Green light chemical adaptive cluster rheological polishing method and device

Abstract

A green photochemical adaptive aggregation rheological polishing method comprises the following steps: 1) fixing a workpiece on a workpiece clamp driving device by using a workpiece clamp; (2) preparing a green photochemical aggregation rheological polishing liquid, the base fluid of the green photochemical aggregation rheological polishing liquid is a photo-rheological system based on reversible photo-crosslinking polymerization reaction; (3) adding the prepared polishing liquid to a photochemical aggregation rheological polishing liquid circulating system, the polishing liquid undergoes photo-crosslinking reaction in a polishing liquid photochemical aggregation rheological occurrence regulating device, and then is supplied into a photochemical aggregation adaptive polishing tool; a viscosity detection device is used for monitoring the viscosity of the polishing liquid, so that the viscosity of the polishing liquid in the machining process is adaptively regulated. And a green photochemical adaptive aggregation rheological polishing device is provided. The present application realizes the controllability of the rheological properties of the liquid flow medium in the polishing process, the high adaptability of the machined surface, the high polishing efficiency, and the deterministic polishing removal.

Description

Technical Field

[0001] This invention belongs to the field of ultra-precision machining technology, specifically relating to a green photochemical aggregate rheological grinding and polishing method and apparatus. Background Technology

[0002] Ultra-precision machining technology is a crucial support for modern high technology, a foundation for the development of modern high-tech industries and science, and a key direction for the development of modern manufacturing science. Currently, the miniaturization trend in high-tech fields such as information technology, biotechnology, advanced manufacturing, and aerospace has greatly promoted the development of ultra-precision machining technology. Ultra-precision machining can achieve ultra-high shape accuracy, surface integrity, and ultra-low surface roughness.

[0003] Polishing typically refers to a machining method that utilizes the mechanical and chemical actions of fine abrasive particles, aided by soft polishing tools, chemical processing fluids, and electric / magnetic fields, to achieve a smooth or ultra-smooth surface, reducing or completely eliminating the processing-induced degradation layer, thereby obtaining a high surface quality. Fluid polishing involves adding abrasive particles to a fluid; the fluid's movement across the workpiece surface generates friction, achieving the polishing effect. Because the fluid itself reduces direct contact between abrasive particles, thus minimizing wear and scratches on the workpiece surface, fluid polishing is often used to process high-precision workpiece surfaces.

[0004] Photoresponsive biomaterials are a type of smart biomaterial. Under the influence of light, the photosensitive groups on photoresponsive biomaterials receive light signals and then, through a photochemical reaction process, convert these signals into chemical signals, causing changes in the material's physicochemical properties. Based on the photochemical reaction mechanism of the photosensitive groups, photoresponsive biomaterials can be divided into three categories: photoisomerization, photolysis, and photopolymerization. Photoisomerization biomaterials contain photoisomerization groups, which cause changes in molecular configuration through the isomerization of photosensitive molecules. Photolysis biomaterials introduce photolysis groups into their molecular chains; under irradiation with light of a specific wavelength, these photolysis groups break chemical bonds, leading to polymer degradation. Photocrosslinking biomaterials, under irradiation with ultraviolet or visible light, undergo intramolecular or intermolecular crosslinking to form stable polymer structures. The light source is safe, clean, easy to use, and controllable. Photocrosslinking polymers can respond to specific wavelengths of light, rapidly aggregate or depolymerize, thus affecting the rheological properties of fluids. Furthermore, the resulting polymer network structure is stable and biodegradable, aligning with green and environmentally friendly processing principles, making them highly suitable for ultra-precision polishing applications.

[0005] A Chinese invention patent (ZL201810188063.2) has been granted, entitled "A Polishing Method and Apparatus Based on Photorheological Materials." This patent involves embedding photosensitive groups such as azophenyl groups and stilbene groups into a common fluid to create a photorheological polishing body. The polishing body is placed in an annular groove of a carrier disk and confined by a mesh screen. By adjusting the wavelength of light irradiating the photorheological polishing body using a light control device, changes in the molecular structure and aggregation state of the photosensitive groups occur, thereby altering the colloidal properties and adjusting the stiffness of the photorheological polishing body. This allows the photorheological polishing body to move relative to the surface of the workpiece, generating friction and achieving the polishing process on the workpiece surface. Clearly, the principle upon which this patent is based isomerization of photoisomerized photosensitive groups is mainly maintained by van der Waals forces. Compared to the chemical bonds formed by photocrosslinking reactions, the stability is less than that of photoisomerized chemical bonds, and the molecules exhibit significant shear thinning characteristics. The light exposure time required for the isomerization of the introduced photosensitive groups is relatively long, which makes it difficult to adjust the stiffness of the polished body and affects the polishing efficiency. Furthermore, the stiffness detection device described in this patent is located outside the polishing working area, making it difficult to achieve real-time detection of the stiffness of the polished body in the polishing working area.

[0006] A Chinese invention patent (ZL202110250346.7) has been granted, entitled "A Variable Stiffness Abrasive Tool Based on Photorheological Effect." This patent utilizes the photorheological effect of photorheological fluid to change the stiffness of the abrasive tool. Specifically, a photorheological fluid is filled into the abrasive tool; the viscoelasticity of the fluid changes under different wavelengths of light, thereby altering the deformability of the deformation layer and consequently changing the stiffness of the abrasive tool. This allows the abrasive tool to precisely conform to hard and brittle workpieces with free-form surfaces, achieving conformal grinding. This patent uses an ordered array of superhard abrasive particles bonded to the outer surface of the deformation layer to form an abrasive layer. Material removal is achieved through the cutting action of the abrasive layer. This is a type of bonded abrasive machining, which, compared to free abrasive machining, is more prone to causing scratches on the workpiece surface.

[0007] A Chinese invention patent (ZL201810187956.5) has been granted, entitled "A Polishing Method and Apparatus Based on Thermorheological Materials." This patent utilizes a thermosensitive polymer as the matrix of a thermorheological elastomer grinding head. Adjusting the temperature of the heat carrier causes microscopic changes in the physical or chemical properties of the thermosensitive polymer, thereby controlling the stiffness of the thermorheological elastomer grinding head to meet process requirements. The grinding head grinds against the workpiece, utilizing the micro-cutting action of the abrasive grains to achieve deterministic removal of material from the workpiece surface. However, this processing method requires maintaining a constant temperature throughout the process, which can lead to energy waste. Furthermore, the stiffness of the thermorheological elastomer grinding head is determined by the temperature of the heat carrier, and heat conduction takes time, hindering rapid adjustment and precise control of the grinding head's stiffness. In essence, this patent also involves bonded abrasive processing. Summary of the Invention

