between the processing area below the laser beam irradiation unit 40 and the loading and unloading area for loading and unloading the workpiece 1 away from the bottom of the laser beam irradiation unit 40 by the moving unit 50.

[0047] The moving unit 50 moves the holding table 30 and the focal point 411 of the laser beam 41 irradiated by the laser beam irradiation unit 40 relative to each other in the X-axis direction, the Y-axis direction, the Z-axis direction, and around an axis parallel to the Z-axis direction. The X-axis direction and the Y-axis direction are directions perpendicular to each other and parallel to the holding surface 31 (i.e., the horizontal direction). The Z-axis direction is a direction perpendicular to both the X-axis direction and the Y-axis direction.

[0048] The moving unit 50 includes: an X-axis moving unit 51 as a processing feed unit that moves the holding worktable 30 in the X-axis direction; a Y-axis moving unit 52 as a dividing feed unit that moves the holding worktable 30 in the Y-axis direction; a rotational moving unit 53 that rotates the holding worktable 30 around an axis parallel to the Z-axis direction; and a Z-axis moving unit 54 that moves the focal point 411 of the laser beam 41 of the laser beam irradiation unit 40 in the Z-axis direction.

[0049] The Y-axis moving unit 52 is an indexing feeding unit that relatively moves the holding table 30 and the focal point 411 of the laser beam 41 of the laser beam irradiation unit 40 in the Y-axis direction. In the first embodiment, the Y-axis moving unit 52 is provided on the device body 21 of the laser processing device 20. The Y-axis moving unit 52 supports the moving plate 24 that supports the X-axis moving unit 51 so as to be movable in the Y-axis direction.

[0050] The X-axis moving unit 51 is a processing feeding unit that moves the holding table 30 and the focal point 411 of the laser beam 41 of the laser beam irradiation unit 40 relative to each other in the X-axis direction. The X-axis moving unit 51 is provided on the moving plate 24. The X-axis moving unit 51 supports the second moving plate 25 so as to be movable in the X-axis direction, and the second moving plate 25 supports the rotation moving unit 53 that rotates the holding table 30 around an axis parallel to the Z-axis direction. The second moving plate 25 supports the rotation moving unit 53 and the holding table 30. The rotation moving unit 53 supports the holding table 30.

[0051] The Z-axis moving unit 54 is a feeding unit that moves the holding table 30 and the focal point 411 of the laser beam 41 of the laser beam irradiation unit 40 relative to each other in the Z-axis direction. The Z-axis moving unit 54 is provided on the erection wall 22 erected from the device body 21. The Z-axis moving unit 54 supports the support column 23 so as to be movable in the Z-axis direction, and a part of the laser beam irradiation unit 40 including a condenser lens and the like described later is arranged at the front end of the support column 23.

[0052] The X-axis moving unit 51 has: a known ball screw, which is set to be rotatable around the axis and moves the second moving plate 25 in the X-axis direction when rotating around the axis; a known pulse motor, which rotates the ball screw around the axis; and a known guide rail, which supports the second moving plate 25 to be movable in the X-axis direction. The Y-axis moving unit 52 has: a known ball screw, which is set to be rotatable around the axis and moves the moving plate 24 in the Y-axis direction when rotating around the axis; a known pulse motor, which rotates the ball screw around the axis; and a known guide rail, which supports the moving plate 24 to be movable in the Y-axis direction. The Z-axis moving unit 54 includes: a known ball screw that is rotatable about the axis and moves the support column 23 in the Z-axis direction when rotating about the axis; a known pulse motor that rotates the ball screw about the axis; and a known guide rail that supports the support column 23 so that it can move freely in the Z-axis direction. The rotation moving unit 53 includes a motor that rotates the holding table 30 about the axis, etc.

[0053] In addition, the laser processing device 20 includes: an X-axis direction position detection unit (not shown) for detecting the position of the holding table 30 in the X-axis direction; a Y-axis direction position detection unit (not shown) for detecting the position of the holding table 30 in the Y-axis direction; and a Z-axis direction position detection unit (not shown) for detecting the position of the focusing lens of the laser beam irradiation unit 40 in the Z-axis direction. Each position detection unit outputs the detection result to the controller 45. In the first embodiment, the X-axis direction position and the Y-axis direction position of the holding table 30 of the laser processing device 20 and the Z-axis direction position of the focusing lens of the laser beam irradiation unit 40 are determined based on the distances in the X-axis direction, the Y-axis direction, and the Z-axis direction from a predetermined reference position (not shown).

[0054] The laser beam irradiation unit 40 is a laser beam irradiation unit that uses a condenser lens to focus a pulsed laser beam 41 on the workpiece 1 held on the holding surface 31 of the holding table 30 and irradiates the workpiece 1. Figure 4 As shown, a part of the laser beam irradiation unit 40 is arranged at the front end of the support column 23, and the support column 23 is supported by a Z-axis moving unit 54 provided on the standing wall 22 standing from the device body 21.

[0055] The laser beam irradiation unit 40 irradiates the workpiece 1 held by the holding table 30 with a laser beam 41 having a wavelength that is absorbable by the substrate 2 of the workpiece 1 , thereby performing laser processing on the workpiece 1 .

[0056] The imaging unit 43 captures the workpiece 1 held by the holding table 30. The imaging unit 43 has an imaging element such as a CCD (Charge Coupled Device) imaging element or a CMOS (Complementary MOS: Complementary Metal Oxide Semiconductor) imaging element for capturing an object facing the objective lens in the Z-axis direction. Figure 4 As shown, the imaging unit 43 is disposed at the front end of the support column 23, and the objective lens is disposed at a position parallel to the condenser lens of the laser beam irradiation unit 40 along the X-axis direction.

