Control method of slicing machine, medium and computer equipment

Abstract

The invention relates to the technical field of hard and brittle material processing, particularly provides a control method of a slicing machine, a computer readable storage medium and computer equipment, and aims to solve the technical problem of how to judge that workpieces such as silicon rods are not cut through by a wire net when an existing slicing machine realizes automatic operation planned by an inventor. In order to achieve the purpose, the control method comprises the steps that image data containing a to-be-cut line and a base plate are collected; analyzing the image data, and judging whether the workpiece is cut through by a line net of a cutting line or not; and under the condition that the workpiece is not completely cut by the wire net of the cutting wire, performing cutting operation on the workpiece in a set mode. By means of the structure, whether workpieces such as silicon rods are completely cut by the cutting line or not can be judged in a visual collection mode instead of manual observation, and automation of the slicing machine is expected to be achieved on the basis.

Description

Technical Field

[0001] The invention relates to the technical field of hard and brittle material processing, and specifically provides a control method for a slicer, a computer-readable storage medium, and a computer device. Background Art

[0002] Taking the silicon rod as an example, the processing equipment usually includes a cutter for cutting the rod (round rod) according to the length specification, a squarer for cutting the round rod of a certain length into a square rod, a grinder for grinding the square rod (grinding surface and chamfer) (such as usually including rough grinding and fine grinding), and a slicer for slicing the square rod with the precision reaching the standard after grinding. The working principle of the slicer is as follows: after the square rod is bonded to the wafer support, the cutting wire (such as diamond wire) is reciprocated at high speed to slice the square rod. Each complete slicing operation of the wire net is called a one-knife cutting operation of the slicer.

[0003] The slicing operation of the existing slicer is concentrated near the slicing station. Each cutting operation usually includes dozens of operation steps and is usually completed by one or two operators. This processing method often has the following problems: the operation of the slicer requires high professionalism and proficiency of the operator, and the labor cost is high; the large number of steps makes it easy for the operator to make mistakes, and once the operator makes a mistake, it may cause different degrees of cutting abnormalities. In view of this, after fully studying and analyzing the operation of the slicer, the inventor aims to propose a process flow that can realize automated slicing operations and a structural framework that is compatible with it.

[0004] Taking the current non-automated operation as an example, in the process of slicing silicon rods using diamond wire, there will be such a link: after each cut, it is necessary to manually judge whether the silicon rod is completely cut through by the wire mesh of the diamond wire. Under normal circumstances, the conditions for manually judging that the silicon rod is completely cut through by the wire mesh are: the diamond wire cuts into a specific depth of the pad (such as usually 3-6mm) and the wire mesh remains flat as a whole. The present invention mainly realizes the automation of slicing operations for this link. Summary of the invention

[0005] The present invention aims to at least partially solve at least a part of the above technical problems. Specifically, it aims to solve the technical problem of judging whether the silicon rod is completely cut through by the wire mesh during the automation operation of the existing slicer.

[0006] In a first aspect, the present invention provides a control method for a slicer, the control method comprising: acquiring image data including cutting lines and a pad; analyzing the image data to determine whether a workpiece is cut through by a wire mesh of the cutting lines; and if the workpiece is not cut through by the wire mesh of the cutting lines, performing an additional cutting operation on the workpiece in a set manner.

[0007] With this configuration, it is possible to determine whether the slice is cut through by visual acquisition instead of manual observation, and on this basis, it is expected that the slicer can be automated.

[0008] It is understandable that those skilled in the art can determine the method of judging whether a cut is through and the method of adding cutting when a cut is not through according to actual needs. For example, the judgment criteria can be the same as or different from the conditions mentioned in the background technology section, and the method of adding cutting can be directly performed in a fixed manner or different methods of adding cutting can be formulated for specific methods of not cutting through.

[0009] In addition, it is understandable that those skilled in the art can process the image data in any reasonable image processing manner, so that the cutting through / not cutting through situation can be judged more accurately after the image processing.

[0010] For the control method of the above-mentioned slicer, in a possible implementation manner, the "analyzing the image data to determine whether the workpiece is cut through by the cutting line" includes: performing edge search on the image data for the pad to determine the edge data of the pad; performing corner point detection on the image data to determine the corner point data where the cutting line in the wire network contacts the pad; determining the position data of the cutting line along the cutting direction based on the edge data and the corner point data; and determining whether the workpiece is cut through by the cutting line based on the position data.

