Test method and mainboard

Abstract

The invention provides a test method and a mainboard. The method is applied to a mainboard to be tested, the mainboard at least comprises a first connecting part and a radio frequency amplifier, and when the mainboard is tested, the first connecting part is connected with a second connecting part of a test instrument; the method comprises the following steps: determining the power of a first signal and the power of a second signal based on the first signal and the second signal which are sent by the test instrument and at least pass through the second connecting part and the first connecting part; wherein the power of the first signal is different from that of the second signal; according to the power of the first signal and the power of the second signal, abnormal detection is carried out on connection of the first connection part and the second connection part, and a detection result is obtained; and when the detection result represents that the connection is abnormal, stopping increasing the input power of the radio frequency amplifier.

Description

Technical Field

[0001] The present application relates to testing technology, including but not limited to testing methods and motherboards. Background Art

[0002] During the production process of mobile terminal production lines, the motherboard needs to be calibrated and the RF performance tested. During the calibration process, the infinite gain index (Radio Gain Index, RGI) of different power levels of the RF transceiver (Transceiver) needs to be scanned to obtain the corresponding relationship between RGI and the output power of the RF transceiver. The output power of the RF transceiver is the input power of the RF amplifier (Power Amplifier, PA). During the RF performance test, the performance of each RF path at the calibrated board level needs to be tested. During the calibration and comprehensive test of the motherboard, it is necessary to increase the input power of the RF amplifier based on the output power of the RF amplifier obtained based on the measurement instrument test so that the output power of the RF amplifier reaches the target power. However, this process may cause the RF amplifier to burn out. Summary of the invention

[0003] In view of this, the testing method and mainboard provided in the present application can prevent the input power of the RF amplifier from exceeding the input power that the RF amplifier can withstand, thereby preventing the RF amplifier from being burned.

[0004] According to one aspect of an embodiment of the present application, a testing method is provided, the method being applied to a mainboard to be tested, the mainboard comprising at least a first connection portion and a radio frequency amplifier, the first connection portion being connected to a second connection portion of a testing instrument when the mainboard is tested; the method comprising: determining the power of the first signal and the power of the second signal based on a first signal and a second signal sent by the testing instrument and passing through at least the second connection portion and the first connection portion; wherein the power of the first signal and the power of the second signal are different; performing an abnormality detection on the connection between the first connection portion and the second connection portion based on the power of the first signal and the power of the second signal to obtain a detection result; and stopping increasing the input power of the radio frequency amplifier when the detection result indicates that the connection is abnormal.

[0005] According to one aspect of an embodiment of the present application, a mainboard is provided, comprising: a first connection part and a radio frequency amplifier, wherein the first connection part of the mainboard is connected to the second connection part of a test instrument during testing; the mainboard further comprises at least: a power measurement module, configured to determine the power of the first signal and the power of the second signal based on a first signal and a second signal sent by the test instrument and passing through at least the second connection part and the first connection part; an abnormality detection module, configured to perform abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the power of the second signal, and obtain a detection result; and a control module, configured to stop increasing the input power of the radio frequency amplifier when the detection result indicates that the connection is abnormal.

[0006] According to one aspect of an embodiment of the present application, an electronic device is provided, which includes at least a power module and a main board, wherein the power module is used to supply power to the main board; and the main board is used to implement the method provided in the embodiment of the present application.

[0007] According to one aspect of an embodiment of the present application, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method provided in the embodiment of the present application is implemented.

[0008] In the embodiment of the present application, the first connection part of the mainboard is connected to the second connection part of the test instrument, and the mainboard performs abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the second signal sent by the test instrument and passing through at least the second connection part and the first connection part. If the connection is abnormal, the input power of the RF amplifier is stopped from being increased; in this way,

[0009] Before increasing the input power of the RF amplifier, the connection between the first connection part and the second connection part is detected for abnormality. If the connection is abnormal, it indicates that the output power of the RF amplifier measured based on the test instrument is less than the actual output power of the RF amplifier. In this case, even if the actual output power of the RF amplifier reaches the target power, the input power of the RF amplifier will continue to increase. If the input power of the RF amplifier increases to exceed the input power that the RF amplifier can withstand, the RF amplifier will be burned. In an embodiment of the present application, in the case of an abnormal connection between the first connection part and the second connection part, regardless of whether the output power of the RF amplifier reaches the target power, the input power of the RF amplifier is stopped from being increased. This can prevent the input power of the RF amplifier from exceeding the input power that the RF amplifier can withstand, thereby preventing the RF amplifier from being burned.