[0008] To overcome the shortcomings of existing technologies, this invention proposes a green photochemical adaptive aggregation rheological polishing method and apparatus. The method utilizes the photo-induced processing medium fluid flow aggregation rheological effect to polish abrasive particles. Under illumination at a specific wavelength (300–380 nm), the raw material components in the fluid flow undergo photocrosslinking reactions, generating a structurally stable spatial grid-type polymer that enhances the aggregation and holding capacity of abrasive particles in the fluid flow. This photochemical aggregation rheological effect-induced network abrasive functional structure cluster possesses excellent adaptability to the microscopic interfaces of complex workpiece shapes and controllable dynamic behavior of the network abrasive functional structure cluster, thereby ensuring efficient material removal and deterministic polishing removal characteristics of the target workpiece. Furthermore, the biodegradable photosensitive groups used have reversible photocrosslinking reactions, enabling the recycling of the polishing fluid flow, and the waste liquid after processing is easily treated in an environmentally friendly manner. This invention develops a unique photochemical aggregation rheological control and photochemical aggregation adaptive polishing tool system. It can induce photochemical stress on the polishing slurry in a timely manner, actively controlling its dynamic rheological behavior. Within the optimal viscosity threshold, it effectively controls the adaptive aggregation rheological properties and generates a special "photosensitive self-assembly micro-cutting tool." The deformable layer of the polishing tool can deform to fit the workpiece surface and has micropores for directional slow release of the polishing slurry. Intelligent control of the flexible tool's motion parameters allows the flexible tool to adaptively adjust the gap between the tool, the polishing slurry, and the machined surface, improving material removal rate. This patent achieves controllable rheological properties of the fluid medium during grinding and polishing, high adaptability to the machined surface, high polishing efficiency, and deterministic polishing removal.

[0009] The technical solution adopted by this invention to solve its technical problem is:

[0010] A green photochemical adaptive aggregation rheological polishing method includes the following steps:

[0011] (1) Use a workpiece fixture to fix the workpiece on the workpiece fixture drive device;

[0012] (2) Prepare a green photochemical aggregate rheological grinding and polishing slurry. The base liquid of the green photochemical aggregate rheological grinding and polishing slurry is a photorheological system based on a reversible photocrosslinking polymerization reaction. It generates an aggregate rheological effect under light irradiation with a wavelength of 300-380nm, and undergoes the opposite transformation under the conditions of stopping irradiation or irradiation with light with a wavelength of 250-280nm. In this way, the fluid can achieve specific rheological properties through light irradiation of different wavelengths. With this reversible green photochemical reaction, the aggregation effect of particles is controlled and the directional movement of abrasive particles is guided, forming a special "photosensitive self-assembled micro cutting tool" in the polishing slurry.

[0013] The polishing slurry comprises the following components by mass percentage: 10wt%-20wt% polishing abrasive particles, 20wt%-35wt% polymer monomer, 10wt%-15wt% photocrosslinking agent, 5wt%-10wt% additive, and 30wt%-40wt% deionized water. First, the polymer monomer and photocrosslinking agent are dissolved separately in a predetermined amount of deionized water to prepare a polymer monomer solution and a photocrosslinking solution, respectively. Then, the two solutions are mixed and allowed to react fully to obtain a polymer monomer solution with photosensitive groups. Additives and a predetermined amount of deionized water are added to prepare a photochemical polymeric rheological polishing base slurry of a predetermined concentration. The polishing abrasive particles are then thoroughly mixed with the photochemical polymeric rheological polishing base slurry, and the additive is added and stirred until homogeneous to prepare the photochemical polymeric rheological polishing slurry.

[0014] (3) Add the prepared polishing slurry to the photochemical aggregation rheological grinding polishing slurry circulation system, and start the polishing slurry circulation system and the polishing slurry photochemical aggregation rheological generation control device. The polishing slurry undergoes a photocrosslinking reaction in the polishing slurry photochemical aggregation rheological generation control device, and a stable spatial grid polymer is generated in the polishing slurry to hold the abrasive particles, forming a micron-level "photosensitive self-assembled micro cutting tool", which is then supplied to the photochemical aggregation adaptive polishing tool. The viscosity detection device located in the polishing tool is used to monitor the viscosity of the polishing slurry, and the sensor controls the polishing slurry photochemical aggregation rheological generation control device to adjust the degree of photochemical reaction in real time, so that the viscosity of the polishing slurry is always within the optimal viscosity threshold, and the viscosity of the polishing slurry is adaptively controlled during the processing.

[0015] Furthermore, the method also includes the following steps:

[0016] (4) For a specific surface to be processed, the motion trajectory to be processed is set in the computer control module, and the polishing tool drive device is turned on. The workpiece on the workpiece fixture moves relative to the polishing liquid on the polishing tool, which has a photochemical aggregation rheological effect. On a flat surface, the abrasive grains are wrapped by photochemical active particles, reducing damage to the surface. When encountering a roughness peak, due to the resistance, the photochemical active particle clusters that wrap the abrasive grains deform, and the cutting edge of the abrasive grains is exposed, producing a cutting effect on the roughness peak. The "photosensitive self-assembled micro-cutting tool" generates shearing force on the workpiece surface, and the material is removed by utilizing the micro-cutting action of the abrasive grains. The polishing tool adaptively adjusts the gap between the tool-polishing liquid fluid-processing area according to the real-time pressure to perform deterministic grinding and polishing with high efficiency, high precision, and low damage.

[0017] Furthermore, the method also includes the following steps:

[0018] (5) The waste liquid generated during polishing is collected in the polishing liquid depolymerization tank. Utilizing the reversibility of photocrosslinking, under the irradiation conditions of light with a wavelength of 250-280nm, the photochemical active particles undergo decrosslinking, and the polishing liquid regains its fluidity. Subsequently, the chips are separated, and the polishing liquid is recycled for the next round of polishing.

[0019] Furthermore, in step (2), the polymer monomer is a green photochemically active particle, which is a polymer monomer molecule modified by photosensitive groups. The photosensitive groups are vinyl functional groups, eosin, azide groups, and groups that can undergo photocrosslinking reactions such as cinnamic acid, coumarin, and anthracene.

[0020] In step (2), the additives include chemical additives such as surfactants and pH adjusters; the surfactants are mild and non-toxic amphoteric surfactants such as asymmetric Gemini amphoteric surfactants, chitosan-modified amphoteric surfactants, and amphoteric polyurethane surfactants; the pH adjusters are green and environmentally friendly pH adjusters such as citric acid, malic acid, and organic bases.

[0021] The polishing abrasive particles are one or a mixture of at least two of the following: metal oxides, SiO2, diamond, and calcium carbonate particles.

[0022] A green photochemical adaptive aggregation rheological polishing device includes a polishing slurry photochemical aggregation rheological generation and control device, a photochemical aggregation adaptive polishing tool system, a polishing work platform system, and a polishing slurry circulation system. The polishing tool system is installed on the polishing slurry photochemical aggregation rheological generation and control device, and the polishing slurry photochemical aggregation rheological generation and control device and the polishing slurry circulation system are installed on the polishing work platform system.

[0023] Furthermore, the internal structure of the polishing fluid photochemical aggregation rheology generation control device is divided into an ultraviolet irradiation zone and a non-irradiation zone by a light-shielding baffle. The ultraviolet emitting device is installed in the irradiation zone, and the motor is installed in the non-irradiation zone. The left end of the lead screw is connected to the motor, and the right end of the lead screw is axially positioned on the outer shell by a bearing. The movable baffle has a thread in the middle to cooperate with the lead screw. When the motor drives the lead screw to rotate, the movable baffle can move left and right. One end of the spring is fixed to the outer shell, and the other end of the spring is fixed to the movable baffle. When the movable baffle moves left and right, the spring shortens and lengthens accordingly. The polishing fluid delivery conduit is made of light-transmitting material and is fixed to the spring according to the number of turns. The extension and contraction of the spring adjusts the duration of light irradiation of the polishing fluid and controls the degree of aggregation reaction of the polishing fluid, thereby achieving the purpose of adjusting the viscosity of the polishing fluid.

