Control method of slicing machine, medium and computer equipment

Abstract

The invention relates to the technical field of hard and brittle material processing, and particularly provides a control method of a slicing machine, a computer readable storage medium and computer equipment. The slicing machine aims at solving the technical problem of how to judge that line hanging occurs in the process of retracting of a feeding mechanism when an existing slicing machine achieves automatic operation planned by an inventor. The slicing machine comprises a cutter feeding mechanism and a cutting mechanism wound with a cutting line, and the control method comprises the steps that under the condition that the cutter feeding mechanism ascends to a preset position relative to the cutting mechanism, image data at least containing the cutting line are collected; the image data are analyzed, and whether a cutting line is hung or not in the retracting operation period of the feed mechanism is judged; and under the condition that the cutting line is hung, at least adjusting operation parameters of tool retracting operation. By means of the structure, whether line hanging occurs in the retracting period of the cutter feeding mechanism or not can be judged in a visual collection mode instead of manual observation.

Description

Technical Field

[0001] The invention relates to the technical field of hard and brittle material processing, and specifically provides a control method for a slicer, a computer-readable storage medium, and a computer device. Background Art

[0002] Taking the silicon rod as an example, the processing equipment usually includes a cutter for cutting the rod (round rod) according to the length specification, a squarer for cutting the round rod of a certain length into a square rod, a grinder for grinding the square rod (grinding surface and chamfer) (such as usually including rough grinding and fine grinding), and a slicer for slicing the square rod with the precision reaching the standard after grinding. The working principle of the slicer is as follows: after the square rod is bonded to the wafer support, the cutting wire (such as diamond wire) is reciprocated at high speed to slice the square rod. Each complete slicing operation of the wire net is called a one-knife cutting operation of the slicer.

[0003] The slicing operation of the existing slicer is concentrated near the slicing station. Each cutting operation usually includes dozens of operation steps and is usually completed by one or two operators. This processing method often has the following problems: the operation of the slicer requires high professionalism and proficiency of the operator, and the labor cost is high; the large number of steps makes it easy for the operator to make mistakes, and once the operator makes a mistake, it may cause different degrees of cutting abnormalities. In view of this, after fully studying and analyzing the operation of the slicer, the inventor aims to propose a process flow that can realize automated slicing operations and a structural framework that is compatible with it.

[0004] Taking the current non-automated operation as an example, the process of slicing silicon rods using diamond wires includes the following steps: after each cut, the processed silicon wafer needs to be lifted (retracted) relative to the cutting mechanism (mainly including the main cutting roller) that constructs the wire mesh. During the retraction process, it is necessary to manually determine whether there is a problem of wire hanging during retraction. For example, wire hanging during retraction is specifically manifested as one or more diamond wire segments in the wire mesh being pulled up by the silicon wafer during the lifting of the silicon rod. If it is not discovered and handled in time, the diamond wire will be broken, which will affect the quality of the silicon wafer and the production change efficiency of the slicer. Summary of the invention

[0005] The present invention aims to at least partially solve at least a part of the above-mentioned technical problems. Specifically, it solves the technical problem of judging the hanging wire that occurs during the process of lifting (retracting) the cutting mechanism of the processed silicon wafer relative to the wire network during the automation operation of the existing slicer.

[0006] In a first aspect, the present invention provides a control method for a slicer, wherein the slicer includes a feed mechanism and a cutting mechanism with a cutting line wound therearound, the control method comprising: when the feed mechanism rises to a preset position relative to the cutting mechanism, collecting image data at least containing the cutting line; analyzing the image data to determine whether the cutting line is hung during a retracting operation of the feed mechanism; and when the cutting line is hung, at least adjusting the operating parameters of the retracting operation.

[0007] Through such a structure, it is possible to determine whether the cutting line is hung during the retraction period of the feed mechanism by replacing manual observation with a visual acquisition method, and on this basis, it is expected to achieve automation of the slicer.

[0008] It is understandable that those skilled in the art can adjust one or more operating parameters during the knife retracting operation according to actual needs, such as operating parameters that may include but are not limited to the lifting speed of the knife feed mechanism. In addition, in addition to adjusting the operating parameters of the knife retracting operation, other related operating parameters of the slicer can also be adjusted, such as adjusting the rotation state of the cutting mechanism, the spraying state of the cutting fluid, etc. On this basis, those skilled in the art can determine the specific adjustment trend and the adjustment strength based on the corresponding trend according to actual needs.

[0009] In addition, it is understandable that those skilled in the art can process the image data in any reasonable image processing manner, so that after the image processing, it can be more accurately determined whether the tool retraction and hanging line situation occurs.