[0057] The imaging unit 43 acquires the image captured by the imaging element and outputs the acquired image to the controller 45. In addition, the imaging unit 43 captures the workpiece 1 held by the holding surface 31 of the holding table 30, and acquires an image for performing alignment (the alignment performs alignment between the workpiece 1 and the laser beam irradiation unit 40).

[0058] The controller 45 controls the above-mentioned components of the laser processing device 20 respectively, so that the laser processing device 20 performs processing on the workpiece 1. The controller 45 is a computer having a processing device, a storage device, and an input / output interface device. The processing device has a microprocessor such as a CPU (central processing unit), and the storage device has a memory such as a ROM (read only memory) or a RAM (random access memory). The processing device of the controller 45 performs processing according to the computer program stored in the storage device, and outputs the control signal for controlling the laser processing device 20 to the above-mentioned components of the laser processing device 20 via the input / output interface device, thereby realizing the function of the controller 45.

[0059] In addition, the laser processing device 20 includes: a display unit, which is a display unit composed of a liquid crystal display device or the like that displays the state of the processing operation, images, etc.; and an input unit, which is an input unit used when the operator inputs processing conditions, etc. The display unit and the input unit are connected to the controller. In the first embodiment, the input unit is composed of a touch panel provided on the display unit.

[0060] (Alignment Steps)

[0061] Figure 5 The schematic diagram is shown schematically using a partial cross section. Figure 21 is a side view of an alignment step of a processing method for a workpiece shown in FIG. The alignment step 102 is a step of performing alignment, which performs alignment between the laser beam irradiation unit of the laser processing device 20 and the predetermined dividing line of the workpiece. In the first embodiment, in the alignment step 102, the controller 45 of the laser processing device 20 receives and registers the processing conditions of the first processing step 103 and the second processing step 104 input by the operator, and places the workpiece 1 on the holding surface 31 of the holding table 30 positioned in the loading and unloading area. In the first embodiment, in the alignment step 102, when the controller 45 receives the start instruction of the processing action from the operator, the laser processing device 20 opens the on-off valve 34, uses the suction force of the suction source 35 to suck and hold the workpiece 1 on the holding surface 31 of the holding table 30 through the vinyl chloride tape 11, and clamps the annular frame 12 by the clamping portion 32.

[0062] In a first embodiment, in the alignment step 102, as Figure 5 As shown, the controller 45 of the laser processing device 20 controls the moving unit 50 to move the holding table 30 to the processing area, positions the second predetermined splitting line 5 of the workpiece 1 attracted and held on the holding table 30 to be parallel to the X-axis direction, and uses the imaging unit 43 to photograph the workpiece 1 held by the holding table 30. In the first embodiment, in the alignment step 102, the controller 45 of the laser processing device 20 matches the image photographed by the imaging unit 43 with the target pattern predetermined in the processing conditions, etc., and detects and stores the position of the second predetermined splitting line 5.

[0063] In the first embodiment, in the alignment step 102, the controller 45 of the laser processing device 20 controls the moving unit 50 to position the first predetermined dividing line 4 of the workpiece 1 attracted and held on the holding table 30 to be parallel to the X-axis direction, and uses the imaging unit 43 to photograph the workpiece 1 held by the holding table 30. In the first embodiment, in the alignment step 102, the controller 45 of the laser processing device 20 performs pattern matching on the image photographed by the imaging unit 43 and the target pattern predetermined in the processing conditions, etc., and detects and stores the position of the first predetermined dividing line 4. In the first embodiment, in the alignment step 102, the controller 45 of the laser processing device 20 controls the moving unit 50 to position the first predetermined dividing line 4 to be parallel to the X-axis direction according to the detected position, and determines the irradiation start position of the laser beam 41, etc., to perform alignment.

[0064] (First processing step)

[0065] Figure 6 The partial cross section is shown schematically. Figure 2A side view of a first processing step and a second processing step of a method for processing a workpiece is shown. Figure 7 It is schematically shown Figure 2 A plan view showing the relative movement direction of the laser beam with respect to the workpiece in the first processing step of the method for processing the workpiece shown. Figure 8 It is schematically shown Figure 2 A plan view of a workpiece after the first processing step of the workpiece processing method shown.

[0066] The first processing step 103 is a step of irradiating the laser beam 41 along the plurality of first predetermined dividing lines 4 to divide the workpiece 1 into a plurality of strips 13. In the first embodiment, in the first processing step 103, the controller 45 of the laser processing device 20 sets the focal point 411 of the laser beam 41 on the front surface 3 of the substrate 2 according to the processing conditions, such as Figure 6 As shown, while controlling the moving unit 50 to move the holding table 30 and the laser beam irradiation unit 40 relative to each other along the first predetermined cutting line 4, a pulsed laser beam 41 is irradiated from the front side 3 of the substrate 2 toward the first predetermined cutting line 4 of the workpiece 1 to perform ablation processing on the first predetermined cutting line 4.

[0067] In the first embodiment, in the first processing step 103, the laser processing device 20 starts irradiating the laser beam 41 at one end 401 of the first predetermined dividing line 4 located at one end in the Y-axis direction. In the first embodiment, in the first processing step 103, the laser processing device 20 starts irradiating the laser beam 41 at one end 401 of the first predetermined dividing line 4 located at one end in the Y-axis direction. Figure 7 As shown by the dotted arrow 301, the moving unit 50 is used to move the holding table 30 relative to the laser beam irradiation unit 40 in the X-axis direction in such a manner that the laser beam 41 is directed toward the other end 402 of the first predetermined dividing line 4, and the irradiation of the laser beam 41 is stopped at the other end 402 of the first predetermined dividing line 4 located at one end in the Y-axis direction.

