A method for manufacturing a self-induction induction cooker glass panel

Abstract

The present application belongs to the technical field of household appliances, and discloses a method for manufacturing a self-inductive induction cooker glass panel, comprising the steps of printing a circuit on the back of a glass substrate, soldering a plurality of thermistors to form a temperature measuring circuit, and coating an insulating coating. By arranging thermistors at a plurality of positions on the back of the glass substrate, the temperature of various places at the bottom of the kitchenware can be effectively detected, so that the induction cooker can adjust the heating power according to the temperature distribution. The method has the advantages of being able to effectively detect the temperature of various places at the bottom of the kitchenware, preventing the generation of hot spots and excessive temperature differences between different positions of the glass panel, and improving safety and service life.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, and in particular to a method for manufacturing a self-induction induction cooker glass panel. Background Art

[0002] In order to prevent the water in the kitchenware from drying up or the bottom of the kitchenware from being uneven, which may cause the local temperature on the surface of the induction cooker to be too high, the existing induction cooker usually sets a fixed or retractable thermistor in the middle of the induction cooker coil to detect the temperature of the bottom of the kitchenware in real time, and adjust the power or automatically shut down according to the detection results.

[0003] However, this solution has some problems. When the bottom of the kitchenware is concave in the middle, the fixed thermistor cannot contact the bottom of the kitchenware, and thus cannot effectively detect the actual temperature of the bottom of the kitchenware. Some kitchenware bottoms are designed to be concave in the middle with convex edges, or even if the bottom is designed to be flat, the middle may be concave due to being dropped or bumped during use.

[0004] Although the thermistor that can be extended up and down can reliably contact the bottom of the cookware and effectively detect the actual temperature in the middle of the bottom of the cookware, for cookware with an uneven bottom, the temperature at the position in contact with the upper surface of the induction cooker is usually much higher than the temperature at the position not in contact with the upper surface of the induction cooker. This will cause "hot spots" to appear at the position in contact with the upper surface of the induction cooker, which greatly increases the risk of the bottom of the cookware being burned through and the surface of the induction cooker being damaged.

[0005] In addition, due to the low cost of glass panels, some induction cookers use glass panels. However, glass panels have the following disadvantages: when the temperature difference between different positions on the glass panel is large, the glass panel will burst; the solution of setting a single thermistor in the prior art cannot detect the temperature difference between different positions of the glass panel, and thus cannot prevent the occurrence of excessive temperature differences.

[0006] The existing technology cannot effectively detect the temperature of various places at the bottom of the kitchenware, and it is difficult to prevent the generation of hot spots and the excessive temperature difference between different positions of the glass panel, which poses a safety hazard and shortens the service life. Therefore, it is necessary to seek a method for manufacturing a self-sensing induction cooker glass panel to produce a glass panel that can effectively detect the temperature of various places at the bottom of the kitchenware, so that the induction cooker can adjust the heating power according to the temperature distribution, prevent the generation of hot spots and the excessive temperature difference between different positions of the glass panel.

[0007] In view of the above problems, the existing technology needs to be improved urgently. Summary of the invention

[0008] The purpose of the present application is to provide a method for manufacturing a self-inductive induction cooker glass panel, which can produce a glass panel that can effectively detect the temperature of various locations at the bottom of the kitchenware.

[0009] The present application provides a method for manufacturing a self-induction induction cooker glass panel, which is used to prepare the glass panel of the induction cooker, comprising the steps of:

[0010] A1. Printing a circuit on the back of a glass substrate using a conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker to obtain a printed circuit; the printed circuit is at least partially located in the heating area of ​​the glass substrate;

[0011] A2. soldering thermistors at different positions in the heating zone on the back of the glass substrate, so that the thermistors are electrically connected to the printed circuit, forming a temperature measurement circuit for inputting a working voltage to each thermistor and outputting an output signal of each thermistor;

[0012] A3. Coating a first insulating coating on the back of the glass substrate to cover the temperature measuring circuit to obtain a semi-finished product;

[0013] A4. Curing the semi-finished product to obtain a glass panel product.

