Optical module heat dissipation structure and heat dissipation method thereof

Abstract

The present invention relates to the field of optical communication technology, and more specifically to a heat dissipation structure and heat dissipation method for an optical module. The optical module is composed of an upper cover, a base, a PCBA board, an upper heat dissipation assembly, and a lower heat dissipation assembly. The upper heat dissipation assembly and the lower heat dissipation assembly are respectively arranged on the upper and lower sides of the PCBA board and are both composed of a heat conduction plate and a radiator. The heat conduction plate is arranged between the PCBA board and the radiator, with a first side of the heat conduction plate in contact with the PCBA board and a second side in contact with the radiator. The radiator is provided with a main heat dissipation duct extending along its length. The first and second sides of the radiator are both embedded with heat dissipation fins, wherein the heat dissipation fins embedded on the second side of the radiator are in contact with the corresponding upper cover or base, and the second side of the radiator is the side away from the heat conduction plate. The present invention adopts a heat dissipation method that combines dual-channel air cooling and contact heat dissipation to transfer and dissipate heat generated by components on the PCBA board, thereby effectively reducing the internal temperature of the optical module.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical module heat dissipation structure and a heat dissipation method thereof. Background Art

[0002] The optical components in optical communication modules are very sensitive to temperature. Excessively high temperatures can affect the performance of the modules and even cause them to malfunction. Therefore, the heat dissipation problem of optical communication modules has always been a difficult yet unavoidable problem.

[0003] Existing heat dissipation methods for optical communication modules are mainly divided into three methods: internal heat dissipation, external heat dissipation, and a combination of internal and external heat dissipation. The internal heat dissipation method, as proposed in the Chinese invention patent with publication number CN114895409B and patent name "Heat Dissipation Optical Module and Optical Module Heat Dissipation Method," dissipates heat through an internal heat conductive sheet and a cavity filled with cooling liquid; the external heat dissipation method, as proposed in the Chinese invention patent with publication number CN104125751B and patent name "Heat Dissipation Structure of Optical Module," dissipates heat through an external radiator; the combined internal and external heat dissipation method, as proposed in the Chinese invention patent with publication number CN113448027B and patent name "Optical Module Heat Dissipation Structure, Optical Module, and Communication Equipment," dissipates heat through internal heat pipes and external heat dissipation fins. The existing technologies of internal heat dissipation and combined internal and external heat dissipation mentioned above both occupy the internal space of the optical communication module, limiting the space for components arranged on the PCBA and increasing the weight of the optical communication module. The existing technologies of external heat dissipation mentioned above are overly dependent on external heat dissipation equipment and facilities, which is not conducive to the use of optical communication modules in situations where external heat dissipation facilities are lacking.

[0004] Based on this, how to effectively control the internal temperature of the optical communication module while reducing the space occupied by the heat dissipation structure and improving the internal space utilization of the optical communication module is a technical problem that needs to be solved urgently. Summary of the Invention

[0005] The purpose of the present invention is to provide an optical module heat dissipation structure and heat dissipation method thereof, which adopts a heat dissipation method combining dual-channel air cooling and contact cooling to transfer and dissipate the heat generated by components on the PCBA board. While efficiently reducing the internal temperature of the optical module, it can effectively save internal space and provide more space margin for the arrangement of components on the PCBA board. This solves the technical problem of how to effectively control the internal temperature of the optical communication module while reducing the space occupied by the heat dissipation structure and improving the internal space utilization of the optical communication module.

[0006] The present invention is achieved through the following technical solutions: a heat dissipation structure for an optical module, the optical module comprising a structural upper cover, a structural base, and a PCBA board, the structural upper cover being covered on the structural base to form a sealed structure, the PCBA board being disposed within the sealed structure, and further comprising an upper heat dissipation assembly and a lower heat dissipation assembly disposed within the sealed structure, the upper heat dissipation assembly and the lower heat dissipation assembly being disposed on the upper and lower sides of the PCBA board, respectively;

[0007] The upper heat dissipation assembly and the lower heat dissipation assembly are both composed of a heat conducting plate and a radiator;

[0008] The heat conducting plate is arranged between the PCBA board and the radiator, wherein a first side of the heat conducting plate contacts the PCBA board and a second side contacts the radiator, and a main heat dissipation duct extending along the length direction of the radiator is provided inside the radiator;

[0009] The first side and the second side of the radiator are both embedded with heat sinks, wherein the heat sink embedded in the second side of the radiator is in contact with the corresponding structural member upper cover or structural member base, and the second side of the radiator is the side away from the heat conducting plate.