[0011] Through such a structure, a specific judgment method is provided for judging whether the workpiece is cut through by the cutting line.

[0012] It is understandable that those skilled in the art can determine the specific methods of edge search and corner point detection and the specific order between the two according to actual needs. On this basis, one or more edges can be selected as reference edges to determine the position data according to the actual situation, such as selecting the upper edge or the lower edge or determining the position according to the edges on both sides.

[0013] For the control method of the above-mentioned slicer, in a possible implementation manner, the cutting lines constitute a wire mesh, the corner point data include multiple corner point data corresponding to multiple cutting positions of the wire mesh, and the "determining whether the workpiece is cut through by the cutting lines based on the position data" includes: comparing the multiple position data corresponding to the multiple corner point data, to determine whether the workpiece is cut through by the cutting lines.

[0014] Through this structure, a possible way to judge whether the workpiece is cut through by the cutting line is given.

[0015] It is understandable that those skilled in the art can determine the comparison method of multiple position data according to actual needs, such as judging whether the workpiece is cut through by the cutting line based on the comparison results corresponding to one or more comparison methods.

[0016] For the control method of the slicer mentioned above, in a possible implementation manner, the "comparing the multiple position data corresponding to the multiple corner point data to determine whether the workpiece is cut through by the cutting line" includes: determining that the workpiece is cut through by the cutting line when at least any one of the multiple position data is greater than or equal to a set value.

[0017] This configuration provides a possible way of determining whether the workpiece has been cut through.

[0018] It is understandable that those skilled in the art can determine the size or range of the set value according to actual conditions, such as referring to 3-6 mm in the background technology section to select a value corresponding to the left endpoint or a value corresponding to a value between the two.

[0019] For the control method of the slicer mentioned above, in one possible implementation, the "determining that the workpiece is cut through by the cutting line when at least any one of the multiple position data is greater than or equal to a set value" includes: when any one of the multiple position data is greater than or equal to a set value, calculating the difference between the maximum value and the minimum value of the multiple position data; and determining that the workpiece is cut through by the cutting line based on the difference.

[0020] With such a configuration, it is possible to determine whether the workpiece is cut through by the cutting line by adding a uniform standard criterion, thereby ensuring the reliability of the determination.

[0021] For the control method of the above-mentioned slicer, in a possible implementation manner, the "when the workpiece is not cut through by the cutting line, performing an additional cutting operation on the workpiece in a set manner" includes: when the workpiece is not cut through by the cutting line, performing an additional cutting operation on the workpiece by adjusting at least a part of the additional cutting parameters; wherein the additional cutting parameters include the feed amount of the feed mechanism, the cutting line speed and the additional cutting time.

[0022] Through such a composition, a possible implementation method of the cutting operation is given.

[0023] It is understandable that those skilled in the art can select and adjust appropriate cutting parameters according to actual needs and can select appropriate adjustment methods according to actual incomplete cutting situations.

[0024] Regarding the control method of the slicer, in a possible implementation, in the step of "analyzing the image data to determine whether the workpiece is cut through by the cutting line", the "analyzing the image data" includes: binarizing the image data.

[0025] With such a configuration, it is possible to more clearly highlight two elements that are strongly related to the judgment: the cutting wire (such as a wire mesh usually made of diamond wire) and the backing plate (such as a plastic plate usually) .

[0026] Regarding the control method of the slicer, in a possible implementation manner, after the image data is binarized, the control method includes: performing threshold segmentation on the image data.

[0027] With such a configuration, it is possible to more effectively identify the area corresponding to the cutting line and the area corresponding to the pad.

[0028] Regarding the control method of the slicer, in a possible implementation manner, the control method further includes: extracting features from the image data.

[0029] With such a configuration, it is possible to extract information meaningful for analysis from image data and perform more effective analysis.

[0030] Regarding the control method of the above-mentioned slicer, in a possible implementation, the slicer includes a cutting chamber, and the cutting chamber is provided with an operating door, and the "collecting image data including the line to be cut and the pad" includes: collecting the image data by at least one of the image acquisition devices; wherein the image acquisition device is arranged at a position of the slicer close to the operating door.

