Laser processing method and laser processing equipment

Abstract

The invention discloses a laser processing method and equipment, and the method comprises the steps: carrying out the partitioning of a to-be-processed circuit board, and enabling the to-be-processed circuit board to be divided into at least two to-be-processed regions; calculating the expansion and shrinkage value of each to-be-processed area based on the reference point of each to-be-processed area; and at least two laser processing assemblies are controlled to carry out laser processing on at least two to-be-processed areas at the same time based on the expansion and shrinkage values of all the to-be-processed areas. According to the method, the to-be-processed circuit board is divided into the at least two to-be-processed areas, and the expansion value of each to-be-processed area is calculated based on the reference point of each to-be-processed area, so that the expansion value of each to-be-processed area can be calculated more accurately, the processing precision is improved, and the processing efficiency is improved. And then the at least two laser processing assemblies are controlled to perform laser processing on the at least two to-be-processed areas at the same time based on the expansion and shrinkage values of the to-be-processed areas, so that different areas of one circuit board can be processed by multiple light beams at the same time, and the processing efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing method and laser processing equipment. Background Art

[0002] As electronic products are constantly updated and developed towards the direction of being lighter, thinner and smarter, circuit boards will develop towards a more miniaturized, high-density and high-reliability direction. Therefore, higher requirements are put forward for the control of the expansion and shrinkage value of printed circuit boards (full name in English: Printed Circuit Board, abbreviated as: PCB). For example, as the number of blind holes in the circuit board design increases, the hole diameter is getting smaller and smaller, and the density between holes is getting higher and higher, in order to improve the processing accuracy of the blind holes, higher requirements are needed for the control of the expansion and shrinkage value of the PCB.

[0003] At present, when processing circuit boards, laser processing equipment usually calculates the expansion and contraction values ​​of the circuit boards first, and then uses a single-beam single table to process the circuit boards based on the expansion and contraction values ​​of the circuit boards, which results in low processing efficiency. For example, for blind hole processing of circuit boards, a common processing method is to use a camera to identify four target locations, thereby calculating the expansion and contraction values ​​of the circuit boards, and using a single-beam single table to process the blind holes. This method is prone to biased holes for circuit boards with a high density of blind holes due to inadequate control of the expansion and contraction values, and it is difficult to improve processing efficiency for circuit boards with a large number of blind holes. Summary of the invention

[0004] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of the present application is to provide a laser processing method and laser processing equipment that can improve processing accuracy and efficiency.

[0005] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0006] The present application provides a laser processing method, the laser processing method comprising:

[0007] Partitioning the circuit board to be processed so that the circuit board to be processed is divided into at least two areas to be processed;

[0008] Calculating the expansion and contraction value of each of the areas to be processed based on the reference points of each of the areas to be processed;

[0009] Based on the expansion and contraction values ​​of each of the to-be-processed areas, at least two laser processing components are controlled to perform laser processing on at least two of the to-be-processed areas simultaneously.

[0010] This embodiment divides the circuit board to be processed into at least two areas to be processed, calculates the expansion and contraction value of each area to be processed based on the reference point of each area to be processed, and then controls at least two laser processing components to perform laser processing on at least two areas to be processed simultaneously based on the expansion and contraction values ​​of each area to be processed, thereby improving the processing accuracy and processing efficiency.

[0011] In some embodiments, the controlling at least two laser processing components to simultaneously perform laser processing on at least two of the to-be-processed areas based on the expansion and contraction values ​​of each of the to-be-processed areas comprises:

[0012] Each of the areas to be processed is divided into a plurality of square processing areas, and the plurality of processing areas are distributed along the width and length directions of the circuit board to be processed, so that each of the processing areas forms a distribution form of multiple rows and columns;

[0013] The laser processing assembly is controlled to process each of the processing areas in sequence.

[0014] This embodiment optimizes the processing path and improves the processing efficiency by subdividing the area to be processed into processing areas distributed in multiple rows and columns, and then controlling the laser processing component to drill holes in each processing area in turn.

[0015] In some embodiments, the processing areas in the areas to be processed have the same shape and area. This embodiment facilitates the division of processing areas and improves work efficiency by subdividing the areas to be processed into processing areas with the same shape and area.

