Multi-stage power supply chip power supply sequence control system and method

Abstract

The invention provides a multi-stage power supply chip power supply sequence control system and method, the control system comprises a plurality of power supply circuits, the input ends of the plurality of power supply circuits are connected with an external power supply, and the output ends of the plurality of power supply circuits are used for outputting different power supply voltages to chips in sequence; the output end of the previous-stage power supply circuit is connected with the switching element on the next-stage power supply circuit, when the previous-stage power supply circuit outputs corresponding power supply voltage to the chip, the previous-stage power supply circuit further outputs power supply voltage to the switching element of the next-stage power supply circuit, and at the moment, the switching element is in a conducting state; the next stage of power supply circuit outputs the corresponding power supply voltage to the chip until the last stage of power supply circuit outputs the corresponding power supply voltage to the chip; under the condition that the external power supply is powered on through one key, a step-by-step driving mode is adopted, the power supply sequence of all circuits is ensured, the stability of the working performance of the chip is ensured, meanwhile, the external power supply does not need to be controlled one by one to supply power to the chip, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of power supply sequence of power supply chips, and in particular to a multi-stage power supply chip power supply sequence control system and method. Background Art

[0002] During the SOC (System-on-a-Chip) chip design process, the chip core power, storage interface voltage and external communication interface require different voltage values ​​for power supply, and there are certain requirements for the power supply sequence; during the chip reliability test or function test, there may be multiple power supplies on the same board. In order to ensure that each power supply can supply power normally and meet the specific power supply sequence, strong control measures must be taken on the power supply part to ensure that the power supply is supplied in the established sequence.

[0003] In the prior art, each power supply is separately connected to an external power supply, and each power supply is usually powered one by one in sequence to ensure that the chip can work normally; however, this power supply method cannot guarantee the accuracy of the power supply sequence, has unstable performance, and is inefficient. Summary of the invention

[0004] The purpose of this application is to address the above problems and provide a multi-stage power chip power supply sequence control system and method to ensure that each power supply can supply power in a specific order.

[0005] In a first aspect, the present application provides a multi-stage power chip power supply sequence control system, comprising: a plurality of power supply circuits, wherein input ends of the plurality of power supply circuits are connected to an external power supply, and output ends of the plurality of power supply circuits are used to output different power supply voltages to the chip in sequence;

[0006] A switching element is provided on the subsequent power supply circuit, and the output end of the previous power supply circuit is also connected to the switching element of the subsequent power supply circuit. The previous power supply circuit outputs a voltage to the subsequent power supply circuit to control the conduction of the switching element; when the switching element is in the on state, the subsequent power supply circuit outputs a supply voltage to the chip.

[0007] According to the technical solution provided in the present application, a boost circuit is further arranged between the previous-stage power supply circuit and the next-stage power supply circuit, and the boost circuit is used to boost the supply voltage of the previous-stage power supply circuit to a control voltage, and the control voltage is used to drive the switching element to conduct.

[0008] According to the technical solution provided in the present application, the power supply circuit is a four-level power supply, which respectively includes: a first power supply circuit, a second power supply circuit, a third power supply circuit, and a fourth power supply circuit; the boost circuit includes: a first boost circuit and a second boost circuit, the input ends of the first power supply circuit, the second power supply circuit, the third power supply circuit, and the fourth power supply circuit are all connected to an external power supply, the output end of the first power supply circuit outputs a first power supply voltage, the output end of the second power supply circuit outputs a second power supply voltage, the output end of the third power supply circuit outputs a third power supply voltage, and the output end of the fourth power supply circuit outputs a fourth power supply voltage;

[0009] The output end of the first power supply circuit is connected to the first boost circuit, and the output end of the first boost circuit is connected to the second power supply circuit; the output end of the second power supply circuit is connected to the third power supply circuit, the output end of the third power supply circuit is connected to the second boost circuit, and the output end of the boost circuit is connected to the fourth power supply circuit;

[0010] When the external power supply is powered on, the first power supply circuit, the second power supply circuit, the third power supply circuit and the fourth power supply circuit are connected in sequence to output the first power supply voltage, the second power supply voltage, the third power supply voltage and the fourth power supply voltage to the chip in sequence.

[0011] According to the technical solution provided in the present application, a first switching element is provided on the second power supply circuit, the first switching element having a gate, a drain and a source, the drain of the first switching element is connected to the external power supply, the source of the first switching element is used to output a second power supply voltage, and the gate of the first switching element is connected to the output end of the first boost circuit; when the external power supply is powered on and the gate of the first switching element receives the control voltage, the drain of the first switching element is connected to the source, and the second power supply circuit outputs the second power supply voltage to the chip.

[0012] According to the technical solution provided in the present application, a second switching element is provided on the third power supply circuit, the second switching element has a gate, a drain and a source, the source of the second switching element is connected to the external power supply, the drain of the second switching element is used to output a third power supply voltage, and the gate of the second switching element is connected to the output end of the second power supply circuit; when the external power supply is powered on and the gate of the second switching element receives the second power supply voltage, the drain of the second switching element is connected to the source, and the third power supply circuit outputs the third power supply voltage to the chip.