[0010] For the control method of the above-mentioned slicer, in a possible implementation manner, the "collecting image data containing at least a cutting line when the feed mechanism rises to a preset position relative to the cutting mechanism" includes: collecting image data containing a cutting line and a cutting mechanism when the feed mechanism rises to a preset position relative to the cutting mechanism; accordingly, the "analyzing the image data to determine whether the cutting line is hung during the retraction of the feed mechanism" includes: acquiring position data between adjacent cutting line segments in the wire network; and determining whether the cutting line is hung during the retraction of the feed mechanism based on the position data.

[0011] Through such a structure, a possible method for judging whether the tool is retracted and the tool is hanging on the line is given.

[0012] It is understandable that those skilled in the art can determine the specific form of the position data and the corresponding relationship between the position data and whether the line is hung according to actual needs. For example, the position data can be distance, projection length / height / distance, relative position relationship, angle, etc.

[0013] For the control method of the above-mentioned slicer, in a possible implementation manner, the "obtaining position data between adjacent cutting line segments in the wire mesh" includes: obtaining distance data between adjacent cutting line segments in the wire mesh; accordingly, the "determining whether the cutting line is hung during the retraction of the feed mechanism based on the position data" includes: when there is a jump value in the distance data, determining that the cutting line is hung during the retraction of the feed mechanism.

[0014] Through such a structure, a specific method for determining the tool retraction hanging line is provided.

[0015] Specifically, when one of the cutting line segments is hung, the distance between it and the adjacent cutting line segment will be greater than the distance between the other two cutting line segments that are not hung.

[0016] For the control method of the above-mentioned slicer, in a possible implementation manner, the "analyzing the image data to determine whether the cutting line is hung during the retraction operation of the feed mechanism" includes: determining the intersection points of each cutting line segment of the wire network with the workpiece or the pad according to the image data; comparing the position data corresponding to the intersection points of multiple cutting line segments to determine whether the cutting line is hung during the retraction operation of the feed mechanism.

[0017] Through such a structure, a specific method for determining the tool retraction hanging line is provided.

[0018] Specifically, the intersection of a normal (no tool retraction hanging) cutting line and a workpiece or pad can be fitted into a straight line, which can be called a reference line. When one or several cutting line segments hang, the intersection of the corresponding cutting line segment and the workpiece or pad will be at a distance from the reference line.

[0019] For the control method of the above-mentioned slicer, in a possible implementation manner, the "determining the intersection points of each cutting line segment of the wire mesh with the workpiece or the pad according to the image data" includes: performing edge search of the workpiece or the pad on the image data to determine the edge data of the workpiece or the pad; performing corner point detection on the image data to determine the corner point data where the cutting lines in the wire mesh contact the workpiece or the pad; determining the intersection points of each cutting line segment of the wire mesh with the workpiece or the pad according to the edge data and the corner point data.

[0020] With such a configuration, it is possible to analyze image data more clearly.

[0021] It is understandable that those skilled in the art can determine the specific methods of edge search and corner point detection and the specific order between the two according to actual needs. On this basis, one or more edges can be selected as reference edges to determine the position data according to the actual situation, such as selecting the upper edge or the lower edge or determining the position according to the edges on both sides.

[0022] For the control method of the above-mentioned slicer, in a possible implementation manner, the "collecting image data at least containing the cutting line when the feed mechanism rises to a preset position relative to the cutting mechanism" includes: collecting image data containing the cutting line and the cutting main roller of the cutting mechanism when the feed mechanism rises to a preset position relative to the cutting mechanism; accordingly, the "analyzing the image data to determine whether the cutting line is hanging on the line during the retraction of the feed mechanism" includes: determining the tangent position of each cutting segment of the wire mesh and the cutting main roller according to the image data; and comparing the tangent positions corresponding to the each cutting segment to determine whether the cutting line is hanging on the line during the retraction of the feed mechanism.

[0023] Through such a structure, a specific method for determining the tool retraction hanging line is provided.

[0024] Specifically, the tangent position (tangent point) of the normal (no hanging of the retracted blade) cutting line and the cutting main roller of the cutting mechanism can be fitted into a straight line, which can be called a reference line. When one or several cutting line segments hang, the corresponding tangent point of the cutting line and the cutting mechanism will be at a distance from the reference line.

[0025] For the control method of the above-mentioned slicer, in a possible implementation manner, the "determining the tangent position of each cutting segment of the wire mesh with the cutting main roller according to the image data" includes: the "determining the tangent position of each cutting segment of the wire mesh with the cutting main roller according to the image data" includes: performing edge search of the cutting mechanism on the image data to determine the edge data of the cutting main roller; performing corner point detection on the image data to determine the corner point data of the tangent position of the cutting line in the wire mesh with the cutting main roller; determining the tangent position of each cutting line segment of the wire mesh with the cutting main roller according to the edge data and the corner point data.

