Production process of single-sided ultrathin transparent material FP and single-sided ultrathin transparent material FPC

Abstract

The invention relates to the technical field of single-sided ultrathin transparent material FP and single-sided ultrathin transparent material FPC production, in particular to a single-sided ultrathin transparent material FP and single-sided ultrathin transparent material FPC production process, which comprises the following specific steps: a, pasting a back bearing film on a material in a roll manner; b, roll type copper plating; c, cutting into sheets; d, manufacturing a circuit pattern; e, AOI scanning is carried out; f, positioning holes and targeting holes; g, copper surface treatment; h, chemical silver deposition; i, open and short circuit testing; j, tearing off the back bearing film; k, shape punching; l, inspecting the appearance of a finished product; compared with an existing single-face ultra-thin transparent material FPC production process, a back bearing film is attached to the material in a roll mode, a back glue roll covering machine can be adopted, automatic roll covering is achieved, influences of manual operation factors are avoided, wrinkles are reduced, roll type copper plating is achieved, the copper plating uniformity is effectively improved, the copper thickness range of roll type copper plating is smaller than or equal to 1 micrometer, and the production efficiency is improved. And the chip copper plating range is less than or equal to 3 microns.

Description

Technical Field

[0001] The invention relates to the technical field of single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process, and specifically to a single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process. Background Art

[0002] The original material structure of ultra-thin transparent FPC is single-sided transparent PET with a thickness of 50um. The initial copper thickness is 3um. The finished copper thickness is required to be ≧10um. The bottom copper is insufficient, and it is necessary to increase the electroplated copper to thicken the surface copper to more than 10um. After the circuit pattern is etched out of the material, no additional layers will be added on it.

[0003] The existing conventional production process in the industry is: roll material with back-end carrier film (some factories do not apply carrier film) → cut material into sheets → black hole / copper plating → circuit pattern production → AOI scanning → positioning hole target hole → copper surface treatment → chemical silver deposition → open short circuit test → tear off back-end carrier film → external punching → finished product appearance inspection → packaging and shipment;

[0004] The above-mentioned process of single sheet material in electroplating copper production process easily leads to poor cardboard wrinkling, poor copper uniformity on the single copper-plated surface, and low production efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: including single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process specific steps include: a. material roll-coating back-side carrier film; b. roll-copper plating; c. cutting into sheets; d. circuit pattern production; e. AOI scanning; f. positioning hole target hole; g. copper surface treatment; h. chemical silver deposition; i. open and short circuit test; j. tearing off the back-side carrier film; k. appearance punching; l. finished product appearance inspection; m. packaging and shipment.

[0007] Preferably, the b. roll-to-roll copper plating uses a copper plating device.

[0008] Preferably, the copper plating device comprises a shell assembly, the shell assembly comprises an outer box body and supporting feet, and the supporting feet are installed below the outer box body.

[0009] Preferably, a power supply assembly is installed at the rear end of the shell assembly, and a moving assembly is installed on the left side of the shell assembly.

[0010] Preferably, a placement component is installed on the left side of the interior of the shell component, and a guide component is connected to the lower end of the placement component, and a stirring component is installed on the lower wall of the shell component.

[0011] Preferably, the power supply assembly includes a power supply, a negative wire, a negative connecting electrode, a positive wire and a positive connecting electrode, and the negative end of the power supply is connected to the negative wire, the end of the negative wire away from the power supply is connected to the negative connecting electrode, the positive end of the power supply is connected to the positive wire, and the end of the positive wire away from the power supply is connected to the positive connecting electrode.

[0012] Preferably, the moving assembly includes an electric slide rail and a slider, and the upper end of the electric slide rail is connected to the slider.

[0013] Preferably, the placement assembly includes a placement tube, a mesh plate, a liquid storage chamber, an insulating protection box and an insulating water pump, and the lower end of the placement tube is connected to the mesh plate, the lower end of the mesh plate is provided with a liquid storage chamber, and the lower end of the liquid storage chamber is installed with an insulating protection box, and an insulating water pump is installed inside the insulating protection box.