[0068] In the first embodiment, in the first processing step 103, after the laser processing device 20 irradiates the laser beam 41 over the entire length of the first predetermined splitting line 4 located at one end in the Y-axis direction, the moving unit 50 is used to relatively move the holding table 30 and the laser beam irradiation unit 40 in the Y-axis direction and the X-axis direction, and the laser beam irradiation unit 40 is positioned on one end 401 of the first predetermined splitting line 4 adjacent to the first predetermined splitting line 4 irradiated with the laser beam 41. In the first embodiment, in the first processing step 103, the laser processing device 20 starts irradiating the laser beam 41 on one end 401 of the adjacent first predetermined splitting line 4, as shown in FIG. Figure 7As shown by the dotted arrow, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a way that the laser beam 41 is directed toward the other end 402 of the first predetermined dividing line 4, and the irradiation of the laser beam 41 is stopped at the other end 402 of the first predetermined dividing line 4. In the first embodiment, in the first processing step 103, the laser processing device 20 sequentially irradiates the laser beam 41 from one end 401 toward the other end 402 side to the further adjacent first predetermined dividing line 4 in the Y-axis direction in the same manner as before.

[0069] Thus, in the first embodiment, in the first processing step 103, the laser processing device 20 sequentially irradiates the laser beam 41 from the first predetermined splitting line 4 located at one end of the plurality of first predetermined splitting lines 4 in the Y-axis direction toward the other end, and the workpiece 1 attracted and held on the holding table 30 is as follows: Figure 8 In the first embodiment, in the first processing step 103, the laser processing device 20 irradiates the laser beam 41 from one end 401 side of the first predetermined cutting line 4 toward the other end 402 side. Figure 8 As shown, as the workpiece 1 after the first processing step 103, all the cut strips 13 are shifted from the position before the first processing step 103 to the rear side of the relative movement direction of the laser beam 41 with respect to the workpiece 1, that is, to the side of one end 401 of the first predetermined dividing line 4.

[0070] (Second processing step)

[0071] Fig. 9 It is schematically shown in Figure 2 FIG. 1 is a plan view of a workpiece before irradiation with a laser beam in a second processing step of a method for processing a workpiece shown in FIG. Fig.10 It is schematically shown Figure 2 FIG. 1 is a plan view showing the relative movement direction of the laser beam with respect to the workpiece in the second processing step of the method for processing the workpiece.

[0072] The second processing step 104 is a step of dividing the workpiece 1 into a plurality of chips 10 by irradiating the laser beam 41 along a plurality of second predetermined dividing lines 5 after the first processing step 103 is performed. Fig. 9 As shown, the controller 45 of the laser processing device 20 controls the moving unit 50 to rotate the holding table 30 90 degrees around the axis, positions the second predetermined splitting line 5 to be parallel to the X-axis direction according to the position of the second predetermined splitting line 5 detected by the alignment step 102, and determines the starting position of the irradiation of the laser beam 41.

[0073] In the first embodiment, in the second processing step 104, the controller 45 of the laser processing device 20 sets the focal point 411 of the laser beam 41 on the front surface 3 of the substrate 2 according to the processing conditions, controls the moving unit 50 to move the holding table 30 and the laser beam irradiation unit 40 relative to each other along the second predetermined cutting line 5, and irradiates the second predetermined cutting line 5 of the workpiece 1 with a pulsed laser beam 41 from the front surface 3 of the substrate 2 to perform ablation processing on the second predetermined cutting line 5.

[0074] In the first embodiment, in the second processing step 104, the laser processing device 20 starts irradiating the laser beam 41 at one end 501 of the second predetermined dividing line 5 located at one end in the Y-axis direction. Fig.10 As shown by the dotted arrow 302, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a manner that the laser beam 41 is directed toward the other end 502 of the second predetermined splitting line 5, and the irradiation of the laser beam 41 is stopped at the other end 502 of the second predetermined splitting line 5 located at one end in the Y-axis direction.

[0075] In the first embodiment, in the second processing step 104, after the laser processing device 20 irradiates the laser beam 41 over the entire length of the second predetermined splitting line 5 located at one end in the Y-axis direction, the laser processing device 20 uses the moving unit 50 to relatively move the holding table 30 and the laser beam irradiation unit 40 in the Y-axis direction and the X-axis direction, and positions the laser beam irradiation unit 40 on the other end 502 of the second predetermined splitting line 5 adjacent to the second predetermined splitting line 5 irradiated with the laser beam 41. In the first embodiment, in the second processing step 104, the laser processing device 20 starts irradiating the laser beam 41 on the other end 502 of the adjacent second predetermined splitting line 5, as shown in FIG. Fig.10 As shown by the dotted arrow 303, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a way that the laser beam 41 is directed toward one end 501 of the second predetermined splitting line 5, and the irradiation of the laser beam 41 is stopped at one end 501 of the second predetermined splitting line 5. In the first embodiment, in the second processing step 104, the laser processing device 20 similarly irradiates the laser beam 41 from one end 501 toward the other end 502 of the further adjacent second predetermined splitting line 5 in the Y-axis direction.