[0013] According to the technical solution provided in the present application, a third switching element is provided on the fourth power supply circuit, and the third switching element has a gate, a drain and a source. The drain of the third switching element is connected to the external power supply, and the source of the third switching element is used to output a fourth power supply voltage. The gate of the third switching element is connected to the output end of the second boost circuit; when the external power supply is powered on and the gate of the third switching element receives the control voltage, the drain of the third switching element is connected to the source, and the fourth power supply circuit outputs the fourth power supply voltage to the chip.

[0014] According to the technical solution provided in the present application, the first boost circuit and the second boost circuit both include a boost element;

[0015] The boost element has a first end, a second end, a third end, a fourth end, a fifth end, a sixth end and a seventh end; the sixth end is used for input, the fourth end is used for output, the seventh end is used for grounding, a plurality of eleventh capacitors are connected in parallel between the sixth end and the seventh end, and a plurality of twelfth capacitors are connected in parallel between the fourth end and the seventh end; the first inductor is arranged between the fifth end and the sixth end; a fifth resistor is arranged between the sixth end and the second end; a sixth resistor is arranged between the first end and the seventh end, a seventh resistor is arranged between the third end and the seventh end, and an eighth resistor is arranged between the third end and the fourth end.

[0016] In a second aspect, the present application provides a method for controlling a power supply sequence of a multi-stage power supply chip, which adopts the multi-stage power supply chip power supply sequence control system described in any one of the first aspects, and comprises the following steps:

[0017] S100: After the external power supply is powered on, the first-level power supply circuit outputs the corresponding power supply voltage to the chip;

[0018] S200: determining that the voltage of the power supply voltage of the previous power supply circuit reaching the switch element of the next power supply circuit after resistance voltage division is greater than or equal to the threshold voltage of the switch element of the next power supply circuit, the previous power supply circuit outputs the power supply voltage to the switch chip of the next power supply circuit, and controls the switch element to be turned on;

[0019] S300: The next-stage power supply circuit outputs a corresponding power supply voltage to the chip;

[0020] S400: Repeat the above steps until the last level of power supply circuit outputs the corresponding power supply voltage to the chip.

[0021] According to the technical solution provided by the present application, the following steps are also included before step S300:

[0022] S201: determining that the voltage of the power supply voltage of the previous power supply circuit reaching the switch element of the next power supply circuit after the resistance voltage division is less than the threshold voltage of the switch element of the next power supply circuit, and the power supply voltage of the previous power supply circuit is boosted to the control voltage by the boost circuit;

[0023] S202: Outputting the control voltage to the switch chip of the next-stage power supply circuit to control the switch element to be turned on.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] The present application provides a multi-stage power chip power supply sequence control system and method, the control system includes a plurality of power supply circuits, the input ends of the plurality of power supply circuits are all connected to an external power supply, and the output ends of the plurality of power supply circuits are used to output different power supply voltages to the chip in sequence; at the same time, the output end of the previous-stage power supply circuit is also connected to the switch element on the next-stage power supply circuit, and when the previous-stage power supply circuit outputs the corresponding power supply voltage to the chip, the previous-stage power supply circuit also outputs the power supply voltage to the switch element of the next-stage power supply circuit, at which time the switch element is in a conducting state, thereby enabling the next-stage power supply circuit to output the corresponding power supply voltage to the chip, until the last-stage power supply circuit outputs the corresponding power supply voltage to the chip; through the above structure, the present application adopts a step-by-step driving method when the external power supply is powered on with one button, strictly guarantees the power supply sequence of each circuit, ensures the stability and reliability of the chip working performance, and does not need to control the external power supply to power the chip one by one, thereby improving work efficiency.

[0026] It should be understood that the description of technical features, technical solutions, beneficial effects or similar language in this application does not imply that all features and advantages can be realized in any single embodiment. On the contrary, it is understood that the description of features or beneficial effects means that specific technical features, technical solutions or beneficial effects are included in at least one embodiment. Therefore, the description of technical features, technical solutions or beneficial effects in this specification does not necessarily refer to the same embodiment. Furthermore, the technical features, technical solutions and beneficial effects described in the present embodiment can also be combined in any appropriate manner. Those skilled in the art will understand that the embodiment can be realized without one or more specific technical features, technical solutions or beneficial effects of a specific embodiment. In other embodiments, additional technical features and beneficial effects can also be identified in a specific embodiment that does not embody all embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solution in this embodiment, the drawings required for use in the description of the embodiment will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of a multi-stage power chip power supply sequence control system provided in Example 1 of the present application;

[0029] Figure 2 A circuit diagram of a first power supply circuit provided in Example 1 of the present application;

[0030] Figure 3 A circuit diagram of a first boost circuit provided in Example 1 of the present application;

[0031] Figure 4 A circuit diagram of a second power supply circuit provided in Example 1 of the present application;

[0032] Figure 5 A circuit diagram of a third power supply circuit provided in Embodiment 1 of the present application;

[0033] Figure 6 A circuit diagram of a second boost circuit provided in Example 1 of the present application;

[0034] Figure 7 A circuit diagram of a fourth power supply circuit provided in Embodiment 1 of the present application;

[0035] Figure 8 This is a flow chart of a multi-stage power supply chip power supply sequence control method provided in Example 2 of the present application.