[0024] Achievement of aggregation: When the polishing fluid flows through the device, it is irradiated with ultraviolet light of a specific wavelength (300-380nm) in the ultraviolet irradiation zone I, causing the photochemical active particles in the polishing fluid to undergo photocrosslinking reaction, generating a spatial network polymer, which at the same time encapsulates the abrasive particles, forming a "photosensitive self-assembled micro cutting tool". The degree of reaction is affected by the duration of light irradiation.

[0025] Viscosity adjustment: When the polishing fluid viscosity is insufficient, the motor drives the lead screw to rotate, causing the moving baffle to move to the left, the spring to contract, the number of turns of the polishing fluid delivery conduit in the irradiation area increases, the irradiation time of the polishing fluid increases, the degree of cross-linking of the internal photochemical active particles is enhanced, and the viscosity increases.

[0026] Furthermore, the aforementioned photochemical aggregation adaptive polishing tool system includes a polishing tool body, a drive shaft, a light source layer, a fluid flow layer, a deformation layer, a polishing slurry viscosity detection device, a pressure sensor, a polishing tool mounting device, and a polishing slurry delivery pipe. The deformation layer is connected to the drive shaft, the light source layer is embedded inside the polishing tool, the polishing slurry viscosity detection device is located in the fluid flow layer and is connected to the motor in the polishing slurry photochemical aggregation rheology generation and control device, the pressure sensor is located at the micropores of the deformation layer, the polishing tool mounting device is located on the polishing tool body, and the polishing slurry delivery pipe is installed on the polishing tool body and communicates with the fluid flow layer.

[0027] Preferably, the deformation layer has good deformation capability, adaptively conforms to the workpiece surface, and has micropores on it. Polishing fluid is supplied to the outer surface of the deformation layer through these micropores, achieving directional slow release of the polishing fluid. The drive shaft is connected to the deformation layer, causing the deformation layer to drive the polishing fluid and the workpiece surface to move relative to each other. The light source layer, embedded inside the polishing tool, emits ultraviolet light to continuously induce photocrosslinking reactions in the green photochemical active particles in the polishing fluid, actively controlling dynamic rheological behavior and effectively controlling the aggregation rheological properties within the optimal viscosity threshold, further "reinforcing" the "photosensitive self-assembly micro-cutting tool" in the polishing fluid. The polishing fluid viscosity detection device monitors the viscosity of the polishing fluid in real time and feeds it back to the polishing fluid. The photochemical aggregation rheology generation and control device controls the motor to rotate forward, reverse, or maintain its position, thereby achieving real-time dynamic adjustment of the polishing slurry viscosity. The pressure sensor is used to measure the pressure of the polishing tool on the workpiece surface. The polishing tool adaptively adjusts the gap between the tool, the polishing slurry fluid, and the processing area based on the real-time pressure. The polishing tool system is installed at the polishing slurry outlet of the photochemical aggregation rheology generation and control device via the polishing tool mounting device. The polishing slurry in the photochemical aggregation rheology generation and control device is supplied to the fluid layer through the polishing slurry delivery pipe. The motion parameters of the polishing tool are intelligently controlled by the computer control module to perform efficient, high-precision, and deterministic grinding and polishing.

[0028] The polishing work platform system includes a polishing work disc, a splash guard, a workpiece clamp, and a workpiece clamp driving device. The workpiece clamp is installed at the center of the polishing work disc. The polishing work disc is controlled to move up and down by a pressure sensor in the polishing tool system to ensure that the polishing tool is always in contact with the workpiece surface with a certain pressure. The splash guard is installed on the outer edge of the polishing work disc, and the height of the guard is 2-3 cm higher than the workpiece clamp. There is an opening at the bottom of the polishing work disc to facilitate the outflow of polishing fluid after processing.

[0029] The polishing slurry circulation system includes a polishing slurry depolymerization tank, a chip separation device, a polishing slurry storage device, and a polishing slurry delivery pump. The polishing slurry inlet of the polishing slurry depolymerization tank is connected to the opening below the polishing work disc. The outlet of the polishing slurry depolymerization tank is connected to the inlet of the chip separation device. The outlet of the chip separation device is connected to the inlet of the polishing slurry storage device through the polishing slurry delivery pump.

[0030] The polishing slurry depolymerization tank contains a light emitting device that emits visible light, which promotes the depolymerization reaction of polymers in the polishing slurry, facilitating chip separation, restoring the fluidity of the polishing slurry, and facilitating its transport and circulation. The chip separation device can separate chips from the polishing slurry, and the purified polishing slurry is transported to the polishing slurry storage device, which has an opening for replenishing the polishing slurry.

[0031] The device also includes a computer control module. The polishing tool system is installed on the polishing liquid photochemical aggregation rheology generation control device and can move in four directions: forward, backward, left, and right. The specific movement trajectory and speed are set in the computer control module according to the characteristics of the surface to be processed.

[0032] The technical concept of this invention is as follows: by utilizing the reversibility of photocrosslinking reaction, the polishing slurry has good fluidity when circulating in the non-polishing area, while in the polishing working area, it can complete the self-assembly of "micro cutting tools" in real time for polishing; the polishing slurry aggregation effect occurs in real time in the polishing area, and the polishing slurry is recycled to achieve pollution-free, low-loss, and low-cost green polishing.

[0033] The aforementioned photochemical aggregation rheological polishing slurry is a reversible photorheological system containing green photochemical active particles. These green photochemical active particles are polymer monomer molecules modified with photosensitive groups. Under ultraviolet light irradiation, they undergo intramolecular or intermolecular cross-linking and aggregation to form a three-dimensional network structure. A novel polishing medium with a green adaptive aggregation rheological effect is formulated with polishing abrasive grains to create a processing suspension. The green photochemical interface reaction controls the particle aggregation effect of the suspension and guides the directional movement of the abrasive grains, achieving a flexible adaptive particle aggregation rheological mechanism in the suspension, forming a "photosensitive self-assembled micro-cutting tool" to achieve micro-removal efficiency. The photocrosslinking reaction is reversible and recyclable. The green photochemical active particles are used for photochemical aggregation and deaggregation, dynamically adjusting the viscosity of the polishing slurry in real time. After polishing, impurities in the waste polishing liquid are removed, and the green photochemical active particles can be recycled, perfectly aligning with the concept of green environmental protection and effectively reducing processing costs. The photosensitive groups include vinyl functional groups, eosin, azide groups, and groups such as cinnamic acid, coumarin, and anthracene that can undergo photocrosslinking reactions.

[0034] This invention achieves controllability of the rheological properties of the liquid medium during grinding and polishing, high adaptability of the processed surface, high grinding and polishing efficiency, and deterministic grinding and polishing removal.