[0014] Preferably, the guide assembly comprises a connecting block and a guide rod, and the guide rod passes through the interior of the connecting block.

[0015] Preferably, the stirring assembly includes a stirring motor, a transmission belt, a rotating shaft, a bearing and a stirring blade, and the rotating end of the stirring motor is connected to the transmission belt, the end of the transmission belt away from the stirring motor is connected to the rotating shaft, and the outside of the rotating shaft is connected to the bearing, and the upper end of the rotating shaft is connected to the stirring blade.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The back-carrying film of the material of the present application can be rolled up and coated with a back adhesive rewinding machine to achieve automatic rewinding without the influence of manual operation factors, reducing the occurrence of wrinkles. The roll copper plating effectively improves the uniformity of copper plating. The copper thickness range of the roll copper plating is ≤1um, and the range of the sheet copper plating is ≤3um. The production efficiency of the roll copper plating is relative to the sheet type, which reduces the time for loading and unloading the sheet, and the production efficiency can be increased by about 25% relative to the sheet copper plating.

[0018] 2. In the copper plating process of the present application, the insulated water pump will perform liquid suction work, suck the liquid into the liquid storage chamber, and then make the liquid emerge from the mesh plate, so as to facilitate the liquid to flow inside the placement tube, so that the liquid can pass through the raw material better, making it easier to carry out copper plating work, and avoiding the raw material being in a rolled shape, which is not convenient for liquid flow inside and affects the electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a flow chart of the present invention;

[0020] Figure 2 This is a front view structural schematic diagram of the copper plating device of the present invention;

[0021] Figure 3 It is a bottom view structural schematic diagram of the copper plating device of the present invention;

[0022] Figure 4 It is a schematic diagram of the enlarged structure of the placement components of the present invention;

[0023] Figure 5 This is a schematic diagram of an enlarged cross-section structure of a placement component of the present invention;

[0024] Figure 6 It is an enlarged structural schematic diagram of the stirring assembly of the present invention.

[0025] In the figure: 1. Shell assembly; 101. Outer box; 102. Support leg; 2. Power supply assembly; 201. Power supply; 202. Negative wire; 203. Negative connecting electrode; 204. Positive wire; 205. Positive connecting electrode; 3. Moving assembly; 301. Electric slide rail; 302. Slider; 4. Placement assembly; 401. Placement cylinder; 402. Mesh plate; 403. Liquid storage chamber; 404. Insulation protection box; 405. Insulation water pump; 5. Guide assembly; 501. Connection block; 502. Guide rod; 6. Stirring assembly; 601. Stirring motor; 602. Transmission belt; 603. Rotating shaft; 604. Bearing; 605. Stirring blade. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1 The present invention provides a technical solution: the single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process specific steps include: a. material roll laminating back carrier film; b. roll copper plating; c. cutting into sheets; d. circuit pattern production; e. AOI scanning; f. positioning hole target hole; g. copper surface treatment; h. chemical silver deposition; i. open and short circuit test; j. tearing off the back carrier film; k. external shape punching; l. finished product appearance inspection; m. packaging and shipment;

[0028] The FPC material of the present invention is made of single-sided transparent PET material, the thickness of PET is 50um, and the initial thickness of the surface copper is only 3um. In order to solve the quality stability and production efficiency of ultra-thin materials in the subsequent production process, the present invention changes the traditional sheet copper plating into roll copper plating, and after copper plating, the roll material is cut into sheet materials for post-production;

[0029] Compared with the ultra-thin single-sided transparent FPC production process in the industry, the present invention adopts roll-type laminating back-side carrier film and roll-type copper plating, which solves the problem of wrinkles caused by the material being too thin during the laminating back-side carrier film and copper plating production process. In addition, the uniformity of roll-type copper plating is significantly higher than that of sheet-type copper plating, with a range of ≤1um and a sheet-type copper plating range of ≤3um.

