Heat exchange plate fin structure, heat exchange device and air conditioner

Abstract

The invention provides a heat exchange plate-fin structure, a heat exchange device and an air conditioner, the heat exchange plate-fin structure comprises a flow path layer, a first gas phase input hole, a first liquid phase input hole, a first output hole and a plurality of circulation grooves are formed in the flow path layer, one end of each circulation groove communicates with the first output hole, and the other end of each circulation groove communicates with the first liquid phase input hole; the first gas phase input hole and the first liquid phase input hole are communicated with the other end of the circulating groove; the plate-shaped layer is arranged on the flow path layer and covers the circulation groove so that a first medium flow path can be defined by the plate-shaped layer and the flow path layer. According to the heat exchange plate-fin structure, the media to be subjected to heat exchange can be distributed into the first medium flow paths, the heat exchange area utilization rate of the heat exchange plate-fin structure is increased, the heat exchange efficiency of the heat exchange plate-fin structure is improved, the compactness of the heat exchange plate-fin structure is guaranteed while the heat exchange performance of the heat exchange plate-fin structure is improved, and the heat exchange efficiency of the heat exchange plate-fin structure is improved. The heat exchange effect consistency of all the heat exchange plate fin structures of the heat exchange device can be improved, and the heat exchange performance of the heat exchange device is further enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning equipment, and in particular to a heat exchange plate fin structure, a heat exchange device and an air conditioner. Background Art

[0002] In the related art, air-conditioning equipment is usually equipped with a heat exchanger. When the refrigerant flows through the heat exchanger, the heat exchanger is used to improve the heat exchange efficiency between the refrigerant and the external environment, thereby ensuring the efficient heating or cooling process. Therefore, the heat exchange performance of the heat exchanger often directly affects the overall performance of the air-conditioning equipment.

[0003] Therefore, how to improve the heat transfer performance of the heat exchanger has become a problem that needs to be solved urgently. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides a heat exchange plate-fin structure.

[0006] A second aspect of the present invention provides a heat exchange device.

[0007] A third aspect of the present invention provides an air conditioner.

[0008] In view of this, according to a first aspect of an embodiment of the present application, a heat exchange plate-fin structure is proposed, comprising:

[0009] A flow path layer is formed with a first gas phase input hole, a first liquid phase input hole, a first output hole and a plurality of flow slots, one end of the flow slot is connected to the first output hole, and the first gas phase input hole and the first liquid phase input hole are both connected to the other end of the flow slot;

[0010] The plate-shaped layer is arranged on the flow path layer, and covers the flow groove to form a first medium flow path with the flow path layer.

[0011] In a possible embodiment, the plate-shaped layer is diffusion-bonded to the flow path layer.

[0012] In a feasible implementation manner, the flow path layer includes:

[0013] A flow path portion is formed with a first through hole, a second through hole, a third through hole and a plurality of connecting grooves, one end of the connecting groove is connected to the third through hole, the first through hole and the second through hole are both connected to the other end of the connecting groove, and the flow path portion is arranged on the plate-shaped layer;

[0014] A covering portion, formed with a fourth through hole, a fifth through hole and a sixth through hole, the covering portion covers an end of the flow slot away from the plate-shaped layer to form the flow slot;

[0015] The first through hole is connected to the fourth through hole to form a first gas phase input hole, the second through hole is connected to the fifth through hole to form a first liquid phase input hole, and the third through hole is connected to the sixth through hole to form a first output hole.

[0016] In a feasible implementation manner, the heat exchange plate-fin structure further includes:

[0017] A current collecting member is arranged at the flow path layer, and a current collecting member is arranged at each of the first gas phase input hole, the first liquid phase input hole and the first output hole;

[0018] The current collecting member forms a current collecting flow path, and the current collecting flow path is connected to the first medium flow path.

[0019] In a feasible embodiment, the plate-shaped layer is formed with a second gas phase input hole, a second liquid phase input hole and a second output hole, the second gas phase input hole and the second liquid phase input hole are respectively connected to the first gas phase input hole and the first liquid phase input hole, and the second output hole is connected to the first output hole.

[0020] In a feasible implementation manner, the distance from one end of the current collecting member away from the flow path layer to the flow path layer is greater than or equal to 0.1 mm.

[0021] In a feasible embodiment, the flow path layer also forms a connecting groove, and the plate-shaped layer covers the connecting groove to form a connecting flow path with the flow path layer. The first liquid phase input hole is connected to one end of the flow groove, and the first gas phase input hole is connected to the first liquid phase input hole through the connecting flow path.

[0022] In a feasible embodiment, the first liquid phase input hole and the first output hole are arranged at intervals along the first direction of the flow path layer, and multiple flow grooves are arranged at intervals along the second direction of the flow path layer, and the length of the flow path layer in the first direction is smaller than the length of the flow path layer in the second direction.

[0023] In a feasible implementation manner, the distance from the first medium flow path to the outer edge of the plate-shaped layer is less than or equal to 2 mm.

[0024] In a feasible embodiment, the plate-shaped layer is made of aluminum material or stainless steel material; and / or

[0025] The flow path layer is made of aluminum material or stainless steel material.