[0031] This configuration provides the possibility of arranging the image acquisition device on the microtome.

[0032] It is understandable that those skilled in the art can determine the number of image acquisition devices, their arrangement on the slicer, and their relative positions relative to the area where the image to be acquired is located, etc., according to actual needs. In order to determine whether the silicon rod is cut through, the key position of image acquisition should be the position where the diamond wire contacts the plastic plate. In view of this, if the image acquisition device (such as a camera, etc.) can include one or more, the image acquisition device can be on the left and / or right side of the frame of the cutting chamber, facing the silicon rod or at a certain angle to the silicon rod, to capture images including the silicon rod and the pad. For example, the image acquisition device may include but is not limited to a camera, an industrial camera, an image sensor, etc.

[0033] For the control method of the above-mentioned slicer, in a possible implementation manner, the image acquisition device includes one or more image acquisition devices arranged along the axial direction of the wire mesh of the cutting line; and / or the image acquisition device is arranged on the slicer in a movable manner along the axial direction of the wire mesh of the cutting line; and / or the image acquisition device is rotatably arranged on the slicer; and / or the image acquisition device is arranged at a set angle relative to the workpiece and / or the pad.

[0034] Through such a configuration, a possible configuration mode of the image acquisition device on the microtome is provided.

[0035] Specifically, by setting multiple or movable devices along the axial direction of the wire mesh of the cutting line, more complete image information can be collected. Based on the rotatable setting method, it can be ensured that the image acquisition device obtains complete image data related to the judgment logic. By setting it at an angle, it is possible to seek to ensure the alignment effect through reasonable azimuth matching to ensure the integrity of the image data. For example, those skilled in the art can determine the number of image acquisition devices set along the axial direction of the wire mesh, the way the image acquisition device moves along the axial direction of the wire mesh, the range of rotation, the angle range, etc. according to actual needs.

[0036] In a second aspect, the present invention provides a computer-readable storage medium, the storage medium comprising a memory, the memory being suitable for storing a plurality of program codes, the program codes being suitable for being loaded and run by a processor to execute any of the aforementioned control methods for a slicer.

[0037] It can be understood that the computer-readable storage medium has all the technical effects of the control method of the slicer described in any of the above items, which will not be repeated here.

[0038] It is understood by those skilled in the art that the present invention implements all or part of the processes in the control method of the slicer, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and it can be understood that the program code includes but is not limited to the program code for executing the control method of the slicer. For the convenience of explanation, only the part related to the present invention is shown. The computer program code can be in the form of source code, object code, executable file or some intermediate form. The computer-readable storage medium may include: any entity or device, medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory, random access memory, electric carrier signal, telecommunication signal and software distribution medium that can carry the computer program code. It should be noted that the content contained in the computer-readable storage medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable storage medium does not include electric carrier signal and telecommunication signal.

[0039] In a third aspect, the present invention provides a computer device, comprising a memory and a processor, wherein the memory is suitable for storing a plurality of program codes, and the program codes are suitable for being loaded and run by the processor to execute any of the aforementioned control methods for a slicer.

[0040] It is understandable that the device has all the technical effects of any of the aforementioned control methods for slicers, which will not be described in detail herein. The device may be a computer-controlled device formed by various electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The following takes a workpiece as a silicon rod to be sliced ​​(hereinafter referred to as a silicon rod, and the product after processing is a silicon wafer) as an example, and describes a preferred embodiment of the present invention with reference to the accompanying drawings, in which:

[0042] Figure 1 A schematic structural diagram of a slicer according to an embodiment of the present invention is shown;

[0043] Figure 2 Schematic diagram showing the judgment condition of not cutting through in the control method of a slicer according to an embodiment of the present invention Figure 1 ;

[0044] Figure 3 Schematic diagram showing the judgment condition of not cutting through in the control method of a slicer according to an embodiment of the present invention Figure 2 ;as well as

[0045] Figure 4A schematic flow chart of a method for controlling a slicer according to an embodiment of the present invention is shown.

