Electronic equipment, shell and optical film thereof
By providing an array-distributed protruding or pit structure on the connecting adhesive layer of the optical diaphragm, the problem of optical coating layer being easily cracked in the shell of the electronic device is solved, the structural reliability is improved and the application of texture effect is expanded. noodle.
Patent Information
- Application Number
- CN202310749405.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-21
- Publication Date
- 2024-12-24
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When the UV glue layer is matched with an optical coating layer with a thickness of more than 200nm, the optical coating layer cracks and texture film cracks are prone to occur, resulting in failure in environmental testing.
A plurality of convex or pit structures distributed in an array are provided on the connecting adhesive layer of the optical diaphragm, thereby increasing the surface area of the connecting adhesive layer, thereby forming a structure with anti-crack effect at the bottom of the optical coating layer.
By increasing the surface area of the connecting adhesive layer, the cracking of the optical coating layer during bending or bonding is avoided, the structural reliability of the optical film is improved, and it performs well in harsh environmental tests.
Smart Images

Figure CN119183265A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of appearance effects of electronic device housings, and in particular to an electronic device, a housing and an optical film thereof. Background Art
[0002] In the structure of electronic devices, in order to achieve a specific overall appearance of the battery cover, such as a ceramic glaze, the conventional method is to directly transfer a texture-free UV adhesive layer on PET, and then further add an optical coating layer and decorative layer structure on the UV adhesive layer. However, the problem with the above solution is that when the UV adhesive layer is combined with an optical coating layer with a thickness of more than 200nm to form a diaphragm structure, the optical coating layer is prone to cracking during the process of bonding the diaphragm structure to the glass. After environmental testing, there are problems such as overall texture film cracking and failure of the 100-grid test. Summary of the invention
[0003] A first aspect of an embodiment of the present application provides an optical film, the optical film comprising:
[0004] Base material;
[0005] A connecting adhesive layer is provided on the substrate, wherein a surface of the connecting adhesive layer facing away from the substrate is provided with a plurality of protrusions or pit structures distributed in an array, thereby increasing the surface area of the connecting adhesive layer;
[0006] The optical coating layer is arranged on the connecting adhesive layer and covers a plurality of protrusions or pit structures distributed in an array on the surface of the connecting adhesive layer.
[0007] In a second aspect, an embodiment of the present application provides a housing, which includes a transparent substrate and the optical film described in the above embodiment attached to the transparent substrate.
[0008] In a third aspect, an embodiment of the present application provides an electronic device, which includes a display screen module, a control circuit board and the shell described in the above embodiment, wherein the display screen module and the shell cooperate to form a accommodating space, and the control circuit board is disposed in the accommodating space and is electrically connected to the display screen module.
[0009] The optical film provided in the embodiment of the present application forms a connecting adhesive layer with an array-distributed protrusion or pit structure at the bottom of the optical coating layer, thereby increasing the surface area of the connecting adhesive layer. When the optical film is bent or bonded to other structures, the optical coating layer can be prevented from cracking, thereby improving the structural reliability of the optical film. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0011] Figure 1 This is a schematic diagram of the front structure of an embodiment of the optical film of the present application;
[0012] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the optical film at AA in the embodiment;
[0013] Figure 3 is a schematic diagram of the cross-sectional structure of another embodiment of the optical film of the present application;
[0014] Figure 4 yes Figure 2 A schematic diagram of a partial structure of an optical film in an embodiment;
[0015] Figure 5 yes Figure 3 A schematic diagram of a partial structure of an optical film in an embodiment;
[0016] Figure 6 is a schematic diagram of the cross-sectional structure of another embodiment of the optical film of the present application;
[0017] Figure 7 It is a structural schematic diagram of an embodiment of a housing of the present application;
[0018] Figure 8 It is a structural schematic diagram of an embodiment of the electronic device of the present application;
[0019] Fig. 9 yes Figure 8 A schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment;
[0020] Fig.10 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION
[0021] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0022] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.
[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0024] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.
[0025] The present application embodiment provides an optical film, please refer to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the front structure of an embodiment of the optical film of the present application, Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the optical film at AA in the embodiment. Optionally, the optical film 100 in this embodiment includes a substrate 110 , a connecting adhesive layer 120 and an optical coating layer 130 .