[0036] In the figure: 1, the first power supply circuit; 2, the second power supply circuit; 3, the third power supply circuit; 4, the fourth power supply circuit; XP1: the first terminal; XP2: the second terminal; D1: the first transient voltage suppressor; F1: the first fuse; FB1: the first magnetic bead; FB2: the second magnetic bead; C1: the first capacitor; U2: the boost element; L1: the first inductor; C11: the eleventh capacitor; C12: the twelfth capacitor; R5: the fifth resistor; R6: the sixth resistor; R7: the seventh resistor; R8: the eighth resistor; XP3: the third terminal; XP4: the fourth terminal; D2: the second transient voltage suppressor; F2: the second fuse; FB3: the third magnetic bead; FB4: the fourth magnetic bead; Q1: the first switch element; C2: the second capacitor; C3: the third capacitor; C4: the fourth capacitor; R2: the second resistor; R3: The third resistor; R4: the fourth resistor; XP5: the fifth terminal; XP6: the sixth terminal; D3: the third transient voltage suppressor; F3: the third fuse; FB5: the fifth magnetic bead; FB6: the sixth magnetic bead; Q2: the second switch element; C5: the fifth capacitor; C6: the sixth capacitor; C7: the seventh capacitor; R10: the tenth resistor; R11: the eleventh resistor; R12: the twelfth resistor; R13: the thirteenth resistor; R14: the fourteenth resistor; XP7: the seventh terminal; XP8: the eighth terminal; D4: the fourth transient voltage suppressor; F4: the fourth fuse; FB7: the seventh magnetic bead; FB8: the eighth magnetic bead; Q3: the third switch element; C8: the eighth capacitor; C9: the ninth capacitor; C10: the tenth capacitor; R16: the sixteenth resistor; R17: the seventeenth resistor; R18: the eighteenth resistor. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The description in this section is only exemplary and explanatory and should not have any limiting effect on the protection scope of the present application. Specifically, the described embodiments are only embodiments of a part of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work should fall within the scope of protection of the present application.

[0038] It should be noted that similar reference numerals and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0039] Example 1

[0040] Please refer to Figure 1-Figure 7 , a schematic diagram of a multi-stage power chip power supply sequence control system provided in this embodiment, comprising: a plurality of power supply circuits, the input ends of the plurality of power supply circuits are all connected to an external power supply, and the output ends of the plurality of power supply circuits are used to output different power supply voltages to the chip in sequence;

[0041] A switching element is provided on the subsequent power supply circuit, and the output end of the previous power supply circuit is also connected to the switching element of the subsequent power supply circuit. The previous power supply circuit outputs a voltage to the subsequent power supply circuit to control the conduction of the switching element; when the switching element is in the on state, the subsequent power supply circuit outputs a supply voltage to the chip.

[0042] Working principle: The present application includes several power supply circuits, the input ends of multiple power supply circuits are all connected to an external power supply, and the output ends of multiple power supply circuits are used to output different power supply voltages to the chip in sequence; at the same time, the output end of the previous power supply circuit is also connected to the switching element on the next power supply circuit. When the previous power supply circuit outputs the corresponding power supply voltage to the chip, the previous power supply circuit also outputs the power supply voltage to the switching element of the next power supply circuit. At this time, the switching element is in a conducting state, thereby enabling the next power supply circuit to output the corresponding power supply voltage to the chip until the last power supply circuit outputs the corresponding power supply voltage to the chip; through the above structure, the present application adopts a step-by-step driving method when the external power supply is powered on with one button, strictly ensuring the power supply sequence of each circuit, ensuring the stability and reliability of the chip's working performance, and at the same time, there is no need to control the external power supply to supply power to the chip one by one, thereby improving work efficiency.

[0043] In some embodiments, a boost circuit is further provided between the previous power supply circuit and the next power supply circuit, and the boost circuit is used to boost the supply voltage of the previous power supply circuit to a control voltage, and the control voltage is used to drive the switch element to conduct.

[0044] Specifically, since the voltage applied to the switching element needs to exceed the threshold voltage in order to turn on the switching element, when the supply voltage of the previous power supply circuit reaches the voltage of the switching element on the next power supply circuit after resistor division, and is lower than the threshold voltage of the switching element on the next power supply circuit, the switching element cannot be controlled to turn on. Therefore, in the present application, when the supply voltage of the previous power supply circuit reaches the voltage of the switching element on the next power supply circuit after resistor division and is lower than the threshold voltage of the switching element on the next power supply circuit, a boost circuit is provided between the previous power supply circuit and the next power supply circuit, and the boost circuit boosts the supply voltage of the previous power supply circuit to a control voltage. At this time, the voltage of the control voltage reaching the switching element on the next power supply circuit after resistor division is higher than the threshold voltage of the switching element on the next power supply circuit, and the switching element can be controlled to turn on, thereby causing the next power supply circuit to output the supply voltage to the chip.