[0035] The beneficial effects of this invention are mainly reflected in:

[0036] 1. This invention employs a polishing slurry that guides the aggregation rheological effect through a green photochemical reaction. The light source is safe, clean, easy to use, and controllable. The green photochemical active particles contained in the polishing slurry undergo a reversible photocrosslinking reaction under specific wavelength (300-380nm) light irradiation, causing the molecules to aggregate. The resulting stable spatial grid-like polymers not only provide a good holding effect for abrasive particles and guide the directional movement of abrasive particles to form a "photosensitive self-assembly micro-cutting tool" that produces micro-cutting action on the workpiece surface, but also have excellent adaptive deformation ability and can well match the surface shape of the workpiece to be processed.

[0037] 2. The photocrosslinking reaction occurring in the polishing slurry is reversible. When irradiated with ultraviolet light of a specific wavelength (300–380 nm), the photocrosslinking reaction in the polishing slurry proceeds in the forward direction, inducing a molecular aggregation effect; when irradiated with light of other wavelengths (250–280 nm), the photocrosslinking reaction in the polishing slurry proceeds in the reverse direction, inducing a molecular deagglomeration effect. The photocrosslinking reaction requires a short time, facilitating timely adjustment of the polishing slurry viscosity. Furthermore, no other substances are generated during the reaction, allowing the polishing slurry to be recycled without replacement. The green photochemical active particles are biodegradable and non-polluting, and the waste liquid after processing is easily treated in an environmentally friendly manner.

[0038] 3. This invention develops a special photochemical aggregation rheological control and photochemical aggregation adaptive polishing tool system, which can timely induce photochemical stress on the polishing slurry, actively control dynamic rheological behavior, effectively control adaptive aggregation rheological performance within the optimal viscosity threshold, and generate a special "photosensitive self-assembly micro-cutting tool"; the polishing tool has a deformable layer that can deform and fit the workpiece surface, and has micropores to achieve directional slow release of the polishing slurry; the intelligent control of the flexible tool's motion parameters allows the flexible tool to adaptively adjust the gap between the tool, the polishing slurry fluid, and the processing area, thereby improving the material removal rate. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of a green photochemical adaptive aggregation rheological polishing device (where 01 is a microscopic schematic diagram when the polishing slurry does not exhibit photochemical aggregation rheological effects, 02 is a microscopic schematic diagram after the polishing slurry exhibits photochemical aggregation rheological effects, and 03 is a magnified view of the polishing position details).

[0040] Figure 2 Schematic diagram of a device for controlling the photochemical aggregation rheology of polishing fluid.

[0041] Figure 3 This is a schematic diagram of a photochemical agglomeration adaptive polishing tool system.

[0042] Figure 4 This is a schematic diagram of the polishing slurry circulation system.

[0043] Figure 5 This is a schematic diagram of the photocrosslinking reaction principle (taking a four-armed photocrosslinked coumarin monomer as an example).

[0044] Figure 6 Microscopic diagrams of (a) the green photochemical aggregated rheological grinding and polishing slurry before operation and (b) the aggregated rheological effect that cuts the surface roughness peaks of the workpiece.

[0045] Figure 7 The diagram shows the processing of (a) a complex curved surface and (b) a micro array surface when using an adaptive polishing tool for photochemical aggregation.

[0046] In the attached figures, 1 is the polishing slurry photochemical aggregation rheology generation control device, 2 is the photochemical aggregation adaptive polishing tool system, 3 is the polishing slurry circulation system, 4 is the polishing work platform system, 5 is the workpiece, 6 is the splash guard, 7 is the workpiece clamp, 8 is the polishing work disc, 9 is the workpiece clamp drive device, 10 is the photosensitive group that can undergo photocrosslinking reaction, 11 is the group formed after the photocrosslinking reaction, 12 is the photocrosslinking polymer monomer, 13 is the spatial network polymer generated by the photocrosslinking reaction, 14 is the green photochemical active particle, 15 is the abrasive particle, 16 is the surfactant, 17 is the pH adjuster, 18 is the polishing slurry movement direction, 19 is the pressure applied by the polishing tool to the workpiece surface, and 20 is the chip. Detailed Implementation

[0047] The present invention will now be further described with reference to the accompanying drawings.

[0048] Reference Figures 1 to 7 A green photochemical adaptive aggregation rheological polishing method includes the following steps:

[0049] (1) Use a workpiece fixture to fix the workpiece on the workpiece fixture drive device;

[0050] (2) Prepare a green photochemical aggregate rheological grinding and polishing slurry. The base liquid of the green photochemical aggregate rheological grinding and polishing slurry is a photorheological system based on a reversible photocrosslinking polymerization reaction. It generates an aggregate rheological effect under light irradiation with a wavelength of 300-380nm, and undergoes the opposite transformation under the conditions of stopping irradiation or irradiation with light with a wavelength of 250-280nm. In this way, the fluid can achieve specific rheological properties through light irradiation of different wavelengths. With this reversible green photochemical reaction, the aggregation effect of particles is controlled and the directional movement of abrasive particles is guided, forming a special "photosensitive self-assembled micro cutting tool" in the polishing slurry.

[0051] The polishing slurry comprises the following components by mass percentage: 10wt%-20wt% polishing abrasive particles, 20wt%-35wt% polymer monomer, 10wt%-15wt% photocrosslinking agent, 5wt%-10wt% additive, and 30wt%-40wt% deionized water. First, the polymer monomer and photocrosslinking agent are dissolved separately in a predetermined amount of deionized water to prepare a polymer monomer solution and a photocrosslinking solution, respectively. Then, the two solutions are mixed and allowed to react fully to obtain a polymer monomer solution with photosensitive groups. Additives and a predetermined amount of deionized water are added to prepare a photochemical polymeric rheological polishing base slurry of a predetermined concentration. The polishing abrasive particles are then thoroughly mixed with the photochemical polymeric rheological polishing base slurry, and the additive is added and stirred until homogeneous to prepare the photochemical polymeric rheological polishing slurry.

[0052] In step (2), the polymer monomer is a green photochemically active particle, which is a polymer monomer molecule modified by photosensitive groups. The photosensitive groups are vinyl functional groups, eosin, azide groups, and groups that can undergo photocrosslinking reactions such as cinnamic acid, coumarin, and anthracene.

[0053] In step (2), the additives include chemical additives such as surfactants and pH adjusters; the surfactants are mild and non-toxic amphoteric surfactants such as asymmetric Gemini amphoteric surfactants, chitosan-modified amphoteric surfactants, and amphoteric polyurethane surfactants; the pH adjusters are green and environmentally friendly pH adjusters such as citric acid, malic acid, and organic bases.

[0054] The polishing abrasive particles are one or a mixture of at least two of the following: metal oxides, SiO2, diamond, and calcium carbonate particles.

[0055] (3) Add the prepared polishing slurry to the photochemical aggregation rheological grinding polishing slurry circulation system, and start the polishing slurry circulation system and the polishing slurry photochemical aggregation rheological generation control device. The polishing slurry undergoes a photocrosslinking reaction in the polishing slurry photochemical aggregation rheological generation control device, and a stable spatial grid polymer is generated in the polishing slurry to hold the abrasive particles, forming a micron-level "photosensitive self-assembled micro cutting tool", which is then supplied to the photochemical aggregation adaptive polishing tool. The viscosity detection device located in the polishing tool is used to monitor the viscosity of the polishing slurry, and the sensor controls the polishing slurry photochemical aggregation rheological generation control device to adjust the degree of photochemical reaction in real time, so that the viscosity of the polishing slurry is always within the optimal viscosity threshold, and the viscosity of the polishing slurry is adaptively controlled during the processing.

