Semiconductor refrigeration system under action of electric field

Abstract

The invention relates to the technical field of semiconductor refrigeration, and provides a semiconductor refrigeration system under the action of an electric field. The first power supply is connected with the semiconductor chilling plate, and the first power supply is a direct-current power supply; and the electric field generating device is used for generating an electric field, and the semiconductor chilling plate is arranged in the electric field. According to the semiconductor refrigeration system under the action of the electric field, the semiconductor refrigeration sheet is connected with the first power supply, and based on the Peltier effect, heat absorption and heat release phenomena occur at the hot end and the cold end correspondingly, so that the refrigeration purpose is achieved; and when the semiconductor chilling plate is located in the electric field, based on the electric card and semiconductor thermionic refrigeration effect, the external electric field can effectively reduce the semiconductor refrigeration temperature and enhance the refrigeration efficiency, so that a better cooling effect is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor refrigeration, and in particular to a semiconductor refrigeration system under the action of an electric field. Background Art

[0002] Semiconductor thermoelectric refrigeration technology is a solid-state refrigeration technology based on thermoelectric effects such as the Peltier effect and the Thomson effect. By applying a DC power supply to the thermoelectric module, heat transfer occurs between the semiconductor element and the metal joint, thereby producing a refrigeration effect. Semiconductor thermoelectric refrigeration technology does not require refrigerants, throttle valves, compressors and other related refrigeration equipment. Therefore, there are no environmental problems caused by refrigerant leakage, and there are no moving parts involved. The operation is stable and reliable. Semiconductor thermoelectric refrigeration technology is widely used in various fields such as thermal management of electronic equipment, infrared detector refrigeration, high-precision temperature control, and aerospace fields because of its simple structure, light weight and compactness, no circulating working fluid, fast temperature response, precise and flexible temperature control, and high refrigeration efficiency. It has broad application prospects in electronic technology, bioengineering, medical and health, industry, national defense and military, scientific research, and daily life.

[0003] However, the semiconductor thermoelectric refrigeration technology in the prior art has a small cooling capacity and low cooling efficiency. Summary of the invention

[0004] The present invention provides a semiconductor refrigeration system under the action of an electric field, which is used to solve the defect of low refrigeration efficiency of the semiconductor refrigeration system in the prior art and improve the refrigeration efficiency of the semiconductor refrigeration system.

[0005] The present invention provides a semiconductor refrigeration system under the action of an electric field, comprising: Semiconductor refrigeration chip; A first power source is connected to the semiconductor cooling sheet, and the first power source is a DC power source; The electric field generating device is used to generate an electric field, and the semiconductor cooling sheet is arranged in the electric field.

[0006] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the electric field generating device comprises: A hot end heat exchanger connected to the hot end of the semiconductor refrigeration plate; A cold end heat exchanger connected to the cold end of the semiconductor refrigeration sheet; The second power supply is connected to both the hot-end heat exchanger and the cold-end heat exchanger.

[0007] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the second power supply is a DC power supply or an AC power supply.

[0008] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the semiconductor refrigeration system further includes a safety protection cover, wherein the safety protection cover includes: A first insulating layer, disposed at the periphery of the electric field; The electric field shielding layer is arranged on the periphery of the first insulating layer.

[0009] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the safety protection cover also includes: The second insulating layer is arranged on the periphery of the electric field shielding layer.

[0010] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the electric field generating device also includes an electrode plate, which is arranged on the hot end heat exchanger; and the electrode plate is connected to the second power supply.

[0011] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the hot-end heat exchanger is cooled by liquid cooling, and a cooling fluid flows in the hot-end heat exchanger; the cold-end heat exchanger exchanges heat with the use fluid by liquid cooling.

[0012] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the hot-end heat exchanger is cooled by air cooling, the hot-end heat exchanger is a fin-type heat exchanger, and a heat dissipation fan is provided on the hot-end heat exchanger; the cold-end heat exchanger is cooled by liquid cooling and uses a fluid for heat exchange.

[0013] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the hot-end heat exchanger is cooled by liquid cooling, and a cooling fluid flows in the hot-end heat exchanger; the cold-end heat exchanger is a fin-type heat exchanger, the cold-end heat exchanger is connected to a cooling fan, and the side of the cold-end heat exchanger facing away from the semiconductor refrigeration plate is connected to a use cavity.

[0014] According to a semiconductor refrigeration system under the action of an electric field provided by the present invention, the hot-end heat exchanger and the cold-end heat exchanger both adopt fin-type heat exchangers, and the hot-end heat exchanger and the cold-end heat exchanger are respectively connected to a heat dissipation fan and a cooling fan; the side of the cold-end heat exchanger facing away from the semiconductor refrigeration plate is connected to a use cavity.