[0010] According to a preferred embodiment, the first side of the radiator is provided with heat dissipation ducts at both ends in the length direction thereof, and the heat dissipation ducts are connected to the heat dissipation main air duct;

[0011] A first through-slot is formed on the heat conducting plate corresponding to the heat dissipation duct, and a second through-slot is formed on the PCBA board corresponding to the heat dissipation duct, wherein the first through-slot and the second through-slot are adapted to the shape of the heat dissipation duct;

[0012] The heat dissipation air ducts of the upper heat dissipation assembly and the lower heat dissipation assembly are connected to each other to form a heat dissipation auxiliary air duct.

[0013] According to a preferred embodiment, the ports on both sides of the main heat dissipation duct of the upper heat dissipation component are connected to the outside of the optical module, and the ports on both sides of the main heat dissipation duct of the lower heat dissipation component are sealed;

[0014] A diverter block is provided in the main heat dissipation air duct of the upper heat dissipation component, and the diverter block is arranged at the rear side of the air inlet of the auxiliary heat dissipation air duct.

[0015] According to a preferred embodiment, a plurality of heat dissipation ribs arranged vertically and at intervals are provided in the radiator of the upper heat dissipation assembly, and the arranged gaps between the plurality of heat dissipation ribs constitute a main heat dissipation air duct.

[0016] According to a preferred embodiment, the heat sinks are arranged along the length direction of the heat sink and are in a zigzag or wavy shape.

[0017] According to a preferred embodiment, a first side of the heat conducting plate is provided with an avoidance groove corresponding to the components on the PCBA board, and thermal grease is coated between the avoidance groove and the components on the PCBA board.

[0018] According to a preferred embodiment, a first buckle is provided on a first side edge of the radiator, and a first slot cooperating with the first buckle is provided on the heat conducting plate;

[0019] A second buckle is provided on the outer side of the heat conducting plate of the upper heat dissipation assembly, and a second slot that matches the second buckle is opened on the heat conducting plate of the lower heat dissipation assembly.

[0020] According to a preferred embodiment, a heat dissipation boss is provided at the edge of the first side of the heat conducting plate along its length direction, a heat dissipation groove is opened at the edge of the PCBA board along its length direction, a heat dissipation bar is embedded in the heat dissipation groove, and the heat dissipation boss is in contact with the heat dissipation bar.

[0021] According to a preferred embodiment, the upper cover of the structural member is composed of an upper structural member and an upper cover plate, the upper cover plate is arranged on the upper surface of the upper structural member, a first thermal pad is provided between the upper cover plate and the radiator of the upper heat dissipation assembly, a second thermal pad is provided between the base of the structural member and the radiator of the lower heat dissipation assembly, an installation groove is provided inside the upper structural member, and the upper heat dissipation assembly and the lower heat dissipation assembly are both arranged in the installation groove.

[0022] The present invention also provides an optical module heat dissipation method, which is applied to the optical module heat dissipation structure as described above, comprising: providing a heat conducting plate and a radiator on the upper and lower sides of a PCBA board, respectively; providing heat sinks on the first and second sides of the radiator; wherein a main heat dissipation duct extending along the length of the radiator is provided inside the radiator;

[0023] The heat generated by the components on the PCBA is transferred to the radiator through the heat conduction plate, and the heat is dissipated by air cooling;

[0024] The heat collected on the radiator is transferred to the corresponding structural member upper cover or structural member base through the heat sink, and the heat is dissipated by contact heat dissipation.

[0025] The technical solution of an optical module heat dissipation structure and heat dissipation method provided by the present invention has at least the following advantages and beneficial effects: (1) a heat dissipation method combining dual-channel air-cooling and contact-type heat dissipation is adopted to transfer and dissipate the heat generated by components on the PCBA board, which can effectively reduce the internal temperature of the optical module; (2) a heat transfer path is designed based on the structural component upper cover, the structural component base, the upper heat dissipation component and the lower heat dissipation component, which can dissipate heat while occupying as little space as possible in the internal cavity of the optical module, effectively saving internal space and providing more space margin for the arrangement of components on the PCBA board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 An exploded schematic diagram of the heat dissipation structure of the optical module provided in Example 1 of the present invention;

[0027] Figure 2 A schematic diagram of the heat sink structure of the upper heat dissipation assembly provided in Example 2 of the present invention;

[0028] Figure 3 A schematic diagram of the heat conduction plate structure of the upper heat dissipation assembly provided in Example 2 of the present invention;