[0046] Reference numerals:

[0047] 100. Slicer; 1. Wire mesh; 2. Silicon rod; 3. Pad; 4. Feed mechanism; 5. Cutting main roller; 6. Cutting chamber frame; 71. Left operating door; 72. Right operating door; 8. Camera. DETAILED DESCRIPTION

[0048] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although the present embodiment is introduced in combination with a specific combination of operating steps, it is obvious that those skilled in the art can adjust the steps such as adding, reducing, replacing, etc. according to actual needs.

[0049] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In addition, in order to better illustrate the present invention, many specific details are given in the following specific embodiments, and those skilled in the art should understand that the present invention can also be implemented without certain specific details. In some examples, the principles of slicers, etc., which are well known to those skilled in the art, are not described in detail in order to highlight the main purpose of the present invention.

[0051] Main reference Figure 1In a possible implementation, the slicer 100 is mainly used to cut the silicon rod (usually called square rod) 2 with grinding accuracy that meets the standard by using the wire mesh 1 of the wire cutting machine (such as diamond wire, etc.) to obtain silicon wafers. Under normal circumstances, the slicing operation is as follows: after completing the sticking (sticking the square rod to be sliced ​​to the pad 3, and then sticking the pad to the crystal support. For example, the pad can be a plastic plate, a resin plate, a glass plate, etc., such as in this example, the pad is a plastic plate), the crystal support is fixed on the feed mechanism 4, and during the reciprocating movement of the wire mesh wound between the cutting main rollers 5 of the wire cutting machine, the silicon rod is driven close to the wire mesh through the feed mechanism, and the wire mesh can slice the square rod by wire sawing. In the process of slicing the silicon rod by the slicer, the liquid supply system needs to continuously spray the cutting liquid to the slicing operation area of ​​the slicing station. The main function of the cutting liquid is to cool, lubricate and take away the silicon powder generated at the cutting seam.

[0052] In a possible implementation, the slicer includes a cutting chamber frame 6 having a cutting chamber, and an operating door (respectively referred to as a left operating door 71 and a right operating door 72) is provided on the left and right sides of the cutting chamber frame. A camera 8 as an image acquisition device is arranged at an angle near each operating door in the cutting chamber. The image acquisition device can be arranged outside the cutting chamber or outside the cutting chamber. For example, if it is arranged outside the cutting chamber, when it is necessary to collect relevant image data, the camera can be moved into the corresponding acquisition position in a movable manner. On this basis, the present invention provides an implementation method of an automated operation based on visual observation for the link of whether a silicon wafer is cut through in a slicer.

[0053] Main reference Figures 2 to 4 In a possible implementation, the control method of the slicer includes:

[0054] S401, collecting image data including wire mesh, silicon wafer and plastic plate through a camera.

[0055] S403: Binarize the image data.

[0056] Among them, the binarization process is to convert the collected grayscale or color image data into image data containing only two colors (usually black and white) through image binarization. By binarizing the image data, the image analysis process can be simplified, the calculation speed can be improved, the storage requirements can be reduced, and the recognition and shape analysis of the image data can be facilitated. Specifically, in order to improve the processing efficiency of the image data in the processing stage, it is necessary to binarize the image data collected by the image acquisition device. The image data after binarization becomes black and white image data, so that the cutting line (usually a wire mesh) and the pad, which are two elements strongly related to the judgment, can be more clearly highlighted.

[0057] S405 , performing threshold segmentation on the image data after the binarization process.

[0058] Among them, threshold segmentation is to divide the image data into different areas based on grayscale value or color information. The goal of threshold segmentation is to distinguish the object of interest from the background in the image data in order to conduct targeted analysis. Taking the double threshold method threshold segmentation as an example, by setting two thresholds (upper threshold and lower threshold) to segment the image data, the noise of the image data can be effectively eliminated and the edge information of the image data can be retained. After the image data is subjected to the aforementioned binarization processing, the difference in the characteristic grayscale values ​​of the wire mesh and the plastic plate in the black and white image data is more obvious. Based on this, through reasonable threshold setting, the threshold segmentation method can be used to effectively identify the wire mesh area and the plastic plate area.

[0059] S407: Extract data related to this analysis from the image data.