[0026] According to a second aspect of an embodiment of the present application, a heat exchange device is provided, comprising:

[0027] A plurality of heat exchange plate-fin structures as provided in any one of the first aspects above, wherein the plurality of heat exchange plate-fin structures are sequentially arranged along a conduction direction of the first gas phase input hole or the first liquid phase input hole;

[0028] Among them, in two adjacent heat exchange plate-fin structures, a gap is formed between the plate-shaped layer of one and the flow path layer of the other, so that a second medium flow path is formed between the two adjacent heat exchange plate-fin structures.

[0029] According to a third aspect of an embodiment of the present application, an air conditioner is provided, comprising:

[0030] A heat exchange device as proposed in any one of the second aspects above.

[0031] Compared with the prior art, the present invention includes at least the following beneficial effects: the heat exchange plate-fin structure provided in the embodiment of the present application includes a flow path layer and a plate-shaped layer, wherein the flow path layer is formed with a plurality of flow grooves, the plate-shaped layer is arranged on the flow path layer and covers the plurality of the aforementioned flow grooves, so that the plate-shaped layer and the flow path layer can enclose a plurality of first medium flow paths to provide a flow path for the medium to be heat exchanged during use; the flow path layer is also formed with a first gas phase input hole, a first liquid phase input hole and a first output hole, one end of the aforementioned flow groove is connected to the aforementioned first output hole, and the first gas phase input hole and the first liquid phase input hole are connected to the other end of the flow groove, so that the gas phase medium to be heat exchanged and the liquid phase medium to be heat exchanged can flow into the heat exchange plate-fin structure through the aforementioned first gas phase input hole and the aforementioned first liquid phase input hole respectively, and after flowing through the first medium flow path, they are further discharged from the heat exchange plate-fin structure through the aforementioned first output hole. Therefore, based on the above-mentioned configuration, the heat exchange plate-fin structure provided in the embodiment of the present application can distribute the gas phase medium to be heat exchanged and the liquid phase medium to be heat exchanged, which are relatively concentrated when input, to each first medium flow path, thereby improving the dispersion of the medium to be heat exchanged. When there is the medium to be heat exchanged in the first medium flow path, the medium to be heat exchanged in each first medium flow path can absorb the heat in the external environment or release the heat to the external environment through the plate-shaped layer and the flow path layer, thereby facilitating the improvement of the heat exchange area utilization rate of the heat exchange plate-fin structure, improving the heat exchange efficiency of the heat exchange plate-fin structure, ensuring the compactness of the heat exchange plate-fin structure while improving the heat exchange performance of the heat exchange plate-fin structure, improving the miniaturization and lightweight level of the heat exchange plate-fin structure, and reducing the volume and weight of the heat exchange device and the air conditioner in practical applications. After heat exchange, the heat exchange medium inside can be further output in a concentrated manner through the first output hole, which can provide a guarantee for the convenience of medium output of the heat exchange plate-fin structure; and the heat exchange plate-fin structure provided in the embodiment of the present application can receive the gas phase medium to be exchanged and the liquid phase medium to be exchanged in a relatively independent form, so that when the heat exchange plate-fin structure is used as a component of a heat exchange device, it is beneficial for the heat exchange device to distribute the heat exchange medium of different phases to each heat exchange plate-fin structure more evenly, thereby ensuring the uniformity of medium distribution in the heat exchange device, ensuring that each heat exchange plate-fin structure can be simultaneously allocated to the gas phase medium to be exchanged or the liquid phase medium to be exchanged, reducing the excessive proportion of the gas phase medium to be exchanged or the liquid phase medium to be exchanged in some heat exchange plate-fin structures, and can improve the consistency of the heat exchange effect of each heat exchange plate-fin structure, and further enhance the heat exchange performance of the heat exchange device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the exemplary embodiments below. The accompanying drawings are only for the purpose of illustrating exemplary embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0033] Figure 1 A schematic structural diagram of a heat exchange plate-fin structure of an embodiment provided in the present application;

[0034] Figure 2 A schematic structural diagram of a flow path layer of an embodiment provided in the present application;

[0035] Figure 3 A schematic structural diagram of a flow path portion of an embodiment provided in the present application;

[0036] Figure 4 A schematic structural diagram of a covering portion of an embodiment provided in the present application;

[0037] Figure 5 A schematic structural diagram of a plate-shaped layer of an embodiment provided in the present application;

[0038] Figure 6 for Figure 1 A schematic cross-sectional view of the heat exchange plate-fin structure along the AA direction shown in FIG.

[0039] Figure 7 A schematic structural diagram of a current collecting member according to an embodiment of the present application;

[0040] Figure 8 A schematic structural diagram of a heat exchange device according to an embodiment of the present application;

[0041] Fig. 9 A schematic structural diagram of a heat exchange device according to another embodiment of the present application.

