Screen printing apparatus and screen printing method

Abstract

The invention relates to silk-screen printing equipment and a silk-screen printing method. The silk-screen printing equipment comprises a scraper set and a separating device. The scraper group is used for printing slurry on the surface of the screen on the surface of a silicon wafer; and the separating device is used for promoting the slurry remaining in the meshes of the screen printing plate to fall off from the meshes after the slurry is printed on the surface of the silicon wafer by the scraper group. According to the silk-screen printing equipment, the slurry remaining in the meshes of the screen printing plate is separated through the separating device after the slurry is printed on the silicon wafer through the scraper set, the blocking risk of the meshes of the screen printing plate is reduced, the ink penetration rate of the slurry is increased, the printing stability is optimized, and therefore the silk-screen printing yield is increased.

Description

Technical Field

[0001] The present application relates to the technical field of screen printing, and in particular to a screen printing device and a screen printing method. Background Art

[0002] The metallized grid line preparation process is an indispensable step in crystalline silicon solar cells. In recent years, with the advancement of technology, the grid line preparation process mainly includes traditional screen printing technology, copper electroplating technology, stacked grid technology, and laser transfer technology.

[0003] The copper electroplating process requires seed layer preparation, mask process, post-processing and other process flows. The process flow is relatively complex and has low compatibility with existing production lines. The stacked grid and laser transfer technologies cannot be mass-produced due to technical barriers and their own technical defects, and the production cost is high and the equipment is expensive. At present, the grid line preparation technology still mainly relies on traditional screen printing technology.

[0004] However, the preparation of the gate line has high requirements on the performance of the gate line, and it needs to have performance requirements such as contact and conductivity. In addition, with the development of battery technology, battery cost control is also crucial. Therefore, traditional printing has high requirements on the performance of silver paste and the design parameters of the screen. As the screen parameters (mainly the narrowing of line width) change, traditional printing is difficult to guarantee the printing yield. Summary of the invention

[0005] Based on this, it is necessary to provide a screen printing device and a screen printing method to address the above technical problems.

[0006] In a first aspect, the present application provides a screen printing device, comprising a scraper group and a detachment device; the scraper group is used to print the slurry on the surface of the screen onto the surface of the silicon wafer; the detachment device is used to cause the slurry remaining in the mesh holes of the screen to fall off from the mesh holes after the scraper group prints the slurry on the surface of the silicon wafer.

[0007] In one of the embodiments, the disengagement device is spaced apart from the scraper assembly and is located at the back of the scraper assembly; the back of the scraper assembly faces a direction opposite to the direction in which the scraper assembly prints the slurry.

[0008] In one embodiment, the distance between the disengagement device and the scraper assembly is 2 mm to 5 mm.

[0009] In one of the embodiments, the detachment device is used to emit an energy beam to the mesh holes of the screen where the slurry remains, so that the slurry remaining in the mesh holes of the screen falls off from the mesh holes under the action of the energy beam.

[0010] In one embodiment, the detachment device comprises a laser scanning device; the energy beam comprises a laser beam;

[0011] The laser scanning device is used to emit the laser beam to the slurry in the mesh, so that the slurry in the mesh is heated up and falls off from the mesh.

[0012] In one embodiment, the wavelength of the laser beam is 800nm~1000nm, and the power of the laser beam is 30W~40W.

[0013] In one embodiment, the detachment device comprises an air pressure device; the energy beam comprises a directional air pressure beam;

[0014] The air pressure device is used to emit the directional air pressure beam to the slurry in the mesh, so that the slurry in the mesh falls off from the mesh under the pressure of the directional air pressure beam.

[0015] In one of the embodiments, the pressure value of the directional air pressure beam is 10Pa~20Pa.