[0010] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solution of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0013] Figure 1 A schematic diagram of calibrating and comprehensively testing a mainboard using a test fixture provided in an embodiment of the present application;

[0014] Figure 2 A schematic diagram of a production line test process provided in an embodiment of the present application;

[0015] Figure 3 A schematic diagram of the implementation flow of the test method provided in the embodiment of the present application;

[0016] Figure 4 A schematic diagram of the structure of the mainboard provided in the embodiment of the present application;

[0017] Figure 5A A schematic diagram of the structure of the mainboard provided in the embodiment of the present application;

[0018] Figure 5B A schematic diagram of the structure of the mainboard provided in the embodiment of the present application;

[0019] Figure 5C A schematic diagram of the structure of the mainboard provided in the embodiment of the present application;

[0020] Figure 6 A schematic diagram of register configuration provided in an embodiment of the present application;

[0021] Figure 7 A schematic diagram of the implementation flow of another testing method provided in an embodiment of the present application;

[0022] Figure 8 A schematic diagram of the mainboard structure provided in the embodiment of the present application;

[0023] Fig. 9 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0026] In the following description, reference is made to “some embodiments”, “this embodiment”, “embodiments of the present application” and examples, etc., which describe a subset of all possible embodiments, but it can be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0027] During the production process of mobile terminal production line, the motherboard needs to be calibrated and the RF performance tested. During the calibration process, the RGI of different power levels of the RF transceiver needs to be scanned to obtain the corresponding relationship between RGI and the output power of the RF transceiver. The output power of the RF transceiver is the input power of the RF amplifier. During the RF performance test, the performance of each RF path at the calibrated board level needs to be tested. Usually, the production line will use special test fixtures to calibrate and comprehensively test the motherboard. Figure 1 A schematic diagram of calibrating and comprehensively testing a mainboard using a test fixture provided in an embodiment of the present application.

[0028] like Figure 1 As shown, when the test fixture is used for calibration and comprehensive testing, the test fixture and the mainboard are directly connected to the RF path through the mechanical fastening between the RF test probe (an example of the second connection part) and the RF test socket (an example of the first connection part). When the fixture is pressed together, board-level calibration and comprehensive testing are performed. When the test fixture is in good contact (an example of no abnormality in the connection between the first connection part and the second connection part), the RF test probe on the fixture and the RF test socket have a good contact standing wave ratio (an example of standing wave ratio), the contact impedance is continuous, and the connection insertion loss between the first connection part and the second connection part is small. At this time, normal calibration and comprehensive testing can be performed. Since the RF test probe on the fixture and the RF test socket are mechanically fastened, it is inevitable that there will be problems such as poor fastening or fixture wear (an example of abnormal connection between the first connection part and the second connection part) leading to deterioration of contact impedance. When the RF test probe and the RF test socket have poor fastening contact (an example of abnormal connection between the first connection part and the second connection part), the contact standing wave ratio deteriorates, the impedance changes suddenly, and the connection insertion loss between the first connection part and the second connection part is large.

[0029] Figure 2 A schematic diagram of the production line test process provided in the embodiment of the present application, such as Figure 2 As shown, if the connection loss Loss between the first connection part and the second connection part is large, the following will occur during the board-level calibration or comprehensive test of the mainboard:

[0030] P T_OUT +Gain-Loss<P expect (1);

[0031] Among them, P T_OUT is the output power of the RF transceiver, Gain is the gain of the RF amplifier, Loss is the connection loss between the first connection part and the second connection part, P expect The target power that the test instrument expects the RF amplifier to output.

[0032] At this time, if the output power of the RF amplifier measured by the test instrument does not reach the target power, the test instrument sends a command to the central processing unit (CPU) of the mainboard through the controller to control the RGI inside the RF transceiver to increase. The RGI value of the RF transceiver determines the output power of the RF transceiver. The output power P of the RF transceiver T_OUT That is the input power P of the RF amplifier in , when the RGI of the RF transceiver increases to a certain level, then:

[0033] P in_max +Gain=P Max_out (2);

[0034] Among them, P in_max is the maximum input power that the RF amplifier can withstand. If the input power of the RF amplifier is greater than P in_max , the RF amplifier may burn out during the process of amplifying the power. Max_out It is the maximum output power that the RF amplifier can withstand.

[0035] According to formula (2), as the RGI of the RF transceiver increases, the input power of the RF transceiver reaches the maximum input power that the RF amplifier can withstand, and the output power of the RF amplifier has reached its limit. If the input power of the RF amplifier continues to increase, the RF amplifier will be burned. However, due to the large physical contact insertion loss between the first connection part and the second connection part, the output power of the RF amplifier measured by the measuring instrument still cannot reach the expected power of the test instrument. At this time, the controller will send an instruction to control the RGI of the transceiver to continue to increase, that is, P T_OUT Further increase, when P T_OUT >P in_maxhour,

[0036] P in_max +Gain>P Max_out (3);

[0037] At this time, when the power amplifier is amplifying the input signal, the RF amplifier will be burned out because the input power of the RF amplifier exceeds the maximum input power that the RF amplifier can withstand, or the output power of the RF amplifier exceeds the maximum output power that the RF amplifier can withstand.