[0016] In some embodiments, when the number of processing areas in the multiple areas to be processed simultaneously is the same, the multiple laser processing assemblies are controlled to process the multiple areas to be processed simultaneously. In this embodiment, when the number of processing areas in each area to be processed is the same, each laser processing assembly is controlled to process different areas to be processed simultaneously, thereby improving processing efficiency.

[0017] In some embodiments, when the difference in the number of processing areas among the multiple areas to be processed simultaneously is greater than a first preset value, at least one of the laser processing assemblies is controlled to process the multiple areas to be processed simultaneously. In this embodiment, when the difference in the number of processing areas among the areas to be processed is greater than a first preset value, one of the laser processing assemblies is controlled to process the multiple areas to be processed simultaneously, thereby improving the processing efficiency.

[0018] In some embodiments, among the multiple areas to be processed simultaneously, if the difference in the number of each row of the processing areas to be processed simultaneously is greater than a second preset value, at least one of the laser processing assemblies is controlled to process multiple rows of the processing areas simultaneously. In this embodiment, when the difference in the number of multiple rows of processing areas to be processed simultaneously is greater than the second preset value, one of the laser processing assemblies is controlled to process multiple rows of the processing areas simultaneously, thereby improving the processing efficiency.

[0019] In some embodiments, when there are multiple circuit boards to be processed simultaneously, the laser processing method further includes:

[0020] Dividing the laser processing components into a plurality of groups, so that each group of the laser processing components includes at least two laser processing components;

[0021] Based on the expansion and contraction values ​​of each processing area of ​​each processing circuit board, multiple groups of laser processing components are controlled to process multiple processing circuit boards respectively, and each group of laser processing components processes multiple processing areas of the same processing circuit board at the same time.

[0022] This embodiment uses multiple groups of laser processing components to simultaneously process multiple circuit boards to be processed, and each group of laser processing components can process different partitions of the same circuit board, thereby improving processing efficiency.

[0023] In some embodiments, the laser processing method further comprises:

[0024] Calculating the average expansion and contraction value of the entire circuit board to be processed based on the expansion and contraction values ​​of each of the areas to be processed;

[0025] The average expansion and contraction value is processed on the board edge of the circuit board to be processed.

[0026] This embodiment calculates the average expansion and contraction value of the entire circuit board to be processed and processes the average expansion and contraction value on the edge of the circuit board, thereby facilitating subsequent processing work.

[0027] In some embodiments, the circuit board to be processed is divided into zones, specifically:

[0028] The circuit board to be processed is divided into N1 processing areas, where N1 is an even number and N1≠0. This embodiment divides the circuit board to be processed into an even number of processing areas to facilitate the single-platform dual-beam design of the laser processing equipment to improve processing efficiency.

[0029] In some embodiments, the value of N1 is 2 or 4. In this embodiment, the circuit board to be processed is divided into two or four processing areas to be processed in order to facilitate the single-platform dual-beam design of the laser processing equipment to improve processing efficiency.

[0030] The present application provides a laser processing device, the laser processing device comprising:

[0031] A workbench surface, the workbench surface is used to fix the circuit board to be processed, wherein the circuit board to be processed is divided into at least two areas to be processed;

[0032] At least two laser processing components, which are arranged above the workbench surface and are used to process the circuit board to be processed fixed on the workbench surface;

[0033] A control component is used to calculate the expansion and contraction value of each of the areas to be processed based on the reference points of each of the areas to be processed, and to control at least two of the laser processing components to perform laser processing on at least two of the areas to be processed simultaneously based on the expansion and contraction values ​​of each of the areas to be processed.

[0034] This embodiment divides the circuit board to be processed into at least two areas to be processed, calculates the expansion and contraction value of each area to be processed based on the reference point of each area to be processed, and then controls at least two laser processing components to perform laser processing on at least two areas to be processed simultaneously based on the expansion and contraction values ​​of each area to be processed, thereby improving the processing accuracy and processing efficiency.

[0035] In some embodiments, the workbench surface is provided in plurality, the laser processing components are provided in plurality of groups, each group of the laser processing components corresponds to one of the workbench surfaces, and each group of the laser processing components includes at least two laser processing components.

[0036] In this embodiment, multiple workbench surfaces and multiple groups of laser processing components are provided, and each group of laser processing components corresponds to one workbench surface, so that multiple groups of laser processing components can be used to process multiple circuit boards to be processed at the same time, and each group of laser processing components can process different partitions of the same circuit board, thereby improving processing efficiency.