[0016] In a second aspect, the present application provides a screen printing method, wherein the screen printing is used to prepare grid lines; the screen printing method comprises:

[0017] Control the scraper group to print the slurry on the screen surface onto the silicon wafer surface;

[0018] After the scraper group prints the slurry on the surface of the silicon wafer, the detaching device is controlled to start working to cause the slurry remaining in the mesh holes of the screen to fall off from the mesh holes.

[0019] In one embodiment, it also includes:

[0020] The disengagement device is controlled to move to the back side of the scraper group and is spaced apart from the scraper group by a preset distance; the back side of the scraper group faces a direction opposite to the direction in which the scraper group prints the slurry.

[0021] In one embodiment, the paste includes silver-clad copper paste.

[0022] The above-mentioned screen printing device and screen printing method, the screen printing device includes a scraper group and a detaching device; the scraper group is used to print the slurry on the surface of the screen onto the surface of the silicon wafer; the detaching device is used to cause the slurry remaining in the mesh of the screen to fall off from the mesh after the scraper group prints the slurry on the surface of the silicon wafer. It can be seen that the screen printing device in the present application uses the detaching device to detach the slurry remaining in the mesh of the screen after the scraper group prints the slurry on the silicon wafer, which helps to reduce the risk of clogging of the screen mesh, increase the ink penetration rate of the slurry, optimize the printing stability, and thus improve the screen printing yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of a screen printing device in one embodiment of the present application;

[0025] Figure 2 Schematic diagram of the process of the screen printing method in one embodiment of the present application;

[0026] Figure 3 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] In the electrode preparation process, the narrowing of the screen line width requires matching with a slurry with good ink permeability and small silver powder particles, which has high requirements for the conductivity and formula of the slurry. As the screen line width narrows, the risk of printing broken gates affects the printing yield and conversion efficiency. Therefore, the existing screen printing technology has high requirements for screen parameter design and slurry formula, and the current screen printing technology optimization space is close to the limit, and the risk of printing broken gates is relatively high. Electroplating copper, stacked grid technology, laser transfer and other technologies cannot be mass-produced for the time being due to expensive equipment, complex process routes, and high technical barriers.

[0032] Based on this, the present application provides a screen printing device including a scraper group and a disengagement device, which can assist ink penetration and reduce the risk of screen line width blockage, thereby optimizing the uniformity of the grid line and reducing the risk of grid breakage. At the same time, this technology has lower requirements for the organic system formula of the slurry and can simultaneously improve the conductivity of the slurry.

[0033] In one embodiment, see the attached Figure 1 , attached Figure 1 1 shows a schematic diagram of the structure of the screen printing device in this embodiment. The screen printing device in this embodiment is used to prepare the grid line. The screen printing device includes a scraper group 110 and a separation device 120. The scraper group 110 is used to print the slurry 220 on the surface of the screen 210 on the surface of the silicon wafer 230. The separation device 120 is used to promote the mesh (attached) remaining in the screen 210 after the scraper group 110 prints the slurry 220 on the surface of the silicon wafer 230. Figure 1 The slurry 220 in the mesh (not shown) falls off from the mesh.

[0034] The scraper group 110 may include at least one scraper for uniformly scraping the slurry 220 on the screen 210 onto the surface of the silicon wafer 230. The detaching device 120 refers to a device that can provide energy to the slurry 220, so that the slurry 220, foreign matter, etc. in the mesh can be detached from the screen 210. For example, it can be a laser scanning device, an air pressure device, a heating device, etc. Specifically, taking the laser device as an example, the laser device emits a laser to the mesh in the screen 210 while the scraper group 110 scrapes the slurry 220. The slurry 220 in the mesh is heated up under the action of the laser to form a steam layer, and the slurry 220 can fall off from the mesh. It can be understood that the mesh holes processed by the separation device 120 can be the corresponding mesh holes in the screen 210 after the scraper group 110 immediately scrapes the slurry 220. Therefore, the corresponding mesh holes on the screen 210 can be cleaned in time after the slurry 220 is scraped, ensuring that the slurry 220 is completely and completely printed on the silicon wafer 230, increasing the transmittance of the slurry 220 during the printing process, optimizing the stability of printing, and avoiding mesh blockage.