[0038] In addition, if the output power of the RF amplifier in the mainboard cannot be accurately measured, it may cause an increase in the error rate of production line calibration and comprehensive testing, thereby affecting the production efficiency of the production line.

[0039] Based on this, an embodiment of the present application provides a testing method, which is applied to a motherboard to be tested, wherein the motherboard includes at least a first connecting part and a radio frequency amplifier, and when testing the motherboard, the first connecting part is connected to the second connecting part of the testing instrument.

[0040] Figure 3 A schematic diagram of the implementation flow of the test method provided in the embodiment of the present application is shown in FIG. Figure 3 As shown, the method may include the following steps 301 to 303:

[0041] Step 301, based on a first signal and a second signal sent by the test instrument and passing through at least the second connection part and the first connection part, determine the power of the first signal and the power of the second signal; wherein the power of the first signal and the power of the second signal are different;

[0042] Step 302, performing an abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the power of the second signal to obtain a detection result;

[0043] Step 303: When the detection result indicates that the connection is abnormal, stop increasing the input power of the radio frequency amplifier.

[0044] In the embodiment of the present application, the first connection part of the mainboard is connected to the second connection part of the test instrument, and the mainboard performs abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the second signal sent by the test instrument and passing through at least the second connection part and the first connection part. If the connection is abnormal, the input power of the RF amplifier is stopped from being increased; in this way,

[0045] Before increasing the input power of the RF amplifier, an abnormality detection is performed on the connection between the first connection part and the second connection part. If the connection is abnormal, it indicates that the output power of the RF amplifier measured based on the test instrument is less than the actual output power of the RF amplifier. On the one hand, the abnormal connection causes the measured output power of the RF amplifier to be inaccurate; on the other hand, even if the actual output power of the RF amplifier reaches the target power, the input power of the RF amplifier will continue to increase. If the input power of the RF amplifier increases to exceed the input power that the RF amplifier can withstand, the RF amplifier will be burned. In an embodiment of the present application, when the connection between the first connection part and the second connection part is abnormal, the input power of the RF amplifier is stopped from being increased regardless of whether the output power of the RF amplifier reaches the target power. This can prevent the input power of the RF amplifier from exceeding the input power that the RF amplifier can withstand, thereby preventing the RF amplifier from being burned. On the other hand, it can avoid erroneous measurement of the output power of the RF amplifier.

[0046] The following describes further optional implementations and related terms of each of the above steps.

[0047] In step 301, based on a first signal and a second signal output by the test instrument and passing through at least the second connection part and the first connection part, the power of the first signal and the power of the second signal are determined; wherein the power of the first signal and the power of the second signal are different.

[0048] Figure 4 A schematic diagram of the connection relationship between the module in the mainboard, the second connection part and the test instrument provided in the embodiment of the present application, such as Figure 4 As shown, the main board also includes a radio frequency transceiver module and a radio frequency amplification module. The radio frequency transceiver module includes a radio frequency transceiver and a power measurement module. The radio frequency amplification module includes a radio frequency amplifier and a bidirectional coupler.

[0049] In the embodiment of the present application, the working state of the bidirectional coupler is not limited. The bidirectional coupler can work in a forward coupling state or a reverse coupling state.

[0050] In some embodiments, when the bidirectional coupler operates in a forward coupling state, it can receive a signal output by the RF amplifier, perform power distribution on the signal output by the RF amplifier, and then couple signals of different powers into a test instrument and a power test module; in other embodiments, when the bidirectional coupler operates in a reverse coupling state, it can receive a signal output by the test instrument, perform power distribution on the signal output by the test instrument, and then couple signals of different powers into the RF amplifier and a power test module.

[0051] In some embodiments, the power of the first signal and the power of the second signal may be determined based on the first signal and the second signal output by the test instrument and passing through the second connection part, the first connection part, and the bidirectional coupler.

[0052] In some embodiments, Figure 4 As shown, when an abnormality detection is performed on the connection between the first connecting part and the second connecting part, the test instrument outputs two signals successively at different times within a preset time. After the two signals pass through the first connecting part and the second connecting part and the bidirectional coupler, one of the output signals is called the first signal and the other signal is called the second signal.

[0053] In some embodiments, the first signal has the same frequency as the second signal, and the power of the first signal is different from the power of the second signal.

[0054] For determining the power of the first signal and the second signal, in some embodiments, the power measurement module sequentially receives the first signal and the second signal output by the bidirectional coupler, and performs power measurement on the received first signal and the second signal to obtain the power of the first signal and the power of the second signal.

