Immersion liquid cooling-based test prototype machine

Abstract

The embodiment of the invention provides a prototype based on immersion liquid cooling test, which comprises a GPU board and a board card, and is characterized in that the GPU board comprises a base and an upper cover, and the base and the upper cover are in butt joint to form a first mounting cavity; the first PCB is positioned in the first mounting cavity and is connected with the base; a first equivalent heat source and a heat conduction pad, the first equivalent heat source is arranged on the first PCB, the first PCB comprises a mica sheet and a heating resistance wire wound on the mica sheet, and the heating resistance wire is electrically connected with the first PCB; the radiator is located in the first installation cavity and connected with the first equivalent heat source through the heat conduction pad, a first temperature sensor is arranged on the first PCB, and the first temperature sensor is in communication connection with the first board card and used for collecting the temperature of the first equivalent heat source. The problem of high-heat-flux local hot spot verification in the development process of the liquid cooling server is solved.

Description

Technical Field

[0001] The present application relates to the technical field of liquid-cooled data center servers, and in particular to a prototype machine based on immersion liquid cooling testing. Background Art

[0002] With the explosive growth of AIGC (Artificial Intelligence Generated Content), the performance of GPU (graphics processing unit) and CPU (Central Processing Unit) chips has improved, while their TDP (thermal design power) has continued to rise, and the power density of server machines has soared. A 4U space server can have a heat dissipation requirement of up to 10kW or more. Traditional air cooling is no longer capable of heat dissipation, and server heat dissipation has become the main bottleneck restricting design.

[0003] In order to solve the heat dissipation problem of servers, liquid cooling technology came into being. Immersion liquid cooling technology is to immerse the server directly in a container for direct contact with the refrigerant for heat exchange. It has the advantages of server heat dissipation efficiency, reducing overall data center deployment, improving server reliability, and low deployment noise.

[0004] However, the above deployment form has undergone a huge change from the traditional rack-mounted deployment form, and the traditional server form needs to be adjusted. The front IO needs to be changed for easy maintenance, the component layout needs to be adjusted, and the design of the liquid block needs to be more structurally tested and verified during the product development and design stage. In addition, the verification problem of high heat flux density local hot spots during the development of liquid-cooled servers cannot be fully solved. Summary of the invention

[0005] In view of this, the purpose of the embodiments of the present application is to provide a prototype based on immersion liquid cooling test to solve the technical problem of verifying local hot spots with high heat flux density during the development of liquid-cooled servers.

[0006] The embodiment of the present application provides a prototype machine based on immersion liquid cooling test, including a GPU board and a board card, wherein the GPU board includes:

[0007] A base and an upper cover, wherein the base and the upper cover are butted together to form a first installation cavity;

[0008] A first PCB board, the first PCB board is located in the first mounting cavity and connected to the base;

[0009] A first equivalent heat source and a thermal pad, wherein the first equivalent heat source is disposed on the first PCB board, the first PCB board comprises a mica sheet and a heating resistance wire wound on the mica sheet, and the heating resistance wire is electrically connected to the first PCB board;

[0010] A heat sink is located in the first mounting cavity and is connected to the first equivalent heat source through the thermal pad. A first temperature sensor is provided on the first PCB board. The first temperature sensor is communicatively connected to the first board and is used to collect the temperature of the first equivalent heat source.

[0011] In a possible implementation, the GPU board also includes a fixed baffle, which is located in the first mounting cavity, and is provided with a plurality of first network ports, each of which is electrically connected to the first PCB board; a baffle is also provided on the fixed baffle, and an LED light is also provided on the first PCB board.

[0012] In a possible implementation manner, the power consumption of the first equivalent heat source is 400 W, and the thermal conductivity of the thermal pad is greater than 5 W / cm.

[0013] In a possible implementation, the prototype also includes a CPU board and a second board, the CPU board includes a second PCB board, a second equivalent heat source, a second temperature sensor and a mounting shell; the mounting shell is buckled on the second PCB board to form a second mounting cavity, the second equivalent heat source and the second temperature sensor are both located in the second mounting cavity and are respectively connected to the second PCB board, the power supply part of the second PCB board is provided with a positive pole and a negative pole, which are respectively electrically connected to the second equivalent heat source, the second temperature sensor is communicatively connected to the second board, and is used to collect the temperature of the second equivalent heat source.