[0015] The semiconductor refrigeration system under the action of an electric field provided by the present invention is connected to a first power source through a semiconductor refrigeration sheet, and based on the Peltier effect, heat absorption and heat release phenomena occur at the hot end and the cold end respectively, thereby achieving the purpose of refrigeration; and when the semiconductor refrigeration sheet is in the electric field, based on the electrocaloric and thermal ion refrigeration effects, the external electric field can cause the dipole polarization state in the dielectric material to change, thereby causing the temperature or entropy of the material itself to change, effectively reducing the semiconductor refrigeration temperature, enhancing the refrigeration efficiency, and thus achieving a better cooling effect.

[0016] In addition, the present invention is combined with other heat dissipation methods such as water cooling and air cooling to generate a new type of refrigeration and heat dissipation system, which effectively improves the refrigeration effect of the system and enhances the refrigeration performance of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is one of the structural principle schematic diagrams of the semiconductor refrigeration system under the action of the electric field provided by the present invention.

[0019] Figure 2 This is the second schematic diagram of the structural principle of the semiconductor refrigeration system under the action of the electric field provided by the present invention.

[0020] Figure 3 This is the third schematic diagram of the structural principle of the semiconductor refrigeration system under the action of the electric field provided by the present invention.

[0021] Figure 4 This is the fourth schematic diagram of the structural principle of the semiconductor refrigeration system under the action of the electric field provided by the present invention.

[0022] Figure 5 This is the fifth schematic diagram of the structural principle of the semiconductor refrigeration system under the action of the electric field provided by the present invention.

[0023] Reference numerals: 1. Semiconductor refrigeration sheet; 2. First power supply; 3. Electric field generating device; 31. Hot end heat exchanger; 32. Cold end heat exchanger; 33. Second power supply; 34. Heat dissipation fan; 35. Cooling fan; 4. First insulating layer; 5. Electric field shielding layer; 6. Second insulating layer; 7. Electrode plate; 8. Use cavity. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] Combine the following Figure 1-Figure 5 The present invention describes a semiconductor refrigeration system under the action of an electric field. Figure 1 As shown, an embodiment of the present invention provides a semiconductor refrigeration system under the action of an electric field, including a semiconductor refrigeration sheet 1, a first power source 2 and an electric field generating device 3.

[0027] The first power source 2 is connected to the semiconductor refrigeration sheet 1 through the metal conductor on the semiconductor refrigeration sheet 1, wherein the first power source 2 is a DC power source, and more preferably, the first power source 2 is a DC regulated power source, providing a continuously adjustable DC power source for the system. Based on the Peltier effect, when direct current is passed, the heat at the cold end of the semiconductor refrigeration sheet 1 is moved to the hot end, resulting in a decrease in the temperature of the cold end and an increase in the temperature of the hot end, thereby forming the cold end and the hot end of the semiconductor refrigeration sheet 1. The electric field generating device 3 is used to generate an electric field, and the semiconductor refrigeration sheet 1 is arranged in the electric field. Based on the electric card and semiconductor thermionic refrigeration effect, the external electric field can cause the dipole polarization state in the dielectric material to change, thereby causing the temperature or entropy of the material itself to change, effectively reducing the semiconductor refrigeration temperature, enhancing the refrigeration efficiency, and thus achieving a better cooling effect.

[0028] In a feasible embodiment of the present invention, the electric field generating device 3 includes a hot-end heat exchanger 31, a cold-end heat exchanger 32 and a second power supply 33. The hot-end heat exchanger 31 is connected to the hot end of the semiconductor refrigeration plate 1; the cold-end heat exchanger 32 is connected to the cold end of the semiconductor refrigeration plate 1; the second power supply 33 is connected to both the hot-end heat exchanger 31 and the cold-end heat exchanger 32.

[0029] Furthermore, the basis for the long-term reliable operation of the semiconductor refrigeration plate 1 is to have good heat dissipation, and good heat dissipation is a prerequisite for obtaining the lowest cold-end temperature. Therefore, in the semiconductor refrigeration system under the action of the electric field of the present invention, the upper and lower surfaces of the semiconductor refrigeration plate 1 are coated with a layer of thermal conductive silicone grease (not shown in the figure) and then installed between the hot-end heat exchanger 31 and the cold-end heat exchanger 32. The hot end and the cold end of the semiconductor refrigeration plate 1 are respectively connected to the hot-end heat exchanger 31 and the cold-end heat exchanger 32.