[0029] Figure 4 A schematic diagram of the PCBA structure provided in Example 2 of the present invention;

[0030] Figure 5 A schematic diagram of the heat conduction plate structure of the lower heat dissipation assembly provided in Example 2 of the present invention;

[0031] Figure 6 A schematic diagram of the heat sink structure of the lower heat dissipation assembly provided in Example 2 of the present invention;

[0032] Figure 7 A schematic diagram of the heat sink structure of the upper heat dissipation assembly provided in Example 2 of the present invention;

[0033] Figure 8 A schematic diagram of a heat transfer path provided in Example 4 of the present invention;

[0034] Figure markings: 1-upper cover, 2-upper structural part, 3-radiator, 4-heat conducting plate, 5-sealing gasket, 6-PCBA board, 7-structural part base, 8-thermal pad, 9-sealing pad, 10-thermal grease, 11-heat dissipation bar, 12-buffer pad, 13-screw, 14-first heat sink, 15-second heat sink, 301-shunt block, 302-heat sink mounting slot, 303-heat dissipation duct, 304-first buckle, 305-base avoidance slot, 401-first slot, 402-first through slot, 403-heat dissipation boss, 404-avoidance slot, 405-second buckle, 406-second slot, 601-heat dissipation through slot, 602-second through slot, 603-components. DETAILED DESCRIPTION

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0036] Example 1

[0037] Figure 1 This is an exploded schematic diagram of the heat dissipation structure of the optical module provided by an embodiment of the present invention. Figure 1 As shown, the heat dissipation structure of the optical module is composed of a structural upper cover, a structural base 7 and a PCBA board 6.

[0038] The structural member upper cover is fitted over the structural member base 7, with a sealing gasket 9 lap 5 positioned at the junction between the two. The structural member upper cover comprises an upper structural member 2 and an upper cover plate 1, which is positioned on the upper surface of the upper structural member 2. A sealing groove is defined on the lower surface of one end of the upper structural member 2 and on the upper surface of one end of the structural member base 7, with a sealing gasket 9 embedded in the groove, thereby forming a sealed structure. The PCBA board 6 is positioned within the sealed structure. Furthermore, corresponding screw mounting holes 13 are defined on the upper structural member 2 and the structural member base 7, which are used to connect the upper structural member 2 and the structural member base 7.

[0039] The optical module heat dissipation structure also includes an upper heat dissipation component and a lower heat dissipation component arranged in a sealing structure, and the upper heat dissipation component and the lower heat dissipation component are respectively arranged on the upper and lower sides of the PCBA board 6; an installation groove is provided inside the upper structural member 2, and the upper heat dissipation component and the lower heat dissipation component are both arranged in the installation groove.

[0040] The upper heat dissipation assembly and the lower heat dissipation assembly are both composed of a heat conducting plate 4 and a radiator 3; the heat conducting plate 4 is arranged between the PCBA board 6 and the radiator 3, and the first side of the heat conducting plate 4 contacts the PCBA board 6 and the second side contacts the radiator 3 to transfer the heat generated by the components 603 on the PCBA board 6 to the radiator 3.

[0041] In this embodiment, the PCBA board 6 is provided with a buffer pad 12 at a position not covered by the heat conducting plate 4. The buffer pad 12 is located between the lower surface of the upper structural member 2 or the upper surface of the structural member base 7 and the PCBA board 6 to protect the PCBA board 6. Specifically, a first side of the heat conducting plate 4 is provided with an avoidance groove 404 corresponding to the on-board component 603 of the PCBA board 6. Thermal grease 10 is applied between the avoidance groove 404 and the on-board component 603 of the PCBA board 6. The first side of the heat conducting plate 4 is provided with a heat dissipation convex portion along the edge of its length. The PCBA board 6 is provided with a heat dissipation groove 601 along the edge of its length, and a heat dissipation bar 11 is embedded in the heat dissipation groove 601. The thickness of the heat dissipation bar 11 is about half of the heat dissipation groove 601 of the PCBA board 6. The heat dissipation boss 403 is embedded in the heat dissipation groove 601 and contacts the heat dissipation bar 11. It should be noted that the heat sink and the heat dissipation bar 11 are made of copper. The radiator 3 is provided with a main heat dissipation duct extending along its length to dissipate the transferred heat by air cooling.