[0042] in, Figures 1 to 9 The corresponding relationship between the reference numerals and the component names is as follows:

[0043] 10 heat exchange plate-fin structure; 20 first end plate; 30 second end plate; 40 medium input pipe; 50 medium output pipe;

[0044] 100 flow path layers; 200 plate layers; 300 current collectors;

[0045] 110 flow path portion; 120 covering portion;

[0046] 11 first medium flow path; 12 second medium flow path; 14 connecting flow path;

[0047] 101 first liquid phase input hole; 102 first output hole; 103 flow slot; 105 first gas phase input hole; 106 connection slot;

[0048] 201 second liquid phase input hole; 202 second output hole; 204 second gas phase input hole;

[0049] 301 Collector flow path;

[0050] 1101 first through hole; 1102 second through hole; 1103 third through hole; 1104 connecting groove;

[0051] 1201 is a fourth through hole; 1202 is a fifth through hole; 1203 is a sixth through hole. DETAILED DESCRIPTION

[0052] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0053] According to the first aspect of an embodiment of the present application, a heat exchange plate-fin structure 10 is proposed, comprising: a flow path layer 100, which is formed with a first gas phase input hole 105, a first liquid phase input hole 101, a first output hole 102 and a plurality of flow grooves 103, one end of the flow groove 103 is connected to the first output hole 102, and the first gas phase input hole 105 and the first liquid phase input hole 101 are both connected to the other end of the flow groove 103; a plate-shaped layer 200, which is arranged on the flow path layer 100, and the plate-shaped layer 200 covers the flow groove 103 to enclose a first medium flow path 11 with the flow path layer 100.

[0054] The heat exchange plate-fin structure 10 provided in the embodiment of the present application includes a flow path layer 100 and a plate-shaped layer 200, wherein the flow path layer 100 is formed with a plurality of flow grooves 103, and the plate-shaped layer 200 is arranged on the flow path layer 100 and covers the plurality of the aforementioned flow grooves 103, so that the plate-shaped layer 200 and the flow path layer 100 can enclose a plurality of first medium flow paths 11 to provide a flow path for the medium to be heat exchanged during use; the flow path layer 100 is also formed with a first gas phase input hole 105, a first liquid phase input hole 106, and a second liquid phase input hole 107. The heat exchange plate-fin structure 10 is connected to the heat exchanger plate fin structure 10 through the first gas phase input hole 105 and the first liquid phase input hole 101, and one end of the circulation groove 103 is connected to the first input hole 101, and the first liquid phase input hole 101 is connected to the other end of the circulation groove 103, so that the gas phase medium to be heat exchanged and the liquid phase medium to be heat exchanged can flow into the heat exchange plate-fin structure 10 through the first gas phase input hole 105 and the first liquid phase input hole 101 respectively, and further discharge from the heat exchange plate-fin structure 10 through the first output hole 102 after flowing through the first medium flow path 11.

[0055] Therefore, based on the above-mentioned settings, the heat exchange plate-fin structure 10 provided in the embodiment of the present application can distribute the gas phase medium to be heat exchanged and the liquid phase medium to be heat exchanged that are relatively concentrated when input to each first medium flow path 11, thereby improving the dispersion of the medium to be heat exchanged. When there is medium to be heat exchanged in the first medium flow path 11, the medium to be heat exchanged in each first medium flow path 11 can absorb heat from the external environment or release heat to the external environment through the plate-shaped layer 200 and the flow path layer 100, thereby facilitating the improvement of the heat exchange area utilization rate of the heat exchange plate-fin structure 10, improving the heat exchange efficiency of the heat exchange plate-fin structure 10, and ensuring the compactness of the heat exchange plate-fin structure 10 while improving the heat exchange performance of the heat exchange plate-fin structure 10, improving the miniaturization and lightweight level of the heat exchange plate-fin structure 10, and reducing the volume and mass of the heat exchange device and the air conditioner in practical applications. After heat exchange, the heat exchange medium in each first medium flow path 11 can be further output in a concentrated manner through the first output hole 102, which can provide a guarantee for the convenience of medium output of the heat exchange plate-fin structure 10.

[0056] It is understandable that if Figures 1 to 6 and Figure 8 As shown, the flow path layer 100 and the plate layer 200 can both be sheet structures, which is beneficial for reducing the overall volume and mass of the heat exchange plate-fin structure 10 while ensuring the heat exchange area of ​​the heat exchange plate-fin structure 10, thereby improving the compactness of the heat exchange plate-fin structure 10.

[0057] It is understandable that if Figures 2 to 4 As shown, the flow path layer 100 can be provided with the aforementioned first gas phase input hole 105, the first liquid phase input hole 101 and the first output hole 102 along its thickness direction, the first gas phase input hole 105, the first liquid phase input hole 101 and the first output hole 102 are arranged at intervals, and the first gas phase input hole 105 and the first liquid phase input hole 101 can be relatively close, and the aforementioned multiple flow grooves 103 are opened in the flow path layer 100 and are located between the first liquid phase input hole 101 and the first output hole 102, so as to establish a communication relationship between the first gas phase input hole 105, the first liquid phase input hole 101, the first output hole 102 and the flow grooves 103, and ensure that the flow grooves 103 can have a relatively high opening length, further ensuring the heat exchange effect of the heat exchange medium when it flows through the first medium flow path 11.

[0058] It is understandable that if Figure 2 and Figure 3As shown, the circulation groove 103 can be an open groove, that is, a notch of the circulation groove 103 can be formed on one side of the flow path layer 100, which is conducive to reducing the difficulty of forming the circulation groove 103. Accordingly, the aforementioned plate-shaped layer 200 covers the circulation groove 103, that is, the plate-shaped layer 200 is arranged on the side of the notch of the flow path layer 100 formed with the circulation groove 103 and covers the aforementioned notch, so that the plate-shaped layer 200 and the flow path layer 100 can enclose the aforementioned first medium flow path 11 based on the groove-shaped space of the circulation groove 103.

