Wafer character OCR (Optical Character Recognition) equipment

Abstract

The invention relates to the technical field of wafer manufacturing, in particular to wafer character OCR (Optical Character Recognition) equipment. The first driving part and the second driving part are both loaded by the rack. Power sources for the wafer edge data pickup unit and the OCR recognition unit to execute translational motion are first driving parts, and the first driving parts and the wafer edge data pickup unit and the OCR recognition unit are oppositely arranged. The power source for the wafer bearing table to execute the planar motion is the second driving part. The wafer edge data pick-up unit can easily and effectively judge whether a wafer circle center and a notch thereof meet expected design requirements or not by picking up edge contour data of a wafer, the controller sends a control signal to the second driving part accordingly, the wafer bearing table can execute planar motion, and meanwhile, the wafer edge data pick-up unit can be used for driving the wafer bearing table to move. The controller synchronously sends a control signal to the wafer bearing table, and the wafer follows the wafer bearing table to perform a micro-speed circumferential rotation motion until the center and the gap of the wafer circle meet the expected design requirements, so that a subsequent OCR (Optical Character Recognition) unit can accurately and quickly recognize wafer characters.

Description

Technical Field

[0001] The invention relates to the technical field of wafer manufacturing, in particular to a wafer character OCR recognition device. Background Art

[0002] During the wafer production stage, it is necessary to read the OCR characters on them to know the character number on each wafer for subsequent traceability. In the past, the process usually involved manual input of OCR characters, which had disadvantages such as slow speed, low efficiency, and high error rate. In view of this, major equipment manufacturers have developed a series of wafer character OCR recognition equipment.

[0003] Take the first generation of wafer character OCR recognition equipment developed by our company a few years ago as an example. It is mainly composed of several parts including a frame, a wafer carrier, an OCR recognition unit and a power unit. Among them, the wafer carrier is carried by the frame and kept in a fixed position. It is used to receive the wafer transferred by the robot. The OCR recognition unit is arranged on one side of the wafer carrier and is directly driven by the power unit. When the wafer is settled relative to the wafer carrier and positioned, the power unit is started, and the OCR recognition unit gradually approaches the wafer carrier due to the driving force until the OCR recognition unit occupies the correct reading position relative to the wafer. However, after nearly a year of market testing, the equipment problems reported by users are mainly concentrated in the following aspects, specifically: the recognition accuracy of the OCR recognition unit is extremely poor, the recognition rate is extremely slow, and recognition errors often occur. The reason is that the OCR recognition technology mainly converts the text information in the image into an editable text format by scanning the image. In this process, the quality of the picked up image has a crucial impact on the recognition result. However, as far as the first generation of wafer character OCR recognition equipment is concerned, the wafer carrier only has the function of dropping the wafer, and does not have the pre-alignment function and circumferential micro-angle adjustment function, which results in the relative position of the centroid of the wafer after dropping and whether the phase angle of the notch meets the expected design requirements depends on the movement accuracy of the robot. However, due to the limitations of manufacturing technology and procurement costs, the movement accuracy of the robot is difficult to reach the sub-micron level, and the movement repeatability error is even more difficult to control, which makes it difficult for the OCR recognition unit to pick up high-quality wafer character images. Therefore, it is urgent for those skilled in the art to solve the above problems. Summary of the invention

[0004] Therefore, in view of the above existing problems and defects, the project development team of the present invention collected relevant information, conducted multiple evaluations and considerations, and the project development team conducted continuous experiments and modifications, which ultimately led to the emergence of the wafer character OCR recognition device.

[0005] In order to solve the above technical problems, the present invention relates to a wafer character OCR recognition device, including a frame, a wafer carrier, a wafer edge contour data pickup unit, an OCR recognition unit, a first drive unit and a second drive unit. The first drive unit and the second drive unit are both supported by the frame. The power source for the wafer edge data pickup unit and the OCR recognition unit to perform translational motion is the first drive unit, and the two are arranged opposite to each other in the left and right directions. The power source for the wafer carrier to perform planar motion is the second drive unit. When OCR recognition operation needs to be performed on the wafer, the wafer carrier receives the wafer transferred by the robot, and then the wafer carrier is started, and the wafer is able to perform circumferential rotation. During this process, the wafer edge data pickup unit completely obtains the edge contour data of the wafer, and the second drive unit is started to drive the wafer carrier to perform planar motion until the centroid of the wafer is adjusted to the expected design position. At the same time, the wafer continues to rotate circumferentially at a low speed under the action of the rotational torque from the wafer carrier until the wafer notch meets the expected design position. Subsequently, the first drive unit is started, and the wafer edge contour data pickup unit and the OCR recognition unit perform translational motion towards each other until the OCR recognition unit occupies the correct position relative to the wafer and the wafer characters can be recognized.