[0076] Thus, in the first embodiment, in the second processing step 104, the laser processing device 20 sequentially irradiates the laser beam 41 from the second predetermined dividing line 5 located at one end of the plurality of second predetermined dividing lines 5 in the Y-axis direction toward the other end, and cuts the workpiece 1 attracted and held on the holding table 30 along the predetermined dividing lines 4 and 5 to be divided into individual chips 10. In addition, in the first embodiment, in the second processing step 104, the laser processing device 20 moves the holding table 30 in the opposite direction of the X-axis direction when irradiating the laser beam 41 to the adjacent second predetermined dividing line 5. Thus, in the first embodiment, in the second processing step 104, the laser processing device 20 repeats the action of irradiating the laser beam 41 from the one end 501 side of the second predetermined dividing line 5 toward the other end 502 side, and then irradiating the laser beam 41 from the other end 502 side of the second predetermined dividing line 5 adjacent to the second predetermined dividing line 5 irradiated with the laser beam 41 toward the one end 501 side, until all the second predetermined dividing lines 5 are irradiated with the laser beam 41.

[0077] Thus, in the workpiece processing method of the first embodiment, the workpiece 1 is divided into individual chips 10 by irradiating the laser beam 41 only once, that is, only in one pass, on each planned dividing line 4, 5. The divided chips 10 are picked up from the vinyl chloride tape 11 one by one.

[0078] As a result of in-depth research, the inventors of the present application have found that, in particular, when the workpiece 1 of a small chip 10 such as the chip 10 to be divided into a square (rectangular) shape of 0.5 mm×0.5 mm as described above is irradiated with a laser beam 41 for division, the strips 13 formed by dividing the workpiece 1 along the first predetermined dividing line 4 will be positionally offset to the rear side of the relative movement direction of the laser beam 41 with respect to the workpiece 1 when the strips 13 are separated from the workpiece 1. In addition, as a result of in-depth research, the inventors of the present application have particularly found that the offset amount of the strips 13 is substantially the same regardless of the length of the strips 13.

[0079] Therefore, in the processing method of the workpiece of the first embodiment described above, in the first processing step 103 of separating the workpiece 1 into long strips 13, the laser beam 41 is irradiated to all the first predetermined dividing lines 4 from one end 401 side toward the other end 402 side, so that in the workpiece 1 after the first processing step 103, the long strips 13 are positionally shifted in the same direction.

[0080] Therefore, in the workpiece processing method of the first embodiment, the laser beam 41 can be irradiated to the second planned dividing line 5 instead of the device 7 in the second processing step 104. As a result, the workpiece processing method of the first embodiment can suppress damage to the device 7.

[0081] [Second embodiment]

[0082] A method for processing a workpiece according to a second embodiment will be described with reference to the drawings. Fig.11 It is a flowchart showing the flow of the method for processing a workpiece according to the second embodiment. Fig.12 It is schematically shown Fig.11 A plan view showing a relative moving direction of a laser beam with respect to a first planned dividing line of a workpiece in a laser machining groove forming step of a method for machining a workpiece shown in FIG. Fig.13 It is schematically shown Fig.11 A plan view showing a relative moving direction of a laser beam with respect to a second planned dividing line of a workpiece in a laser machining groove forming step of a workpiece machining method shown in FIG. Fig.14 It is schematically shown Fig.11 A plan view showing the relative movement direction of the laser beam with respect to the workpiece in the first processing step of the method for processing the workpiece shown. Fig.15 It is schematically shown Fig.11 A plan view showing the relative movement direction of the laser beam with respect to the workpiece in the second processing step of the workpiece processing method shown. Fig.11 , Fig.12 , Fig.13 , Fig.14 as well as Fig.15 The same components as those of the first embodiment are denoted by the same reference numerals and their description is omitted.

[0083] The processing method of the workpiece according to the second embodiment includes the following steps: irradiating the laser beam 41 to each of the predetermined dividing lines 4 and 5 multiple times (three times in the second embodiment), that is, irradiating the laser beam 41 in multiple (three times in the second embodiment) passes to divide the workpiece 1 into the individual chips 10; and Fig.11 The present invention is the same as the first embodiment except for the laser processing groove forming step 110. In the second embodiment, the thickness of the workpiece 1 is 270 μm, and the workpiece 1 is ablated by 90 μm in the thickness direction by irradiation with the laser beam 41 once, i.e., by one pass.

[0084] The laser processing groove forming step 110 is a step of irradiating the laser beam 41 along each first predetermined dividing line 4 to form a first laser processing groove 403 ( Fig.13 Then, the laser beam 41 is irradiated along each second predetermined splitting line 5 to form a second laser processed groove 503 ( Fig.14In the second embodiment, in the laser processing groove forming step 110, the controller 45 of the laser processing device 20 sets the focal point 411 of the laser beam 41 on the front surface 3 of the substrate 2 according to the processing conditions, controls the moving unit 50 to move the holding table 30 and the laser beam irradiation unit 40 relatively along the first predetermined dividing line 4, and irradiates the first predetermined dividing line 4 of the workpiece 1 with the pulsed laser beam 41 from the front surface 3 of the substrate 2, thereby performing ablation processing on the first predetermined dividing line 4.

[0085] In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 starts irradiating the laser beam 41 at one end 401 of the first predetermined dividing line 4 located at one end in the Y-axis direction. In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 starts irradiating the laser beam 41 at one end 401 of the first predetermined dividing line 4 located at one end in the Y-axis direction. Fig.12 As shown by the dotted arrow 301, the moving unit 50 is used to move the holding table 30 relative to the laser beam irradiation unit 40 in the X-axis direction in such a manner that the laser beam 41 is directed toward the other end 402 of the first predetermined dividing line 4, and the irradiation of the laser beam 41 is stopped at the other end 402 of the first predetermined dividing line 4 located at one end in the Y-axis direction.

