Automatic probe card taking and placing device and control method thereof

Abstract

The invention relates to an automatic probe card taking and placing device and a control method thereof. The automatic probe card pick-and-place device comprises a transport carrier, at least one accommodating shelf configured to accommodate a probe card, a lap joint position adjusting module, a pick-and-place assembly configured to pick and place the probe card, a plurality of telescopic pieces and a control element. The control element is electrically or communicatively connected with the transport carrier, the lap joint position adjusting module, the telescopic member and the pick-and-place assembly. The control element is configured to: control the transport vehicle to move to a target position adjacent to the prober; driving the lap joint position adjusting module to calibrate the relative positions of the at least one accommodating shelf and the pick-and-place assembly relative to the prober; actuating the telescopic part to move the at least one accommodating shelf and the pick-and-place assembly towards and away from the prober; and actuating the pick-and-place assembly to pick and place the probe card accommodated in the at least one accommodating shelf or the carrying platform of the prober. Therefore, comprehensive automation of the probe card loading and unloading system can be realized.

Description

Technical Field

[0001] The present disclosure relates to an automatic probe card pick-and-place device and a control method thereof. Background Art

[0002] Currently, each packaging and testing factory and test equipment manufacturer needs to manually carry the probe card and load and unload the probe card into the prober. However, this takes a lot of time and engineering manpower. In addition, due to the different proficiency of the operators who install the probe card, improper operation can easily cause damage to the probe card.

[0003] Therefore, how to propose an automated probe card placement device and a control method thereof to reduce the risk of manual installation of the probe card is one of the issues that the industry is eager to invest research and development resources to solve. Summary of the invention

[0004] In view of this, an object of the present disclosure is to provide an automated probe card pick-and-place device and a control method thereof that can solve the above-mentioned problems.

[0005] In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, an automated probe card pick-and-place device includes a transport carrier, at least one storage shelf configured to accommodate probe cards, an overlapping position adjustment module, a pick-and-place assembly configured to pick-and-place probe cards, a plurality of telescopic parts, and a control element. At least one storage shelf is located above the transport carrier. At least one storage shelf is configured to accommodate probe cards. The overlapping position adjustment module is disposed between at least one storage shelf and the transport carrier. The pick-and-place assembly is disposed above at least one storage shelf. The pick-and-place assembly is configured to pick-and-place probe cards. The telescopic part is connected to at least one storage shelf and connected between the pick-and-place assembly and at least one storage shelf. The control element is electrically or communicatively connected to the transport carrier, the overlapping position adjustment module, the telescopic part, and the pick-and-place assembly. The control element is configured to: control the transport carrier to move to a target position adjacent to the probe tester; drive the overlap position adjustment module to calibrate the relative position of at least one storage shelf and a pick-and-place component relative to the probe tester; actuate the telescopic member to move at least one storage shelf and a pick-and-place component toward and away from the probe tester; and actuate the pick-and-place component to pick and place a probe card contained in at least one storage shelf or a carrier of the probe tester.

[0006] In one or more embodiments of the present disclosure, at least one accommodating shelf further includes a first accommodating shelf and a second accommodating shelf. The first accommodating shelf is disposed on the overlap position adjustment module. The second accommodating shelf is movably located between the first accommodating shelf and the pick-and-place assembly.

[0007] In one or more embodiments of the present disclosure, the telescopic member is further connected between the first accommodating shelf and the second accommodating shelf and actuates the second accommodating shelf to move toward and away from the first accommodating shelf. The second accommodating shelf and the first accommodating shelf are separated from each other in a direction parallel to the actuation direction of the telescopic member.

[0008] In one or more embodiments of the present disclosure, the overlapping position adjustment module includes a lateral displacement component, and the lateral displacement component actuates at least one accommodating shelf to move along a direction perpendicular to the actuation direction of the telescopic member.

[0009] In one or more embodiments of the present disclosure, the overlapping position adjustment module includes a horizontal adjustment component, and the horizontal adjustment component drives at least one accommodating shelf to swing relative to the transport carrier.

[0010] In one or more embodiments of the present disclosure, the horizontal adjustment assembly further includes a base, a movable portion, at least one rolling element, and an actuator. The movable portion is connected to the base. The movable portion includes a connecting plate connected to at least one accommodating shelf and a swing block connected to the connecting plate. The swing block has an arc-shaped slide groove. At least one rolling element is pivotally connected to the base and connected to the arc-shaped slide groove, so that the swing block can be slidably connected to the base. The actuator actuates the movable portion to swing the movable portion relative to the base.

[0011] In one or more embodiments of the present disclosure, the automated probe card pick-and-place apparatus further comprises a plurality of sensing devices configured to emit and sense light.

[0012] In one or more embodiments of the present disclosure, the overlapping position adjustment module includes a rotation adjustment component that causes at least one accommodating shelf to rotate with the center of the rotation adjustment component as the center of the circle.

[0013] In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further comprises at least one first positioning shaft disposed on the telescopic member, and the at least one first positioning shaft is configured to be combined with a positioning sleeve of a probe tester.

[0014] In one or more embodiments of the present disclosure, the overlap position adjustment module includes a plurality of floating components connected to at least one accommodating shelf. Each of the floating components includes a plurality of sliders stacked on each other. The sliders include a first track extending along a first direction and a second track extending along a second direction perpendicular to the first direction.

[0015] In one or more embodiments of the present disclosure, the overlapping position adjustment module further comprises a plurality of locking structures configured to fix at least one accommodating shelf to the overlapping position adjustment module and configured to allow at least one accommodating shelf to move relative to the overlapping position adjustment module.

[0016] In one or more embodiments of the present disclosure, each of the locking structures includes a sleeve member connected to at least one accommodating shelf and a second positioning shaft disposed on the overlapping position adjustment module and corresponding to the sleeve member.

[0017] In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a control method is used for an automated probe card pick-and-place device. The automated probe card pick-and-place device includes a transport carrier, a first accommodating shelf and a second accommodating shelf located above the transport carrier, an overlapping position adjustment module connected between the first accommodating shelf and the transport carrier, a pick-and-place component located above the second accommodating shelf, and a plurality of telescopic members connected between the first accommodating shelf and the second accommodating shelf and between the second accommodating shelf and the pick-and-place component. The control method includes: controlling the transport carrier to move to a target position adjacent to the probe tester; driving the overlapping position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf, and the pick-and-place component relative to the probe tester; actuating the telescopic member to move the second accommodating shelf and the pick-and-place component so that the second accommodating shelf and the first accommodating shelf are separated from each other in a direction parallel to the actuation direction of the telescopic member; and actuating the pick-and-place component to pick and place the probe card contained in the first accommodating shelf, the second accommodating shelf, or the carrier of the probe tester.

[0018] In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly causes the pick-and-place assembly and the second accommodating shelf to be separated from each other.

[0019] In one or more embodiments of the present disclosure, the step of driving the overlapping position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly relative to the needle testing machine further includes: actuating the horizontal adjustment component of the overlapping position adjustment module so that the bearing surface of the first accommodating shelf and the bearing surface of the second accommodating shelf connected to the horizontal adjustment component are parallel to the top surface of the needle testing machine; actuating the rotational adjustment component of the overlapping position adjustment module so that the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly connected to the rotational adjustment component rotate with the center of the rotational adjustment component as the center; and actuating the lateral displacement component of the overlapping position adjustment module so that the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly connected to the lateral displacement component move laterally relative to the needle testing machine.