[0030] The back-carrying film of the roll-type coating of the material of the present application can be automatically coated by a back-adhesive coating machine without the influence of manual operation factors, which reduces the occurrence of wrinkles. The roll-type copper plating effectively improves the uniformity of copper plating. The extreme difference of copper thickness of roll-type copper plating is ≤1um, and the extreme difference of sheet-type copper plating is ≤3um. The production efficiency of roll-type copper plating is relative to that of sheet-type, which reduces the time of sheet loading and unloading, and the production efficiency can be increased by about 25% relative to sheet-type copper plating.

[0031] Among them, b. roll copper plating adopts copper plating equipment.

[0032] like Figure 2 As shown, the copper plating device includes a housing assembly 1 , wherein the housing assembly 1 includes an outer box body 101 and a support leg 102 , and the support leg 102 is installed below the outer box body 101 .

[0033] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a power supply component 2 is installed at the rear end of the shell component 1, and a moving component 3 is installed on the left side of the shell component 1, a placement component 4 is installed on the left side of the interior of the shell component 1, and a guide component 5 is connected to the lower end of the placement component 4, and a stirring component 6 is installed on the lower wall of the shell component 1.

[0034] like Figure 2 As shown, the power supply component 2 includes a power supply 201, a negative wire 202, a negative connecting electrode 203, a positive wire 204 and a positive connecting electrode 205, and the negative end of the power supply 201 is connected to the negative wire 202, the end of the negative wire 202 away from the power supply 201 is connected to the negative connecting electrode 203, the positive end of the power supply 201 is connected to the positive wire 204, and the end of the positive wire 204 away from the power supply 201 is connected to the positive connecting electrode 205.

[0035] like Figure 4As shown, the moving assembly 3 includes an electric slide rail 301 and a slider 302, and the upper end of the electric slide rail 301 is connected to the slider 302;

[0036] The movable slide rail 301 drives the slider 302 to move, thereby causing the placement tube 401 to shake back and forth, causing the liquid inside the device to shake more irregularly.

[0037] like Figure 5 As shown, the placement component 4 includes a placement cylinder 401, a mesh plate 402, a liquid storage cavity 403, an insulating protection box 404 and an insulating water pump 405, and the lower end of the placement cylinder 401 is connected to the mesh plate 402, the lower end of the mesh plate 402 is provided with the liquid storage cavity 403, and the lower end of the liquid storage cavity 403 is installed with an insulating protection box 404, and the insulating water pump 405 is installed inside the insulating protection box 404;

[0038] During the copper plating process, the insulated water pump 405 will perform liquid suction work, suck the liquid into the liquid storage chamber 403, and then make the liquid emerge from the mesh plate 402, so as to facilitate the liquid to flow inside the placement tube 401, so that the liquid can pass through the raw material better, making it easier to carry out the copper plating work, and avoiding the raw material being in a rolled shape, which is not convenient for liquid flow inside and affects the electroplating effect.

[0039] like Figure 4 As shown, the guide assembly 5 includes a connecting block 501 and a guide rod 502, and the guide rod 502 penetrates the interior of the connecting block 501;

[0040] The sliding structure between the connecting block 501 and the guide rod 502 can provide support for the placement component 4 .

[0041] like Figure 6 As shown, the stirring assembly 6 includes a stirring motor 601, a transmission belt 602, a rotating shaft 603, a bearing 604 and a stirring blade 605, and the rotating end of the stirring motor 601 is connected to the transmission belt 602, and the end of the transmission belt 602 away from the stirring motor 601 is connected to the rotating shaft 603, and the outside of the rotating shaft 603 is connected to the bearing 604, and the upper end of the rotating shaft 603 is connected to the stirring blade 605;

[0042] The stirring motor 601 is turned on, and the rotating shaft 603 rotatably connected to the bearing 604 is driven to rotate through the transmission belt 602, so that the stirring blade 605 rotates to stir the inside of the outer box body 101.