[0026] Specifically, the material of the substrate 110 is a transparent resin material, which can be PET (Polyethyleneterephthalate, PET or PEIT for short, commonly known as polyester resin, a condensation product of terephthalic acid and ethylene glycol), PMMA (polymethyl methacrylate (PMMA for short), also known as acrylic, acrylic or organic glass), PC (Polycarbonate, polycarbonate (PC for short) is a high molecular polymer containing carbonate groups in the molecular chain), PI (Polyimide), etc. More material types of the substrate 110 are within the scope of understanding of those skilled in the art, and are not listed and described in detail here.
[0027] The connecting adhesive layer 120 is disposed on the substrate 110, and the connecting adhesive layer 120 may be a UV optical adhesive or the like. Figure 3 , Figure 3 1 is a schematic diagram of a cross-sectional structure of another embodiment of the optical film of the present application, wherein a surface of the connecting adhesive layer 120 facing away from the substrate is provided with a plurality of protrusions ( Figure 2 Medium structure, marked 121) or pit ( Figure 3 The structure in the middle, marked as 122) structure, thereby increasing the surface area of the connecting adhesive layer 120.
[0028] Optionally, the optical coating layer 130 is disposed on the connecting adhesive layer 120 and covers a plurality of protrusions or pit structures distributed in an array on the surface of the connecting adhesive layer 120. The optical coating layer 130 may be a layer or multiple layers of sputtering coating formed by discontinuous coating technology or non-conductive electroplating technology. Those skilled in the art may design it by themselves according to the effect requirements, such as silicon oxide layer, nitride silicon layer, etc., which are not specifically limited here. Among them, the thickness of the optical coating layer 130 may be 100-500nm. The structural scheme of the connecting adhesive layer 120 in the embodiment of the present application, especially for the optical coating layer 130 with a large thickness (greater than 200nm), has a better anti-cracking effect.
[0029] Optionally, please also refer to Figure 2 and Figure 4 , Figure 4 yes Figure 2 Schematic diagram of the local structure of the optical film in the embodiment, the connecting adhesive layer 120 in the present embodiment is provided with a plurality of protrusions 121 distributed in an array on the surface facing away from the substrate 110, optionally, the surface of the protrusion 121 in the present embodiment is a spherical structure, the radius R1 of the spherical structure is 3um to 30um, and the radius R1 can specifically be 3um, 5um, 6um, 8um, 10um, 12um, 15um, 20um, 25um, 30um and the like; the height H of the spherical structure protruding from the surface of the connecting adhesive layer 120 is 3um to 30um, that is, the height H of the spherical structure protruding from the surface of the connecting adhesive layer 120 can be the same as the radius R1 of the spherical structure, that is, the protrusion 121 is a hemispherical structure, of course, in some other embodiments, the protrusion 121 can also be a structure smaller than a hemisphere or larger than a hemisphere, which is not specifically limited here. In addition, in some other embodiments, the protrusion 121 can also be an ellipsoidal or irregular curved protrusion structure, or the protrusion 121 can be of different sizes, as long as the surface area of the connecting adhesive layer 120 can be increased. They will not be listed or described in detail here.
[0030] Among them, the spacing L1 between adjacent protrusions 121 can be 30um to 150um, and the spacing L1 can specifically be 30um, 35um, 40um, 50um, 80um, 100um, 120um, 150um, etc. The size selection of the radius R1 of the spherical structure and the size selection of the spacing L1 between adjacent protrusions 121 comprehensively affect the haze and transmittance of the optical film 100. In the embodiment of the present application, the radius R1 of the spherical structure is 25um and the spacing L1 is 100um, and an optical film with a haze of 10% and a transmittance of 92% is obtained, and it also has an anti-glare (AG, Anti-Glare Glass) effect. Compared with the texture-free film (transmittance 90%, haze 3%), the haze and transmittance of the film in the embodiment of the present application are larger (haze 10%, transmittance 92%), and it is difficult to distinguish the protrusions in terms of human eye recognition, that is, the protrusions on the surface of the film are not easy to observe with the naked eye. Therefore, in addition to the anti-glare effect, after the film is silk-screened with an ink layer, the protrusions do not affect the mirror effect of the film surface.