[0059] It is understandable that if Figure 6 As shown, the cross-sectional shape of the flow slot 103 can be set according to actual needs. For example, the cross-sectional shape can be a triangle, a quadrilateral, an arcuate shape, etc., which is not limited here.

[0060] It can be understood that the aforementioned heat exchange medium can be but is not limited to refrigerant.

[0061] It should be noted that the heat exchange plate-fin structure 10 provided in the embodiment of the present application can be used as a component of a heat exchange device or an air conditioner in practical applications. During use, the installation position of the heat exchange plate-fin structure 10 can be adjusted so that the fluid medium in the external environment can flow through the heat exchange plate-fin structure 10 along the spacing direction of the multiple first medium flow paths 11, so that the aforementioned fluid medium can pass through the outside of each first medium flow path 11 in sequence when flowing through the heat exchange plate-fin structure 10, and then exchange heat with the medium to be exchanged in the first medium flow path 11. It can be understood that the aforementioned fluid medium can be but is not limited to air. Taking the aforementioned heat exchange plate-fin structure 10 as an example when it is applied to an air conditioner, the spacing direction of the aforementioned multiple first medium flow paths 11 can be used to be arranged along the air supply direction of the air supply device of the air conditioner, so that the airflow output by the aforementioned air supply device can pass through the outside of each first medium flow path 11 in sequence.

[0062] like Figure 8 and Fig. 9As shown, taking the heat exchange plate-fin structure 10 as a component of the heat exchange device as an example, multiple aforementioned heat exchange plate-fin structures 10 can be stacked and arranged, and the first gas phase input holes 105 of each heat exchange plate-fin structure 10 are connected in sequence, the first liquid phase input holes 101 of each heat exchange plate-fin structure 10 are connected in sequence, and the first output holes 102 of each heat exchange plate-fin structure 10 are connected in sequence, so that each first heat exchange plate-fin structure 10 forms a parallel relationship, and then the gas phase medium to be heat exchanged and the liquid phase medium to be heat exchanged can be respectively distributed to the corresponding heat exchange plate-fin structure 10 through each first gas phase input hole 105 and each first liquid phase input hole 101, and flow through the first medium channel of each heat exchange plate-fin structure 10 for heat exchange, and the medium to be heat exchanged can be further centrally output through each first output hole 102 after heat exchange. Among the multiple heat exchange plate-fin structures 10, a gap can be formed between two adjacent heat exchange plate-fin structures 10, and the aforementioned gap can be used as a second medium flow path 12. The second medium flow path 12 can be used for the circulation of fluid medium in the external environment to facilitate heat exchange between the medium to be exchanged and the aforementioned fluid medium. It can be understood that the aforementioned fluid medium can be but is not limited to air.

[0063] Exemplarily, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, the first liquid phase input hole 101 and the first output hole 102 can be arranged along the direction of gravity, so that the first medium flow path 11 can maintain a high verticality. When the aforementioned heat exchange device is used as an evaporator, the condensed water generated on the surface of the heat exchange plate-fin structure 10 can drip under the action of gravity, thereby improving the drainage performance of the heat exchange device and preventing the condensed water from occupying a large area of ​​the second medium flow path 12, which is beneficial to reducing the resistance of the aforementioned fluid medium when flowing through the second medium flow path 12, thereby further exerting the heat exchange performance of the heat exchange device.

[0064] The heat exchange plate-fin structure 10 provided in the embodiment of the present application is based on the setting of the aforementioned first gas phase input hole 105 and the first liquid phase input hole 101, and can receive the gas phase medium to be exchanged and the liquid phase medium to be exchanged in a relatively independent form. Therefore, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, it is beneficial for the heat exchange device to distribute the medium to be exchanged in different phases to each heat exchange plate-fin structure 10 more evenly, thereby ensuring the uniformity of the distribution of the medium in different phases in the heat exchange device, ensuring that each heat exchange plate-fin structure 10 can be simultaneously allocated to the gas phase medium to be exchanged or the liquid phase medium to be exchanged, reducing the possibility of too high a proportion of the gas phase medium to be exchanged or the liquid phase medium to be exchanged in some heat exchange plate-fin structures 10, and can improve the consistency of the heat exchange effect of each heat exchange plate-fin structure 10, and further enhance the heat exchange performance of the heat exchange device.

[0065] In some examples, the plate-shaped layer 200 is diffusion bonded to the flow path layer 100 .

[0066] In this technical solution, the plate-shaped layer 200 and the flow path layer 100 are connected by diffusion bonding. On the one hand, the tightness of the connection between the plate-shaped layer 200 and the flow path layer 100 can be ensured, and a gap between the plate-shaped layer 200 and the flow path layer 100 can be avoided, thereby reducing the possibility of leakage of the medium to be exchanged in the first medium flow path 11; on the other hand, the connection strength between the plate-shaped layer 200 and the flow path layer 100 can also be ensured, thereby improving the adaptability of the heat exchange plate-fin structure 10 to high-pressure working conditions, which is conducive to broadening the heat exchange plate-fin structure 10. On the other hand, it can also reduce the plastic deformation of the plate-shaped layer 200 and the flow path layer 100 during connection, and reduce the possibility of large-scale deformation of the flow groove 103 during the connection process, which is beneficial to ensuring the molding accuracy of the first medium flow path 11. In the process of manufacturing the heat exchange plate-fin structure 10, the possibility of blockage of the first medium flow path 11 can be reduced, and the production yield rate of the heat exchange plate-fin structure 10 can be improved, thereby ensuring the heat exchange performance of the heat exchange plate-fin structure 10.