[0037] Compared with the prior art, the present application divides the circuit board to be processed into at least two areas to be processed, and then calculates the expansion and contraction value of each area to be processed based on the reference point of each area to be processed, so that the expansion and contraction value of the processed area can be calculated more accurately, thereby improving the processing accuracy. Thereafter, based on the expansion and contraction value of each area to be processed, at least two laser processing components are controlled to perform laser processing on at least two areas to be processed at the same time, thereby realizing multiple light beams processing a circuit board at the same time, and multiple light beams can process different areas of a circuit board at the same time, thereby improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1A three-dimensional diagram of the laser processing equipment provided in an embodiment of the present application.

[0039] Figure 2 A flow chart of a laser processing method provided in an embodiment of the present application.

[0040] Figure 3 A schematic diagram of a structure in which a circuit board to be processed provided in an embodiment of the present application is divided into two areas to be processed.

[0041] Figure 4 Another structural schematic diagram of the circuit board to be processed provided in an embodiment of the present application is divided into two areas to be processed.

[0042] Figure 5 The circuit board to be processed provided in the embodiment of the present application is divided into four areas to be processed.

[0043] Figure 6 A schematic diagram of the processing path in the dual-beam processing mode provided in an embodiment of the present application.

[0044] Figure ID:

[0045] 1. Bed assembly; 2. Workbench base assembly; 3. Workbench table; 4. Beam support assembly; 5. Optical platform assembly; 6. Laser processing assembly; 100. Circuit board to be processed; 101a. First area to be processed; 101b. Second area to be processed; 101c. Third area to be processed; 101d. Fourth area to be processed; 102. Processing area; 104. Processing path. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0047] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more, and the term "multiple" refers to two or more; the terms "connected", "fixed", etc. should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0049] With the continuous development of the electronics industry, the quality and performance of printed circuit boards (PCBs), as the core components of electronic devices, have a crucial impact on the stability and reliability of the entire device. In the manufacturing process of PCBs, the problem of expansion and shrinkage has always been a matter of great concern. Expansion and shrinkage refers to the dimensional changes of PCBs caused by material properties, environmental factors, process parameters, etc. during production, transportation, and assembly. The expansion and shrinkage of PCBs will also affect the processing accuracy, such as the drilling accuracy of blind holes.

[0050] In order to improve the processing accuracy, for example, to improve the deflected holes caused by the expansion and contraction of the PCB, the present application designs a multi-table multi-beam laser processing equipment, the laser processing equipment can be a CO2 laser processing equipment, the laser processing equipment can be applied to a circuit board to be processed which is divided into a plurality of processing areas. For example, the circuit board to be processed can be divided into two processing areas or four processing areas, that is, the blind holes on a circuit board can be divided into two or four partitions according to a certain ratio for processing. Specifically, a circuit board can be evenly divided into two areas along the width direction of the circuit board, or a circuit board can be evenly divided into four areas along the width and length directions of the circuit board. Of course, it is also possible not to divide it evenly, but to divide it according to the area size of the circuit board to be processed, and then process each area separately based on the expansion and contraction value of each area, so that the partition mode can effectively control the expansion and contraction value of the circuit board, thereby improving the calculation accuracy of the expansion and contraction value of the area processed by the equipment, and effectively improving the processing accuracy; at the same time, the present application adopts a processing method in which multiple beams correspond to the same table, and different partitions of a circuit board can be processed at the same time, which effectively improves the processing efficiency and enhances the competitiveness of circuit board manufacturers.