[0042] Furthermore, a heat sink mounting groove 302 is provided on both the first and second sides of the radiator 3, and a heat sink is embedded in the heat sink mounting groove 302. The first heat sink 14 embedded in the second side of the radiator 3 is in contact with the corresponding structural upper cover or structural base 7, and the second heat sink 15 embedded in the first side of the radiator 3 is in contact with the heat conducting plate 4. The second side of the radiator 3 is the side away from the heat conducting plate 4; a first thermal pad 8 is provided between the upper cover 1 and the radiator 3 of the upper heat dissipation assembly, and a second thermal pad 8 is provided between the structural base 7 and the radiator 3 of the lower heat dissipation assembly to transfer the heat gathered on the radiator 3 to the corresponding structural upper cover or structural base 7, and dissipate the heat through contact heat dissipation.

[0043] In summary, the heat dissipation method that combines dual-channel air cooling and contact cooling is used to transfer and dissipate the heat generated by the components 603 on the PCBA board 6, which can effectively reduce the internal temperature of the optical module; in addition, the heat transfer path design based on the structural component upper cover, the structural component base 7, the upper heat dissipation component and the lower heat dissipation component can dissipate heat while occupying as little space as possible in the internal cavity of the optical module, effectively saving internal space and providing more space margin for the arrangement of the components 603 on the PCBA board 6.

[0044] Example 2

[0045] This embodiment is based on the technical solution provided in Example 1, and adds auxiliary heat dissipation ducts connecting the radiators 3 on the upper and lower sides of the PCBA board 6, specifically as follows:

[0046] In this embodiment, see Figure 2 and Figure 6As shown, the first side of the radiator 3 is provided with heat dissipation ducts 303 at both ends in the longitudinal direction, and the heat dissipation ducts 303 are connected to the heat dissipation main air duct; see Figure 3 and Figure 5 As shown, the heat conducting plate 4 is provided with a first through slot 402 corresponding to the heat dissipation duct 303, see Figure 4 As shown, a second through-slot 602 is provided on the PCBA board 6 corresponding to the heat dissipation air duct 303. The first through-slot 402 and the second through-slot 602 are both adapted to the shape of the heat dissipation air duct 303. The heat dissipation air duct 303 of the upper heat dissipation component passes through the first through-slot 402 and the second through-slot 602 in sequence and is connected to the heat dissipation air duct 303 of the lower heat dissipation component to form a heat dissipation auxiliary air duct.

[0047] The ports on both sides of the main heat dissipation air duct of the upper heat dissipation component are connected to the outside of the optical module, and the hot air flow in the main heat dissipation air duct is blown out from the radiator 3 through an external blowing device; the ports on both sides of the main heat dissipation air duct of the lower heat dissipation component are sealed and connected to the main heat dissipation air duct of the upper heat dissipation component through the auxiliary heat dissipation air duct, so as to transfer the heat generated by the components 603 on the lower side of the PCBA board 6 to the radiator 3 of the upper heat dissipation component for dissipation.

[0048] Furthermore, a diverter block 301 is provided in the main heat dissipation air duct of the upper heat dissipation component, and the diverter block 301 is arranged on the rear side of the air inlet of the auxiliary heat dissipation air duct; the diverter block 301 divides the airflow entering the main heat dissipation air duct of the upper heat dissipation component into two parts, one part enters the main heat dissipation air duct of the upper heat dissipation component, and the other part enters the main heat dissipation air duct of the lower radiator 3 through the auxiliary heat dissipation air duct.

[0049] See also Figure 2 The radiator 3 of the upper heat dissipation assembly is provided with a plurality of heat dissipation ribs arranged vertically and spaced apart. The arrangement gaps of the plurality of heat dissipation ribs constitute the main heat dissipation duct. Figure 6 , the main heat dissipation duct of the lower heat dissipation component is designed with a hollow inner cavity; in a preferred embodiment of this embodiment, the diverter block 301 is triangular and arranged in each arrangement gap; in another embodiment, see Figure 7 As shown, the diverter block 301 is a partition that blocks a portion of the arrangement gap on the rear side of the air inlet of the heat dissipation auxiliary air duct, intercepts a portion of the airflow and redirects it to the heat dissipation auxiliary air duct, and the remaining airflow enters the heat dissipation main air duct of the upper heat dissipation component through the unblocked arrangement gap.

[0050] Furthermore, the heat sinks are arranged along the length direction of the radiator 3 and are zigzag or wavy, and the angles of adjacent sides of the heat sinks are between 60° and 90°. This design can connect different arrangement gaps and different sections of different arrangement gaps, making the heat more uniform.