[0055] When performing abnormality detection on the connection between the first connecting part and the second connecting part, in some embodiments, the mainboard can determine the standing wave ratio of the first signal and the second signal based on the power of the first signal and the power of the second signal, and perform abnormality detection on the connection based on the standing wave ratio to obtain the detection result.

[0056] In some embodiments, the standing wave ratio is calculated as follows:

[0057] SWR=(1+K) / (1-K) (4);

[0058] Wherein, SWR is the standing wave ratio; K is the reflection coefficient, K=(P1-P2) / (P1+P2); P1 is the power of the first signal, and P2 is the power of the second signal.

[0059] Furthermore, in the embodiments of the present application, the manner of detecting abnormalities in the connection is not limited; in some embodiments, the mainboard determines that the standing wave ratio is greater than a first threshold, and the detection result obtained is that the connection is abnormal; wherein the first threshold can be pre-set according to actual needs, and exemplarily, the first threshold is 1.5.

[0060] In other embodiments, the mainboard controls the test instrument to send the first signal and the second signal N times based on determining that the standing wave ratio is greater than a first threshold; wherein N is greater than or equal to 1; determines the standing wave ratio of the first signal and the second signal received each time; and based on determining that the number of standing wave ratios greater than the first threshold among the N standing wave ratios is greater than or equal to a second threshold, the detection result obtained is the connection abnormality.

[0061] Exemplarily, the process of performing abnormality detection on the mainboard based on N standing wave ratios is as follows: based on determining that the standing wave ratio is greater than a first threshold, the mainboard sends a first signal to the test instrument, wherein the first signal is used to instruct the test instrument to send the first signal and the second signal N times; the mainboard receives the first signal and the second signal N times, and the mainboard determines the standing wave ratio of the first signal and the second signal received each time, and based on determining that the number of standing wave ratios greater than the first threshold among the N standing wave ratios is greater than or equal to a second threshold, the mainboard obtains the detection result of the connection abnormality.

[0062] It can be understood that in the embodiment of the present application, the abnormality detection is not limited to being performed based on the standing wave ratio of the first signal and the second signal sent for the first time by the test instrument. The mainboard can also control the test instrument to send the first signal and the second signal N times, and perform abnormality detection based on the standing wave ratio of the first signal and the second signal received N times; in this way, the number of standing wave ratios on which the abnormality detection is based is increased, which is beneficial to improving the accuracy of abnormality detection.

[0063] In some embodiments, before determining the power of the first signal and the power of the second signal, and / or before determining the standing wave ratio of the first signal and the second signal received each time, the method further includes: calibrating the power measurement module.

[0064] It can be understood that the power measurement module is used to determine the power of the first signal and the power of the second signal received for the first time; when determining the standing wave ratio of the first signal and the second signal received N times, the power measurement module is also used to determine the power of the first signal and the second signal received each time. In this way, before determining the power of the first signal and the power of the second signal, and / or before determining the standing wave ratio of the first signal and the second signal received each time, the power measurement module is calibrated, which not only ensures the accuracy of the first determination of the standing wave ratio, but also ensures the accuracy of the subsequent N determinations of the standing wave ratio.

[0065] Regarding calibration of the power measurement module, further, in some embodiments, the mainboard determines the second output power of the fourth signal output by the RF amplifier based on the first output power of the fourth signal output by the RF transceiver in the mainboard and the gain of the RF amplifier; and calibrates the power measurement module based on the second output power and the third output power of the fourth signal measured by the power measurement module.

[0066] In some embodiments, the first output power can be obtained by looking up the RGI value in the RF transceiver. For the specific implementation of calibrating the power measurement module, exemplarily, the mainboard can adjust the working parameters of the power measurement module according to the second output power, so that the third output power measured by the power measurement module after adjustment is the same as the second output power.

[0067] It can be understood that in the above-mentioned process of calibrating the power measurement module, no external devices other than the mainboard are involved, so the test mainboard does not need to exchange information with external devices, which is beneficial to improving the convenience of calibration.

[0068] In some embodiments, the frequency of the first signal, the frequency of the second signal, and the frequency of the fourth signal are the same.

[0069] It can be understood that there are multiple RF paths in the mainboard, each RF path corresponds to an RF frequency band, and the frequency of the first signal, the frequency of the second signal and the frequency of the fourth signal are the same. In other words, the RF frequency band in which the first signal is located, the RF frequency band in which the second signal is located and the RF frequency band in which the fourth signal is located are the same.

[0070] In some embodiments, the abnormality detection method and the power measurement module calibration method for the connection between the first connection part and the second connection part corresponding to each radio frequency band are the same.