[0035] Therefore, the relative positions of the scraper assembly 110 and the separation device 120 in this embodiment can be flexibly set based on the above effects, and no specific restrictions are made in this embodiment, and it is only necessary to ensure that the mesh after the slurry 220 is scraped and cleaned in time. Figure 1 , attached Figure 1 FIG. 1 shows that the separation device 120 and the scraper assembly 110 are located on the same horizontal plane and are arranged along the scraping direction of the slurry 220 (as shown in FIG. Figure 1 In the case where the detachment device 120 and the scraper group 110 are arranged in sequence, the distance between the detachment device 120 and the scraper group 110 can be as small as possible, so as to ensure that the detachment device 120 can process the mesh immediately after the scraper group 110 scrapes the slurry 220, and ensure the transmittance of the slurry 220 in the mesh. In other examples, the detachment device 120 can also be set above the scraper group 110, at a distance as short as possible from the scraper group 110, and start working as soon as possible after the scraper group 110 scrapes the slurry 220, to ensure that the detachment device 120 can promptly and effectively process the slurry 220 or impurities in the mesh. Not limited to this.

[0036] The screen printing device in this embodiment uses the separation device 120 to separate the slurry 220 remaining in the mesh of the screen 210 after the scraper group 110 prints the slurry 220 on the silicon wafer 230, which helps to reduce the risk of mesh blockage of the screen 210, increase the ink penetration rate of the slurry 220, optimize printing stability, and thus improve the screen printing yield. Therefore, it can also reduce the requirements of the screen printing system formula for the slurry 220, and can increase the conductivity of the slurry 220, especially in the application of silver-coated copper slurry 220.

[0037] In one embodiment, continue to refer to the attached Figure 1 , attached Figure 1 The figure shows that direction Y is the direction in which the scraper assembly 110 scrapes the slurry 220, and direction X is the direction opposite to the direction in which the scraper assembly 110 scrapes the slurry 220. The separation device 120 is spaced apart from the scraper assembly 110 and is located on the back of the scraper assembly 110; the back of the scraper assembly 110 faces the direction opposite to the direction in which the scraper assembly 110 scrapes the slurry 220.

[0038] Continue to refer to the attached Figure 1 The above-mentioned detachment device 120 is located on the back side of the scraper group 110, and the back side of the scraper group 110 faces the direction opposite to the direction in which the scraper group 110 scrapes the slurry 220. It can be understood that the detachment device 120 and the scraper group 110 are sequentially arranged in the direction in which the scraper group 110 scrapes the slurry 220. After the scraper group 110 completes the scraping of the slurry 220 at a position, the detachment device 120 processes the mesh corresponding to the position, so that the slurry 220 in the mesh corresponding to the position completely falls onto the target position on the surface of the silicon wafer 230. It can be seen that in this embodiment, the detachment device 120 is spaced apart from the scraper group 110 and is located on the back side of the scraper group 110, which can ensure the timeliness of the detachment device 120 processing the slurry 220.

[0039] In one embodiment, the distance between the disengagement device and the scraper assembly is 2 mm to 5 mm, for example, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, but not limited thereto.

[0040] In this embodiment, the distance between the detaching device and the scraper group is set to 2 mm to 5 mm, which can ensure that the detaching device can accurately and timely process the mesh after the scraper group has scraped the slurry.

[0041] In one embodiment, the detaching device is used to emit an energy beam to the mesh holes of the screen with residual slurry, so that the slurry remaining in the mesh holes of the screen falls off from the mesh holes under the action of the energy beam.