[0026] With such a configuration, it is possible to analyze image data more clearly.

[0027] It is understandable that those skilled in the art can determine the specific methods of edge search and corner point detection and the specific order between the two according to actual needs. On this basis, one or more edges can be selected as reference edges to determine the position data according to the actual situation, such as selecting the upper edge or the lower edge or determining the position according to the edges on both sides.

[0028] For the control method of the slicer mentioned above, in a possible implementation manner, the "in the case of the cutting line hanging, at least adjusting the operating parameters of the knife retracting operation" includes: in the case of the cutting line hanging, lowering the operating parameters of the knife retracting operation, and selectively adjusting the operating parameters of the cutting mechanism.

[0029] With such a structure, the problem of wire hanging during tool withdrawal can be effectively dealt with by adjusting the tool feed mechanism and the cutting mechanism.

[0030] It is understandable that those skilled in the art can determine which or which operating parameters of the cutting mechanism to adjust simultaneously and in what manner of adjustment to perform, etc., according to actual needs.

[0031] For the control method of the slicer mentioned above, in a possible implementation, in the step of "analyzing the image data to determine whether the cutting line is hung during the retracting operation of the feed mechanism", the "analyzing the image data" includes: binarizing the image data.

[0032] Through such a structure, it is possible to more clearly highlight the two elements that are strongly related to the judgment (cutting line (usually diamond wire) and workpiece / pad (usually plastic plate) / cutting mechanism (mainly including cutting main roller)).

[0033] Regarding the control method of the slicer, in a possible implementation manner, after binarization processing is performed on the image data, the control method includes: performing threshold segmentation on the image data.

[0034] With such a configuration, it is possible to more effectively identify the area corresponding to the cutting line and the area corresponding to the pad.

[0035] Regarding the control method of the slicer, in a possible implementation manner, the control method further includes: performing feature extraction on the image data.

[0036] With such a configuration, it is possible to extract information meaningful for analysis from image data and perform more effective analysis.

[0037] For the control method of the above-mentioned slicer, in a possible implementation, the slicer includes a cutting chamber, and the cutting chamber is provided with an operating door, and the "collecting image data containing at least a cutting line" includes: collecting the image data containing at least a cutting line by at least one of the image acquisition devices; wherein the image acquisition device is arranged at a position of the slicer close to the operating door.

[0038] This configuration provides the possibility of arranging the image acquisition device on the microtome.

[0039] It is understandable that those skilled in the art can determine the number of image acquisition devices, their arrangement on the slicer, and their relative positions relative to the area where the image to be acquired is located, etc., according to actual needs. In order to determine whether the silicon rod is cut through, the key position of image acquisition should be the position where the diamond wire contacts the plastic plate. In view of this, if the image acquisition device (such as a camera, etc.) can include one or more, the image acquisition device can be on the left and / or right side of the frame of the cutting chamber, facing the silicon rod or at a certain angle to the silicon rod, to capture images including the silicon rod and the pad. For example, the image acquisition device may include but is not limited to a camera, an industrial camera, an image sensor, etc.

[0040] For the control method of the above-mentioned slicer, in a possible implementation manner, the image acquisition device includes one or more image acquisition devices arranged along the axial direction of the wire mesh of the cutting line; and / or the image acquisition device is arranged on the slicer in a movable manner along the axial direction of the wire mesh of the cutting line; and / or the image acquisition device is rotatably arranged on the slicer; and / or the image acquisition device is arranged at a set angle relative to the workpiece and / or the pad.

[0041] Through such a configuration, a possible configuration mode of the image acquisition device on the microtome is provided.

[0042] Specifically, by setting multiple or movable devices along the axial direction of the wire mesh of the cutting line, more complete image information can be collected. Based on the rotatable setting method, it can be ensured that the image acquisition device obtains complete image data related to the judgment logic. By setting it at an angle, it is possible to seek to ensure the alignment effect through reasonable azimuth matching to ensure the integrity of the image data. For example, those skilled in the art can determine the number of image acquisition devices set along the axial direction of the wire mesh, the way the image acquisition device moves along the axial direction of the wire mesh, the range of rotation, the angle range, etc. according to actual needs.

[0043] In a second aspect, the present invention provides a computer-readable storage medium, the storage medium comprising a memory, the memory being suitable for storing a plurality of program codes, the program codes being suitable for being loaded and run by a processor to execute any of the aforementioned control methods for a slicer.

[0044] It can be understood that the computer-readable storage medium has all the technical effects of the control method of the slicer described in any of the above items, which will not be repeated here.