[0014] By setting thermistors at multiple positions on the back of the glass substrate, the temperature of various places on the bottom of the kitchenware can be effectively detected, so that the induction cooker can adjust the heating power according to the temperature distribution. It has the advantages of being able to effectively detect the temperature of various places on the bottom of the kitchenware, prevent the generation of hot spots and excessive temperature differences between different positions of the glass panel, and improve safety and service life.

[0015] Preferably, the step A1 further includes the following steps:

[0016] A00. Print a display pattern on the back side of the glass substrate.

[0017] Printing the display pattern on the back of the glass substrate can form a beautiful decorative effect on the glass panel and provide different indication patterns for buttons and indicator lights with different functions. By performing these steps before printing the printed circuit, it can be ensured that the display pattern will not be covered by the subsequent printed circuit and coating.

[0018] Preferably, after step A00 and before step A1, the method further includes the following steps:

[0019] A01. Apply a second insulating coating on the back side of the glass substrate.

[0020] Applying the second insulating coating can protect the printed display pattern and prevent it from being affected by the subsequent circuit printing and coating process. It can also effectively prevent direct contact between the glass substrate and electrical components, reduce the risk of short circuits, and improve overall electrical safety. At the same time, this insulating coating can also provide a flat and insulating foundation for the subsequent circuit printing steps, which is conducive to improving the quality and reliability of printed circuits.

[0021] Preferably, in both step A01 and step A3, the thermal expansion coefficient after curing is 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain the corresponding insulating coating.

[0022] Preferably, the coating thickness of the second insulating coating layer is 10 μm-15 μm; and the coating thickness of the first insulating coating layer is 3 μm-5 μm.

[0023] Optionally, in step A1, aluminum or copper material is used to print the printed circuit.

[0024] Optionally, in step A1, the printed circuit is printed using a polyimide material.

[0025] Preferably, in step A2, the heating area on the back side of the glass substrate is divided into a plurality of self-sensing areas, and at least one thermistor is soldered in each of the self-sensing areas.

[0026] Preferably, the self-sensing zone includes a first self-sensing zone located in the middle of the heating zone and a plurality of second self-sensing zones evenly arranged around the first self-sensing zone.

[0027] Beneficial effects: The manufacturing method of the self-inductive induction cooker glass panel provided in the present application includes the steps of printing a circuit on the back of a glass substrate, soldering a plurality of thermistors to form a temperature measuring circuit, and applying an insulating coating. By arranging thermistors at multiple positions on the back of the glass substrate, the temperature of various locations on the bottom of the kitchenware can be effectively detected, thereby facilitating the induction cooker to adjust the heating power according to the temperature distribution. The method has the advantages of being able to effectively detect the temperature of various locations on the bottom of the kitchenware, preventing the generation of hot spots and excessive temperature differences between different locations of the glass panel, thereby improving safety and service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The present invention provides a flowchart of a method for manufacturing a self-induction induction cooker glass panel according to an embodiment of the present application.

[0029] Figure 2 A flow chart of another method for manufacturing a self-induction induction cooker glass panel provided in an embodiment of the present application.

[0030] Figure 3This is a bottom view of the glass substrate after the display pattern is printed.

[0031] Figure 4 Schematic diagram of the distribution location of thermistors and printed circuits.

[0032] Figure 5 4 is a cross-sectional view of the self-induction cooker glass panel corresponding to step A01.

[0033] Figure 6 4 is a cross-sectional view of the self-induction cooker glass panel corresponding to step A1.

[0034] Figure 7 4 is a cross-sectional view of the self-induction cooker glass panel corresponding to step A2.

[0035] Figure 8 4 is a cross-sectional view of the self-induction cooker glass panel corresponding to step A3.