[0051] Example 3

[0052] This embodiment is based on the technical solution provided in Example 1 and further explains the assembly method of each component:

[0053] A first clip 304 is provided at the first side edge of the radiator 3, and a first slot 401 is provided on the heat conducting plate 4 to cooperate with the first clip 304 to realize the connection between the radiator 3 and the heat conducting plate 4; base avoidance grooves 305 are provided on both sides of the radiator 3 of the lower heat dissipation assembly; a second clip 405 is provided on the outer side of the heat conducting plate 4 of the upper heat dissipation assembly, and a bevel boss is provided at the lower end of the second clip 405. A second slot 406 is provided on the heat conducting plate 4 of the lower heat dissipation assembly to cooperate with the second clip 405 to realize the connection between the heat conducting plates 4 on the upper and lower sides of the PCBA board 6.

[0054] The following describes the complete assembly process of the optical module heat dissipation structure provided in this embodiment:

[0055] Step 1: Assembly of air-cooled heat dissipation structure:

[0056] The heat sink is pasted into the heat sink mounting groove 302 opened on the first side and the second side of the upper heat dissipation component radiator 3, and then the heat sink 3 is matched and fastened with the heat conducting plate 4; the heat sink is pasted into the heat sink mounting groove 302 opened on the first side and the second side of the lower heat dissipation component radiator 3, and then the heat sink 3 is matched and fastened with the heat conducting plate 4.

[0057] Step 2: Assembly of contact heat dissipation structure:

[0058] Paste the thermal pad 8 on the upper surface of the structural member base 7, and paste the buffer pad 12 on the position of the PCBA board 6 not covered by the thermal conductive plate 4, and then match and install the radiator 3 of the lower heat dissipation component inside the structural member base 7; apply thermal grease 10 in the avoidance groove 404 of the thermal conductive plate 4, and then set the sealing gasket 9 on the heat dissipation duct 303 after the radiator 3 of the lower heat dissipation component passes through the thermal conductive plate 4; set the heat dissipation strip 11 in the heat dissipation groove 601 opened on the PCBA board 6, and then set the PCBA board 6 on the thermal conductive plate 4 of the lower heat dissipation component so that the second groove 602 opened on the PCBA board 6 passes through The heat dissipation duct 303 of the radiator 3 of the lower heat dissipation component performs the same steps on the upper heat dissipation component, which will not be elaborated here; after the heat conduction plate 4 of the upper heat dissipation component is matched and fastened with the heat conduction plate 4 of the lower heat dissipation component, the first thermal pad 8 is pasted between the upper cover 1 and the radiator 3 of the upper heat dissipation component, and the second thermal pad 8 is pasted between the structural member base 7 and the radiator 3 of the lower heat dissipation component, and then the sealing gasket 9 circle 5 is set at the edge of the upper surface of the structural member base 7, and then the upper structural member 2 welded with the upper cover 1 is fastened with the structural member base 7, and finally the structural member upper cover and the structural member base 7 are connected by screws 13.

[0059] Example 4

[0060] This embodiment provides a heat dissipation method for an optical module, which is applied to the heat dissipation structure of the optical module as described in any one of Examples 1 to 3, comprising: arranging a heat conducting plate 4 and a heat sink 3 on the upper and lower sides of a PCBA board 6, respectively, and arranging heat sinks on the first and second sides of the heat sink 3, wherein a main heat dissipation air duct extending along the length direction of the heat sink 3 is provided inside the heat sink 3; the heat generated by the components 603 on the PCBA board 6 is transferred to the heat sink 3 through the heat conducting plate 4, and the heat is dissipated by air cooling; the heat accumulated on the heat sink 3 is transferred to the corresponding structural member upper cover or structural member base 7 through the heat sink, and the heat is dissipated by contact heat dissipation; for the specific heat transfer path, see Figure 8 shown.