[0031] Optionally, please also refer to Figure 3 and Figure 5 , Figure 5 yes Figure 3Schematic diagram of the local structure of the optical film in the embodiment, the surface of the connecting adhesive layer 120 in this embodiment facing away from the substrate 110 is provided with a plurality of pits 122 distributed in an array, optionally, the surface of the pits 122 in this embodiment is a spherical structure, and in some other embodiments, the surface shape of the pits 122 can also be an ellipsoidal or irregular curved surface shape, as long as the surface area of the connecting adhesive layer 120 can be increased. The detailed features of this part are within the understanding of those skilled in the art, and will not be listed and described in detail here.
[0032] Optionally, in the embodiment of the present application, the surface of the pit 122 is a spherical structure, and the radius R2 is 3um to 30um. The radius R2 can specifically be 3um, 5um, 6um, 8um, 10um, 12um, 15um, 20um, 25um, 30um and the like; the depth D of the pit 122 can be 3um to 30um, that is, the depth D of the pit 122 can be the same as the radius R2 of the spherical structure, that is, the pit 122 is a hemispherical structure. Of course, in some other embodiments, the pit 122 can also be a structure smaller than a hemisphere or larger than a hemisphere, which is not specifically limited here.
[0033] Among them, the spacing L2 between adjacent pits 122 can be 30um to 150um, and the spacing L2 can specifically be 30um, 35um, 40um, 50um, 80um, 100um, 120um, 150um, etc. The size selection of the radius R2 of the spherical structure and the size selection of the spacing L2 between adjacent pits 122 comprehensively affect the haze and transmittance of the optical film 100. In the embodiment of the present application, the radius R2 of the spherical structure is 25um and the spacing L2 is 100um, and an optical film with a haze of 10% and a transmittance of 92% is obtained, and it also has an anti-glare (AG, Anti-Glare Glass) effect. Compared with the texture-free film (transmittance 90%, haze 3%), the haze and transmittance of the film in the embodiment of the present application are larger (haze 10%, transmittance 92%), and it is difficult to distinguish the pits in terms of human eye recognition, that is, the pits on the surface of the film are not easy to observe with the naked eye. Therefore, in addition to the anti-glare effect, after the film is silk-screened with an ink layer, the pits do not affect the mirror effect of the film surface.
[0034] During the preparation process of the optical film in the embodiment of the present application, it can be specifically designed using software such as C++ to design a three-dimensional sphere of a certain diameter value or an irregular curved surface shape of randomly distributed sizes. Then the spacing between adjacent three-dimensional spheres is designed to evenly cover a specific size range (set according to the purpose and requirements), such as within the range of 200*100mm. Output BMP drawings. Then the BMP drawings are input into the grayscale exposure equipment to process the texture (spherical protrusions or pits). Then the substrate is transferred by a transfer machine to form a connecting adhesive layer, which can be specifically UV optical adhesive. Finally, the product is fixed to the sputtering coating machine hanger by a magnet or other solution, and the confirmed coating film system is selected to coat the product. The detailed parameters of the coating machine and the thickness of the coating are determined according to the actual effect.
[0035] The optical film in the embodiment of the present application forms a connecting adhesive layer with an array-distributed protrusion or pit structure at the bottom of the optical coating layer, thereby increasing the surface area of the connecting adhesive layer. When the optical film is bent or bonded to other structures, the optical coating layer can be prevented from cracking, thereby improving the structural reliability of the optical film, expanding the application area of the texture effect, and performing well in more stringent environmental tests when used in conjunction with injection molded parts with non-planar structures.
[0036] See also Figure 6 , Figure 6 It is a schematic diagram of the cross-sectional structure of another embodiment of the optical film of the present application. The optical film 100 in this embodiment includes a substrate 110, a connecting adhesive layer 120, an optical coating layer 130 and an ink layer 140. The detailed structural features of the substrate 110, the connecting adhesive layer 120 and the optical coating layer 130 can be found in the relevant description of the aforementioned embodiments and will not be repeated here.
[0037] Optionally, the ink layer 140 in this embodiment can be multi-layered, and can be formed by silk-screen printing. In addition to preventing the optical coating layer from cracking as mentioned in the above embodiments, the optical film in this embodiment can also achieve a ceramic glaze effect similar to a mirror texture by silk-screening the ink layer 140.