[0036] Explanation of reference numerals: 1. glass substrate; 101. first self-inductive region; 102. second self-inductive region; 2. printed circuit; 3. thermistor; 4. temperature measuring circuit; 5. first insulating coating; 7. display pattern; 8. second insulating coating. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0038] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0039] Temperature control is a key technical challenge in the application of induction cookers. Existing temperature detection methods usually rely on setting a single thermistor at the center of the induction cooker coil. However, this method has serious limitations. When using cookware with an uneven bottom, the fixed thermistor may not be able to effectively contact the bottom of the cookware, resulting in inaccurate temperature detection. Even if a thermistor that can be extended up and down is used, it is impossible to fully reflect the temperature distribution at the bottom of the cookware. This single-point temperature measurement method makes it difficult to detect the formation of local hot spots, increasing the risk of the bottom of the cookware being burned through and the surface of the induction cooker being damaged. In addition, for induction cookers using glass panels, single-point temperature measurement cannot effectively monitor the temperature difference between different positions of the panel, which may cause the glass panel to burst due to temperature stress. These problems seriously affect the safety, cooking effect and service life of the induction cooker.

[0040] If these technical problems are not solved, a series of serious consequences will occur. The formation of local hot spots may cause food to be overcooked or burnt in certain areas, affecting the cooking quality and taste. Continuous local overheating may damage the cookware or even cause the bottom of the cookware to burn through. For the induction cooker itself, the accumulation of temperature stress on the glass panel may cause the panel to suddenly break, which not only causes property damage but also may cause personal injury to the user. Due to imprecise temperature control, the energy efficiency of the induction cooker will also be affected, resulting in unnecessary energy waste. In the long run, these problems will significantly shorten the service life of the induction cooker and kitchenware, and increase the replacement cost for users. Therefore, it is particularly important to develop a new method for manufacturing induction cooker glass panels that can comprehensively and accurately detect the temperature distribution at the bottom of the kitchenware. This improvement can not only improve cooking safety and effectiveness, but also extend the life of the equipment and enhance the user experience.

[0041] To this end, the present application proposes a method for manufacturing a self-inductive induction cooker glass panel, which is used to prepare a glass panel that can effectively detect the temperature of various locations at the bottom of the kitchenware.

[0042] Please refer to Figure 1 In some embodiments of the present application, a method for manufacturing a self-induction induction cooker glass panel is used to prepare a glass panel for an induction cooker, comprising the steps of:

[0043] A1. A conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker is used to print a circuit on the back of the glass substrate 1 to obtain a printed circuit 2; the printed circuit 2 is at least partially located in the heating area of ​​the glass substrate 1 (that is, partially or entirely located in the heating area of ​​the glass substrate 1);

[0044] A2. Thermistors 3 are soldered at multiple different positions in the heating zone on the back of the glass substrate 1, so that the thermistors 3 are electrically connected to the printed circuit 2, forming a temperature measuring circuit 4 for inputting a working voltage to each thermistor 3 and outputting an output signal (which may be a current signal or a voltage signal) of each thermistor 3;

[0045] A3. Coating a first insulating coating 5 on the back of the glass substrate 1 to cover the temperature measuring circuit 4 to obtain a semi-finished product;

[0046] A4. After curing the semi-finished product, a glass panel product is obtained.

[0047] By arranging thermistors 3 at multiple positions on the back of the glass substrate 1, the temperature of various locations at the bottom of the kitchenware can be effectively detected, so that the induction cooker can adjust the heating power according to the temperature distribution. It has the advantages of being able to effectively detect the temperature of various locations at the bottom of the kitchenware, prevent the generation of hot spots and excessive temperature differences between different locations of the glass panel (for example, when the induction cooker detects that the temperature of at least one location is too high or the maximum temperature deviation between different locations is too high through the self-sensing induction cooker glass panel, the heating power is reduced to avoid the generation of hot spots and excessive temperature differences), thereby improving safety and service life. Among them, the first insulating coating 5 covers the temperature measurement circuit 4, which plays an electrical isolation and protection role.

[0048] Among them, since the printed circuit 2 does not react magnetically with the magnetic field generated by the induction cooker coil, the interference of the magnetic field of the induction cooker coil on the printed circuit 2 can be effectively reduced, thereby ensuring the stability and accuracy of the temperature measuring circuit 4; and the accuracy can be improved. Since the influence of the external magnetic field is reduced, the temperature measuring circuit 4 can more accurately reflect the temperature change of the thermistor 3, thereby improving the accuracy of temperature measurement; and the compatibility can also be enhanced. This design enables the self-inductive induction cooker glass panel to work normally in a strong magnetic field environment, thereby enhancing the applicability and compatibility of the product.

