Semiconductor refrigeration system under electric field

Abstract

The application relates to the technical field of semiconductor refrigeration, and provides a semiconductor refrigeration system under the action of an electric field, which comprises a semiconductor refrigeration sheet, a first power supply connected with the semiconductor refrigeration sheet, wherein the first power supply is a direct-current power supply, and an electric field generating device used for generating an electric field and provided with the semiconductor refrigeration sheet in the electric field. The semiconductor refrigeration system under the action of the electric field provided by the application is connected with the first power supply through the semiconductor refrigeration sheet, heat absorption and heat release phenomena appear on the hot end and the cold end based on the Peltier effect, and the refrigeration purpose is achieved; when the semiconductor refrigeration sheet is in the electric field, the external electric field can effectively reduce the semiconductor refrigeration temperature and enhance the refrigeration efficiency based on the electrocaloric effect and the semiconductor thermionic refrigeration effect, so that better cooling effect is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor refrigeration, and particularly relates to a semiconductor refrigeration system under the action of an electric field. BACKGROUND

[0002] Semiconductor thermoelectric refrigeration technology is a solid-state refrigeration technology based on thermoelectric effects such as Peltier effect and Thomson effect. By applying a direct current to a thermoelectric module, heat is transferred at the junction of the semiconductor element and the metal connector, thereby producing a refrigeration effect. Semiconductor thermoelectric refrigeration technology does not require refrigerants, throttling valves, compressors and other related refrigeration equipment. Therefore, there is no environmental problem caused by refrigerant leakage, and there are no moving parts, so the operation is stable and reliable. Semiconductor thermoelectric refrigeration technology is widely used in electronic device thermal management, infrared detector refrigeration, high-precision temperature control and other high-tech and aerospace fields, etc. due to its simple structure, light weight, no circulating working medium, fast temperature response, precise and flexible temperature control, and high refrigeration efficiency. It has a wide application prospect in the fields of electronic technology, biological engineering, medical health, industry, national defense and military, scientific research, and daily life.

[0003] However, the semiconductor thermoelectric refrigeration technology in the prior art has a small refrigeration capacity and low refrigeration efficiency. SUMMARY

[0004] The present application provides a semiconductor refrigeration system under the action of an electric field to solve the problem of low refrigeration efficiency of the semiconductor refrigeration system in the prior art and improve the refrigeration efficiency of the semiconductor refrigeration system.

[0005] The present application provides a semiconductor refrigeration system under the action of an electric field, comprising:

[0006] a semiconductor refrigeration sheet;

[0007] a first power supply connected to the semiconductor refrigeration sheet, wherein the first power supply is a direct current power supply;

[0008] an electric field generating device for generating an electric field, and the semiconductor refrigeration sheet is arranged in the electric field.

[0009] According to the semiconductor refrigeration system under the action of an electric field provided by the present application, the electric field generating device comprises:

[0010] a hot end heat exchanger connected to the hot end of the semiconductor refrigeration sheet;

[0011] a cold end heat exchanger connected to the cold end of the semiconductor refrigeration sheet;

[0012] a second power supply connected to the hot end heat exchanger and the cold end heat exchanger.

[0013] The second power supply is a direct current power supply or an alternating current power supply.

[0014] The semiconductor refrigeration system under electric field effect further comprises a safety protection cover, wherein the safety protection cover comprises:

[0015] A first insulation layer is arranged at the outer periphery of the electric field.

[0016] An electric field shielding layer is arranged at the outer periphery of the first insulation layer.

[0017] The semiconductor refrigeration system under electric field effect further comprises a safety protection cover, wherein the safety protection cover comprises:

[0018] A second insulation layer is arranged at the outer periphery of the electric field shielding layer.

[0019] The electric field generating device further comprises an electrode plate arranged on the heat end heat exchanger, and the electrode plate is connected with the second power supply.

[0020] The heat end heat exchanger is cooled in a liquid cooling mode, and cooling fluid flows through the heat end heat exchanger; and the cold end heat exchanger exchanges heat with the use fluid in a liquid cooling mode.

[0021] The heat end heat exchanger is cooled in a liquid cooling mode, and cooling fluid flows through the heat end heat exchanger; and the cold end heat exchanger exchanges heat with the use fluid in a liquid cooling mode.

[0022] The heat end heat exchanger is cooled in a liquid cooling mode, and cooling fluid flows through the heat end heat exchanger; and the cold end heat exchanger exchanges heat with the use fluid in a liquid cooling mode.