[0014] In a possible implementation manner, the power of the second equivalent heat source is AP500W or SP350W, and the mounting shell is made of metal.

[0015] In a possible implementation manner, the prototype further includes a mainboard, a backplane, an IO board, and a riser board.

[0016] In a possible implementation manner, the first board card is provided with a first board card circuit, the first board card circuit includes a first power supply circuit and a first signal circuit, the first power supply circuit is connected to the first equivalent heat source, and the first signal circuit is connected to the first temperature sensor.

[0017] In a possible implementation manner, the second board card is provided with a second board card circuit, the second board card circuit includes a second power supply circuit and a second signal circuit, the second power supply circuit is connected to the second equivalent heat source, and the second signal circuit is connected to the second temperature sensor.

[0018] In a possible implementation manner, a liquid inlet monitoring point and a liquid outlet monitoring point are provided on the mainboard, and a GPU area monitoring point is provided on the GPU board.

[0019] In a possible implementation manner, the IO board is provided with a one-button start / stop physical button and a second network port, and the second network port is used to output power consumption and temperature data of the IO board.

[0020] In the immersion liquid cooling test prototype provided in the embodiment of the present application, the heat source part of the GPU is implemented as follows: the Die adopts an equivalent volume of 55.5*55.5*3.85, and the heating resistor wire is wound with mica sheets to achieve a power consumption of 400W. Epoxy resin is used internally, and 2*Temp.sensors are set on the PCB to monitor the temperature before and after the heat source for analysis and use. The self-developed heat pipe radiator, the TIM material adopts a thermal pad with a thermal conductivity of more than 5W / cm, one 3.3V in the DDR is supplied to the LED and one 48V is supplied to the heat source, and the interconnection is achieved through the PCIe X16 slot. The temperature sensor communicates with the MCU through I2C, and the interconnection is achieved through the PCIe X16 slot, so as to solve the problem of local hot spot verification with high heat flux density during the development of liquid-cooled servers.

[0021] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 An exploded view from a side perspective of a GPU board of an immersion liquid cooling test prototype provided in an embodiment of the present application is shown.

[0024] Figure 2 An exploded view from a top view of a GPU board of a prototype machine for immersion liquid cooling testing provided in an embodiment of the present application is shown.

[0025] Figure 3 A schematic diagram of the structure of a CPU based on an immersion liquid cooling test prototype provided in an embodiment of the present application is shown.

[0026] Figure 4 A schematic plan view of a CPU based on an immersion liquid cooling test prototype provided in an embodiment of the present application is shown.

[0027] Among them: 1. GPU board; 11. base; 12. upper cover; 13. first PCB board; 14. first equivalent heat source; 15. radiator; 16. fixed baffle; 17. first temperature sensor; 2. CPU board; 21. second PCB board; 22. second equivalent heat source; 23. second temperature sensor. DETAILED DESCRIPTION

[0028] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0029] Considering the current use of liquid cooling in heat dissipation development and design, there are still the following problems:

[0030] The heat dissipation medium is changed from air to immersion coolant, and its heat dissipation characteristics test and flow resistance characteristics need to be further tested for different models.

[0031] The simulation design results have large deviations. Traditional simulations need to rely on empirical values ​​to set factors affecting real scenarios, and there is no empirical data for relevant feedback in R&D tests.

[0032] Judging from the current chip development trend, TDP thermal design parameters are getting higher and higher. For example, the TDP of the next-generation NV GPU card will be as high as 1500W and above. Without the physical object, the feasibility test and verification of the next-generation higher power density components cannot be achieved, and the cycle from hardware design to production is long.

[0033] The test results of simulated load using heaters such as PTC have large deviations and cannot obtain flow resistance and local hot spots.

[0034] Testing with actual servers is costly. Due to supply and global trade restrictions, some components cannot be purchased in kind, such as GPUs, CPUs, and other products.

[0035] It is impossible to evaluate the performance of coupled external equipment, such as the equipment operating condition selection of cold plate liquid-cooled CDU and the test verification of the matching degree of immersion tank and CDU equipment operating conditions.