[0060] The image data is to extract the information meaningful for analysis from the original image data for further analysis, classification or other related processing. After threshold segmentation, the wire mesh image data can be extracted by limiting the information including but not limited to the length condition and width condition corresponding to the wire mesh area in the identified wire mesh area. Similarly, the plastic plate image data can be extracted by limiting the information including but not limited to the length condition and width condition corresponding to the plastic plate area in the identified plastic plate area.

[0061] S409: Perform edge detection on the plastic plate.

[0062] Among them, edge detection is mainly used to determine the edge of image data. Taking the widely used Canny edge detection algorithm as an example, it mainly detects the edge of image data by calculating the gradient amplitude and direction of image data, and uses non-maximum suppression and double threshold technology to reduce edge noise and pseudo edges. For example, the edge of a plastic plate can be determined by the Canny edge detection algorithm, and this edge is used as the reference edge for judging the cut-through.

[0063] S411, performing corner point detection on the diamond wire to determine the end points where the diamond wire contacts the plastic plate at each cutting position.

[0064] Among them, corner point detection is mainly used to determine the corner point data in the image data. Taking the widely used corner point detection as an example, it is mainly based on the local autocorrelation corner point detection method to determine the corner point data in the image data. This algorithm has a high accuracy for the position of the corner point. For example, Harris corner point detection can be used to identify the end point where the diamond wire contacts the plastic plate corresponding to each cutting position in the wire mesh (hereinafter referred to as the end point of the diamond wire), and the end point is used as the measurement point to determine whether the position of the silicon rod corresponding to the silicon wafer is completely cut through by the wire mesh.

[0065] After identifying the edge of the plastic plate and the end point of the diamond wire, the distance h between the end point of the diamond wire and the edge of the plastic plate can be calculated. Taking the lower edge of the plastic plate as an example, when the end point of the diamond wire is above the lower edge of the plastic plate, h is recorded as a positive value, and when the end point of the diamond wire is below the lower edge of the plastic plate, h is recorded as a negative value.

[0066] S413. In the entire wire mesh, there will be different h values ​​corresponding to each cutting position. In this example, the conditions for judging whether the silicon rod is completely cut through by the wire mesh include two:

[0067] Condition 1: hmax-hmin≤2mm (the position of the silicon rod corresponding to a single silicon wafer will produce an h);

[0068] Condition 2: All h ≥ 3 mm.

[0069] When both conditions are met, it can be determined that the silicon rod is completely cut through by the wire mesh. Among them, hmax-hmin≤2mm indicates that the wire bow of the wire mesh is flat, and all h≥3mm indicates that the cutting depth of the wire mesh is sufficient). When the silicon rod is completely cut through by the wire mesh, there is no need to arrange additional cutting operations for the silicon wafer, such as continuing the subsequent retraction operation.

[0070] S415: When the above two conditions are not met, it is determined that the current knife cutting is not through. In the case of not through cutting, in a possible implementation, the following processing logic is further used to arrange additional cutting operations for the current knife cutting:

[0071] Scenario 1:

[0072] All h≥3mm, but hmax-hmin>2mm, which means that the cutting depth of this knife is sufficient but there is a problem of large wire bow difference (such as the maximum wire bow difference is 3mm). Based on this, after analyzing this situation, the inventor determined that when performing the additional cutting operation for this knife cutting, the cutting parameters of the additional cutting operation are controlled as follows: the feed amount of the feed mechanism = 0; 1200m / min≤cutting line speed≤2200m / min; 1min≤additional cutting time t≤3min. After the additional cutting program is executed, the aforementioned logic for judging whether the silicon rod is completely cut through by the wire mesh is triggered again, and according to the judgment result, it is determined whether it is necessary to continue to arrange additional cutting and how to arrange additional cutting until the silicon wafer is cut through.

[0073] Scenario 2:

[0074] hmax-hmin>2 and there is a problem of h<3mm (only some h≥3mm), which means that the cutting depth of the knife is not enough and there is a problem of line bow difference. The inventor further analyzes this situation and further divides it into several situations for discussion:

[0075] (1) When there is a problem of hmin<0, that is, there is a problem that part of the diamond wire does not cut the plastic plate, then the wire bow difference is large. Based on this, after analyzing this situation, the inventor determined that when performing the additional cutting operation for the current knife cutting, the cutting parameters of the additional cutting operation are controlled in the following manner: the feed amount of the feed mechanism = 0; 1800m / min≤cutting line speed≤2400m / min; 20min≤additional cutting time t≤30min.