[0006] As a further improvement of the technical solution disclosed in the present invention, the main structure of the wafer edge contour data picking unit is a high-precision laser transmission sensor. The main structure of the OCR recognition unit is a wafer OCR character sensor.

[0007] As a further improvement of the technical solution disclosed in the present invention, the frame includes a base, a support frame and an outer cover shell. The outer cover shell covers the base directly above. The support frame is hidden in the cavity of the outer cover shell and is fixed to the base in a detachable manner.

[0008] As a further improvement of the technical solution disclosed in the present invention, a left-placed avoidance notch and a right-placed avoidance notch are simultaneously opened on the top wall of the outer cover shell, wherein the left-placed avoidance notch is used to allow the OCR recognition unit to freely perform translational movement and the wafer carrier to freely perform planar movement, while the right-placed avoidance notch is used to facilitate the wafer edge contour data picking unit to freely perform translational movement.

[0009] As a further improvement of the technical solution disclosed in the present invention, the first driving part is a screw rod left-right rotating linear guide electric module, which includes a first mounting frame, a first motor, a first screw rod, a first left-mounted bearing seat, a first right-mounted bearing seat, a first left-mounted slide and a first right-mounted slide. The first mounting frame is fixed as a whole with the frame. The first left-mounted bearing seat and the first right-mounted bearing seat can be detachably fixed on the first mounting frame, and cooperate to jointly bear the first screw rod. The first motor is used to drive the first screw rod to perform circumferential rotational motion, and it also uses the first mounting frame as an installation base. The first left-mounted slide used as an installation base by the OCR recognition unit and the first right-mounted slide used as an installation base by the wafer edge contour data picking unit are both mounted on the first screw rod. When the first motor is in the starting state, the first left-mounted slide and the first right-mounted slide perform opposite / backward displacement motion due to the action of the reverse driving force.

[0010] As a further improvement of the technical solution disclosed in the present invention, the second driving unit includes a first screw linear module and a second screw linear module. The first screw linear module directly loads the wafer carrier and is used to drive the wafer carrier to perform translational motion along the front-to-back direction. The second screw linear module is used to directly load the first screw linear module and is used to drive the first screw linear module together with the wafer carrier to perform translational motion along the left-right direction.

[0011] As a further improvement of the technical solution disclosed in the present invention, the first screw linear module includes a second mounting frame, a second screw, a front bearing seat, a rear bearing seat, an upper slide and a first synchronous belt transmission mechanism. The second mounting frame is supported by the second screw linear module. The front bearing seat and the rear bearing seat can be detachably fixed on the second mounting frame, and cooperate to jointly support the second screw. The first synchronous belt transmission mechanism is used to drive the second screw to perform circumferential rotational motion, and its structural body also uses the second mounting frame as an installation base. The upper slide used as an installation base by the wafer carrier is mounted on the second screw.

[0012] As a further improvement of the technical solution disclosed in the present invention, the second screw linear module includes a third mounting frame, a third screw, a second left-mounted bearing seat, a second right-mounted bearing seat, a lower slide and a second motor. The third mounting frame is placed on the top wall of the base, and is detachably connected to the base. The second left-mounted bearing seat and the second right-mounted bearing seat can be detachably fixed on the third mounting frame, and cooperate to jointly bear the third screw. The second motor is used to drive the third screw to perform circumferential rotational motion, and it also uses the third mounting frame as an installation base. The lower slide used as an installation base by the first screw linear module is mounted on the third screw.

[0013] As a further improvement of the technical solution disclosed in the present invention, the wafer carrier includes a load-bearing frame, a spindle, a wafer drop column, an encoder and a second synchronous belt transmission mechanism. The load-bearing frame is loaded by the second driving unit. The spindle uses the load-bearing frame as a mounting base, and it passes through the load-bearing frame longitudinally. The wafer drop column is used to drop and limit the wafer, and it is integrated with the spindle, and the two remain coaxial. The second synchronous belt transmission mechanism is used to drive the spindle to perform circumferential rotational motion, and its main structure also uses the load-bearing frame as a mounting base. The encoder is mounted on the spindle and performs a follow-up circumferential rotational motion.