[0036] Based on this, there are huge challenges in pre-research implementation, testing costs, R&D production cycle, supply time, etc. for thermal testing of immersion cooling using physical machines. It is particularly important to conduct a more accurate liquid cooling thermal test evaluation before server development.

[0037] The embodiment of the present application is based on an overall proportional replica of the size and layout of the immersion liquid cooling test prototype, which is used for heat dissipation testing with low cost and high precision. The overall basic functions of one-button start and stop, lighting, temperature, and power consumption acquisition can be realized. The heat source part proportionally replicates the size of the heat source model and the heat flux density of the heat source part.

[0038] The following is an illustration of the design of a 4U8 GPU heat dissipation simulation prototype:

[0039] The board (first board and second board) of the embodiment of the present application is a board of key heat source components required for the mainboard, backplane, GPU board 1, IO board, and Riser board. The board design adopts a two-layer board, which mainly includes component connectors, and the board circuit (first board circuit and second board circuit) is mainly composed of two parts: power supply circuit and signal circuit. The power supply circuit is used for component heat sources (such as the first equivalent heat source 14 and the second equivalent heat source 22), and the signal circuit is used for components and temperature sensors (first temperature sensor 17 and second temperature sensor 23) in the board, wherein the IO board integrates a one-button start and stop physical button, and power consumption and temperature data are output by the network port. The connectors on the board are the same as the connectors of the corresponding component real models, such as PCIeSlot (interface slot), BGA package CPU base, DIMM Slot, etc., so as to realize the physical connection of GPU, network card, CPU, memory components with the mainboard, GPU board 1, and Riser board.

[0040] The power supply scheme of the whole machine is that the BUSBAR (busbar) voltage is supplied to the CLIP, the CLIP supplies power to the motherboard, the motherboard has three 8-pin power connectors to the backplane, and six 4-pin power connectors are supplied to the riser. The power board supplies power to the GPU motherboard through six copper pillars.

[0041] The whole machine heat dissipation point and power consumption monitoring are implemented as follows: for the 3-backplane modular design, each backplane is set with 3 monitoring points, the mainboard is set with liquid inlet and heat source front and rear monitoring points, GPU board 1 is set with GPU area monitoring points, and the heat source component is set with liquid inlet monitoring points. The temperature is sampled and read by mounting to MCU through I2C, and the whole machine power consumption is read by sampling to MCU through precision resistor AD.

[0042] Heat source components include: GPU, CPU, network card, hard disk, memory, these high power density components and components with high total heat generation, which are installed in the chassis respectively. The implementation scheme of CPU components is shown in the figure below. Heat source part: distribution is based on CPU die distribution, power consumption is based on AP500W, SP350W selection, 2*Temp.sensors are built in to monitor the temperature in the cavity, which can be used for analysis, epoxy resin is used for filling, fixing, heat conduction, and the main body is made of pure copper; power supply part, connected to the positive and negative levels of the die through the upper + lower pad, simplifying the BGA package, using copper pads to replace the PCB to divide it into positive and negative areas, including the temperature sensor pins, and the PCB uses a 4-layer board; structure part: the outer shell is made of 1.5mm metal copper, the shape is processed by a milling machine, and the internal fixation uses the bonding function of epoxy resin.

[0043] GPU implementation of heat source components Figure 1 and Figure 2 As shown, the heat source is implemented as follows: Die uses an equivalent volume of 55.5*55.5*3.85, uses mica sheets to wrap the heating resistor wire, achieves a power consumption of 400W, uses epoxy resin inside, and PCB is equipped with 2*Temp.sensors to monitor the temperature before and after the heat source for analysis and use. Self-developed heat pipe radiator 15, TIM material uses a thermal pad with a thermal conductivity of more than 5W / cm, DDR has one 3.3V for LED and one 48V for heat source, interconnected through PCIe X16 slot, temperature sensor communicates with MCU through I2C, and interconnected through PCIe X16 slot. Heat source and PCB are fixed: hot melt adhesive is used for bonding, and heat sink 15 and heat source are locked with screws; the connector uses a standard PCIe X16, which is connected to the GPU board 1 connector, and the whole is made of nickel-plated metal copper and processed by a milling machine.