[0042] The detachment device in this embodiment can emit an energy beam, and the slurry can change under the action of the energy beam, so that it falls off from the mesh. Exemplarily, the detachment device is a laser device as an example. The laser device can emit a laser beam of preset energy. The laser beam is irradiated on the slurry and the surface of the mesh. After the slurry absorbs the energy of the laser beam, the temperature rises, thereby causing the organic components of the slurry to evaporate. After evaporation, a steam layer is generated, causing the slurry in the mesh to fall off from the screen. Similarly, for other types of detachment devices, their working principle is to fall off from the mesh under the action of the energy beam, thereby realizing the cleaning of the mesh. For screens with narrower meshes, the transmittance of the slurry during printing can also be guaranteed.

[0043] In one embodiment, the detaching device includes a laser scanning device; the energy beam includes a laser beam; the laser scanning device is used to emit a laser beam to the slurry in the mesh, so that the slurry in the mesh is heated up and falls off from the mesh.

[0044] In the present embodiment, a feasible embodiment is provided, in which a laser scanning device processes the mesh after printing the slurry, and the laser beam is irradiated on the slurry and the mesh surface. After the slurry absorbs the energy of the laser beam, the temperature rises, thereby causing the organic components of the slurry to evaporate. After evaporation, a steam layer is generated, which causes the slurry in the mesh to fall off from the screen. The mesh can be cleaned quickly to avoid clogging of the mesh, thereby improving the transmittance of the slurry printing.

[0045] In one embodiment, the wavelength of the laser beam is 800nm-1000nm, and the power of the laser beam is 30W-40W. For example, the wavelength of the laser beam can be 800nm, 820nm, 830nm, 840nm, 850nm, 860nm, 870nm, 880nm, 890nm, 900nm, 910nm, 920nm, 930nm, 940nm, 950nm, 960nm, 970nm, 980nm, 990nm, 1000nm, etc., but not limited thereto. For example, the power of the laser beam can be 30W, 31W, 32W, 33W, 34W, 35W, 36W, 37W, 38W, 39W, 40W, etc., but not limited thereto. In this embodiment, the wavelength of the laser beam is limited to 800nm~1000nm, and the power of the laser beam is limited to 30W~40W, which can ensure that when the laser beam is emitted to the surface of the slurry, the slurry can absorb the energy of the laser beam and heat up to produce a steam layer in the shortest possible time, thereby quickly falling off from the mesh.

[0046] In one embodiment, the detachment device includes an air pressure device; the energy beam includes a directional air pressure beam; the air pressure device is used to emit a directional air pressure beam to the slurry in the mesh, so that the slurry in the mesh falls off from the mesh under the pressure of the directional air pressure beam.

[0047] This embodiment provides another feasible embodiment, in which a directional air pressure beam is emitted by an air pressure device to quickly and directionally scan the slurry on the mesh, and the slurry in the mesh can be quickly separated from the mesh under the pressure of the directional air pressure beam.

[0048] In one embodiment, the pressure value of the directional air pressure beam is 10Pa~20Pa. For example, the pressure value of the directional air pressure beam can be 10Pa, 11Pa, 12Pa, 13Pa, 14Pa, 15Pa, 16Pa, 17Pa, 18Pa, 19Pa, 20Pa, etc., but is not limited thereto. In this embodiment, the pressure value of the directional air pressure beam is limited to 10Pa~20Pa, which can ensure that the pressure value of the directional air pressure beam is fast enough to achieve the separation of the slurry.

[0049] In one embodiment, see the attached Figure 2 , attached Figure 2 1 is a flow chart of a screen printing method in an embodiment of the present application. The screen printing in this embodiment is used to prepare grid lines. The screen printing method includes the following steps S201 to S202.

[0050] Step S201, controlling the scraper assembly to print the slurry on the screen surface onto the surface of the silicon wafer.

[0051] Specifically, the slurry is laid on the side of the screen that faces away from the silicon wafer, and the scraper group is controlled to start moving to print the slurry on the surface of the screen onto the surface of the silicon wafer.

[0052] Step S202, after the scraper assembly prints the slurry on the surface of the silicon wafer, the detaching device is controlled to start working to cause the slurry remaining in the mesh holes of the screen to fall off from the mesh holes.