[0030] In a feasible embodiment of the present invention, the second power supply 33 is a DC power supply or an AC power supply. The second power supply 33 is used to generate an electric field on the semiconductor refrigeration plate 1, which can effectively reduce the cooling temperature of the semiconductor refrigeration plate 1 and enhance its cooling efficiency, thereby achieving a better cooling effect.

[0031] In a feasible embodiment of the present invention, a safety protection cover is further included, the safety protection cover includes a first insulating layer 4 and an electric field shielding layer 5, the first insulating layer 4 is arranged at the periphery of the electric field; the electric field shielding layer 5 is arranged at the periphery of the first insulating layer 4, and the electric field shielding layer 5 is used to suppress coupling interference of the electric field. The first insulating layer 4 is used to prevent the leakage of charge.

[0032] In a feasible embodiment of the present invention, the safety protection cover further includes a second insulating layer 6 disposed on the periphery of the electric field shielding layer 5. The provision of the second insulating layer 6 can further prevent the leakage of electric charges.

[0033] like Figure 2 As shown, in a feasible embodiment of the present invention, the electric field generating device further includes an electrode plate 7, which is arranged on the top side of the hot end heat exchanger 31 and the bottom side of the cold end heat exchanger 32; and the electrode plates 7 are connected to the second power supply 33. The electrode plate 7 can be integrated on the hot end heat exchanger 31 or the cold end heat exchanger 32, or can be arranged separately and connected to the hot end heat exchanger 31 or the cold end heat exchanger 32. The electrode plate 7 can be directly connected to the second power supply 33 to form an electric field.

[0034] It should be noted that, in order to ensure safety, an insulating layer may be provided between the electrode plate 7 and the hot-end heat exchanger 31 , and between the electrode plate 7 and the cold-end heat exchanger 32 .

[0035] See again Figure 1 and Figure 2 As shown, in a feasible embodiment of the present invention, the hot end heat exchanger 31 is cooled by liquid cooling, and a cooling fluid flows in the hot end heat exchanger 31, wherein the cooling fluid can be water or other refrigerants such as ethylene glycol. The cold end heat exchanger 32 exchanges heat with the use fluid by liquid cooling, and the use fluid is passed into the cold end heat exchanger 32 for cold transfer.

[0036] It should be noted that, in order to ensure safety, both the pipes for supplying cooling fluid and the pipes for supplying working fluid need to be insulated, that is, they are non-conductive pipes.

[0037] like Figure 3As shown, in a feasible embodiment of the present invention, the hot end heat exchanger 31 is cooled by air cooling, the hot end heat exchanger 31 is a fin heat exchanger, and a heat dissipation fan 34 is provided on the hot end heat exchanger 31, and the heat energy of the hot end of the semiconductor refrigeration plate 1 is quickly conducted and dissipated by air cooling. The semiconductor refrigeration plate 1 is still connected to the cold end heat exchanger 32, and the use fluid is passed into the cold end heat exchanger 32. The use fluid releases heat in the cold end heat exchanger 32 to obtain cold capacity. The cold end heat exchanger 32 uses liquid cooling to exchange heat with the use fluid to achieve rapid cooling of the use fluid.

[0038] like Figure 4 As shown, in a feasible embodiment of the present invention, the hot end heat exchanger 31 is cooled by liquid cooling, and a cooling fluid flows in the hot end heat exchanger 31, and the cooling fluid can be water or other refrigerants such as ethylene glycol. The cold end heat exchanger 32 is a fin type heat exchanger, and the cold end heat exchanger 32 is connected to a cooling fan 35, and the cooling is dissipated by the cooling fan 35 to accelerate the cold transfer of the system. The side of the cold end heat exchanger 32 facing away from the semiconductor refrigeration plate is connected to the use cavity 8, and the cold of the cold end heat exchanger 32 is transferred to the use cavity 8.

[0039] like Figure 5 As shown, in a feasible embodiment of the present invention, both the hot end heat exchanger 31 and the cold end heat exchanger 32 are finned heat exchangers, and the hot end heat exchanger 31 and the cold end heat exchanger 32 are respectively connected to a heat dissipation fan 34 and a cooling fan 35. The heat dissipation fan 34 dissipates heat from the hot end heat exchanger 31, and the cooling fan 35 dissipates cold from the cold end heat exchanger 32, so that the system quickly takes away cold or heat. The side of the cold end heat exchanger 32 facing away from the semiconductor refrigeration sheet 1 is connected to a use cavity 8, and cold energy is provided to the use cavity 8.