[0020] In one or more embodiments of the present disclosure, the horizontal adjustment assembly further includes a connecting plate connecting the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly. The step of actuating the horizontal adjustment assembly of the overlap position adjustment module makes the connecting plate parallel to the top surface of the needle measuring machine.

[0021] In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further includes two sensing devices configured to emit and sense light. The probe tester further includes two reference positioning plates disposed on the top surface of the probe tester and corresponding to the two sensing devices. The step of driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf, and the pick-and-place assembly relative to the probe tester further includes: driving the two sensing devices to emit light toward the two reference positioning plates.

[0022] In one or more embodiments of the present disclosure, the step of actuating the rotation adjustment component of the overlapping position adjustment module enables the two sensing devices to sense the same distance value of the light reflected from the two reference positioning plates.

[0023] In one or more embodiments of the present disclosure, the step of actuating the lateral displacement component of the overlapping position adjustment module enables the light emitted by the two sensing devices to be respectively aligned with the two positioning rods of the two reference positioning plates.

[0024] In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further includes at least one first positioning axis disposed on the telescopic member. The probe card tester further includes at least one positioning sleeve corresponding to the at least one first positioning axis. The step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly enables the at least one first positioning axis to be combined with the at least one positioning sleeve.

[0025] In one or more embodiments of the present disclosure, the overlap position adjustment module further comprises a plurality of locking structures. The steps of actuating the telescopic member to move the second accommodating shelf and placing and taking components enable the first accommodating shelf to be fixed to the overlap position adjustment module through the locking structures or to be movable relative to the overlap position adjustment module.

[0026] In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly enables the first accommodating shelf to move relative to the overlapping position adjustment module when the second accommodating shelf and the pick-and-place assembly move toward the carrier of the probe measuring machine.

[0027] In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly enables the first accommodating shelf to be fixed to the overlapping position adjustment module when the second accommodating shelf and the pick-and-place assembly move away from the carrier of the probe tester.

[0028] In one or more embodiments of the present disclosure, the step of actuating the pick-and-place assembly takes the probe card contained in the carrier and places the probe card in the first containing shelf.

[0029] In one or more embodiments of the present disclosure, the step of actuating the pick-and-place assembly takes the probe card contained in the second containing shelf and places the probe card in the carrier.

[0030] In one or more embodiments of the present disclosure, the carrier accommodates a first probe card, and the second accommodating shelf accommodates a second probe card. The step of actuating the pick-and-place assembly further includes: taking the first probe card accommodated in the carrier and placing the first probe card in the first accommodating shelf; and after placing the first probe card in the first accommodating shelf, taking the second probe card accommodated in the second accommodating shelf and placing the second probe card in the carrier.

[0031] In summary, in the automatic probe card pick-up and placement device and its control method disclosed in the present invention, since the overlap position adjustment module is equipped with a sensing device, and the telescopic member is equipped with a floating component, the automatic probe card pick-up and placement device and the probe tester can be precisely engaged to facilitate the automatic loading and unloading of the probe card. In the automatic probe card pick-up and placement device and its control method disclosed in the present invention, since the first accommodating shelf, the second accommodating shelf and the pick-up and placement component can be horizontally separated by the actuation of the telescopic member, the automatic probe card pick-up and placement device can complete the replacement operation of the new probe card and the old probe card at one time, or can install multiple new probe cards at the same time and recycle multiple old probe cards at the same time. In the automatic probe card pick-up and placement device and its control method disclosed in the present invention, the automatic probe card pick-up and placement device can cooperate with a self-made front opening sh ipping box (Front Opening Sh ipping Box; FOSB) loading and unloading vehicle and the intelligent warehousing system under development to build an intelligent factory of a cyber-physical (Cyber-physical; CP) system, thereby realizing the comprehensive automation of the probe card loading and unloading system.

[0032] The above description is only used to illustrate the problem to be solved by the present disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of the present disclosure will be described in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0034] Figure 1 A three-dimensional view of an automated probe card pick-and-place device according to one embodiment of the present disclosure is shown.

[0035] Figure 2 A functional block diagram of an automated probe card pick-and-place device according to one embodiment of the present disclosure is shown.

[0036] Figure 3 A flow chart of a control method of an automated probe card pick-and-place device according to one embodiment of the present disclosure is shown.

[0037] Figure 4A schematic diagram of an automated probe card pick-and-place device and a probe tester according to one embodiment of the present disclosure is shown.

[0038] Figure 5 A flow chart showing one step of a control method of an automated probe card pick-and-place device according to one embodiment of the present disclosure is shown.

[0039] Figure 6 A partial enlarged view of an automated probe card pick-and-place device and a probe tester according to one embodiment of the present disclosure is shown.

[0040] Figure 7 A side view of an automated probe card pick-and-place device and a probe tester according to one embodiment of the present disclosure is shown.

[0041] Figure 8 A three-dimensional view of a level adjustment assembly according to an embodiment of the present disclosure is shown.

[0042] Fig. 9 A partial enlarged view of a level adjustment assembly according to an embodiment of the present disclosure is shown.

[0043] Fig.10 A three-dimensional view of a rotation adjustment assembly and a lifting assembly according to an embodiment of the present disclosure is shown.

[0044] Fig.11 A three-dimensional view of a lateral displacement assembly according to an embodiment of the present disclosure is shown.

[0045] Fig.12 A schematic diagram showing horizontal separation of a first accommodating shelf, a second accommodating shelf, and a pick-and-place assembly according to an embodiment of the present disclosure is shown.

[0046] Fig.13 An oblique top view of an automated probe card pick-and-place device and a probe tester according to one embodiment of the present disclosure is shown.

[0047] Fig.14 A schematic diagram is shown of a first state of connection between an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure.

[0048] Fig.15 A schematic diagram is shown of a second embodiment of the connection between an automated probe card pick-and-place device and a probe tester according to an embodiment of the present disclosure.

[0049] Fig.16 A three-dimensional diagram showing the connection between an automated probe card pick-and-place device and a probe test machine according to one embodiment of the present disclosure is shown.

[0050] Fig.17 A side view of a floating assembly according to one embodiment of the present disclosure is shown.

[0051] Fig.18 A three-dimensional view of a floating assembly according to an embodiment of the present disclosure is shown.

[0052] Fig.19 A schematic diagram illustrating a third aspect of a locking structure according to an embodiment of the present disclosure is shown.

[0053] Fig. 20 A schematic diagram illustrating a fourth aspect of a locking structure according to an embodiment of the present disclosure is shown.

[0054] Fig.21 A flow chart showing one step of a control method of an automated probe card pick-and-place device according to one embodiment of the present disclosure is shown.

[0055] Fig. 22 A partial three-dimensional diagram showing the connection between an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure is shown.