[0056] (4) For a specific surface to be processed, the motion trajectory to be processed is set in the computer control module, and the polishing tool drive device is turned on. The workpiece on the workpiece fixture moves relative to the polishing liquid on the polishing tool, which has a photochemical aggregation rheological effect. On a flat surface, the abrasive grains are wrapped by photochemical active particles, reducing damage to the surface. When encountering a roughness peak, due to the resistance, the photochemical active particle clusters that wrap the abrasive grains deform, and the cutting edge of the abrasive grains is exposed, producing a cutting effect on the roughness peak. The "photosensitive self-assembled micro-cutting tool" generates shearing force on the workpiece surface, and the material is removed by utilizing the micro-cutting action of the abrasive grains. The polishing tool adaptively adjusts the gap between the tool-polishing liquid fluid-processing area according to the real-time pressure to perform deterministic grinding and polishing with high efficiency, high precision, and low damage.

[0057] (5) The waste liquid generated during polishing is collected in the polishing liquid depolymerization tank. Utilizing the reversibility of photocrosslinking, under the irradiation conditions of light with a wavelength of 250-280nm, the photochemical active particles undergo decrosslinking, and the polishing liquid regains its fluidity. Subsequently, the chips are separated, and the polishing liquid is recycled for the next round of polishing.

[0058] Reference Figure 1 A green photochemical aggregation rheological grinding and polishing device, the device comprising a polishing slurry photochemical aggregation rheological generation control device 1, a photochemical aggregation adaptive grinding and polishing tool system 2, a polishing slurry circulation system 3, a polishing work platform system 4, and a computer control module.

[0059] The photochemical aggregation adaptive polishing tool system 2 is installed on the photochemical aggregation rheology generation and control device 1 of the polishing liquid, and can move in four directions: forward, backward, left, and right. The specific movement trajectory and speed are set in the computer control module according to the characteristics of the surface to be processed.

[0060] Reference Figure 2 The polishing fluid photochemical aggregation rheology generation control device 1 is internally divided into an ultraviolet irradiation zone I and a non-irradiation zone II by a light-shielding baffle 103. An ultraviolet emitting device 101 is installed in the irradiation zone, and a motor 104 is installed in the non-irradiation zone. The left end of the lead screw 106 is connected to the motor 104, and the right end is axially positioned on the outer shell 108 by a bearing 107. The movable baffle 105 has a thread in the middle to cooperate with the lead screw 106. When the motor 104 drives the lead screw 106 to rotate, the movable baffle 105 can move left and right. One end of the spring 102 is fixed to the outer shell 108, and the other end is fixed to the movable baffle 105. When the movable baffle 105 moves left and right, the spring 102 shortens and extends accordingly. The polishing fluid delivery conduit 109 is made of light-transmitting material and is fixed to the spring 102 according to the number of turns. The extension and contraction of the spring 102 adjusts the duration of light irradiation of the polishing fluid and controls the degree of aggregation reaction of the polishing fluid, thereby achieving the purpose of adjusting the viscosity of the polishing fluid.

[0061] Achievement of aggregation: When the polishing fluid flows through the device, it is irradiated with ultraviolet light of a specific wavelength (300-380nm) in the ultraviolet irradiation zone I, causing the photochemical active particles in the polishing fluid to undergo photocrosslinking reaction, generating a spatial network polymer, which at the same time encapsulates the abrasive particles, forming a "photosensitive self-assembled micro cutting tool". The degree of reaction is affected by the duration of light irradiation.

[0062] Viscosity adjustment: When the viscosity of the polishing liquid is insufficient, the motor 104 drives the lead screw 106 to rotate, causing the moving baffle 105 to move to the left, the spring 102 to contract, the number of turns of the polishing liquid delivery conduit 109 in the irradiation zone I increases, the irradiation time of the polishing liquid increases, the degree of cross-linking of the internal photochemical active particles is enhanced, and the viscosity increases.

[0063] Reference Figure 3The photochemical aggregation adaptive polishing tool system 2 includes a polishing tool body 201, a drive shaft 202, a light source layer 203, a fluid flow layer 204, a deformation layer 205, a polishing slurry viscosity detection device 206, a pressure sensor 207, a polishing tool mounting device 208, and a polishing slurry delivery pipe 209. The deformation layer 205 is connected to the drive shaft 202. The light source layer 203 is embedded inside the polishing tool. The polishing slurry viscosity detection device 206 is located in the fluid flow layer 204 and is connected to the motor 104 in the polishing slurry photochemical aggregation rheology generation and control device 1. The pressure sensor 207 is located at the micropore 210 of the deformation layer. The polishing tool mounting device 208 is located on the polishing tool body 201. The polishing slurry delivery pipe 209 is installed on the polishing tool body 201 and communicates with the fluid flow layer 204.

[0064] The deformation layer 205 has excellent deformation capability, adaptively conforming to the workpiece surface. Micropores 210 are formed on the deformation layer, through which polishing slurry is supplied to the outer surface of the deformation layer 205, achieving directional slow release of the polishing slurry. The drive shaft 202 is connected to the deformation layer 205, causing the deformation layer 205 to drive the polishing slurry and the workpiece surface to move relative to each other. The light source layer 203, embedded inside the polishing tool, emits ultraviolet light, causing the green photochemical active particles in the polishing slurry to continuously undergo photocrosslinking reactions, actively controlling dynamic rheological behavior, effectively controlling the aggregation rheological properties within the optimal viscosity threshold, further "reinforcing" the "photosensitive self-assembly micro-cutting tool" in the polishing slurry. The polishing slurry viscosity detection device 206 monitors the viscosity of the polishing slurry in real time and feeds it back to the polishing fluid. The photochemical aggregation rheology generation and control device 1 controls the motor 104 to rotate forward, reverse, or hold, thereby achieving real-time dynamic adjustment of the polishing slurry viscosity. The pressure sensor 207 is used to measure the pressure of the polishing tool 2 on the workpiece surface 5. The polishing tool 2 adaptively adjusts the gap between the tool, the polishing slurry fluid, and the processing area based on the real-time pressure. The polishing tool system 2 is installed at the polishing slurry outlet of the polishing slurry photochemical aggregation rheology generation and control device 1 via the polishing tool mounting device 208. The polishing slurry in the polishing slurry photochemical aggregation rheology generation and control device 1 is supplied to the liquid flow layer 204 through the polishing slurry delivery pipe 209. The polishing tool 2 is intelligently controlled by the computer control module to perform efficient, high-precision, and deterministic grinding and polishing.

[0065] Reference Figure 4The polishing slurry circulation system 3 includes a polishing slurry depolymerization tank 301, a chip separation device 302, a polishing slurry storage device 303, and a polishing slurry delivery pump 304. The polishing slurry inlet of the polishing slurry depolymerization tank 301 is connected to the opening below the polishing work disc 8. The outlet of the polishing slurry depolymerization tank 301 is connected to the inlet of the chip separation device 302. The outlet of the chip separation device 302 is connected to the inlet of the polishing slurry storage device 303. The outlet of the polishing slurry storage device 303 is connected to the polishing slurry inlet of the polishing slurry photochemical aggregation rheology generation and control device 1 through the polishing slurry delivery pump 304.