[0076] (2) When hmin>0 and the proportion of h<3mm>1 / 2, there is a wire bow problem, but at least it can ensure that the diamond wire has cut the plastic plate. Based on this, the inventor analyzed the situation and determined that when performing the additional cutting operation for the current knife cutting, the cutting parameters of the additional cutting operation are controlled as follows: the feed amount of the feed mechanism = 0; 1500m / min≤cutting line speed≤2200m / min; 10min≤additional cutting time t≤15min.

[0077] (3) When hmin>0 and the proportion of h<3mm is less than 1 / 3, it can be ensured that the diamond wire has cut to the plastic plate, but the problem of wire bow difference still needs to be paid attention to. Based on this, after analyzing this situation, the inventor determined that when performing the additional cutting operation for the current knife cutting, the cutting parameters of the additional cutting operation are controlled in the following manner: the feed amount of the feed mechanism = 0; 1500m / min≤cutting line speed≤2200m / min; 5min≤additional cutting time t≤10min.

[0078] After the additional cutting program is executed, the aforementioned logic for determining whether the silicon wafer is completely cut through by the wire mesh is triggered again, and whether additional cutting needs to be arranged and how to arrange additional cutting are determined according to the judgment result until the silicon wafer is cut through.

[0079] Scenario 3:

[0080] hmax-hmin≤2mm and there is a problem of h<3mm (only some h≥3mm), which means that there is a problem of line bow difference in cutting with this knife. Similar to the above situation 2, the inventor further analyzes this situation and further divides it into several situations for discussion:

[0081] (1) When all h satisfy 1≤h<5mm and when the proportion of the part with h<3mm is greater than 1 / 2, the inventors, after analyzing this situation, determined that when performing the additional cutting operation for the current knife cutting, the cutting parameters of the additional cutting operation are controlled as follows: the feed amount of the feed mechanism = 0; 1500m / min≤cutting line speed≤2200m / min; 10min≤additional cutting time t≤15min.

[0082] (2) When hmin>0 and the proportion of the part with h<3mm is greater than 1 / 3 and less than or equal to 1 / 2, the inventors, after analyzing this situation, determined that when performing the additional cutting operation for the current knife cutting, the cutting parameters of the additional cutting operation are controlled in the following manner: the feed amount of the feed mechanism = 0; 1500m / min≤cutting line speed≤2200m / min; 5min≤additional cutting time t≤10min.

[0083] After the additional cutting program is executed, the aforementioned logic for determining whether the silicon wafer is completely cut through by the wire mesh is triggered again, and whether additional cutting needs to be arranged and how to arrange additional cutting are determined according to the judgment result until the silicon wafer is cut through.

[0084] Scenario 4:

[0085] When all h<3mm, it means that the cutting depth of this knife is not enough. At this time, there is no need to check the difference between hmax and hmin. The cutting parameters of the additional cutting operation can be directly controlled as follows: 1mm≤feed amount of feed mechanism≤3mm; 1800m / min≤cutting line speed≤2400m / min; 10min≤additional cutting time t≤15min.

[0086] After the additional cutting program is executed, the aforementioned logic for judging whether the silicon rod is completely cut through by the wire mesh is triggered again, and whether additional cutting needs to be arranged and how to arrange additional cutting are determined according to the judgment result, until the wire mesh cuts through the silicon rod.

[0087] It can be seen that in the control method of the slicer of the present invention, an image acquisition device is used to replace manual observation with visual observation in the observation link of the slicing operation of the silicon rod. On this basis, by introducing an image processing method that is more suitable for the present invention and combining two judgment conditions, a judgment is given as to whether the silicon rod is completely cut through by the wire mesh. Furthermore, in the case where the silicon rod is not completely cut through, the inventor has formulated different additional cutting operation methods according to actual needs. Therefore, based on the control method of the slicer of the present invention, it is expected to realize the automated operation of the slicer in the link of judging whether the silicon rod is cut through by the wire mesh.