[0045] It is understood by those skilled in the art that the present invention implements all or part of the processes in the control method of the slicer, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and it can be understood that the program code includes but is not limited to the program code for executing the control method of the slicer. For the convenience of explanation, only the part related to the present invention is shown. The computer program code can be in the form of source code, object code, executable file or some intermediate form. The computer-readable storage medium may include: any entity or device, medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory, random access memory, electric carrier signal, telecommunication signal and software distribution medium that can carry the computer program code. It should be noted that the content contained in the computer-readable storage medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable storage medium does not include electric carrier signal and telecommunication signal.

[0046] In a third aspect, the present invention provides a computer device, comprising a memory and a processor, wherein the memory is suitable for storing a plurality of program codes, and the program codes are suitable for being loaded and run by the processor to execute any of the aforementioned control methods for a slicer.

[0047] It is understandable that the device has all the technical effects of any of the aforementioned control methods for slicers, which will not be described in detail herein. The device may be a computer-controlled device formed by various electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The following takes a workpiece as a silicon rod to be sliced ​​(hereinafter referred to as a silicon rod, and the product after processing is a silicon wafer) as an example, and describes a preferred embodiment of the present invention with reference to the accompanying drawings, in which:

[0049] Figure 1 A schematic structural diagram of a slicer according to an embodiment of the present invention is shown;

[0050] Figure 2 A schematic diagram showing the judgment conditions for retracting the cutter and hanging the line in the control method of the slicer according to the first embodiment of the present invention;

[0051] Figure 3 A schematic flow chart showing a method for controlling a slicer according to a first embodiment of the present invention;

[0052] Figure 4 A schematic diagram showing the judgment conditions for retracting the cutter and hanging the line in the control method of the slicer according to the second embodiment of the present invention;

[0053] Figure 5 A schematic flow chart showing a control method for a slicer according to a second embodiment of the present invention;

[0054] Figure 6 A schematic diagram showing the judgment conditions for retracting the cutter and hanging the line in the control method of the slicer according to the third embodiment of the present invention; and

[0055] Figure 7 A schematic flow chart showing a control method for a slicer according to a third embodiment of the present invention.

[0056] Reference numerals:

[0057] 100. Slicer; 1. Wire mesh; 2. Silicon rod; 3. Pad; 4. Feed mechanism; 5. Cutting main roller; 6. Cutting chamber frame; 71. Left operating door; 72. Right operating door; 8. Camera. DETAILED DESCRIPTION

[0058] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although the present embodiment is introduced in combination with a specific combination of operating steps, it is obvious that those skilled in the art can adjust the steps such as adding, reducing, replacing, etc. according to actual needs.

[0059] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] In addition, in order to better illustrate the present invention, many specific details are given in the following specific embodiments, and those skilled in the art should understand that the present invention can also be implemented without certain specific details. In some examples, the principles of slicers, etc., which are well known to those skilled in the art, are not described in detail in order to highlight the main purpose of the present invention.

[0061] Main reference Figure 1 In a possible implementation, the slicer 100 is mainly used to use the wire mesh 1 (wherein 1(a) in the figure is a normal diamond wire, and 1(b) is a diamond wire that has been pulled up due to the problem of retracting the cutter and hanging the wire) of the wire cutting machine to grind the silicon rod (usually called a square rod) 2 (in the figure, it is a sliced ​​state) along its radial direction to obtain silicon wafers. Under normal circumstances, the slicing operation is as follows: after the stick is glued (the square rod to be sliced ​​is glued to the pad 3, and then the pad is glued to the crystal support. For example, the pad can be a plastic plate, a resin plate, a glass plate, etc., and in this example, the pad is a plastic plate), the crystal support is fixed on the feed mechanism 4. During the reciprocating movement of the wire mesh between the cutting main rollers 5 of the wire cutting machine, the feed mechanism drives the silicon rod to approach the wire mesh, and the wire mesh can slice the square rod by wire sawing. When the slicer is slicing silicon rods, the liquid supply system needs to continuously spray cutting fluid into the slicing operation area of ​​the slicing station. The main function of the cutting fluid is to cool, lubricate and remove silicon powder generated at the cutting seam.

[0062] In a possible implementation, the slicer includes a cutting chamber frame 6 in which a cutting chamber is formed, and an operating door (respectively denoted as a left operating door 71 and a right operating door 72) is respectively provided on the left and right sides of the cutting chamber frame, and a camera 8 as an image acquisition device is arranged at an angle near each operating door inside the cutting chamber, and the image acquisition device can be arranged inside or outside the cutting chamber. Taking the arrangement outside the cutting chamber as an example, in the case where relevant image data needs to be collected, the camera can be moved into the corresponding collection position in a movable manner. On this basis, the present invention provides an automated operation based on visual observation for the link of whether the diamond wire hanging net phenomenon occurs during the retraction period of the feed mechanism in the slicer after completing the slicing operation.