[0045] In some embodiments, the power supply circuit is a four-stage power supply, which includes: a first power supply circuit 1, a second power supply circuit 2, a third power supply circuit 3, and a fourth power supply circuit 4; the boost circuit includes: a first boost circuit and a second boost circuit, the input ends of the first power supply circuit 1, the second power supply circuit 2, the third power supply circuit 3, and the fourth power supply circuit 4 are all connected to an external power supply, the output end of the first power supply circuit 1 outputs a first power supply voltage, the output end of the second power supply circuit 2 outputs a second power supply voltage, the output end of the third power supply circuit 3 outputs a third power supply voltage, and the output end of the fourth power supply circuit 4 outputs a fourth power supply voltage;

[0046] The output end of the first power supply circuit 1 is connected to the first boost circuit, and the output end of the first boost circuit is connected to the second power supply circuit 2; the output end of the second power supply circuit 2 is connected to the third power supply circuit 3, the output end of the third power supply circuit 3 is connected to the second boost circuit, and the output end of the boost circuit is connected to the fourth power supply circuit 4;

[0047] When the external power supply is powered on, the first power supply circuit 1, the second power supply circuit 2, the third power supply circuit 3 and the fourth power supply circuit 4 are connected in sequence, and the first power supply voltage, the second power supply voltage, the third power supply voltage and the fourth power supply voltage are sequentially output to the chip.

[0048] Specifically, in this SOC chip, there are four different voltages, namely, core power, analog power, IO power, and DDR controller power, and their voltages are 0.9V, 1.8V, 3.3V, and 1.5V respectively; the power supply sequence is 0.9V, 1.8V, 3.3V, and 1.5V; therefore, in this embodiment, the power supply circuit is a four-level power supply, namely, a first power supply circuit 1, a second power supply circuit 2, a third power supply circuit 3, and a fourth power supply circuit 4; wherein, the first power supply voltage is 0.9V, the second power supply voltage is 1.8V, the third power supply voltage is 3.3V, and the fourth power supply voltage is 1.5V;

[0049] like Figure 1-Figure 6 As shown, this embodiment adopts a step-by-step driving method for power supply, that is, when the external power supply is powered on, there is no control switch on the first power supply circuit 1, so that the first power supply voltage is directly output to the chip; when the first power supply voltage is normally supplied, the switch chip on the second power supply circuit 2 is driven to be turned on, so that the second power supply voltage is output to the chip; when the second power supply voltage is normally supplied, the switch chip on the third power supply circuit 3 is driven to be turned on, so that the third power supply voltage is output to the chip; when the third power supply voltage is normally supplied, the switch chip on the fourth power supply circuit 4 is driven to be turned on, so that the fourth power supply voltage is output to the chip;

[0050] In this embodiment, if Figure 2 As shown, the first power supply circuit 1 includes a first wiring terminal XP1, a second wiring terminal XP2, a first transient voltage suppressor D1, a first fuse F1, a first magnetic bead FB1, a second magnetic bead FB2 and five first capacitors C1, the input end of the first wiring terminal XP1 is connected to the positive electrode of the external power supply, the input end of the second wiring terminal XP2 is connected to the negative electrode of the external power supply, and the first transient voltage suppressor D1 is connected between the output end of the first wiring terminal XP1 and the output end of the second wiring terminal XP2; the output end of the first wiring terminal XP1 is connected in series with the first fuse F1 and the first magnetic bead FB1, and outputs the first supply voltage; the output end of the second wiring terminal XP2 is connected to the second magnetic bead FB2, and the other end of the second magnetic bead FB2 is grounded; the other end of the first magnetic bead FB1 and the other end of the second magnetic bead FB2 are connected in parallel with five first capacitors C1;

[0051] Among them, the five first capacitors C1 include two tantalum capacitors and three high-frequency ceramic capacitors, and the tantalum capacitors and high-frequency ceramic capacitors both play a filtering role; the first transient voltage suppressor D1 is used to suppress instantaneous overvoltage and protect individual components in the circuit from being damaged by instantaneous surge pulse voltage; the first fuse F1 plays a safety role; the first magnetic bead FB1 and the second magnetic bead FB2 are used to prevent mutual interference between circuits and maintain the independence of each circuit.

[0052] In some embodiments, a first switching element Q1 is provided on the second power supply circuit 2, and the first switching element Q1 has a gate, a drain and a source. The drain of the first switching element Q1 is connected to an external power supply, and the source of the first switching element Q1 is used to output a second power supply voltage. The gate of the first switching element Q1 is connected to the output end of the first boost circuit; when the external power supply is powered on and the gate of the first switching element Q1 receives a control voltage, the drain of the first switching element Q1 is connected to the source, and the second power supply circuit 2 outputs the second power supply voltage to the chip.

[0053] Specifically, the first switch element Q1 is an N-channel enhancement type field effect transistor; when the voltage applied to the gate exceeds the threshold voltage, the current can flow from the external power supply through the drain to the source, and then flow to the chip to power the chip;

[0054] Specifically, in this embodiment, since the threshold voltage of the selected first switch element Q1 is 1.6V, the voltage of the first power supply voltage reaching the first switch element Q1 after resistor voltage division cannot drive the first switch element Q1 to turn on, so a first boost circuit is provided between the first power supply circuit 1 and the second power supply circuit 2 to boost the first power supply voltage to a control voltage. In this embodiment, the control voltage is 3.9V, and the voltage of the control voltage reaching the first switch element Q1 after resistor voltage division is 1.6V, which can control the first switch element Q1 to turn on, thereby causing the second power supply circuit 2 to output a second power supply voltage of 1.8V to the chip;

[0055] Specifically, Figure 4 As shown, the second power supply circuit 2 includes: a third wiring terminal XP3, a fourth wiring terminal XP4, a second transient voltage suppressor D2, a second fuse F2, a third magnetic bead FB3, a fourth magnetic bead FB4, three second capacitors C2, five third capacitors C3, a fourth capacitor C4, a second resistor R2, a third resistor R3, a fourth resistor R4 and a first switch element Q1;