[0066] The polishing slurry depolymerization tank 301 contains a light emitting device that emits visible light, which promotes the depolymerization reaction of polymers in the polishing slurry, facilitating chip separation, restoring the fluidity of the polishing slurry, and facilitating its transport and circulation. The chip separation device 302 can separate chips from the polishing slurry, and the purified polishing slurry is transported to the polishing slurry storage device 303, which has an opening 305 for replenishing the polishing slurry.

[0067] Reference Figure 1 The polishing work platform system 4 includes a polishing work disc 8, a splash guard 6, a workpiece clamp 7, and a workpiece clamp driving device 9. The workpiece clamp 7 is installed at the center of the polishing work disc 8. The polishing work disc 8 is controlled to move up and down by the pressure sensor 207 in the photochemical aggregation adaptive polishing tool system 2 to ensure that the polishing tool 2 is always in contact with the workpiece surface 5 with a certain pressure. The splash guard 6 is installed on the outer edge of the polishing work disc 8. The height of the guard is 2-3 cm higher than the workpiece clamp. There is an opening at the bottom of the polishing work disc 8 to facilitate the flow of polishing liquid after processing.

[0068] Reference Figures 5-7 Photocrosslinking reaction principle: A four-armed photocurable coumarin monomer 12 has four coumarin groups 10. When irradiated with 365nm light, the coumarin groups 10 undergo a photocrosslinking reaction to generate new groups 11. The new groups cause the coumarin monomer 12 to crosslink with each other, forming a stable three-dimensional spatial network structure 13.

[0069] Material removal mechanism: Before illumination, both the green photochemical active particles 14 and abrasive particles 15 in the polishing slurry are in a free state. Under illumination of a specific wavelength (300-380nm), the green photochemical active particles 14 undergo photocrosslinking reactions to form a spatial network structure. This structure encapsulates the abrasive particles 15, creating a holding effect and forming a "photosensitive self-assembly micro-cutting tool". The polishing tool 2, coated with polishing slurry, applies pressure 19 to the workpiece surface 5 and rotates. The micro-cutting tool exerts pressure on the workpiece surface and undergoes relative motion 18, achieving material removal. The deformable layer 205 of the photochemical aggregation adaptive polishing tool 2 has excellent deformability and can adaptively conform to complex surfaces such as complex curved surfaces 501 and micro-array surfaces 502.

[0070] Example 1

[0071] This invention is applicable to the processing of planar and curved surfaces of hard and brittle materials, semiconductor materials, optical materials, etc. For example, when processing a SiC semiconductor material workpiece with dimensions of 25mm × 25mm × 5mm (length × width × height), the processing steps are as follows:

[0072] (1) The SiC semiconductor material workpiece 5 is fixed on the workpiece clamp drive device 9 using the workpiece clamp 7;

[0073] (2) A green photochemical aggregate rheological grinding and polishing slurry is prepared. The base liquid of the photochemical aggregate rheological grinding and polishing slurry is a photorheological system based on a reversible photocrosslinking polymerization reaction. It generates an aggregate rheological effect under light irradiation at a certain wavelength (365nm) and can undergo the opposite transformation under light irradiation at other wavelengths (250-280nm). In this way, the fluid can achieve specific rheological properties through light irradiation at different wavelengths. The particle aggregation effect is controlled by this reversible green photochemical reaction and the abrasive particles are guided to move in a specific direction, forming a special "photosensitive self-assembled micro cutting tool" in the polishing slurry.

[0074] The polishing slurry comprises the following components by mass percentage: 15 wt% polishing abrasive diamond, 25 wt% polymeric monomer allyl formate, 15 wt% photocrosslinking agent anthracene, 5 wt% Gemini amphoteric surfactant, 5 wt% pH adjuster citric acid, and 35 wt% deionized water. First, the polymeric monomer and photocrosslinking agent are dissolved separately in a certain amount of deionized water to prepare a polymeric monomer solution and a photocrosslinking solution, respectively. Then, the two solutions are mixed and reacted fully under certain conditions to obtain an allyl 9-anthracarboxylic acid solution. Additives and a certain amount of deionized water are added to prepare a photochemical polymeric rheological polishing base slurry of a specific concentration. The polishing abrasive is then thoroughly mixed with the photochemical polymeric rheological polishing base slurry, and additives are added and stirred until homogeneous to prepare the photochemical polymeric rheological polishing slurry.

[0075] (3) The prepared polishing slurry is added to the photochemical aggregation rheological grinding polishing slurry circulation system 3, and the polishing slurry circulation system 3 and the polishing slurry photochemical aggregation rheological generation control device 1 are started. The polishing slurry undergoes a photocrosslinking reaction in the polishing slurry photochemical aggregation rheological generation control device 1, and a stable spatial grid polymer is generated in the polishing slurry to hold the abrasive particles and form a micron-level "photosensitive self-assembled micro cutting tool", which is then supplied to the photochemical aggregation adaptive polishing tool 2. The viscosity detection device 206 located in the polishing tool 2 can monitor the viscosity of the polishing slurry and control the degree of photochemical reaction in real time through the sensor to control the polishing slurry photochemical aggregation rheological generation control device 1, so that the viscosity of the polishing slurry is always within the optimal viscosity threshold, and the viscosity of the polishing slurry is adaptively controlled during the processing. When processing different types of workpieces, the optimal viscosity for a specific workpiece is set according to the material properties, shape characteristics, processing requirements, etc. of the workpiece, so as to achieve adaptive control of the viscosity of the polishing slurry for different types of workpieces, and achieve low energy consumption, high efficiency, strong targeting and wide adaptability polishing.

[0076] (4) For the surface to be processed 5, the motion trajectory to be processed is set in the computer control module, and the polishing tool drive device 202 is turned on. The workpiece 5 on the workpiece fixture 7 moves relative to the polishing liquid on the polishing tool 2 which has a photochemical aggregation rheological effect. On the flat surface, the abrasive grains are wrapped by photochemical active particles, which reduces the damage to the surface. When encountering the roughness peak, due to the resistance, the photochemical active particle cluster wrapped with abrasive grains deforms, and the cutting edge of the abrasive grains is exposed, which produces a cutting effect on the roughness peak. The "photosensitive self-assembled micro cutting tool" generates shearing force on the workpiece surface and uses the micro-cutting action of abrasive grains to achieve material removal. The polishing tool adaptively adjusts the gap between the tool 2, the polishing liquid fluid, and the processing area 5 according to the real-time pressure to perform efficient, high-precision, and low-damage deterministic grinding and polishing.

[0077] (5) The waste liquid generated during polishing is collected in the polishing liquid depolymerization tank 301. Utilizing the reversibility of photocrosslinking, under irradiation conditions of other wavelengths of light (250-280nm), the photochemical active particles undergo decrosslinking, and the polishing liquid regains its fluidity. Subsequently, the chips are separated, and the polishing liquid is recycled for the next round of polishing. Utilizing the reversibility of the photocrosslinking reaction, the polishing liquid has good fluidity when circulating in the non-polishing area, while in the polishing working area, it can complete the self-assembly of "micro-cutting tools" in real time for polishing. The polishing liquid aggregation effect occurs in real time in the polishing area, and the polishing liquid is recycled, achieving pollution-free, low-loss, and low-cost green polishing.