[0044] The SSD implementation scheme of the heat source component is shown in the figure below, including three parts: heat source, structure and hardware. Heat source part: Die uses mica sheets with equivalent volume to wrap the heating resistor wire to achieve 25W power consumption, epoxy resin is used inside, and PCB is equipped with 2*Temp.sensors to monitor the temperature before and after the heat source for analysis. The hard disk has one 3.3V for LED and one 48V for heat source, which are interconnected through U.2. The temperature sensor communicates with MCU through I2C and is interconnected through the U.2 interface. In terms of structure, the heat source is fixed to the PCB: hot melt adhesive is used to bond the upper cover 12 to the casing, a sealing gasket is added to seal and screws are added to lock it, and the connector uses the commonly used U.2 interface.

[0045] Network card heat source: equivalent heat source size 25*25*5, Sensor: PCB is equipped with 2*Temp.sensors to monitor the temperature before and after the heat source for analysis and use, Radiator 15: self-developed aluminum extruded radiator 15, TIM: thermal pad with thermal conductivity above 5W / cm is used; one 3.3V for LED and one 48V for heat source in the network card, interconnected through PCIe X16. The temperature sensor communicates with the MCU through I2C, and the interconnection is realized through the PCIe X16 interface; the heat source and PCB are fixed: hot melt adhesive is used to bond the radiator 15, screws are used to lock it with the motherboard, and the connector uses PCIe X16 and adapter.

[0046] The immersion liquid cooling test prototype in the embodiment of the present application solves the problem of verifying local hot spots with high heat flux density during the development of liquid-cooled servers, effectively improves the accuracy of pre-research tests, and helps accelerate product development test cycles, predict development risks, reduce development costs, and help evaluate the performance of product equipment that is partially coupled to the CDU through the design of equivalent heat flux density and proportional model replication solutions.

[0047] An immersion liquid cooling test prototype according to an embodiment of the present application includes a GPU board 1 and a board card. The GPU board 1 includes:

[0048] The base 11 and the upper cover 12 are connected to form a first installation cavity;

[0049] A first PCB board 13, the first PCB board 13 is located in the first installation cavity and connected to the base 11;

[0050] A first equivalent heat source 14 and a thermal pad, wherein the first equivalent heat source 14 is disposed on a first PCB board 13, wherein the first PCB board 13 comprises a mica sheet and a heating resistance wire wound on the mica sheet, and the heating resistance wire is electrically connected to the first PCB board 13;

[0051] The heat sink 15 is located in the first installation cavity and is connected to the first equivalent heat source 14 through a thermal pad. A first temperature sensor 17 is provided on the first PCB board 13. The first temperature sensor 17 is communicatively connected to the first board and is used to collect the temperature of the first equivalent heat source 14.

[0052] Combined with the above embodiments, the GPU implementation scheme of the heat source component is shown in the figure below, wherein the heat source is partially implemented as follows: Die uses an equivalent volume of 55.5*55.5*3.85, uses mica sheets to wrap the heating resistor wire, reaches 400W power consumption, uses epoxy resin inside, PCB is equipped with 2*Temp.sensors to monitor the temperature before and after the heat source for analysis and use, self-developed heat pipe radiator 15, TIM material uses a thermal pad with a thermal conductivity of more than 5W / cm, DDR has one 3.3V for LED and one 48V for heat source, interconnected through PCIe X16 slot, temperature sensor communicates with MCU through I2C, and interconnected through PCIe X16 slot. Fix the heat source to the PCB: Use hot melt adhesive to bond, and the heat sink 15 and the heat source are locked with screws; the connector uses a standard PCIe X16, which is connected to the GPU board 1 connector, and the whole is made of nickel-plated metal copper, which is processed by a milling machine.

[0053] In the immersion liquid cooling test prototype according to the embodiment of the present application, the GPU board 1 also includes a fixed baffle 16, which is located in the first installation cavity. A plurality of first network ports are provided on the fixed baffle 16, and each first network port is electrically connected to the first PCB board 13; a baffle is also provided on the fixed baffle 16, and an LED light is also provided on the first PCB board 13.