[0014] As a further improvement of the technical solution disclosed in the present invention, the wafer carrying platform also includes a vacuum suction cup. The vacuum suction cup absorbs the wafer by means of negative pressure effect, and the vacuum suction cup is placed and fixed on the top wall of the wafer placement column.

[0015] In actual applications, when the wafer is transferred to the wafer carrier via a robot, the wafer carrier performs a circumferential rotational motion due to the rotational torque, and the wafer performs a follow-up circumferential rotational motion. At the same time, the wafer edge data picking unit gradually approaches the wafer carrier due to the driving force from the first driving unit. Then, the wafer edge data picking unit completely obtains the edge contour data of the wafer, and the controller determines whether the centroid and notch orientation of the wafer meet the expected requirements based on this. When it is determined that the center point position of the wafer does not meet the expected requirements, the second drive unit is started due to the control signal sent by the controller, and the wafer carrier is able to perform planar motion. At the same time, the wafer continues to follow the wafer carrier to perform micro-speed circumferential rotation motion, and in this process, the controller makes real-time judgments based on the edge contour data of the wafer acquired and continues to send control signals to the second drive unit and the wafer carrier until the center point of the wafer and the phase angle of the wafer notch meet the expected design requirements. Subsequently, the OCR recognition unit gradually approaches the wafer carrier due to the driving force from the first drive unit until it occupies the correct imaging position relative to the wafer, and the wafer characters can be accurately and quickly recognized.

[0016] After nearly a month of on-site trial operation, the results show that compared with the first-generation design, the wafer character OCR recognition device disclosed in the present invention can achieve at least the following beneficial technical effects in practical applications, specifically:

[0017] 1) The wafer edge data picking unit can easily and effectively determine whether the wafer center and its notch meet the expected design requirements by picking up the edge contour data of the wafer, and the controller sends a control signal to the second driving unit accordingly, so that the wafer carrier can perform planar motion. At the same time, the controller synchronously sends a control signal to the wafer carrier, and the wafer follows the wafer carrier to perform micro-speed circumferential rotation motion until the wafer center and its notch meet the expected design requirements, which is conducive to the subsequent OCR recognition unit to accurately and quickly recognize the wafer characters;

[0018] 2) Under the joint action of the wafer edge data picking unit and the second driving unit, the wafer carrier has the functions of wafer placement, pre-alignment and circumferential micro-angle adjustment, which is conducive to ensuring that the relative position of the centroid of the wafer after placement and the phase angle of the notch meet the expected design requirements, thereby effectively relaxing the requirements for the robot's motion accuracy and motion repeatability error;

[0019] 3) The wafer edge data pickup unit and the OCR recognition unit are arranged opposite to each other in the left and right directions, and both are driven by the same power source (i.e., the first driving unit). Therefore, under the premise that the design functions of the wafer edge data pickup unit and the OCR recognition unit can be fully utilized, the wafer character OCR recognition device has a simpler design structure, which is conducive to subsequent manufacturing implementation, and the overall manufacturing cost is relatively controllable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present invention.

[0022] Figure 2 It is also a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present invention (with the side panels belonging to the outer cover shell hidden).

[0023] Figure 3 It is a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present invention under a viewing angle (while hiding the supporting frame and the outer cover shell).

[0024] Figure 4 It is a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present invention under another viewing angle (while hiding the supporting frame and the outer cover shell).

[0025] Figure 5 It is a three-dimensional schematic diagram of a wafer carrying platform in the wafer character OCR recognition device disclosed in the present invention.

[0026] Figure 6 yes Figure 5 Front view of .

[0027] Figure 7 yes Figure 6 AA section view.

[0028] Figure 8 It is a three-dimensional schematic diagram of the first driving unit in the wafer character OCR recognition device disclosed in the present invention.

[0029] Fig. 9 yes Figure 8 Front view of .

[0030] Fig.10 It is a schematic diagram of the state after the wafer carrier and the second driving part in the wafer character OCR recognition device disclosed in the present invention are assembled (the wafer carrier is shown by double-dotted lines).