[0067] For example, Figures 1 to 7 As shown, the surfaces of the flow path layer 100 and the plate-shaped layer 200 may both have a high flatness, which further facilitates the connection of the flow path layer 100 and the plate-shaped layer 200 by diffusion bonding and reduces the possibility of stress irregularity during diffusion bonding.

[0068] It should be noted that when diffusion bonding between the flow path layer 100 and the plate-shaped layer 200 is actually carried out, the flow path layer 100 and the plate-shaped layer 200 can be pressurized and bonded at a temperature lower than the melting point of the plate-shaped layer 200 and the flow path layer 100 to avoid melting and deformation of the flow path layer 100 and the plate-shaped layer 200, thereby ensuring the molding accuracy of the heat exchange plate fin structure 10.

[0069] like Figure 3 , Figure 4 and Figure 6As shown, in some examples, the flow path layer 100 includes: a flow path portion 110, which is formed with a first through hole 1101, a second through hole 1102, a third through hole 1103 and a plurality of connecting grooves 1104, one end of the connecting groove 1104 is connected to the third through hole 1103, and the first through hole 1101 and the second through hole 1102 are both connected to the other end of the connecting groove 1104, and the flow path portion 110 is disposed on the plate-shaped layer 200; a covering portion 120, which is formed with a fourth through hole 1201 , the fifth through hole 1202 and the sixth through hole 1203, the covering portion 120 covers the flow groove 103 away from one end of the plate-shaped layer 200 to form the flow groove 103; wherein the first through hole 1101 is connected to the fourth through hole 1201 to form a first gas phase input hole 105, the second through hole 1102 is connected to the fifth through hole 1202 to form a first liquid phase input hole 101, and the third through hole 1103 is connected to the sixth through hole 1203 to form a first output hole 102.

[0070] In this technical solution, the flow path layer 100 may include a flow path portion 110 and a covering portion 120, wherein the flow path portion 110 is formed with a plurality of connecting grooves 1104, and the connecting grooves 1104 may be a groove-shaped structure with both ends open, and the covering portion 120 is arranged on one side of the flow path portion 110 and covers the open side of the connecting grooves 1104 to form the flow grooves 103. Accordingly, the side of the flow path portion 110 away from the covering portion 120 may be arranged on the plate-shaped layer 200, thereby enclosing the first medium flow path 11, so as to facilitate the use of the first medium flow path 11 to circulate the heat exchange medium in practical applications; the flow path portion 110 is also formed with a first through hole 1101, a second through hole 1102 and a third through hole 1103, and accordingly, the covering portion 120 is formed with a fourth through hole 1201, a fifth through hole 1202 and a sixth through hole 1203. Hole 1203, when the covering portion 120 is arranged on the flow path portion 110, the aforementioned first through hole 1101 and the aforementioned fourth through hole 1201 are interconnected to form the aforementioned first gas phase input hole 105, the aforementioned second through hole 1102 and the aforementioned fifth through hole 1202 are interconnected to form the aforementioned first liquid phase input hole 101, and the aforementioned third through hole 1103 and the aforementioned sixth through hole 1203 are interconnected to form the aforementioned first output hole 102, so that based on the aforementioned arrangement, when the flow path layer 100 is manufactured, the flow path portion 110 and the covering portion 120 can be manufactured independently based on different blanks, and the aforementioned flow groove 103 can be obtained by assembling the flow path portion 110 and the covering portion 120, which is beneficial to reduce the processing difficulty and processing cost of the flow groove 103 and improve the processing efficiency of the flow path layer 100.

[0071] like Figure 1 , Figures 6 to 8As shown, in some examples, the heat exchange plate-fin structure 10 further includes: a collecting member 300, which is arranged in the flow path layer 100, and a collecting member 300 is arranged at each of the first gas phase input hole 105, the first liquid phase input hole 101 and the first output hole 102; wherein the collecting member 300 forms a collecting flow path 301, and the collecting flow path 301 is connected to the first medium flow path 11.

[0072] In this technical solution, the heat exchange plate-fin structure 10 may further include a collector 300 formed with a collector flow path 301, the collector 300 is arranged on the aforementioned flow path layer 100, and a collector 300 is arranged at the aforementioned first gas phase input hole 105, the first liquid phase input hole 101 and the first output hole 102, respectively, and the aforementioned collector flow path 301 is connected to the aforementioned first medium flow path 11, that is, the collector flow path 301 of the collector 300 located at the first gas phase input hole 105 can be connected to the first medium flow path 11 through the aforementioned first gas phase input hole 105, and the collector flow path 301 of the collector 300 located at the first liquid phase input hole 101 can be connected to the first medium flow path 11 through the aforementioned first The liquid phase input hole 101 is connected to the first medium flow path 11, and the collecting flow path 301 of the collecting piece 300 located at the first output hole 102 can be connected to the first medium flow path 11 through the aforementioned first output hole 102. Therefore, based on the aforementioned setting, the heat exchange plate-fin structure 10 can, on the one hand, carry out centralized input and output of the medium to be exchanged through the aforementioned collecting piece 300 during use, thereby improving the convenience of medium circulation of the heat exchange plate-fin structure 10. On the other hand, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, it is convenient for multiple heat exchange plate-fin structures 10 included in the heat exchange device to be connected through the collecting piece 300, which is beneficial to improving the structural compactness of the heat exchange device.