[0063] The present invention is introduced below in combination with three methods for judging diamond wire mesh.

[0064] Embodiment 1:

[0065] Main reference Figure 2 and Figure 3 In a first possible implementation manner, the control method of the slicer includes:

[0066] S301, collecting image data including wire mesh, silicon wafer and pad through a camera.

[0067] The collection of image data for the problem of retracting the knife and hanging on the line occurs during the retracting process of the feed mechanism. Therefore, the position of the feed mechanism for the trigger signal to start the image data collection can trigger the image data collection signal when the feed mechanism reaches a specific position suitable for judging the problem of retracting the knife and hanging on the line, so that the controller of the slicer or the control end such as the server can adjust the working condition of the slicer after receiving the image collection trigger signal, such as but not limited to opening the operating doors on both sides of the cutting chamber, adjusting the circulation state of the cutting liquid (adjusting the water outlet state of the spray pipe, closing the spray pipe above the cutting main roller), stopping the rotation of the cutting main roller, and stopping the lifting of the feed mechanism. After the working condition of the slicer is adjusted, the image collection device is in place, such as being sent to a station that can automatically collect the image data of the retracting knife and hanging on the line by a corresponding mechanism, such as placing the image collection device at the operating door on the left, right, or both sides of the cutting chamber. After it is in place, image data can also be acquired in a movable manner, such as by a specific path (such as moving along the axial direction of the cutting main roller, the moving distance should be ≥ the maximum load-camera field of view) and angle (0°<the angle between the camera and the wire mesh≤a certain angle in the range of 70°, at which the image acquisition device should be able to clearly capture the image data containing the diamond wire) to acquire image data, and the number of acquired image data should be ≥ the maximum load / camera field of view. After the acquisition is completed, the image acquisition device can be returned to its original position, and the slicer can be restored to the retracted state, that is: if there is a problem of hanging wire during retracting, the retracting operation can be continued according to the original retracting process.

[0068] Assumption: When the wire mesh is flat, the position where the silicon rod just touches the diamond wire is point 0. And assuming that the downward feed amount of the feed mechanism during the entire cutting process is a, then when the cutting is completed and the tool is ready to be retracted, the servo position of the feed mechanism is a. For example, the servo position for the first triggering of the hanging wire detection is am, where 3mm≤m≤10mm (where m is the first lifting height of the feed mechanism, such as 7mm), and the servo position for the second triggering of the hanging wire detection is an, where 15mm≤n≤25mm (n is the second lifting height of the feed mechanism, such as 20mm). Of course, the number and position of triggering the hanging wire detection can also be changed accordingly according to specific process requirements and related actual needs. For example, the servo position for the third triggering of the hanging wire detection can be increased. For example, the servo position for the third triggering of the hanging wire detection is ap, where 30mm≤p≤60mm (p is the third lifting height of the feed mechanism, such as 45mm).

[0069] S303: Binarize the image data.

[0070] Among them, the binarization process is to convert the collected grayscale or color image data into image data containing only two colors (usually black and white) through image binarization. By binarizing the image data, the image analysis process can be simplified, the calculation speed can be improved, the storage requirements can be reduced, and the recognition and shape analysis of the image data can be facilitated. Specifically, in order to improve the processing efficiency of the image data in the processing stage, it is necessary to binarize the image data collected by the image acquisition device. The image data after the binarization process becomes black and white image data, so that the elements strongly related to the judgment, such as diamond wire, silicon wafer, plastic plate, etc., can be more clearly highlighted.

[0071] S305 , performing threshold segmentation on the image data after the binarization process.

[0072] Among them, threshold segmentation is to divide the image data into different areas based on grayscale value or color information. The goal of threshold segmentation is to distinguish the object of interest from the background in the image data so as to conduct targeted analysis. Taking the double threshold method threshold segmentation as an example, by setting two thresholds (upper threshold and lower threshold) to segment the image data, the noise of the image data can be effectively eliminated and the edge information of the image data can be retained. After the image data is subjected to the aforementioned binarization processing, the difference in the characteristic grayscale values ​​of the wire mesh and the plastic plate in the black and white image data is more obvious. Based on this, through reasonable threshold setting, the threshold segmentation method can be used to effectively identify the wire mesh area, silicon wafer and plastic plate area.

[0073] S307: Extract data related to this analysis from the image data.