[0086] In the second embodiment, in the laser processing groove forming step 110, after the laser processing device 20 irradiates the laser beam 41 over the entire length of the first predetermined dividing line 4 located at one end in the Y-axis direction, the holding table 30 and the laser beam irradiation unit 40 are relatively moved in the Y-axis direction and the X-axis direction by the moving unit 50, and the laser beam irradiation unit 40 is positioned on the other end 402 of the first predetermined dividing line 4 adjacent to the first predetermined dividing line 4 irradiated with the laser beam 41. In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 starts irradiating the laser beam 41 on the other end 402 of the adjacent first predetermined dividing line 4, as shown in FIG. Fig.12 As shown by the dotted arrow 304, the moving unit 50 is used to move the holding table 30 relative to the laser beam irradiation unit 40 in the X-axis direction in such a way that the laser beam 41 is directed toward one end 401 of the first predetermined cutting line 4, and the irradiation of the laser beam 41 is stopped at one end 401 of the first predetermined cutting line 4.

[0087] In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 irradiates the laser beam 41 to the first predetermined dividing line 4 further adjacent in the Y-axis direction from one end 401 toward the other end 402. Thus, in the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 sequentially irradiates the laser beam 41 from the first predetermined dividing line 4 located at one end in the Y-axis direction among the plurality of first predetermined dividing lines 4 toward the other end, and when irradiating the laser beam 41 to the adjacent first predetermined dividing line 4, the holding table 30 is moved in the opposite direction of the X-axis direction. Thus, in the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 irradiates the laser beam 41 once to all the first predetermined dividing lines 4, and forms the first laser processing grooves 403 on all the first predetermined dividing lines 4.

[0088] In the laser processing groove forming step 110, the controller 45 of the laser processing device 20 controls the moving unit 50 to rotate the holding table 30 about the axis by 90 degrees, and positions the second predetermined splitting line 5 to be parallel to the X-axis direction according to the position of the second predetermined splitting line 5 detected by the alignment step 102, and determines the irradiation start position of the laser beam 41. In the second embodiment, in the laser processing groove forming step 110, the controller 45 of the laser processing device 20 sets the focal point 411 of the laser beam 41 to the front surface 3 of the substrate 2 according to the processing conditions, controls the moving unit 50 to move the holding table 30 and the laser beam irradiation unit 40 relatively along the second predetermined splitting line 5, and irradiates the second predetermined splitting line 5 of the workpiece 1 with the pulsed laser beam 41 from the front surface 3 side of the substrate 2, and performs ablation processing on the second predetermined splitting line 5.

[0089] In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 starts irradiating the laser beam 41 at one end 501 of the second predetermined dividing line 5 located at one end in the Y-axis direction. In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 starts irradiating the laser beam 41 at one end 501 of the second predetermined dividing line 5 located at one end in the Y-axis direction. Fig.13 As shown by the dotted arrow 302, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a manner that the laser beam 41 is directed toward the other end 502 of the second predetermined splitting line 5, and the irradiation of the laser beam 41 is stopped at the other end 502 of the second predetermined splitting line 5 located at one end in the Y-axis direction.

[0090] In the second embodiment, in the laser processing groove forming step 110, after the laser processing device 20 irradiates the laser beam 41 over the entire length of the second predetermined splitting line 5 located at one end in the Y-axis direction, the laser processing device 20 uses the moving unit 50 to relatively move the holding table 30 and the laser beam irradiation unit 40 in the Y-axis direction and the X-axis direction, and positions the laser beam irradiation unit 40 on the other end 502 of the second predetermined splitting line 5 adjacent to the second predetermined splitting line 5 irradiated with the laser beam 41. In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 starts irradiating the laser beam 41 on the other end 502 of the adjacent second predetermined splitting line 5, as shown in FIG. Fig.13 As shown by the dotted arrow 303, the moving unit 50 is used to move the holding table 30 relative to the laser beam irradiation unit 40 in the X-axis direction in such a way that the laser beam 41 is directed toward one end 501 of the second predetermined splitting line 5, and the irradiation of the laser beam 41 is stopped at one end 501 of the second predetermined splitting line 5.

[0091] In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 irradiates the laser beam 41 to the second predetermined dividing line 5 further adjacent in the Y-axis direction from one end 501 toward the other end 502. Thus, in the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 sequentially irradiates the laser beam 41 from the second predetermined dividing line 5 located at one end in the Y-axis direction among the plurality of second predetermined dividing lines 5 toward the other end, and moves the holding table 30 in the opposite direction of the X-axis direction when irradiating the laser beam 41 to the adjacent second predetermined dividing line 5. Thus, in the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 irradiates the laser beam 41 once to all the second predetermined dividing lines 5, and forms the second laser processing grooves 503 on all the second predetermined dividing lines 5.

[0092] Then, in the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 controls the moving unit 50 by the controller 45 to rotate the holding table 30 about the axis, and then positions the first predetermined dividing line 4 to be parallel to the X-axis direction, and positions the focal point 411 to the groove bottom of the laser processing groove. As before, the laser beam 41 is irradiated once to all the first predetermined dividing lines 4, and the first laser processing groove 403 is formed at the groove bottom of the first laser processing groove 403 formed on all the first predetermined dividing lines 4. In the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 controls the moving unit 50 by the controller 45 to rotate the holding table 30 about the axis, and then positions the second predetermined dividing line 5 to be parallel to the X-axis direction, and positions the focal point 411 to the groove bottom of the second laser processing groove 503. As before, the laser beam 41 is irradiated once to all the second predetermined dividing lines 5, and the second laser processing groove 503 is formed at the groove bottom of the second laser processing groove 503 formed on all the second predetermined dividing lines 5.