[0056]

Main component symbol description

[0057] 100: Automated probe card pick-and-place device 110: Transport carrier

[0058] 120: Overlap position adjustment module 122: Horizontal adjustment component

[0059] 122A: first horizontal adjustment component 122B: second horizontal adjustment component

[0060] 124: Rotation adjustment assembly 126: Lifting assembly

[0061] 128: Lateral displacement assembly 129: Floating assembly

[0062] 130: Storage shelf 132: First storage shelf

[0063] 132a, 134a: bearing surface 134: second storage shelf

[0064] 140: Pick and place assembly 150: Telescopic member

[0065] 152: first telescopic member 154: second telescopic member

[0066] 160: Sensing device 170: First positioning axis

[0067] 180: Locking structure 182: Hole sleeve

[0068] 184: Accommodating space 186: Second positioning axis

[0069] 200: needle tester 200a: top surface

[0070] 230: stage 260: reference positioning plate

[0071] 262: Positioning rod 270: Positioning sleeve

[0072] 1221A, 1221B: base 1222A, 1222B: pendulum

[0073] 1223A, 1223B: Connecting plate 1224B: Arc chute

[0074] 1225B: Rolling element 1226,1246,1266,1286: Actuator

[0075] 1242: Movable platform 1243: Movable column

[0076] 1244: Bearing ring 1262: Bottom plate

[0077] 1263: Column 1282: Base

[0078] 1283: Side wall 1284: Linear rail

[0079] 1291: First slider 1292,1295: Track

[0080] 1293: Second slider 1294: Sliding member

[0081] 1296: Third slider AD: actuation direction

[0082] CE: Control Element CM: Control Method

[0083] CTR: Center L: Light

[0084] LD: Transverse direction MP1: First movable part

[0085] MP2: Second active part PC: Probe card

[0086] R: Recess RT: Route

[0087] S1: first state S2: second state

[0088] S3: The third state S4: The fourth state

[0089] S10,S12,S14,S16,S121,S122,S123,S124,S161,S162: Steps

[0090] UD: lifting direction X, Y, Z: direction DETAILED DESCRIPTION

[0091] The following will disclose multiple embodiments of the present disclosure with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are not necessary. In addition, in order to simplify the drawings, some existing conventional structures and elements will be depicted in a simple schematic manner in the drawings. The same reference numerals will be used to represent the same or similar elements in all drawings.

[0092] The structure and function of each component included in the automated probe card pick-and-place device 100 of this embodiment and the connection relationship between the components will be described in detail below.

[0093] Please refer to Figure 1 . Figure 1 FIG. 1 is a perspective view of an automated probe card pick-and-place device 100 according to an embodiment of the present disclosure. In this embodiment, the automated probe card pick-and-place device 100 includes a transport carrier 110, an overlap position adjustment module 120, at least one accommodating shelf 130, and a pick-and-place assembly 140. The overlap position adjustment module 120, the accommodating shelf 130, and the pick-and-place assembly 140 are disposed on the transport carrier 110. Figure 1 As shown, the transport vehicle 110 equipped with the overlapping position adjustment module 120, the storage shelf 130 and the pick-and-place assembly 140 can reach the target position according to the route RT. The overlapping position adjustment module 120 is disposed on the transport vehicle 110. The overlapping position adjustment module 120 is configured to adjust the position of the storage shelf 130 and the pick-and-place assembly 140 in space. Figure 1 As shown, the accommodating shelf 130 is disposed above the transport carrier 110 and is configured to accommodate the probe card PC. Specifically, the accommodating shelf 130 is disposed on the overlapping position adjustment module 120. In other words, the overlapping position adjustment module 120 is disposed between the accommodating shelf 130 and the transport carrier 110. The pick-up and placement component 140 is movably disposed above the accommodating shelf 130 and is configured to pick up and place the probe card PC. In some embodiments, the overlapping position adjustment module 120 further includes a horizontal adjustment component 122, a rotation adjustment component 124, a lifting component 126, a lateral displacement component 128, and a floating component 129. In some embodiments, the accommodating shelf 130 includes a first accommodating shelf 132 and a second accommodating shelf 134. However, the present disclosure is not intended to limit the number of accommodating shelves 130, that is, the present disclosure may include any number of accommodating shelves 130 as required. In some embodiments, such as Figure 1As shown, the first accommodating shelf 132 is disposed on the overlapping position adjustment module 120, and the second accommodating shelf 134 is movably located between the first accommodating shelf 132 and the pick-and-place assembly 140. The detailed structure, function and connection relationship between the above elements will be described below.

[0094] In some embodiments, the transport vehicle 110 may be, for example, an automatic guided vehicle (AGV) or other automated powertrain.

[0095] In some implementations, the probe card PC is, for example, an intermediary element for testing integrated circuits on a wafer (not shown).

[0096] Please continue to refer to Figure 1 .like Figure 1 As shown, the automated probe card pick-and-place device 100 further includes a plurality of telescopic members 150. The telescopic members 150 are connected to the receiving shelf 130 and are connected between the pick-and-place assembly 140 and the receiving shelf 130. In some embodiments, Figure 1 As shown, the telescopic member 150 includes a first telescopic member 152 and a second telescopic member 154. The first telescopic member 152 is connected between the first accommodating shelf 132 and the second accommodating shelf 134 and is configured to move along the actuation direction AD. The second telescopic member 154 is connected between the second accommodating shelf 134 and the pick-and-place assembly 140 and is configured to move along the actuation direction AD. In some embodiments, the actuation direction AD is parallel to the first direction (e.g., direction X).

[0097] Please continue to refer to Figure 1 .like Figure 1 As shown, the automated probe card pick-and-place device 100 further includes a sensing device 160. The sensing device 160 is configured to emit and sense light L. In some embodiments, the light L can be, for example, a laser or other suitable type of light. The sensing device 160 configured to emit and sense light L is used for ranging, which will be described in more detail below. In some embodiments, the automated probe card pick-and-place device 100 may include one, two, or more than two sensing devices 160. The present disclosure is not intended to limit the number of sensing devices 160.

[0098] Please continue to refer to Figure 1 .like Figure 1 As shown, the automated probe card pick-and-place device 100 further includes a first positioning shaft 170. The first positioning shaft 170 is disposed on the telescopic member 150. In some embodiments, the first positioning shaft 170 is disposed on the first telescopic member 152. The first positioning shaft 170 is configured to allow the automated probe card pick-and-place device 100 to be aligned with the probe tester ( Figure 1The following will be described in more detail.

[0099] In some embodiments, the telescopic member 150 may be, for example, a telescopic fork or other similar rail assembly. In some embodiments, the telescopic member 150 may also be coupled with a pulley assembly to achieve a mechanical advantage and labor-saving effect.

[0100] In some embodiments, the sensing device 160 may be, for example, a laser sensor or other similar optical sensors.

[0101] Please refer to Figure 2 as well as Figure 3 . Figure 2 FIG. 1 is a functional block diagram of an automated probe card pick-and-place apparatus 100 according to an embodiment of the present disclosure. Figure 3 FIG. 1 is a flow chart of a control method CM of an automated probe card pick-and-place device 100 according to an embodiment of the present disclosure. Figure 2 As shown, the automated probe card pick-and-place device 100 further includes a control element CE. The control element CE is electrically or communicatively connected to the transport carrier 110, the overlap position adjustment module 120, the pick-and-place assembly 140, and the telescopic member 150. Specifically, the control method CM of the automated probe card pick-and-place device 100 is controlled by the control element CE. Figure 3 As shown, the control method CM of the automated probe card pick-and-place device 100 includes step S10, step S12, step S14 and step S16. For a better understanding of step S10, please refer to Figure 4 For a better understanding of step S12, please refer to Figures 5 to 11 For a better understanding of step S14, please refer to Figures 12 to 20 For a better understanding of step S16, please refer to Figure 21 to Figure 22 .

[0102] The following will describe in detail the steps S10 , S12 , S14 and S16 of the control method CM of the automated probe card pick-and-place apparatus 100 .

[0103] Step S10 : controlling the transport vehicle 110 to move to a target position adjacent to the probe machine 200 .