[0071] For the case where there is no abnormality in the connection between the first connection part and the second connection part, in some embodiments, when the detection result indicates that there is no abnormality in the connection, the mainboard obtains the power of the third signal output by the RF amplifier and passing through at least the first connection part and the second connection part measured by the test instrument; based on the power of the third signal, the input power of the RF amplifier is increased; and based on determining that the power of the third signal output by the RF amplifier reaches the target power after the input power of the RF amplifier is increased, it is determined that the mainboard has passed the target power requirement test.

[0072] It can be understood that before the target power requirement test is performed on the mainboard, the connection between the first connection part and the second connection part is detected for abnormalities. Only when there is no abnormality in the connection is the mainboard tested accordingly, rather than performing the target power requirement test on the mainboard without performing an abnormality detection. In this way, it is ensured that the output power of the RF amplifier tested by the test instrument matches the actual output power of the RF amplifier, or the difference is not much, thereby ensuring the accuracy of the test results.

[0073] In some embodiments, the frequency of the first signal, the frequency of the second signal, and the frequency of the third signal are the same.

[0074] In some embodiments, the frequency of the first signal, the frequency of the second signal and the frequency of the third signal are the same, that is, the RF frequency band of the first signal, the RF frequency band of the second signal and the RF frequency band of the third signal are the same.

[0075] In some embodiments, the target power requirement test method corresponding to each RF frequency band is the same, and the target power requirement test can be performed on the RF amplified signal of each RF frequency band on the mainboard according to the test method of the embodiment of the present application.

[0076] It can be understood that the frequency of the first signal and the frequency of the second signal used for abnormal detection are the same as the frequency of the fourth signal used when calibrating the power measurement module, and the same as the frequency of the third signal used for the target power requirement test of the mainboard; this is beneficial to improving the accuracy of the target power requirement test in the frequency band where the third signal is located.

[0077] In some embodiments, the RGI of the RF transceiver can be limited through a non-volatile (NV) memory. When the RGI reaches the RGI value set in the NV memory, the transceiver RGI value will no longer be increased regardless of whether the RF amplifier output power reaches the target power. That is, the NV limitation makes the output power of the RF transceiver less than the maximum input power that the RF amplifier can withstand.

[0078] The above embodiment requires measuring the output power of the RF transceiver at different RGI values ​​in each frequency band in advance, and then determining the appropriate RGI limit value of the RF transceiver at different frequency bands through the link budget of the RF path at different frequency bands. In addition, due to the fluctuation of the output power of the RF transceiver and the gain of the back-end RF amplifier, the error rate of production line calibration and comprehensive measurement increases, affecting the production efficiency of the production line.

[0079] Based on this, an exemplary application of an embodiment of the present application in a practical application scenario will be described below.

[0080] Figure 5A , Figure 5B and Figure 5C Another structural schematic diagram of the mainboard provided in the embodiment of the present application, wherein: Figure 5B and Figure 5C for Figure 5A A partial enlarged view of the module in Figure 5A As shown, the main board at least includes a radio frequency transceiver module 501, a radio frequency amplifier module and a first connection part, the radio frequency transceiver module 501 at least includes a radio frequency transceiver and a power measurement module 5011, the radio frequency amplifier module includes a first radio frequency amplifier module 502 and a second radio frequency amplifier module 503, the first radio frequency amplifier module 502 and the second radio frequency amplifier module 503 both include radio frequency amplifiers and bidirectional couplers; wherein, the first radio frequency amplifier module 502 includes a bidirectional coupler 5021, and the second radio frequency amplifier module 503 includes a bidirectional coupler 5031. The frequency band ranges of the output signals supported by different radio frequency amplifier modules are different.

[0081] The technical solution uses the feedback receiver (FBRX) input port of the radio frequency transceiver to perform reverse detection on a bidirectional coupler in a radio frequency amplification module to detect the standing wave ratio of the radio frequency amplifier output port.

[0082] In some embodiments, the FBRX input port (FBRX_in) transmits the received first signal and the second signal to a power measurement module.

[0083] As shown in Figure 5, the dotted line is the connection topology between the RF amplifier module and the coupler port inside the RF amplifier module and the FBRX_in port of the RF transceiver. This port can detect the output power of the RF amplifier module and can also detect the standing wave ratio of the channel. The FBRX_in port performs power detection at intervals to achieve power control, so a channel standing wave ratio detection can be inserted between two power detection antennas. In the embodiment of the present application, the coupler inside the RF amplifier module is a bidirectional coupler, and the reverse coupling function can be realized by configuring the internal register of the device. The register configuration is as follows: Figure 6 shown.

[0084] like Figure 6 As shown, ANT MB FWD & ANT HB FWD indicates that the bidirectional coupler is working in the forward coupling state, and ANT MB REV & ANT HB REV indicates that the bidirectional coupler is working in the reverse coupling state. The forward coupling state is used to detect the output power of the RF amplifier for power control, and the reverse coupling state is used to detect the standing wave ratio of the output port of the RF amplifier.