[0078] Example 2

[0079] This invention relates to the processing of planar and curved surfaces of hard and brittle materials, semiconductor materials, optical materials, etc. For example, when processing convex curved optical glass with a diameter of 30mm and a focal length of 60mm, the processing steps are as follows:

[0080] (1) Use the workpiece clamp 7 to fix the convex curved optical glass 5 onto the workpiece clamp drive device 9;

[0081] (2) A green photochemical adaptive aggregate rheological polishing slurry is prepared. The base liquid of the photochemical adaptive aggregate rheological polishing slurry is a photorheological system based on a reversible photocrosslinking polymerization reaction. It generates an aggregate rheological effect under light irradiation at a certain wavelength (365nm) and can undergo the opposite transformation under light irradiation at other wavelengths (254nm). In this way, the fluid can achieve specific rheological properties through light irradiation at different wavelengths. The particle aggregation effect is controlled by this reversible green photochemical reaction and the abrasive particles are guided to move in a specific direction, forming a special "photosensitive self-assembly micro cutting tool" in the polishing slurry.

[0082] The polishing slurry comprises the following components by mass percentage: polishing abrasive Al2O3, diamond mixed abrasive 12wt%, polymeric monomer acrylamide 30wt%, photocrosslinking agent coumarin 15wt%, additive chitosan-modified zwitterionic surfactant 4wt%, pH adjuster methylpropanol 4wt%, and deionized water 35wt%. First, the polymeric monomer and photocrosslinking agent are dissolved separately in a certain amount of deionized water to prepare a polymeric monomer solution and a photocrosslinking solution, respectively. Then, the two solutions are mixed and reacted fully under certain conditions to obtain a polymeric monomer solution of coumarin-functionalized acrylamide monomer. Additives and a certain amount of deionized water are added to prepare a photochemical polymeric rheological polishing base slurry of a specific concentration. The polishing abrasive and the photochemical polymeric rheological polishing base slurry are thoroughly mixed and stirred evenly to prepare the photochemical polymeric rheological polishing slurry.

[0083] (3) The prepared polishing slurry is added to the photochemical aggregation rheological grinding polishing slurry circulation system 3, and the polishing slurry circulation system 3 and the polishing slurry photochemical aggregation rheological generation control device 1 are started. The polishing slurry undergoes a photocrosslinking reaction in the polishing slurry photochemical aggregation rheological generation control device 1, and a stable spatial grid polymer is generated in the polishing slurry to hold the abrasive particles and form a micron-level "photosensitive self-assembled micro cutting tool", which is then supplied to the photochemical aggregation adaptive polishing tool 2. The viscosity detection device 206 located in the polishing tool 2 can monitor the viscosity of the polishing slurry and control the degree of photochemical reaction in real time through the sensor to control the polishing slurry photochemical aggregation rheological generation control device 1, so that the viscosity of the polishing slurry is always within the optimal viscosity threshold, and the viscosity of the polishing slurry is adaptively controlled during the processing. When processing different types of workpieces, the optimal viscosity for a specific workpiece is set according to the material properties, shape characteristics, processing requirements, etc. of the workpiece, so as to achieve adaptive control of the viscosity of the polishing slurry for different types of workpieces, and achieve low energy consumption, high efficiency, strong targeting and wide adaptability polishing.

[0084] (4) For the surface to be processed 5, the motion trajectory to be processed is set in the computer control module, and the polishing tool drive device 202 is turned on. The workpiece 5 on the workpiece fixture 7 moves relative to the polishing liquid on the polishing tool 2 which has a photochemical aggregation rheological effect. On the flat surface, the abrasive grains are wrapped by photochemical active particles, which reduces the damage to the surface. When encountering the roughness peak, due to the resistance, the photochemical active particle cluster wrapped with abrasive grains deforms, and the cutting edge of the abrasive grains is exposed, which produces a cutting effect on the roughness peak. The "photosensitive self-assembled micro cutting tool" generates shearing force on the workpiece surface and uses the micro-cutting action of abrasive grains to achieve material removal. The polishing tool adaptively adjusts the gap between the tool 2, the polishing liquid fluid, and the processing area 5 according to the real-time pressure to perform efficient, high-precision, and low-damage deterministic grinding and polishing.

[0085] (5) The waste liquid generated during polishing is collected in the polishing liquid depolymerization tank 301. Utilizing the reversibility of photocrosslinking, under irradiation conditions of other wavelengths of light (250-280nm), the photochemical active particles undergo decrosslinking, and the polishing liquid regains its fluidity. Subsequently, the chips are separated, and the polishing liquid is recycled for the next round of polishing. Utilizing the reversibility of the photocrosslinking reaction, the polishing liquid has good fluidity when circulating in the non-polishing area, while in the polishing working area, it can complete the self-assembly of "micro-cutting tools" in real time for polishing. The polishing liquid aggregation effect occurs in real time in the polishing area, and the polishing liquid is recycled, achieving pollution-free, low-loss, and low-cost green polishing.

[0086] The embodiments described in this specification are merely examples of implementations of the inventive concept and are for illustrative purposes only. The scope of protection of this invention should not be considered limited to the specific forms described in these embodiments; rather, it extends to equivalent technical means conceived by those skilled in the art based on the inventive concept.

Claims

1. A green photochemical adaptive aggregation rheological polishing method, characterized in that, The method includes the following steps: (1) Use a workpiece fixture to fix the workpiece on the workpiece fixture drive device; (2) Prepare a green photochemical aggregate rheological grinding and polishing slurry. The base liquid of the green photochemical aggregate rheological grinding and polishing slurry is a photorheological system based on a reversible photocrosslinking polymerization reaction. It generates an aggregate rheological effect under light irradiation with a wavelength of 300-380nm, and undergoes the opposite transformation under the conditions of stopping irradiation or irradiation with light with a wavelength of 250-280nm. In this way, the fluid can achieve specific rheological properties through light irradiation of different wavelengths. With this reversible green photochemical reaction, the aggregation effect of particles is controlled and the directional movement of abrasive particles is guided, forming a special "photosensitive self-assembled micro cutting tool" in the polishing slurry. The polishing slurry comprises the following components by mass percentage: 10wt%-20wt% polishing abrasive particles, 20wt%-35wt% polymer monomer, 10wt%-15wt% photocrosslinking agent, 5wt%-10wt% additive, and 30wt%-40wt% deionized water. First, the polymer monomer and photocrosslinking agent are dissolved separately in a predetermined amount of deionized water to prepare a polymer monomer solution and a photocrosslinking solution, respectively. Then, the two solutions are mixed and allowed to react fully to obtain a polymer monomer solution with photosensitive groups. Additives and a predetermined amount of deionized water are added to prepare a photochemical polymeric rheological polishing base slurry of a predetermined concentration. The polishing abrasive particles are then thoroughly mixed with the photochemical polymeric rheological polishing base slurry, and additives are added and stirred until homogeneous to prepare the photochemical polymeric rheological polishing slurry. (3) Add the prepared polishing slurry to the photochemical aggregation rheological grinding polishing slurry circulation system, and start the polishing slurry circulation system and the polishing slurry photochemical aggregation rheological generation control device. The polishing slurry undergoes a photocrosslinking reaction in the polishing slurry photochemical aggregation rheological generation control device. A stable spatial grid polymer is generated in the polishing slurry to hold the abrasive particles and form a micron-level "photosensitive self-assembled micro cutting tool". It is then supplied to the photochemical aggregation adaptive polishing tool. The viscosity detection device located in the polishing tool is used to monitor the viscosity of the polishing slurry and control the degree of photochemical reaction in real time through the sensor to control the polishing slurry photochemical aggregation rheological generation control device, so that the viscosity of the polishing slurry is always within the optimal viscosity threshold, and the viscosity of the polishing slurry is adaptively controlled during the processing.