[0073] like Figure 5 As shown, in some examples, the plate-shaped layer 200 is formed with a second gas phase input hole 204, a second liquid phase input hole 201 and a second output hole 202, the second gas phase input hole 204 and the second liquid phase input hole 201 are respectively connected to the first gas phase input hole 105 and the first liquid phase input hole 101, and the second output hole 202 is connected to the first output hole 102.

[0074] In this technical solution, the plate-shaped layer 200 may also be formed with a second gas phase input hole 204, a second liquid phase input hole 201 and a second output hole 202, wherein the second gas phase input hole 204 and the second liquid phase input hole 201 are respectively connected to the first gas phase input hole 105 and the first liquid phase input hole 101, and the second output hole 202 is connected to the first output hole 102. Therefore, in actual applications, the heat exchange plate-fin structure 10 can be connected to external devices through the collecting parts 300 and the plate-shaped layer 200 on both sides of the flow path layer 100, respectively, to improve the connection convenience of the heat exchange plate-fin structure 10.

[0075] For example, Figure 8 As shown, when the heat exchange plate-fin structure 10 is applied to a heat exchange device, in two adjacent heat exchange plate-fin structures 10, each collecting piece 300 of one can be correspondingly connected to the second gas phase input hole 204, the second liquid phase input hole 201 and the second output hole 202 of the other, so that the two adjacent heat exchange plate-fin structures 10 form a parallel relationship, which is convenient for the heat exchange device to evenly distribute the heat exchange medium to each heat exchange plate-fin structure 10, which is conducive to giving full play to the heat exchange performance of the heat exchange device.

[0076] In some examples, the distance from one end of the current collecting member 300 away from the flow path layer 100 to the flow path layer 100 is greater than or equal to 0.1 mm.

[0077] In this technical solution, the distance from one end of the current collecting piece 300 away from the flow path layer 100 to the flow path layer 100 can be greater than or equal to 0.1 mm, so that when the end of the current collecting piece 300 away from the aforementioned flow path layer 100 is used to connect other heat exchange plate-fin structures 10 or other devices, a certain distance can be formed between the aforementioned other heat exchange plate-fin structures 10 or other devices and the flow path layer 100 where the current collecting piece 300 is located, thereby avoiding contact between the aforementioned flow path layer 100 and other structures, which is beneficial for exposing the flow path layer 100 to the external environment more fully, thereby further improving the heat exchange performance of the heat exchange plate-fin structure 10.

[0078] In some feasible examples, the distance from one end of the current collecting member 300 away from the flow path layer 100 to the flow path layer 100 is greater than or equal to 0.1 mm and less than or equal to 10 mm, thereby avoiding the current collecting member 300 from being too long, which is beneficial to ensuring the compactness of the heat exchange plate-fin structure 10.

[0079] like Figure 1 and Figure 2 As shown, in some examples, the flow path layer 100 is also formed with a connecting groove 106, and the plate-shaped layer 200 covers the connecting groove 106 to form a connecting flow path 14 with the flow path layer 100, the first liquid phase input hole 101 is connected to one end of the flow groove 103, and the first gas phase input hole 105 is connected to the first liquid phase input hole 101 through the connecting flow path 14.

[0080] In this technical solution, a first liquid phase input hole 101 can be provided to be connected to one end of the aforementioned circulation groove 103, so that the first liquid phase input hole 101 is directly connected to the first medium flow path 11, and a first gas phase input hole 105 is provided to be connected to the first liquid phase input hole 101 through the aforementioned connecting flow path 14, so that the first gas phase input hole 105 can be connected to the first medium flow path 11 through the first liquid phase input hole 101. Furthermore, on the one hand, the heat exchange plate-fin structure 10 can transport the received gas phase medium to be heat exchanged and the liquid phase medium to be heat exchanged to the first medium flow path 11 for heat exchange, and on the other hand, it can also reduce the connection complexity between the first gas phase input hole 105, the first liquid phase input hole 101 and the first medium flow path 11, simplify the flow path distribution within the heat exchange plate-fin structure 10, and further reduce the processing difficulty of the heat exchange plate-fin structure 10.

[0081] like Figure 2 As shown, in some examples, the first liquid phase input hole 101 and the first output hole 102 are arranged at intervals along the first direction of the flow path layer 100, and the plurality of flow grooves 103 are arranged at intervals along the second direction of the flow path layer 100, and the length of the flow path layer 100 in the first direction is less than the length of the flow path layer 100 in the second direction.

[0082] In this technical solution, the first liquid phase input hole 101 and the first output hole 102 can be arranged at intervals along the direction of the larger size of the flow path layer 100, so as to facilitate increasing the opening length of the circulation groove 103, so as to provide favorable conditions for increasing the heat exchange capacity of the medium to be heat exchanged. Correspondingly, multiple circulation grooves 103 can be arranged at intervals along the direction of the smaller size of the flow path layer 100, which is conducive to further improving the compactness of the heat exchange plate-fin structure 10, reducing the volume and mass of the heat exchange plate-fin structure 10, and achieving further improvement in the lightweight and miniaturization of the heat exchange plate-fin structure 10.

