Power divider, power divider assembly and antenna manufacturing method

By forming a groove in the dielectric plate and using a resistive material block to create an isolation resistor without welding, the power divider addresses manufacturing complexity and cost issues, achieving a compact and flat design with improved electrical performance and bandwidth.

CN119181947APending Publication Date: 2024-12-24BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202310745300.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-21
Publication Date
2024-12-24

AI Technical Summary

Technical Problem

Conventional Wilkinson power dividers require a welding process for isolation resistors, complicating the manufacturing process and increasing costs, while their quarter-wavelength impedance transformation lines fail to meet the miniaturization needs of high-frequency microwave communications.

Method used

A method for manufacturing a power divider that eliminates the need for welding by forming a groove in a dielectric plate and placing a resistive material block in the groove, electrically overlapping output ends of transmission microstrip lines with the block to create an isolation resistor, resulting in a flat structure that facilitates integration and reduces volume.

Benefits of technology

The method simplifies the manufacturing process, reduces costs, and enhances the compactness and flatness of the power divider, improving its integration into other devices with better electrical performance and wider bandwidth.

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Abstract

The invention discloses a power divider, a power divider assembly and a manufacturing method of an antenna. The power divider comprises a dielectric plate, a conductive layer and a grounding conductive plate, the conductive layer is located on one side of the dielectric layer; the grounding conductive plate and the conductive layer are arranged at intervals; the conductive layer comprises an input microstrip line and at least one stage of power division unit connected with the input microstrip line, each power division unit comprises a first transmission microstrip line and a second transmission microstrip line, and each power division unit further comprises a groove located in the dielectric plate and a resistance material block located in the groove; and the output end, far away from the input microstrip line, of the first transmission microstrip line and the output end, far away from the input microstrip line, of the second transmission microstrip line are electrically overlapped with the resistance material block. Therefore, the power divider can reduce the complexity of the manufacturing process and the manufacturing cost.
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Citation Information

Patent Citations

  • Design structure of wired power divider chip resistance avoidance hole

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  • Broadband micro-strip power divider

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    CN203787548U

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    CN205752482U