[0031] Fig.11 It is a three-dimensional schematic diagram of the second driving unit in the wafer character OCR recognition device disclosed in the present invention.

[0032] Fig.12 It is a three-dimensional schematic diagram of the first screw linear module in the wafer character OCR recognition device disclosed in the present invention.

[0033] Fig.13 It is a three-dimensional schematic diagram of the second screw linear module in the wafer character OCR recognition device disclosed in the present invention.

[0034] 1-frame; 11-base; 12-support frame; 13-outer cover; 131-left avoidance gap; 132-right avoidance gap; 2-wafer carrier; 21-load-bearing frame; 22-spindle; 23-wafer drop column; 24-encoder; 25-second synchronous belt transmission mechanism; 26-vacuum suction cup; 3-wafer edge profile data pickup unit; 31-high-precision laser transmission sensor; 4-OCR recognition unit; 41-wafer OCR character sensor; 5-first drive unit; 51-first mounting frame; 52-first motor; 53-first screw rod; 54 -first left bearing seat; 55-first right bearing seat; 56-first left slide; 57-first right slide; 6-second drive unit; 61-first screw linear module; 611-second mounting bracket; 612-second screw; 613-front bearing seat; 614-rear bearing seat; 615-upper slide; 616-first synchronous belt transmission mechanism; 62-second screw linear module; 621-third mounting bracket; 622-third screw; 623-second left bearing seat; 624-second right bearing seat; 625-lower slide; 626-second motor. DETAILED DESCRIPTION

[0035] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "left", "right", "up", "down", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0036] The following is a further detailed description of the present invention in conjunction with specific embodiments. Figure 1-Figure 4The three-dimensional schematic diagrams of the wafer character OCR recognition device disclosed in the present invention in different states are respectively shown. It can be seen that it is mainly composed of a frame 1, a wafer carrier 2, a wafer edge contour data pickup unit 3, an OCR recognition unit 4, a first drive unit 5 and a second drive unit 6. Among them, the first drive unit 5 and the second drive unit 6 are both supported by the frame 1. The power source for the wafer edge data pickup unit 3 and the OCR recognition unit 4 to perform translational motion is the first drive unit 5, and the two are arranged opposite to each other in the left and right directions. The power source for the wafer carrier 2 to perform planar motion is the second drive unit 6. When it is necessary to perform OCR recognition operation on the wafer, the wafer carrier 2 receives the wafer transferred by the robot, and then the wafer carrier 2 is started, and the wafer is able to perform circumferential rotation. During this process, the wafer edge data picking unit 3 completely obtains the edge contour data of the wafer, and the second drive unit 6 is started to drive the wafer carrier 2 to perform planar motion until the centroid of the wafer is adjusted to the expected design position. At the same time, the wafer continues to rotate circumferentially at a low speed under the action of the rotational torque from the wafer carrier 2 until the wafer notch meets the expected design position. Subsequently, the first drive unit 5 is started, and the wafer edge contour data picking unit 3 and the OCR recognition unit 4 perform translational motion towards each other until the OCR recognition unit 4 occupies the correct position relative to the wafer and the wafer characters are recognized.

[0037] The working principle of the wafer character OCR recognition equipment is roughly as follows: when the wafer is transferred to the wafer carrier 2 via the robot, the wafer carrier 2 performs a circumferential rotation motion due to the rotational torque, and the wafer performs a follow-up circumferential rotation motion. At the same time, the wafer edge data picking unit 3 gradually approaches the wafer carrier 2 due to the driving force from the first driving unit 5, and then, the wafer edge data picking unit 3 completely obtains the edge contour data of the wafer, and the controller determines whether the centroid and notch orientation of the wafer meet the expected requirements based on this. When it is determined that the center point position of the wafer does not meet the expected requirements, the second drive unit 6 is started due to the control signal sent by the controller, and the wafer carrier 2 is able to perform planar motion. At the same time, the wafer continues to follow the wafer carrier 2 to perform micro-speed circumferential rotation motion, and in this process, the controller makes real-time judgments based on the edge contour data of the wafer acquired and continues to send control signals to the second drive unit 6 and the wafer carrier 2 until the center point of the wafer and the phase angle of the wafer notch meet the expected design requirements. Subsequently, the OCR recognition unit 4 gradually approaches the wafer carrier 2 due to the driving force from the first drive unit 5 until it occupies the correct imaging position relative to the wafer, and the wafer characters can be accurately and quickly recognized.