[0083] It should be noted that Figure 5 The X direction is used to schematically represent the aforementioned second direction, and the Y direction is used to schematically represent the aforementioned first direction.

[0084] In some examples, the distance from the first medium flow path 11 to the outer edge of the plate-shaped layer 200 is less than or equal to 2 mm.

[0085] In this technical solution, the distance from the first medium flow path 11 to the outer edge of the plate-shaped layer 200 can be set to be less than or equal to 2 mm, so that when the structural parameters of the flow path layer 100 are constant, the overall size of the plate-shaped layer 200 can be reduced, and then the overall size of the heat exchange plate-fin structure 10 can be reduced. On the one hand, it is beneficial to further improve the compactness of the heat exchange plate-fin structure 10 and enhance the miniaturization and lightweight level of the heat exchange plate-fin structure 10. On the other hand, it also helps to improve the heat exchange efficiency of the heat exchange plate-fin structure 10 and achieve further improvement of the heat exchange performance of the heat exchange plate-fin structure 10.

[0086] It should be noted that, by testing the heat exchange plate-fin structure 10 provided in the embodiment of the present application, when the distance from the first medium flow path 11 to the outer edge of the plate-shaped layer 200 is less than or equal to 2 mm, the heat exchange efficiency of the heat exchange plate-fin structure 10 can be greater than 0.95.

[0087] In some examples, the plate-shaped layer 200 is made of an aluminum material or a stainless steel material; and / or the flow path layer 100 is made of an aluminum material or a stainless steel material.

[0088] In this technical solution, the plate-shaped layer 200 can be made of aluminum material or stainless steel material, which is beneficial to improve the thermal conductivity of the plate-shaped layer 200 and further improve the heat exchange performance of the heat exchange plate-fin structure 10.

[0089] Correspondingly, the flow path layer 100 can also be made of aluminum material or stainless steel material, which is beneficial to improve the thermal conductivity of the plate-shaped layer 200 and further improve the heat exchange performance of the heat exchange plate-fin structure 10.

[0090] like Figure 8 and Fig. 9 As shown, according to the second aspect of an embodiment of the present application, a heat exchange device is proposed, comprising: a plurality of heat exchange plate-fin structures 10 as proposed in any one of the first aspects above, the plurality of heat exchange plate-fin structures 10 are arranged in sequence along the conduction direction of the first gas phase input hole 105 or the first liquid phase input hole 101; wherein, in two adjacent heat exchange plate-fin structures 10, a gap is formed between the plate layer 200 of one and the flow path layer 100 of the other, so that a second medium flow path 12 is formed between the two adjacent heat exchange plate-fin structures 10.

[0091] The heat exchange device provided in the embodiment of the present application may include a plurality of the aforementioned heat exchange plate-fin structures 10, and the plurality of the aforementioned heat exchange plate-fin structures 10 may be arranged in sequence along the conduction direction of the first gas phase input hole 105 or the first liquid phase input hole 101, so that the plurality of heat exchange plate-fin structures 10 form a stacked state, thereby improving the structural compactness of the heat exchange device, and facilitating the distribution of the medium to be exchanged to the corresponding first medium flow path 11 through each first gas phase input hole 105 and the first liquid phase input hole 101, thereby improving the distribution dispersion of the medium to be exchanged, and allowing the medium to be exchanged to flow through the first medium channel of each heat exchange plate-fin structure 10 to exchange heat with the external environment, thereby improving the heat exchange efficiency. In two adjacent heat exchange plate-fin structures 10, the plate-shaped layer 200 of one may form a gap with the flow path layer 100 of the other, and the aforementioned gap may be used as the second medium flow path 12, and the second medium flow path 12 may be used for the circulation of the fluid medium in the external environment, so as to facilitate the heat exchange between the medium to be exchanged and the aforementioned fluid medium.

[0092] It can be understood that the aforementioned heat exchange medium can be but is not limited to refrigerant; the aforementioned fluid medium can be but is not limited to air.

[0093] Exemplarily, when the heat exchange plate-fin structure 10 is used as a component of a heat exchange device, the first liquid phase input hole 101 and the first output hole 102 can be arranged along the direction of gravity, so that the first medium flow path 11 can maintain a high verticality. When the aforementioned heat exchange device is used as an evaporator, the condensed water generated on the surface of the heat exchange plate-fin structure 10 can drip under the action of gravity, thereby improving the drainage performance of the heat exchange device and preventing the condensed water from occupying a large area of ​​the second medium flow path 12, which is beneficial to reducing the resistance of the aforementioned fluid medium when flowing through the second medium flow path 12, thereby further exerting the heat exchange performance of the heat exchange device.