[0053] While controlling the movement of the scraper group, the movement of the detaching device is also synchronously controlled to ensure that the relative position of the detaching device and the detaching device is unchanged, so as to avoid the detaching device being unable to timely remove the slurry in the mesh due to the change of relative position, thereby ensuring the effect of the detaching device. After the scraper group prints the slurry on the surface of the silicon wafer, the detaching device is immediately controlled to remove the slurry.

[0054] Specifically, controlling the detachment device to start working to cause the slurry remaining in the meshes of the screen to fall off from the meshes may be controlling the detachment device to emit an energy beam to the meshes of the screen where the slurry remains, so that the slurry remaining in the meshes of the screen falls off from the meshes under the action of the energy beam. According to different working principles of the detachment device, the corresponding energy beam and the working parameters of the detachment control device are also different.

[0055] Exemplarily, taking the detachment device as a laser scanning device, controlling the detachment device to emit an energy beam to the mesh of the screen with residual slurry can be: controlling the laser scanning device to emit a laser beam to the slurry in the mesh, so that the slurry in the mesh heats up and falls off from the mesh. The wavelength of the emitted laser beam can be 800nm~1000nm, and the power of the laser beam can be 30W~40W. Limiting the wavelength of the laser beam to 800nm~1000nm and the power of the laser beam to 30W~40W can ensure that when the laser beam is emitted to the surface of the slurry, the slurry can absorb the energy of the laser beam in the shortest possible time to heat up to produce a steam layer, thereby quickly falling off from the mesh.

[0056] In another exemplary embodiment, taking the detachment device as an air pressure device, controlling the detachment device to emit an energy beam to the mesh of the screen with residual slurry can be: controlling the air pressure device to emit a directional air pressure beam to the slurry in the mesh, so that the slurry in the mesh falls off from the mesh under the pressure of the directional air pressure beam. The slurry on the mesh is quickly and directionally scanned by emitting a directional air pressure beam by the air pressure device, and the slurry in the mesh can be quickly detached from the mesh under the pressure of the directional air pressure beam. The pressure value of the directional air pressure beam is 10Pa~20Pa. It can ensure that the pressure value of the directional air pressure beam is fast enough to achieve the detachment of the slurry.

[0057] In this embodiment, the slurry remaining in the mesh of the screen is separated by the separation device after the scraper group prints the slurry on the silicon wafer, which helps to reduce the risk of screen mesh blockage, increase the ink penetration rate of the slurry, optimize printing stability, and thus improve the screen printing yield. Therefore, it can also reduce the requirements of screen printing on the slurry system formula, and can increase the conductivity of the slurry, especially in the application of silver-coated copper slurry.

[0058] In one embodiment, it also includes: controlling the disengagement device to move to the back side of the scraper group and being spaced a preset distance from the scraper group; the back side of the scraper group faces in a direction opposite to the direction in which the scraper group scrapes the slurry.

[0059] It can be understood that the disengagement device and the scraper group can be two independently controlled devices. Before preparing for screen printing, the relative positions of the scraper group and the disengagement device can be calibrated first. Specifically, it can be as in the steps in this embodiment, controlling the disengagement device to move to the back of the scraper group, and being spaced a preset distance from the scraper group, thereby ensuring that after the scraper group completes the slurry coating, the disengagement device can promptly and effectively separate the slurry in the mesh.

[0060] The preset distance may be 2 mm to 5 mm, for example, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm, but is not limited thereto.

[0061] In one embodiment, the paste comprises a silver coated copper paste.

[0062] In this embodiment, the slurry for screen printing can be a silver-coated copper slurry, which reduces the requirements of screen printing on the slurry system formula and ensures the conductivity of the slurry.