[0085] When the production line uses test fixtures and test instruments for calibration or comprehensive testing, the control device controls the RF transceiver to be in the standing wave detection state through instructions. The RF transceiver sends control instructions through the Mobile Industry Processor Interface (MIPI) / General Radio Frequency Control (GRFC) interface to configure the register values ​​of each RF amplifier module to make the internal coupler of each RF amplifier module work in the reverse coupling state. At the same time, control instructions are sent through MIPI or GRFC to connect different RF paths to achieve standing wave ratio detection of different frequency bands of each RF amplifier module, and then determine whether to perform subsequent calibration or comprehensive testing based on the size of the standing wave ratio. This can effectively avoid the problem of RF amplifier burning during calibration or comprehensive testing due to wear or fastening problems of the test fixture. At the same time, it can also monitor the status of the production line fixture, effectively discover fixture problems and replace the test fixture in time.

[0086] The present application provides a testing method. Figure 7 A schematic diagram of the implementation flow of the test method provided in the embodiment of the present application is shown in FIG. Figure 7 As shown, the test method includes the following steps 701 to 708:

[0087] Step 701, performing clock calibration (XO calibration) and FBRX calibration (an example of power test module calibration) on the mainboard;

[0088] In some embodiments, the above two calibrations are independent of external wiring.

[0089] Step 702, entering the standing wave ratio detection mode.

[0090] In some embodiments, after the XO and FBRX are calibrated, the control device controls the CPU and the RF transceiver to enter the standing wave detection mode. At this time, the RF transceiver sends a control instruction through MIPI / GRFC to configure the register value of each RF amplification module to make the internal coupler of each RF method module work in the reverse coupling state, and sends a control instruction through MIPI or GRFC to connect different RF paths to achieve standing wave ratio detection in different frequency bands.

[0091] Step 703 , determining whether the standing wave ratios of all paths are less than a first threshold value, if so, executing step 704 , otherwise executing step 707 .

[0092] In some embodiments, when the standing wave ratio of a certain RF path is detected to be less than 1.5, the RF path is determined to be in a normal state. When the standing wave ratio of the RF path is detected to be greater than 1.5, the RF path is determined to be abnormal and an error is reported and the calibration is continued. If the same machine is abnormal three times in a row, the machine is determined to be abnormal. Subsequent calibration is performed only when all RF paths are determined to be in a normal state.

[0093] Step 704, perform calibration or comprehensive testing.

[0094] In some embodiments, during the above-mentioned calibration or comprehensive test process, the test instrument needs to adjust the input power of the RF amplifier, that is, adjust the output power of the RF transceiver, that is, adjust the RGI of the RF transceiver, according to the measured power of the third signal sent by the RF amplifier and passing through the first connection part, the second connection part and the coupler, and record the measured power of the third signal sent by the RF amplifier and passing through at least the first connection part, the second connection part and the coupler, calculate the power of the third signal sent by the RF amplifier without passing through the coupler, and record the mapping relationship between the power and the corresponding RGI.

[0095] Step 705, determine whether the calibration or comprehensive test is passed. If yes, go to step 706, otherwise go to step 708;

[0096] Step 706, calibrate or test the next motherboard.

[0097] Step 707, play the re-stream, then execute step 701.

[0098] In some embodiments, if the standing wave ratio of a certain RF path is greater than a first threshold, a recurrent signal is sent to the control device, the signal being used to instruct the sending device to remove the motherboard from the production line. Then, at least the power measurement module in the motherboard is recalibrated.

[0099] Step 708, determine that the current main board is a bad board, and continue to calibrate or test the next main board, that is, execute steps 701 to 708 for the next main board.

[0100] It should be noted that although the steps of the method in the present application are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.; or, steps in different embodiments may be combined into a new technical solution.

[0101] Based on the above embodiments, the present application provides a mainboard. Figure 8A schematic diagram of the hardware structure of the motherboard provided in the embodiment of the present application; Figure 8 As shown, the main board 80 includes a first connection part 801 and a radio frequency amplifier 802. When the main board 80 is tested, the first connection part 801 is connected to the second connection part of the test instrument; the main board 80 also includes at least:

[0102] A power measurement module 803, configured to determine the power of the first signal and the power of the second signal based on the first signal and the second signal sent by the test instrument and passing through at least the second connection part and the first connection part;

[0103] an abnormality detection module 804, configured to perform abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the power of the second signal, and obtain a detection result;

[0104] The control module 805 is configured to stop increasing the input power of the RF amplifier when the detection result indicates that the connection is abnormal.