[0038] In practical applications, the wafer character OCR recognition device disclosed in the present invention can achieve at least the following beneficial technical effects in practical applications, specifically:

[0039] 1) The wafer edge data picking unit 3 can easily and effectively determine whether the wafer center and its notch meet the expected design requirements by picking up the edge contour data of the wafer, and the controller sends a control signal to the second driving unit 6 accordingly, so that the wafer carrier 2 can perform planar motion. At the same time, the controller synchronously sends a control signal to the wafer carrier 2, and the wafer follows the wafer carrier 2 to perform a micro-speed circumferential rotation motion until the wafer center and its notch meet the expected design requirements, which is conducive to the subsequent OCR recognition unit 4 to accurately and quickly recognize the wafer characters;

[0040] 2) Under the joint action of the wafer edge data picking unit 3 and the second driving unit 6, the wafer carrier 2 has the functions of wafer placement, pre-alignment and circumferential micro-angle adjustment (the wafer carrier 2 has its own power to perform circumferential rotation), which is conducive to ensuring that the relative position of the centroid of the wafer after placement and the phase angle of the notch meet the expected design requirements, thereby effectively relaxing the requirements on the robot's motion accuracy and motion repeatability error;

[0041] Here, it is also necessary to emphasize that the wafer edge data picking unit 3 and the OCR recognition unit 4 are arranged opposite to each other in the left-right direction, and both are driven by the same power source (i.e., the first driving unit 5). Therefore, under the premise that the design functions of the wafer edge data picking unit 3 and the OCR recognition unit 4 can be fully utilized, the wafer character OCR recognition device has a simpler design structure, which is conducive to subsequent manufacturing implementation, and the overall manufacturing cost is relatively controllable.

[0042] It is known that according to common knowledge, the wafer edge profile data picking unit 3 can adopt a variety of design concepts to realize the picking of the wafer edge profile data. However, in this embodiment, a high-precision laser transmission sensor 31 is preferably used. The high-precision laser transmission sensor 31 includes a transmitter and a receiver. The transmitter is used to emit a laser beam, and the receiver is used to receive a light intensity signal. The wafer is placed between the transmitter and the receiver, which affects the normal transmission of the laser beam. The high-precision laser transmission sensor 31 uses a sampling frequency much higher than that of a traditional linear CCD camera. In the same time period, the number of sampling points around the edge of the wafer is increased, thereby improving the confirmation speed and confirmation accuracy of the wafer center. The wafer sampling data is determined by the step drop method to determine the initial estimated position of the lowest point of the notch. The high-precision laser transmission sensor 31 is used again to perform fine sampling of the notch edge in a small range, and the position of the lowest point of the wafer mouth is determined by the step drop method for the fine sampling data, and the sampling data in the wafer notch range is eliminated from the wafer edge sampling data. The least squares method is applied to the wafer edge sampling data after the notch is eliminated to fit the wafer center. In the process of picking up the edge profile data of the wafer, in addition to collecting the analog output signal of the high-precision laser transmission sensor 31, the controller also synchronously collects its Low digital output signal, and searches the Low digital output signal data. The inflection point from 1 to 0 is the starting point of the gap, and the inflection point from 0 to 1 is the end point of the gap, thereby clearly identifying the wafer gap.

[0043] In the rapidly developing semiconductor industry, accurate reading of wafer ID is a key link to ensure efficient and accurate production processes. In view of this, in the present embodiment, the main structure of the OCR recognition unit 4 is preferably a wafer OCR character sensor 41. The wafer OCR character sensor 41 integrates RGB three-color lighting technology. This design can not only effectively cope with various complex lighting environments, but also automatically adjust the light intensity and color combination according to the surface characteristics of the detected wafer characters, thereby ensuring that the clarity and contrast of the character image are optimal, laying a solid foundation for subsequent recognition processing. Furthermore, the wafer OCR character sensor 41 adopts Hejie's patented intelligent image algorithm. This series of sensors performs well in character recognition, especially for clearly printed characters, with a recognition rate of up to 99.99%. In addition, the wafer OCR character sensor 41 also has an intelligent code shift compensation function, which can automatically correct the character position offset caused by wafer movement or jitter to ensure that every reading is accurate.