[0049] In some preferred embodiments, see Figure 2 , before step A1, the following steps are also included:

[0050] A00. Print the display pattern 7 on the back side of the glass substrate 1.

[0051] Printing the display pattern 7 on the back of the glass substrate 1 can form an aesthetically pleasing decorative effect on the glass panel and provide different indication patterns for buttons and indicator lights with different functions (such as Figure 3 By performing these steps before printing the printed circuit 2, it can be ensured that the display pattern 7 will not be covered by the subsequent printed circuit 2 and coating.

[0052] There are many methods for printing the display pattern 7. For example, screen printing technology can be used to transfer the designed pattern to the back of the glass substrate 1 through a screen. Inkjet printing technology can also be used to directly print the digitized pattern on the back of the glass substrate 1. In addition, thermal transfer technology can also be considered to transfer the pre-made pattern film to the back of the glass substrate 1 at high temperature. The specific pattern and position of the display pattern 7 can be adjusted according to actual needs.

[0053] Further, after step A00 and before step A1 , A01 . coating a second insulating coating 8 on the back side of the glass substrate 1 .

[0054] Applying the second insulating coating 8 can protect the printed display pattern 7 and prevent it from being affected by the subsequent circuit printing and coating process. It can also effectively prevent direct contact between the glass substrate 1 and the electrical components, reduce the risk of short circuits, and improve overall electrical safety. At the same time, applying the second insulating coating 8 can also provide a flat and insulating foundation for the subsequent circuit printing step, which is conducive to improving the quality and reliability of the printed circuit 2.

[0055] In step A01, insulating materials such as epoxy resin, polyurethane or silicone resin can be used to apply the second insulating coating 8, which have good insulating properties and heat resistance. The color of the second insulating coating 8 can be adjusted according to actual needs, for example, it can be set to black, but is not limited thereto. The coating process of the second insulating coating 8 can be scraping, spin coating or spraying, and its coating thickness can be adjusted according to actual needs.

[0056] The structure of the self-induction induction cooker glass panel after each step A01 to A3 is as follows: Figure 5-Figure 8 shown.

[0057] In one possible implementation, in both step A01 and step A3, a thermal expansion coefficient of 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain the corresponding insulating coating.

[0058] First, the thermal expansion coefficient of the second insulating coating 8 after curing is 3.2×10 -5 / ℃-3.8×10 -5 / ℃, which is close to the thermal expansion coefficient of the glass substrate 1, helps to reduce the thermal stress between the second insulating coating 8 and the glass substrate 1, and reduces the risk of the second insulating coating 8 falling off. Secondly, the material of the first insulating coating 5 is selected as a coating with the same properties as the material of the second insulating coating 8, which ensures the performance consistency between the layers of coating. This consistency is crucial to the stability of the entire structure. When the induction cooker is working, the glass panel will undergo repeated thermal cycles. If different layers of coating have different thermal expansion characteristics, it may cause interlayer stress accumulation, eventually causing the coating to crack or peel off. This risk can be significantly reduced by using materials with consistent thermal expansion coefficients.

[0059] In order to meet the above thermal expansion coefficient requirements, polymer materials such as epoxy resin, silicone resin or polyimide can be selected as the matrix, and appropriate amounts of inorganic fillers such as aluminum oxide and silicon oxide can be added to adjust the thermal expansion coefficient. The selection and proportion of these materials need to be accurately calculated and experimentally verified to ensure that the thermal expansion coefficient of the final cured coating falls within 3.2×10 -5 / ℃ to 3.8×10 -5 / ℃ range.

[0060] Among them, each insulating coating can be applied by screen printing, spraying or doctor blade coating, etc. Each method has its own characteristics, for example, screen printing is suitable for precise control of coating thickness, while spraying is suitable for large-area rapid coating.

[0061] The coating thickness of each insulating coating can be adjusted according to actual needs. For example, the coating thickness of the second insulating coating 8 can be 10 μm-15 μm, the coating thickness of the first insulating coating 5 can be 3 μm-5 μm, and the coating thickness of the third insulating coating 9 can be 3 μm-5 μm.