[0054] In the immersion liquid cooling test prototype according to the embodiment of the present application, the power consumption of the first equivalent heat source 14 is 400 W, and the thermal conductivity of the thermal pad is greater than 5 W / cm.

[0055] The embodiment of the present application is based on an immersion liquid cooling test prototype, and the prototype also includes a CPU board 2 and a second board. The CPU board 2 includes a second PCB board 21, a second equivalent heat source 22, a second temperature sensor 23 and a mounting shell; the mounting shell is buckled on the second PCB board 21 to form a second mounting cavity, the second equivalent heat source 22 and the second temperature sensor 23 are both located in the second mounting cavity, and are respectively connected to the second PCB board 21. The power supply part of the second PCB board 21 is provided with a positive electrode and a negative electrode, which are respectively electrically connected to the second equivalent heat source 22. The second temperature sensor 23 is communicatively connected to the second board and is used to collect the temperature of the second equivalent heat source 22.

[0056] In combination with the above embodiments, the CPU component implementation scheme is as follows Figure 3 and Figure 4As shown, the heat source part: the distribution is based on the CPU die distribution, the power consumption is based on the AP500W, SP350W selection, and 2*Temp.sensors are built in to monitor the temperature in the cavity, which can be used for analysis. It uses epoxy resin for filling, fixing, and heat conduction, and the main body is made of pure copper; the power supply part is connected to the positive and negative ends of the die through the upper + lower - pad, which simplifies the BGA package and uses copper pads to replace the PCB to divide it into positive and negative areas, including the temperature sensor pins, and the PCB uses a 4-layer board; the structural part: the outer shell is made of 1.5mm metal copper, the shape is processed by a milling machine, and the internal fixation uses the bonding function of epoxy resin.

[0057] In the immersion liquid cooling test prototype according to the embodiment of the present application, the power of the second equivalent heat source 22 is AP500W or SP350W, and the material of the mounting shell is metal.

[0058] The embodiment of the present application is based on an immersion liquid cooling test prototype, and the prototype also includes a main board, a backboard, an IO board, and a riser board.

[0059] In the immersion liquid cooling test prototype according to the embodiment of the present application, the first board is provided with a first board circuit, the first board circuit includes a first power supply circuit and a first signal circuit, the first power supply circuit is connected to the first equivalent heat source 14, and the first signal circuit is connected to the first temperature sensor 17.

[0060] In the immersion liquid cooling test prototype according to the embodiment of the present application, the second board is provided with a second board circuit, the second board circuit includes a second power supply circuit and a second signal circuit, the second power supply circuit is connected to the second equivalent heat source 22, and the second signal circuit is connected to the second temperature sensor 23.

[0061] In the immersion liquid cooling test prototype according to the embodiment of the present application, a liquid inlet monitoring point and a liquid outlet monitoring point are arranged on the mainboard, and a GPU area monitoring point is arranged on the GPU board 1.

[0062] In the immersion liquid cooling test prototype according to the embodiment of the present application, a physical start / stop button and a second network port are provided on the IO board, and the second network port is used to output the power consumption and temperature data of the IO board.

[0063] Heat dissipation simulation prototype: The overall size and layout of the model are reproduced in proportion. It is used for heat dissipation testing with low cost and high precision. The overall basic functions of one-key start and stop, lighting, temperature, and power consumption acquisition can be realized. The heat source part also reproduces the size of the heat source model and the heat flux density of the heat source part in proportion.

[0064] The boards include: the key heat source component boards required for the main board, backplane, GPU board 1, IO board, and riser board. The board design can be a two-layer board, which mainly includes component connectors. The board circuits are mainly divided into two parts: power supply and signal lines. The power supply is used for component heat sources, and the signal is used for temperature sensors in components and boards. The IO board integrates a one-button start and stop physical button, and the power consumption and temperature data are output by the network port. The connectors on the board are the same as the real connectors of the corresponding components, such as PCIeSlot, BGA package CPU base, DIMM Slot, etc. to realize the physical connection between GPU, network card, CPU, memory components and the mainboard, GPU board 1, and riser board.