[0044] Depend on Figure 1 , 2It can be clearly seen from the figure that the frame 1 is mainly composed of several parts such as a base 11, a support frame 12 and an outer cover shell 13. The outer cover shell 13 covers the top of the base 11, and is composed of a plurality of side panels and a top plate. The support frame 12 is hidden in the cavity of the outer cover shell 13, and is detachable to achieve fixation with the base 11. A left avoidance gap 131 and a right avoidance gap 132 are provided on the top plate at the same time, wherein the left avoidance gap 131 is used for the OCR recognition unit 4 to freely perform translational movement and for the wafer carrier 2 to freely perform planar movement, while the right avoidance gap 132 is used to facilitate the wafer edge contour data picking unit 3 to freely perform translational movement. In this way, under the premise of ensuring that the wafer carrier 2, the wafer edge contour data picking unit 3 and the OCR recognition unit 4 have sufficient freedom of movement, not only the first driving unit 5, the second driving unit 6 and the hidden parts of the wafer carrier 2, the wafer edge contour data picking unit 3 and the OCR recognition unit 4 are effectively prevented from being affected by external dust and debris, but also the occurrence of workers' personal safety being endangered due to accidents or misoperations can be effectively avoided.

[0045] As is known, according to design common sense, the first driving unit 5 can adopt a variety of design structures to achieve simultaneous driving of the wafer edge data picking unit 3 and the OCR recognition unit 4. However, hereby recommends an implementation scheme with a simple design structure, easy manufacturing and implementation, convenient for later maintenance and repair operations, extremely high action accuracy, and extremely fast action response speed, specifically: Figure 8 , 9 As shown in , the first driving part 5 is preferably a screw rod left-right rotation linear guide electric module, which is mainly composed of the first mounting frame 51, the first motor 52, the first screw rod 53, the first left bearing seat 54, the first right bearing seat 55, the first left slide 56 and the first right slide 57. The first mounting frame 51 is fixed to the frame 1 as a whole. The first left bearing seat 54 and the first right bearing seat 55 can be detachably fixed on the first mounting frame 51, and cooperate to jointly bear the first screw rod 53. Along its length direction, the first screw rod 53 is provided with a left-handed screw thread segment and a right-handed screw thread segment in sequence. The first motor 52 is used to drive the first screw rod 53 to perform circumferential rotation movement, and it also uses the first mounting frame 51 as the installation base. The first left slide 56 used as the installation base by the wafer OCR character sensor 41 and the first right slide 57 used as the installation base by the high-precision laser transmission sensor 31 are respectively mounted on the left-handed screw thread segment and the right-handed screw thread segment in a one-to-one correspondence. When the first motor 52 is in the starting state, the first left slide 56 and the first right slide 57 are moved closer / away due to the reverse driving force, and the wafer OCR character sensor 41 and the high-precision laser transmission sensor 31 are able to move closer / away from the wafer carrier 2 at the same time.

[0046] In order to achieve the same design purpose as above, in view of this, if Fig.10 , 11 As shown in , the second driving unit 6 is mainly composed of a first screw linear module 61 and a second screw linear module 62. Among them, the first screw linear module 61 directly loads the wafer carrier 2, and is used to drive the wafer carrier 2 to perform translational motion along the front-to-back direction. The second screw linear module 62 is used to directly load the first screw linear module 61, and is used to drive the first screw linear module 61 together with the wafer carrier 2 to perform translational motion along the left-right direction. In this way, under the coordinated action of the first screw linear module 61 and the second screw linear module 62, the wafer carrier 2 can accurately perform planar motion.