[0074] Among them, image data is to extract information meaningful for analysis from the original image data for further analysis, classification or other related processing. After threshold segmentation, the wire mesh image data can be extracted by limiting the information including but not limited to the length condition and width condition corresponding to the wire mesh area in the identified wire mesh area. Similarly, the image data of the silicon wafer and plastic plate area can be extracted by limiting the information including but not limited to the length condition and width condition corresponding to the silicon wafer and plastic plate area in the identified silicon wafer and plastic plate area.

[0075] S309, obtaining the distance between adjacent diamond wires in the wire mesh including a plurality of diamond wire segments.

[0076] Specifically, when one of the diamond wire segments is hung, the distance between it and the adjacent diamond wire will be greater than the distance between the other two cutting wire segments that are not hung. Specifically, assuming that the distance between adjacent diamond wires when no hanging occurs is equivalent to the right angle side of a right triangle, the distance between adjacent diamond wires when hanging occurs is roughly equivalent to the hypotenuse of a right triangle. Exemplarily, the distance data mentioned here is measured and compared with a certain longitudinal section of the silicon rod as a reference surface.

[0077] Exemplarily, assuming that the distance between adjacent diamond wires when no hanging occurs is recorded as a, and the distance between the two adjacent diamond wires when one of the adjacent diamond wires hangs occurs is recorded as b. For example, when ba≥0.1 mm, it can be defined as hanging during tool withdrawal.

[0078] S311, judging whether there is a jump value in the distance between adjacent cutting line segments in the wire net, in this example, judging whether the aforementioned b exists. If yes, it is determined that the problem of diamond wire hanging occurs during this retraction and the process goes to S313; if no, the retraction operation continues.

[0079] S313. In a possible implementation manner, when the diamond wire is stuck during the current retraction, the following processing logic is further used to arrange a processing method for the current retraction stuck:

[0080] Scenario 1:

[0081] When the lifting height of the feed mechanism is 3mm≤m≤10mm and the wire hanging problem is determined during the wire hanging detection during the tool retraction:

[0082] (1) In the case of a small amount of diamond wire hanging, such as when the number of diamond wires hanging is ≤20, the normal retraction procedure is performed, but the feed mechanism is slowly raised, such as the raising speed is ≤10mm / min. At the same time, the main cutting roller of the slicer is moved slowly, such as the moving speed is ≤10m / min, and the cutting fluid spray of the slicer is turned on.

[0083] (2) In the event that a relatively large number or a large number of diamond wires are hung, for example, when the number of hung diamond wires is greater than 20, the control end such as the central control room will issue an alarm or other form of reminder so that reasonable handling methods such as calling for manual wire trimming and net retraction can be obtained.

[0084] Scenario 2:

[0085] When the lifting height of the feed mechanism is 15mm≤n≤20mm and the wire hanging problem is determined during the wire hanging detection during the retraction:

[0086] (1) When a small amount of diamond wire is hung and the number of hung wires is ≤20, the retraction procedure is executed normally, the main roller of the slicer moves slowly, the moving speed is ≤10m / min, the feed mechanism is slowly lifted, the lifting speed is ≤10mm / min, and the cutting fluid spray is turned on at the same time.

[0087] (2) When a large number of diamond wires are hung, such as when the number of hung diamond wires is greater than 20, adjust the state of the slicer so that the main cutting roller stops rotating and the feed mechanism is slowly raised, such as the raising speed of the feed mechanism is ≤10mm / min. During the process, the cutting fluid spray is always turned on.

[0088] Embodiment 2:

[0089] Main reference Figure 4 and Figure 5 , Figure 4 and Figure 5 The control method of the slicer in the second possible implementation mode shown is similar to the above-mentioned embodiment 1 in that the collected image data still includes image data of the diamond wire, silicon wafer and plastic plate. The main difference is the way of judging the hanging wire.

[0090] Specifically, the aforementioned embodiment 1 determines whether there is a hanging wire problem during the retraction of the cutting tool by whether there is a jump value in the distance data between two adjacent diamond wire segments. In the present embodiment, whether the cutting wire hangs during the retraction of the cutting tool by the intersection of each diamond wire segment in the wire mesh of multiple diamond wire segments and the workpiece or the pad is determined.

[0091] Specifically, the intersection of a normal (no hanging during tool retraction) diamond wire and a workpiece or pad can be fitted into a straight line, which can be called a reference line. When one or several diamond wire segments are hung, the intersection of the corresponding diamond wire segment and the workpiece or pad will have a vertical distance from the reference line, which can be called a height difference. In the case of a height difference or an angle difference that matches the height difference, it can be determined that the cutting line is hung during the tool retraction of the feed mechanism. Exemplarily, the height difference is recorded as h, and when h≥1mm, it can be defined as a hanging line during tool retraction.