[0104] Please refer to Figure 4 . Figure 4 FIG. 1 is a schematic diagram of an automated probe card placement device 100 and a probe tester 200 according to an embodiment of the present disclosure. For the sake of simplicity, some components of the automated probe card placement device 100 are omitted. Figure 1 , Figure 2 as well as Figure 4As shown, the control element CE controls the automated probe card pick-and-place device 100 to move to the target position. Specifically, the control element CE can control the transport carrier 110 to move along the Figure 1 The route RT shown reaches the target location. For example, Figure 4 As shown, the target location is a location adjacent to the needle detection machine 200. Figure 4 As shown, the probe tester 200 includes a stage 230, a reference positioning plate 260, and a positioning sleeve 270, and the probe tester 200 has a top surface 200a. The stage 230 is disposed on the top surface 200a. In some embodiments, the stage 230 is configured to carry a wafer and accommodate a probe card PC. The reference positioning plate 260 is configured to withstand the light L from the sensing device 160. The positioning sleeve 270 is configured to be combined with the first positioning shaft 170 of the automated probe card pick-and-place device 100. This will be described in more detail below.

[0105] In some embodiments, the prober 200 may be, for example, a wafer prober that carries a wafer and performs electrical testing on integrated circuits of the wafer through a probe card PC.

[0106] Step S12 : driving the overlapping position adjustment module 120 to calibrate the relative positions of the first accommodating shelf 132 , the second accommodating shelf 134 and the pick-and-place assembly 140 with respect to the probe measuring machine 200 .

[0107] In this embodiment, step S12 is performed before step S14, and step S12 is a pre-step of step S14. Step S12 is performed to adjust the positions of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 in space, so as to calibrate the relative positions of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 relative to the needle measuring machine 200. In detail, the control element CE performs step S12 to ensure the alignment of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 in three axial directions (e.g., direction X, direction Y, and direction Z).

[0108] Please refer to Figure 5 . Figure 5 FIG. 1 is a detailed flow chart of step S12 of the control method CM of the automated probe card pick-and-place device 100 according to one embodiment of the present disclosure. In this embodiment, step S12 further includes step S121, step S122, step S123, and step S124. For a better understanding of step S121, please refer to Figure 6 as well as Figure 7 To better understand step S122, please refer to Figure 8 as well as Fig. 9 To better understand step S123, please refer to Fig.10To better understand step S124, please refer to Fig.11 .

[0109] Step S121 , step S122 , step S123 , and step S124 will be described in detail below.

[0110] Step S121 : driving the two sensing devices 160 to emit light L toward the two reference positioning plates 260 .

[0111] Please refer to Figure 6 . Figure 6 It is a partially enlarged view of the automated probe card placement device 100 and the probe tester 200 according to one embodiment of the present disclosure. In this embodiment, after the control element CE executes step S10, the control element CE controls the sensing device 160 to emit light L toward the reference positioning plate 260. Then, when the light L reaches the reference positioning plate 260, the light L is reflected by the reference positioning plate 260 and then sensed by the sensing device 160. Thereby, the control element CE can measure the distance value (The Value of Distance) between the sensing device 160 and the reference positioning plate 260 through the sensing device 160. In this embodiment, the automated probe card placement device 100 substantially includes two sensing devices 160 (such as Fig.13 As shown in FIG. 1 , and two sensing devices 160 are located on both sides of the automated probe card pick-and-place device 100, the probe tester 200 also includes two reference positioning plates 260. In this case, the control element CE can measure two distance values ​​between the sensing device 160 on one side and the reference positioning plate 260 and between the sensing device 160 on the other side and the reference positioning plate 260 through the two sensing devices 160 located on both sides, as a basis for calibration.

[0112] Please refer to Figure 7 . Figure 7 FIG. 1 is a side view of an automated probe card pick-and-place device 100 and a probe tester 200 according to an embodiment of the present disclosure. Figure 7 As shown, the reference positioning plate 260 includes a positioning rod 262. In some embodiments, the positioning rod 262 is elongated and extended in a third direction (e.g., direction Z), and the positioning rod 262 protrudes from the reference positioning plate 260 along a second direction (e.g., direction Y). The provision of the positioning rod 262 helps the control element CE to determine whether the operation of step S12 is completed. For example, when the light L emitted by the sensing device 160 senses the positioning rod 262, the distance value measured by the control element CE becomes smaller, thereby determining that the relative positions of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 relative to the needle measuring machine 200 have reached the reference point.

[0113] In some embodiments, the distance between the two positioning rods 262 of the two reference positioning plates 260 is equal to the distance between the two sensing devices 160 .

[0114] Step S122 : activating the horizontal adjustment assembly 122 of the overlapping position adjustment module 120 so that the supporting surface 132 a of the first accommodating shelf 132 and the supporting surface 134 a of the second accommodating shelf 134 connected to the horizontal adjustment assembly 122 are parallel to the top surface 200 a of the probe machine 200 .

[0115] Please refer to Figure 8 . Figure 8 FIG. 1 is a perspective view of a level adjustment assembly 122 according to an embodiment of the present disclosure. In this embodiment, the level adjustment assembly 122 includes a first level adjustment assembly 122A and a second level adjustment assembly 122B. The first level adjustment assembly 122A and the second level adjustment assembly 122B are configured to adjust the leveling state of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140. Figure 8 As shown, the first horizontal adjustment component 122A includes a base 1221A and a first movable part MP1. The first movable part MP1 is connected to the base 1221A. The first movable part MP1 includes a connecting plate 1223A and two swing blocks 1222A connected to the connecting plate 1223A. The first movable part MP1 swings relative to the base 1221A. Figure 8 As shown, the second horizontal adjustment component 122B includes a base 1221B and a second movable part MP2. The second movable part MP2 is connected to the base 1221B. The base 1221B is connected to the connecting plate 1223A. The second movable part MP2 includes a connecting plate 1223B connected to the first accommodating shelf 132 and two swing blocks 1222B connected to the connecting plate 1223B. The second movable part MP2 swings relative to the base 1221B.

[0116] For example, if Figure 8 As shown, the first movable part MP1 swings relative to the base 1221A along an axial direction parallel to the direction Y, and the second movable part MP2 swings relative to the base 1221B along an axial direction parallel to the direction X. In this way, the control element CE can adjust the leveling state of the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 by actuating the leveling adjustment assembly 122. In detail, as Figure 1 , Figure 4 , Figure 8 , Fig.12As shown, when the control element CE executes step S122, since the connecting plate 1223B is connected to the first accommodating shelf 132, the connecting plate 1223A and the connecting plate 1223B can be parallel to the top surface 200a of the probe machine 200, thereby causing the supporting surface 132a of the first accommodating shelf 132 connected to the horizontal adjustment component 122 and the supporting surface 134a of the second accommodating shelf 134 to be parallel to the top surface 200a of the probe machine 200.

[0117] Please refer to Fig. 9 . Fig. 9 FIG. 1 is a partially enlarged view of a horizontal adjustment component 122 according to an embodiment of the present disclosure. Fig. 9 The structure of the horizontal adjustment component 122 is shown in more detail. In order to more specifically explain how the horizontal adjustment component 122 works, the second horizontal adjustment component 122B is used as an example. It should be noted that the components included in the first horizontal adjustment component 122A are similar to the components included in the second horizontal adjustment component 122B, so the first horizontal adjustment component 122A will not be described in detail here. Fig. 9 As shown, the two swing blocks 1222B of the second horizontal adjustment assembly 122B have an arc-shaped slide groove 1224B, and the second horizontal adjustment assembly 122B further includes at least one rolling element 1225B and an actuator 1226. The rolling element 1225B is pivotally connected to the base 1221B and connected to the arc-shaped slide groove 1224B, so that the swing block 1222B can be slidably connected to the base 1221B. The actuator 1226 actuates the second movable part MP2 to make the second movable part MP2 swing relative to the base 1221B.