[0094] In some feasible examples, the heat exchange device may further include a first end plate 20, a second end plate 30, a medium input pipe 40, a medium output pipe 50 and a gas-liquid separation device, wherein the first end plate 20 and the second end plate 30 are arranged at intervals along the conduction direction of the aforementioned first input hole, a plurality of the aforementioned heat exchange plate-fin structures 10 are located between the first end plate 20 and the second end plate 30, the medium input pipe 40 and the medium output pipe 50 are penetrated through the aforementioned first end plate 20, and the medium input pipe 40 is connected to the aforementioned gas-liquid separation device, and the medium output pipe 50 is connected to the aforementioned first end plate 20. An output hole 102, the gas phase output end of the gas-liquid separation device is connected to each of the aforementioned first gas phase input holes 105, and the liquid phase output end of the gas-liquid separation device is connected to each of the aforementioned first liquid phase input holes 101. Based on the aforementioned arrangement, the heat exchange device can utilize the first end plate 20 and the second end plate 30 to constrain and fix multiple heat exchange plate-fin structures 10, thereby improving the structural stability and reliability of the heat exchange device, and facilitating the centralized input and output of the medium to be exchanged through the medium input pipe 40 and the medium output pipe 50, respectively, thereby improving the ease of use of the heat exchange device.

[0095] In addition, since the air conditioner provided in the embodiment of the present application includes the heat exchange plate-fin structure 10 proposed in any one of the first aspects above, it has all the beneficial effects of the heat exchange plate-fin structure 10, which will not be repeated here.

[0096] According to a third aspect of an embodiment of the present application, an air conditioner is provided, comprising: a heat exchange device as provided in any one of the second aspects above.

[0097] Since the air conditioner provided in the embodiment of the present application includes the heat exchange device proposed in any one of the second aspects above, it has all the beneficial effects of the heat exchange device, which will not be repeated here.

[0098] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0099] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front” and “back” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0100] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0101] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat exchange plate-fin structure, characterized in that: include: A flow path layer, formed with a first gas phase input hole, a first liquid phase input hole, a first output hole and a plurality of flow slots, one end of the flow slot is connected to the first output hole, and the first gas phase input hole and the first liquid phase input hole are both connected to the other end of the flow slot; The plate-shaped layer is arranged on the flow path layer, and the plate-shaped layer covers the flow groove to form a first medium flow path with the flow path layer.

2. The heat exchange plate-fin structure according to claim 1, characterized in that: The plate-shaped layer is diffusion-bonded to the flow path layer.

3. The heat exchange plate-fin structure according to claim 1, characterized in that: The flow path layer comprises: A flow path portion is formed with a first through hole, a second through hole, a third through hole and a plurality of the communicating grooves, one end of the communicating groove is connected to the third through hole, the first through hole and the second through hole are both connected to the other end of the communicating groove, and the flow path portion is arranged on the plate-shaped layer; a covering portion, formed with a fourth through hole, a fifth through hole and a sixth through hole, wherein the covering portion covers an end of the flow slot away from the plate-shaped layer to form the flow slot; The first through hole is connected to the fourth through hole to form the first gas phase input hole, the second through hole is connected to the fifth through hole to form the first liquid phase input hole, and the third through hole is connected to the sixth through hole to form the first output hole.

4. The heat exchange plate-fin structure according to claim 1, characterized in that: Also includes: A current collecting member is arranged at the flow path layer, wherein one current collecting member is arranged at each of the first gas phase input hole, the first liquid phase input hole and the first output hole; Wherein, the current collecting member forms a current collecting flow path, and the current collecting flow path is connected to the first medium flow path.

5. The heat exchange plate-fin structure according to claim 4, characterized in that: The plate-shaped layer is formed with a second gas phase input hole, a second liquid phase input hole and a second output hole, the second gas phase input hole and the second liquid phase input hole are respectively connected to the first gas phase input hole and the first liquid phase input hole, and the second output hole is connected to the first output hole.

6. The heat exchange plate-fin structure according to claim 4, characterized in that: A distance from one end of the current collecting member away from the flow path layer to the flow path layer is greater than or equal to 0.1 mm.

7. The heat exchange plate-fin structure according to any one of claims 1 to 6, characterized in that: The flow path layer also forms a connecting groove, and the plate-shaped layer covers the connecting groove to form a connecting flow path with the flow path layer. The first liquid phase input hole is connected to one end of the flow groove, and the first gas phase input hole is connected to the first liquid phase input hole through the connecting flow path.

8. The heat exchange plate-fin structure according to claim 7, characterized in that: The first liquid phase input hole and the first output hole are arranged at intervals along the first direction of the flow path layer, and the plurality of flow grooves are arranged at intervals along the second direction of the flow path layer. The length of the flow path layer in the first direction is less than the length of the flow path layer in the second direction.

9. The heat exchange plate-fin structure according to any one of claims 1 to 6, characterized in that: The distance from the first medium flow path to the outer edge of the plate-shaped layer is less than or equal to 2 mm.

10. The heat exchange plate-fin structure according to any one of claims 1 to 6, characterized in that: The plate-shaped layer is made of aluminum material or stainless steel material; and / or The flow path layer is made of aluminum material or stainless steel material.

11. A heat exchange device, characterized in that: include: A plurality of heat exchange plate-fin structures according to any one of claims 1 to 10, wherein the plurality of heat exchange plate-fin structures are arranged in sequence along the conduction direction of the first gas phase input hole or the first liquid phase input hole; Among the two adjacent heat exchange plate-fin structures, a gap is formed between the plate-shaped layer of one and the flow path layer of the other, so that a second medium flow path is formed between the two adjacent heat exchange plate-fin structures.

12. An air conditioner, characterized in that: include: The heat exchange device as claimed in claim 11.

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