[0062] The second insulating coating 8 is coated on the back of the glass substrate 1, and its thicker thickness of 10μm-15μm can provide good basic insulation performance. The first insulating coating 5 covers the temperature measuring circuit 4, and its thickness of 3μm-5μm can ensure effective insulation of the temperature measuring circuit 4 without excessively affecting heat conduction. This design scheme of the thickness of the insulating coating can minimize the impact on heat conduction while ensuring the safety of circuit insulation, thereby improving the overall performance and reliability of the self-inductive induction cooker glass panel. By accurately controlling the thickness of each insulating coating, a good balance can be achieved between insulation performance and heat conduction efficiency, which is beneficial to improving the service life and working stability of the product.

[0063] Preferably, in step A1, the printed circuit 2 is printed using a conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker.

[0064] Considering that the influence of electromagnetic eddy current on the printed circuit 2 on the glass panel cannot be completely eliminated in the induction cooker environment, the printed circuit 2 can be prepared by selecting suitable materials according to the working frequency of the induction cooker coil of the induction cooker to minimize this influence.

[0065] For example, for low-frequency induction cookers, in order to reduce costs, copper or aluminum materials can be used to print the printed circuit 2, and polyimide materials or other inorganic conductive materials can also be used to print the printed circuit 2. For high-frequency induction cookers, it is preferred to use polyimide materials or other inorganic conductive materials to print the printed circuit 2. Polyimide material is an excellent conductive material with high conductivity and low magnetism. Even if it is used in a high-frequency induction cooker, it will not be disturbed by the magnetic field generated by the induction cooker coil, thereby ensuring the normal operation of the circuit.

[0066] The printed circuit 2 can be prepared by screen printing, inkjet printing, laser etching, etc. Different printing methods are suitable for different conductive materials and production scales. For example, for mass production, screen printing may be more economical; while for small batch or customized production, inkjet printing may be more flexible.

[0067] In some embodiments, in step A2, the heating area on the back side of the glass substrate 1 is divided into a plurality of self-sensing areas, and at least one thermistor 3 is soldered in each self-sensing area.

[0068] The heating zone is the area opposite to the induction cooker coil of the induction cooker. Dividing the heating zone into multiple self-sensing zones can better adapt to pots of different sizes and shapes and improve the accuracy of temperature measurement. At least one thermistor 3 is soldered in each self-sensing zone to achieve real-time monitoring of the temperature of the zone. This design enables the induction cooker to more accurately sense temperature changes in different zones, thereby achieving more precise temperature control.

[0069] The number, shape, size and distribution of the self-sensing regions can be adjusted according to actual needs. The number of thermistors 3 in each self-sensing region can be adjusted according to actual needs.

[0070] For example, in a preferred embodiment, see Figure 4 The self-sensing area includes a first self-sensing area 101 located in the middle of the heating area (i.e., the circular area in the middle of the figure) and a plurality of second self-sensing areas 102 evenly arranged around the first self-sensing area 101 (i.e., the fan-shaped area around the first self-sensing area 101 in the figure).

[0071] The first self-sensing area 101 is located in the middle of the heating area, and can accurately sense the temperature change in the central area of ​​the bottom of the pot. In fact, the closer to the center of the induction cooker coil, the greater the magnetic field strength, and thus the higher the temperature, the more likely it is to have hot spots, so it is necessary to detect the temperature in the middle of the heating area. Multiple second self-sensing areas 102 are evenly arranged around the first self-sensing area 101, which can fully cover other areas of the bottom of the pot and achieve comprehensive monitoring of the temperature of the entire heating area. This layout design makes the temperature sensing more uniform and comprehensive, and can more accurately reflect the temperature distribution of the entire heating area. By soldering at least one thermistor 3 in each self-sensing area to form a complete temperature measurement circuit 4, the temperature changes of each area can be monitored in real time, providing reliable data support for precise control of heating. This solution improves the accuracy and comprehensiveness of temperature sensing by reasonably dividing the self-sensing area and evenly arranging it, which helps to achieve more accurate temperature control, thereby improving the heating effect and user experience of the induction cooker. At the same time, this design also provides the possibility of achieving differentiated heating control in different areas and enhances the functional flexibility of the induction cooker.