2. The green photochemical adaptive aggregation rheological polishing method as described in claim 1, characterized in that, The method further includes the following steps: (4) For a specific surface to be processed, the motion trajectory to be processed is set in the computer control module, and the polishing tool drive device is turned on. The workpiece on the workpiece fixture moves relative to the polishing liquid on the polishing tool, which has a photochemical aggregation rheological effect. On a flat surface, the abrasive grains are wrapped by photochemical active particles, which reduces the damage to the surface. When encountering a roughness peak, due to the resistance, the photochemical active particle clusters that wrap the abrasive grains deform, and the cutting edge of the abrasive grains is exposed, which produces a cutting effect on the roughness peak. The "photosensitive self-assembled micro cutting tool" generates shearing force on the workpiece surface and uses the micro-cutting action of the abrasive grains to achieve material removal. The polishing tool adaptively adjusts the gap between the tool-polishing liquid fluid-processing area according to the real-time pressure to perform efficient, high-precision, and low-damage deterministic grinding and polishing.

3. The green photochemical adaptive aggregation rheological polishing method as described in claim 2, characterized in that, The method further includes the following steps: (5) The waste liquid generated during polishing is collected in the polishing liquid depolymerization tank. Utilizing the reversibility of photocrosslinking, under the irradiation conditions of light with a wavelength of 250-280nm, the photochemical active particles undergo decrosslinking, and the polishing liquid regains its fluidity. Subsequently, the chips are separated, and the polishing liquid is recycled for the next round of polishing.

4. The green photochemical adaptive aggregation rheological polishing method as described in any one of claims 1 to 3, characterized in that, In step (2), the polymer monomer is a green photochemically active particle, which is a polymer monomer molecule modified by photosensitive groups. The photosensitive groups are vinyl functional groups, eosin, azide groups, cinnamic acid, coumarin, and anthracene. In step (2), the additives include surfactants and pH adjusters; the surfactants are asymmetric Gemini zwitterionic surfactants, chitosan-modified zwitterionic surfactants, and zwitterionic polyurethane surfactants; the pH adjusters are citric acid, malic acid, and organic bases. The polishing abrasive particles are one or a mixture of two or more of the following: metal oxides, SiO2, diamond, and calcium carbonate particles.

5. An apparatus for implementing the green photochemical adaptive aggregation rheological polishing method as described in claim 1, characterized in that, The device includes a polishing slurry photochemical aggregation rheology generation and control device, a photochemical aggregation adaptive polishing tool system, a polishing work platform system, and a polishing slurry circulation system. The polishing tool system is installed on the polishing slurry photochemical aggregation rheology generation and control device, and the polishing slurry photochemical aggregation rheology generation and control device and the polishing slurry circulation system are installed on the polishing work platform system.

6. The apparatus as claimed in claim 5, characterized in that, The polishing fluid photochemical aggregation rheology generation control device is internally divided into an ultraviolet irradiation zone and a non-irradiation zone by a light-shielding baffle. The ultraviolet emitting device is installed in the irradiation zone, and the motor is installed in the non-irradiation zone. The left end of the lead screw is connected to the motor, and the right end of the lead screw is axially positioned on the outer shell by a bearing. The movable baffle has a thread in the middle to cooperate with the lead screw. When the motor drives the lead screw to rotate, the movable baffle can move left and right. One end of the spring is fixed to the outer shell, and the other end of the spring is fixed to the movable baffle. When the movable baffle moves left and right, the spring shortens and lengthens accordingly. The polishing fluid delivery conduit is made of light-transmitting material and is fixed to the spring according to the number of turns. The extension and contraction of the spring adjusts the duration of light irradiation of the polishing fluid and controls the degree of aggregation reaction of the polishing fluid, thereby achieving the purpose of adjusting the viscosity of the polishing fluid.

7. The apparatus as described in claim 5 or 6, characterized in that, The aforementioned photochemical aggregation adaptive polishing tool system includes a polishing tool body, a drive shaft, a light source layer, a fluid flow layer, a deformation layer, a polishing slurry viscosity detection device, a pressure sensor, a polishing tool mounting device, and a polishing slurry delivery pipe. The deformation layer is connected to the drive shaft, the light source layer is embedded inside the polishing tool, the polishing slurry viscosity detection device is located in the fluid flow layer and is connected to the motor in the polishing slurry photochemical aggregation rheology generation and control device, the pressure sensor is located at the micropores of the deformation layer, the polishing tool mounting device is located on the polishing tool body, and the polishing slurry delivery pipe is installed on the polishing tool body and communicates with the fluid flow layer.

8. The apparatus as described in claim 5 or 6, characterized in that, The polishing work platform system includes a polishing work disc, a splash guard, a workpiece clamp, and a workpiece clamp driving device. The workpiece clamp is installed at the center of the polishing work disc. The polishing work disc is controlled to move up and down by a pressure sensor in the polishing tool system to ensure that the polishing tool is always in contact with the workpiece surface with a certain pressure. The splash guard is installed on the outer edge of the polishing work disc, and the height of the guard is 2-3 cm higher than the workpiece clamp. There is an opening at the bottom of the polishing work disc to facilitate the outflow of polishing fluid after processing.

9. The apparatus as described in claim 5 or 6, characterized in that, The polishing slurry circulation system includes a polishing slurry depolymerization tank, a chip separation device, a polishing slurry storage device, and a polishing slurry delivery pump. The polishing slurry inlet of the polishing slurry depolymerization tank is connected to the opening below the polishing work disc. The outlet of the polishing slurry depolymerization tank is connected to the inlet of the chip separation device. The outlet of the chip separation device is connected to the inlet of the polishing slurry storage device through the polishing slurry delivery pump. The polishing slurry depolymerization tank contains a light emitting device that emits visible light, which promotes the depolymerization reaction of polymers in the polishing slurry, facilitating chip separation, restoring the fluidity of the polishing slurry, and facilitating its transport and circulation. The chip separation device can separate chips from the polishing slurry, and the purified polishing slurry is transported to the polishing slurry storage device, which has an opening for replenishing the polishing slurry.

10. The apparatus as claimed in claim 5 or 6, characterized in that, The device also includes a computer control module. The polishing tool system is installed on the polishing liquid photochemical aggregation rheology generation control device and can move in four directions: forward, backward, left, and right. The specific movement trajectory and speed are set in the computer control module according to the characteristics of the surface to be processed.

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