[0023] The heat end heat exchanger is cooled in a liquid cooling mode, and cooling fluid flows through the heat end heat exchanger; and the cold end heat exchanger exchanges heat with the use fluid in a liquid cooling mode.

[0024] The semiconductor refrigeration system under the electric field effect provided by the application is connected with the first power supply through the semiconductor refrigeration sheet, and based on the Peltier effect, the heat absorption and heat release phenomena appear at the hot end and the cold end respectively; the refrigeration purpose is realized; and when the semiconductor refrigeration sheet is in the electric field, based on the electric calor and thermionic refrigeration effect, the additional electric field can cause the change of the dipole polarization state in the dielectric material, and then cause the change of the temperature or entropy of the material itself, effectively reduce the semiconductor refrigeration temperature, enhance the refrigeration efficiency, and thus realize the better cooling effect.

[0025] In addition, the application is combined with other heat dissipation modes such as water cooling and air cooling to generate a new type of refrigeration and heat dissipation system, effectively improving the refrigeration effect of the system and improving the refrigeration performance of the system. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is one of the structure principle schematic diagrams of the semiconductor refrigeration system under the electric field effect provided by the application.

[0028] Figure 2 is the second structure principle schematic diagram of the semiconductor refrigeration system under the electric field effect provided by the application.

[0029] Figure 3 is the third structure principle schematic diagram of the semiconductor refrigeration system under the electric field effect provided by the application.

[0030] Figure 4 is the fourth structure principle schematic diagram of the semiconductor refrigeration system under the electric field effect provided by the application.

[0031] Figure 5 is the fifth structure principle schematic diagram of the semiconductor refrigeration system under the electric field effect provided by the application.

[0032] Reference signs:

[0033] 1, semiconductor refrigeration sheet; 2, first power supply; 3, electric field generating device; 31, hot end heat exchanger; 32, cold end heat exchanger; 33, second power supply; 34, heat dissipation fan; 35, heat dissipation fan; 4, first insulation layer; 5, electric field shielding layer; 6, second insulation layer; 7, electrode plate; 8, use cavity. DETAILED DESCRIPTION

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0035] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] The following is combined Figures 1-5 This invention describes a semiconductor cooling system under the influence of an electric field. For example... Figure 1 As shown, an embodiment of the present invention provides a semiconductor refrigeration system under the action of an electric field, including a semiconductor refrigeration chip 1, a first power supply 2, and an electric field generating device 3.

[0037] The first power supply 2 is connected to the thermoelectric cooler 1 via a metal conductor on the thermoelectric cooler 1. The first power supply 2 is a DC power supply, more preferably a DC regulated power supply, providing a continuously adjustable DC power supply to the system. Based on the Peltier effect, when DC current passes through, heat from the cold end of the thermoelectric cooler 1 is transferred to the hot end, causing the cold end temperature to decrease and the hot end temperature to increase, thus forming the cold and hot ends of the thermoelectric cooler 1. An electric field generating device 3 is used to generate an electric field, within which the thermoelectric cooler 1 is placed. Based on the electrocaloric and thermoelectric thermionic cooling effects, the applied electric field can cause changes in the dipole polarization state in the dielectric material, thereby causing changes in the material's own temperature or entropy, effectively reducing the thermoelectric cooling temperature, enhancing cooling efficiency, and achieving a better cooling effect.

[0038] In a feasible embodiment of the present invention, the electric field generating device 3 includes a hot-end heat exchanger 31, a cold-end heat exchanger 32, and a second power supply 33. The hot-end heat exchanger 31 is connected to the hot end of the semiconductor cooling chip 1; the cold-end heat exchanger 32 is connected to the cold end of the semiconductor cooling chip 1; and the second power supply 33 is connected to both the hot-end heat exchanger 31 and the cold-end heat exchanger 32.

[0039] Further, the basis for long-term reliable operation of the semiconductor refrigeration sheet 1 is good heat dissipation, which is a prerequisite for obtaining the lowest cold end temperature. Therefore, in the semiconductor refrigeration system under the electric field of the present application, the semiconductor refrigeration sheet 1 is installed between the hot end heat exchanger 31 and the cold end heat exchanger 32 after the upper and lower surfaces of the semiconductor refrigeration sheet 1 are coated with a layer of heat-conductive silicone grease (not shown in the figure), and the hot end and the cold end of the semiconductor refrigeration sheet 1 are connected with the hot end heat exchanger 31 and the cold end heat exchanger 32, respectively.