[0056] The first switch element Q1 has a gate, a drain and a source, in which D is the drain, S is the source and G is the gate; the input end of the third terminal XP3 is connected to the positive electrode of the external power supply, the input end of the fourth terminal XP4 is connected to the negative electrode of the external power supply, and the second transient voltage suppressor D2 is connected between the output end of the third terminal XP3 and the output end of the fourth terminal XP4; the output end of the third terminal XP3 is connected in series with the second fuse F2, the third magnetic bead FB3 and the drain of the first switch element Q1, the source of the first switch element Q1 outputs the second power supply voltage, and the source and drain of the first switch element Q1 are connected in series. A fourth resistor R4 is connected; a fourth magnetic bead FB4 is connected to the output end of the fourth wiring terminal XP4, and the other end of the fourth magnetic bead FB4 is grounded; three second capacitors C2 are connected in parallel between the other end of the fourth magnetic bead FB4 and the drain of the first switch element Q1; five third capacitors C3 are connected in parallel between the other end of the fourth magnetic bead FB4 and the source of the first switch element Q1; a third resistor R3 is connected to the gate of the first switch element Q1, and the other end of the third resistor R3 is connected to the output end of the first boost circuit, and a fourth capacitor C4 and a second resistor R2 are connected in parallel between the gate of the first switch element Q1 and the other end of the fourth magnetic bead FB4;

[0057] Among them, the second capacitor C2 and the fourth capacitor C4 are high-frequency ceramic capacitors, and the second capacitor C2 and the fourth capacitor C4 both play a filtering role; the five third capacitors C3 include three high-frequency ceramic capacitors and two tantalum capacitors, and the tantalum capacitors and the high-frequency ceramic capacitors both play a filtering role; the second transient voltage suppressor D2 is used to suppress instantaneous overvoltage and protect various components in the circuit from being damaged by instantaneous surge pulse voltage; the second fuse F2 plays a safety role; the third magnetic bead FB3 and the fourth magnetic bead FB4 are used to prevent mutual interference between circuits and maintain the independence of each circuit.

[0058] In some embodiments, a second switching element Q2 is provided on the third power supply circuit 3, and the second switching element Q2 has a gate, a drain and a source. The source of the second switching element Q2 is connected to the external power supply, the drain of the second switching element Q2 is used to output the third power supply voltage, and the gate of the second switching element Q2 is connected to the output end of the second power supply circuit 2; when the external power supply is powered on and the gate of the second switching element Q2 receives the second power supply voltage, the drain of the second switching element Q2 is connected to the source, and the third power supply circuit 3 outputs the third power supply voltage to the chip.

[0059] Specifically, the second switch element Q2 is a P-channel enhancement type field effect transistor; when the voltage applied to the gate exceeds the threshold voltage, the current can flow from the external power supply through the source to the drain, and then flow to the chip to power the chip;

[0060] Specifically, in this embodiment, since the voltage of the second power supply voltage of 1.8V reaching the second switch element Q2 after resistor voltage division can drive the second switch element Q2 to turn on, the output end of the second power supply circuit 2 is directly connected to the input end of the second switch element Q2;

[0061] Specifically, Figure 5 As shown, the third power supply circuit 3 includes: a fourth terminal XP4, a fifth terminal XP5, a third transient voltage suppressor D3, a third fuse F3, a fifth magnetic bead FB5, a sixth magnetic bead FB6, three fifth capacitors C5, five sixth capacitors C6, a seventh capacitor C7, a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, a transistor and a second switch element Q2;

[0062] The second switch element Q2 has a gate, a drain and a source, in which D is the drain, S is the source and G is the gate; the input end of the fifth terminal XP5 is connected to the positive electrode of the external power supply, the input end of the sixth terminal XP6 is connected to the negative electrode of the external power supply, and a third transient voltage suppressor D3 is connected between the output ends of the fifth terminal XP5 and the sixth terminal XP6; the output end of the fifth terminal XP5 is connected in series with a third fuse F3, a fifth magnetic bead FB5 and the source of the second switch element Q2, the drain of the second switch element Q2 outputs a third power supply voltage, and a fourteenth resistor R14 is connected between the source and drain of the second switch element Q2; the output end of the sixth terminal XP6 is connected to a sixth magnetic bead FB6, and the sixth magnetic bead FB 6 is grounded; three fifth capacitors C5 are connected in parallel between the other end of the sixth magnetic bead FB6 and the source of the second switch element Q2; five sixth capacitors C6 are also connected to the drain of the second switch element Q2, and the other ends of the five sixth capacitors C6 are all grounded; the gate of the second switch element Q2 is connected to an eleventh resistor R11, the other end of the eleventh resistor R11 is connected to the first end of the triode, the second end of the triode is grounded, the third end of the triode is connected to a twelfth resistor R12, and the other end of the twelfth resistor R12 is connected to the output end of the second power supply circuit 2; a seventh capacitor C7 and a thirteenth resistor R13 are connected in parallel between the second end and the third end of the triode; a tenth resistor R10 is also connected between the gate and the source of the second switch element Q2;

[0063] Among them, the fifth capacitor C5 and the seventh capacitor C7 are high-frequency ceramic capacitors, and the fifth capacitor C5 and the seventh capacitor C7 both play a filtering role; the five sixth capacitors C6 include three high-frequency ceramic capacitors and two tantalum capacitors, and the tantalum capacitors and the high-frequency ceramic capacitors both play a filtering role; the third transient voltage suppressor D3 is used to suppress instantaneous overvoltage and protect various components in the circuit from being damaged by instantaneous surge pulse voltage; the third fuse F3 plays a safety insurance role; the fifth magnetic bead FB5 and the sixth magnetic bead FB6 are used to prevent mutual interference between circuits and maintain the independence of each circuit.