[0043] Working principle of the copper plating device: first, put the rolled material into the placement cylinder 401, then fill the outer box 101 with copper plating solvent, then turn on the stirring motor 601, and drive the rotating shaft 603 connected to the bearing 604 to rotate through the transmission belt 602, so that the stirring blade 605 rotates to stir the inside of the outer box 101, so that the copper ions in the liquid inside the outer box 101 are evenly distributed, which is more convenient for copper plating. Then turn on the insulating water pump 405, and transport the liquid in the outer box 101 to the liquid storage chamber 403 through the insulating water pump 405, and then spray the liquid from the mesh plate 402 to form a bottom-up flow with the inside of the placement cylinder 401. direction, so that it is convenient for the liquid to pass through the inside of the rolled material, which is convenient for the equipment to perform copper plating. Then, the power supply 201 is turned on, and the negative electrode 203 is powered by the negative wire 202, and the positive electrode 205 is powered by the positive wire 204, so that the equipment can work. During the operation of the equipment, the electric slide rail 301 will also drive the slider 302 to move, so that the placement cylinder 401 can shake back and forth, and the liquid inside the equipment can shake more irregularly, which is convenient for the copper ions to contact with the raw materials and perform copper plating. The sliding structure between the connecting block 501 and the guide rod 502 can form a supporting effect on the placement component 4, which is convenient for the placement component 4 to move back and forth.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process, characterized by: The specific steps of the single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process include: a. Material roll-up with back-carrying film; b. Roll-up copper plating; c. Cutting into sheets; d. Circuit pattern production; e. AOI scanning; f. Positioning hole target hole; g. Copper surface treatment; h. Chemical silver immersion; i. Open and short circuit test; j. Tearing off the back-carrying film; k. Appearance punching; l. Finished product appearance inspection; m. Packaging and shipment.

2. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 1, characterized in that: b. The roll-to-roll copper plating adopts a copper plating device.

3. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 2, characterized in that: The copper plating device comprises a housing assembly (1), wherein the housing assembly (1) comprises an outer box body (101) and a support leg (102), and the support leg (102) is installed below the outer box body (101).

4. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 3, characterized in that: A power supply component (2) is installed at the rear end of the housing component (1), and a moving component (3) is installed on the left side of the housing component (1).

5. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 3, characterized in that: A placement component (4) is installed on the left side of the interior of the shell component (1), and a guide component (5) is connected to the lower end of the placement component (4). A stirring component (6) is installed on the lower wall of the shell component (1).

6. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 4, characterized in that: The power supply component (2) comprises a power supply (201), a negative electrode wire (202), a negative electrode connecting electrode (203), a positive electrode wire (204) and a positive electrode connecting electrode (205), wherein the negative terminal of the power supply (201) is connected to the negative electrode wire (202), the end of the negative electrode wire (202) away from the power supply (201) is connected to the negative electrode connecting electrode (203), the positive terminal of the power supply (201) is connected to the positive electrode wire (204), and the end of the positive electrode wire (204) away from the power supply (201) is connected to the positive electrode connecting electrode (205).

7. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 4, characterized in that: The moving assembly (3) comprises an electric slide rail (301) and a slider (302), and the upper end of the electric slide rail (301) is connected to the slider (302).

8. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 5, characterized in that: The placement component (4) comprises a placement tube (401), a mesh plate (402), a liquid storage chamber (403), an insulating protection box (404) and an insulating water pump (405), wherein the lower end of the placement tube (401) is connected to the mesh plate (402), the lower end of the mesh plate (402) is provided with a liquid storage chamber (403), and the lower end of the liquid storage chamber (403) is installed with an insulating protection box (404), and the insulating water pump (405) is installed inside the insulating protection box (404).

9. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 5, characterized in that: The guide assembly (5) comprises a connecting block (501) and a guide rod (502), and the guide rod (502) penetrates the interior of the connecting block (501).

10. The single-sided ultra-thin transparent material FP single-sided ultra-thin transparent material FPC production process according to claim 5, characterized in that: The stirring assembly (6) comprises a stirring motor (601), a transmission belt (602), a rotating shaft (603), a bearing (604) and a stirring blade (605), wherein the rotating end of the stirring motor (601) is connected to the transmission belt (602), an end of the transmission belt (602) away from the stirring motor (601) is connected to the rotating shaft (603), the outside of the rotating shaft (603) is connected to the bearing (604), and the upper end of the rotating shaft (603) is connected to the stirring blade (605).

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