[0040] In a feasible embodiment of the present application, the second power supply 33 is a direct current power supply or an alternating current power supply, and the second power supply 33 is used to generate an electric field on the semiconductor refrigeration sheet 1, which can effectively reduce the refrigeration temperature of the semiconductor refrigeration sheet 1 and enhance its refrigeration efficiency, thereby achieving better cooling effect.

[0041] In a feasible embodiment of the present application, the safety protection cover includes a first insulating layer 4 and an electric field shielding layer 5, the first insulating layer 4 is arranged at the outer periphery of the electric field, and the electric field shielding layer 5 is arranged at the outer periphery of the first insulating layer 4, and the electric field shielding layer 5 is used to suppress the coupling interference of the electric field. The first insulating layer 4 is used to prevent the leakage of electric charge.

[0042] In a feasible embodiment of the present application, the safety protection cover further includes a second insulating layer 6 arranged at the outer periphery of the electric field shielding layer 5, and the arrangement of the second insulating layer 6 can further prevent the leakage of electric charge.

[0043] As shown in Figure 2 In a feasible embodiment of the present application, the electric field generating device further includes an electrode plate 7 arranged at the top side of the hot end heat exchanger 31 and the bottom side of the cold end heat exchanger 32, and the electrode plate 7 is connected with the second power supply 33. The electrode plate 7 can be integrated on the hot end heat exchanger 31 or the cold end heat exchanger 32, or can be separately arranged and connected on the hot end heat exchanger 31 or the cold end heat exchanger 32. The electrode plate 7 can be directly connected with the second power supply 33 to form an electric field.

[0044] It should be noted that, in order to ensure safety, an insulating layer can be arranged between the electrode plate 7 and the hot end heat exchanger 31, and between the electrode plate 7 and the cold end heat exchanger 32.

[0045] Referring again to Figure 1 and Figure 2 In a feasible embodiment of the present application, the hot end heat exchanger 31 is cooled in a liquid cooling mode, and a cooling fluid flows through the hot end heat exchanger 31, wherein the cooling fluid can be water or other refrigerants such as ethylene glycol. The cold end heat exchanger 32 exchanges heat with the use fluid in a liquid cooling mode, and the use fluid is introduced into the cold end heat exchanger 32 to transfer cold energy.

[0046] It should be noted that, for safety reasons, both the pipes supplying cooling fluid and the pipes supplying the working fluid must be insulated, i.e., non-conductive.

[0047] like Figure 3 As shown, in a feasible embodiment of the present invention, the hot-end heat exchanger 31 is cooled by air cooling. The hot-end heat exchanger 31 is a finned heat exchanger, and a cooling fan 34 is provided on the hot-end heat exchanger 31 to quickly conduct and dissipate the heat energy of the hot end of the thermoelectric cooler 1 through air cooling. The thermoelectric cooler 1 is still connected to the cold-end heat exchanger 32, and the working fluid is introduced. The working fluid releases heat in the cold-end heat exchanger 32 to obtain cooling. The cold-end heat exchanger 32 uses liquid cooling to exchange heat with the working fluid, thereby achieving rapid cooling of the working fluid.

[0048] like Figure 4 As shown, in a feasible embodiment of the present invention, the hot-end heat exchanger 31 is cooled by liquid cooling, and a cooling fluid flows inside the hot-end heat exchanger 31. The cooling fluid can be water or other refrigerants such as ethylene glycol. The cold-end heat exchanger 32 is a finned heat exchanger, and a cooling fan 35 is connected to the cold-end heat exchanger 32 to dissipate heat and accelerate the transfer of cold energy in the system. A usage cavity 8 is connected to the side of the cold-end heat exchanger 32 facing away from the semiconductor cooling chip, transferring the cold energy of the cold-end heat exchanger 32 to the usage cavity 8.

[0049] like Figure 5 As shown, in a feasible embodiment of the present invention, both the hot-end heat exchanger 31 and the cold-end heat exchanger 32 are finned heat exchangers, and the hot-end heat exchanger 31 and the cold-end heat exchanger 32 are respectively connected to a cooling fan 34 and a cooling fan 35. The cooling fan 34 dissipates heat from the hot-end heat exchanger 31, and the cooling fan 35 dissipates heat from the cold-end heat exchanger 32, allowing the system to quickly remove cold or heat. The side of the cold-end heat exchanger 32 facing away from the semiconductor cooling chip 1 is connected to a usage cavity 8, providing cooling to the usage cavity 8.