[0051] Reference Figure 1As shown, the embodiment of the present application discloses a laser processing device, which includes a bed assembly 1, a workbench base assembly 2, a workbench table 3, a beam support assembly 4, an optical platform assembly 5, a control assembly (not shown in the figure) and a laser processing assembly 6. The workbench table 3 and the laser processing assembly 6 can be provided with multiple, each workbench table 3 can be used to fix a circuit board, and each laser processing assembly 6 can emit a laser beam. The workbench base assembly 2 is arranged on the upper surface of the bed assembly 1, and the multiple workbench tables 3 can be movably arranged on the workbench base assembly 2. The beam support assembly 4 is connected to the bed assembly 1, and the optical platform assembly 5 and the multiple laser processing assemblies 6 are respectively connected to the beam support assembly 4, and the optical platform assembly 5 and the multiple laser processing assemblies 6 are respectively located above the workbench table 3. Among them, multiple workbench surfaces 3 can be used to fix multiple circuit boards to be processed, and the circuit boards to be processed are pre-divided into multiple processing areas; the optical platform component 5 can be used to take pictures of the circuit boards to be processed fixed on the workbench surface 3 for positioning; multiple laser processing components 6 can be used to process the circuit boards to be processed fixed on the workbench surface 3. The control component can be used to calculate the expansion and contraction value of each processing area of ​​the circuit board to be processed based on the reference point of each processing area of ​​the circuit board to be processed, and to control the multiple laser processing components 6 to perform laser processing on multiple processing areas of the circuit board to be processed at the same time based on the expansion and contraction values ​​of each processing area of ​​the circuit board to be processed, and the laser processing includes laser blind hole processing, laser marking, laser cutting, etc.

[0052] In some embodiments, the circuit board 100 to be processed is pre-divided into two or four processing areas. Figures 3 to 5 Of course, it can be understood that in other embodiments, the circuit board 100 to be processed can also be divided into other numbers of areas to be processed. For example, the circuit board 100 to be processed can be divided into N1 areas to be processed, where N1 is an even number and is not equal to zero. For example, the value of N1 can be 2, 4, 6, 8, 10, etc.

[0053] Continue to refer to Figure 1 As shown, in this embodiment, two workbench surfaces 3 are provided, and the two workbench surfaces 3 are respectively along the length direction of the bed assembly 1 ( Figure 1The two workbench tops 3 are arranged side by side (in the X direction in the figure), and the two workbench surfaces 3 are movably connected to the workbench base assembly 2, so that the two workbench tops 3 can move on the workbench base assembly 2 along the X direction and the Y direction. The two workbench tops 3 can be used to fix two circuit boards respectively, that is, one workbench top is used to fix one circuit board. There are two groups of laser processing components 6, each group corresponds to one workbench top 3, and each group of laser processing components includes two laser processing components 6, that is, two of the laser processing components 6 can correspond to one of the workbench tops 3, and the other two laser processing components 6 can correspond to the other workbench top 3, so that different partitions of the circuit board located on the same workbench top 3 can be processed simultaneously by multiple laser processing components 6, and the circuit boards located on each workbench top can also be processed simultaneously by multiple groups of laser processing components, and each group of laser processing components can also process different partitions of the same circuit board at the same time.

[0054] For example, when a blind hole processing is required for a circuit board to be processed, the circuit board to be processed can be placed on one of the workbench surfaces 3, and the workbench surface 3 can fix the circuit board to be processed and drive the circuit board to be processed to move in the X direction and the Y direction; then obtain the reference points in each processing area of ​​the circuit board to be processed fixed on the workbench surface 3, and then the control component calculates the expansion and contraction value of each processing area based on the reference points in each processing area of ​​the circuit board to be processed, and then the control component controls the corresponding two laser processing components 6 to perform laser processing (such as blind hole processing) on ​​different processing areas at the same time based on the expansion and contraction values ​​of each processing area of ​​the circuit board to be processed. After processing the circuit board, the control component also calculates the average expansion and contraction value of the entire circuit board based on the expansion and contraction values ​​of each processing area, and processes the average expansion and contraction value on the edge of the circuit board to record the average expansion and contraction value on the circuit board.

[0055] When blind hole processing is required for two circuit boards to be processed at the same time, the two circuit boards to be processed can be placed on two workbench surfaces 3 respectively, and the two workbench surfaces 3 can respectively fix the two circuit boards to be processed and drive the corresponding circuit boards to be processed to move in the X direction and the Y direction; then obtain the reference points in each processing area of ​​the two circuit boards to be processed respectively fixed on the two workbench surfaces 3, and then the control component calculates the expansion and contraction value of each processing area based on the reference points in each processing area of ​​each circuit board to be processed, and then the control component controls the corresponding groups of laser processing components 6 to perform laser processing on different partitions of different circuit boards to be processed at the same time based on the expansion and contraction values ​​of each processing area of ​​each circuit board to be processed. After processing the circuit board, the control component also calculates the average expansion and contraction value of each circuit board based on the expansion and contraction value of each processing area, and processes the average expansion and contraction value on the board edge of the corresponding circuit board to record the average expansion and contraction value on the circuit board.