[0093] Thus, in the second embodiment, in the laser processing groove forming step 110, the laser processing device 20 repeatedly performs the action of irradiating the laser beam 41 from one end 401, 501 side of the first predetermined cutting line 4 or the second predetermined cutting line 5 toward the other end 402, 502 side, and then irradiating the laser beam 41 from the other end 402, 502 side of the first predetermined cutting line 4 or the second predetermined cutting line 5 adjacent to the first predetermined cutting line 4 or the second predetermined cutting line 5 that has been irradiated with the laser beam 41 toward one end 401, 501 side, until the first laser processing groove 403 and the second laser processing groove 503 are formed for all the first predetermined cutting lines 4 or the second predetermined cutting lines 5 according to the prescribed number of times. In the second embodiment, in the laser processing groove forming step 110, after the laser processing device 20 forms the first laser processing groove 403 and the second laser processing groove 503 for all the predetermined dividing lines 4 and 5 multiple times (twice in the second embodiment), the controller 45 controls the moving unit 50 to rotate the holding table 30 around the axis, and then positions the first predetermined dividing line 4 at a position parallel to the X-axis direction.

[0094] In a second embodiment, in the first processing step 103, as Fig.14 As shown, the laser processing device 20 sets the focal point 411 at the bottom of the first laser processing groove 403, and irradiates the first predetermined cutting line 4 with the laser beam 41, so as to cut the workpiece 1 into a long strip 13. In the second embodiment, in the second processing step 104, as shown in FIG. Fig.15 As shown, the laser processing device 20 sets the focusing point 411 on the bottom of the second laser processed groove 503 , and irradiates the second planned dividing line 5 with the laser beam 41 to divide the workpiece 1 into individual chips 10 , similarly to the first embodiment.

[0095] In the processing method of the workpiece of the second embodiment, in the first processing step 103 of separating the workpiece 1 into the strips 13, the laser beam 41 is irradiated to all the first predetermined splitting lines 4 from the one end 401 side toward the other end 402 side, so that in the workpiece 1 after the first processing step 103, the strips 13 are positionally shifted in the same direction. As a result, the processing method of the workpiece of the second embodiment has the following effect in the same manner as the first embodiment: in the second processing step 104, the laser beam 41 can be irradiated to the second predetermined splitting lines 5 instead of the device 7, and damage to the device 7 can be suppressed.

[0096] [Third embodiment]

[0097] A method for processing a workpiece according to a third embodiment will be described with reference to the drawings. Fig.16 It is a plan view schematically showing the relative movement direction of the laser beam with respect to the first planned dividing line of the workpiece in the first processing step of the workpiece processing method according to the third embodiment. Fig.17 : is a plan view schematically showing the relative movement direction of the laser beam relative to the second planned dividing line of the workpiece in the second processing step of the workpiece processing method of the third embodiment. Fig.16 as well as Fig.17 The same components as those of the first embodiment are denoted by the same reference numerals and their description is omitted.

[0098] The processing method of the workpiece of the third embodiment is the same as the first embodiment except that the workpiece 1 is divided into individual chips 10 by irradiating the laser beam 41 multiple times (three times in the second embodiment) to each predetermined dividing line 4, 5, that is, by irradiating the laser beam 41 in so-called multiple (three times in the second embodiment) passes, and that the laser processing groove forming step 110 is included as in the second embodiment, and the first processing step 103 is different from the second processing step 104. In addition, in the third embodiment, as in the second embodiment, the thickness of the workpiece 1 is 270 μm, and the workpiece 1 is ablated by 90 μm in the thickness direction by irradiating the laser beam 41 once, that is, one pass.

[0099] In the third embodiment, in the laser processing groove forming step 110, the laser processing device 20 irradiates the laser beam 41 only once to all the first predetermined dividing lines 4, and irradiates the laser beam 41 only once to all the second predetermined dividing lines 5, respectively, similarly to the second embodiment, to form the first laser processing groove 403 and the second laser processing groove 503 on the predetermined dividing lines 4 and 5. In the third embodiment, in the laser processing groove forming step 110, the laser processing device 20 controls the moving unit 50 by the controller 45 to rotate the holding table 30 around the axis, and then positions the second predetermined dividing line 5 to be parallel to the X-axis direction to perform alignment, and implements the first processing step 103.

[0100] In the third embodiment, in the first processing step 103, the laser processing device 20 sets the focal point 411 at the bottom of the first laser processed groove 403, and starts irradiating the laser beam 41 at one end 401 of the first predetermined dividing line 4 located at one end in the Y-axis direction. In the third embodiment, in the first processing step 103, the laser processing device 20 Fig.16 As shown by the dotted arrow 301, the moving unit 50 is used to move the holding table 30 relative to the laser beam irradiation unit 40 in the X-axis direction in such a manner that the laser beam 41 is directed toward the other end 402 of the first predetermined dividing line 4, and the irradiation of the laser beam 41 is stopped at the other end 402 of the first predetermined dividing line 4 located at one end in the Y-axis direction.