[0092] Since the determination of the intersection is involved in this embodiment, in order to better determine the intersection data, in this embodiment, in addition to the aforementioned binarization processing, threshold segmentation and feature extraction, the image data also includes the following processing:

[0093] S509: Perform edge detection on the silicon wafer and the plastic plate.

[0094] Among them, edge detection is mainly used to determine the edge of image data. Taking the widely used Canny edge detection algorithm as an example, it mainly detects the edge of image data by calculating the gradient amplitude and direction of image data, and uses non-maximum suppression and double threshold technology to reduce edge noise and pseudo edges. For example, the edge of a plastic plate can be determined by the Canny edge detection algorithm, and this edge is used as the reference edge for judging the cut-through.

[0095] S511, performing corner point detection on the diamond wire to determine the end point where the diamond wire contacts the silicon wafer / pad at each cutting position.

[0096] Among them, corner point detection is mainly used to determine the corner point data in the image data. Taking the widely used corner point detection as an example, it is mainly based on the local autocorrelation corner point detection method to determine the corner point data in the image data. This algorithm has a high accuracy for the position of the corner point. For example, Harris corner point detection can be used to identify the end point where the diamond wire contacts the silicon wafer / pad corresponding to each cutting position in the wire mesh (hereinafter referred to as the end point of the diamond wire), and use this end point as the measurement point to determine whether the silicon wafer is completely cut through.

[0097] The other control logics are similar to those in Example 1 and will not be described in detail here.

[0098] Embodiment 3:

[0099] Main reference Figure 6 and Figure 7 , Figure 6 and Figure 7 The control method of the slicer in the third possible implementation is different from the aforementioned embodiments 1 and 2 in that the collected image data includes image data of the diamond wire and the cutting mechanism. Based on this, the method of judging the hanging wire is similar to the principle of the aforementioned embodiment 2.

[0100] Specifically, the tangent position (tangent point) of the normal (no retraction and hanging line) diamond wire and the cutting main roller of the cutting mechanism can be fitted into a straight line, which can also be referred to as the baseline with reference to Example 2. When one or several diamond wire segments are hung, the tangent point between the corresponding diamond wire and the cutting main roller will be at a distance from the baseline, such as the position where the suspended diamond wire is tangent to the cutting main roller is further outward than the normal cutting line, and the position difference between the two can be called the distance difference. In the case of a distance difference, it can be determined that the cutting line is hung during the retraction of the feed mechanism. Exemplarily, the distance difference is recorded as l, such as when l ≥ 0.5 mm, it can be defined as retraction and hanging line.

[0101] Similar to the second embodiment, since the present embodiment involves the confirmation of the cutting point, the processing of the image data includes the step of edge detection of the cutting main roller and the step of corner detection of the diamond wire.

[0102] The other control logics are similar to those in Example 1 and will not be described in detail here.

[0103] It can be seen that in the control method of the slicer of the present invention, visual observation through an image acquisition device replaces manual observation. On this basis, three different judgment methods are used to determine whether the diamond wire is hung during the current retraction operation of the feed mechanism. Furthermore, in the event that the diamond wire hangs during the retraction operation, the inventor has developed different coping methods based on actual needs. Therefore, based on the control method of the slicer of the present invention, it is expected to achieve automated operation of the slicer in determining whether the diamond wire is hung during the current retraction operation of the feed mechanism.

[0104] It should be pointed out that although the various steps in the above embodiments are described in a specific order, those skilled in the art can understand that in order to achieve the effects of the present invention, different steps do not have to be performed in such an order. They can be performed simultaneously or in other orders, and some steps can also be added, replaced or omitted.

[0105] It should be noted that, although the control method of the slicer constructed in the above specific manner is introduced as an example, those skilled in the art will appreciate that the present invention should not be limited thereto. In fact, the user can flexibly adjust the relevant steps and parameters in the steps according to the actual application scenario and other situations.

[0106] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A control method for a slicer, characterized in that: The slicer comprises a blade feeding mechanism and a cutting mechanism with a cutting line wound around it, and the control method comprises: When the cutting mechanism rises to a preset position relative to the cutting mechanism, collecting image data at least including a cutting line; Analyze the image data to determine whether the cutting line is hung during the retracting operation of the cutting mechanism; In the case of the cutting wire hanging, at least the operating parameters of the retracting operation are adjusted.