[0056] In some other embodiments, the workbench surface 3 may also be provided with N2, and the laser processing component 6 may also be provided with N3, N2 and N3 are both even numbers and not equal to zero, and N3 may be a multiple of N2. For example, the value of N2 may be 2, 4, 6, 8, 10, etc., and the value of N3 may be 4, 8, 12, 16, 20, etc.

[0057] In some embodiments, the circuit board to be processed fixed on the workbench surface 3 can be photographed by the optical platform component 5 to capture the reference points in each area to be processed of the circuit board to be processed. For example, the circuit board to be processed can be photographed by a charge coupled device (full name: Charge coupled Device, abbreviated as: CCD) to obtain the reference points of each area to be processed in the circuit board to be processed.

[0058] The present application divides the circuit board to be processed into multiple areas to be processed, and then calculates the expansion and contraction value of each area to be processed based on the reference points of each area to be processed of the circuit board to be processed, thereby effectively optimizing the expansion and contraction value calculation method of an entire circuit board, being able to more accurately calculate the expansion and contraction value of the processed area, improving the drilling accuracy, and effectively solving the problem of offset holes caused by the expansion and contraction of the circuit board. At the same time, the single-table dual-beam processing mode designed in the present application, combined with the efficient control system of the equipment itself, can realize dual-beam processing of a circuit board at the same time, and dual-beams can process different areas of a circuit board at the same time, thereby improving the drilling efficiency. In addition, the overall design of the present application adopts a dual-table four-beam solution. The left and right tables of the equipment can process two circuit boards at the same time, and four beams are used for simultaneous processing. Compared with the traditional dual-table dual-beam equipment, this solution can greatly improve the efficiency of drilling, increase the production capacity of the circuit board factory, and thus enhance the market competitiveness.

[0059] Accordingly, refer to Figure 2 As shown, the embodiment of the present application further discloses a laser processing method, which can apply the laser processing equipment described in the above embodiment, and the laser processing method includes the steps of:

[0060] S11, partitioning the circuit board to be processed into at least two areas to be processed.

[0061] Specifically, the circuit board can be divided into N1 areas to be processed, where N1 is an even number and N1≠0. Exemplarily, the value of N1 can be 2, 4, 6, 8, 10, etc.

[0062] For example, a circuit board can be divided into two regions along the width direction of the circuit board, or a circuit board can be divided into four regions along the width and length direction of the circuit board. Figures 3 to 5 shown.

[0063] S12, calculating the expansion and contraction value of each area to be processed based on the reference point of each area to be processed.

[0064] Specifically, the number of partitions of the circuit board to be processed can be determined according to the number of groups of reference points on the circuit board to be processed 100. Generally, four reference points can form a group, and then the expansion and contraction value of each area to be processed is calculated based on the reference points of each area to be processed. Further, when calculating the expansion and contraction value of a certain area to be processed, one of the reference points in the area to be processed can be defined as a coordinate reference point, and the other reference points in the area to be processed can be defined as control points. Then, the actual coordinates of each control point relative to the coordinate reference point are calculated, and then the actual coordinates of each control point are compared with its preset coordinates to calculate the coordinate offset value of each control point; then the coordinate offset values ​​of each control point are averaged to obtain the expansion and contraction value of the corresponding area to be processed.

[0065] Exemplarily, the reference points of each area to be processed in the circuit board to be processed may be acquired by CCD photography.

[0066] S13, based on the expansion and contraction values ​​of each area to be processed, controlling at least two laser processing components to perform laser processing on at least two areas to be processed simultaneously.

[0067] Specifically, each processing area of ​​the circuit board 100 to be processed can be divided into a plurality of square processing areas 102, and the plurality of processing areas 102 are distributed along the width and length of the circuit board 100 to be processed, so that each processing area 102 forms a distribution form of multiple rows and columns, and a number of blind holes need to be processed in each processing area 102; then the laser processing assembly 6 is controlled to process each processing area 102 in sequence along the width direction of the circuit board 100 to be processed. Among them, the shape and area of ​​each processing area 102 in each processing area can be the same or different, and the length and width of the processing area 102 can both be 65 mm.