[0072] The number and number of distribution circles of the second self-sensing regions 102 can be adjusted according to actual needs; the second self-sensing regions 102 can be arranged in a single circle or multiple circles, and the number of second self-sensing regions 102 in each circle can be adjusted according to actual needs. Figure 4 In the embodiment, the number of the second self-sensing regions 102 is seven (thereby there are eight self-sensing regions in total), and they are arranged in a circle, and a thermistor 3 is disposed in each self-sensing region; but the present invention is not limited thereto.

[0073] The performance parameters of the thermistor 3 can be selected according to actual needs. For example, a thermistor 3 with a resistance range of 1KΩ-200KΩ, an operating temperature range of -40°C-300°C and a rated power of no more than 25mW can be selected, but it is not limited thereto.

[0074] In step A4, the curing can be carried out by natural curing (i.e., standing curing), thermal curing or UV curing, depending on the selected coating system. The temperature and time of the curing process need to be strictly controlled to ensure that the coating is fully cross-linked and achieves the expected thermal expansion coefficient and insulation performance.

[0075] It should be noted that the magnetic field generated by the induction cooker coil will cause certain interference to the thermistor 3, but the interference of the magnetic field to each thermistor 3 is basically the same; and as long as the thermistor 3 is affected by high temperature, the output signal at the output end will change, no matter how the magnetic field affects it, this changed signal will still exist. In the induction cooker, the output signals of each thermistor 3 can be compared with each other through a comparator, so that according to the deviation between the output signals of each thermistor 3, it can be judged whether there is a specific high-temperature point on the glass panel of the induction cooker. Therefore, even if the magnetic field interferes with the thermistor 3, it does not affect the detection of the specific high-temperature point (that is, although the magnetic field will affect the detection accuracy of the specific value of the temperature, it will not affect the discovery of the specific high-temperature point when multiple thermistors 3 are set); in this way, the corresponding PWM signal can be fed back to adjust the output power of the induction cooker, thereby reducing the overheating situation, thereby protecting the glass from bursting.

[0076] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0077] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A method for manufacturing a self-induction induction cooker glass panel, used for preparing a glass panel for an induction cooker, characterized in that: Includes steps: A1. Printing a circuit on the back of a glass substrate using a conductive material that does not react magnetically to the magnetic field generated by the induction cooker coil of the induction cooker to obtain a printed circuit; the printed circuit is at least partially located in the heating area of ​​the glass substrate; A2. soldering thermistors at different positions in the heating zone on the back of the glass substrate, so that the thermistors are electrically connected to the printed circuit, forming a temperature measurement circuit for inputting a working voltage to each thermistor and outputting an output signal of each thermistor; A3. Coating a first insulating coating on the back of the glass substrate to cover the temperature measuring circuit to obtain a semi-finished product; A4. Curing the semi-finished product to obtain a glass panel product; Before step A1, the following steps are also included: A00. A pattern is printed on the back of the glass substrate; After step A00 and before step A1, the following steps are further included: A01. Coating a second insulating coating on the back of the glass substrate; In both step A01 and step A3, the thermal expansion coefficient after curing is 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain the corresponding insulating coating; The coating thickness of the second insulating coating is 10 μm-15 μm; the coating thickness of the first insulating coating is 3 μm-5 μm; In step A2, the heating area on the back side of the glass substrate is divided into a plurality of self-sensing areas, and at least one thermistor is soldered in each of the self-sensing areas; The self-sensing area includes a first self-sensing area located in the middle of the heating area and a plurality of second self-sensing areas evenly arranged around the first self-sensing area; the second self-sensing areas are arranged in multiple circles.

2. The method for manufacturing a self-induction induction cooker glass panel according to claim 1, characterized in that: In step A1, the printed circuit is printed using aluminum or copper material.

3. The method for manufacturing a self-induction induction cooker glass panel according to claim 1, characterized in that: In step A1, the printed circuit is printed using a polyimide material.

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