[0105] In some embodiments, the main board 80 also includes a determination module, and the standing wave determination module is configured to determine the standing wave ratio of the first signal and the second signal based on the power of the first signal and the power of the second signal; the abnormality detection module 804 is configured to determine the standing wave ratio of the first signal and the second signal based on the power of the first signal and the power of the second signal; based on the standing wave ratio, the connection is detected for abnormality to determine the detection result.

[0106] In some embodiments, the main board 80 also includes a control module, an abnormality detection module 804, which is configured to obtain the detection result of the connection abnormality based on determining that the standing wave ratio is greater than a first threshold; the control module is configured to control the test instrument to send the first signal and the second signal N times based on determining that the standing wave ratio is greater than the first threshold; wherein N is greater than or equal to 1; the standing wave determination module is configured to determine the standing wave ratio of the first signal and the second signal received each time; the abnormality detection module 804 is also configured to obtain the detection result of the connection abnormality based on determining that the number of standing wave ratios greater than the first threshold among the N standing wave ratios is greater than or equal to a second threshold.

[0107] In some embodiments, the main board 80 also includes an acquisition module, wherein the acquisition module is configured to obtain the power of a third signal output by the RF amplifier and passing through at least the first connection part and the second connection part measured by the test instrument when the detection result indicates that there is no abnormality in the connection; the control module is configured to increase the input power of the RF amplifier based on the power of the third signal; and the determination module is configured to determine that the main board has passed the target power requirement test based on determining that the power of the third signal output by the RF amplifier reaches the target power after the input power of the RF amplifier is increased.

[0108] In some embodiments, the frequency of the first signal, the frequency of the second signal, and the frequency of the third signal are the same.

[0109] In some embodiments, the main board 80 also includes a calibration module, and the calibration module is configured to, before determining the power of the first signal and the power of the second signal, and / or before determining the standing wave ratio of the first signal and the second signal received each time, the method also includes: calibrating the power measurement module; wherein the power measurement module is used to determine the power of the first signal and the power of the second signal.

[0110] In some embodiments, the calibration module is further configured to determine the second output power of the fourth signal output by the RF amplifier based on the first output power of the fourth signal output by the RF transceiver in the mainboard and the gain of the RF amplifier; and calibrate the power measurement module based on the second output power and the third output power of the fourth signal measured by the power measurement module.

[0111] In some embodiments, the frequency of the first signal, the frequency of the second signal, and the frequency of the fourth signal are the same.

[0112] In some embodiments, the mainboard 80 also includes a memory and a processor (not shown in the figure), the memory stores a computer program that can be executed on the processor, and the processor implements the steps in the method provided in the above embodiment when executing the program.

[0113] It should be noted that the memory is configured to store instructions and applications executable by the processor, and can also cache data to be processed or processed by various modules in the processor and the motherboard 80 (for example, image data, audio data, voice communication data, and video communication data), which can be implemented through flash memory (FLASH) or random access memory (Random Access Memory, RAM).

[0114] Fig. 9A schematic diagram of the structure of an electronic device provided in an embodiment of the present application, such as Fig. 9 As shown, the electronic device 90 at least includes a power module 901 and a main board 80, wherein the power module 901 is used to supply power to the main board 80; and the main board is used to implement the test method described in the embodiment of the present application.

[0115] The description of the above device embodiment is similar to the description of the above method embodiment, and has similar beneficial effects as the method embodiment. For technical details not disclosed in the device embodiment of the present application, please refer to the description of the method embodiment of the present application for understanding.

[0116] It should be noted that in the embodiments of this application Figure 8 The division of modules by the mainboard shown is schematic and is only a logical function division. There may be other division methods in actual implementation. In addition, each functional unit in each embodiment of the present application may be integrated into a processing unit, or may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units. It may also be implemented in the form of a combination of software and hardware.

[0117] It should be noted that in the embodiment of the present application, if the above-mentioned test method is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable the mainboard to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory (ROM), a disk or an optical disk. In this way, the embodiment of the present application is not limited to any specific combination of hardware and software.

[0118] An embodiment of the present application provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the test method provided in the above embodiment are implemented.

[0119] An embodiment of the present application provides a computer program product including instructions, which, when executed on a computer, enables the computer to execute the steps of the testing method provided in the above method embodiment.

[0120] It should be noted here that the description of the above storage medium and device embodiments is similar to the description of the above method embodiments, and has similar beneficial effects as the method embodiments. For technical details not disclosed in the storage medium, storage medium and device embodiments of this application, please refer to the description of the method embodiments of this application for understanding.

[0121] It should be understood that "one embodiment" or "an embodiment" or "some embodiments" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in one embodiment" or "in some embodiments" appearing throughout the specification may not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. The above-mentioned sequence numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments. The above description of each embodiment tends to emphasize the differences between the various embodiments, and the same or similar aspects can be referenced to each other. For the sake of brevity, this article will not repeat them.