[0061] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A heat dissipation structure of an optical module, wherein the optical module is composed of a structural member upper cover, a structural member base (7) and a PCBA board (6), wherein the structural member upper cover is covered on the structural member base (7) to form a sealed structure, and the PCBA board (6) is arranged in the sealed structure, characterized in that: It also includes an upper heat dissipation component and a lower heat dissipation component arranged in the sealing structure, wherein the upper heat dissipation component and the lower heat dissipation component are respectively arranged on the upper and lower sides of the PCBA board (6); The upper heat dissipation assembly and the lower heat dissipation assembly are both composed of a heat conducting plate (4) and a radiator (3); The heat conducting plate (4) is arranged between the PCBA board (6) and the radiator (3); a first side of the heat conducting plate (4) contacts the PCBA board (6) and a second side contacts the radiator (3); and a main heat dissipation duct extending along the length direction of the radiator (3) is provided inside the radiator (3); The first side and the second side of the radiator (3) are both embedded with heat sinks, wherein the heat sink embedded in the second side of the radiator (3) is in contact with the corresponding structural component upper cover or structural component base (7), and the second side of the radiator (3) is the side away from the heat conducting plate (4); The first side of the radiator (3) is provided with heat dissipation ducts (303) at both ends in the length direction thereof, and the heat dissipation ducts (303) are connected to the heat dissipation main air duct; A first through-slot (402) is provided on the heat-conducting plate (4) corresponding to the heat-dissipating air duct (303), and a second through-slot (602) is provided on the PCBA board (6) corresponding to the heat-dissipating air duct (303), wherein both the first through-slot (402) and the second through-slot (602) are adapted to the shape of the heat-dissipating air duct (303); The heat dissipation air ducts (303) of the upper heat dissipation assembly and the lower heat dissipation assembly are connected to each other to form a heat dissipation auxiliary air duct; The ports on both sides of the main heat dissipation duct of the upper heat dissipation component are connected to the outside of the optical module, and the ports on both sides of the main heat dissipation duct of the lower heat dissipation component are sealed; A diverter block (301) is provided in the main heat dissipation air duct of the upper heat dissipation component, and the diverter block (301) is arranged at the rear side of the air inlet of the auxiliary heat dissipation air duct.

2. The optical module heat dissipation structure according to claim 1, wherein: A plurality of heat dissipation ribs arranged vertically and at intervals are provided in the radiator (3) of the upper heat dissipation assembly, and the arranged intervals between the plurality of heat dissipation ribs form a main heat dissipation air duct.

3. The optical module heat dissipation structure according to claim 2, wherein: The heat sinks are arranged along the length direction of the radiator (3) and are in a zigzag or wavy shape.

4. The optical module heat dissipation structure according to claim 1, wherein: A first side of the heat conducting plate (4) is provided with an avoidance groove (404) corresponding to the on-board components (603) of the PCBA board (6), and thermal conductive silicone grease (10) is coated between the avoidance groove (404) and the on-board components (603) of the PCBA board (6).

5. The optical module heat dissipation structure according to claim 1, wherein: A first buckle (304) is provided at a first side edge of the heat sink (3), and a first slot (401) matching the first buckle (304) is provided on the heat conducting plate (4); A second buckle (405) is provided on the outer side of the heat conducting plate (4) of the upper heat dissipation assembly, and a second clamping groove (406) matching with the second buckle (405) is provided on the heat conducting plate (4) of the lower heat dissipation assembly.

6. The optical module heat dissipation structure according to claim 1, wherein: A heat dissipation boss (403) is provided at an edge of a first side of the heat conducting plate (4) along its length direction, a heat dissipation groove (601) is provided at an edge of the PCBA board (6) along its length direction, a heat dissipation bar (11) is embedded in the heat dissipation groove (601), and the heat dissipation boss (403) is in contact with the heat dissipation bar (11).

7. The optical module heat dissipation structure according to claim 1, wherein: The structural member upper cover is composed of an upper structural member (2) and an upper cover plate (1); the upper cover plate (1) is arranged on the upper surface of the upper structural member (2); a first thermal pad (8) is provided between the upper cover plate (1) and the radiator (3) of the upper heat dissipation assembly; a second thermal pad (8) is provided between the structural member base (7) and the radiator (3) of the lower heat dissipation assembly; a mounting groove is provided inside the upper structural member (2); and the upper heat dissipation assembly and the lower heat dissipation assembly are both arranged in the mounting groove.

8. A method for heat dissipation of an optical module, characterized in that: The heat dissipation structure of an optical module according to any one of claims 1 to 7 comprises: A heat conducting plate (4) and a radiator (3) are respectively arranged on the upper and lower sides of the PCBA board (6), and heat sinks are arranged on the first side and the second side of the radiator (3), wherein a main heat dissipation duct extending along the length direction of the radiator (3) is provided inside the radiator (3); The heat generated by the components (603) on the PCBA board (6) is transferred to the radiator (3) through the heat conducting plate (4), and the heat is dissipated by air cooling; The heat gathered on the radiator (3) is transferred to the corresponding structural component upper cover or structural component base (7) through the heat sink, and the heat is dissipated by contact heat dissipation.

Images