[0068] For example, when blind hole processing is performed on each processing area 102 of the circuit board 100 to be processed, the actual coordinate value of each blind hole to be processed in each processing area can be calculated based on the expansion and contraction value of each processing area and the preset coordinate value of each blind hole to be processed, and then the blind hole can be processed according to the actual coordinate value of each blind hole to be processed.

[0069] In some embodiments, when the number of processing areas 102 in the first area to be processed 101a is the same as the number of processing areas 102 in the second area to be processed 101b, each laser processing assembly 6 is controlled to process different areas to be processed respectively. Figure 3As shown, the entire circuit board 100 to be processed can be divided into a first area 101a to be processed and a second area 101b to be processed, and then the first area 101a to be processed is divided into 44 processing areas 102 of the same shape and area, and the second area 101b to be processed is divided into 44 processing areas 102 of the same shape and area. It can be seen that the number of processing areas 102 in the second area 101b to be processed is the same as the number of processing areas in the first area 101a to be processed. When processing blind holes, the reference points in the first area to be processed 101a and the second area to be processed 101b can be first captured by CCD, and then the expansion and contraction value of the first area to be processed 101a is calculated based on the reference points of the first area to be processed 101a, and the expansion and contraction value of the second area to be processed 101b is calculated based on the reference points of the second area to be processed 101b. Then, the two laser processing components 6 are controlled to process the first area to be processed 101a and the second area to be processed 101b based on the expansion and contraction values ​​of each area to be processed, specifically, each processing area 102 is processed in sequence from small to large according to the serial number of each processing area 102 in the figure.

[0070] For example, the two laser processing components 6 for processing the same workbench table 3 are respectively the first laser processing component and the second laser processing component. Then, when the first laser processing component processes the processing area 102 with the serial number 1 in the first area to be processed 101a, the second laser processing component processes the processing area 102 with the serial number 1 in the second area to be processed 101b. When the first laser processing component processes the processing area 102 with the serial number 2 in the first area to be processed 101a, the second laser processing component processes the processing area 102 with the serial number 1 in the second area to be processed 101b. The first laser processing assembly processes the processing areas 102 with serial numbers 1 to 4 in the first area to be processed 101a, and at the same time, the second laser processing assembly processes the processing areas 102 with serial numbers 1 to 4 in the second area to be processed 101b; then the first laser processing assembly processes the processing areas 102 with serial numbers 5 to 8 in the first area to be processed 101a, and at the same time, the second laser processing assembly processes the processing areas 102 with serial numbers 5 to 8 in the second area to be processed 101b, and so on, until the two areas to be processed are processed.

[0071] In other embodiments, when the difference in the number of processing areas 102 in each area to be processed is greater than a first preset value, at least one laser processing component 6 is controlled to simultaneously process multiple areas to be processed 101. Specifically, among the multiple areas to be processed simultaneously, if the difference in the number of each row of processing areas to be processed simultaneously is greater than a second preset value, for example, the difference in the number of each row of processing areas to be processed simultaneously is greater than or equal to 2, then at least one of the laser processing components is controlled to simultaneously process multiple rows of the processing areas.

[0072] Reference Figure 4As shown, the entire circuit board 100 to be processed can be divided into a first area to be processed 101a and a second area to be processed 101b, and then the first area to be processed 101a is divided into 44 processing areas 102 of the same shape and area, and the second area to be processed 101b is divided into 66 processing areas 102 of the same shape and area. It can be seen that in the first area to be processed 101a and the second area to be processed 101b to be processed simultaneously, the number of each row of processing areas 102 in the second area to be processed 101b is 2 more than the number of each row of processing areas 102 in the first area to be processed 101a. When processing blind holes, the reference points in the first area to be processed 101a and the second area to be processed 101b can be first captured by CCD, and then the expansion and contraction value of the first area to be processed 101a is calculated based on the reference points of the first area to be processed 101a, and the expansion and contraction value of the second area to be processed 101b is calculated based on the reference points of the second area to be processed 101b. Then, the two laser processing components 6 are controlled to process the first area to be processed 101a and the second area to be processed 101b based on the expansion and contraction values ​​of each area to be processed, respectively. Specifically, each processing area 102 is processed in sequence from small to large according to the serial number in the figure. At the same time, the laser processing component 6 that processes the first area to be processed 101a can also process the second area to be processed 101b.