[0122] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there may be three relationships. For example, object A and / or object B can represent three situations: object A exists alone, object A and object B exist at the same time, and object B exists alone.

[0123] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0124] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as: multiple modules or components can be combined, or can be integrated into another system, or some features can be ignored, or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or modules can be electrical, mechanical or other forms.

[0125] The modules described above as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules; they may be located in one place or distributed on multiple network units; some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0126] In addition, all functional modules in the embodiments of the present application may be integrated into one processing unit, or each module may be a separate unit, or two or more modules may be integrated into one unit; the above-mentioned integrated modules may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0127] A person skilled in the art can understand that all or part of the steps of implementing the above method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above method embodiment; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, etc., various media that can store program codes.

[0128] Alternatively, if the above-mentioned integrated unit of the present application is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application can essentially or in other words, the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for the mainboard to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROMs, magnetic disks or optical disks.

[0129] The methods disclosed in several method embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments.

[0130] The features disclosed in several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.

[0131] The features disclosed in several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.

[0132] The above is only an implementation method of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A testing method, characterized in that: The method is applied to a motherboard to be tested, the motherboard at least comprising a first connection portion and a radio frequency amplifier, and when testing the motherboard, the first connection portion is connected to a second connection portion of a testing instrument; the method comprises: Determine the power of the first signal and the power of the second signal based on the first signal and the second signal output by the test instrument and passing through at least the second connection part and the first connection part; wherein the power of the first signal and the power of the second signal are different; performing abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the power of the second signal to obtain a detection result; When the detection result indicates that the connection is abnormal, the increase of the input power of the radio frequency amplifier is stopped.

2. The method according to claim 1, characterized in that The performing abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the power of the second signal to obtain the detection result includes: Determining a standing wave ratio of the first signal to the second signal according to the power of the first signal and the power of the second signal; Based on the standing wave ratio, abnormality detection is performed on the connection to obtain the detection result.

3. The method according to claim 2, characterized in that The performing abnormality detection on the connection based on the standing wave ratio to obtain the detection result includes: Based on determining that the standing wave ratio is greater than a first threshold, the detection result obtained is that the connection is abnormal; or, based on determining that the standing wave ratio is greater than the first threshold, controlling the test instrument to send the first signal and the second signal N times; wherein N is greater than or equal to 1; Determine the standing wave ratio of the first signal and the second signal received each time; Based on determining that the number of standing wave ratios greater than the first threshold among the N standing wave ratios is greater than or equal to the second threshold, the detection result obtained is the connection abnormality.

4. The method according to any one of claims 1 to 3, characterized in that: The method further comprises: When the detection result indicates that there is no abnormality in the connection, obtaining power of a third signal output by the radio frequency amplifier and passing through at least the first connection portion and the second connection portion, which is measured by the test instrument; increasing the input power of the radio frequency amplifier based on the power of the third signal; Based on determining that the power of the third signal output by the RF amplifier reaches the target power after the input power of the RF amplifier is increased, it is determined that the mainboard passes the target power requirement test.

5. The method according to claim 4, characterized in that The frequency of the first signal, the frequency of the second signal, and the frequency of the third signal are the same.

6. The method according to claim 3, characterized in that: Before determining the power of the first signal and the power of the second signal, and / or before determining the standing wave ratio of the first signal and the second signal received each time, the method also includes: calibrating a power measurement module; wherein the power measurement module is used to determine the power of the first signal and the power of the second signal.

7. The method according to claim 6, characterized in that The calibrating the power measurement module includes: Determine a second output power of the fourth signal output by the RF amplifier based on a first output power of the fourth signal output by the RF transceiver in the mainboard and a gain of the RF amplifier; The power measurement module is calibrated based on the second output power and the third output power of the fourth signal measured by the power measurement module.

8. The method according to claim 7, characterized in that The frequency of the first signal, the frequency of the second signal, and the frequency of the fourth signal are the same.

9. A motherboard, characterized in that: The mainboard includes a first connection part and a radio frequency amplifier, wherein the first connection part is connected to the second connection part of the test instrument during the test; the mainboard also includes at least: a power measurement module configured to determine the power of the first signal and the power of the second signal based on the first signal and the second signal sent by the test instrument and passing through at least the second connection part and the first connection part; an abnormality detection module, configured to perform abnormality detection on the connection between the first connection part and the second connection part according to the power of the first signal and the power of the second signal, and obtain a detection result; The control module is configured to stop increasing the input power of the radio frequency amplifier when the detection result indicates that the connection is abnormal.

10. An electronic device, wherein: The electronic device comprises at least a power module and a main board, wherein the power module is used to supply power to the main board; and the main board is used to implement the method according to any one of claims 1 to 8.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 8 is implemented.

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