[0065] The power supply solution for the whole machine is to supply power to CLIP through BUSBAR voltage, CLIP supplies power to the motherboard, the motherboard has three 8-pin power connectors to the backplane; six 4-pin power connectors to the riser, and the power board supplies power to the GPU motherboard through six copper pillars.

[0066] The heat dissipation point and power consumption monitoring of the whole machine are realized through the modular design of 3 backplanes. Each backplane has 3 monitoring points. The mainboard has monitoring points for liquid inlet and before and after the heat source. GPU board 1 has monitoring points for the GPU area. The heat source component has a liquid inlet monitoring point. The temperature is sampled and read by mounting to the MCU through I2C, and the power consumption of the whole machine is read by sampling to the MCU through precision resistor AD.

[0067] Heat source components include: GPU, CPU, network card, hard disk, memory and other high-power density components and components that account for a high proportion of the total heat generation.

[0068] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

Claims

1. A prototype machine based on immersion liquid cooling test, characterized in that: It includes a GPU board and a first board card, wherein the GPU board includes: A base and an upper cover, wherein the base and the upper cover are butted together to form a first installation cavity; A first PCB board, the first PCB board is located in the first mounting cavity and connected to the base; A first equivalent heat source and a thermal pad, wherein the first equivalent heat source is disposed on the first PCB board, the first PCB board comprises a mica sheet and a heating resistance wire wound on the mica sheet, and the heating resistance wire is electrically connected to the first PCB board; A heat sink is located in the first mounting cavity and is connected to the first equivalent heat source through the thermal pad. A first temperature sensor is provided on the first PCB board. The first temperature sensor is communicatively connected to the first board and is used to collect the temperature of the first equivalent heat source.

2. The immersion liquid cooling test prototype according to claim 1, characterized in that: The GPU board also includes a fixed baffle, which is located in the first installation cavity. A plurality of first network ports are arranged on the fixed baffle, and each of the first network ports is electrically connected to the first PCB board. A baffle is also arranged on the fixed baffle, and an LED light is also arranged on the first PCB board.

3. The immersion liquid cooling test prototype according to claim 1, characterized in that: The power consumption of the first equivalent heat source is 400 W, and the thermal conductivity of the thermal pad is greater than 5 W / cm.

4. The immersion liquid cooling test prototype according to claim 1, characterized in that: The prototype also includes a CPU board and a second board, wherein the CPU board includes a second PCB board, a second equivalent heat source, a second temperature sensor and a mounting shell; the mounting shell is buckled on the second PCB board to form a second mounting cavity, the second equivalent heat source and the second temperature sensor are both located in the second mounting cavity and are respectively connected to the second PCB board, the power supply part of the second PCB board is provided with a positive pole and a negative pole, which are respectively electrically connected to the second equivalent heat source, the second temperature sensor is communicatively connected to the second board, and is used to collect the temperature of the second equivalent heat source.

5. The immersion liquid cooling test prototype according to claim 4, characterized in that: The power of the second equivalent heat source is AP500W or SP350W, and the material of the mounting shell is metal.

6. The immersion liquid cooling test prototype according to claim 1, characterized in that: The prototype also includes a mainboard, a backplane, an IO board, and a riser board.

7. The immersion liquid cooling test prototype according to claim 5, characterized in that: The first board card is provided with a first board card circuit, and the first board card circuit includes a first power supply circuit and a first signal circuit, the first power supply circuit is connected to the first equivalent heat source, and the first signal circuit is connected to the first temperature sensor.

8. The immersion liquid cooling test prototype according to claim 5, characterized in that: The second board card is provided with a second board card circuit, and the second board card circuit includes a second power supply circuit and a second signal circuit, the second power supply circuit is connected to the second equivalent heat source, and the second signal circuit is connected to the second temperature sensor.

9. The immersion liquid cooling test prototype according to claim 6, characterized in that: The mainboard is provided with a liquid inlet monitoring point and a liquid outlet monitoring point, and the GPU board is provided with a GPU area monitoring point.

10. The immersion liquid cooling test prototype according to claim 6, characterized in that: The IO board is provided with a one-button start / stop physical button and a second network port, and the second network port is used to output power consumption and temperature data of the IO board.

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