[0040] In summary, the semiconductor refrigeration system under the action of an electric field provided by the present invention comprises a semiconductor refrigeration sheet 1, a hot end heat exchanger 31, a cold end heat exchanger 32, a first insulating layer 4, an electric field shielding layer 5, a first power source 2 and a second power source 33. The semiconductor refrigeration sheet 1 is connected to the first power source 2, which is a DC power source at this time. The hot end of the semiconductor refrigeration sheet 1 is connected to the hot end heat exchanger 31, the cold end of the semiconductor refrigeration sheet 1 is connected to the cold end heat exchanger 32, the hot end heat exchanger 31 and the cold end heat exchanger 32 are connected to the second power source 33, which is an AC power source or a DC power source at this time. An electric field is provided on the semiconductor refrigeration sheet 1. The first insulating layer 4 and the electric field shielding layer 5 are outside the refrigeration system, forming a safety protection cover for preventing leakage of the electric field and suppressing coupling interference of the electric field.

[0041] The semiconductor refrigeration system of the present invention can effectively reduce the refrigeration temperature of the system to enhance its refrigeration efficiency, thereby achieving a better cooling effect.

[0042] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "mode", "specific mode", or "some modes" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or mode are included in at least one embodiment or mode of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or modes in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or modes described in this specification and the features of the different embodiments or modes, without contradiction.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor refrigeration system under the action of an electric field, characterized in that: include: Semiconductor cooling chip (1); A first power source (2) connected to the semiconductor cooling sheet (1), wherein the first power source (2) is a direct current power source; The electric field generating device (3) is used to generate an electric field, and the semiconductor cooling sheet (1) is arranged in the electric field.

2. The semiconductor refrigeration system under the action of electric field according to claim 1, characterized in that: The electric field generating device (3) comprises: A hot end heat exchanger (31) connected to the hot end of the semiconductor refrigeration sheet (1); A cold end heat exchanger (32) connected to the cold end of the semiconductor refrigeration sheet (1); A second power source (33) is connected to both the hot-end heat exchanger (31) and the cold-end heat exchanger (32).

3. The semiconductor refrigeration system under the action of electric field according to claim 2, characterized in that: The second power supply (33) is a direct current power supply or an alternating current power supply.

4. The semiconductor refrigeration system under the action of electric field according to claim 1, characterized in that: Also included is a safety protection cover, the safety protection cover comprising: A first insulating layer (4) is arranged on the periphery of the electric field; The electric field shielding layer (5) is arranged on the periphery of the first insulating layer (4).

5. The semiconductor refrigeration system under the action of electric field according to claim 4, characterized in that: The safety protection cover also includes: A second insulating layer (6) is arranged on the periphery of the electric field shielding layer (5).

6. The semiconductor refrigeration system under the action of electric field according to claim 2, characterized in that: The electric field generating device further comprises an electrode plate (7) which is arranged on the hot end heat exchanger (31); and the electrode plate (7) is connected to the second power source (33).

7. The semiconductor refrigeration system under the action of electric field according to claim 2, characterized in that: The hot-end heat exchanger (31) is cooled by liquid cooling, and a cooling fluid flows in the hot-end heat exchanger (31); the cold-end heat exchanger (32) is cooled by liquid cooling to exchange heat with the used fluid.

8. The semiconductor refrigeration system under the action of electric field according to claim 2, characterized in that: The hot end heat exchanger (31) is cooled by air cooling, the hot end heat exchanger (31) is a fin heat exchanger, and a heat dissipation fan (34) is provided on the hot end heat exchanger (31); the cold end heat exchanger (32) is cooled by liquid cooling and uses a fluid for heat exchange.

9. The semiconductor refrigeration system under the action of electric field according to claim 2, characterized in that: The hot-end heat exchanger (31) is cooled by liquid cooling, and a cooling fluid flows in the hot-end heat exchanger (31); the cold-end heat exchanger (32) is a fin-type heat exchanger, the cold-end heat exchanger (32) is connected to a cooling fan, and the side of the cold-end heat exchanger (32) facing away from the semiconductor refrigeration plate is connected to a use cavity (8).

10. The semiconductor refrigeration system under the action of electric field according to claim 2, characterized in that: The hot-end heat exchanger (31) and the cold-end heat exchanger (32) are both fin-type heat exchangers, and the hot-end heat exchanger (31) and the cold-end heat exchanger (32) are respectively connected to a heat dissipation fan (34) and a cooling fan (35); the cold-end heat exchanger (32) is connected to a use cavity (8) on a side facing away from the semiconductor refrigeration plate (1).

Images