[0038] See also Figure 7 , Figure 7 1 is a schematic diagram of the structure of an embodiment of the housing of the present application, wherein the housing 10 includes a transparent substrate 200 and an optical film 100, and specifically, the side of the base material 110 of the optical film 100 away from the connecting adhesive layer 120 is bonded to the transparent substrate 200 by an optical adhesive 102. The optical film 100 may be the structure in the aforementioned embodiment, and the transparent substrate 200 may be made of transparent glass, transparent resin, transparent ceramic, etc., which are not specifically limited here.
[0039] Furthermore, the present application also provides an electronic device, please refer to Figure 8 and Fig. 9 , Figure 8 is a structural diagram of an embodiment of the electronic device of the present application, Fig. 9 yes Figure 8 The schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment, the electronic device in this embodiment may include a display screen module 30, a housing 10 and a control circuit board 20. Among them, the housing 10 may be the housing in the aforementioned embodiment. The housing 10 in this embodiment may be the rear cover plate of the electronic device, i.e., the battery cover, or may include the side frame of the middle frame, etc., which is not specifically limited here.
[0040] Optionally, the display screen module 30 cooperates with the housing 10 to form an accommodation space 1000, the control circuit board 20 is disposed in the accommodation space 1000, the control circuit board 20 is electrically connected to the display screen module 30, and the control circuit board 20 is used to control the display screen module 30. The detailed technical features of the other parts of the electronic device are within the scope of understanding of those skilled in the art and will not be repeated here.
[0041] See also Fig.10 , Fig.10 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, and a wearable device (such as a VR device, a smart watch), etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.
[0042] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.
[0043] The optical film of the electronic device in this embodiment has a connecting adhesive layer with an array-distributed protrusion or pit structure formed at the bottom of the optical coating layer, thereby increasing the surface area of the connecting adhesive layer. When the optical film is bent or bonded to other structures, the optical coating layer can be prevented from cracking, thereby improving the structural reliability of the optical film, expanding the application area of the texture effect, and performing well in more stringent environmental tests when used in conjunction with injection molded parts with non-planar structures.
[0044] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. An optical film, characterized in that: The optical film comprises: Base material; A connecting adhesive layer is provided on the substrate, wherein a surface of the connecting adhesive layer facing away from the substrate is provided with a plurality of protrusions or pit structures distributed in an array, thereby increasing the surface area of the connecting adhesive layer; The optical coating layer is arranged on the connecting adhesive layer and covers a plurality of protrusions or pit structures distributed in an array on the surface of the connecting adhesive layer.
2. The optical film according to claim 1, characterized in that: A surface of the connecting adhesive layer facing away from the substrate is provided with a plurality of protrusions distributed in an array, the surface of the protrusions is a spherical structure, and the radius of the spherical structure is 3um to 30um.
3. The optical film according to claim 2, characterized in that: The radius of the spherical structure is 5um to 10um.
4. The optical film according to claim 2, characterized in that: The height of the spherical structure protruding from the surface of the connecting adhesive layer is 3um to 30um.
5. The optical film according to claim 1, characterized in that: A surface of the connecting adhesive layer facing away from the substrate is provided with a plurality of pits distributed in an array, the surface of the pits is a spherical structure, and the radius of the spherical structure is 3um to 30um.
6. The optical film according to claim 5, characterized in that: The radius of the spherical structure is 5um to 10um.
7. The optical film according to claim 5, characterized in that: The depth of the pit is 3um to 30um.
8. The optical film according to any one of claims 1 to 7, characterized in that: The distance between adjacent protrusions or depressions is 30um to 150um.
9. The optical film according to any one of claims 1 to 7, characterized in that: The optical film also includes an ink layer disposed on the optical coating layer.
10. A housing, characterized in that: The housing comprises a transparent substrate and the optical film according to any one of claims 1 to 9 attached to the transparent substrate.
11. An electronic device, characterized in that: The electronic device comprises a display screen module, a control circuit board and the housing as claimed in claim 10, wherein the display screen module cooperates with the housing to form a receiving space, and the control circuit board is disposed in the receiving space and is electrically connected to the display screen module.