[0047] As a further refinement of the above technical solution, Fig.12 As shown in , the first screw linear module 61 is mainly composed of several parts such as a second mounting frame 611, a second screw 612, a front bearing seat 613, a rear bearing seat 614, an upper slide 615 and a first synchronous belt transmission mechanism 616. The second mounting frame 611 is supported by the second screw linear module 62. The front bearing seat 613 and the rear bearing seat 614 can be detachably fixed on the second mounting frame 611, and cooperate to jointly bear the second screw 612. The first synchronous belt transmission mechanism 616 is used to drive the second screw 612 to perform circumferential rotational motion, and its main structure (including a rotating motor, an active synchronous wheel and a driven synchronous wheel, etc.) also uses the second mounting frame 611 as an installation base. The upper slide 615, which is used as an installation base by the wafer carrier 2, is mounted on the second screw 612. As shown Fig.13 As shown in , the second screw linear module 62 is mainly composed of a third mounting frame 621, a third screw 622, a second left-mounted bearing seat 623, a second right-mounted bearing seat 624, a lower slide 625 and a second motor 626. The third mounting frame 621 is placed on the top wall of the base 11, and is detachably connected to the base 11. The second left-mounted bearing seat 623 and the second right-mounted bearing seat 624 are both detachably fixed on the third mounting frame 621, and cooperate to jointly bear the third screw 622. The second motor 626 is used to drive the third screw 622 to perform circumferential rotational motion, and it also uses the third mounting frame 621 as an installation base. The lower slide 625 used as an installation base by the first screw linear module 61 is sleeved on the third screw 622.

[0048] Depend on Figure 5 , 6As shown in 7, it can be clearly known that the wafer carrier 2 is mainly composed of a load-bearing frame 21, a spindle 22, a wafer drop column 23, an encoder 24 and a second synchronous belt transmission mechanism 25. The load-bearing frame 21 is loaded by the second driving unit 6. The spindle 22 uses the load-bearing frame 21 as a mounting base, and it passes through the load-bearing frame 21 longitudinally. The wafer drop column 23 is used to drop and limit the wafer, and it is integrated with the spindle 22, and the two remain coaxial. The second synchronous belt transmission mechanism 25 is used to drive the spindle 22 to perform circumferential rotational motion, and its structural body (including a rotating motor, an active synchronous wheel and a driven synchronous wheel, etc.) also uses the load-bearing frame 21 as a mounting base. The encoder 24 is mounted on the spindle 22 and performs a follow-up circumferential rotational motion. In this way, on the one hand, the wafer carrier 2 has an extremely simple design structure, which is conducive to manufacturing implementation; on the other hand, with the help of the second synchronous belt transmission mechanism 25 to apply a rotational torque to the spindle 22, the wafer that has been dropped can synchronously perform circumferential rotation motion following the wafer drop column 23, which is conducive to the wafer edge data picking unit 3 picking up the edge contour data of the wafer, and with the assistance of the encoder 24, it is more conducive to the precise adjustment of the wafer notch phase angle.

[0049] Finally, in order to ensure that the wafers have good position consistency after being placed and avoid the relative position changes caused by the excitation force or other external forces, as a further optimization of the above technical solution, Figure 5 , 6 As described in FIG. 7 , the wafer carrier 2 is also equipped with a vacuum chuck 26 . The vacuum chuck 26 absorbs the wafer by means of negative pressure effect, and is placed and fixed on the top wall of the wafer placement column 23 .

[0050] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer character OCR recognition device, characterized in that: The invention comprises a frame, a wafer carrying platform, a wafer edge profile data picking unit, an OCR recognition unit, a first driving unit and a second driving unit; the first driving unit and the second driving unit are both supported by the frame; the power sources for the wafer edge data picking unit and the OCR recognition unit to perform translational motion are both the first driving unit, and the two are arranged opposite to each other along the left and right directions; the power source for the wafer carrying platform to perform planar motion is the second driving unit; when the OCR recognition operation needs to be performed on the wafer, the wafer carrying platform receives the wafer transferred by the robot, and then the wafer carrying platform is started, and the wafer can perform circumferential rotation Rotational motion, during this process, the wafer edge data picking unit completely obtains the edge contour data of the wafer, the second driving unit is started to drive the wafer carrier to perform planar motion until the centroid of the wafer is adjusted to the expected design position, and at the same time, the wafer continues to rotate circumferentially at a low speed under the action of the rotational torque from the wafer carrier until the wafer notch meets the expected design position, then, the first driving unit is started, the wafer edge contour data picking unit and the OCR recognition unit perform translational motion towards each other until the OCR recognition unit occupies the correct imaging orientation relative to the wafer, and the wafer characters can be recognized.

2. The wafer character OCR recognition device according to claim 1, characterized in that: The main structure of the wafer edge profile data picking unit is a high-precision laser transmission sensor; the main structure of the OCR recognition unit is a wafer OCR character sensor.