[0064] In some embodiments, a third switching element Q3 is provided on the fourth power supply circuit 4, and the third switching element Q3 has a gate, a drain and a source. The drain of the third switching element Q3 is connected to the external power supply, the source of the third switching element Q3 is used to output a fourth power supply voltage, and the gate of the third switching element Q3 is connected to the output end of the second boost circuit; when the external power supply is powered on and the gate of the third switching element Q3 receives the control voltage, the drain of the third switching element Q3 is connected to the source, and the fourth power supply circuit 4 outputs the fourth power supply voltage to the chip.

[0065] Specifically, the third switch element Q3 is an N-channel enhancement type field effect transistor; when the voltage applied to the gate exceeds the threshold voltage, the current can flow from the external power supply through the drain to the source, and then flow to the chip to power the chip;

[0066] Specifically, in the present embodiment, since the threshold voltage of the selected third switch element Q3 is 1.6V, the voltage of the third power supply voltage reaching the third switch element Q3 after resistor voltage division cannot drive the third switch element Q3 to turn on, so a second boost circuit is provided between the third power supply circuit 3 and the fourth power supply circuit 4 to boost the third power supply voltage to a control voltage. In the present embodiment, the control voltage is 3.9V, and the voltage of the control voltage reaching the third switch element Q3 after resistor voltage division is 1.6V, which can control the third switch element Q3 to turn on, thereby causing the fourth power supply circuit 4 to output a fourth power supply voltage of 1.5V to the chip;

[0067] Specifically, Figure 7 As shown, the fourth power supply circuit 4 includes: a seventh terminal XP7, an eighth terminal XP8, a fourth transient voltage suppressor D4, a fourth fuse F4, a seventh magnetic bead FB7, an eighth magnetic bead FB8, three eighth capacitors C8, five ninth capacitors C9, a tenth capacitor C10, a sixteenth resistor R16, a seventeenth resistor R17, an eighteenth resistor R18 and a third switch element Q3;

[0068] The third switch element Q3 has a gate, a drain and a source, in which D is the drain, S is the source and G is the gate; the input end of the seventh terminal XP7 is connected to the positive electrode of the external power supply, the input end of the eighth terminal XP8 is connected to the negative electrode of the external power supply, and a fourth transient voltage suppressor D4 is connected between the output end of the seventh terminal XP7 and the output end of the eighth terminal XP8; the output end of the seventh terminal XP7 is connected in series with a fourth fuse F4, a seventh magnetic bead FB7 and the drain of the third switch element Q3, the source of the third switch element Q3 outputs a fourth power supply voltage, and a tenth terminal is connected between the source and drain of the third switch element Q3. Seventh resistor R17; the output end of the eighth terminal XP8 is connected to the eighth magnetic bead FB8, and the other end of the eighth magnetic bead FB8 is grounded; three eighth capacitors C8 are connected in parallel between the other end of the eighth magnetic bead FB8 and the drain of the third switch element Q3; five ninth capacitors C9 are connected in parallel between the other end of the eighth magnetic bead FB8 and the source of the third switch element Q3; the gate of the third switch element Q3 is connected to the sixteenth resistor R16, and the other end of the sixteenth resistor R16 is connected to the output end of the first boost circuit, and the gate of the third switch element Q3 and the other end of the eighth magnetic bead FB8 are connected in parallel with the tenth capacitor C10 and the eighteenth resistor R18;

[0069] Among them, the eighth capacitor C8 and the tenth capacitor C10 are high-frequency ceramic capacitors, and the eighth capacitor C8 and the tenth capacitor C10 both play a filtering role; the five ninth capacitors C9 include three high-frequency ceramic capacitors and two tantalum capacitors, and the tantalum capacitors and the high-frequency ceramic capacitors both play a filtering role; the fourth transient voltage suppressor D4 is used to suppress instantaneous overvoltage and protect various components in the circuit from being damaged by instantaneous surge pulse voltage; the fourth fuse F4 plays a safety role; the seventh magnetic bead FB7 and the eighth magnetic bead FB8 are used to prevent mutual interference between circuits and maintain the independence of each circuit.

[0070] In some embodiments, the first boost circuit and the second boost circuit both include a boost element U2;

[0071] The boost element U2 has a first end, a second end, a third end, a fourth end, a fifth end, a sixth end and a seventh end; the sixth end is used for input, the fourth end is used for output, the seventh end is used for grounding, a plurality of eleventh capacitors C11 are connected in parallel between the sixth end and the seventh end, and a plurality of twelfth capacitors C12 are connected in parallel between the fourth end and the seventh end; a first inductor L1 is arranged between the fifth end and the sixth end; a fifth resistor R5 is arranged between the sixth end and the second end; a sixth resistor R6 is arranged between the first end and the seventh end, a seventh resistor R7 is arranged between the third end and the seventh end, and an eighth resistor R8 is arranged between the third end and the fourth end.