[0101] In the third embodiment, in the first processing step 103, after the laser processing device 20 irradiates the laser beam 41 once over the entire length of the first predetermined dividing line 4 located at one end in the Y-axis direction, the laser processing device 20 does not use the moving unit 50 to relatively move the holding table 30 and the laser beam irradiation unit 40 in the Y-axis direction, but sets the focal point 411 at the bottom of the first laser processing groove 403, and starts irradiating the laser beam 41 at the other end 402 of the first predetermined dividing line 4 where the laser beam 41 has been irradiated. In the third embodiment, in the first processing step 103, the laser processing device 20 Fig.16 As shown by the dotted arrow 304, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 so that the laser beam 41 is directed toward one end 401 of the first predetermined dividing line 4, and the irradiation of the laser beam 41 is stopped at one end 401 of the first predetermined dividing line 4. Thus, in the third embodiment, in the first processing step 103, the laser processing device 20 irradiates the laser beam 41 twice (i.e., two passes) over the entire length of the first predetermined dividing line 4 located at one end in the Y-axis direction while moving the holding table 30 back and forth in the X-axis direction.

[0102] In the third embodiment, in the first processing step 103, after the laser processing device 20 irradiates the laser beam 41 twice over the entire length of the first predetermined splitting line 4 located at one end in the Y-axis direction, the moving unit 50 is used to relatively move the holding table 30 and the laser beam irradiation unit 40 in the Y-axis direction and the X-axis direction, and the laser beam irradiation unit 40 is positioned on one end 401 of the first predetermined splitting line 4 adjacent to the first predetermined splitting line 4 irradiated with the laser beam 41. In the third embodiment, in the first processing step 103, the laser processing device 20 sets the focal point 411 at the bottom of the first laser processed groove 403, and starts irradiating the laser beam 41 on one end 401 of the adjacent first predetermined splitting line 4, as shown in FIG. Fig.16 As shown by the dotted arrow 301, the moving unit 50 is used to move the holding table 30 relative to the laser beam irradiation unit 40 in the X-axis direction in such a way that the laser beam 41 is directed toward the other end 402 of the first predetermined cutting line 4, and the irradiation of the laser beam 41 is stopped at the other end 402 of the first predetermined cutting line 4.

[0103] In the third embodiment, in the first processing step 103, the laser processing device 20 sets the focal point 411 at the bottom of the first laser processing groove 403, and starts irradiating the laser beam 41 at the other end 402 of the first predetermined dividing line 4. Fig.16 As shown by the dotted arrow 304, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a manner that the laser beam 41 is directed toward one end 401 of the first predetermined dividing line 4, and the irradiation of the laser beam 41 is stopped at one end 401 of the first predetermined dividing line 4. In the third embodiment, in the first processing step 103, the laser processing device 20 sequentially irradiates the laser beam 41 from one end 401 toward the other end 402 side to the further adjacent first predetermined dividing line 4 in the Y-axis direction, and then sequentially irradiates the laser beam 41 from the other end 402 toward the one end 401 side.

[0104] Thus, in the third embodiment, in the first processing step 103, the laser processing device 20 irradiates twice while moving the laser beam 41 back and forth in the X-axis direction from the first predetermined cutting line 4 located at one end in the Y-axis direction toward the other end in sequence, thereby cutting the workpiece 1 attracted and held on the holding table 30 into long strips 13 extending in the X-axis direction. As the workpiece 1 after the first processing step 103, all the long strips 13 obtained by cutting are shifted from the position before the first processing step 103 to the rear side of the relative moving direction of the laser beam 41 relative to the workpiece 1 when cutting into the long strips 13, that is, the other end 402 side of the first predetermined cutting line 4.

[0105] Thus, in the third embodiment, in the first processing step 103, the action of irradiating each first predetermined cutting line 4 with the laser beam 41 from one end 401 side toward the other end 402 side of the first predetermined cutting line 4 with the laser beam 41 is repeated, and then the first predetermined cutting line 4 that has been irradiated with the laser beam 41 from one end 401 side toward the other end 402 side with the laser beam 41 is irradiated from the other end 402 side toward one end 401 side, and then the adjacent first predetermined cutting line 4 is irradiated with the laser beam 41 in the same manner, until all the first predetermined cutting lines 4 are irradiated with the laser beam 41.

[0106] In the third embodiment, in the second processing step 104, the laser processing device 20 controls the moving unit 50 by the controller 45 to rotate the holding table 30 90 degrees around the axis, and positions the second predetermined splitting line 5 at a position parallel to the X-axis direction. In the third embodiment, in the second processing step 104, the laser processing device 20 sets the focal point 411 at the bottom of the second laser processing groove 503, and starts irradiating the laser beam 41 at one end 501 of the second predetermined splitting line 5 located at one end in the Y-axis direction. In the third embodiment, in the second processing step 104, the laser processing device 20 sets the focal point 411 at the bottom of the second laser processing groove 503, and starts irradiating the laser beam 41 at one end 501 of the second predetermined splitting line 5 located at one end in the Y-axis direction. Fig.17 As shown by the dotted arrow 302, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a manner that the laser beam 41 is directed toward the other end 502 of the second predetermined splitting line 5, and the irradiation of the laser beam 41 is stopped at the other end 502 of the second predetermined splitting line 5 located at one end in the Y-axis direction.