[0088] It should be pointed out that although the various steps in the above embodiments are described in a specific order, those skilled in the art can understand that in order to achieve the effects of the present invention, different steps do not have to be performed in such an order. They can be performed simultaneously or in other orders, and some steps can also be added, replaced or omitted.

[0089] It should be noted that, although the control method of the slicer constructed in the above specific manner is introduced as an example, those skilled in the art will appreciate that the present invention should not be limited thereto. In fact, the user can flexibly adjust the relevant steps and parameters in the steps according to the actual application scenario and other situations.

[0090] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A control method for a slicer, characterized in that: The control method comprises: Collect image data including cutting line and pad; Analyze the image data to determine whether the workpiece is cut through by the wire mesh of the cutting wire; When the workpiece is not cut through by the wire mesh of the cutting wire, the workpiece is subjected to additional cutting operation in a set manner.

2. The control method according to claim 1, characterized in that: The “analyzing the image data to determine whether the workpiece is cut through by the cutting line” includes: Search the edge of the pad on the image data to determine the edge data of the pad; Perform corner point detection on the image data to determine the corner point data where the cutting line in the wire mesh contacts the pad; Determine the position data of the cutting line along the feeding direction according to the edge data and the corner point data; According to the position data, it is determined whether the workpiece is cut through by the cutting line.

3. The control method according to claim 2, characterized in that: The cutting lines constitute a wire mesh, and the corner point data include a plurality of corner point data corresponding to a plurality of cutting positions of the wire mesh. The “determining whether the workpiece is cut through by the cutting line according to the position data” includes: The plurality of position data corresponding to the plurality of corner point data are compared to determine whether the workpiece is cut through by the cutting line.

4. The control method according to claim 3, characterized in that: The "comparing the plurality of position data corresponding to the plurality of corner point data to determine whether the workpiece is cut through by the cutting line" includes: At least when any one of the plurality of position data is greater than or equal to a set value, it is determined that the workpiece is cut through by the cutting line.

5. The control method according to claim 4, characterized in that: The “determining that the workpiece is cut through by the cutting line when at least any one of the plurality of position data is greater than or equal to a set value” includes: When any one of the plurality of position data is greater than or equal to a set value, calculating a difference between a maximum value and a minimum value of the plurality of position data; According to the difference, it is determined that the workpiece is cut through by the cutting line.

6. The control method according to claim 1, characterized in that: The “when the workpiece is not cut through by the cutting line, performing an additional cutting operation on the workpiece in a set manner” includes: When the workpiece is not cut through by the cutting line, the workpiece is subjected to additional cutting by adjusting at least a part of the additional cutting parameters; The additional cutting parameters include the feed rate of the feed mechanism, the cutting line speed and the additional cutting time.

7. The control method according to claim 1, characterized in that: In the step of "analyzing the image data to determine whether the workpiece is cut through by the cutting line", the "analyzing the image data" includes: Binarize the image data.

8. The control method according to claim 7, characterized in that: After the image data is binarized, the control method includes: Perform threshold segmentation on image data.

9. The control method according to claim 1, characterized in that: The control method further comprises: Perform feature extraction on image data.

10. The control method according to claim 1, characterized in that: The slicer comprises a cutting chamber, wherein the cutting chamber is provided with an operating door. The "collection of image data including the line to be cut and the backing plate" includes: Acquiring image data by at least one of the image acquisition devices; Wherein, the image acquisition device is arranged at a position of the slicer close to the operating door.

11. The control method according to claim 10, characterized in that: The image acquisition device comprises one or more image acquisition devices arranged along the axial direction of the wire web of the cutting line; and / or The image acquisition device is arranged on the slicer in a manner that it can move along the axial direction of the wire web of the cutting wire; and / or The image acquisition device is rotatably arranged on the slicer; and / or The image acquisition device is arranged at a set angle relative to the workpiece and / or the backing plate.

12. A computer-readable storage medium, the storage medium comprising a memory, the memory being adapted to store a plurality of program codes, characterized in that: The program code is suitable for being loaded and run by a processor to execute the control method of the microtome according to any one of claims 1 to 11.

13. A computer device, comprising a memory and a processor, wherein the memory is suitable for storing a plurality of program codes, wherein: The program code is suitable for being loaded and run by the processor to execute the control method of the microtome according to any one of claims 1 to 11.

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