[0050] In summary, the semiconductor refrigeration system under the action of an electric field provided by the present invention includes a semiconductor refrigeration chip 1, a hot-end heat exchanger 31, a cold-end heat exchanger 32, a first insulating layer 4, an electric field shielding layer 5, a first power supply 2, and a second power supply 33. The semiconductor refrigeration chip 1 is connected to the first power supply 2, which is a DC power supply. The hot end of the semiconductor refrigeration chip 1 is connected to the hot-end heat exchanger 31, and the cold end of the semiconductor refrigeration chip 1 is connected to the cold-end heat exchanger 32. The hot-end heat exchanger 31 and the cold-end heat exchanger 32 are connected to the second power supply 33, which is an AC power supply or a DC power supply. An electric field is provided on the semiconductor refrigeration chip 1. The first insulating layer 4 and the electric field shielding layer 5 are located outside the refrigeration system, forming a safety protection shield to prevent leakage of the electric field and suppress coupling interference of the electric field.

[0051] The semiconductor refrigeration system can effectively reduce the refrigeration temperature of the system, enhance the refrigeration efficiency, and achieve better cooling effect.

[0052] In the description of the embodiments of the present application, it should be explained that, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0053] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "way", "specific way", or "some ways" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or way are included in at least one embodiment or way of the embodiments of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or way. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or ways in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or features of the embodiments described in the present application without contradiction.

[0054] Finally, it should be pointed out that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor cooling system under the action of an electric field, characterized in that, include: Semiconductor cooling chip (1); The first power supply (2) is connected to the semiconductor cooling chip (1), and the first power supply (2) is a DC power supply; An electric field generating device (3) is used to generate an electric field, and the semiconductor cooling chip (1) is disposed within the electric field. The electric field generating device (3) includes: A hot-end heat exchanger (31) is connected to the hot end of the semiconductor refrigeration chip (1); A cold-end heat exchanger (32) is connected to the cold end of the semiconductor refrigeration chip (1); The second power source (33) is connected to both the hot end heat exchanger (31) and the cold end heat exchanger (32); The second power source (33) is a DC power source or an AC power source.

2. The semiconductor cooling system under the action of an electric field according to claim 1, characterized in that, It also includes a safety shield, which comprises: A first insulating layer (4) is disposed on the outer periphery of the electric field; An electric field shielding layer (5) is disposed on the outer periphery of the first insulating layer (4).

3. The semiconductor cooling system under the action of an electric field according to claim 2, characterized in that, The safety shield also includes: The second insulating layer (6) is disposed on the outer periphery of the electric field shielding layer (5).

4. The semiconductor refrigeration system under the action of an electric field according to claim 1, characterized in that, The electric field generating device also includes an electrode plate (7) disposed on the hot end heat exchanger (31); and the electrode plate (7) is connected to the second power source (33).

5. The semiconductor refrigeration system under the action of an electric field according to claim 1, characterized in that, The hot-end heat exchanger (31) is cooled by liquid cooling and a cooling fluid flows inside the hot-end heat exchanger (31); the cold-end heat exchanger (32) is cooled by liquid cooling and exchanges heat with the working fluid.

6. The semiconductor cooling system under the action of an electric field according to claim 1, characterized in that, The hot end heat exchanger (31) is cooled by air cooling. The hot end heat exchanger (31) is a finned heat exchanger and a heat dissipation fan (34) is provided on the hot end heat exchanger (31). The cold end heat exchanger (32) is cooled by liquid cooling and exchanges heat with the working fluid.

7. The semiconductor refrigeration system under the action of an electric field according to claim 1, characterized in that, The hot end heat exchanger (31) is cooled by liquid cooling and a cooling fluid flows inside the hot end heat exchanger (31); the cold end heat exchanger (32) is a finned heat exchanger, the cold end heat exchanger (32) is connected to a cooling fan, and the side of the cold end heat exchanger (32) facing away from the semiconductor cooling chip is connected to a working cavity (8).

8. The semiconductor refrigeration system under the action of an electric field according to claim 1, characterized in that, Both the hot-end heat exchanger (31) and the cold-end heat exchanger (32) are finned heat exchangers, and the hot-end heat exchanger (31) and the cold-end heat exchanger (32) are respectively connected to a heat dissipation fan (34) and a cooling fan (35); the side of the cold-end heat exchanger (32) facing away from the semiconductor cooling chip (1) is connected to a working cavity (8).

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