[0073] For example, it is assumed that the two laser processing components 6 for processing the same workbench table 3 are respectively the first laser processing component and the second laser processing component. Then, when the first laser processing component processes the processing area 102 with a serial number of 1 in the first area to be processed 101a, the second laser processing component processes the processing area 102 with a serial number of 2 in the second area to be processed 101b. When the first laser processing component processes the processing area 102 with a serial number of 2 in the first area to be processed 101a, the second laser processing component processes the processing area 102 with a serial number of 3 in the second area to be processed 101b. By analogy, when the first laser processing component processes the processing area 102 with a serial number of 1 to 4 in the first area to be processed 101a, 2. After the second laser processing assembly processes the processing areas 102 numbered 2 to 5 in the second area to be processed 101b, the first laser processing assembly continues to process the processing area 102 numbered 1 in the second area to be processed 101b, and at the same time, the second laser processing assembly processes the processing area 102 numbered 6 in the second area to be processed 101b; then the first laser processing assembly processes the processing area 102 numbered 12 in the second area to be processed 101b, and then continues to process the processing areas 102 numbered 5 to 8 in the first area to be processed 101a, and at the same time, the second laser processing assembly continues to process the processing areas 102 numbered 7 to 11 in the second area to be processed 101b, and so on, until the two areas to be processed are processed.

[0074] In another embodiment, referring to Figure 5As shown, the entire circuit board 100 to be processed can be divided into a first processing area 101a, a second processing area 101b, a third processing area 101c and a fourth processing area 101d, and then the first processing area 101a and the third processing area 101c are respectively divided into 30 processing areas 102 with the same shape and area, and the second processing area 101b and the fourth processing area 101d are respectively divided into 36 processing areas 102 with the same shape and area. When processing the blind hole, the reference points in the first processing area 101a, the second processing area 101b, the third processing area 101c and the fourth processing area 101d can be captured by CCD first, and then the expansion and contraction values ​​of each processing area can be calculated based on the reference points in each processing area, and then the two laser processing components 6 are controlled to process the processing areas 102 in each processing area based on the expansion and contraction values ​​of each processing area, specifically, the processing areas 102 are processed in order from small to large according to the serial numbers of each processing area in the figure.

[0075] For example, it is assumed that the two laser processing components 6 for processing the same workbench table 3 are respectively the first laser processing component and the second laser processing component. Then, when the first laser processing component processes the processing area 102 with the serial number 1 in the first area to be processed 101a, the second laser processing component processes the processing area 102 with the serial number 1 in the second area to be processed 101b. When the first laser processing component processes the processing area 102 with the serial number 2 in the first area to be processed 101a, the second laser processing component processes the processing area 102 with the serial number 2 in the second area to be processed 101b, so that By analogy, when the first laser processing component has processed the processing areas 102 numbered 1 to 5 in the first area to be processed 101a and the second laser processing component has processed the processing areas 102 numbered 1 to 5 in the second area to be processed 101b, the first laser processing component can continue to move but without emitting light for processing. At the same time, the second laser processing component processes the processing area 102 numbered 6 in the second area to be processed 101b until the first area to be processed 101a and the second area to be processed 101b are processed, and then the third area to be processed 101c and the fourth area to be processed 101d are added in the same way.

[0076] In other embodiments, multiple circuit boards can also be processed simultaneously. For example, the laser processing components can be divided into multiple groups, so that each group of laser processing components includes at least two laser processing components, and based on the expansion and contraction values ​​of each area to be processed of the circuit boards to be processed, the multiple groups of laser processing components are controlled to process the multiple circuit boards to be processed respectively, and each group of laser processing components simultaneously processes at least two areas to be processed of the same circuit board to be processed.

[0077] In order to facilitate subsequent processing work, after processing the blind holes on the circuit board 100 to be processed, the average expansion and shrinkage value of the entire circuit board 100 to be processed can be calculated based on the expansion and shrinkage values ​​of each area to be processed, and then the average expansion and shrinkage value is processed on the edge of the circuit board 100 to be processed to facilitate subsequent processing work. Because the average expansion and shrinkage value may be used in the subsequent processing work, the average expansion and shrinkage value is recorded on the edge of the circuit board 100 to be processed for easy query.