[0118] Step S123: activating the rotation adjustment assembly 124 of the overlapping position adjustment module 120 to make the first accommodating shelf 132 , the second accommodating shelf 134 and the pick-and-place assembly 140 connected to the rotation adjustment assembly 124 rotate around the center CTR of the rotation adjustment assembly 124 .

[0119] Please refer to Fig.10 . Fig.10 1 is a perspective view of a rotation adjustment assembly 124 and a lifting assembly 126 according to an embodiment of the present disclosure. In this embodiment, the rotation adjustment assembly 124 is configured to drive the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 to rotate with the center CTR of the rotation adjustment assembly 124 as the center. Specifically, Figure 1 as well as Fig.10 As shown, since the rotation adjustment assembly 124 is connected to the first accommodating shelf 132 through the horizontal adjustment assembly 122, the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 can be simultaneously rotated along an axial direction parallel to, for example, the direction Z and passing through the center CTR through the rotation adjustment assembly 124. Fig.10 As shown, the rotation adjustment assembly 124 includes a movable platform 1242, a movable column 1243, a bearing ring 1244 and an actuator 1246. The movable column 1243 is connected to the four corners of the movable platform 1242, and the movable column 1243 is elongated and extended in a third direction (for example, direction Z). The bearing ring 1244 is disposed on the movable platform 1242 and rotates with the center CTR as the center. The actuator 1246 is connected to the bearing ring 1244, and the actuator 1246 is configured to be controlled by the control element CE to reciprocate to drive the bearing ring 1244 to rotate.

[0120] Please continue to refer to Fig.10 The lifting assembly 126 is connected to the rotation adjustment assembly 124. In this embodiment, the lifting assembly 126 is configured to drive the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 to rise and fall. Figure 1 as well as Fig.10 As shown, since the lifting assembly 126 is connected to the first accommodating shelf 132 through the rotation adjustment assembly 124 and the horizontal adjustment assembly 122, the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 can simultaneously rise and fall along the third direction (for example, direction Z) through the lifting assembly 126. Fig.10 As shown, the lifting assembly 126 includes a base plate 1262, a cylinder 1263 and an actuator 1266. The base plate 1262 extends parallel to the movable platform 1242. The cylinders 1263 are disposed at the four corners of the base plate 1262, and the cylinders 1263 are disposed corresponding to the movable columns 1243 and are reciprocally connected to the movable columns 1243. In other words, the lifting assembly 126 is connected to the rotation adjustment assembly 124 through the connection between the cylinders 1263 and the movable columns 1243. The actuator 1266 is disposed on the base plate 1262, and one end of the actuator 1266 is fixed to the base plate 1262, and the other end of the actuator 1266 is abutted against the movable platform 1242. In some embodiments, the actuator 1266 is configured to be controlled by the control element CE to actuate the rotation adjustment component 124 to rise and fall, so that the first storage shelf 132, the second storage shelf 134 and the pick-and-place component 140 can rise and fall simultaneously along a third direction (for example, direction Z) to achieve the purpose of adjusting the height.

[0121] In this embodiment, the control element CE completes step S123 through two sensing devices 160. Figure 1 , Figure 7 as well as Fig.10As shown, when the control element CE executes step S123, the control element CE not only actuates the rotation adjustment component 124, but also simultaneously monitors the two distance values ​​of the light L reflected from the two reference positioning plates 260 sensed by the two sensing devices 160. When the control element CE determines that the two distance values ​​are different, the control element CE actuates the actuator 1246 of the rotation adjustment component 124 to rotate the bearing ring 1244 to simultaneously drive the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place component 140 to rotate around the center CTR of the rotation adjustment component 124 until the two distance values ​​are the same. When the control element CE determines that the two distance values ​​are the same, the control element CE controls the actuator 1246 to stop actuating to stop the bearing ring 1244 from rotating, thereby completing the operation of step S123.

[0122] Step S124 : actuating the lateral displacement assembly 128 of the overlapping position adjustment module 120 , so that the first accommodating shelf 132 , the second accommodating shelf 134 and the pick-and-place assembly 140 connected to the lateral displacement assembly 128 move laterally relative to the probe machine 200 .

[0123] Please refer to Fig.11 . Fig.11 FIG. 1 is a perspective view of a lateral displacement assembly 128 according to an embodiment of the present disclosure. In this embodiment, the lateral displacement assembly 128 is configured to actuate the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 to move in a direction perpendicular to the actuation direction AD. Specifically, Figure 1 as well as Fig.11 As shown, since the lateral displacement assembly 128 is connected to the first accommodating shelf 132 through the lifting assembly 126, the rotation adjustment assembly 124 and the horizontal adjustment assembly 122, the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 can simultaneously move laterally relative to the needle detection machine 200 along the lateral movement direction LD perpendicular to the actuation direction AD through the lateral displacement assembly 128. Fig.11 As shown, the lateral displacement assembly 128 includes a base 1282, two side walls 1283, a linear rail 1284, and an actuator 1286. Figure 1 , Fig.10 as well as Fig.11 As shown, the base 1282 is connected between the transport carrier 110 and the lifting assembly 126. Two side walls 1283 are disposed at both ends of the base 1282 along the lateral direction LD. The linear rail 1284 is disposed on the base 1282, and the linear rail 1284 is elongated and extends along the lateral direction LD. The actuator 1286 is connected to the bottom plate 1262 of the lifting assembly 126, and the actuator 1286 is configured to be controlled by the control element CE to reciprocate to drive the components above the lifting assembly 126 to move laterally relative to the needle detection machine 200.

[0124] In this embodiment, the control element CE completes step S124 through two sensing devices 160. Figure 1 , Figure 7 as well as Fig.11 As shown, when the control element CE executes step S124, the control element CE not only actuates the lateral displacement assembly 128, but also simultaneously monitors whether the light L emitted by the two sensing devices 160 is respectively aligned with the two positioning rods 262 of the two reference positioning plates 260. When the control element CE determines that the light L emitted by the two sensing devices 160 is not aligned with the two positioning rods 262, the control element CE actuates the actuator 1286 of the lateral displacement assembly 128 to simultaneously drive the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 to move laterally relative to the needle measuring machine 200. When the control element CE determines that the light L emitted by the two sensing devices 160 is respectively aligned with the two positioning rods 262, the control element CE controls the actuator 1286 to stop actuating so that the components above the lifting assembly 126 stop moving, thereby completing the operation of step S124.

[0125] Step S14 : actuating the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 , so that the second accommodating shelf 134 and the first accommodating shelf 132 are separated from each other in a direction parallel to the actuation direction AD of the telescopic member 150 .

[0126] Please refer to Fig.12 . Fig.12 FIG. 1 is a schematic diagram of the horizontal separation of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 according to an embodiment of the present disclosure. After the control element CE executes step S12, step S14 is executed. In this embodiment, the control element CE is configured to actuate the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 to unfold the automated probe card pick-and-place apparatus 100, such as Fig.12 As shown. Figure 2 as well as Fig.12 As shown, when the control element CE actuates the first telescopic member 152 and the second telescopic member 154 to move the second accommodating shelf 134 and the pick-and-place assembly 140, the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 are separated from each other in the actuation direction AD (ie, horizontally separated).