2. The control method according to claim 1, characterized in that: The “collecting image data at least including the cutting line when the feed mechanism rises to a preset position relative to the cutting mechanism” includes: When the cutting mechanism rises to a preset position relative to the cutting mechanism, collecting image data including the cutting line and the cutting mechanism; Accordingly, the “analyzing the image data to determine whether the cutting line is hanging during the retraction of the cutting mechanism” includes: Obtaining position data between adjacent cutting line segments in the wire mesh; According to the position data, it is determined whether the cutting line is hung during the retraction of the cutting mechanism.

3. The control method according to claim 2, characterized in that: The "obtaining position data between adjacent cutting line segments in the wire mesh" includes: Obtain the distance data between adjacent cutting line segments in the wire mesh; Accordingly, the “determining whether the cutting line is hung during the retraction of the cutting mechanism according to the position data” includes: In the case where there is a jump value in the distance data, it is determined that the cutting line is hung during the retraction of the feed mechanism.

4. The control method according to claim 1, characterized in that: The "analyzing the image data to determine whether the cutting line is hung during the retracting operation of the cutting mechanism" includes: Determine the intersection points of each cutting line segment of the wire mesh and the workpiece or the backing plate according to the image data; The position data of the intersection points corresponding to the plurality of cutting line segments are compared to determine whether the cutting line is hung during the retraction of the cutting mechanism.

5. The control method according to claim 4, characterized in that: The “determining the intersection points of each cutting line segment of the wire mesh and the workpiece or the backing plate according to the image data” includes: Searching for the edge of the workpiece or the backing plate on the image data to determine the edge data of the workpiece or the backing plate; Performing corner point detection on the image data to determine corner point data where the cutting line in the wire mesh contacts the workpiece or the backing plate; According to the edge data and the corner point data, the intersection points of each cutting line segment of the wire mesh and the workpiece or the backing plate are determined.

6. The control method according to claim 1, characterized in that: The “collecting image data at least including the cutting line when the feed mechanism rises to a preset position relative to the cutting mechanism” includes: When the cutting mechanism rises to a preset position relative to the cutting mechanism, collecting image data including the cutting line and the cutting main roller of the cutting mechanism; Accordingly, the “analyzing the image data to determine whether the cutting line is hanging during the retraction of the cutting mechanism” includes: Determining the tangent position between each cutting segment of the wire web and the cutting main roller according to the image data; The tangent positions corresponding to the respective cutting sections are compared to determine whether the cutting line is hung during the retraction of the cutting mechanism.

7. The control method according to claim 6, characterized in that: The “determining the tangent position between each cutting segment of the wire web and the cutting main roller according to the image data” includes: Perform edge search of the cutting mechanism on the image data to determine edge data of the cutting main roller; Performing corner point detection on the image data to determine corner point data of the tangent position between the cutting line in the wire web and the cutting main roller; The tangent position between each cutting line segment of the wire web and the cutting main roller is determined according to the edge data and the corner point data.

8. The control method according to claim 1, characterized in that: The "at least adjusting the operating parameters of the retracting operation when the cutting line is hung" includes: In the case of hanging of the cutting line, reduce the operating parameters of the retracting operation, and The operating parameters of the cutting mechanism are selectively adjusted.

9. The control method according to claim 1, characterized in that: In the step of "analyzing the image data to determine whether the cutting line is hung during the retracting operation of the feed mechanism", the "analyzing the image data" includes: The image data is binarized.

10. The control method according to claim 9, characterized in that: After binarization of the image data, the control method includes: The image data is subjected to threshold segmentation.

11. The control method according to claim 1, characterized in that: The control method further comprises: Feature extraction is performed on the image data.

12. The control method according to claim 1, characterized in that: The slicer comprises a cutting chamber, wherein the cutting chamber is provided with an operating door. The "collecting image data at least containing the cutting line" includes: Acquiring image data at least including the cutting line by at least one of the image acquisition devices; Wherein, the image acquisition device is arranged at a position of the slicer close to the operating door.

13. The control method according to claim 12, characterized in that: The image acquisition device comprises one or more image acquisition devices arranged along the axial direction of the wire web of the cutting line; and / or The image acquisition device is arranged on the slicer in a manner that it can move along the axial direction of the wire web of the cutting wire; and / or The image acquisition device is rotatably arranged on the slicer; and / or The image acquisition device is arranged at a set angle relative to the workpiece and / or the backing plate.

14. A computer-readable storage medium, the storage medium comprising a memory, the memory being adapted to store a plurality of program codes, characterized in that: The program code is suitable for being loaded and run by a processor to execute the control method of the microtome according to any one of claims 1 to 13.

15. A computer device, comprising a memory and a processor, wherein the memory is suitable for storing a plurality of program codes, wherein: The program code is suitable for being loaded and run by the processor to execute the control method of the microtome according to any one of claims 1 to 13.

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