[0078] Exemplarily, the processing path 104 converted by software is shown in FIG6 . The converted processing path pattern can match the single-table dual-beam device for simultaneous light processing, effectively improving the efficiency and accuracy of drilling.

[0079] The present application divides the circuit board 100 to be processed into multiple areas to be processed, and then calculates the expansion and contraction values ​​of each area to be processed 101 based on the reference points of each area to be processed. Then, based on the expansion and contraction values ​​of each area to be processed, multiple laser processing components 6 are controlled to perform laser processing on multiple areas to be processed at the same time, thereby effectively improving the processing accuracy and processing efficiency.

[0080] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A laser processing method, characterized in that: include: Partitioning the circuit board to be processed so that the circuit board to be processed is divided into at least two areas to be processed; Calculating the expansion and contraction value of each of the areas to be processed based on the reference points of each of the areas to be processed; Based on the expansion and contraction values ​​of each of the to-be-processed areas, at least two laser processing components are controlled to perform laser processing on at least two of the to-be-processed areas simultaneously.

2. The laser processing method according to claim 1, characterized in that: The controlling at least two laser processing components to simultaneously perform laser processing on at least two of the to-be-processed areas based on the expansion and contraction values ​​of each of the to-be-processed areas comprises: Each of the areas to be processed is divided into a plurality of square processing areas, and the plurality of processing areas are distributed along the width and length directions of the circuit board to be processed, so that each of the processing areas forms a distribution form of multiple rows and columns; The laser processing assembly is controlled to process each of the processing areas in sequence.

3. The laser processing method according to claim 2, characterized in that: The shapes and areas of the processing areas in the areas to be processed are the same.

4. The laser processing method according to claim 2, characterized in that: When the numbers of the processing areas in the multiple regions to be processed simultaneously are the same, the multiple laser processing components are controlled to process the multiple regions to be processed simultaneously respectively.

5. The laser processing method according to claim 2, characterized in that: When the difference in the number of processing areas among the multiple areas to be processed simultaneously is greater than a first preset value, at least one of the laser processing components is controlled to simultaneously process the multiple areas to be processed.

6. The laser processing method according to claim 5, characterized in that: Among the multiple areas to be processed simultaneously, if the difference in number of the processing areas in each row to be processed simultaneously is greater than a second preset value, at least one of the laser processing components is controlled to process the multiple rows of processing areas simultaneously.

7. The laser processing method according to claim 1, characterized in that: When there are multiple circuit boards to be processed simultaneously, the laser processing method further includes: Dividing the laser processing components into a plurality of groups, so that each group of the laser processing components includes at least two laser processing components; Based on the expansion and contraction values ​​of each processing area of ​​each processing circuit board, multiple groups of laser processing components are controlled to process multiple processing circuit boards respectively, and each group of laser processing components processes multiple processing areas of the same processing circuit board at the same time.

8. The laser processing method according to claim 1, characterized in that: The laser processing method further comprises: Calculating the average expansion and contraction value of the entire circuit board to be processed based on the expansion and contraction values ​​of each of the areas to be processed; The average expansion and contraction value is processed on the board edge of the circuit board to be processed.

9. The laser processing method according to any one of claims 1 to 8, characterized in that: The circuit board to be processed is divided into zones, specifically: The circuit board to be processed is divided into N1 areas to be processed, wherein N1 is an even number and N1≠0.

10. The laser processing method according to claim 9, characterized in that: The value of N1 is 2 or 4.

11. A laser processing device, characterized in that: include: A workbench surface, the workbench surface is used to fix the circuit board to be processed, wherein the circuit board to be processed is divided into at least two areas to be processed; At least two laser processing components, which are arranged above the workbench surface and are used to process the circuit board to be processed fixed on the workbench surface; A control component is used to calculate the expansion and contraction value of each of the areas to be processed based on the reference points of each of the areas to be processed, and to control at least two of the laser processing components to perform laser processing on at least two of the areas to be processed simultaneously based on the expansion and contraction values ​​of each of the areas to be processed.

12. The laser processing equipment according to claim 11, characterized in that: There are a plurality of workbench surfaces, and there are a plurality of groups of laser processing components. Each group of laser processing components corresponds to one workbench surface, and each group of laser processing components includes at least two laser processing components.

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