[0127] Please refer to Fig.13 . Fig.13 It is an oblique top view of an automated probe card pick-and-place device 100 and a probe tester 200 according to one embodiment of the present disclosure. Fig.13 The structure of the automated probe card pick-and-place device 100 and the probe tester 200 is shown in more detail. Fig.13As shown, the automated probe card pick-and-place device 100 includes two sensing devices 160 on both sides, and the probe tester 200 includes a reference positioning plate 260 corresponding to the two sensing devices 160. In some embodiments, the positioning sleeve 270 has a recess R, and the recess R coincides with the first positioning axis 170. For example, Fig.13 As shown, the positioning sleeve 270 has three recesses R, and three first positioning shafts 170 are disposed on the first telescopic member 152. Each first positioning shaft 170 is disposed corresponding to each recess R, and each first positioning shaft 170 is configured to be combined with each recess R. However, the present disclosure is not intended to limit the number of recesses R and first positioning shafts 170. In this embodiment, the control element CE is configured to actuate the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 toward and away from the needle detection machine 200. Figure 2 , Fig.12 as well as Fig.13 As shown, when the control element CE actuates the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 toward the probe machine 200 , the first accommodating shelf 132 , the second accommodating shelf 134 and the pick-and-place assembly 140 are horizontally separated.

[0128] Please refer to Fig.14 . Fig.14 Schematic diagram of the first state S1 of the automatic probe card placement device 100 and the probe tester 200 according to one embodiment of the present disclosure. In step S14, the control element CE actuates the first telescopic member 152 and the second telescopic member 154 to further enable the automatic probe card placement device 100 and the probe tester 200 to overlap each other. In this embodiment, the first state S1 is the intermediate stage (Intermediate Stage) of the automatic probe card placement device 100 and the probe tester 200 overlapping. Fig.14 As shown, when the control element CE actuates the first telescopic member 152 and the second telescopic member 154 to make the automated probe card pick-and-place device 100 in the first state S1 (equivalent to the unfolded state of the automated probe card pick-and-place device 100), the first positioning shaft 170 is located directly above the positioning sleeve 270. In this state, the first positioning shaft 170 has not yet been combined with the positioning sleeve 270, which means that the control element CE has not yet completed the overlapping operation of the automated probe card pick-and-place device 100 and the probe tester 200.

[0129] Please refer to Fig.15 . Fig.15 FIG. 1 is a schematic diagram of a second state S2 of the automatic probe card placement device 100 and the probe tester 200 according to an embodiment of the present disclosure. In this embodiment, the second state S2 is a completed stage of the automatic probe card placement device 100 and the probe tester 200 being placed together. Fig.15As shown, when the automated probe card pick-and-place device 100 is in the first state S1, the control element CE then actuates the overlap position adjustment module 120 to descend along the lifting direction UD parallel to the third direction (e.g., direction Z), so that the first positioning shaft 170 disposed on the first telescopic member 152 is combined with the positioning sleeve 270, and the control element CE completes the overlap operation of the automated probe card pick-and-place device 100 and the probe tester 200. When the first positioning shaft 170 is combined with the positioning sleeve 270, the control element CE stops actuating the overlap position adjustment module 120.

[0130] Please also refer to Figures 16 to 18 . Fig.16 FIG. 1 is a three-dimensional diagram of an automated probe card pick-and-place device 100 and a probe tester 200 according to an embodiment of the present disclosure. Fig.17 as well as Fig.18 The figures are a side view and a stereoscopic view of a floating assembly 129 according to an embodiment of the present disclosure. In the present embodiment, a plurality of floating assemblies 129 are located on top of the overlapping position adjustment module 120 and connected to the first accommodating shelf 132. In some embodiments, the automated probe card pick-and-place apparatus 100 includes four floating assemblies 129, but the present disclosure is not intended to limit the number of floating assemblies 129. Fig.17 as well as Fig.18 As shown, each floating assembly 129 includes a plurality of sliders stacked on each other. In the present embodiment, each floating assembly 129 includes a first slider 1291, a second slider 1293, and a third slider 1296. The first slider 1291 includes a track 1292. The second slider 1293 includes a plurality of sliding members 1294. The third slider 1296 includes a track 1295. The first slider 1291 is connected to the horizontal adjustment assembly 122. The third slider 1296 is connected to the first accommodating shelf 132. The track 1292 is disposed on the first slider 1291 and is elongated and extended along the second direction (e.g., direction Y). The track 1295 is disposed on the third slider 1296 and is elongated and extended along the first direction (e.g., direction X). The second slider 1293 is slidably connected to the first slider 1291 and the third slider 1296 through the sliding member 1294. Thus, the floating assembly 129 allows the first accommodating shelf 132 and the horizontal adjustment assembly 122 to slide relative to each other in a first direction (eg, direction X) and a second direction (eg, direction Y).

[0131] Please refer to Fig.19 . Fig.19FIG. 1 is a schematic diagram of a third state S3 of a locking structure 180 according to an embodiment of the present disclosure. In this embodiment, the automated probe card placement device 100 further includes a plurality of locking structures 180. The locking structures 180 are configured to fix the first accommodating shelf 132 to the overlapping position adjustment module 120 (i.e., locked state) and configured to allow the first accommodating shelf 132 to be movable relative to the overlapping position adjustment module 120 (i.e., unlocked state). Fig.19 As shown, each locking structure 180 includes a sleeve member 182 connected to the first accommodating shelf 132 and a second positioning shaft 186 disposed on the overlap position adjustment module 120 and corresponding to the sleeve member 182. In some embodiments, the sleeve member 182 has an accommodating space 184 configured to accommodate the second positioning shaft 186. The second positioning shaft 186 reciprocates in the accommodating space 184. Fig.19 As shown, the third state S3 is the unlocked state of the locking structure 180, because the second positioning shaft 186 has not yet engaged with the hole member 182. In some embodiments, the second positioning shaft 186 reciprocates along a third direction (eg, direction Z).

[0132] Please refer to Fig. 20 . Fig. 20 FIG. 1 is a schematic diagram of a fourth state S4 of a locking structure 180 according to an embodiment of the present disclosure. Fig. 20 As shown, the fourth state S4 is the locking state of the locking structure 180, because the second positioning shaft 186 is engaged with the hole member 182. For example, the second positioning shaft 186 moves upward along the third direction (eg, direction Z) to engage with the hole member 182.

[0133] Please also refer to Fig.14 , Fig.15 as well as Fig.19 In one use scenario, when the automated probe card pick-and-place device 100 is Figure 1 When the state shown is expanded and converted to the first state S1, or when the automated probe card placement device 100 is converted from the first state S1 to the second state S2, since the second positioning axis 186 is not engaged with the sleeve member 182, when the automated probe card placement device 100 is to be connected with the probe tester 200, the first accommodating shelf 132 and the horizontal adjustment component 122 can slide freely due to the floating component 129, and when the first positioning axis 170 is combined with the positioning sleeve 270, even if the calibration is not completed accurately enough when executing step S12, the automated probe card placement device 100 can still be successfully connected with the probe tester 200.

[0134] Please also refer to Fig.14 , Fig.15 as well as Fig. 20In another use scenario, when the automated probe card pick-and-place device 100 is converted from the second state S2 to the first state S1, or when the automated probe card pick-and-place device 100 is converted from the first state S1 to Figure 1 In the folded state shown, since the second positioning shaft 186 is engaged with the hole piece 182, when the automated probe card pick-up and placement device 100 is to be separated from the probe test machine 200 or the automated probe card pick-up and placement device 100 is to be folded, the control element CE can actuate the overlapping position adjustment module 120 and the telescopic fork in a stable state.