[0072] Specifically, Figure 3 and Figure 6As shown, the first boost circuit and the second boost circuit both include a boost element U2; the boost element U2 has a first end, a second end, a third end, a fourth end, a fifth end, a sixth end and a seventh end, the first end is a remote sensing end, which is used to monitor the voltage at the load end to improve the accuracy of voltage regulation; the second end is an enable end, the third end is a feedback end, which is used to monitor the output voltage and feed its information back to the inside of the chip to adjust the switching frequency or current, thereby stabilizing the output voltage; the fourth end is the output end, the fifth end is the inductor end, and the sixth end is the input end , the seventh end is the ground end; two eleventh capacitors C11 are connected in parallel between the sixth end and the seventh end, and two twelfth capacitors C12 are connected in parallel between the fourth end and the seventh end; a first inductor L1 is arranged between the fifth end and the sixth end; a fifth resistor R5 is arranged between the sixth end and the second end; a sixth resistor R6 is arranged between the first end and the seventh end, a seventh resistor R7 is arranged between the third end and the seventh end, and an eighth resistor R8 is arranged between the third end and the fourth end; wherein the eleventh capacitor C11 and the twelfth capacitor C12 both play a filtering role.

[0073] Example 2

[0074] refer to Figure 8 As shown, the present application provides a multi-stage power chip power supply sequence control method, using a multi-stage power chip power supply sequence control system as described above, the multi-stage power chip power supply sequence control method includes the following steps:

[0075] S100: After the external power supply is powered on, the first-level power supply circuit outputs the corresponding power supply voltage to the chip;

[0076] S200: determining that the voltage of the power supply voltage of the previous power supply circuit reaching the switch element of the next power supply circuit after the resistance voltage division is greater than or equal to the threshold voltage of the switch element of the next power supply circuit, and the previous power supply circuit outputs the power supply voltage to the switch chip of the next power supply circuit to control the switch element to be turned on;

[0077] S300: the next-stage power supply circuit outputs a corresponding power supply voltage to the chip;

[0078] S400: Repeat the above steps until the last level of power supply circuit outputs the corresponding power supply voltage to the chip.

[0079] In some embodiments, the following steps are also included before step S300:

[0080] S201: determining that the voltage of the power supply voltage of the previous power supply circuit reaching the switch element of the next power supply circuit after the resistance voltage division is less than the threshold voltage of the switch element of the next power supply circuit, and the power supply voltage of the previous power supply circuit is boosted to the control voltage by the boost circuit;

[0081] S202: Outputting the control voltage to the switch chip of the next-stage power supply circuit to control the switch element to be turned on.

[0082] Specifically, when the chip is used, the external power supply is powered on, and the first-level power supply circuit outputs the corresponding power supply voltage to the chip. At the same time, when the power supply voltage of the previous-level power supply circuit reaches the voltage of the switch element on the next-level power supply circuit after the resistor voltage division is greater than or equal to the threshold voltage of the switch element on the next-level power supply circuit, the previous-level power supply circuit is directly connected to the switch chip of the next-level power supply circuit, and the previous-level power supply circuit outputs the power supply voltage to the switch chip of the next-level power supply circuit to control the switch element to be turned on, and the next-level power supply circuit outputs the corresponding power supply voltage to the chip; and the power supply voltage of the previous-level power supply circuit is divided by the resistor. When the voltage reaching the switching element on the subsequent power supply circuit is less than the threshold voltage of the switching element on the subsequent power supply circuit, a boost circuit is arranged between the previous power supply circuit and the subsequent power supply circuit, and the boost circuit boosts the supply voltage of the previous power supply circuit to the control voltage. At this time, the voltage of the control voltage reaching the switching element on the subsequent power supply circuit after resistance voltage division is higher than the threshold voltage of the switching element on the subsequent power supply circuit, which can control the switching element to be turned on, thereby making the subsequent power supply circuit output the supply voltage to the chip; until the last power supply circuit outputs the corresponding supply voltage to the chip, the power supply to the chip is completed.

[0083] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and its core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of this application, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the concept and technical solution of the invention to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. A multi-stage power chip power supply sequence control system, characterized in that: include: A plurality of power supply circuits, wherein input ends of the plurality of power supply circuits are connected to an external power source, and output ends of the plurality of power supply circuits are used to sequentially output different power supply voltages to the chip; A switching element is provided on the subsequent power supply circuit, and the output end of the previous power supply circuit is also connected to the switching element of the subsequent power supply circuit. The previous power supply circuit outputs a voltage to the subsequent power supply circuit to control the conduction of the switching element; when the switching element is in the on state, the subsequent power supply circuit outputs a supply voltage to the chip.

2. The multi-level power chip power supply sequence control system according to claim 1, characterized in that: A boost circuit is also provided between the previous power supply circuit and the next power supply circuit, and the boost circuit is used to boost the power supply voltage of the previous power supply circuit to a control voltage, and the control voltage is used to drive the switch element to conduct.