3. The wafer character OCR recognition device according to claim 1, characterized in that: The frame includes a base, a supporting frame and an outer cover shell; the outer cover shell covers the top of the base; The support frame is hidden in the cavity of the outer cover shell, and is detachably fixed to the base.

4. The wafer character OCR recognition device according to claim 3, characterized in that: A left-placed avoidance notch and a right-placed avoidance notch are simultaneously provided on the top wall of the outer cover shell; wherein, the left-placed avoidance notch is used to allow the OCR recognition unit to freely perform translational movement and the wafer carrier to freely perform planar movement, while the right-placed avoidance notch is used to facilitate the wafer edge contour data picking unit to freely perform translational movement.

5. The wafer character OCR recognition device according to any one of claims 1 to 4, characterized in that: The first driving part is a lead screw left-right rotating linear guide electric module, which includes a first mounting frame, a first motor, a first lead screw, a first left-mounted bearing seat, a first right-mounted bearing seat, a first left-mounted slide and a first right-mounted slide; the first mounting frame is fixed to the frame as a whole; the first left-mounted bearing seat and the first right-mounted bearing seat can be detachably fixed on the first mounting frame, and cooperate with each other to jointly bear the first lead screw; the first motor is used to drive the first lead screw to perform circumferential rotational motion, and it also uses the first mounting frame as an installation base; the first left-mounted slide used as an installation base by the OCR recognition unit and the first right-mounted slide used as an installation base by the wafer edge contour data picking unit are both mounted on the first lead screw; when the first motor is in a started state, the first left-mounted slide and the first right-mounted slide perform opposite / backward displacement motion due to the action of a reverse driving force.

6. The wafer character OCR recognition device according to any one of claims 3-4, characterized in that: The second driving unit includes a first lead screw linear module and a second lead screw linear module; the first lead screw linear module directly loads the wafer carrier, and is used to drive the wafer carrier to perform translational movement along the front-to-back direction; and the second lead screw linear module is used to directly load the first lead screw linear module, and is used to drive the first lead screw linear module together with the wafer carrier to perform translational movement along the left-to-right direction.

7. The wafer character OCR recognition device according to claim 6, characterized in that: The first screw linear module includes a second mounting frame, a second screw, a front bearing seat, a rear bearing seat, an upper slide and a first synchronous belt transmission mechanism; the second mounting frame is supported by the second screw linear module; the front bearing seat and the rear bearing seat can be detachably fixed on the second mounting frame, and cooperate with each other to jointly bear the second screw; the first synchronous belt transmission mechanism is used to drive the second screw to perform circumferential rotational motion, and its main structure also uses the second mounting frame as an installation base; the upper slide used as an installation base by the wafer carrier is mounted on the second screw.

8. The wafer character OCR recognition device according to claim 7, characterized in that: The second screw linear module includes a third mounting frame, a third screw, a second left-mounted bearing seat, a second right-mounted bearing seat, a lower slide and a second motor; the third mounting frame is placed on the top wall of the base, and is detachably connected to the base; the second left-mounted bearing seat and the second right-mounted bearing seat can be detachably fixed to the third mounting frame, and cooperate with each other to jointly bear the third screw; the second motor is used to drive the third screw to perform circumferential rotational motion, and it also uses the third mounting frame as an installation base; the lower slide used as an installation base by the first screw linear module is mounted on the third screw.

9. The wafer character OCR recognition device according to any one of claims 1 to 4, characterized in that: The wafer carrier includes a load-bearing frame, a spindle, a wafer dropping column, an encoder and a second synchronous belt transmission mechanism; the load-bearing frame is loaded by the second driving part; the spindle uses the load-bearing frame as an installation base, and it longitudinally passes through the load-bearing frame; the wafer dropping column is used to drop and limit the wafer, and it is integrated with the spindle, and the two remain coaxial; the second synchronous belt transmission mechanism is used to drive the spindle to perform circumferential rotation motion, and its main structure also uses the load-bearing frame as an installation base; the encoder is mounted on the spindle and performs a follow-up circumferential rotation motion.

10. The wafer character OCR recognition device according to claim 9, characterized in that: The wafer carrying platform also includes a vacuum suction cup; the vacuum suction cup uses the negative pressure effect to absorb the wafer, and the wafer is placed and fixed on the top wall of the wafer placement column.

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