[0135] Step S16 : actuating the pick-and-place assembly 140 to pick up and place the probe card PC accommodated in the first accommodating shelf 132 , the second accommodating shelf 134 or the stage 230 of the probe testing machine 200 .

[0136] Please refer to Figure 5 , Fig.21 as well as Fig. 22 After the control element CE executes step S14, step S16 is executed. Specifically, after the control element CE completes the overlapping operation of the automated probe card pick-and-place device 100 and the probe tester 200, the pick-and-place assembly 140 is used to pick and place the probe card PC.

[0137] like Fig.21 As shown, it shows the Figure 3 Different implementations of step S16 in . Fig.21 Step S161 and step S162 are shown. Fig. 22 A partial three-dimensional diagram of the connection between the automated probe card pick-and-place device 100 and the probe tester 200 is shown. Fig. 22 Some components of the automated probe card pick-and-place device 100 are omitted. After the control element CE executes step S14, the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 are separated from each other in the actuation direction AD. Fig. 22 It should be noted that Fig. 22 FIG. 1 shows a probe card PC accommodated in the second accommodating shelf 134. However, in practice, one or more probe cards PC may be accommodated in the first accommodating shelf 132, the second accommodating shelf 134 and / or the stage 230 of the probe tester 200 in different usage scenarios. Fig.21 as well as Fig. 22 .

[0138] Step S161 : Take the first probe card PC accommodated in the carrier 230 and place the first probe card PC in the first accommodation shelf 132 . Step S162 : Take the second probe card PC accommodated in the second accommodation shelf 134 and place the second probe card PC in the carrier 230 .

[0139] Please refer to Fig.21 as well as Fig. 22 In one use scenario, after executing step S14, execute step S161, and then execute step S162. For example, when the carrier 230 of the probe tester 200 contains an old probe card PC and the second accommodating shelf 134 contains a new probe card PC, the pick-and-place component 140 takes the old probe card PC contained in the carrier 230 and places the old probe card PC in the first accommodating shelf 132. Then, the pick-and-place component 140 takes the new probe card PC contained in the second accommodating shelf 134 and places the new probe card PC in the carrier 230.

[0140] Please continue to refer to Fig.21 as well as Fig. 22 . In another usage scenario, after executing step S14, step S161 is executed. For example, when the probe card PC is accommodated in the carrier 230 of the probe tester 200, the pick-and-place component 140 takes the probe card PC accommodated in the carrier 230 and places the probe card PC in the first accommodating shelf 132. In some embodiments, when neither the first accommodating shelf 132 nor the second accommodating shelf 134 accommodates any probe card PC, the pick-and-place component 140 may also take the probe card PC accommodated in the carrier 230 and place the probe card PC in the first accommodating shelf 132 or the second accommodating shelf 134.

[0141] Please continue to refer to Fig.21 as well as Fig. 22 In another use scenario, after executing step S14, step S162 is executed. For example, when the second accommodating shelf 134 accommodates the probe card PC, the pick-and-place assembly 140 takes the probe card PC accommodated in the second accommodating shelf 134 and places the probe card PC in the carrier 230. In some embodiments, when the first accommodating shelf 132 accommodates the probe card PC, the pick-and-place assembly 140 may also take the probe card PC accommodated in the first accommodating shelf 132 and place the probe card PC in the carrier 230.

[0142] In an additional usage scenario, for example, when both the first accommodating shelf 132 and the second accommodating shelf 134 accommodate new probe cards PC, the pick-and-place assembly 140 takes the new probe card PC accommodated in the first accommodating shelf 132 and places it in the carrier 230. Then, the control element CE controls the transport carrier 110 to go to a target position adjacent to another probe tester 200, and the pick-and-place assembly 140 takes the new probe card PC accommodated in the second accommodating shelf 134 and places it in another carrier 230 of another probe tester 200.

[0143] In another additional usage scenario, for example, when the carrier 230 and another carrier 230 respectively contain old probe cards PC, the pick-and-place assembly 140 takes the old probe card PC contained in the carrier 230 and places it in the first containing shelf 132. Then, the control element CE controls the transport carrier 110 to go to a target position adjacent to another probe tester 200, and the pick-and-place assembly 140 takes the old probe card PC contained in another carrier 230 of another probe tester 200 and places it in the second containing shelf 134.

[0144] From the above detailed description of the specific implementation methods of the present disclosure, it can be clearly seen that in the automatic probe card pick-up and placement device and its control method disclosed in the present disclosure, since the overlap position adjustment module is equipped with a sensing device, and the telescopic member is equipped with a floating component, the automatic probe card pick-up and placement device and the probe tester can be precisely engaged to facilitate the automatic loading and unloading of the probe card. In the automatic probe card pick-up and placement device disclosed in the present disclosure and its control method, since the first accommodating shelf, the second accommodating shelf and the pick-up and placement component can be horizontally separated by the actuation of the telescopic member, the automatic probe card pick-up and placement device can complete the replacement operation of the new probe card and the old probe card at one time, or can simultaneously install multiple new probe cards and simultaneously recycle multiple old probe cards. In the automatic probe card pick-up and placement device disclosed in the present disclosure and its control method, the automatic probe card pick-up and placement device can cooperate with a self-made front opening sh ipping box (Front Opening Sh ipping Box; FOSB) loading and unloading vehicle and the intelligent warehousing system under development to build an intelligent factory of the cyber-physical (Cyber-physical; CP) system, thereby realizing the comprehensive automation of the probe card loading and unloading system.

[0145] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the claims.

Claims

1. An automated probe card pick-and-place device, characterized in that: Include: Transport vehicles; at least one receiving shelf located above the transport carrier and configured to receive a probe card; An overlapping position adjustment module is disposed between the at least one accommodating shelf and the transport vehicle; A pick-and-place assembly, disposed above the at least one accommodating shelf and configured to pick-and-place the probe card; A plurality of telescopic members connected to the at least one accommodating shelf and connected between the pick-and-place assembly and the at least one accommodating shelf; as well as A control element is electrically or communicatively connected to the transport carrier, the overlap position adjustment module, the plurality of telescopic members, and the pick-and-place assembly, and the control element is configured to: Controlling the transport vehicle to move to a target position adjacent to the needle detection machine; Driving the overlap position adjustment module to calibrate the relative positions of the at least one accommodating shelf and the pick-and-place assembly with respect to the needle measuring machine; Actuating the plurality of telescopic members to move the at least one accommodating shelf and the pick-and-place assembly toward and away from the needle testing machine; as well as The pick-and-place assembly is actuated to pick up and place the probe card accommodated in the at least one accommodating shelf or the carrier of the probe tester.

2. The automated probe card pick-and-place device according to claim 1, wherein: The at least one accommodating shelf further comprises: A first accommodating shelf is disposed on the overlapping position adjustment module; and The second accommodating shelf is movably located between the first accommodating shelf and the pick-and-place assembly.

3. The automated probe card pick-and-place device according to claim 2, wherein: The multiple telescopic members are further connected between the first accommodating shelf and the second accommodating shelf and actuate the second accommodating shelf to move toward and away from the first accommodating shelf, and the second accommodating shelf and the first accommodating shelf are separated from each other in a direction parallel to the actuation direction of the multiple telescopic members.