[0107] In the third embodiment, in the second processing step 104, after the laser processing device 20 irradiates the laser beam 41 once over the entire length of the second predetermined dividing line 5 located at one end in the Y-axis direction, the laser processing device 20 does not use the moving unit 50 to relatively move the holding table 30 and the laser beam irradiation unit 40 in the Y-axis direction, but sets the focal point 411 at the bottom of the second laser processing groove 503 and starts irradiating the laser beam 41 at the other end 502 of the second predetermined dividing line 5 where the laser beam 41 has been irradiated. In the third embodiment, in the second processing step 104, the laser processing device 20 Fig.17 As shown by the dotted arrow 303, the holding table 30 is moved relative to the laser beam irradiation unit 40 in the X-axis direction by the moving unit 50 in such a manner that the laser beam 41 is directed toward one end 501 of the second predetermined dividing line 5, and the irradiation of the laser beam 41 is stopped at one end 501 of the second predetermined dividing line 5. Thus, in the third embodiment, in the second processing step 104, the laser processing device 20 irradiates the laser beam 41 twice (i.e., two passes) over the entire length of the second predetermined dividing line 5 located at one end in the Y-axis direction while moving the holding table 30 back and forth in the X-axis direction.

[0108] In the third embodiment, in the second processing step 104, the laser processing device 20 sets the focal point 411 at the bottom of the second laser processing groove 503 in the same manner as the first processing step 103, and irradiates the laser beam 41 twice in sequence from the second predetermined dividing line 5 located at one end of the plurality of second predetermined dividing lines 5 in the Y-axis direction toward the other end, thereby dividing the workpiece 1 attracted and held on the holding workbench 30 into individual chips 10. Thus, in the third embodiment, in the second processing step 104, similarly to the first processing step 103, the action of irradiating each second predetermined splitting line 5 with the laser beam 41 from one end 501 side toward the other end 502 side of the second predetermined splitting line 5 with the laser beam 41, then irradiating the second predetermined splitting line 5 with the laser beam 41 from the other end 502 side toward one end 501 side after irradiating the second predetermined splitting line 5 with the laser beam 41 from one end 501 side toward the other end 502 side, and then irradiating the adjacent second predetermined splitting line 5 with the laser beam 41 in the same manner is repeated until all the second predetermined splitting lines 5 are irradiated with the laser beam 41 and the workpiece 1 is split into chips 10.

[0109] In the third embodiment, in the second processing step 104 , the laser beam irradiation unit 40 and the holding table 30 may be relatively moved to irradiate the second planned dividing line 5 with the laser beam 41 to divide the workpiece 1 into chips 10 , similarly to the first embodiment.

[0110] In the processing method of the workpiece of the third embodiment, in the first processing step 103 of separating the workpiece 1 into the strips 13, the laser beam 41 is irradiated to all the first predetermined splitting lines 4 from the other end 402 side toward the one end 401 side, so that in the workpiece 1 after the first processing step 103, the strips 13 are positionally shifted in the same direction. As a result, the processing method of the workpiece of the third embodiment has the following effect in the same manner as the first and second embodiments: in the second processing step 104, the laser beam 41 can be irradiated to the second predetermined splitting lines 5 instead of the device 7, and damage to the device 7 can be suppressed.

[0111] In addition, the present invention is not limited to the above-mentioned embodiment, etc. That is, it can be implemented with various modifications within the scope not departing from the gist of the present invention.

Claims

1. A method for processing a workpiece, wherein the workpiece is divided along a predetermined dividing line to form a plurality of chips, wherein the predetermined dividing line includes a plurality of first predetermined dividing lines extending in a first direction and a plurality of second predetermined dividing lines extending in a second direction intersecting the first direction, wherein: The processing method of the workpiece has the following steps: A first processing step of irradiating a laser beam along a plurality of first predetermined dividing lines to divide the workpiece into a plurality of strips; and A second processing step, after the first processing step is performed, irradiating the workpiece with a laser beam along a plurality of second predetermined dividing lines to divide the workpiece into a plurality of chips, In the first processing step, the laser beam is irradiated on each of the first predetermined dividing lines from one end side toward the other end side of the first predetermined dividing line. In the second processing step, the operation of irradiating the laser beam from one end side toward the other end side of one second planned dividing line and then irradiating the laser beam from the other end side toward the one end side of the adjacent second planned dividing line is repeated.

2. The method for processing a workpiece according to claim 1, wherein: The processing method of the workpiece further comprises the following laser processing groove forming step: before implementing the first processing step, after irradiating the laser beam along each of the first predetermined division lines to form a first laser processing groove, irradiating the laser beam along each of the second predetermined division lines to form a second laser processing groove, In the laser processing groove forming step, the action of irradiating the laser beam from one end side of the first predetermined splitting line or the second predetermined splitting line toward the other end side and then irradiating the laser beam from the other end side toward the one end side of the adjacent first predetermined splitting line or the second predetermined splitting line is repeated.

3. A method for processing a workpiece, wherein the workpiece is divided along a predetermined dividing line to form a plurality of chips, wherein the predetermined dividing line includes a plurality of first predetermined dividing lines extending in a first direction and a plurality of second predetermined dividing lines extending in a second direction intersecting the first direction, wherein: The processing method of the workpiece has the following steps: A first processing step of irradiating a laser beam along a plurality of first planned dividing lines to divide the workpiece into a plurality of long strips; and A second processing step, after the first processing step is performed, irradiating the workpiece with a laser beam along a plurality of second predetermined dividing lines to divide the workpiece into a plurality of chips, In the first processing step, the action of irradiating each of the first predetermined splitting lines with the laser beam from one end side toward the other end side of the first predetermined splitting line, then irradiating the first predetermined splitting line with the laser beam from the other end side toward the one end side after irradiating the laser beam from the one end side toward the other end side, and then irradiating the adjacent first predetermined splitting line with the laser beam is repeated.

4. The method for processing a workpiece according to any one of claims 1 to 3, wherein: The processing method of the workpiece further comprises the following tape sticking step: before carrying out the first processing step, the workpiece is stuck on a vinyl chloride tape.

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