3. The multi-stage power chip power supply sequence control system according to claim 2, characterized in that: The power supply circuit is a four-stage power supply, comprising: a first power supply circuit (1), a second power supply circuit (2), a third power supply circuit (3), and a fourth power supply circuit (4); the boost circuit comprises: a first boost circuit and a second boost circuit, the input ends of the first power supply circuit (1), the second power supply circuit (2), the third power supply circuit (3), and the fourth power supply circuit (4) are all connected to an external power supply, the output end of the first power supply circuit (1) outputs a first power supply voltage, the output end of the second power supply circuit (2) outputs a second power supply voltage, the output end of the third power supply circuit (3) outputs a third power supply voltage, and the output end of the fourth power supply circuit (4) outputs a fourth power supply voltage; The output end of the first power supply circuit (1) is connected to the first boost circuit, and the output end of the first boost circuit is connected to the second power supply circuit (2); the output end of the second power supply circuit (2) is connected to the third power supply circuit (3), the output end of the third power supply circuit (3) is connected to the second boost circuit, and the output end of the boost circuit is connected to the fourth power supply circuit (4); When the external power supply is powered on, the first power supply circuit (1), the second power supply circuit (2), the third power supply circuit (3) and the fourth power supply circuit (4) are connected in sequence, and sequentially output a first power supply voltage, a second power supply voltage, a third power supply voltage and a fourth power supply voltage to the chip.

4. The multi-stage power chip power supply sequence control system according to claim 3, characterized in that: The second power supply circuit (2) is provided with a first switch element (Q1), the first switch element (Q1) having a gate, a drain and a source, the drain of the first switch element (Q1) being connected to the external power supply, the source of the first switch element (Q1) being used to output a second power supply voltage, and the gate of the first switch element (Q1) being connected to an output end of the first boost circuit; when the external power supply is powered on and the gate of the first switch element (Q1) receives the control voltage, the drain of the first switch element (Q1) is connected to the source, and the second power supply circuit (2) outputs the second power supply voltage to the chip.

5. The multi-stage power chip power supply sequence control system according to claim 4, characterized in that: The third power supply circuit (3) is provided with a second switch element (Q2), the second switch element (Q2) having a gate, a drain and a source, the source of the second switch element (Q2) being connected to the external power supply, the drain of the second switch element (Q2) being used to output a third power supply voltage, and the gate of the second switch element (Q2) being connected to an output end of the second power supply circuit (2); when the external power supply is powered on and the gate of the second switch element (Q2) receives the second power supply voltage, the drain of the second switch element (Q2) is connected to the source, and the third power supply circuit (3) outputs the third power supply voltage to the chip.

6. The multi-level power supply chip power supply sequence control system according to claim 5, characterized in that: The fourth power supply circuit (4) is provided with a third switch element (Q3), the third switch element (Q3) having a gate, a drain and a source, the drain of the third switch element (Q3) being connected to the external power supply, the source of the third switch element (Q3) being used to output a fourth power supply voltage, and the gate of the third switch element (Q3) being connected to the output end of the second boost circuit; when the external power supply is powered on and the gate of the third switch element (Q3) receives the control voltage, the drain of the third switch element (Q3) is connected to the source, and the fourth power supply circuit (4) outputs the fourth power supply voltage to the chip.

7. The multi-stage power chip power supply sequence control system according to claim 6, characterized in that: The first boost circuit and the second boost circuit both include a boost element (U2); The boost element (U2) has a first end, a second end, a third end, a fourth end, a fifth end, a sixth end and a seventh end; the sixth end is used for input, the fourth end is used for output, the seventh end is used for grounding, a plurality of eleventh capacitors (C11) are connected in parallel between the sixth end and the seventh end, and a plurality of twelfth capacitors (C12) are connected in parallel between the fourth end and the seventh end; the first inductor (L1) is arranged between the fifth end and the sixth end; a fifth resistor (R5) is arranged between the sixth end and the second end; a sixth resistor (R6) is arranged between the first end and the seventh end, a seventh resistor (R7) is arranged between the third end and the seventh end, and an eighth resistor (R8) is arranged between the third end and the fourth end.

8. A method for controlling the power supply sequence of a multi-stage power chip, using the multi-stage power supply sequence control system of any one of claims 1 to 7, characterized in that: The steps include: S100: After the external power supply is powered on, the first-level power supply circuit outputs the corresponding power supply voltage to the chip; S200: determining that the voltage of the power supply voltage of the previous power supply circuit reaching the switch element of the next power supply circuit after resistance voltage division is greater than or equal to the threshold voltage of the switch element of the next power supply circuit, the previous power supply circuit outputs the power supply voltage to the switch chip of the next power supply circuit, and controls the switch element to be turned on; S300: The next-stage power supply circuit outputs a corresponding power supply voltage to the chip; S400: Repeat the above steps until the last level of power supply circuit outputs the corresponding power supply voltage to the chip.

9. The method for controlling the power supply sequence of a multi-stage power chip according to claim 8, characterized in that: Before step S300, the following steps are also included: S201: determining that the voltage of the power supply voltage of the previous power supply circuit reaching the switch element of the next power supply circuit after the resistance voltage division is less than the threshold voltage of the switch element of the next power supply circuit, and the power supply voltage of the previous power supply circuit is boosted to the control voltage by the boost circuit; S202: Outputting the control voltage to the switch chip of the next-stage power supply circuit to control the switch element to be turned on.

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