4. The automated probe card pick-and-place device according to claim 3, characterized in that: The overlapping position adjustment module includes a lateral displacement component, and the lateral displacement component actuates the at least one accommodating shelf to move along a direction perpendicular to the actuation direction of the plurality of telescopic members.

5. The automated probe card pick-and-place device according to claim 1, characterized in that: The overlapping position adjustment module includes a horizontal adjustment component, and the horizontal adjustment component actuates the at least one accommodating shelf to swing relative to the transport carrier.

6. The automated probe card pick-and-place device according to claim 5, characterized in that: The level adjustment component further comprises: Pedestal; The movable part is connected to the base and comprises a connecting plate connected to the at least one accommodating shelf and a swing block connected to the connecting plate, wherein the swing block has an arc-shaped slide groove; At least one rolling element is pivotally connected to the base and connected to the arc-shaped slide groove, so that the swing block can be slidably connected to the base; as well as An actuator actuates the movable portion to make the movable portion swing relative to the base.

7. The automated probe card pick-and-place device according to claim 1, characterized in that: Further included are a plurality of sensing devices configured to emit and sense light.

8. The automated probe card pick-and-place device according to claim 1, wherein: The overlapping position adjustment module includes a rotation adjustment component, and the rotation adjustment component causes the at least one accommodating shelf to rotate with the center of the rotation adjustment component as the center of the circle.

9. The automated probe card pick-and-place device according to claim 1, wherein: It further comprises at least one first positioning shaft disposed on the plurality of telescopic members, and the at least one first positioning shaft is configured to be combined with a positioning sleeve of the needle detection machine.

10. The automated probe card pick-and-place device according to claim 9, characterized in that: The overlapping position adjustment module includes a plurality of floating components connected to the at least one accommodating shelf, each of the plurality of floating components includes a plurality of sliders stacked on each other, and the plurality of sliders include a first track extending along a first direction and a second track extending along a second direction perpendicular to the first direction.

11. The automated probe card pick-and-place device according to claim 9, characterized in that: The overlapping position adjustment module further includes a plurality of locking structures, and the plurality of locking structures are configured to fix the at least one accommodating shelf to the overlapping position adjustment module and configured to enable the at least one accommodating shelf to be movable relative to the overlapping position adjustment module.

12. The automated probe card pick-and-place device according to claim 11, characterized in that: Each of the plurality of locking structures comprises a sleeve member connected to the at least one accommodating shelf and a second positioning shaft disposed on the overlapping position adjustment module and corresponding to the sleeve member.

13. A control method for controlling an automated probe card pick-and-place device, characterized in that: The automated probe card pick-and-place device comprises a transport carrier, a first accommodating shelf and a second accommodating shelf located above the transport carrier, a lap position adjustment module connected between the first accommodating shelf and the transport carrier, a pick-and-place assembly located above the second accommodating shelf, and a plurality of telescopic members connected between the first accommodating shelf and the second accommodating shelf and between the second accommodating shelf and the pick-and-place assembly. The control method comprises: Controlling the transport vehicle to move to a target position adjacent to the needle detection machine; Driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly with respect to the needle measuring machine; Actuating the multiple telescopic members to move the second accommodating shelf and the pick-and-place assembly, so that the second accommodating shelf and the first accommodating shelf are separated from each other in a direction parallel to the actuation direction of the multiple telescopic members; as well as The pick-and-place assembly is actuated to pick up and place a probe card accommodated in the first accommodating shelf, the second accommodating shelf or the carrier of the probe tester.

14. The control method according to claim 13, characterized in that: The step of actuating the plurality of telescopic members to move the second accommodating shelf and the pick-and-place assembly causes the pick-and-place assembly and the second accommodating shelf to be separated from each other.

15. The control method according to claim 13, characterized in that: The step of driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf, and the pick-and-place assembly relative to the needle measuring machine further includes: Actuating the horizontal adjustment component of the overlap position adjustment module so that the bearing surface of the first accommodating shelf and the bearing surface of the second accommodating shelf connected to the horizontal adjustment component are parallel to the top surface of the needle measuring machine; Actuating the rotation adjustment component of the overlap position adjustment module so that the first accommodating shelf, the second accommodating shelf and the pick-and-place component connected to the rotation adjustment component rotate with the center of the rotation adjustment component as the center of the circle; as well as Actuating the lateral displacement component of the overlapping position adjustment module causes the first accommodating shelf, the second accommodating shelf and the pick-and-place component connected to the lateral displacement component to move laterally relative to the needle measuring machine.

16. The control method according to claim 15, characterized in that: The horizontal adjustment component further includes a connecting plate connecting the first accommodating shelf, the second accommodating shelf and the pick-and-place component, and the step of actuating the horizontal adjustment component of the overlapping position adjustment module makes the connecting plate parallel to the top surface of the probe machine.

17. The control method according to claim 15, characterized in that: The automated probe card pick-and-place device further includes two sensing devices configured to emit and sense light, the probe tester further includes two reference positioning plates disposed on the top surface of the probe tester and corresponding to the two sensing devices, and the step of driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly relative to the probe tester further includes: The two sensing devices are driven to emit the light toward the two reference positioning plates.

18. The control method according to claim 17, characterized in that: The step of actuating the rotation adjustment component of the overlapping position adjustment module makes the two sensing devices sense the same distance value of the light reflected from the two reference positioning plates.

19. The control method according to claim 17, characterized in that: The step of actuating the lateral displacement assembly of the overlapping position adjustment module enables the light emitted by the two sensing devices to be respectively aligned with the two positioning rods of the two reference positioning plates.

20. The control method according to claim 13, characterized in that: The automated probe card picking and placing device further includes at least one first positioning axis disposed on the multiple telescopic parts, the probe card testing machine further includes at least one positioning sleeve corresponding to the at least one first positioning axis, and the step of actuating the multiple telescopic parts to move the second accommodating shelf and the picking and placing component enables the at least one first positioning axis to be combined with the at least one positioning sleeve.

21. The control method according to claim 20, characterized in that: The overlapping position adjustment module further includes a plurality of locking structures, and the step of actuating the plurality of telescopic members to move the second storage shelf and the pick-and-place assembly enables the first storage shelf to be fixed to the overlapping position adjustment module through the plurality of locking structures or to be movable relative to the overlapping position adjustment module.

22. The control method according to claim 21, characterized in that: The step of actuating the plurality of telescopic members to move the second accommodating shelf and the pick-and-place assembly enables the first accommodating shelf to be movable relative to the overlapping position adjustment module when the second accommodating shelf and the pick-and-place assembly move toward the carrier of the probe testing machine.

23. The control method according to claim 21, characterized in that: The step of actuating the plurality of telescopic members to move the second accommodating shelf and the pick-and-place assembly enables the first accommodating shelf to be fixed to the overlapping position adjustment module when the second accommodating shelf and the pick-and-place assembly move away from the carrier of the probe testing machine.

24. The control method according to claim 13, characterized in that: The step of actuating the pick-and-place assembly takes the probe card contained in the carrier and places the probe card in the first containing shelf.

25. The control method according to claim 13, characterized in that: The step of actuating the pick-and-place assembly takes the probe card contained in the second containing shelf and places the probe card in the carrier.

26. The control method according to claim 13, characterized in that: The carrier accommodates a first probe card, the second accommodating shelf accommodates a second probe card, and the step of actuating the pick-and-place assembly further includes: Taking the first probe card contained in the carrier and placing the first probe card in the first containing shelf; and After placing the first probe card in the first accommodating shelf, taking out the second probe card accommodated in the second accommodating shelf and placing the second probe card in the carrier.

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