[0063] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0064] Based on the same inventive concept, the embodiment of the present application also provides a screen printing device for implementing the screen printing method involved above. The implementation solution provided by the device to solve the problem is similar to the implementation solution recorded in the above method, so the specific limitations in one or more screen printing device embodiments provided below can refer to the above limitations on the screen printing method, and will not be repeated here.

[0065] In an exemplary embodiment, a screen printing device is provided, comprising a first control module and a second control module, wherein the first control module is used to control a scraper group to print the slurry on the surface of the screen onto the surface of a silicon wafer, and the second control module is used to control a detachment device to start working to cause the slurry remaining in the mesh of the screen to fall off from the mesh after the scraper group prints the slurry on the surface of the silicon wafer.

[0066] In one embodiment, the second control module is also used to control the disengagement device to move to the back of the scraper group and be spaced a preset distance from the scraper group; the back of the scraper group faces in a direction opposite to the direction in which the scraper group scrapes the slurry.

[0067] In an exemplary embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as shown in FIG. Figure 3As shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be implemented through WIFI, a mobile cellular network, near field communication (NFC) or other technologies. When the computer program is executed by the processor, a screen printing method is implemented. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device shell, or an external keyboard, touchpad or mouse.

[0068] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0069] In an exemplary embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned screen printing method embodiments when executing the computer program.

[0070] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned screen printing method embodiments are implemented.

[0071] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above-mentioned screen printing method embodiments when executed by a processor.

[0072] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0073] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the application. It should be noted that, for a person of ordinary skill in the art, several variations and improvements may be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A screen printing device, characterized in that: It comprises a scraper group and a detaching device; the scraper group is used to print the slurry on the surface of the screen onto the surface of the silicon wafer; the detaching device is used to cause the slurry remaining in the mesh holes of the screen to fall off from the mesh holes after the scraper group prints the slurry on the surface of the silicon wafer.

2. The screen printing device according to claim 1, characterized in that: The disengagement device is spaced apart from the scraper assembly and is located at the back of the scraper assembly; the back of the scraper assembly faces a direction opposite to the direction in which the scraper assembly prints the slurry.

3. The screen printing device according to claim 2, characterized in that: The distance between the separation device and the scraper assembly is 2 mm to 5 mm.

4. The screen printing device according to claim 1, characterized in that: The detaching device is used to emit an energy beam to the mesh holes of the screen where the slurry remains, so that the slurry remaining in the mesh holes of the screen falls off from the mesh holes under the action of the energy beam.

5. The screen printing device according to claim 4, characterized in that: The detachment device comprises a laser scanning device; the energy beam comprises a laser beam; The laser scanning device is used to emit the laser beam to the slurry in the mesh, so that the slurry in the mesh is heated up and falls off from the mesh.

6. The screen printing device according to claim 5, characterized in that: The wavelength of the laser beam is 800nm-1000nm, and the power of the laser beam is 30W-40W.

7. The screen printing device according to claim 4, characterized in that: The detachment device comprises an air pressure device; the energy beam comprises a directional air pressure beam; The air pressure device is used to emit the directional air pressure beam to the slurry in the mesh, so that the slurry in the mesh falls off from the mesh under the pressure of the directional air pressure beam.

8. The screen printing device according to claim 7, characterized in that: The pressure value of the directional air pressure beam is 10Pa~20Pa.

9. A screen printing method, characterized in that: The screen printing is used to prepare the grid line; the screen printing method comprises: Control the scraper group to print the slurry on the screen surface onto the silicon wafer surface; After the scraper group prints the slurry on the surface of the silicon wafer, the detaching device is controlled to start working to cause the slurry remaining in the mesh holes of the screen to fall off from the mesh holes.

10. The screen printing method according to claim 9, characterized in that: Also includes: The disengagement device is controlled to move to the back side of the scraper group and is spaced apart from the scraper group by a preset distance; the back side of the scraper group faces a direction opposite to the direction in which the scraper group prints the slurry.

11. The screen printing method according to claim 9, characterized in that: The paste includes silver-clad copper paste.

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